Chip mounter for electronic component processing

Abstract

The invention discloses a chip mounter for electronic component processing, and belongs to the field of electronic component chip mounters. A chip mounter for electronic component processing comprises a processing table and further comprises a positioning block moving along the surface of the processing table, the bottom of the positioning block is fixedly connected with a first motor, the bottom end of a rotating shaft of the first motor is fixedly connected with a rotating disc, the rotating disc is provided with a chip mounting mechanism, the processing table is provided with a displacement mechanism, and the displacement mechanism is connected with the positioning block. The positioning block is mounted on the displacement mechanism; through the arrangement of the rotating disc and the multiple sets of adsorption rods, material taking and chip mounting work of multiple sets of electronic elements can be achieved, the time of reciprocating material taking is saved, and the chip mounting efficiency is improved; and in cooperation with the arrangement of the first spring, the impact force generated by downward pressing of the adsorption rod on the circuit board can be greatly weakened, the protection effect is improved, in addition, the flexible wind action is generated at the top of the electronic element, the attaching tightness is enhanced, and the attaching effect is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component placement machines, and in particular to a placement machine for processing electronic components. Background Art

[0002] The placement machine for electronic components processing is an automated device specially designed to quickly and accurately mount surface mount technology components on printed circuit boards. It gives full play to the high-tech achievements of modern precision machinery, mechatronics, optoelectronics, and computer control technology, and can quickly and accurately place various electronic components on the designated positions on the circuit board through functions such as picking, displacement, alignment, and placement.

[0003] At present, in the process of patching, it is necessary to constantly go back and forth to pick up materials, which wastes a lot of material picking time and reduces the patching efficiency; and when the current equipment is patching, it will produce a large impact stress, which is easy to cause damage to the circuit substrate and electronic components. Therefore, a patch machine for processing electronic components is proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problems in the prior art that the continuous back and forth material picking wastes a lot of material picking time and reduces the patch efficiency; and that large impact stress is generated during patching, which easily causes damage to circuit substrates and electronic components. A patch machine for processing electronic components is proposed to solve the problems in the prior art that the continuous back and forth material picking wastes a lot of material picking time and reduces the patch efficiency; and that the large impact stress is generated during patching, which easily causes damage to circuit substrates and electronic components.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A chip placement machine for processing electronic components comprises a processing table, and also comprises: a positioning block moving along the surface of the processing table, a first motor being fixedly connected to the bottom of the positioning block, a rotating disk being fixedly connected to the bottom end of the rotating shaft of the first motor, a chip placement mechanism being arranged on the rotating disk, wherein a displacement mechanism is arranged on the processing table, and the positioning block is mounted on the displacement mechanism; a feeding part, which is arranged on the processing table and is used to supply raw materials required for the chip placement.

[0007] In order to facilitate the movement of the substrate, preferably, a positioning plate is slidably connected to the processing table, a first screw is rotatably connected inside the processing table, a moving block is threadedly connected to the first screw, the top of the moving block is fixedly connected to the bottom of the positioning plate, a second motor is fixedly connected to the side wall of the processing table, and the output shaft of the second motor is fixedly connected to the end of the first screw.

[0008] For the convenience of chip mounting positioning, preferably, the displacement mechanism includes a second screw rod. Guide sliding grooves are formed on both sides of the processing table. The second screw rod is rotatably connected in one of the guide sliding grooves. A third motor is fixedly connected to the side wall of the processing table, and the output shaft of the third motor is fixedly connected to the end of the second screw rod. A first sliding sleeve is threadedly connected to the second screw rod. An installation plate is fixedly connected to the top of the first sliding sleeve. A third screw rod is rotatably connected between the two side walls of the installation plate. A fourth motor is fixedly connected to the side wall of the installation plate, and the output shaft of the fourth motor is fixedly connected to the end of the third screw rod. And the positioning block is threadedly sleeved on the third screw rod.

[0009] Further, a guide sliding rod is fixedly connected in the other guide sliding groove. A second sliding sleeve is slidably sleeved on the guide sliding rod. The other end of the installation plate is fixedly connected to the top of the second sliding sleeve.

[0010] Further, the side walls of the first sliding sleeve and the second sliding sleeve are both in sliding fit with the inner wall of the guide sliding groove, and the top of the positioning block is in sliding fit with the bottom of the installation plate.

[0011] To improve the chip mounting efficiency, preferably, the chip mounting mechanism includes four groups of positioning cylinders. The four groups of positioning cylinders are fixedly arranged on the rotating disk at equal intervals. An adsorption rod is slidably connected in the positioning cylinder. A flared opening is formed at the bottom of the adsorption rod. A first spring is sleeved on the outer wall of the adsorption rod located in the positioning cylinder. A gas guide ring is fixedly connected between the four adsorption rods. The gas guide ring is communicated with the inner cavity of the flared opening through a negative pressure pipe. A negative pressure pump is fixedly connected to the rotating disk. The negative pressure pump is communicated with the inner cavity of the gas guide ring through a gas guide pipe. An electric push rod is fixedly connected to the side wall of the positioning block.

[0012] To improve the chip mounting quality, further, the lower part of the side wall of the positioning cylinder is communicated with the inner cavity of the flared opening through a charging pipe. A switching box is fixedly connected between the charging pipe and the negative pressure pipe. A switching plate is slidably connected in the switching box. An air suction through groove and an air charging through groove are respectively formed on the switching plate. A double-headed air pump is fixedly connected to the side wall of the switching box. The two output ends of the double-headed air pump are respectively communicated with the top and the bottom of the switching box.

[0013] For the convenience of feeding, preferably, the feeding part includes a feeding conveyor belt. A feeding groove is formed on the processing table. The feeding conveyor belt is installed in the feeding groove. A driving box is fixedly connected to the side wall of the feeding groove. The rotating shaft of the driving roller of the feeding conveyor belt penetrates and extends into the driving box and is fixedly connected to a driving impeller. And a flow guiding part for pushing the driving impeller to rotate is arranged on the installation plate.

[0014] In order to improve the chip - mounting efficiency, preferably, the flow - guiding part includes a piston box fixed on the mounting plate. A piston plate is slidably connected in the piston box. A second spring is fixedly connected between the side wall of the piston plate and the inner wall of the piston box. Extrusion rods are fixedly connected to both sides of the positioning block, and the extrusion rods are aligned with the piston plate. A punching tube is fixedly connected and communicated with the side wall of the piston box, and the other end of the punching tube is communicated with the inner cavity of the driving box, and a one - way valve is arranged in the punching tube.

[0015] In order to improve the chip - mounting quality, preferably, a dust - collecting box is fixedly connected to the side wall of the processing table. A plurality of groups of dust - suction holes are equidistantly arranged on the inner wall of the feeding groove, and the dust - suction holes are communicated with the inner cavity of the dust - collecting box. A suction tube is fixedly connected and communicated with the side wall of the dust - collecting box, and the other end of the suction tube is communicated with the inner cavity of the piston box, and a one - way valve is arranged in the suction tube.

[0016] Compared with the prior art, the present invention provides a chip mounter for processing electronic components, having the following beneficial effects:

[0017] 1. For the chip mounter for processing electronic components, through the setting of the rotating disk and multiple groups of adsorption rods, the feeding and chip - mounting operations of multiple groups of electronic components can be realized, saving the time of reciprocating feeding, improving the chip - mounting efficiency; and with the setting of the first spring, the impact force generated by the downward pressure of the adsorption rod on the circuit board can be greatly weakened, improving the protection effect. In addition, a flexible wind force is generated on the top of the electronic component, strengthening the tightness of the fit and improving the fitting effect.

[0018] 2. For the chip mounter for processing electronic components, through the cooperative setting of the extrusion rod, the piston plate and the piston box, during the feeding process, compressed gas is filled into the driving box to push the driving impeller to rotate, thereby driving the feeding conveyor belt to rotate, enabling the materials on the feeding conveyor belt to move, ensuring the subsequent replenishment of materials forward for feeding operations, and improving the convenience of feeding.

[0019] 3. For the chip mounter for processing electronic components, through the cooperation of the piston plate and the second spring, a directional airflow is generated in the feeding groove to suck the debris attached to the surface of the component to be installed, ensuring the cleanliness of the component to be installed and improving the chip - mounting quality; and the gas in the piston box is replenished, ensuring the continuous rotation of the subsequent feeding conveyor belt 7 and the continuity of the chip - mounting work. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The overall structural schematic diagram of a chip mounter for processing electronic components proposed by the present invention Figure 1 ;

[0021] Figure 2Schematic diagram of the overall structure of a mounter for processing electronic components proposed by the present invention Figure 2 ;

[0022] Figure 3 Schematic diagram of the partial sectional side view structure of a mounter for processing electronic components proposed by the present invention;

[0023] Figure 4 Schematic diagram of the half-sectional side view structure of a mounter for processing electronic components proposed by the present invention;

[0024] Figure 5 For a mounter for processing electronic components proposed by the present invention Figure 4 Schematic diagram of the enlarged structure of area A;

[0025] Figure 6 For a mounter for processing electronic components proposed by the present invention Figure 4 Schematic diagram of the enlarged structure of area B;

[0026] Figure 7 For a mounter for processing electronic components proposed by the present invention Figure 5 Schematic diagram of the enlarged structure of area C;

[0027] Figure 8 Schematic diagram of the enlarged partial structure of the rotating disk of a mounter for processing electronic components proposed by the present invention.

[0028] In the figure: 1. Processing table; 2. Positioning block; 21. First motor; 22. Electric push rod; 3. Rotating disk; 4. Positioning plate; 41. First screw; 42. Moving block; 43. Second motor; 5. Second screw; 51. Guide chute; 52. Third motor; 53. First sliding sleeve; 54. Mounting plate; 55. Third screw; 56. Fourth motor; 57. Guide slide bar; 571. Second sliding sleeve; 6. Positioning cylinder; 61. Adsorption rod; 611. Flared mouth; 612. Negative pressure pipe; 62. First spring; 63. Air guide ring; 64. Negative pressure pump; 641. Air guide pipe; 642. Inflation pipe; 65. Switching box; 66. Switching plate; 661. Suction through groove; 662. Inflation through groove; 67. Double-headed air pump; 7. Feeding conveyor belt; 71. Feeding groove; 72. Driving box; 73. Driving impeller; 74. Piston box; 741. Piston plate; 742. Second spring; 75. Extrusion rod; 76. Impact pipe; 8. Dust collection box; 81. Dust suction hole; 82. Suction pipe. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0030] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0031] Embodiment:

[0032] Referring to Figures 1-8 , a chip mounter for processing electronic components, includes a processing table 1, and further includes: a positioning block 2 moving along the surface of the processing table 1, a first motor 21 is fixedly connected to the bottom of the positioning block 2, a rotating disk 3 is fixedly connected to the bottom end of the rotating shaft of the first motor 21, and a chip mounting mechanism is arranged on the rotating disk 3. Among them, a displacement mechanism is arranged on the processing table 1, and the positioning block 2 is installed on the displacement mechanism; a feeding part, the feeding part is arranged on the processing table 1, and the feeding part is used for supplying the raw materials required for chip mounting.

[0033] Referring to Figures 1-4 , wherein, a positioning plate 4 is slidably connected to the processing table 1, a first screw rod 41 is rotatably connected to the inside of the processing table 1, a moving block 42 is threadedly connected to the first screw rod 41, the top of the moving block 42 is fixedly connected to the bottom of the positioning plate 4, a second motor 43 is fixedly connected to the side wall of the processing table 1, and the output shaft of the second motor 43 is fixedly connected to the end of the first screw rod 41; the displacement mechanism includes a second screw rod 5, guide sliding grooves 51 are opened on both sides of the processing table 1, the second screw rod 5 is rotatably connected to one of the guide sliding grooves 51, a third motor 52 is fixedly connected to the side wall of the processing table 1, the output shaft of the third motor 52 is fixedly connected to the end of the second screw rod 5, a first sliding sleeve 53 is threadedly connected to the second screw rod 5, the top of the first sliding sleeve 53 is fixedly connected to a mounting plate 54, a third screw rod 55 is rotatably connected between the two side walls of the mounting plate 54, a fourth motor 56 is fixedly connected to the side wall of the mounting plate 54, the output shaft of the fourth motor 56 is fixedly connected to the end of the third screw rod 55, and the positioning block 2 is threadedly sleeved on the third screw rod 55; a guide sliding rod 57 is fixedly connected to the other guide sliding groove 51, a second sliding sleeve 571 is slidably sleeved on the guide sliding rod 57, and the other end of the mounting plate 54 is fixedly connected to the top of the second sliding sleeve 571; the side walls of the first sliding sleeve 53 and the second sliding sleeve 571 are both in sliding fit with the inner wall of the guide sliding groove 51, and the top of the positioning block 2 is in sliding fit with the bottom of the mounting plate 54; the feeding part includes a feeding conveyor belt 7, a feeding groove 71 is opened on the processing table 1, and the feeding conveyor belt 7 is installed in the feeding groove 71.

[0034] With the above structure set up, the circuit board is placed into the positioning plate 4. Subsequently, the second motor 43 drives the first screw rod 41 to rotate, causing the positioning plate 4 to move along the first screw rod 41 to a predetermined position. Subsequently, through the coordinated operation of the third motor 52 and the fourth motor 56, the moving block 42 moves on the surface of the processing table 1, and the rotating disk 3 is moved above the feeding conveyor belt 7. At this time, the electric push rod 22 extends downward and inserts into the positioning cylinder 6, thereby pushing the adsorption rod 61 to slide downward until the flared opening 611 fits onto the surface of the component to be installed. Meanwhile, the negative pressure pump 64 is turned on, causing a negative pressure effect to be generated within the flared opening 611, thereby adsorbing and removing the component to be installed. Subsequently, the electric push rod 22 resets, and the first motor 21 drives the rotating disk 3 to rotate, moving a new positioning cylinder 6 below the electric push rod 22. In this way, the components to be installed are adsorbed at the bottoms of multiple groups of flared openings 611, achieving the material taking work for multiple groups of components to be installed, saving the material taking time, and improving the chip mounting efficiency.

[0035] Refer to Figure 5 , Figure 7 and Figure 8 , in which, the chip mounting mechanism includes four groups of positioning cylinders 6. The four groups of positioning cylinders 6 are fixedly arranged at equal intervals on the rotating disk 3. An adsorption rod 61 is slidably connected within the positioning cylinder 6. A flared opening 611 is formed at the bottom of the adsorption rod 61. A first spring 62 is sleeved on the outer wall of the adsorption rod 61 located within the positioning cylinder 6. A gas guide ring 63 is fixedly connected between the four groups of adsorption rods 61. The gas guide ring 63 is communicated with the inner cavity of the flared opening 611 through a negative pressure pipe 612. A negative pressure pump 64 is fixedly connected to the rotating disk 3. The negative pressure pump 64 is communicated with the inner cavity of the gas guide ring 63 through a gas guide pipe 641. An electric push rod 22 is fixedly connected to the side wall of the positioning block 2. The lower part of the side wall of the positioning cylinder 6 is communicated with the inner cavity of the flared opening 611 through an inflation pipe 642. A switching box 65 is fixedly connected between the inflation pipe 642 and the negative pressure pipe 612. A switching plate 66 is slidably connected within the switching box 65. An air intake through groove 661 and an inflation through groove 662 are respectively formed on the switching plate 66. A double-headed air pump 67 is fixedly connected to the side wall of the switching box 65. Two output ends of the double-headed air pump 67 are respectively communicated with the top and the bottom of the switching box 65.

[0036] It should be noted that the volume of the gas compressed within the positioning cylinder 6 is greater than the volume of the gas sucked away by the flared opening 611.

[0037] Through the arrangement of the above structure, under the coordinated operation of the third motor 52 and the fourth motor 56, the component to be installed under the electric push rod 22 is driven to move to the required installation position, and then the electric push rod 22 extends downward to push the adsorption rod 61 downward so that the component to be installed is attached to the circuit substrate. At the same time, the double-headed air pump 67 adjacent to the adsorption rod 61 starts to work and fills gas into the top of the switching box 65, thereby pushing the switching plate 66 to slide downward, so that the inflation groove 662 and the inflation tube 642 are in a connected state. At this time, the suction groove 661 and the negative pressure tube 612 will be changed to a disconnected state, and during the adsorption During the downward movement of the rod 61, the gas in the positioning tube 6 will be compressed. At this time, the compressed gas will quickly flow along the inflation tube 642 to the bell mouth 611, thereby relieving the negative pressure in the bell mouth 611, so that the components to be installed will be separated from the bottom of the bell mouth 611, and the automatic material drop will be completed, which improves the patch efficiency. At the same time, the gas filled in will continue to blow downward along the bell mouth 611, so that the components to be installed can be stably attached to the circuit substrate, effectively improving the patch effect; and in conjunction with the rotation of the rotating disk 3, repeating the above steps can complete multiple patch operations without multiple material removals, effectively improving the patch efficiency. In addition, in conjunction with the setting of the first spring 62, the impact of the downward pressure of the adsorption rod 61 on the circuit board can be greatly reduced, and the flexible wind force can be used to enhance the tightness of the fit and improve the fit effect.

[0038] Reference Figures 1-4 and Figure 6 , wherein a driving box 72 is fixedly connected to the side wall of the feeding trough 71, the rotating shaft of the driving roller of the feeding conveyor belt 7 extends through the driving box 72 and is fixedly connected to a driving impeller 73, and a guide portion for driving the driving impeller 73 to rotate is provided on the mounting plate 54; the guide portion includes a piston box 74, the piston box 74 is fixed on the mounting plate 54, a piston plate 741 is slidably connected in the piston box 74, a second spring 742 is fixedly connected between the side wall of the piston plate 741 and the inner wall of the piston box 74, an extrusion rod 75 is fixedly connected to both sides of the positioning block 2, the extrusion rod 75 is aligned with the piston plate 741, the side wall of the piston box 74 is fixed and connected to a punch tube 76, the other end of the punch tube 76 is connected to the inner cavity of the driving box 72, and a one-way valve is provided in the punch tube 76.

[0039] It should be noted that the one-way valve in the impulse tube 76 can only allow the airflow in the piston box 74 to move into the drive box 72 .

[0040] With the above structure, when the moving block 42 takes materials again with multiple sets of suction rods 61, the extrusion rod 75 will extrude the piston plate 741, thereby compressing the gas in the piston box 74 and opening the one-way valve in the impact tube 76, so that the gas fills into the drive box 72 along the impact tube 76, thereby driving the drive impeller 73 to rotate, driving the feeding conveyor belt 7 to rotate, moving the materials on the feeding conveyor belt 7, ensuring the subsequent replenishment of materials forward for material taking operations, and improving the convenience of material taking.

[0041] Refer to Figure 3 、 Figure 4 , wherein, a dust collection box 8 is fixedly connected to the side wall of the processing table 1, and multiple groups of dust suction holes 81 are equidistantly arranged on the inner wall of the feeding groove 71. The dust suction holes 81 are communicated with the inner cavity of the dust collection box 8. The side wall of the dust collection box 8 is fixedly connected and communicated with a suction pipe 82. The other end of the suction pipe 82 is communicated with the inner cavity of the piston box 74. A one-way valve is arranged in the suction pipe 82, and a filter screen is arranged at the connection between the suction pipe 82 and the piston box 74.

[0042] It should be noted that the one-way valve in the suction pipe 82 only allows the air flow in the feeding groove 71 to move into the piston box 74.

[0043] With the above structure, when the moving block 42 leaves above the feeding groove 71, the extrusion rod 75 will release the extrusion on the piston plate 741. At this time, under the rebounding action of the second spring 742, the piston plate 741 will reset and generate a suction force in the piston box 74, thereby opening the one-way valve in the suction pipe 82, so that the air flow in the feeding groove 71 moves into the dust collection box 8 along the dust suction holes 81. At this time, by using the gas flow effect, the debris attached to the surface of the element to be installed is sucked, ensuring the cleanliness of the element to be installed and improving the chip mounting quality; and realizing the replenishment of the gas in the piston box 74, ensuring the continuous rotation of the subsequent feeding conveyor belt 7 and the coherence of the chip mounting work.

[0044] Refer to Figures 1-8In the present invention, when in use, first place the component to be installed on the feeding conveyor belt 7, then place the circuit substrate into the positioning plate 4, then the second motor 43 drives the first screw 41 to rotate, so that the positioning plate 4 moves to a predetermined position along the first screw 41; then, the third motor 52 and the fourth motor 56 cooperate to operate, so that the moving block 42 moves on the surface of the processing table 1, and the rotating disk 3 moves to above the feeding conveyor belt 7, at this time, the electric push rod 22 extends downward and is inserted into the positioning cylinder 6, thereby pushing the adsorption rod 61 to slide downward until The bell mouth 611 is attached to the surface of the component to be installed, and the negative pressure pump 64 is turned on at the same time, so that a negative pressure is generated in the bell mouth 611, so that the component to be installed is adsorbed and taken out, and then the electric push rod 22 is reset, and the first motor 21 drives the rotating disk 3 to rotate, and the new positioning cylinder 6 is moved to the bottom of the electric push rod 22, and so on and so forth, and the components to be installed are adsorbed on the bottom of multiple groups of bell mouths 611, so that the material taking work of multiple groups of components to be installed is realized, which saves the material taking time and improves the patch efficiency; then, under the coordinated operation of the third motor 52 and the fourth motor 56, the electric push rod 22 is driven to move the new positioning cylinder 6 to the bottom of the electric push rod 22, and the positioning cylinder 6 is moved ... The component to be installed under the push rod 22 moves to the desired installation position, and then the electric push rod 22 extends downward to push the adsorption rod 61 downward, so that the component to be installed is attached to the circuit substrate. At the same time, the double-headed air pump 67 adjacent to the adsorption rod 61 starts to work and fills gas into the top of the switching box 65, thereby pushing the switching plate 66 to slide downward, so that the inflation groove 662 and the inflation tube 642 are in a connected state. At this time, the suction groove 661 and the negative pressure tube 612 will be changed to a disconnected state, and in the process of the adsorption rod 61 moving downward, the positioning cylinder 6 will be compressed. The gas in the bell mouth 611 is compressed quickly along the inflation tube 642 to be replenished into the bell mouth 611, so as to release the negative pressure in the bell mouth 611, so that the component to be installed can be separated from the bottom of the bell mouth 611, and the automatic material dropping is completed, thereby improving the patch efficiency. At the same time, the filled gas will continue to blow downward along the bell mouth 611, so that the component to be installed can be stably attached to the circuit substrate, thereby effectively improving the patch effect. In conjunction with the rotation of the rotating disk 3, the above steps are repeated, so that multiple patch operations can be completed without multiple material removals, thereby effectively improving the patch efficiency.

[0045] When the moving block 42 takes materials again with multiple groups of suction rods 61, the extrusion rod 75 will extrude the piston plate 741, thereby compressing the gas in the piston box 74 and opening the one-way valve in the impact tube 76, so that the gas fills into the driving box 72 along the impact tube 76, thereby driving the driving impeller 73 to rotate, driving the feeding conveyor belt 7 to rotate, and moving the materials on the feeding conveyor belt 7 to ensure the subsequent replenishment of materials forward for material taking operations, improving the convenience of material taking; at the same time, when the moving block 42 leaves, the extrusion rod 75 will release the extrusion on the piston plate 741. At this time, under the resilience of the second spring 742, the piston plate 741 will reset and generate a suction force in the piston box 74, thereby opening the one-way valve in the suction tube 82, so that the airflow in the feeding groove 71 moves along the dust suction holes 81 into the dust collection box 8. At this time, by using the gas flow effect, the debris attached to the surface of the component to be installed is sucked, ensuring the cleanliness of the component to be installed and improving the chip mounting quality; and the gas in the piston box 74 is replenished, ensuring the continuous rotation of the subsequent feeding conveyor belt 7 and the coherence of the chip mounting work.

[0046] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A pick-and-place machine for processing electronic components, including a processing table (1), characterized in that, It further includes: A positioning block (2) moving along the surface of the processing table (1). A first motor (21) is fixedly connected to the bottom of the positioning block (2). The bottom end of the rotating shaft of the first motor (21) is fixedly connected to a rotating disk (3). A chip mounting mechanism is arranged on the rotating disk (3). Among them, a displacement mechanism is arranged on the processing table (1), and the positioning block (2) is installed on the displacement mechanism. A feeding part, which is arranged on the processing table (1) and is used for supplying the raw materials required for chip mounting.

2. The pick-and-place machine for processing electronic components according to claim 1, wherein, A positioning plate (4) is slidably connected to the processing table (1). A first screw rod (41) is rotatably connected to the processing table (1). A moving block (42) is threadedly connected to the first screw rod (41). The top of the moving block (42) is fixedly connected to the bottom of the positioning plate (4). A second motor (43) is fixedly connected to the side wall of the processing table (1), and the output shaft of the second motor (43) is fixedly connected to the end of the first screw rod (41).

3. The pick-and-place machine for processing electronic components according to claim 1, characterized in that, The displacement mechanism includes a second screw rod (5). Guide chute (51) is provided on both sides of the processing table (1). The second screw rod (5) is rotatably connected in one of the guide chutes (51). A third motor (52) is fixedly connected to the side wall of the processing table (1), and the output shaft of the third motor (52) is fixedly connected to the end of the second screw rod (5). A first sliding sleeve (53) is threadedly connected to the second screw rod (5). The top of the first sliding sleeve (53) is fixedly connected to a mounting plate (54). A third screw rod (55) is rotatably connected between the two side walls of the mounting plate (54). A fourth motor (56) is fixedly connected to the side wall of the mounting plate (54), and the output shaft of the fourth motor (56) is fixedly connected to the end of the third screw rod (55). And the positioning block (2) is threadedly sleeved on the third screw rod (55).

4. The pick-and-place machine for processing electronic components according to claim 3, characterized in that, A guide slide bar (57) is fixedly connected to the other guide chute (51). A second sliding sleeve (571) is slidably sleeved on the guide slide bar (57). The other end of the mounting plate (54) is fixedly connected to the top of the second sliding sleeve (571).

5. The pick-and-place machine for processing electronic components according to claim 4, wherein The side walls of the first sliding sleeve (53) and the second sliding sleeve (571) are both in sliding fit with the inner wall of the guide chute (51). The top of the positioning block (2) is in sliding fit with the bottom of the mounting plate (54).

6. The mounter for processing electronic components according to claim 3, characterized in that, The patch mechanism includes four groups of positioning cylinders (6), and the four groups of positioning cylinders (6) are fixedly arranged on the rotating disk (3) at equal intervals. An adsorption rod (61) is slidably connected in the positioning cylinder (6). A flared opening (611) is formed at the bottom of the adsorption rod (61). A first spring (62) is sleeved on the outer wall of the adsorption rod (61) located in the positioning cylinder (6). A gas guide ring (63) is fixedly connected between the four groups of adsorption rods (61). The gas guide ring (63) is communicated with the inner cavity of the flared opening (611) through a negative pressure pipe (612). A negative pressure pump (64) is fixedly connected to the rotating disk (3). The negative pressure pump (64) is communicated with the inner cavity of the gas guide ring (63) through a gas guide pipe (641). An electric push rod (22) is fixedly connected to the side wall of the positioning block (2).

7. The mounter for processing electronic components according to claim 6, wherein, The lower part of the side wall of the positioning cylinder (6) is communicated with the inner cavity of the flared opening (611) through an inflation pipe (642). A switching box (65) is fixedly connected between the inflation pipe (642) and the negative pressure pipe (612). A switching plate (66) is slidably connected in the switching box (65). An air suction through groove (661) and an air inflation through groove (662) are respectively formed on the switching plate (66). A double-headed air pump (67) is fixedly connected to the side wall of the switching box (65). Two output ends of the double-headed air pump (67) are respectively communicated with the top and the bottom of the switching box (65).

8. The pick-and-place machine for processing electronic components according to claim 3, wherein, The feeding part includes a feeding conveyor belt (7). A feeding groove (71) is formed in the processing table (1). The feeding conveyor belt (7) is installed in the feeding groove (71). A driving box (72) is fixedly connected to the side wall of the feeding groove (71). The rotating shaft of the driving roller of the feeding conveyor belt (7) penetrates through and extends into the driving box (72) and is fixedly connected with a driving impeller (73). A flow guiding part for driving the driving impeller (73) to rotate is arranged on the mounting plate (54).

9. The pick-and-place machine for processing electronic components according to claim 8, characterized in that, The flow guiding part includes a piston box (74). The piston box (74) is fixed on the mounting plate (54). A piston plate (741) is slidably connected in the piston box (74). A second spring (742) is fixedly connected between the side wall of the piston plate (741) and the inner wall of the piston box (74). Extrusion rods (75) are fixedly connected to both sides of the positioning block (2). The extrusion rods (75) are aligned with the piston plate (741). A punching pipe (76) is fixedly connected and communicated with the side wall of the piston box (74). The other end of the punching pipe (76) is communicated with the inner cavity of the driving box (72). A one-way valve is arranged in the punching pipe (76).

10. A pick-and-place machine for processing electronic components according to claim 9, characterized in that, A dust collection box (8) is fixedly connected to the side wall of the processing table (1). A plurality of dust suction holes (81) are formed at equal intervals on the inner wall of the feeding groove (71). The dust suction holes (81) are communicated with the inner cavity of the dust collection box (8). A suction pipe (82) is fixedly connected and communicated with the side wall of the dust collection box (8). The other end of the suction pipe (82) is communicated with the inner cavity of the piston box (74). A one-way valve is arranged in the suction pipe (82).

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