Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Abstract

The invention provides a substrate processing apparatus, a method of manufacturing a semiconductor device, and a recording medium, wherein the replacement time of a processing container can be mastered with high precision. The present invention is provided with: a processing container for processing a substrate; and a control unit configured so as to be able to calculate a difference between a lifelong cumulative film thickness value, which is a cumulative value of the thickness of deposits adhering to the inside of the processing container by processing the substrate, and a cumulative etching amount estimated from a cleaning process for removing the deposits. And calculates the replacement time of the processing container on the basis of the difference value.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, a method for manufacturing a semiconductor device, and a recording medium. Background Art

[0002] As a substrate processing apparatus for processing a substrate, there is known an apparatus that has a processing container and a support member for supporting a substrate in multiple layers and performs a film forming process on the substrate in a state where the support member is inserted into the processing container (for example, see Patent Document 1). In such a substrate processing apparatus, when the film forming process on the substrate is repeatedly performed, a film may accumulate on both the processing container and the support member. In this case, both the processing container and the support member are subjected to cleaning for removing the accumulated film.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: International Publication No. 2015 / 030047 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In recent years, a substrate processing apparatus has been developed in which a plurality of support members are prepared for one processing container, and while a substrate supported by a certain support member is being processed in the processing container, the substrate is transferred to another support member, thereby improving productivity. In this way, when a plurality of support members are used for one processing container, there is a case where a plurality of support members are continuously cleaned. In this case, since the processing container is cleaned together with each support member, there is a concern that the processing container may be excessively eroded. Due to repeated excessive erosion, the replacement period of the processing container is advanced, but in many cases, the replacement period of the processing container depends on the number of cleaning processes, and there is room for improvement.

[0008] The present invention provides a technique capable of accurately grasping the replacement period of a processing container.

[0009] Means for Solving the Problems

[0010] According to one aspect of the present invention, there is provided a technique including:

[0011] a processing container that processes a substrate; and

[0012] a control unit configured to be able to calculate a difference between a lifetime cumulative film thickness value that is a cumulative value of the thickness of deposits attached to the inner side of the processing container through the processing of the substrate and a cumulative erosion amount estimated from a cleaning process for removing the deposits, and to obtain the replacement period of the processing container based on the difference.

[0013] Advantages of the Invention

[0014] According to the present invention, it is possible to accurately grasp the replacement timing of the processing container. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. is a cross-sectional view showing a schematic configuration example of a substrate processing apparatus according to an embodiment of the present invention.

[0016] Figure 2 FIG. is a longitudinal sectional view showing a configuration example of a substrate processing apparatus according to an embodiment of the present invention.

[0017] Figure 3 FIG. is a diagram showing an example of the configuration of a control unit of a substrate processing apparatus according to an embodiment of the present invention.

[0018] Figure 4A FIG. is a diagram for explaining processing container information in a substrate processing apparatus according to an embodiment of the present invention.

[0019] Figure 4B FIG. is a diagram for explaining support member information in a substrate processing apparatus according to an embodiment of the present invention.

[0020] Figure 5 FIG. is an explanatory diagram for explaining the operation of a substrate processing apparatus according to an embodiment of the present invention.

[0021] Figure 6 FIG. is a flowchart showing a substrate processing process of a substrate processing apparatus according to an embodiment of the present invention.

[0022] Figure 7 FIG. is a flowchart of a cleaning timing determination process for a support member of a substrate processing apparatus according to an embodiment of the present invention.

[0023] Figure 8 FIG. is a flowchart of a replacement timing determination process for a processing container of a substrate processing apparatus according to an embodiment of the present invention.

[0024] Figure 9 FIG. is a flowchart of a replacement timing determination process for a support member of a substrate processing apparatus according to an embodiment of the present invention.

[0025] Figure 10 FIG. is an example of a display screen showing the states of a processing container and a support member of a substrate processing apparatus according to an embodiment of the present invention.

[0026] DESCRIPTION OF REFERENCE NUMERALS

[0027] S Substrate

[0028] 100 Substrate processing apparatus

[0029] 212 Reaction tube (an example of a processing container)

[0030] 409 Control unit

[0031] RLT Lifetime cumulative film thickness value

[0032] REA Cumulative erosion amount Detailed implementation mode

[0033] Hereinafter, while referring to the attached Figure 1 the implementation modes of the present invention will be described.

[0034] It should be noted that the drawings used in the following description are all schematic, and the dimensional relationships of the elements on the drawings, the ratios of the elements, etc. are not necessarily the same as in reality. In addition, among multiple drawings, the dimensional relationships of the elements and the ratios of the elements are not necessarily the same either.

[0035] (1) Structure of the substrate processing apparatus

[0036] Use Figure 1 and Figure 2 to illustrate the schematic structure of the substrate processing apparatus according to an embodiment of the present invention. Figure 1 is a cross-sectional view showing a schematic structural example of the substrate processing apparatus of the present technology. Figure 2 is a longitudinal sectional view showing a schematic structural example of the substrate processing apparatus according to an embodiment of the present invention, and is also a sectional view along Figure 1 the arrow 2X-2X in

[0037] Figure 1 and Figure 2 show a substrate processing apparatus 100 to which the technology of the present invention is applied. The substrate processing apparatus 100 is an apparatus for processing a substrate S. The substrate processing apparatus 100 includes a transfer chamber 140, a reactor 200, a transfer chamber 270, and a controller 400.

[0038] <Transfer chamber 140>

[0039] The transfer chamber 140 is a space for transferring the substrate S. The transfer chamber 140 is constituted by a housing 142.

[0040] The transfer chamber 140 is configured to communicate with the transfer chamber 270. Specifically, the transfer chamber 140 communicates through a loading / unloading port 144 provided in the housing 272 constituting the transfer chamber 270. The loading / unloading port 144 serves as a passage for loading the substrate S from the transfer chamber 140 into the transfer chamber 270 and unloading the substrate S from the transfer chamber 270 into the transfer chamber 140. The loading / unloading port 144 is opened and closed by a gate valve 146 mounted on the housing 272.

[0041] The transfer chamber 140 is provided with a transfer robot 150 for transferring (transporting) the substrate S. The transfer robot 150 has an arm 152 having an end effector. The transfer robot 150 is configured to be able to be raised and lowered and rotated while maintaining the airtightness of the transfer chamber 140 by a lifting device (not shown) and a rotating device (not shown).

[0042] The transfer robot 150 receives the substrate S before being processed by the reactor 200 from the device outside the transfer chamber 140, and carries the received substrate S into the transfer chamber 270. In addition, the transfer robot 150 carries out the substrate S after being processed by the reactor 200 from the transfer chamber 270, and delivers the carried-out substrate S to the device outside the transfer chamber 140. In this embodiment, the substrate S before being processed by the reactor 200 is referred to as an unprocessed substrate S.

[0043] <Reactor 200>

[0044] The reactor 200 is a space where the substrate S can be processed. The reactor 200 is a space where a process such as forming a thin film on the surface of the substrate S is performed, for example.

[0045] The reactor 200 includes a processing chamber 210. In addition, the processing chamber 210 is located above the transfer chamber 270. It should be noted that the above mentioned here refers to the above in the vertical direction. In addition, when referring to the below, it refers to the below in the vertical direction. In addition, the vertical direction in this embodiment is the same direction as the up and down direction of the substrate processing device 100. Hereinafter, the above and the below in the vertical direction are simply abbreviated as "above" and "below".

[0046] The processing chamber 210 is a space in which substrate processing including heating of the substrate S can be performed. The processing chamber 210 is mainly composed of a reaction tube 212 as an example of a processing container. In addition, a plurality of boats 240 are transported separately in the processing chamber 210 and substrate processing is performed. In other words, the processing chamber 210 performs substrate processing while replacing a plurality of boats 240.

[0047] A heater 214 as a heating unit is disposed on the outer peripheral side of the reaction tube 212 to heat the boat 240 and the substrate S supported on the boat 240 through the reaction tube 212. The heater 214 is separated from the outer peripheral wall of the reaction tube 212. In the present embodiment, a resistance heating heater is used as the heater 214. In addition, as long as the heater 214 can heat the boat 240 and the substrate S supported on the boat 240, a heater other than the resistance heating heater may also be used.

[0048] The upper end of the reaction tube 212 is sealed. At the lower end of the reaction tube 212, a flange portion 212a extending radially inward of the reaction tube 212 is provided. The center of the flange portion 212a is open, forming a furnace opening 212b. The boat 240 moves between the processing chamber 210 and the transfer chamber 270 through the furnace opening 212b.

[0049] The reaction tube 212 is configured to be able to accommodate the boat 240 that supports the substrate S. In addition, the area in the internal space of the reaction tube 212 that accommodates the boat 240 supporting the substrate S is called the processing area, and the interval constituting the processing area is called the processing chamber 210.

[0050] A plurality of nozzles 220 are provided in the reaction tube 212. These nozzles 220 penetrate the peripheral wall of the reaction tube 212 and extend upward from below. On each nozzle 220, a plurality of air holes (not shown) are provided at intervals along the extending direction. The gas supplied from the air holes of the nozzle 220 is supplied to the substrate S supported by the boat 240 in the processing chamber 210.

[0051] The nozzles 220 are provided, for example, for each gas. In the present embodiment, as an example, two nozzles 220a and 220b are used. Each nozzle 220 is arranged so as not to overlap in the horizontal direction.

[0052] As Figure 2 shown, the first gas is supplied from the first gas supply unit 222 to the nozzle 220a. That is, the first gas supply unit 222 is configured to supply the first gas to the nozzle 220a. The first gas supply unit 222 includes a gas supply pipe 222a, a mass flow controller (MFC) 222c as a flow controller (flow control unit), and a valve 222d as an on-off valve. On the gas supply pipe 222a, a first gas source 222b, an MFC 222c, and a valve 222d are provided in sequence from the upstream direction. The gas supply pipe 222a is configured to communicate with the nozzle 220a. The first gas source 222b may also be included in the first gas supply unit 222.

[0053] The first gas source 222b is a source of the first gas containing the first element (also referred to as "first element-containing gas").

[0054] In addition, as Figure 2As shown, a cleaning gas is supplied from the first cleaning gas supply unit 223 to the nozzle 220a. That is, the first cleaning gas supply unit 223 is configured to supply the cleaning gas to the nozzle 220a. The first cleaning gas supply unit 223 includes a gas supply pipe 223a, an MFC 223c, and a valve 223d. On the gas supply pipe 223a, a first cleaning gas source 223b, an MFC 223c, and a valve 223d are provided in order from the upstream direction. The gas supply pipe 223a is connected to a portion of the gas supply pipe 222a on the downstream side of the ratio valve 222d. The gas supply pipe 223a is configured to communicate with the nozzle 220a via the gas supply pipe 222a. The first cleaning gas source 223b may also be included in the first cleaning gas supply unit 223.

[0055] The first cleaning gas source 223b is a cleaning gas source.

[0056] As Figure 2 shown, a second gas is supplied from the second gas supply unit 224 to the nozzle 220b. That is, the second gas supply unit 224 is configured to supply the second gas to the nozzle 220b. The second gas supply unit 224 includes a gas supply pipe 224a, an MFC 224c, and a valve 224d. On the gas supply pipe 224a, a second gas source 224b, an MFC 224c, and a valve 224d are provided in order from the upstream direction. The gas supply pipe 224a is configured to communicate with the nozzle 220b. The second gas source 224b may also be included in the second gas supply unit.

[0057] The second gas source 224b is a source of a second gas containing a second element (hereinafter, also referred to as "second element-containing gas"). The second element-containing gas is one of the processing gases. In addition, the second element-containing gas may also be considered as a reaction gas or a modification gas.

[0058] In addition, as Figure 2 shown, a cleaning gas is supplied from the second cleaning gas supply unit 225 to the nozzle 220b. That is, the second cleaning gas supply unit 225 is configured to supply the cleaning gas to the nozzle 220b. The second cleaning gas supply unit 225 includes a gas supply pipe 225a, an MFC 225c, and a valve 225d. On the gas supply pipe 225a, a second cleaning gas source 225b, an MFC 225c, and a valve 225d are provided in order from the upstream direction. The gas supply pipe 225a is connected to a portion of the gas supply pipe 224a on the downstream side of the ratio valve 224d. The gas supply pipe 225a is configured to communicate with the nozzle 220b via the gas supply pipe 224a. The second cleaning gas supply unit 225 may also include the second cleaning gas source 225b.

[0059] The second cleaning gas source 225b is a cleaning gas source containing fluorine. In addition, the second cleaning gas source 225b in the present embodiment may also be a cleaning gas having the same properties as the first cleaning gas source 223b.

[0060] In the present embodiment, the number of nozzles 220 is two, but the present invention is not limited to this structure. The number of nozzles 220 can be set to three or more according to the content of substrate processing. For example, dedicated nozzles can be provided for cleaning gas supply, or dedicated nozzles can be provided for inert gas supply.

[0061] As Figure 2 shown, an exhaust section 230 is connected to the reaction tube 212. The exhaust section 230 performs vacuum exhaust so that the pressure in the reaction tube 212 becomes a specified pressure (degree of vacuum). The exhaust section 230 has an exhaust pipe 230a, a valve 230b, and an APC (Auto Pressure Controller) valve 230c serving as a pressure regulator (pressure regulating section). A vacuum pump (not shown) connected to the downstream of the exhaust pipe 230a may also be included in the exhaust section 230. The exhaust pipe 230a communicates with the inside of the reaction tube 212. A vacuum pump is connected to the exhaust pipe 230a via the valve 230b and the valve 230c. In addition, a pressure detection section 230d having a function of detecting the pressure in the reaction tube 212 may be provided in the exhaust section 230. Furthermore, the pressure in the reaction tube 212 is adjusted by the cooperation of the above-described gas supply section and the exhaust section 230. When adjusting the pressure, for example, the adjustment may be performed so that the pressure value detected by the pressure detection section 230d becomes a specified value.

[0062] <Transfer chamber 270>

[0063] The transfer chamber 270 is, as Figure 2 shown, a space for transferring the boat 240 and the substrate S to the reactor 200. In addition, the transfer chamber 270 is also a space in which the substrate S can be transferred through the loading / unloading port 144 by the transfer robot 150 in the transfer chamber 140. Details will be described later. In the transfer chamber 270, the boat 240 supporting the substrate S is switched and transferred to the reactor 200. In addition, the transfer chamber 270 includes a plurality of boats 240, a revolving section 260, and a cooling section 290.

[0064] The transfer chamber 270 is located below the processing chamber 210 and is configured to communicate with the processing chamber 210. Specifically, the lower end portion of the reaction tube 212 is connected to the upper portion (top wall portion) of the housing 272 constituting the transfer chamber 270. The transfer chamber 270 communicates with the inside of the reaction tube 212 through the furnace opening 212b.

[0065] An inlet / outlet port 144 for loading and unloading the substrate S is provided on the side wall of the housing 272. The inlet / outlet port 144 is opened and closed by a gate valve 146. In the transfer chamber 270, the substrate S is placed (loaded) on the boat 240 via the inlet / outlet port 144 by the transfer robot 150, and the substrate S is taken out from the boat 240 by the transfer robot 150.

[0066] A boat elevator 274 is provided in the transfer chamber 270. The boat elevator 274 is a device capable of raising and lowering the boat 240. The boat elevator 274 has a lid 276 for supporting the boat 240. The boat 240 moves between the transfer chamber 270 and the processing chamber 210 by the raising and lowering of the lid 276. The lid 276 is a component for closing the furnace opening 212b. In addition, an O-ring as a sealing component may be provided on the lower surface of the flange portion 212a of the reaction tube 212 or the upper surface of the lid 276. When the O-ring is provided, when the boat 240 is placed at a specified position in the processing chamber 210, the O-ring is squeezed and deformed between the flange portion 212a and the lid 276. Thus, the inside of the reaction tube 212 is maintained more airtight. Additionally, a heater may be provided on the lid 276. By providing a heater on the lid 276, the temperature of the substrate S disposed below the boat 240 and the temperature of the substrate S disposed above can be maintained equal.

[0067] On the lid 276, a boat support portion 278 for supporting the boat 240 is provided. The boat support portion 278 has a rotation shaft 278a and a rotation mechanism 278b. The rotation shaft 278a extends in the vertical direction. The bottom plate portion 244 of the boat 240 is connected to the upper end portion of the rotation shaft 278a. If the rotation shaft 278a rotates in a state where the bottom plate portion 244 of the boat 240 is connected to the upper end portion of the rotation shaft 278a, the boat 240 rotates relative to the lid 276. For example, the boat 240 accommodated in the processing chamber 210 rotates by the rotation of the rotation shaft 278a. Additionally, the rotation mechanism 278b is fixed to the lid 276. The rotation mechanism 278b rotatably supports the rotation shaft 278a.

[0068] The boat elevator 274 moves the lid 276 downward, and picks up the boat 240 from the boat support portion 262 on the revolution portion 260 at the upper end portion of the rotation shaft 278a. After picking up the boat 240, the boat elevator 274 raises the lid 276. Then, the boat 240 is accommodated in the processing chamber 210. Additionally, after the substrate processing of the substrate S in the processing chamber 210 is completed, the boat elevator 274 lowers the lid 276 to take out the boat 240 from the processing chamber 210. Then, the boat 240 is delivered from the rotation shaft 278a on the lid 276 to the boat support portion 262 on the revolution portion 260.

[0069] The exhaust section 280 is connected to the transfer chamber 270. The exhaust section 280 is a device that performs vacuum exhaust so that the pressure in the transfer chamber 270 becomes a specified pressure (vacuum degree). The exhaust section 280 is composed of an exhaust pipe 280a, a valve 280b, and an APC valve 280c. In addition, a vacuum pump (not shown) may be included in the exhaust section 280. The exhaust pipe 280a communicates with the transfer chamber 270. A vacuum pump is connected to the exhaust pipe 280a via the valve 280b and the valve 280c. Additionally, a pressure detection section 280d having a function of detecting the pressure in the transfer chamber 270 may be provided in the exhaust section 280.

[0070] The boat 240 is a support member that can support the substrate S. The boat 240 is configured to be able to support at least one substrate S. When configured to support a plurality of substrates S, the substrates S are supported with a space in the vertical direction. The boat 240 includes a top plate portion 242, a bottom plate portion 244, and a support portion 246. The support portion 246 is located between the top plate portion 242 and the bottom plate portion 244. In addition, the support portion 246 includes a plurality of placement portions (not shown) that can support a plurality of substrates S with a space in the vertical direction. In other words, the support portion 246 can support a plurality of substrates S in multiple layers in the vertical direction using the plurality of placement portions. In addition, in this embodiment, as an example, three boats 240 are used, the boat A is defined as the boat 240a, the boat B is defined as the boat 240b, and the boat C is defined as the boat 240c. In this embodiment, when the boat 240 is described, it may also indicate any one or all of the boat 240a, the boat 240b, and the boat 240c.

[0071] As Figure 1 shown, the revolution section 260 is a device that can revolve the boat 240. The revolution section 260 includes a boat support portion 262, a revolving table 264, a revolving shaft 266, and a revolution mechanism 268.

[0072] The boat support portion 262 is a portion that supports the boat 240. A plurality of boat support portions 262 are provided on the revolving table 264. Specifically, a plurality of them are provided at intervals in the rotational direction of the revolving table 264. As an example in the present embodiment, three boat support portions 262 are provided on the revolving table 264. The boat support portion 262 has a boat support portion 262a corresponding to the boat 240a, a boat support portion 262b corresponding to the boat 240b, and a boat support portion 262c corresponding to the boat 240c. In addition, when referring to the boat support portion 262 in the present embodiment, it may also refer to one or all of the boat support portion 262a, the boat support portion 262b, and the boat support portion 262c. In addition, the boat support portion 262 has a rotation shaft 263 and a rotation mechanism 265. The rotation shaft 263 extends in the vertical direction from the revolving table 264. The upper end portion of the rotation shaft 263 is detachably connected to the bottom plate portion 244 of the boat 240. When the rotation shaft 263 rotates in a state where the bottom plate portion 244 is connected to the upper end portion of the rotation shaft 263, the boat 240 rotates relative to the revolving table 264. For example, when transferring the substrate S using the transfer robot 150, the orientation of the boat 240 can be adjusted by the rotation of the boat 240. The rotation mechanism 265 is fixed to the revolving table 264 and rotatably supports the rotation shaft 263.

[0073] A plurality of boat support portions 262 are respectively provided on the upper surface of the revolving table 264. A revolving shaft 266 is connected to the central portion of the revolving table 264. By the rotation of the revolving shaft 266, the revolving table 264 rotates. By the rotation of the revolving table 264, the boat support portion 262 revolves around the revolving shaft 266.

[0074] The revolving shaft 266 is connected to the revolving table 264. The revolving shaft 266 extends in the vertical direction and penetrates the bottom wall of the transfer chamber 270. The revolving shaft 266 uses the rotational force from the revolving mechanism 268 to rotate the revolving table 264 and make the boat support portion 262 revolve. The revolving mechanism 268 is controlled by the controller 400.

[0075] The revolving mechanism 268 is provided on the lower surface of the bottom wall of the transfer chamber 270 and rotatably supports the revolving shaft 266. For example, by revolving and moving the revolving table 264, the boat 240 is moved from a position adjacent to the loading / unloading port 144 to below the processing chamber 210. Specifically, when moving to the next section, the revolving table 264 is rotated so that the boat revolves about 120 degrees according to the situation.

[0076] A plurality of cooling portions 290 are provided on the revolving table 264 corresponding to the plurality of boats 240. For example, a cooling portion 290a is provided for the boat 240a to be described later, a cooling portion 290b is provided for the boat 240b to be described later, and a cooling portion 290c is provided for the boat 240c to be described later.

[0077] In addition, as Figure 1 shown, the transfer chamber 270 has a first section A1, a second section A2, and a third section A3 within the range above the revolving section 260.

[0078] The first section A1 is a section where the boat 240 can be moved between the revolving section 260 and the boat elevator 274. Specifically, in the first section A1, the boat 240 is moved between the boat support section 262 of the revolving section 260 and the boat support section 278 of the boat elevator 274. This first section A1 is arranged below the processing chamber 210.

[0079] The second section A2 is a section where the boat 240 and the substrate S after heat treatment can standby. In addition, the second section A2 is also a section where the boat 240 and the substrate S after heat treatment can be cooled. Specifically, in the second section A2, an inert gas is supplied from the cooling section 290 toward the boat 240 and the substrate S after heat treatment. Thus, the substrate S after heat treatment is cooled. When the revolving section 260 rotates clockwise (right turn), the second section A2 is arranged downstream in the rotation direction of the first section A1.

[0080] The third section A3 is adjacent to the transfer chamber 140 and is a section where the substrate S can be transferred between the transfer chamber 140. Specifically, the transfer robot 150 delivers the untreated substrate S to the boat 240 located in the third section A3 and picks up the processed substrate S from the boat 240 located in the third section A3. In this way, the substrate S is transferred between the third section A3 and the transfer chamber 140. In the third section A3, the boat 240 is arranged at a position opposite to the loading / unloading port 144 and is configured to enable the transfer robot 150 to transfer the substrate S.

[0081] In the present embodiment, as Figure 1 shown, for convenience, the first section A1, the second section A2, and the third section A3 are respectively set as angularly equal (120 degrees) sections centered on the rotation axis of the revolving section 260. That is, the sizes of the first section A1, the second section A2, and the third section A3 are respectively set to the same size. The present invention is not limited to this structure. The sizes of each section can also be set as appropriate. In addition, other sections different from the first section A1, the second section A2, and the third section A3 can also be newly set.

[0082] <Controller>

[0083] Next, the controller 400 will be described using Figure 3 .

[0084] The controller 400 controls the operations of various parts of the substrate processing apparatus 100.

[0085] The controller 400 is configured as a computer having a control unit 409 with a CPU (Central Processing Unit) 401 and a RAM (Random Access Memory) 402, a storage unit 403 as a storage device, and an I / O port 404. The RAM 402, the storage unit 403, and the I / O port 404 are configured to be able to exchange data with the CPU 401 via an internal bus 405.

[0086] In addition, as shown in Figure 3 the control unit 409 may also have a calculation unit 407 that performs calculations in the substrate processing apparatus 100 and a determination unit 408 that selects each operation in the substrate processing apparatus 100. In addition, the calculation in the substrate processing apparatus 100 may be performed by one of the functions of the CPU 401, and the selection of each operation in the substrate processing apparatus 100 may be performed by one of the functions of the CPU 401. That is, the calculation unit 407 and the determination unit 408 may be configured by the functions of the CPU 401.

[0087] The CPU 401 is configured to read and execute a control program from the storage unit 403, and read a process recipe from the storage unit 403 according to the input of an operation instruction from an operation unit 423 as an input / output device, etc. And the CPU 401 is configured to be able to control, for example, the opening and closing operation of the gate valve 146, the opening and closing control of each pump, the flow rate adjustment operation of the MFC, the opening and closing operation of the valve, etc. in accordance with the content of the read process recipe. In addition, the operation unit 423 is connected to a display unit 424 such as a display that can display the processing state of the substrate S via the internal bus 405. The operation unit 423 may also be directly connected to the display unit 424. When the operation unit 423 is a touch panel having the function of the display unit 424, the display unit 424 may be omitted.

[0088] The storage unit 403 is composed of, for example, a flash memory, an HDD (Hard Disk Drive), etc. In the storage unit 403, a recipe 410 composed of a process recipe etc. that records the order and conditions of substrate processing, a control program 411 that controls the operation of the substrate processing apparatus 100, a processing container information 412 that stores information related to the reaction tube 212, a support member information 413 that stores information related to the boat 240, etc. are stored in a readable manner.

[0089] In the processing container information 412, as shown in Figure 4AAs shown, it may also include the lifetime cumulative film thickness value RLT, which is the cumulative value of the thickness of the film (an example of a deposit) attached to the inner side of the reaction tube 212 through the treatment of the substrate S, and the cumulative erosion amount REA estimated based on the cleaning treatment for removing the attached film. Here, the lifetime cumulative film thickness value RLT is the cumulative film thickness value since the start of using the reaction tube 212, and is a value that is not subtracted midway during the period when the deposit remains in the reaction tube 212. In addition, the attached film thickness value is obtained based on the type of processing gas used in the treatment of the substrate S and the substrate processing time. Additionally, multiple modes of the film thickness value can also be obtained in experiments and stored in the storage unit 403. The cumulative erosion amount REA is the cumulative erosion amount estimated based on the cleaning treatment since the start of using the reaction tube 212, and is a value that is not subtracted midway. In addition, the erosion amount is obtained based on the type of cleaning gas and the cleaning treatment time. Additionally, multiple modes of the erosion amount can also be obtained in experiments and stored in the storage unit 403.

[0090] In addition, the threshold information of the reaction tube 212 may also be included in the processing container information 412. The threshold information may include a threshold RT1 for determining the attention state of the reaction tube 212 and a threshold RT2 for determining the warning state of the reaction tube 212. The attention state of the reaction tube 212 is the state from the initial stage to the middle stage during the replacement period of the reaction tube 212, and refers to the state in which the replacement reaction tube 212 should be prepared. On the other hand, the warning state of the reaction tube 212 is the state from the middle stage to the end stage during the replacement period of the reaction tube 212, and refers to the state in which the reaction tube 212 should be immediately replaced.

[0091] In the support member information 413, as Figure 4B shown, it may also include the cumulative film thickness value BCT, which is the cumulative value of the thickness of the film (an example of a deposit) attached to the boat 240 through the treatment of the substrate S, and the number of cleaning treatments N (hereinafter, appropriately referred to as "cleaning times N") for removing the attached film. The threshold information of the boat 240 may also be included in the support member information 413. In the threshold information, the cleaning information of the boat 240 and the replacement information of the boat 240 may be included. The threshold BT1 for determining the start time of the cleaning treatment of the boat 240 may be included in the cleaning information of the boat 240. The threshold BT2 for determining the attention state related to the replacement of the boat 240 and the threshold BT3 for determining the warning state related to the replacement of the boat 240 may be included in the replacement information of the boat 240. The support member information 413 is stored in the storage unit 403 for each boat 240.

[0092] In the present embodiment, the operation unit 423 is used to set the threshold information included in the processing container information 412 respectively. Similarly, the operation unit 423 is used to set the threshold information included in the support member information 413 respectively. In addition, the present invention is not limited thereto, and each threshold information may also be set in advance.

[0093] In addition, the process recipe is combined in such a way that the controller 400 executes each step in the substrate processing process described later and can obtain a specified result, and functions as a program.

[0094] Hereinafter, the process recipe, the control program, etc. are collectively referred to and also simply referred to as a program. In addition, when the term "program" is used in this specification, there are cases where it only includes the process recipe alone, cases where it only includes the control program alone, or cases where it includes both. In addition, the RAM 402 is configured as a storage area (working area) that temporarily holds programs, data, etc. read out by the CPU 401.

[0095] The I / O port 404 is connected to each structure such as the gate valve 146, each pressure regulator, each pump, and the heater control unit. Moreover, a network transceiver unit 421 connected to the upper-level device 420 via a network is provided.

[0096] In addition, regarding the controller 400, the controller 400 related to the present technology can be configured by installing a program into a computer or the like using an external storage device 422 that stores the above program. In addition, as the external storage device 422, for example, magnetic disks such as hard disks, optical discs such as DVDs, magneto-optical discs such as MOs, and semiconductor memories such as USB memories can be cited. In addition, the means for supplying a program to a computer is not limited to the case of supplying it via the external storage device 422. For example, communication means such as a network and a dedicated line can also be used to supply a program without passing through the external storage device 422. In addition, the storage unit 403 and the external storage device 422 are configured as computer-readable recording media. Hereinafter, they are collectively referred to and also simply referred to as recording media. In addition, when the term "recording medium" is used in this specification, there are cases where it only includes the storage unit 403 alone, cases where it only includes the external storage device 422 alone, or cases where it includes both.

[0097] The control unit 409 of the controller 400 is configured to be able to calculate the difference D between the lifetime cumulative film thickness value RLT, which is the cumulative value of the thickness of the film attached to the inner side of the reaction tube 212 through the processing of the substrate S, and the cumulative erosion amount REA estimated from the cleaning process for removing the attached film, and to obtain the replacement period of the reaction tube 212 based on the difference D. Specifically, the control unit 409 of the present embodiment has a CPU 401, a RAM 402, a calculation unit 407 that calculates the difference D, and a determination unit 408 that determines the replacement period of the reaction tube 212 based on the difference D as described above.

[0098] The determination unit 408 determines the replacement timing of the reaction tube 212 by comparing a preset threshold value with the difference value D. Specifically, the determination unit 408 compares the threshold value RT1 indicating the attention state of the replacement timing in the reaction tube 212 with the difference value D, and when the difference value D is equal to or greater than the threshold value RT1, it is determined that the reaction tube 212 has reached the replacement timing. Further, the control unit 409 notifies the determination result of the determination unit 408. Specifically, when it is determined by the determination unit 408 that the reaction tube 212 is at the replacement timing, the control unit 409 causes the display unit 424 capable of displaying the processing state of the substrate S to display a mark indicating the replacement of the reaction tube 212 (see Figure 10 ).

[0099] In addition, the determination unit 408 compares the threshold value RT2 indicating the warning state of the replacement timing in the reaction tube 212 with the difference value D, and when the difference value D is equal to or greater than the threshold value RT2, it is determined that the time to immediately replace the reaction tube 212 has arrived. Further, the control unit 409 notifies the determination result of the determination unit 408. Specifically, when it is determined by the determination unit 408 that the reaction tube 212 is at the replacement timing, the control unit 409 causes the display unit 424 capable of displaying the processing state of the substrate S to display a mark indicating the replacement of the reaction tube 212 (see Figure 10 ).

[0100] In addition, the control unit 409 controls in such a manner that the mark indicating the replacement of the reaction tube 212 is different before and after the difference value D exceeds the threshold value. Specifically, when the difference value D becomes equal to or greater than the threshold value RT1, the control unit 409 controls the display unit 424 to change the color of the attention mark indicating the replacement timing of the reaction tube 212. In addition, when the difference value D becomes equal to or greater than the threshold value RT2, the control unit 409 controls the display unit 424 to restore the color of the attention mark indicating the replacement timing and change the color of the warning mark indicating the replacement timing of the reaction tube 212 (see Figure 10 ).

[0101] In the present embodiment, as an example, the determination unit 408 determines the caution state or warning state of the replacement timing based on the comparison between the difference D between the lifetime cumulative film thickness value RLT and the cumulative erosion amount REA, and the threshold value RT1 indicating the caution state of the replacement timing or the threshold value RT2 indicating the warning state of the replacement timing. However, the present invention is not limited to this structure. For example, it may be that the storage unit 403 stores the cumulative value of the excessive erosion amount when the reaction tube 212 is excessively eroded by the cleaning process, and the determination unit 408 compares the cumulative value of the excessive erosion amount stored in the storage unit 403 with the threshold value to determine whether there is a caution state or warning state of the replacement timing. Additionally, for example, it may be that the storage unit 403 stores the excessive erosion times instead of the excessive erosion amount, and the determination unit 408 compares the excessive erosion times with the threshold value to determine whether there is a caution state or warning state of the replacement timing.

[0102] In the present embodiment, as an example, the determination result of the determination unit 408 is displayed on the display unit 424. However, the present invention is not limited to this structure. For example, it may be reported by voice or the like while being displayed on the display unit 424. Additionally, it may be notified via a communication line.

[0103] The controller 400 further having the control unit 409 may also be controlled to perform the cleaning process in a state where the boat 240 is loaded into the reaction tube 212. Additionally, the control unit 409 may also be controlled to perform the cleaning process in a state where the boat 240 does not support the substrate S. In this case, the boat 240 and the reaction tube 212 can be cleaned simultaneously. Furthermore, the present invention is not limited to this structure, and the control unit 409 may also be controlled to perform the cleaning process in a state where the boat 240 is unloaded from the reaction tube 212. In this case, only the reaction tube 212 can be cleaned.

[0104] When the reaction tube 212 is replaced, the control unit 409 controls the storage unit 403 to clear (reset) the lifetime cumulative film thickness value RLT and the cumulative erosion amount REA of the reaction tube 212, respectively. Additionally, since no deposits remain in the reaction tube 212 when the reaction tube 212 is excessively eroded by the cleaning process, the control unit 409 may also perform control to clear (reset) the lifetime cumulative film thickness value RLT and the cumulative erosion amount REA, respectively.

[0105] In addition, the additional determination unit 408 may also determine the replacement timing of the boat 240 based on the number of times N that the boat 240 has been cleaned. The determination unit 408 determines the replacement timing of the boat 240 by comparing a preset threshold value with the number of times N. Specifically, the determination unit 408 compares the threshold value BT2 indicating the attention state of the replacement timing in the boat 240 with the number of times N. When the number of times N is equal to or greater than the threshold value RT1, it is determined that the boat 204 has reached the replacement timing. And the control unit 409 notifies the determination result of the determination unit 408. Specifically, when it is determined by the determination unit 408 that the boat 240 is in the replacement timing, the control unit 409 causes the display unit 424 to display a mark indicating the replacement of the boat 240 (see Figure 10 ).

[0106] In addition, the additional determination unit 408 compares the threshold value BT3 indicating the warning state of the replacement timing in the boat 240 with the number of times N. When the number of times N is equal to or greater than the threshold value BT3, it is determined that the time has come to immediately replace the boat 240. And the control unit 409 notifies the determination result of the determination unit 408. Specifically, when it is determined by the determination unit 408 that the boat 240 is in the replacement timing, the control unit 409 causes the display unit 424 capable of displaying the processing state of the substrate S to display a mark indicating the replacement of the boat 240 (see Figure 10 ).

[0107] In addition, when the boat 240 is replaced, the control unit 409 controls the storage unit 403 to clear (reset) the cumulative film thickness value BCT and the cleaning times N of the replaced boat 240.

[0108] (2) Substrate processing process

[0109] Next, use Figure 5 and Figure 6 to illustrate the substrate processing process. As one process of the substrate processing apparatus, the process of processing the substrate S using the substrate processing apparatus 100 having the above structure will be described. In addition, in the following description, the operations of the respective parts constituting the substrate processing apparatus 100 are controlled by the controller 400.

[0110] First, as Figure 5 shown, the transfer robot 150 is used to transfer the substrate S from the transfer chamber 140 to the boat 240a in the third section A3 of the transfer chamber 270. For convenience, the substrate S transferred to the boat 240a is denoted by reference numeral S1 in the drawings.

[0111] Next, by the rotation of the revolution unit 260 (in Figure 5(Rotating clockwise), the boat 240a supporting the substrate S1 revolves and moves from the third section A3 to the first section A1, and the boat 240b not supporting the substrate (appropriately referred to as the "empty boat 240") revolves and moves from the second section A2 to the third section A3. Here, the transfer robot 150 is used to transfer the next substrate S (the second substrate) to the empty boat 240b that has moved to the third section A3 from the transfer chamber 140.

[0112] When the boat 240a supporting the substrate S1 moves to the first section A1, the boat 240a rises while being supported by the boat elevator 274. Then, the boat 240a is received in the processing chamber 210. That is, the boat 240a in the first section A1 is carried into the processing chamber 210.

[0113] The boat 240a received in the processing chamber 210 is subjected to a heat treatment. That is, the first gas and the second gas are supplied to the substrate S1 supported by the boat 240a, and film formation is performed through a substrate process including the heat treatment. The substrate S1 is thus subjected to a substrate process ( Figure 6 the step S200 shown).

[0114] When the heat treatment of the substrate S ends, the pressure between the processing chamber 210 and the transfer chamber 270 is adjusted, and the boat 240a is carried out of the processing chamber 210 by the boat elevator 274. The boat 240a carried out of the processing chamber 210 is delivered to the boat support portion 262a on the first section A1 of the revolving portion 260.

[0115] The boat 240a carried out of the processing chamber 210 revolves and moves from the first section A1 to the second section A2 by the rotation of the revolving portion 260. The boat 240a that has moved to the second section A2 is cooled by the inert gas conveyed from the cooling unit 290a. That is, the substrate S1 supported by the boat 240a is cooled by the inert gas.

[0116] Next, through the substrate process of the substrate S1, the film thickness of the film attached to the used boat 240a increases, so the cumulative film thickness value BCT1a of the boat 240a is updated (step S210).

[0117] In addition, through the substrate process of the substrate S1, the film thickness of the film attached to the inner surface of the reaction tube 212 increases, so the lifetime cumulative film thickness value RLT of the reaction tube 212 is updated (step S220). In addition, the order of step S210 and step S220 can also be swapped.

[0118] Next, a determination process for the cleaning timing of the boat 240 (here, the boat 240a) is performed (step S230). The determination process for the cleaning timing of the boat 240 will be described later.

[0119] In addition, a determination process for the replacement timing of the boat 240 (here, the boat 240a) is performed (step S240). The determination process for the replacement timing of the boat 240 will be described later.

[0120] In addition, a determination process for the replacement timing of the reaction tube 212 is performed (step S250). The determination process for the replacement timing of the reaction tube 212 will be described later. In addition, the order of step S230, step S240, and step S250 can be changed respectively.

[0121] In addition, step S210, step S220, step S230, step S240, and step S250 can also be executed during the substrate processing.

[0122] As described above, the substrate processing step of the substrate S1 is completed. In addition, when the substrate processing of the substrate S1 is completed, the boat 240b supporting the second substrate S is accommodated in the processing chamber 210, and the above steps S200 to S250 are repeated.

[0123] (3) Cleaning timing determination process

[0124] Next, use Figure 7 To explain the cleaning timing determination process. As one of the processes of the substrate processing apparatus, a process for determining the cleaning timing of the boat 240 of the substrate processing apparatus 100 having the above structure will be described. In addition, in the present embodiment, when performing the cleaning process, the boat 240 is accommodated in the reaction tube 212 for cleaning. Therefore, the reaction tube 212 is also cleaned together with the boat 240. In addition, in the following description, the operations of the respective parts constituting the substrate processing apparatus 100 are controlled by the controller 400. In addition, as an example of the boat 240 for performing substrate processing, the following description is made using the boat A (boat 240a). In addition, the same applies to the case where substrate processing is performed using the boat B (boat 240b) and the boat C (boat 240c) that are not present in the following description.

[0125] First, when the substrate processing (step S200) of the substrate S1 ends in the substrate processing step, the cumulative film thickness value BCT1a of the boat 240a used in the substrate processing is updated in step S210. And in step S230, a cleaning timing determination process for the boat 240a used in the substrate processing is performed. Specifically, in Figure 7 The threshold value BT1a for determining the start of cleaning is obtained in the shown step S231.

[0126] Next, in step S232, the cumulative film thickness value BCT1a is compared with the threshold value BT1a. When the cumulative film thickness value BCT1a is greater than or equal to the threshold value BT1a, it is determined that the cleaning time has been reached, and the process proceeds to step S233. On the other hand, when the cumulative film thickness value BCT1a is less than the threshold value BT1a, it is determined that the cleaning start time has not been reached, and the cleaning process is not performed, and the process proceeds to the next process. In addition, the next process mentioned here is the determination process for the replacement time of the boat 240a (step S240).

[0127] In step S233, the cleaning process of the boat 240a is performed. Specifically, the empty boat 240a that does not support the substrate S is carried into the reaction tube 212 and the cleaning process is performed. Here, when it is determined that the boat 240a immediately after the substrate process is the object of the cleaning process, before the next substrate process is performed by the reaction tube 212, all the substrates S are removed from the boat 240a, and after the boat 240a is emptied, it is carried into the processing chamber 210. Then, in a predetermined order, the boat 240a and the reaction tube 212 are cleaned using a cleaning gas. When the cleaning process is completed, the process proceeds to step S234.

[0128] In step S234, the cleaning count N of the boat (hereinafter appropriately referred to as "cleaned boat") 240a that has undergone the cleaning process is updated. In addition, the cumulative film thickness value BCT1a of the cleaned boat 240a is cleared (reset to zero). After step S234 ends, the process proceeds to the next process. In addition, the next process mentioned here is the determination process for the replacement time of the boat 240a (step S240).

[0129] (4) Support member replacement time determination process step

[0130] Next, use Figure 8 to describe the support member replacement time determination process step. As one process of the substrate processing apparatus, a process for determining the replacement time of the boat 240 of the substrate processing apparatus 100 having the above structure is described. In addition, in the following description, the operations of the respective parts constituting the substrate processing apparatus 100 are controlled by the controller 400. In addition, as an example of the boat 240 for substrate processing, the following description uses the boat A (boat 240a). In addition, the same applies to the case where the substrate processing is performed using the boat B (boat 240b) and the boat C (boat 240c) that do not exist in the following description.

[0131] When the cleaning time determination process (step S230) of the boat 240a in the substrate processing step ends, the support member replacement time determination process is executed as step S240. First, in Figure 8 the threshold value BT2a for support member replacement determination is obtained in step S241 as shown.

[0132] Next, in step S242, the number of cleaning times N of the boat 240a is compared with the threshold value BT2a. When the number of cleaning times N is equal to or greater than the threshold value BT2a, it is determined that the time has come to immediately replace the boat 240a, and the process proceeds to step S243. On the other hand, when the number of cleaning times N is less than the threshold value BT2a, the process proceeds to step S245.

[0133] Next, in step S243, a warning is issued to immediately replace the boat 240a. Specifically, a display urging replacement of the boat 240a is performed on the display unit 424.

[0134] Next, in step S244, the substrate processing using the boat 240a as the replacement target is restricted. In addition, this restriction of the substrate processing continues until the boat 240a is replaced. After step S244 ends, the process proceeds to the next process. In addition, the next process described here is the determination process for the replacement time of the reaction tube 212 (step S250).

[0135] Next, in step S245, the number of cleaning times N of the boat 240a is compared with the threshold value BT3a. When the number of cleaning times N is equal to or greater than the threshold value BT3a, it is determined that the time has come to replace the boat 240a, and the process proceeds to step S246. On the other hand, when the number of cleaning times N is less than the threshold value BT3a, it is determined that the boat 240a has not reached the replacement time, and the determination process for the replacement time of the support member is ended.

[0136] Next, in step S246, a caution is given to replace the boat 240a. Specifically, a display urging replacement of the boat 240a is performed on the display unit 424. After step S246 ends, the process proceeds to the next process. In addition, the next process described here is the determination process for the replacement time of the reaction tube 212 (step S250).

[0137] (5) Process for determining the replacement time of the processing container

[0138] Next, use Figure 9 to describe the process for determining the replacement time of the processing container. As one process of the substrate processing apparatus, a process for determining the replacement time of the reaction tube 212 of the substrate processing apparatus 100 having the above-described configuration will be described. In addition, in the following description, the operations of the respective parts constituting the substrate processing apparatus 100 are controlled by the controller 400.

[0139] When the determination process for the replacement time of the boat 240a (step S240) in the substrate processing step ends, the process for determining the replacement time of the processing container is executed as step S250. First, in Figure 9In step S251 shown above, the lifetime cumulative film thickness value RLT of the reaction tube 212 is obtained.

[0140] Next, in step S252, the cumulative etch amount REA is obtained. In addition, steps S251 and S252 can be swapped.

[0141] Next, in step S253, the difference D between the lifetime cumulative film thickness value RLT and the cumulative etch amount REA is calculated. Specifically, the calculation unit 407 calculates the value obtained by subtracting the cumulative etch amount REA from the lifetime cumulative film thickness value RLT.

[0142] Next, in step S254, the threshold value RT1 and the threshold value RT2 for determining the replacement of the processing container are obtained.

[0143] Next, in step S255, the difference D is compared with the threshold value RT1. When the difference D is equal to or greater than the threshold value RT1, it is determined that the time has come to immediately replace the reaction tube 212, and the process proceeds to step S256. On the other hand, when the difference D is less than the threshold value RT1, the process proceeds to step S258.

[0144] Next, in step S256, a warning is issued to immediately replace the reaction tube 212. Specifically, a display urging the replacement of the reaction tube 212 is made on the display unit 424.

[0145] Next, in step S257, the use of the reaction tube 212 is restricted. In addition, this restriction of the reaction tube 212 continues until the reaction tube 212 is replaced. When step S257 ends, the determination process for the replacement time of the reaction tube 212 ends.

[0146] Next, in step S258, the difference D is compared with the threshold value RT2. When the difference D is equal to or greater than the threshold value RT2, it is determined that the time has come to replace the reaction tube 212, and the process proceeds to step S259. On the other hand, when the difference D is less than the threshold value RT2, the determination process for the replacement time of the reaction tube 212 ends.

[0147] Next, in step S259, a reminder is given to replace the reaction tube 212. Specifically, a display urging the replacement of the boat 240a is made on the display unit 424. When step S259 ends, the determination process for the replacement time of the reaction tube 212 ends.

[0148] Next, the effects of the present embodiment will be described.

[0149] In the present embodiment, the control unit 409 is configured to calculate the difference D between the lifetime cumulative film thickness value RLT and the cumulative erosion amount REA, and to determine the replacement timing of the reaction tube 212 as the processing container based on the difference D. Thus, according to the present embodiment, for example, compared with the case of determining the replacement timing of the reaction tube 212 based on the preset number of uses of the reaction tube 212, the replacement timing of the reaction tube 212 can be grasped with high accuracy. By grasping the replacement timing of the reaction tube 212 with such high accuracy, for example, the replacement timing of the reaction tube 212 can be delayed, and the service life of the reaction tube 212 can be extended.

[0150] In the present embodiment, since the control unit 409 includes the calculation unit 407 and the determination unit 408, for example, compared with the case where the calculation unit 407 and the determination unit 408 are provided separately, the structure of the control unit 409 can be simplified.

[0151] In the present embodiment, it may also be that the determination unit 408 compares the preset threshold RT1 or threshold RT2 with the difference D to determine the replacement timing of the reaction tube 212, and the control unit 409 notifies the determination result of the determination unit 408. In the case where the threshold is set in order to determine the replacement timing of the reaction tube 212 using the determination unit 408, the replacement timing of the reaction tube 212 can be grasped with higher accuracy. In addition, since the determination result of the determination unit 408 is notified, it is easy to grasp the replacement timing.

[0152] In the present embodiment, it may also be that as a notice of caution, the threshold RT1 reaching the caution state indicating the replacement timing in the reaction tube 212, that is, the initial stage of the replacement timing of the reaction tube 212, is notified. In this case, the reaction tube 212 for replacement can be prepared in advance.

[0153] In the present embodiment, it may also be that a warning indicating that the threshold RT2 has reached the warning state indicating the replacement timing in the reaction tube 212, that is, the middle stage of the replacement timing of the reaction tube 212, is notified. In this case, the processing container prepared in the caution state can be replaced immediately, which helps to reduce the waiting time for the replacement processing container.

[0154] In the present embodiment, the control unit 409 is controlled to carry the substrate S into the reaction tube 212 in a state where the substrate S is supported by the boat 240 and to process the substrate S. In this case, a plurality of substrates S can be processed simultaneously.

[0155] In this embodiment, it is also possible to use the determination unit 408 to determine the replacement timing of the boat 240 based on the number of times N that the boat 240 has been cleaned, and the control unit 409 notifies the determination result of the determination unit 408. In this case, since the cleaning count N is used to find the replacement timing of the boat 240, the execution of substrate processing using the boat 240 in a state where it can no longer withstand substrate processing is restricted, and the generation of defective substrates due to damage to the boat 240 can be suppressed.

[0156] In this embodiment, it is also possible that when the determination unit 408 determines that the reaction tube 212 is at the replacement timing, the control unit 409 controls to display a mark indicating the replacement of the reaction tube 212 on the display unit 424. In this case, by displaying the main idea that the reaction tube 212 is at the replacement timing on the display unit 424, the operator can recognize that the reaction tube 212 has reached the replacement timing, and the operator can prepare for the replacement of the next reaction tube 212.

[0157] In this embodiment, it is also possible to use the operation unit 423 to set each threshold value. In this case, the threshold value corresponding to each condition can be set using the operation unit 423, and the available period of the reaction tube 212 can be extended.

[0158] In this embodiment, it is also possible to store at least the lifetime cumulative film thickness value RLT and the cumulative erosion amount REA in the storage unit 403. In this case, since the information for grasping the replacement timing of the reaction tube 212 is stored in advance in the storage unit 403, even when the substrate processing apparatus 100 is restarted, various information is stored in advance, and operations can be performed without collecting various information.

[0159] In this embodiment, it is also possible that the control unit 409 controls so that the mark indicating the replacement timing of the reaction tube 212 displayed on the display unit 424 is different before and after the difference D exceeds the threshold value BT1 and the threshold value BT2. In this case, by switching the marks for attention and warning displayed on the display unit 424, the operator can accurately grasp the preparation and replacement timing of the reaction tube 212, and thus can perform efficient preparation and replacement operations for the reaction tube 212.

[0160] In this embodiment, it is also possible that the control unit 409 controls to perform a cleaning process in a state where the boat 240 is loaded into the reaction tube 212. In this case, since the reaction tube 212 and the boat 240 are cleaned simultaneously, the erosion amount management of the film adhering to the reaction tube 212 and the boat 240 becomes easy.

[0161] In this embodiment, it is also possible to control, by the control unit 409, to perform the cleaning process in a state where the susceptor 240 does not support the substrate S. In this case, for example, compared with the case where the cleaning process is performed in a state where the susceptor 240 supports the substrate S, the influence on the processed substrate S can be avoided.

[0162] In this embodiment, it is also possible to control, by the control unit 409, to perform the cleaning process in a state where the susceptor 240 has been removed from the reaction tube 212. In this case, for example, compared with the case where the cleaning process is performed in a state where the susceptor 240 has been inserted into the reaction tube 212, the influence on the susceptor 240 can be avoided, and only the reaction tube 212 is etched.

[0163] In this embodiment, it is also possible that when the reaction tube 212 is replaced, the control unit 409 controls the storage unit 403 to clear (reset) the lifetime cumulative film thickness value RLT and the cumulative etching amount REA of the reaction tube 212 in the storage unit 403, respectively. In this case, by clearing the information of the reaction tube 212 before replacement stored in the storage unit 403, the information of the reaction tube 212 after replacement can be correctly set. In addition, when the reaction tube 212 is over-etched by the cleaning process, the control unit 409 can also control the storage unit 403 to clear (reset) the lifetime cumulative film thickness value RLT and the cumulative etching amount REA, respectively. The over-etching of the reaction tube 212 means that the deposits attached to the reaction tube 212 disappear, which is equivalent to the case where the reaction tube 212 is replaced. Therefore, when the reaction tube 212 is over-etched, by clearing the lifetime cumulative film thickness value RLT and the cumulative etching amount REA, respectively, the information of the reaction tube 212 after over-etching can be correctly set.

[0164] In this embodiment, it is also possible that when the susceptor 240 is replaced, the control unit 409 controls the storage unit 403 to clear the cumulative film thickness value BCT and the cleaning times N of the susceptor 240 in the storage unit 403. In this case, by clearing the information of the susceptor 240 before replacement stored in the storage unit 403, the information of the susceptor 240 after replacement can be correctly set.

[0165] (Other embodiments)

[0166] In the foregoing embodiment, the apparatus is operated with all three susceptors 240 carrying the substrate S, but the present invention is not limited to this structure. The apparatus may also be operated with the substrate S placed on two of the three susceptors 240, or may be operated with the substrate S placed on one susceptor 240.

[0167] In addition, as the substrate processing apparatus 100, an example of using a set of reactors 200 and a transfer chamber 270 has been described, but the present invention is not limited thereto. For example, multiple sets of reactors 200 and transfer chambers 270 may be connected to the transfer chamber 140. Additionally, multiple reactors 200 may be provided above the transfer chamber 270. In this case, substrate processing of the substrate S can be performed in multiple reactors 200 in parallel. Further, the multiple reactors 200 may be spaces for performing different substrate processes respectively. In this case, after substrate processing is performed in the first reactor 200, other substrate processing may be performed in the subsequent reactor 200.

[0168] In addition, the substrate processing apparatus 100 may also flexibly use the susceptor 240 to be used according to the type of film formed on the substrate S. That is, since the susceptor 240 with a high usage rate has a fast development of the attached film, the cleaning process is frequently performed. On the other hand, since the susceptor 240 with a low usage rate has a slow development of the film, the cleaning process may not be performed frequently.

[0169] In the above-described manner, an example of forming a film using a batch-type substrate processing apparatus that processes multiple substrates at once has been described, but the present invention is not limited to the above-described manner. For example, it is also well applicable to the case of forming a film using a single-wafer substrate processing apparatus that processes one or multiple substrates at once. Additionally, in the above-described manner, an example of forming a film using a substrate processing apparatus having a hot-wall type processing furnace has been described, but the present invention is not limited to the above-described manner, and it is also well applicable to the case of forming a film using a substrate processing apparatus having a cold-wall type processing furnace.

[0170] Even when using these substrate processing apparatuses, each process can be performed in the same processing sequence and processing conditions as in the above-described manner and modified examples, and the same effects as in the above-described manner and modified examples can be obtained.

Claims

1. A substrate processing apparatus, characterized in that, Comprising: A processing container for processing a substrate; and A control unit configured to calculate a difference between a lifetime cumulative film thickness value, which is a cumulative value of the thickness of deposits adhering to the inside of the processing container through the processing of the substrate, and a cumulative erosion amount estimated from a cleaning process for removing the deposits, and to determine a replacement period of the processing container based on the difference.

2. The substrate processing apparatus according to claim 1, wherein: The control unit includes: A calculation unit that calculates the difference; and A determination unit that determines the replacement period of the processing container based on the difference.

3. The substrate processing apparatus according to claim 2, wherein: The determination unit determines the replacement period of the processing container by comparing a preset threshold value with the difference, and the control unit notifies the determination result of the determination unit.

4. The substrate processing apparatus according to claim 3, wherein: The threshold value indicates a caution state of the replacement period in the processing container.

5. The substrate processing apparatus according to claim 3, wherein: The threshold value indicates a warning state of the replacement period in the processing container.

6. The substrate processing apparatus according to claim 2, wherein: It further includes a support member for supporting the substrate, and the control unit can be controlled to load the substrate into the processing container in a state where the substrate is supported by the support member and process the substrate.

7. The substrate processing apparatus according to claim 6, wherein: The determination unit determines the replacement period of the support member based on the number of times the cleaning process has been performed on the support member, and the control unit notifies the determination result of the determination unit.

8. The substrate processing apparatus according to claim 3, wherein: It further includes a display unit for displaying the processing state of the substrate, and the control unit can be controlled to display a mark indicating replacement of the processing container on the display unit when it is determined by the determination unit that the processing container is in the replacement period.

9. The substrate processing apparatus according to claim 3, wherein: It further includes an operation unit for setting the threshold value.

10. The substrate processing apparatus according to claim 3, wherein: It further includes a storage unit for storing at least the lifetime cumulative film thickness value and the cumulative erosion amount.

11. The substrate processing apparatus according to claim 8, wherein: The control unit can be controlled to make the mark indicating replacement of the processing container different before and after the difference exceeds the threshold value.

12. The substrate processing apparatus according to claim 6, wherein: The control unit can be controlled to perform the cleaning process in a state where the support member is loaded into the processing container.

13. The substrate processing apparatus according to claim 12, wherein: The control unit can be controlled to perform the cleaning process in a state where the support member does not support the substrate.

14. The substrate processing apparatus according to claim 6, wherein: The control unit can be controlled to perform the cleaning process in a state where the support member has been removed from the processing container.

15. The substrate processing apparatus according to claim 3, wherein: It further includes a storage unit that stores at least the lifetime cumulative film thickness value and the cumulative erosion amount, The control unit can control the storage unit to clear the lifetime cumulative film thickness value and the cumulative erosion amount of the processing container respectively.

16. The substrate processing apparatus according to claim 15, wherein: When the processing container is replaced or the difference obtained by subtracting the cumulative erosion amount from the lifetime cumulative film thickness value is negative, the control unit can control the storage unit to clear the lifetime cumulative film thickness value and the cumulative erosion amount respectively.

17. The substrate processing apparatus according to claim 3, wherein: The determination unit determines the replacement period of the processing container based on the value obtained by accumulating the difference values when the difference obtained by subtracting the cumulative erosion amount from the lifetime cumulative film thickness value is negative.

18. The substrate processing apparatus according to claim 6, wherein: It further includes a storage unit that stores at least the cumulative film thickness value of the deposits on the support member and the number of times of the cleaning process of the support member, When the support member is replaced, the control unit can control the storage unit to clear the cumulative film thickness value of the support member and the number of times of the cleaning process respectively.

19. A method for manufacturing a semiconductor device, characterized in that, It includes the following steps: Loading a substrate into a processing container and processing the substrate; Calculating the difference between the lifetime cumulative film thickness value, which is the cumulative value of the thickness of the deposits attached to the inner side of the processing container through the processing of the substrate, and the cumulative erosion amount estimated based on the cleaning process for removing the deposits, and determining the replacement period of the processing container based on the difference.

20. A recording medium, which is a computer-readable recording medium and records a program, is characterized in that, The program causes a substrate processing apparatus to execute the following steps by using a computer: Loading a substrate into a processing container and processing the substrate; Calculating the difference between the lifetime cumulative film thickness value, which is the cumulative value of the thickness of the deposits attached to the inner side of the processing container through the processing of the substrate, and the cumulative erosion amount estimated based on the cleaning process for removing the deposits, and determining the replacement period of the processing container based on the difference.

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