Flash removing structure for semiconductor chip trimming processing

Abstract

The invention relates to the technical field of chip processing, and particularly discloses a flash removing structure for semiconductor chip trimming processing, the flash removing structure comprises a workbench, a top plate and a lifting device, the workbench is internally provided with a storage groove for storing a chip body, and the top plate is connected with the lifting device; the chip body comprises a lead, a connecting rib and a flash region; an overflow removing unit is arranged on the top plate; a cutting unit is arranged on the workbench and used for cutting off the upper plate in the clamping area. When the cutting unit is started, the feeding air cylinder is moved to the position corresponding to the clamping area through the left-right moving unit, the feeding air cylinder drives the cutting frame and the two cutting knives to move to the area where the upper plate is located, the two cutting knives separate the upper plate from the middle plate and the lower plate, and the upper plate is cut by the cutting unit while the upper plate is cut. The side laser cutting device and the middle laser cutting device are started, and the work of removing the connecting ribs on the chip body can be completed.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and particularly relates to a flash removal structure for semiconductor chip dicing and singulation processing. Background Art

[0002] During the production process of a chip, two steps of dicing and singulation and flash removal are required. Dicing: cutting off the connecting bars on the lead frame; Flash removal: removing the excess residual glue that overflows onto the lead frame during encapsulation. The flash located on the surface of the lead frame at the edge of the plastic package is generally a very thin film-like attachment. Since the adhesion between the molding compound and the lead frame is very strong, a relatively large force is required to peel it off.

[0003] When a chip is encapsulated, to improve efficiency, usually two or more chips are encapsulated together in a group. After encapsulation, the connecting bars to be cut include the parts beside the chip and the parts connecting between two chips. However, when the chip is encapsulated, some connecting bars enclose the leads inside. To protect the leads and cut off the excess connecting bars, therefore, the present application proposes a flash removal structure for semiconductor chip dicing and singulation processing. Summary of the Invention

[0004] The purpose of the present invention is to provide a flash removal structure for semiconductor chip dicing and singulation processing to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution. A flash removal structure for semiconductor chip dicing and singulation processing includes a workbench, a top plate, and a lifting device. An accommodation groove for storing the chip body is arranged inside the workbench, and the top plate is connected to the lifting device;

[0006] The chip body includes leads, connecting bars, and a flash area;

[0007] A flash removal unit is arranged on the top plate;

[0008] A cutting unit is arranged on the workbench. The cutting unit is used to cut off the upper plate in the clamping area. A side laser cutting device and an intermediate laser cutting device are arranged on the top plate. The area where two chip bodies are connected is the intermediate area, and the side of the chip body away from the intermediate area is set as the side area. The side laser cutting device is used to cut off the connecting bars within the laser cutting area at the side area of the chip body, and the intermediate laser cutting device is used to cut off the connecting bars within the laser cutting area in the intermediate area.

[0009] Preferably, a bottom plate is arranged at the bottom of the workbench, and the bottom plate is connected to the workbench through support rods.

[0010] Preferably, four support rods are provided, and the four support rods are respectively inserted into the four corners of the workbench. The support rods are inserted with bases, the bases are arranged on the upper side of the bottom plate, and the bottom plate abuts against the upper end surface of the base.

[0011] Preferably, the overflow material removal unit includes a plurality of cleaning air pipes and a conveying pipeline. The plurality of cleaning air pipes are aligned with a plurality of overflow material areas, and the plurality of cleaning air pipes are connected by the conveying pipeline. A blower is arranged on the conveying pipeline, and an air outlet facing the overflow material area is arranged at the bottom of the cleaning air pipe.

[0012] Preferably, the lifting device includes a lifting housing, a lifting lead screw, and a lifting motor. The lifting lead screw is inserted into the interior of the lifting housing, and the lifting lead screw is connected to the output end of the lifting motor. The lifting motor is installed on the top of the lifting housing.

[0013] Preferably, the lifting lead screw is threadedly connected with a lifting nut. The lifting nut is slidably connected with the lifting housing, and the lifting nut is connected with a bracket, and the bracket is connected with the top plate.

[0014] Preferably, the cutting unit includes a feeding air cylinder, a left cutting knife, and a right cutting knife. The output end of the feeding air cylinder is connected with a cutting frame. The left cutting knife and the right cutting knife are both installed on the cutting frame, and a push plate is installed between the left cutting knife and the right cutting knife.

[0015] Preferably, the cutting unit further includes a left and right moving unit for driving the feeding air cylinder to move left and right.

[0016] Preferably, a pressing unit is arranged on the top plate. The pressing unit includes two side pressing plates and an intermediate pressing plate.

[0017] Preferably, a side adsorption unit is arranged on the side pressing plate, and an intermediate adsorption unit is arranged on the intermediate pressing plate.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] First, when the blower of the present invention is started, it can blow out gas. The gas is sent to each cleaning air pipe through the conveying pipeline and discharged through the air outlet. The gas is aligned with the overflow material area in the chip body, and the excess residual glue on the lead frame can be blown off, keeping the lead frame clean.

[0020] 2. When the cutting unit of the present invention is started, the feed cylinder is moved to the position corresponding to the clamping area through the left and right moving units, and the feed cylinder drives the cutting frame and the two cutting knives to move to the area where the upper plate is located. The two cutting knives separate the upper plate from the middle plate and the lower plate. While the cutting unit cuts the upper plate, the side laser cutting device and the middle laser cutting device are started to cut the connecting ribs at the corresponding positions and cut off the connecting ribs in the side area and the middle area. In this way, the laser cutting area and the clamping area in the connecting ribs are cut off, and the corresponding side adsorption unit, the middle adsorption unit and the lifting device are started to drive the top plate to move up and separate the cut connecting ribs from the chip body. At this time, only the middle plate and the lower plate in the clamping area remain on the chip body. When the chip body is taken out of the storage slot, the remaining and redundant connecting ribs can be removed by prying the lower plate, thereby completing the removal of the connecting ribs on the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is one of the structural schematic diagrams of the deburring structure used for semiconductor chip cutting processing in the present invention.

[0022] Figure 2 This is the second structural schematic diagram of the deburring structure used for semiconductor chip cutting processing in the present invention.

[0023] Figure 3 It is a structural schematic diagram of the overflow removal unit in the present invention.

[0024] Figure 4 It is a schematic diagram of the structure of the cutting unit in the present invention.

[0025] Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure at point A in the middle.

[0026] Figure 6 It is a structural schematic diagram of the workbench and chip body in the present invention.

[0027] In the figure: 1, workbench; 2, bottom plate; 3, support rod; 4, base; 5, chip body; 501, lead; 502, connecting rib; 503, overflow area; 6, top plate; 7, lifting device;

[0028] 8. Overflow removal unit; 801. Clearing air duct; 802. Conveying pipeline; 803. Exhaust port;

[0029] 9. Cutting unit; 901. Feed cylinder; 902. Cutting frame; 903. Left cutting knife; 904. Right cutting knife; 10. Pressing unit; 1001. Side pressure plate; 1002. Side adsorption unit; 1003. Middle pressure plate; 1004. Middle adsorption unit; 11. Side laser cutting device; 12. Middle laser cutting device. Detailed implementation mode

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] Refer to Figures 1-6 , a structure for removing overflow material for semiconductor chip dicing and lead frame processing, including a workbench 1, a top plate 6, and a lifting device 7. A storage groove for storing the chip body 5 is provided inside the workbench 1. When the chip body 5 is packaged, in order to improve efficiency, usually two or more are packaged together in a group. After packaging, the redundant connecting ribs 502 need to be cut, and some of the connecting ribs 502 connect two chip bodies 5.

[0032] Specifically, a bottom plate 2 is provided at the bottom of the workbench 1. The bottom plate 2 and the workbench 1 are connected by support rods 3. Four support rods 3 are provided, and the four support rods 3 are respectively inserted into the four corners of the workbench 1. The support rods 3 are inserted with a base 4. The base 4 is arranged on the upper side of the bottom plate 2, and the bottom plate 2 abuts against the upper end surface of the base 4.

[0033] The height of the workbench 1 is raised through components such as the bottom plate 2, the support rods 3, and the base 4, and adjusted to a height suitable for the staff to load and unload materials.

[0034] It should be noted that the chip body 5 includes leads 501, connecting ribs 502, and an overflow area 503. The overflow area 503 is the area where the leads 501 and the lead frame are located (the area after removing the connecting ribs 502). Redundant residual glue usually adheres to the position of the lead frame in the overflow area 503 everywhere.

[0035] In order to remove the redundant residual glue on the upper side of the overflow area 503, an overflow material removal unit 8 is provided on the top plate 6. The overflow material removal unit 8 is aligned with the overflow area 503. When the overflow material removal unit 8 is started, it can blow out wind towards the overflow area 503, and the redundant residual glue at the overflow area 503 is blown off from the lead frame by the wind.

[0036] Specifically, the overflow material removal unit 8 includes a plurality of cleaning air pipes 801 and a conveying pipe 802. The plurality of cleaning air pipes 801 are aligned with a plurality of overflow areas 503. The plurality of cleaning air pipes 801 are connected by the conveying pipe 802. A blower is provided on the conveying pipe 802, and an air outlet 803 aligned with the overflow area 503 is provided at the bottom of the cleaning air pipe 801.

[0037] The blower starts and can blow out gas. The gas is sent to each cleaning air duct 801 through the conveying pipeline 802 and discharged through the air outlet 803. The gas is directed at the overflow area 503 in the chip body 5, and the excess residual glue on the lead frame can be blown off, keeping the lead frame clean.

[0038] To facilitate the adjustment of the height of the top plate 6, a lifting device 7 is connected to the top plate 6. The lifting device 7 is used to drive the top plate 6 to move up and down. Specifically, the lifting device 7 includes a lifting housing, a lifting lead screw, and a lifting motor. The lifting lead screw is inserted into the interior of the lifting housing. The lifting lead screw is connected to the output end of the lifting motor. The lifting motor is installed on the top of the lifting housing. And the lifting lead screw is threadedly connected with a lifting nut. The lifting nut is slidably connected to the lifting housing. The lifting nut is connected with a bracket, and the bracket is connected to the top plate 6.

[0039] In this way, when the lifting motor in the lifting device 7 starts, it can drive the lifting lead screw to rotate forward and backward, thereby driving the lifting nut, the bracket, and the top plate 6 to move up and down, adjusting the height of the top plate 6. The top plate 6 moves downward and approaches the overflow area 503, so that the wind discharged from the air outlet 803 can directly reach the position of the overflow area 503, avoiding the diversion of the wind.

[0040] To cut the redundant connecting ribs 502 in the chip body 5, the connecting ribs 502 include a clamping area, a laser cutting area, and a pressing area that are clamped between adjacent leads 501. The clamping area includes an upper plate, a lower plate, and an intermediate plate. The upper plate and the lower plate are respectively located on the upper and lower sides of the lead 501. The intermediate plate is inserted into the gap between adjacent leads 501. Therefore, a cutting unit 9 is provided on the workbench 1. The cutting unit 9 is used to cut off the upper plate in the clamping area. A side laser cutting device 11 and an intermediate laser cutting device 12 are provided on the top plate 6. The area where two chip bodies 5 are connected is the intermediate area, and the side of the chip body 5 away from the intermediate area is the side area. The side laser cutting device 11 is used to cut off the connecting ribs 502 in the laser cutting area at the side area of the chip body 5, and the intermediate laser cutting device 12 is used to cut off the connecting ribs 502 in the laser cutting area in the intermediate area.

[0041] Specifically, the cutting unit 9 includes a feeding cylinder 901, a left cutting knife 903, and a right cutting knife 904. The output end of the feeding cylinder 901 is connected with a cutting frame 902. The left cutting knife 903 and the right cutting knife 904 are both installed on the cutting frame 902. And a push plate is installed between the left cutting knife 903 and the right cutting knife 904. The push plate is used to push the cut upper plate to move, so that the upper plate is separated from the intermediate plate and the lower plate in the clamping area.

[0042] More specifically, the cutting unit 9 also includes a left-right moving unit, which is used to drive the feed cylinder 901 to move and can be used to adjust the position of the feed cylinder 901 and the cutting knife to avoid them hindering the loading and unloading of the chip body 5.

[0043] When the cutting unit 9 is started, the feed cylinder 901 is moved to the corresponding position of the clamping area through the left and right moving units. The feed cylinder 901 drives the cutting frame 902 and the two cutting knives to move to the area where the upper plate is located. The two cutting knives separate the upper plate from the middle plate and the lower plate. At this time, the upper plate and the lead 501 can be separated from each other.

[0044] In order to keep the chip body 5 stable when cutting the connecting ribs 502, a pressing unit 10 is provided on the top plate 6. The pressing unit 10 includes two side pressing plates 1001 and a middle pressing plate 1003. The two side pressing plates 1001 are respectively aligned with the pressing areas in the two side regions of the two chip bodies 5, while the middle pressing plate 1003 is aligned with the pressing areas in the middle regions of the two chip bodies 5, and are respectively used to press the corresponding connecting ribs 502 to prevent the chip body 5 from shaking during cutting.

[0045] Specifically, a side suction unit 1002 is provided on the side pressure plate 1001 , and a middle suction unit 1004 is provided on the middle pressure plate 1003 .

[0046] While the cutting unit 9 is cutting the upper plate, the side laser cutting device 11 and the middle laser cutting device 12 are started to cut the connecting ribs 502 at the corresponding positions, and the connecting ribs 502 in the side area and the middle area are cut off. In this way, the laser cutting area and the pressing area (the area pressed by the side pressure plate 1001 and the middle pressure plate 1003) in the connecting rib 502 are cut off, and the corresponding side adsorption unit 1002, the middle adsorption unit 1004, and the lifting device 7 are started to separate the cut connecting ribs 502 from the chip body 5. At this time, only the middle plate and the lower plate in the clamping area remain on the chip body 5. When taking the chip body 5 out of the storage slot, the remaining and redundant connecting ribs 502 can be removed by prying the lower plate.

[0047] Working principle:

[0048] The fan is started to blow out gas, which is sent to each cleaning air duct 801 through the delivery pipe 802 and discharged through the exhaust port 803. The gas is aimed at the overflow area 503 in the chip body 5, which can blow away the excess residual glue on the lead frame, keeping the lead frame clean.

[0049] When the cutting unit 9 is started, the feed cylinder 901 is moved to the corresponding position of the clamping area through the left and right moving units. The feed cylinder 901 drives the cutting frame 902 and the two cutting knives to move to the area where the upper plate is located. The two cutting knives separate the upper plate from the middle plate and the lower plate. At this time, the upper plate and the lead 501 can be separated from each other.

[0050] While the cutting unit 9 is cutting the upper plate, the side laser cutting device 11 and the middle laser cutting device 12 are started to cut the connecting ribs 502 at the corresponding positions, and the connecting ribs 502 in the side area and the middle area are cut off. In this way, the laser cutting area and the pressing area (the area pressed by the side pressure plate 1001 and the middle pressure plate 1003) in the connecting rib 502 are cut off, and the corresponding side adsorption unit 1002, the middle adsorption unit 1004, and the lifting device 7 are started to separate the cut connecting ribs 502 from the chip body 5. At this time, only the middle plate and the lower plate in the clamping area remain on the chip body 5. When the chip body 5 is taken out of the storage slot, the remaining and redundant connecting ribs 502 can be removed by prying the lower plate, thereby completing the removal of the connecting ribs 502 on the chip body 5.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flashing removal structure for semiconductor chip dicing and tabbing processing, comprising a workbench (1), a top plate (6), and a lifting device (7), characterized in that, Inside the workbench (1), there is a storage groove for storing the chip body (5), and the top plate (6) is connected with a lifting device (7); The chip body (5) includes leads (501), connecting ribs (502), and overflow areas (503); An overflow cleaning unit (8) is arranged on the top plate (6); A cutting unit (9) is arranged on the workbench (1). The cutting unit (9) is used to cut off the upper plate in the clamping area. A side laser cutting device (11) and an intermediate laser cutting device (12) are arranged on the top plate (6). The area where two chip bodies (5) are connected is the intermediate area, and the side of the chip body (5) away from the intermediate area is set as the side area. The side laser cutting device (11) is used to cut off the connecting ribs (502) within the laser cutting area at the side area of the chip body (5), and the intermediate laser cutting device (12) is used to cut off the connecting ribs (502) within the laser cutting area in the intermediate area.

2. The overflow removal structure for semiconductor chip dicing and bar separating processing according to claim 1, wherein A bottom plate (2) is arranged at the bottom of the workbench (1), and the bottom plate (2) is connected with the workbench (1) through support rods (3).

3. The overflow removing structure for semiconductor chip dicing and bar separating processing according to claim 2, characterized in that, There are four support rods (3), and the four support rods (3) are respectively inserted into the four corners of the workbench (1). The support rods (3) are inserted with bases (4). The bases (4) are arranged on the upper side of the bottom plate (2), and the bottom plate (2) abuts against the upper end surface of the base (4).

4. A flashing removal structure for semiconductor chip dicing and singulation processing according to claim 1, characterized in that, The overflow cleaning unit (8) includes a plurality of cleaning air pipes (801) and a conveying pipeline (802). The plurality of cleaning air pipes (801) are aligned with the plurality of overflow areas (503). The plurality of cleaning air pipes (801) are connected through the conveying pipeline (802). A blower is arranged on the conveying pipeline (802). A discharge port (803) aligned with the overflow area (503) is arranged at the bottom of the cleaning air pipe (801).

5. A flash removal structure for semiconductor chip dicing and singulation processing according to claim 1, wherein, The lifting device (7) includes a lifting housing, a lifting lead screw, and a lifting motor. The lifting lead screw is inserted into the interior of the lifting housing. The lifting lead screw is connected with the output end of the lifting motor, and the lifting motor is installed on the top of the lifting housing.

6. The overflow removing structure for semiconductor chip dicing and bar separating processing according to claim 5, wherein, The lifting lead screw is threadedly connected with a lifting nut. The lifting nut is slidably connected with the lifting housing. The lifting nut is connected with a bracket, and the bracket is connected with the top plate (6).

7. The overflow material removing structure for semiconductor chip dicing and singulating according to claim 1, characterized in that, The cutting unit (9) includes a feed cylinder (901), a left cutting knife (903), and a right cutting knife (904). The output end of the feed cylinder (901) is connected with a cutting frame (902). The left cutting knife (903) and the right cutting knife (904) are both installed on the cutting frame (902), and a push plate is installed between the left cutting knife (903) and the right cutting knife (904).

8. A flash removal structure for semiconductor chip dicing and singulation processing according to claim 7, characterized in that, The cutting unit (9) further includes a left and right moving unit, and the left and right moving unit is used to drive the feed cylinder (901) to move left and right.

9. The overflow removal structure for semiconductor chip dicing and bar separation processing according to claim 1, wherein, A pressing unit (10) is arranged on the top plate (6). The pressing unit (10) includes two side pressing plates (1001) and an intermediate pressing plate (1003).

10. A flashing removal structure for semiconductor chip dicing and singulation processing according to claim 9, characterized in that, Side adsorption units (1002) are arranged on the side pressing plates (1001), and an intermediate adsorption unit (1004) is arranged on the intermediate pressing plate (1003).

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