Antenna module mounted on a vehicle

Abstract

An antenna module mounted on a vehicle includes a printed circuit board on a first face of which at least one antenna element is arranged, a second printed circuit board whose first face is joined to a second face of the printed circuit board, a first electronic component being arranged on the first face of the second printed circuit board, a second electronic component being arranged on a second face of the second printed circuit board, a first heat sink arranged in contact with the first electronic component arranged on the first face of the second printed circuit board, a second heat sink arranged in contact with the second electronic component arranged on the second face of the second printed circuit board, and a hole region formed in a central portion of the printed circuit board to accommodate the first electronic component.

Description

Technical Field

[0001] This invention relates to an antenna module mounted on a vehicle. A specific embodiment relates to an antenna module having a plurality of communication modules and a heat dissipation structure, and a vehicle including the antenna module. Background Technology

[0002] Electronic devices can be categorized into mobile / portable terminals and stationary terminals based on their portability. Furthermore, in recent years, the commercialization of wireless communication systems based on LTE technology has enabled electronic devices to offer a wide variety of services. In the future, it is expected that wireless communication systems using 5G technology will be commercialized and provide a diverse range of services. Additionally, a portion of the LTE frequency band can be allocated to provide 5G communication services.

[0003] In this regard, mobile terminals can be configured to provide 5G communication services across various frequency bands. In recent years, there has been ongoing effort to utilize Sub-6 GHz bands to provide 5G communication services. However, in the future, in addition to Sub-6 GHz bands, millimeter wave (mmWave) bands are also expected to be used to provide 5G communication services, in order to achieve faster data speeds.

[0004] In recent years, the demand for providing such communication services via vehicles has been gradually increasing. On the other hand, regarding communication services, in addition to existing communication services such as LTE (Long Term Evolution), the demand for 5G communication services as the next generation of communication services has also become a matter of social concern.

[0005] On the other hand, since the vehicle body and roof are made of metal, there is a problem with radio wave obstruction. Therefore, an additional antenna module can be installed on the upper part of the vehicle body or roof. Alternatively, if the antenna module is installed on the lower part of the vehicle body or roof, the portion of the vehicle body or roof corresponding to the antenna installation area can be made of a non-metallic material.

[0006] However, from a design perspective, the vehicle body or roof needs to be formed as a single piece. In this case, the exterior of the vehicle body or roof can be made of metal. Therefore, there is a problem of a significant decrease in antenna efficiency caused by the vehicle body or roof being assembled as a single unit.

[0007] Furthermore, the antenna module mounted on the vehicle may include electronic components, including a plurality of communication modules. The electronic components may be configured on different substrates or on different surfaces of the same substrate. Considering the configuration of electronic components on different substrates or on different surfaces of the same substrate, an optimal heat dissipation structure is required. Summary of the Invention

[0008] The problem to be solved

[0009] The purpose of this specification is to solve the above-mentioned problems and other issues. The purpose of this specification is to provide an antenna module for a vehicle that has multiple communication modules and a heat dissipation structure.

[0010] The purpose of this specification is to achieve an optimal heat dissipation structure by considering the configuration of electronic components disposed on two sides of a substrate or on substrates that are different from each other.

[0011] The purpose of this specification is to provide an antenna module for use in vehicles that has multiple communication modules and a heat dissipation structure.

[0012] The purpose of this specification is to provide an optimal heat dissipation structure that takes into account the optimal shape and configuration of multiple covers and heat sinks.

[0013] The purpose of this manual is to optimize the heat dissipation structure for electronic components arranged on multiple sides of a PCB (Printed Circuit Board).

[0014] The purpose of this manual is to minimize the overall height of the antenna module while improving heat dissipation performance.

[0015] The purpose of this manual is to improve antenna performance while keeping the height of the antenna module mounted on the vehicle below a specified level.

[0016] The purpose of this specification is to apply a heat dissipation structure, taking into account the configuration of antennas and electronic components capable of broadband operation in order to support various communication systems, to vehicles.

[0017] The purpose of this specification is to effectively dissipate the heat generated by the electronic components to the outside of the antenna module through a plurality of heat sink structures.

[0018] The purpose of this specification is to provide an optimized heat dissipation structure by taking into account the heat transfer path along the signal path within the antenna module.

[0019] Technical solutions to the problem

[0020] To achieve the above or other objectives, an antenna module mounted on a vehicle according to one aspect of this specification includes: a PCB, with at least one antenna element disposed on a first side of the PCB; a second PCB, the first side being combined with a second side of the PCB, a first electronic component disposed on the first side, and a second electronic component disposed on the second side; a first heat sink configured to contact the first electronic component disposed on the first side of the second PCB; a second heat sink configured to contact the second electronic component disposed on the second side of the second PCB; and a hole region formed in the center of the PCB to accommodate the first electronic component.

[0021] According to an embodiment, the first width of the lower end of the first heat sink may be smaller than the width of the hole region, such that at least a portion of the first heat sink is inserted into the hole region. The inserted portion of the first heat sink can dissipate heat generated in the first electronic component by contacting it with the first electronic component housed in the hole region. The second width of the second heat sink may be larger than the width of the second PCB, such that heat generated in the second electronic component is dissipated.

[0022] According to an embodiment, the antenna module may further include a first cover that engages with a side portion of the upper region of the first heat sink. The third width of the opening region of the first cover into which the first heat sink inserts may be greater than the first width of the lower end of the first heat sink.

[0023] According to an embodiment, the first cover may include: a horizontal region parallel to a horizontal plane; and a first inclined region and a second inclined region inclined at a predetermined angle relative to the horizontal plane. The first heat sink may be disposed in the horizontal region of the first cover.

[0024] According to an embodiment, the first heat sink may include: a first metal structure formed with a first width and a first height, such that at least a portion is inserted into the hole region of the PCB; a second metal structure connected to the first metal structure and formed at a second height along the Z-axis in the upper region of the first metal structure; and a third metal structure connected to the second metal structure and formed at a third height along the Z-axis in the upper region of the second metal structure, the side portion being coupled to the first cover. The third height of the third metal structure may be greater than the second height of the second metal structure. The second height of the second metal structure may be greater than the first height of the first metal structure.

[0025] According to an embodiment, the third metal structure may include a plurality of metal components, which are parallel to each other in the horizontal axis direction and arranged in the Z-axis direction. The width of the second metal structure may be the same as the third width of the third metal structure. The first width of the first metal structure may be smaller than the third width of both the second and third metal structures.

[0026] According to an embodiment, the antenna module may further include a thermoelectric element disposed between the second electronic component and the second heat sink disposed on the second side of the second PCB, and absorb heat generated by the second electronic component. The first electronic component disposed on the first side of the second PCB may be bonded to the lower end of the first heat sink using a thermoelectric material. The first side of the thermoelectric element may contact the second electronic component using the thermoelectric material, and the second side of the thermoelectric element may contact the second heat sink.

[0027] According to an embodiment, the second heat sink can be configured in the horizontal region of the first cover to overlap with the first heat sink in the Z-axis direction. The second heat sink may include: a fourth metal structure in contact with the thermoelectric element, formed with the second width and a fourth height; and a fifth metal structure connected to the fourth metal structure, formed with the second width and a fifth height. The fourth metal structure may include a plurality of second metal members, which are parallel to each other in the horizontal axis direction and arranged towards the Z-axis direction. The fourth height of the fourth metal structure may be greater than the fifth height of the fifth metal structure.

[0028] According to an embodiment, the first electronic component may include at least one of a modem, an RF (radio frequency) transceiver, a power management chip, and a first power amplifier. The second electronic component may include a DC / DC converter and a second power amplifier. The first power amplifier may operate in the low-frequency band (LB), and the second power amplifier may operate in the mid-frequency band (MB) and the high-frequency band (HB). Heat generated by the first power amplifier can be dissipated through the first heat sink, and heat generated by the second power amplifier can be dissipated through the second heat sink.

[0029] This specification provides a vehicle equipped with an antenna module according to another aspect of the specification. The vehicle includes: an antenna module disposed under the roof of the vehicle; and a telematics module operatively coupled to the antenna module, configured to communicate with at least one of a neighboring vehicle, a Road Side Unit (RSU), and a base station. The antenna module includes: a PCB with at least one antenna element disposed on a first side of the PCB; a second PCB, the first side being coupled to the second side of the PCB, a first electronic component disposed on the first side, and a second electronic component disposed on the second side; a first heat sink configured to contact the first electronic component disposed on the first side of the second PCB; a second heat sink configured to contact the second electronic component disposed on the second side of the second PCB; and a hole region formed in the center of the PCB to accommodate the first electronic component.

[0030] According to an embodiment, the first width of the lower end of the first heat sink may be smaller than the width of the hole region, such that at least a portion of the first heat sink is inserted into the hole region. The inserted portion of the first heat sink can dissipate heat generated in the first electronic component by contacting it with the first electronic component housed in the hole region. The second width of the second heat sink may be larger than the width of the second PCB, such that heat generated in the second electronic component is dissipated.

[0031] Invention Effects

[0032] The technical effects of the antenna module mounted on the vehicle as described above, and the vehicle including it, will now be explained.

[0033] According to this specification, the vehicle may be provided with an antenna module having multiple communication modules and a heat dissipation structure.

[0034] According to this specification, an optimal heat dissipation structure can be achieved through the optimal shape and configuration of multiple covers and heat sinks.

[0035] According to this specification, the metal structures of the first and second heat sinks are shaped and optimized for each of the multiple regions, thereby enabling the heat dissipation structure to be optimized for electronic components disposed on multiple surfaces of the PCB.

[0036] According to this specification, the first heat sink is configured to be integrated with the upper cover, thereby minimizing the overall height of the antenna module while improving heat dissipation performance.

[0037] According to this specification, heat generated in the electronic components can be dissipated to the upper and lower regions by a first heat sink that is combined with the upper cover and a second heat sink that is disposed in the lower region of the lower cover.

[0038] According to this specification, an optimized heat dissipation structure can be proposed by taking into account the heat transfer path along the signal path from the power amplifier to the antenna element that can operate in broadband.

[0039] The following detailed embodiments will clarify other applicable scopes of the present invention. However, since those skilled in the art will clearly understand the various changes and modifications within the technical concept and scope of the present invention, it should be understood that the specific embodiments, such as the detailed embodiments and preferred embodiments, are merely examples. Attached Figure Description

[0040] Figure 1 This is a diagram illustrating a vehicle as described in this specification.

[0041] Figure 2a and Figure 2b The diagram illustrates a structure within a vehicle, including the antenna module described herein, that allows the antenna module to be mounted within the vehicle.

[0042] Figure 3 This is a configuration diagram of the vehicle according to an embodiment of this specification.

[0043] Figure 4 This describes the structure of a second PCB, which is an embodiment of a NAD substrate that can be stacked with a first PCB, which is the main PCB.

[0044] Figure 5 Enlarged view and cross-sectional view showing the stacked structure of the PCB and the second PCB.

[0045] Figure 6 This is a cross-sectional view of a vehicle antenna module that includes a plurality of radiators as described in this specification.

[0046] Figure 7 It means Figure 6 The diagram shows the structure of the first heat sink, the second heat sink, and the connection structure of the PCB and the second PCB.

[0047] Figure 8 express Figure 6 An exploded 3D view of the vehicle's antenna module.

[0048] Figure 9 This is a perspective view of a vehicle antenna module equipped with a first cover formed by a horizontal and an inclined structure.

[0049] Figure 10 This is a cross-sectional view of an antenna module, including a first heat sink and a second heat sink, cut along line AA′.

[0050] Figure 11 This is a cross-sectional view of the antenna module, including the second heat sink, cut along line BB′.

[0051] Figure 12 This refers to the electronic components on the first and second sides of the second PCB of the antenna module configured in this specification.

[0052] Figure 13 Indicates configuration in Figure 12 The electronic components on the first and second sides of the second PCB and their power consumption under specific temperature conditions.

[0053] Figure 14 This is a conceptual diagram illustrating the heat dissipation mechanism for electronic components on a PCB with multiple heat sources and a second PCB.

[0054] Figure 15 This diagram shows the configuration of a vehicle including the antenna module described in this specification. Detailed Implementation

[0055] The embodiments disclosed in this specification will be described in detail below with reference to the accompanying drawings. Here, identical or similar constituent elements are given the same reference numerals regardless of the drawing numbers, and repeated descriptions of them will be omitted. The suffixes "module" and "part" used for constituent elements in the following description are assigned or used interchangeably only for ease of writing and do not inherently have a distinguishing meaning or function. Furthermore, in the process of describing the embodiments disclosed in this specification, if it is determined that a detailed description of related well-known technologies would obscure the essence of the embodiments disclosed in this specification, a detailed description of those technologies will be omitted. Moreover, the accompanying drawings are only for ease of understanding of the embodiments disclosed in this specification and should not be used to limit the technical ideas disclosed in this specification. Rather, they should be understood to cover all modifications, equivalents, and even substitutions included within the scope of the ideas and techniques of this specification.

[0056] The terms "first," "second," etc., which contain ordinal numbers, can be used to describe various constituent elements, but the constituent elements are not limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from other constituent elements.

[0057] When a component is mentioned as being "connected" or "coupled" to another component, it may mean that it is directly connected or coupled to the other component, but it can also be understood as meaning that there are other components between them. Conversely, when a component is mentioned as being "directly connected" or "directly coupled" to another component, it should be understood as meaning that there are no other components between them.

[0058] Unless the context clearly indicates otherwise, the singular form should include the plural form.

[0059] In this application, terms such as “comprising” or “having” are used only to specify the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, and are not intended to preclude the possibility of the presence or addition of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0060] The antenna module described in this manual will be explained in detail below. Regarding this, Figure 1 This is a diagram illustrating a vehicle as described in this specification.

[0061] Reference Figure 1 Vehicle 1 may have at least one communication antenna. Vehicle 1 may use the communication antenna to transmit and / or receive signals in various frequency bands. Vehicle 1 may perform V2V (Vehicle-to-Vehicle), V2I (Vehicle-to-Infrastructure), V2P (Vehicle-to-Pedestrian), V2N (Vehicle-to-Network) and other communication methods.

[0062] The antenna can be constructed from a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna can be a transparent antenna.

[0063] The antenna can also be configured on the glass of vehicle 1. The antenna can be integrated with or attached to the windshield 101, door windows 102, 103, corner window 104, rear windshield (not shown), rearview mirror (not shown), sunroof 105, or headlight glass 106. For example, the antenna can be a transparent antenna. As another example, the antenna can be configured in the area formed by the roof 110 on the upper part of vehicle 1.

[0064] on the other hand, Figure 2a and Figure 2b The diagram illustrates a structure within a vehicle, including the antenna module described herein, that allows the antenna module to be mounted within the vehicle.

[0065] Reference Figure 2a and Figure 2b In this specification, in order to improve the appearance of the vehicle and maintain telematics performance in the event of a collision, a flat antenna with a non-protruding shape will be used instead of the existing shark fin antenna. Furthermore, this specification will propose an antenna that integrates both LTE and 5G antennas while providing existing mobile communication services (LTE) and taking into account fifth-generation (5G) communication.

[0066] Reference Figure 2a The antenna module 1000 is mounted on the roof of the vehicle 1. Figure 2a In the antenna module 1000, a radome 110a surrounds the antenna system 1000, protecting the antenna module 1000 from external environmental influences and external impacts during vehicle movement. The radome 110a may be formed of a dielectric material that allows radio wave signals transmitted and received by the antenna system 1000 and infrastructure structures such as base stations or other vehicles to pass through.

[0067] Reference Figure 2b The antenna module 1000 can be disposed within the roof structure 110b of the vehicle 1, and at least a portion of the roof structure 110b is made non-metallic. In this case, at least a portion of the roof structure 110b of the vehicle can be made non-metallic and formed of a dielectric material that allows the antenna system 1000 to transmit radio wave signals to and from infrastructure structures such as base stations or other vehicles.

[0068] On the other hand, refer to Figure 2a and Figure 2b The area formed by the beam pattern formed by the antenna installed in the antenna module 1000 mounted on the vehicle needs to be formed from the horizontal region to the upper region at a specified angle.

[0069] Regarding this, the peak of the elevation beam pattern of the antenna in the antenna module 1000 does not need to be formed at the aperture location. Therefore, the peak of the antenna's elevation beam pattern needs to be formed from the horizontal region to the upper region at a specified angle. For example, the antenna's elevation beam pattern can be formed as follows: Figure 2a and Figure 2b The beam is formed in a hemisphere shape. In addition, since the beam peak is formed in the low elevation range (e.g., 30 degrees), the elevation beam pattern of the antenna can also be called a low elevation beam pattern.

[0070] Figure 3 This is a configuration diagram of the vehicle according to an embodiment of this specification. (Refer to...) Figure 3Vehicle 1 may include an object detection device 410, a communication device 420, a user interface device 431, a driving operation device 432, a vehicle drive device 433, a running system 434, a navigation system 435, a detection unit 436, an interface unit 437, a memory 438, a power supply unit 439, and / or a control unit 440. In contrast, vehicle 1 may include other components besides those described above, or some of the aforementioned components may be omitted.

[0071] The object detection device 410 may be a device for detecting objects located outside the vehicle 1. For example, the object detection device 410 may include a processor 411, a camera 412, a radar 413, a lidar 414, an ultrasonic sensor 415, and / or an infrared sensor 416.

[0072] The communication device 420 can be a device for communicating with external devices. The communication device 420 may include at least one of the following: a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit capable of implementing various communication protocols, and RF components. For example, the communication device 420 may include a processor 421, a short-range communication unit 422, a location information unit 423, a V2X (vehicle-to-the-world) communication unit 424, an optical communication unit 425, a broadcast transceiver unit 426, and / or an ITS (Internet System for Telecommunications) communication unit 427.

[0073] The user interface device 431 can be a device for interaction between the vehicle 1 and the user. The vehicle 1 can implement UI (User Interface) or UX (User Experience) through the user interface device 431.

[0074] The driving control device 432 may be a device for receiving user input for driving. The vehicle drive device 433 may be a device for driving various devices within the electrically controlled vehicle 1. The operating system 434 may be a system for controlling various operations of the vehicle 1. The navigation system 435 may provide navigation information. The detection unit 436 may detect the status of the vehicle 1.

[0075] The interface unit 437 serves as a channel for connecting to various types of external devices in the vehicle 1. The memory 438 stores basic data for the units in the vehicle 1, control data for the operation of the control unit, input / output data, etc. The power supply unit 439 supplies the power required for the operation of each component. The control unit 440 controls the overall operation of each unit within the vehicle 1. The control unit 440 can be implemented by an ECU (Electronic Control Unit) and / or a TCU (Telematics Control Unit).

[0076] On the other hand, refer to Figures 1 to 3 The antenna system mounted on the vehicle can be configured inside the vehicle, on the vehicle roof, inside the roof, or inside the roof frame. In this regard, the antenna system disclosed in this specification can be configured to operate in the low-frequency (LB), mid-frequency (MB), and high-frequency (HB) bands of 4G LTE systems and the Sub-6 band of 5G NR systems.

[0077] On the other hand, the vehicle antenna module described in this specification will be explained. Regarding the substrate disposed inside the vehicle antenna module, since electronic components are disposed on both the first and second sides, the size occupied by the substrate can be reduced. In particular, since electronic components for 5G wireless communication are disposed, the NAD (Network Access Device) substrate can be implemented as a two-sided substrate. The NAD substrate implemented as a two-sided substrate can be formed with a two-sided heat dissipation structure. Furthermore, the reduced-size NAD substrate can be optimally positioned on the main PCB.

[0078] Regarding this, Figure 4 This describes the structure of a second PCB, which is an embodiment of a NAD substrate that can be stacked with a first PCB, which is the main PCB. Figure 4 (a) indicates a structure in which electronic components are disposed only on the first surface S1b of the second PCB1200b. A ball grid for electrical connection with the PCB, which serves as the main substrate, may be formed on the second surface S2b of the second PCB1200b.

[0079] Figure 4 (b) indicates a second structure in which a first electronic component is disposed on the first side S1b of the second PCB1200b, and a second electronic component is disposed on the second side S2b. Figure 4 In (b), the second PCB1200b can be formed with a first width W1p. A second electronic component can be disposed at the center of the second surface S2b of the second PCB1200b. Ball grids for electrical connection with the PCB, which serves as the main substrate, can be formed on one side and the other side of the second surface S2b of the second PCB1200b.

[0080] Figure 4 (c) indicates a third structure in which a first electronic component is disposed on the first side S1b of the second PCB1200b and a second electronic component is disposed on the second side S2b. Figure 4 The structure of (c) is to place in Figure 4A portion of the electronic components on the first surface S1b of (b) are disposed on the structure of the second surface S2b. A second electronic component may be disposed at the center of the second surface S2b of the second PCB 1200b. Ball grids for electrical connection with the PCB, which serves as the main substrate, may be formed on one and the other sides of the second surface S2b of the second PCB 1200b. Figure 4 In (c), the second PCB1200b can be formed with a second width W2p that is narrower than the first width W1p. Therefore, Figure 4 The third structure of (c) compared to Figure 4 (b) The second structure reduces the width equivalent to ΔWp, thus making it easy to fit within the empty space of the PCB, which serves as the main substrate.

[0081] On the other hand, in the vehicle antenna module of this specification, the PCB as the main substrate and the second PCB as the NAD substrate can be formed in a stacked structure. Regarding this, Figure 5 Enlarged view and cross-sectional view showing the stacked structure of the PCB and the second PCB. Figure 5 (a) shows an enlarged view of the stack-up structure of PCB1200 and PCB1200b. (Refer to...) Figure 5 (a) The first surface S1a or the second surface S2a of PCB1200 can be combined with the second surface S1b of the second PCB1200b. The first surface S1b of the second PCB1200b can be configured to protrude from the second surface S2a or the first surface S1a of PCB1200.

[0082] Figure 5 (b) shows a cross-sectional view of the stacked structure of PCB 1200 and PCB 120b, which form the perforated region HR to allow the insertion of the second electronic component 1220. (Refer to...) Figure 5 (b) The first surface S1a of PCB1200 and the second surface S2b of PCB1200b can be combined by a ball grid structure.

[0083] This specification describes vehicle antenna modules that include multiple radiators. Regarding this, Figure 6 This is a cross-sectional view of a vehicle antenna module that includes a plurality of radiators as described in this specification. Figure 7 It means Figure 6 The diagram shows the structure of the first and second heat sinks combined with the PCB and the second PCB. Figure 7 (a) indicates a structure in which a first radiator 1500a with first metal structures to third metal structures 1510a, 1520a, 1530a is combined with a first cover 1310. Figure 7(b) represents the first heat transfer path HP1 from one side of the second PCB1200b to the first antenna ANT1 and the second heat transfer path HP2 from the other side of the second PCB1200b to the second antenna ANT2 in the combined structure of PCB1200 and the second PCB1200b. Figure 7 (c) is a diagram showing the second heat sink 1500b having a fourth metal structure 1510b and a fifth metal structure 1520b.

[0084] on the other hand, Figure 8 express Figure 6 An exploded perspective view of the vehicle's antenna module. (Refer to...) Figures 6 to 8 This specification describes a vehicle antenna module with multiple heat sinks. In this regard, a vehicle can provide an antenna module with multiple communication modules and heat dissipation structures. An optimal heat dissipation structure can be achieved by considering the configuration of electronic components disposed on two or different substrates. A vehicle can provide an antenna module with multiple communication modules and heat dissipation structures. An optimal heat dissipation structure can be provided, taking into account the optimal shape and configuration of multiple covers and heat sinks. The heat dissipation structure can be optimized for each electronic component disposed on multiple sides of the PCB. The overall height of the antenna module can be minimized while improving heat dissipation performance. Antenna performance can be improved while keeping the height of the antenna module mounted in the vehicle below a specified level. A heat dissipation structure considering the configuration of antennas and electronic components capable of broadband operation to support various communication systems can be applied to vehicles. With the multiple heat sink structure, heat generated in the electronic components can be effectively dissipated to the outside of the antenna module. An optimized heat dissipation structure can be provided by considering the heat transfer path along the signal path within the antenna module.

[0085] Reference Figures 6 to 8 The antenna module 1000 may include a PCB 1200, a second PCB 1200b, a first heat sink 1500a, and a second heat sink 1500b. The antenna module 1000 may also include a hole region HR formed in the PCB 1200.

[0086] At least one antenna element may be configured on the first side of PCB 1200. The first side S1b of a second PCB 1200b may be integrated into the second side of PCB 1200. A first electronic component 1210 may be configured on the first side S1b of the second PCB 1200b, and a second electronic component 1220 may be configured on the second side S2b of the second PCB 1200b. The second PCB 1200b is configured with electronic components for 5G wireless communication and is referred to as an NAD (Network Access Device) substrate.

[0087] The power consumed by the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be a first power value. The power consumed by the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b can be a second power value. The second power value can be set to be greater than the first power value. For example, the first power value can be 1.5W, and the second power value can be 1.8W. Therefore, the first heat sink 1500a and the second heat sink 1500b need to be designed to dissipate the second heat discharged through the second surface S2b of the second PCB 1200b more effectively than the first heat discharged through the first surface S1b.

[0088] The first heat sink 1500a can be configured to contact a first electronic component 1210 disposed on a first surface S1b of the second PCB 1200b. The second heat sink 1500b can be configured to contact a second electronic component 1220 disposed on a second surface S2b of the second PCB 1200b. A hole region HR can be formed at the center of the PCB 1200b to accommodate the first electronic component 1210.

[0089] The first width W1 at the lower end of the first heat sink 1500a can be smaller than the width Wh of the hole region HR, such that at least a portion of the first heat sink 1500a is inserted into the hole region HR. The portion of the first heat sink 1500a inserted into the hole region HR can contact the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b, which is housed in the hole region HR. Through the insertion of the first heat sink 1500a into the hole region HR, heat generated on the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be dissipated. On the other hand, the second width W2 of the second heat sink 1500b can be larger than the width Wp of the second PCB 1200b, such that heat generated on the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b can be dissipated.

[0090] The first width W1 at the lower end of the first heat sink 1500a is smaller than the hole area HR of the PCB 1200, and the second width W2 of the second heat sink 1500b is larger than the width Wp of the second PCB 1200b. Therefore, the first heat generated by the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be centrally dissipated through the hole area HR of the PCB 1200, which serves as the motherboard, via the first heat sink 1500a. Furthermore, the second heat generated by the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b can be dissipated through the second heat sink 1500b.

[0091] The antenna module 1000 may further include a first cover 1310 coupled to a first heat sink 1500a and a second cover 1320 coupled to a second heat sink 1500b. The first cover 1310 may be referred to as the upper cover, and the second cover 1320 as the lower cover. The first cover 1310 may be coupled to the side portion of the upper region of the first heat sink 1500a. The third width W3 of the opening region of the first cover 1310 into which the first heat sink 1500a is inserted may be greater than the first width W1 of the lower end of the first heat sink 1500a.

[0092] On the other hand, the upper cover of the vehicle antenna module in this specification, i.e., the first cover, can be formed in a streamlined or inclined structure to correspond to the shape of the vehicle's roof. Regarding this, Figure 9 This is a perspective view of a vehicle antenna module equipped with a first cover formed by a horizontal and an inclined structure. Figure 10 This is a cross-sectional view of an antenna module, including a first heat sink and a second heat sink, cut along line AA′. Figure 11 This is a cross-sectional view of the antenna module, including the second heat sink, cut along line BB′.

[0093] Reference Figure 9 The first cover 1310 may include a horizontal region 1311, a first inclined region 1312, and a second inclined region 1313. The horizontal region 1311 of the first cover 1310 may be formed parallel to a horizontal plane. The first inclined region 1312 and the second inclined region 1313 may be formed inclined at a predetermined angle to a horizontal plane parallel to the horizontal region 1311 of the first cover 1310. A first heat sink 1500a may be disposed in the horizontal region 1311 of the first cover 1310. A second heat sink 1500b may be disposed in the horizontal region 1311 of the first cover 1310.

[0094] The first inclined region 1312 of the first cover 1310 can be inclined from one end of the horizontal region 1311 to the end of the first inclined region 1312 to reduce its height. The second inclined region 1313 of the first cover 1310 can be inclined from the other end of the horizontal region 1311 to the end of the second inclined region 1313 to reduce its height. In the first portion formed at one end of the first inclined region 1312, the height from the lower end to the upper end of the first inclined region 1312 can be a first height h1c. In the second portion formed at the other end of the second inclined region 1313, the height from the lower end to the upper end of the second inclined region 1313 can be the first height h1c. In the third portion where the first inclined region 1312 connects to the horizontal region 1311, the height from the lower end to the upper end of the first inclined region 1312 can be a second height h2c. In the fourth portion where the second inclined region 1313 connects to the horizontal region 1311, the height from the lower end to the upper end of the second inclined region 1313 can be the second height h2c. The height of the horizontal region 1311 from its lower end to its upper end can be a second height h2c. The second height h2c can be greater than the first height h1c.

[0095] Reference Figure 9 and Figure 10 A first heat sink 1500a and a second heat sink 1500b can be configured on the cross-section along line AA′ of the antenna module. The first heat sink 1500a can contact the first electronic component on the first side of the second PCB 1200b using the thermoelectric material (TIM) of the first thermoelectric layer 1511. The second heat sink 1500b can contact the second electronic component on the second side of the second PCB 1200b using the thermoelectric material (TIM) of the second thermoelectric layer 1512 and the third thermoelectric layer 1513. The NAD in the second electronic component on the second side of the second PCB 1200b can function as a heat source.

[0096] Reference Figure 9 and Figure 11 On the cross-section along line BB′ of the antenna module, second heat sinks 1500a and 1500b can be configured. The second heat sink 1500b can contact the electronic components on the second side of the PCB 1200 using the thermoelectric material (TIM) of the second thermoelectric layer 1512 and the third thermoelectric layer 1513. Among the electronic components on the second side of the PCB 1200b, AP modules, Wi-Fi modules, and V2X modules can function as heat sources.

[0097] Reference Figures 6 to 11This specification describes the cover structure and radiator structure of the vehicle antenna module. The second cover 1320 may have a recessed region RA formed for inserting the second radiator 1500b. The second cover 1320 can be integrated with the metal structure inside the vehicle roof using a first region 1321 on one side and a second region 1322 on the other side of the recessed region RA. The first region 1310R1 of the first cover 1310 adjacent to one side of the first radiator 1500a and the second region 1310R2 adjacent to the other side of the first radiator 1500a can be formed of a dielectric material through which radio waves pass. The second cover 1320 integrated with the metal structure inside the vehicle roof can be formed of a metallic material, thereby improving heat dissipation characteristics.

[0098] The first heat sink 1500a may be formed in the form of a plurality of metal structures. The first heat sink 1500a may include a first metal structure 1510a, a second metal structure 1520a and a third metal structure 1530a.

[0099] The first metal structure 1510a can be formed with a first width W1 and a first height h1, such that at least a portion is inserted into the hole region HR of the PCB 1200. The second metal structure 1520a can be connected to the first metal structure 1510a. The second metal structure 1520a can be formed along the Z-axis in the upper region of the first metal structure 1510a with a second height h2. The third metal structure 1530a can be connected to the second metal structure 1520a. The third metal structure 1530a can be formed along the Z-axis in the upper region of the second metal structure 1520a with a third height h3. The side portion of the third metal structure 1530a can be combined with the first cover 1310. The third height h3 of the third metal structure 1530a can be greater than the thickness of the first cover 1310.

[0100] The third metal structure 1530a may include a plurality of metal members spaced parallel to each other in the horizontal direction and arranged in the Z-axis direction. The third height h3 of the third metal structure 1530a may be greater than the second height h2 of the second metal structure 1520a. Therefore, the first heat generated in the first electronic component 1210 can be discharged to the outside of the first cover 1310 through the plurality of metal members of the third metal structure 1530a. By including the third metal structure 1530a with a third height h3 greater than the second height h2, the first heat transfer path of the first heat can be increased. Therefore, the first heat generated in the first electronic component 1210 can be effectively discharged to the outside of the first cover 1310.

[0101] The second height h2 of the third metal structure 1520a can be greater than the first height h1 of the first metal structure 1510a. Therefore, the overall height of the first heat sink 1500a can be minimized by inserting the first metal structure 1510a of the first heat sink 1500a into the hole area HR of the PCB 1200.

[0102] On the other hand, the width W3 of the second metal structure 1520a of the first heat sink 1500a can be the same as the third width W3 of the third metal structure 1530a. The first width W1 of the first metal structure 1510a can be smaller than the third width W3 of the second metal structure 1520a and the third metal structure 1523a.

[0103] On the other hand, the vehicle antenna module of this specification can optimize the heat dissipation structure using thermoelectric elements. In this regard, the second PCB 1200b, implemented on the NAD substrate, consumes more power than PCB 1200. Therefore, the second PCB 1200b can be combined with the second heat sink 1500b using a thermoelectric element TEC. The vehicle antenna module 1000 may also include a thermoelectric element TEC.

[0104] A thermoelectric element TEC can be disposed between a second electronic component 1220 and a second heat sink 1500b disposed on a second surface S2b of the second PCB 1200b. The thermoelectric element TEC can be configured to absorb second heat generated by the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b. The first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be bonded to the lower end of the first heat sink 1500a using the thermoelectric material of the first thermoelectric layer 1511.

[0105] The second electronic component disposed on the second side S2b of the second PCB 1200b can improve its heat dissipation performance through the thermoelectric element TEC and the thermoelectric material of the second thermoelectric layer 1512. The first side S1c of the thermoelectric element TEC can contact the second electronic component 1220 using the thermoelectric material of the second thermoelectric layer 1512. The second side S2c of the thermoelectric element TEC can contact the second heat sink 1500b.

[0106] Similar to the first heat sink 1500a, the second heat sink 1500b may also be formed from a plurality of metal structures. The second heat sink 1500b may be configured to overlap with the first heat sink 1500a in the Z-axis direction in the horizontal region 1311 of the first cover 1310.

[0107] The second heat sink 1500b may include a fourth metal structure 1510b and a fifth metal structure 1520b. The fourth metal structure 1510b may contact the thermoelectric element TEC and is formed with a second width W2 and a fourth height h4. The fifth metal structure 1520b may be connected to the fourth metal structure 1510b. The fifth metal structure 1520b may be formed with a second width W2 and a fifth height h5. The fourth metal structure 1510b may include a plurality of second metal members spaced parallel to each other in the horizontal axis direction and arranged in the Z-axis direction. The fourth height h4 of the fourth metal structure 1510b may be greater than the fifth height h5 of the fifth metal structure 1520b.

[0108] On the other hand, the electronic components arranged on the first surface S1b and the second surface S2b of the second PCB1200b, which corresponds to the NAD substrate, will be described below. Regarding this, Figure 12 This refers to the electronic components on the first and second sides of the second PCB of the antenna module configured in this specification. Figure 13 Indicates configuration in Figure 12 The electronic components on the first and second sides of the second PCB and their power consumption under specific temperature conditions.

[0109] Reference Figures 6 to 13 The first electronic component 1210 configured on the first surface S1b of the second PCB 1200b may include at least one of a modem S1, an RF transceiver S4, a power management chip S3, and a first power amplifier S8, S10, and S11. The first electronic component 1210 may also include a memory S2 and DRX ICs 13, S14, and S15. The modem S1 and power management chip S3, configured in the lower region of the first surface S1b of the second PCB 1200b, can operate at a temperature of approximately 120 degrees Celsius. The RF transceiver S4, configured in the center of the first surface S1b of the second PCB 1200b, can also operate at a temperature of approximately 120 degrees Celsius. The modem S1 and power management chip S3 consume power values ​​of 0.8W and 0.6W or more, respectively, therefore heat generated in the modem S1 and power management chip S3 needs to be dissipated. The first power amplifiers S8, S10, and S11 on the first surface S1b of the second PCB 1200b can operate at a temperature of approximately 160 degrees Celsius.

[0110] The second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b may include DC / DC converters S5 and S6 and second power amplifiers S7, S9, and S12. The second PCB 1200b may be disposed within a specified area. For example, the second PCB 1200b may be disposed within a limited area of ​​38mm × 43mm.

[0111] The first power amplifier S8 can be configured to operate in the low-frequency band (LB) of the first frequency band for 4G / 5G wireless communication. The first power amplifier S10 can be configured to operate in the n77 / n79 frequency band of 5G wireless communication. The first power amplifier S11 can be configured to operate in the n79 / n79 frequency band of 5G wireless communication. The low-frequency band (LB) of the first frequency band can be set to 617 to 960 MHz, but is not limited thereto and can vary depending on the application. The n77 frequency band of 5G wireless communication can be set to 3300-4200 MHz, but is not limited thereto and can vary depending on the application. The n79 frequency band of 5G wireless communication can be set to 4400-5000 MHz, but is not limited thereto and can vary depending on the application.

[0112] The second power amplifier S7 can be configured to operate in the GSM band. The second power amplifier S9 can be configured to operate in the intermediate frequency (MB) and high frequency (HB) bands of 5G wireless communication. The intermediate frequency (MB) band, as the second band, can be set to 1520 to 4500 MHz, but is not limited to this and can be varied depending on the application. The high frequency (HB) band, as the third band, can be set to 4500 to 6000 MHz, but is not limited to this and can be varied depending on the application. The second power amplifier S12 can be configured to operate in the n41 band of 5G wireless communication. The n41 band of 5G wireless communication can be set to 2496-2690 MHz, but is not limited to this and can be varied depending on the application.

[0113] DC / DC converters S5 and S6 can operate at approximately 125 degrees Celsius. Second power amplifier S7 can operate at approximately 135 degrees Celsius. Second power amplifiers S9 and S12 can operate at approximately 160 degrees Celsius. Second power amplifier S9, operating in the mid-frequency (MB) and high-frequency (HB) bands of 5G wireless communication, consumes approximately 1.1-1.3W of power; therefore, it is necessary to dissipate the heat generated by second power amplifier S9.

[0114] Therefore, the heat generated by the first power amplifiers S8, S10, and S11 on the first side S1b of the second PCB 1200b can be dissipated by the first heat sink 1500a. The heat generated by the second power amplifiers S7, S9, and S12 on the second side S2b of the second PCB 1200b can be dissipated by the second heat sink 1500b.

[0115] On the other hand, in the antenna module of this specification, antenna elements disposed in different regions of the PCB corresponding to one side and the other side of the first heat sink can radiate signals and dissipate heat in different ways. In this regard, the first antenna element ANT1 can be disposed in the first region 1200R1 of the PCB 1200 corresponding to the first region 1310a of the first cover 1310. The second antenna element ANT2 can be disposed in the second region 1200R2 of the PCB 1200 corresponding to the second region 1310b of the first cover 1310.

[0116] Regarding this, when the first antenna element and the second antenna element ANT2 operate simultaneously in different frequency bands, more heat may be generated. Therefore, the heat dissipation mechanism when the first antenna element and the second antenna element ANT2 operate simultaneously in different frequency bands is as follows.

[0117] The first antenna element ANT1 can be combined with the first power amplifier S8 disposed on the first side S1b of the second PCB 1200b to receive and / or transmit signals in the low-frequency band. The second antenna element ANT2 can be combined with the second power amplifier S9 disposed on the second side S2b of the second PCB 1200b to receive and / or transmit signals simultaneously in the mid-frequency and high-frequency bands. In this regard, the heat generated by the first power amplifier S8 can be dissipated through the first heat sink 1500a, while the heat generated by the second power amplifier S9 can be dissipated through the second heat sink 1500b.

[0118] The antenna module can be designed to dissipate heat transferred from the first electronic component 1210 to the first antenna element ANT1 and from the second electronic component 1220 to the second antenna element ANT2. For this purpose, the second width W2 of the second heat sink 1500b can be greater than the distance G1 from the end of the first antenna element ANT1 to the end of the second antenna element ANT2. In this regard, a first heat transfer path HP1 can be formed from the second PCB 1200b through PCB 1200 to the end of the first antenna element ANT1. Additionally, a second heat transfer path HP2 can be formed from the second PCB 1200b through PCB 1200 to the end of the second antenna element ANT2. The distance G1 from the end of the antenna element ANT1 to the end of the second antenna element ANT2 can be formed to include both the first heat transfer path HP1 and the second heat transfer path HP2. Therefore, the second width W2 of the second heat sink 1500b is greater than the length of the first heat transfer path HP1 and the second heat transfer path HP2, thereby effectively dissipating the heat generated by the first power amplifier S8 and the second power amplifier S9.

[0119] On the other hand, the PCB1200 and the second PCB1200b of the vehicle antenna module in this specification can be implemented as a multilayer PCB with multiple layers stacked along the Z-axis direction. In this regard, the first, second, third, and fourth layers of the second PCB1200 can be respectively configured with a communication block for 5G communication, a first ground layer, an RF signal path, and a second ground layer. The first layer can be configured as a communication block, housing an NAD module and a power management chip (PMIC). The communication block, including the NAD module and the power management chip (PMIC), can be configured inside a shielding enclosure.

[0120] A first ground plane and a second ground plane are configured in the upper and lower regions of the RF signal path, which serve as the third layer, in the second and fourth layers, respectively, so that the RF signal path can be formed in a stripline structure. A first ground plane can be configured in the second layer to isolate signals radiated from the oscillating element. SMPS power lines can be designed and configured in the third layer. The RF signal path for the transceiver block can be configured in the third layer.

[0121] Layers 5, 6, 7, and 8 of the second PCB1200 can be configured with RF signal paths, a third ground plane, a GNSS (Global Navigation Satellite System) antenna signal path, and a fourth ground plane. Layer 5 can be configured with power lines, data lines for transmitting memory data, and RF signal paths for the transceiver block. Layer 6 can be configured with power lines for signals output from the inverter and a third ground plane. Layer 7 can be configured with LDO power lines, SDR differential signal lines, and signal lines connected to the GNSS antenna. Layer 8 can be configured with a fourth ground plane.

[0122] Layers 9, 10, 11, and 12 of the second PCB 1200 can be configured with power amplifiers, a fifth ground plane, signal paths for the first and second antennas, and low-noise amplifier modules. Layer 9 can be configured with power amplifier modules and power lines for the inverter, as well as high-speed data lines such as PCI-E and / or USB (Universal Serial Bus). Layer 10 can be configured with power lines for the first variable power amplifier and a fifth ground plane serving as a ground plane for baseband signals. Layer 11 can be configured with signal lines connected to the first and second antennas (serving as main antennas) and power lines for the second variable power amplifier. The first variable power amplifier can be configured to operate in the low-frequency range, and the second variable power amplifier can be configured to operate in the high-frequency range. Layer 12 can be configured with ball grid structures for soldering and low-noise amplifier modules.

[0123] On the other hand, the vehicle antenna module with multiple heat sinks as described in this specification can implement a heat dissipation structure using different mechanisms for each of the multiple heat sources. Regarding this, Figure 14 This is a conceptual diagram illustrating the heat dissipation mechanism for electronic components on a PCB with multiple heat sources and a second PCB.

[0124] Reference Figures 6 to 14 A PCB 1200 is disposed within the internal space formed by a first cover 1310 and a second cover 1320. A second PCB 1200b is disposed within a hole area of ​​the PCB 1200. In a first region, heat dissipated by the NAD module disposed on the second PCB 1200b can be disposed in the external space of the first cover 1310 and the second cover 1320 through the first heat sink 1500a and the second heat sink 1500b. The NAD module can be disposed inside an additional shield to prevent interference with external interference signals. A thermoelectric element (TEC) can be disposed between the second heat sink 1500b and the NAD module.

[0125] The first heatsink 1500a can be configured in the first region. For example, the first heatsink 1500a can be configured at 7.3cm. 3 The first area. The second heatsink 1500b can be configured to cover the first to third areas. For example, the second heatsink 1500b can be configured to cover 146cm. 3 The area from the first region to the third region.

[0126] In the second region, heat dissipated from the AP module disposed on the PCB 1200 can be disposed in the lower region of the second cover 1320 via the second heat sink 1500b. The AP module can be disposed within a recessed space of the second cover 1320. Heat dissipated from the AP module can be discharged between the recessed space of the second cover 1320 and the second heat sink 1500b. Additionally, heat dissipated from the AP module can be discharged downwards via the second heat sink 1500b.

[0127] In the third region, heat dissipated from the communication module disposed on PCB 1200 can be discharged to the lower region of the second cover 1320 via the second heat sink 1500b. The communication module can be disposed within the recessed space of the second cover 1320. For example, the communication module can be an internet communication module, but is not limited thereto, and can vary depending on the application. Heat dissipated from the communication module can be discharged between the recessed space of the second cover 1320 and the second heat sink 1500b. Additionally, heat dissipated from the communication module can be discharged to the lower space via the second heat sink 1500b.

[0128] The above describes one aspect of the vehicle antenna module in this manual. The following describes another aspect of this manual: a vehicle equipped with an antenna module. Regarding this, Figure 15 This diagram illustrates the configuration of a vehicle including the antenna module described in this specification. In this regard, the foregoing description of the antenna module applies to the following vehicles.

[0129] Reference Figures 1 to 15 The antenna module 1000 can perform short-range communication, wireless communication, and V2X communication independently or through the communication device 400. For this purpose, the processor 1400 can control the antenna module 1000 to transmit and receive signals with nearby vehicles, RSUs, and base stations.

[0130] The processor 1400 controls the transmission and reception of signals with nearby vehicles, RSUs, nearby objects, and base stations via the communication device 400. Here, information about nearby objects can be acquired through object detection devices such as the vehicle 1's camera 531, radar 532, lidar 533, and sensors 534 and 535. Alternatively, the processor 1400 can control the transmission and reception of signals with nearby vehicles, RSUs, nearby objects, and base stations via the communication device 400 and the antenna module 1000.

[0131] Vehicle 1 may include antenna module 1000 and telematics module 300. The telematics module 300 may be configured on the second side of PCB 1200, but is not limited thereto, and may vary depending on the application. The telematics module 300 may include an RFIC (radio frequency integrated circuit) and a processor 1400 as transceiver circuitry. Antenna module 1000 may be configured on the underside of the roof of vehicle 1. The telematics module 300 may be operatively integrated with antenna module 1000. The telematics module 300 may be configured to communicate with at least one of adjacent vehicles, RSU (Road Side Unit), and base station.

[0132] Antenna module 1000 may include PCB 1200, second PCB 1200b, first heat sink 1500a, and second heat sink 1500b. Antenna module 1000 may also include a hole region HR formed in PCB 1200.

[0133] At least one antenna element may be configured on the first side of PCB 1200. The first side S1b of a second PCB 1200b may be integrated into the second side of PCB 1200. A first electronic component 1210 may be configured on the first side S1b of the second PCB 1200b, and a second electronic component 1220 may be configured on the second side S2b of the second PCB 1200b. The second PCB 1200b is configured with electronic components for 5G wireless communication and is referred to as an NAD (Network Access Device) substrate.

[0134] The power consumed by the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be a first power value. The power consumed by the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b can be a second power value. The second power value can be set to be greater than the first power value. For example, the first power value can be 1.5W, and the second power value can be 1.8W. Therefore, the first heat sink 1500a and the second heat sink 1500b need to be designed to dissipate the second heat discharged through the second surface S2b of the second PCB 1200b more effectively than the first heat discharged through the first surface S1b.

[0135] The first heat sink 1500a can be configured to contact the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b. The second heat sink 1500b can be configured to contact the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b. The hole region HR can be formed at the center of the PCB 1200b to accommodate the first electronic component 1210.

[0136] The first width W1 at the lower end of the first heat sink 1500a can be smaller than the width Wh of the hole region HR, such that at least a portion of the first heat sink 1500a is inserted into the hole region HR. The portion of the first heat sink 1500a inserted into the hole region HR can contact the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b, which is housed in the hole region HR. Through the insertion of the first heat sink 1500a into the hole region HR, heat generated on the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be dissipated. On the other hand, the second width W2 of the second heat sink 1500b can be larger than the width Wp of the second PCB 1200b, such that heat generated on the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b can be dissipated.

[0137] The first width W1 at the lower end of the first heat sink 1500a is smaller than the hole area HR of the PCB 1200, and the second width W2 of the second heat sink 1500b is larger than the width Wp of the second PCB 1200b. Therefore, the first heat generated by the first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be centrally dissipated through the hole area HR of the PCB 1200, which serves as the motherboard. Additionally, the second heat generated by the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b can be dissipated through the second heat sink 1500b.

[0138] The antenna module 1000 may further include a first cover 1310 coupled to a first heat sink 1500a and a second cover 1320 coupled to a second heat sink 1500b. The first cover 1310 may be referred to as the upper cover, and the second cover 1320 as the lower cover. The first cover 1310 may be coupled to the side portion of the upper region of the first heat sink 1500a. The third width W3 of the opening region of the first cover 1310 into which the first heat sink 1500a is inserted may be greater than the first width W1 of the lower end of the first heat sink 1500a.

[0139] The first heat sink 1500a may be formed in the form of a plurality of metal structures. The first heat sink 1500a may include a first metal structure 1510a, a second metal structure 1520a and a third metal structure 1530a.

[0140] The first metal structure 1510a can be formed with a first width W1 and a first height h1, such that at least a portion is inserted into the hole region HR of the PCB 1200. The second metal structure 1520a can be connected to the first metal structure 1510a. The second metal structure 1520a can be formed along the Z-axis direction in the upper region of the first metal structure 1510a with a second height h2. The third metal structure 1530a can be connected to the second metal structure 1520a. The third metal structure 1530a can be formed along the Z-axis direction in the upper region of the second metal structure 1520a with a third height h3. The side portion of the third metal structure 1530a can be combined with the first cover 1310.

[0141] The third metal structure 1530a may include a plurality of metal members spaced parallel to each other in the horizontal direction and arranged in the Z-axis direction. The third height h3 of the third metal structure 1530a may be greater than the second height h2 of the second metal structure 1520a. Therefore, the first heat generated in the first electronic component 1210 can be discharged to the outside of the first cover 1310 through the plurality of metal members of the third metal structure 1530a. By including the third metal structure 1530a with a third height h3 greater than the second height h2, the first heat transfer path can be increased. Therefore, the first heat generated in the first electronic component 1210 can be effectively discharged to the outside of the first cover 1310.

[0142] The second height h2 of the third metal structure 1520a can be greater than the first height h1 of the first metal structure 1510a. Therefore, the overall height of the first heat sink 1500a can be minimized by inserting the first metal structure 1510a of the first heat sink 1500a into the hole area HR of the PCB 1200.

[0143] On the other hand, the width W3 of the second metal structure 1520a of the first heat sink 1500a can be the same as the third width W3 of the third metal structure 1530a. The first width W1 of the first metal structure 1510a can be smaller than the third width W3 of the second metal structure 1520a and the third metal structure 1523a.

[0144] On the other hand, the vehicle described in this specification can optimize its heat dissipation structure using thermoelectric elements. In this regard, the second PCB 1200b, implemented on the NAD substrate, consumes more power than PCB 1200. Therefore, the second PCB 1200b can be combined with the second heat sink 1500b using a thermoelectric element (TEC). The vehicle antenna module 1000 may also include a thermoelectric element (TEC).

[0145] A thermoelectric element TEC can be disposed between a second electronic component 1220 and a second heat sink 1500b disposed on a second surface S2b of the second PCB 1200b. The thermoelectric element TEC can be configured to absorb second heat generated by the second electronic component 1220 disposed on the second surface S2b of the second PCB 1200b. The first electronic component 1210 disposed on the first surface S1b of the second PCB 1200b can be bonded to the lower end of the first heat sink 1500a using the thermoelectric material of the first thermoelectric layer 1511.

[0146] The second electronic component disposed on the second side S2b of the second PCB 1200b can improve its heat dissipation performance through the thermoelectric element TEC and the thermoelectric material of the second thermoelectric layer 1512. The first side S1c of the thermoelectric element TEC can contact the second electronic component 1220 using the thermoelectric material of the second thermoelectric layer 1512. The second side S2c of the thermoelectric element TEC can contact the second heat sink 1500b.

[0147] Similar to the first heat sink 1500a, the second heat sink 1500b may also be formed from a plurality of metal structures. The second heat sink 1500b may be configured to overlap with the first heat sink 1500a in the Z-axis direction in the horizontal region 1311 of the first cover 1310.

[0148] The second heat sink 1500b may include a fourth metal structure 1510b and a fifth metal structure 1520b. The fourth metal structure 1510b may contact the thermoelectric element TEC and is formed with a second width W2 and a fourth height h4. The fifth metal structure 1520b may be connected to the fourth metal structure 1510b. The fifth metal structure 1520b may be formed with a second width W2 and a fifth height h5. The fourth metal structure 1510b may include a plurality of second metal members spaced parallel to each other in the horizontal axis direction and arranged in the Z-axis direction. The fourth height h4 of the fourth metal structure 1510b may be greater than the fifth height h5 of the fifth metal structure 1520b.

[0149] The above describes the antenna module mounted on a vehicle and the vehicle including it. The following describes the technical effects of the antenna module mounted on a vehicle and the vehicle including it.

[0150] According to this specification, an antenna module with multiple communication modules and heat dissipation structure can be provided for use in a vehicle.

[0151] According to this specification, an optimal heat dissipation structure can be achieved through the optimal shape and configuration of multiple covers and heat sinks.

[0152] According to this specification, the metal structures of the first and second heat sinks are shaped and optimized for each of the multiple regions, thereby enabling the heat dissipation structure to be optimized for electronic components disposed on multiple surfaces of the PCB.

[0153] According to this specification, the first heat sink is configured to be integrated with the upper cover, thereby minimizing the overall height of the antenna module while improving heat dissipation performance.

[0154] According to this specification, heat generated in the electronic components can be dissipated to the upper and lower regions by a first heat sink that is combined with the upper cover and a second heat sink that is disposed in the lower region of the lower cover.

[0155] According to this specification, an optimized heat dissipation structure can be proposed by taking into account the heat transfer path along the signal path from the power amplifier to the antenna element that can operate in broadband.

[0156] The following detailed embodiments will clarify other applicable scopes of the present invention. However, since those skilled in the art will clearly understand the various changes and modifications within the technical concept and scope of the present invention, it should be understood that the specific embodiments, such as the detailed embodiments and preferred embodiments, are merely examples.

[0157] In connection with the foregoing description, the antenna module mounted on a vehicle and the control actions thereon can be implemented by software, firmware, or a combination thereof. On the other hand, the design of the antenna module mounted on a vehicle and the configuration for controlling the antenna module can be implemented by computer-readable code in a medium containing a program. Computer-readable media include all types of storage devices storing data that can be read by a computer system. Examples of computer-readable media include HDD (Hard Disk Drive), SSD (Solid State Disk), SDD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage devices, etc., and can also be implemented in the form of a carrier wave (e.g., internet-based transmission). Furthermore, the computer may also include a terminal or vehicle control unit, i.e., a processor. Therefore, the detailed description described above should not be construed as limiting in any way, but rather as exemplary. The scope of this specification should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of this specification should fall within the scope of this specification.

Claims

1. An antenna module, mounted on a vehicle, wherein, The antenna module comprises: a printed circuit board on a first surface of which at least one antenna element is arranged; a second printed circuit board whose first surface is combined with a second surface of the printed circuit board, a first electronic component is arranged on the first surface of the second printed circuit board, and a second electronic component is arranged on a second surface of the second printed circuit board; a first heat sink arranged in contact with the first electronic component arranged on the first surface of the second printed circuit board; a second heat sink arranged in contact with the second electronic component arranged on the second surface of the second printed circuit board; and a hole region formed in a central portion of the printed circuit board to accommodate the first electronic component, a first width of a lower end of the first heat sink is smaller than a width of the hole region, so that at least a portion of the first heat sink is inserted into the hole region; at least a portion of the inserted first heat sink discharges heat generated at the first electronic component by being in contact with the first electronic component accommodated in the hole region; a second width of the second heat sink is greater than a width of the second printed circuit board, so that heat generated at the second electronic component is discharged.

2. The antenna module according to claim 1, wherein a first cover combined with a side portion of an upper region of the first heat sink is further included; a third width of an opening region of the first cover into which the first heat sink is inserted is greater than the first width of the lower end of the first heat sink.

3. The antenna module according to claim 2, wherein the first cover includes: a horizontal region parallel with respect to a horizontal plane; and a first inclined region and a second inclined region inclined at a prescribed angle with respect to the horizontal plane; the first heat sink is arranged in the horizontal region of the first cover.

4. The antenna module according to claim 3, wherein the first heat sink includes: a first metal structure formed in a first width and a first height so that at least a portion of the first metal structure is inserted into the hole region of the printed circuit board; a second metal structure connected with the first metal structure and formed in a second height at an upper region of the first metal structure in a Z-axis direction; and a third metal structure connected with the second metal structure and formed in a third height at an upper region of the second metal structure in the Z-axis direction, the side portion being combined with the first cover; the third height of the third metal structure is greater than the second height of the second metal structure; the second height of the second metal structure is greater than the first height of the first metal structure.

5. The antenna module according to claim 4, wherein the third metal structure includes a plurality of metal members parallel with respect to a horizontal axis direction and arranged toward a Z-axis direction; a width of the second metal structure is the same as a third width of the third metal structure; a first width of the first metal structure is smaller than the third width of the second metal structure and the third metal structure.

6. The antenna module according to claim 5, wherein ​ a thermoelectric element disposed between the second electronic component disposed on the second face of the second printed circuit board and the second heat sink and absorbing heat generated from the second electronic component; the first electronic component disposed on the first face of the second printed circuit board is combined with the lower end of the first heat sink using a thermoelectric material; a first face of the thermoelectric element is in contact with the second electronic component using the thermoelectric material, and a second face of the thermoelectric element is in contact with the second heat sink. 7.The antenna module of claim 6, wherein the second heat sink is disposed in the horizontal area of the first cover to overlap the first heat sink in the Z-axis direction; the second heat sink includes: a fourth metal structure in contact with the thermoelectric element and formed in the second width and a fourth height; and a fifth metal structure connected to the fourth metal structure and formed in the second width and a fifth height; the fourth metal structure includes a plurality of second metal members parallel to each other in the horizontal axis direction and disposed toward the Z-axis direction; the fourth height of the fourth metal structure is greater than the fifth height of the fifth metal structure. 8.The antenna module of claim 6, wherein the first electronic component includes at least one of a modem, a radio frequency transceiver, a power management chip, and a first power amplifier; the second electronic component includes a direct current / direct current converter and a second power amplifier; the first power amplifier operates in a low frequency band, and the second power amplifier operates in a medium frequency band and a high frequency band; heat generated from the first power amplifier is discharged through the first heat sink, and heat generated from the second power amplifier is discharged through the second heat sink. 9.The antenna module of claim 8, wherein a second cover is provided with a recessed area formed to insert the second heat sink, and the second cover is combined with a metal structure inside a roof using a first area of one side of the recessed area and a second area of the other side; a first area of the first cover adjacent to one side of the first heat sink and a second area of the first cover adjacent to the other side of the first heat sink are formed of a dielectric material through which an electric wave passes; the second cover is formed of a metal material. 10.The antenna module of claim 9, wherein a first antenna element is disposed in a first area of the printed circuit board corresponding to the first area of the first cover, a second antenna element is disposed in a second area of the printed circuit board corresponding to the second area of the first cover. 11.The antenna module of claim 10, wherein the first antenna element is combined with the first power amplifier and receives a signal in a low frequency band, and the second antenna element is combined with the second power amplifier and simultaneously receives a signal in a medium frequency band or a high frequency band; heat generated from the first power amplifier is discharged through the first heat sink, and heat generated from the second power amplifier is simultaneously discharged through the second heat sink. 12.The antenna module of claim 11, wherein, a second width of the second heat sink is greater than a distance from an end of the first antenna element to an end of the second antenna element, such that heat transferred from the first electronic component to the first antenna element and heat transferred from the second electronic component to the second antenna element are discharged. 13.The antenna module of claim 1, wherein, the printed circuit board and the second printed circuit board are implemented as a multi-layer printed circuit board stacked in a Z-axis direction; a first layer, a second layer, a third layer, and a fourth layer of the second printed circuit board are respectively configured with a communication block for 5G communication, a first ground layer, a radio frequency signal path, and a second ground layer; a fifth layer, a sixth layer, a seventh layer, and an eighth layer of the second printed circuit board are configured with a radio frequency signal path, a third ground layer, a signal path of a global navigation satellite system antenna, and a fourth ground layer; a ninth layer, a tenth layer, an eleventh layer, and a twelfth layer of the second printed circuit board are configured with a power amplifier, a fifth ground layer, a signal path of a first antenna and a second antenna, and a low noise amplifier module.

14. A vehicle equipped with an antenna module, wherein, including: an antenna module configured at a lower portion of a roof of the vehicle; and a telematics module operatively associated with the antenna module and configured to communicate with at least one of a neighboring vehicle, a road side unit, and a base station; the antenna module including: a printed circuit board on which at least one antenna element is disposed on a first surface thereof; a second printed circuit board whose first surface is combined with a second surface of the printed circuit board, a first electronic component is disposed on the first surface of the second printed circuit board, and a second electronic component is disposed on a second surface of the second printed circuit board; a first heat sink configured to be in contact with the first electronic component disposed on the first surface of the second printed circuit board; a second heat sink configured to be in contact with the second electronic component disposed on the second surface of the second printed circuit board; and a hole region formed at a central portion of the printed circuit board to accommodate the first electronic component, a first width of a lower end of the first heat sink is less than a width of the hole region, such that at least a portion of the first heat sink is inserted into the hole region; at least a portion of the inserted first heat sink discharges heat generated at the first electronic component by being in contact with the first electronic component accommodated in the hole region; a second width of the second heat sink is greater than a width of the second printed circuit board, such that heat generated at the second electronic component is discharged.

15. The vehicle of claim 14, wherein, including: a first cover combined with a side portion of an upper region of the first heat sink; and a second cover provided with a recessed region formed to insert the second heat sink, the second cover being combined with a metal structure inside a roof using a first region of one side of the recessed region and a second region of the other side; a first region of the first cover adjacent to one side of the first heat sink and a second region of the first cover adjacent to the other side of the first heat sink are formed of a dielectric material through which electromagnetic waves pass; the second cover is formed of a metal material.

16. The vehicle according to claim 15, wherein the first heat sink includes: a first metal structure formed in a first width and a first height such that at least a portion is inserted into the hole region of the printed circuit board; a second metal structure connected to the first metal structure and formed in a second height in an upper region of the first metal structure in a Z-axis direction; and a third metal structure connected to the second metal structure and formed in a third height in an upper region of the second metal structure in the Z-axis direction, the side surface portion being combined with the first cover; the third metal structure includes a plurality of metal members parallel to each other in a horizontal axis direction and arranged toward a Z-axis direction; the third height of the third metal structure is greater than the second height of the second metal structure; the second height of the second metal structure is greater than the first height of the first metal structure; a width of the second metal structure is the same as a third width of the third metal structure; the first width of the first metal structure is less than the third width of the third metal structure.

17. The vehicle according to claim 16, further comprising: a thermoelectric element arranged between the second electronic component arranged on the second face of the second printed circuit board and a second heat sink and absorbing heat generated in the second electronic component; the first electronic component arranged on the first face of the second printed circuit board is combined with a lower end of the first heat sink using a thermoelectric material; a first face of the thermoelectric element is in contact with the second electronic component using the thermoelectric material, and a second face of the thermoelectric element is in contact with the second heat sink.

18. The vehicle according to claim 17, wherein the second heat sink is arranged in a horizontal region of the first cover so as to overlap the first heat sink in a Z-axis direction; the second heat sink includes: a fourth metal structure formed in the second width and a fourth height in contact with the thermoelectric element; and a fifth metal structure formed in the second width and a fifth height in contact with the fourth metal structure; the fourth metal structure includes a plurality of second metal members parallel to each other in a horizontal axis direction and arranged toward a Z-axis direction; the fourth height of the fourth metal structure is greater than the fifth height of the fifth metal structure.

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