High-precision chip mounting apparatus and mounting method

Abstract

The application discloses a high-precision chip mounting device and a mounting method, which comprises a transfer mounting unit, a chip loading unit and an adjusting platform arranged in sequence along a conveying direction; the chip loading unit is used for providing different specifications of chips for the transfer mounting unit and coarsely adjusting the angle of the chip to be picked up; the transfer mounting unit is used for moving the chip on the chip loading unit to the adjusting platform, and the adjusting platform is used for finely adjusting the chip; after the transfer mounting unit picks up the chip on the adjusting platform, the chip is finely adjusted. The chip angle is adjusted three times during the loading to mounting process, and the chip angle can be greatly adjusted before the chip is preliminarily picked up, and only slight adjustment is needed for the chip angle in the subsequent process, so that the high-precision mounting requirement of the chip is met.

Description

Technical Field

[0001] This application relates to the field of chip mounting technology, and in particular to a high-precision chip mounting equipment and mounting method. Background Technology

[0002] As core components of electronic communication products such as optical modules, chip placement is a crucial process in the manufacturing of these products. Due to the small size of chips and the high precision required during placement, it is difficult to complete manually, thus creating a need for automated chip placement. While existing chip placement equipment can meet the automation requirements, it typically requires a chip calibration after initial pickup. The chip is picked up by the placement mechanism from the loading device, placed on a transfer table for adjustment, and then picked up again by the placement mechanism for placement. Because the initial chip pickup has a large skew angle, the chip angle adjustment time is long, and a single adjustment is unlikely to meet the requirements of high-precision placement. Summary of the Invention

[0003] This application provides a high-precision chip placement equipment and method, which can sequentially coarsely, finely, and micro-adjust the chip angle before placement, and make significant adjustments to the chip before initial chip pickup, thus shortening the chip angle adjustment time. High-precision placement requirements are met through three adjustments. The technical solution is as follows:

[0004] High-precision chip mounting equipment includes a transfer and mounting unit, as well as a chip loading unit and an adjustment platform arranged sequentially along the conveying direction;

[0005] The chip loading unit is used to provide chips of different specifications to the transfer and mounting unit, and to coarsely adjust the angle of the chips to be picked up.

[0006] The transfer and mounting unit is used to move the chip from the chip loading unit to the adjustment platform, and the adjustment platform is used to fine-tune the chip.

[0007] After the transfer and mounting unit picks up the chip from the adjustment platform, it then performs fine-tuning on the chip.

[0008] Preferably, the chip loading unit includes a support platform that can rotate around its own axis, and an xy-movement module that drives the support platform to move. Several material trays that can rotate synchronously are distributed on the support platform, and any one of the material trays can rotate on its own axis.

[0009] Preferably, the adjustment platform is provided with a carrier board lateral movement unit for adjusting the position of the carrier board on one side. The transfer and mounting unit includes a lateral movement platform arranged along the conveying direction, and a transfer mechanism and a mounting mechanism that move along the lateral movement platform. The transfer mechanism is located between the chip loading unit and the adjustment platform, and the mounting mechanism is located between the adjustment platform and the carrier board lateral movement unit.

[0010] More preferably, the mounting mechanism includes a pickup component, a yz moving module for driving the pickup component to move, and a fine-tuning mechanism for swinging around the z-axis to adjust the angle of the pickup component. The pickup component has a through-hole structure, and the pickup component provides mounting pressure through a pressure regulating component to control the mounting force on the chip.

[0011] More preferably, the pickup assembly includes an air bearing and a nozzle assembly. The air bearing includes a bearing housing and a drive shaft that slides within the bearing housing supported by an air film. The nozzle assembly is connected to the bottom of the drive shaft, and a sealed drive cavity communicating with the pressure regulating component is formed between the drive shaft and the bearing housing. The pickup assembly is connected to the yz moving module through the fine-tuning component.

[0012] More preferably, the perforated structure includes a through hole on the nozzle assembly and a placement groove for placing a transparent plate, and a vertical groove on the drive shaft. The placement groove communicates with the through hole, and the angle of the chip picked up by the nozzle assembly can be observed through the vertical groove.

[0013] More preferably, it also includes a vision detection unit for detecting the chip angle and state, the vision detection unit including a first detection component, a second detection component and a third detection component respectively disposed opposite to the chip loading unit, the adjustment platform and the carrier board transverse movement unit.

[0014] Preferably, the device further includes a glue-dipping unit, which includes a linear drive mechanism, and a dispensing mechanism and a scraping mechanism disposed on the linear drive mechanism and moving along the y-axis.

[0015] Preferably, it further includes a nozzle storage unit, which includes a first supply device for providing nozzles to the transfer mechanism and a second supply device for providing nozzles to the mounting mechanism.

[0016] This application also provides a chip mounting method, including the high-precision mounting equipment described above, and further including the following steps:

[0017] Feeding: Chips of different specifications are placed on the chip feeding unit;

[0018] Coarse adjustment: The chip loading unit, in conjunction with the vision inspection unit, adjusts the chip of the required mounting specification to the picking station and makes the first adjustment to the angle of the chip to be picked.

[0019] Transfer: After picking up the corresponding chip at the picking station, the transfer mechanism transfers the chip to the adjustment platform;

[0020] Fine-tuning: The adjustment platform, in conjunction with the visual inspection unit, performs a second adjustment to the chip;

[0021] Fine-tuning: The mounting mechanism picks up the chip on the adjustment platform and moves it below the vision detection unit. The vision detection unit then detects the angle of the chip picked up by the mounting mechanism, and the mounting mechanism makes a third adjustment to the picked-up chip.

[0022] Placement: The placement mechanism, in conjunction with the vision detection unit, determines the placement position on the carrier board of the carrier board traversing unit and places the picked-up chip on the corresponding placement position.

[0023] Compared with the prior art, the beneficial effects of this application are as follows:

[0024] (1) Before chip mounting, the chip angle is adjusted by coarse adjustment, fine adjustment and fine adjustment in sequence. The chip loading device can make a large adjustment to the chip angle before the initial chip picking. Only a small adjustment to the chip angle is needed afterward, which can shorten the chip angle adjustment time. By adjusting the chip three times, the chip is ensured to be in a horizontal state, which improves the mounting accuracy after mounting and ensures the mounting quality of the product.

[0025] (2) The chip feeding unit can make significant adjustments to the chip angle by driving movement, rotation and self-rotation, and can also improve the chip feeding speed and improve the mounting efficiency.

[0026] (3) The chips are picked up and placed sequentially by the transfer mechanism and the placement mechanism, avoiding long-distance back-and-forth movement to pick up and place the chips, which can improve the placement efficiency.

[0027] (4) The mounting mechanism achieves high force control by precisely controlling the air pressure, thereby driving the pick-up component to apply mounting force to the chip. It has a simple structure, small size, and light weight. The through-hole structure facilitates observation of the chip angle and adjustment, resulting in high mounting accuracy. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the chip tilt in this application (the dashed line represents the chip in a tilted state).

[0029] Figure 2 This is a three-dimensional structural diagram of this application;

[0030] Figure 3 This is a front view of this application;

[0031] Figure 4 This is a three-dimensional structural diagram of the chip loading unit of this application;

[0032] Figure 5 This is a schematic diagram of the mounting mechanism structure of this application;

[0033] Figure 6 This is a schematic diagram of the picking component structure of this application;

[0034] Figure 7 This is a schematic diagram of the internal structure of the picking component in this application.

[0035] In the picture:

[0036] 1. Chip loading unit; 10. XY moving module; 20. Support platform; 30. Material tray;

[0037] 2. Adjustment platform; 21. Adsorption platform; 22. Fine adjustment mechanism; 3. Carrier plate transverse movement unit;

[0038] 4. Transfer and mounting unit; 41. Transfer mechanism; 42. Mounting mechanism; 421. Pick-up assembly; 4211. Air bearing; 42111. Drive shaft; 42112. Bearing housing; 4212. Nozzle assembly; 42121. Connecting part; 42122. Nozzle; 4213. First air supply channel; 4214. Second air supply channel; 4215. Vertical groove; 4216. Through hole; 4217. Placement groove; 4218. Limiting component; 422. Fine-tuning mechanism; 423. YZ moving module; 424. Pressure regulating component; 43. Horizontal moving platform;

[0039] 5. Vision inspection unit; 51. First inspection component; 52. Second inspection component; 53. Third inspection component; 6. Carrier board loading unit; 7. Adhesive dispensing unit; 71. Linear drive mechanism; 72. Dispensing mechanism; 73. Adhesive removal mechanism; 8. Nozzle storage unit; 81. First supply device; 82. Second supply device; 100. Drive cavity; 1000. Chip. Detailed Implementation

[0040] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0041] See Figures 2 to 7To further elaborate on this application:

[0042] Combination Figure 2 The high-precision chip mounting equipment includes a transfer and mounting unit 4 and a vision inspection unit 5, as well as a chip loading unit 1, an adjustment platform 2 and a carrier board lateral movement unit 3 arranged sequentially along the conveying direction (x-axis direction); the chip loading unit 1 is used to provide chips of different specifications to the transfer and mounting unit 4 and to make preliminary adjustments to the angle of the chips to be picked up.

[0043] Combination Figure 2 The vision inspection unit 5 is used to detect the chip angle and status; the vision inspection unit 5 is located at the top of the conveying direction; wherein, the vision inspection unit 5 includes a first detection component 51, a second detection component 52, and a third detection component 53 respectively disposed opposite to the chip loading unit 1, the adjustment platform 2, and the carrier board traversing unit 3. The first detection component 51 is used to cooperate with the chip loading unit 1 to move the chip to be picked up to the picking station of the transfer and mounting unit 4, and to coarsely adjust the chip angle; the second detection component 52 is used to cooperate with the adjustment platform 2 to finely adjust the chip on it; the third detection component 53 is used to cooperate with the carrier board traversing unit 3 to determine the chip mounting position.

[0044] The transfer and mounting unit 4 is used to transfer or mount chips between the chip loading unit 1 and the adjustment platform 2, and between the adjustment platform 2 and the carrier board traversing unit 3. The adjustment platform 2 is used for fine-tuning the chips. After picking up the chips from the adjustment platform 2, the transfer and mounting unit 4, in cooperation with the vision inspection unit 5, fine-tunes the chips and mounts them onto the carrier board.

[0045] Compared with existing technologies, this application improves chip mounting quality and performance by performing coarse, fine, and micro adjustments on the chip before mounting, thereby improving chip mounting quality and performance. Before the chip is picked up, the chip loading unit 1 can significantly adjust the chip angle, reducing the need for subsequent chip angle adjustments. Only minor adjustments to the chip angle are required afterward, which greatly shortens the chip angle adjustment time and ensures that the chip mounting angle meets high precision requirements.

[0046] Combination Figure 2 and Figure 3The transfer and mounting unit 4 includes a transverse platform 43 arranged along the conveying direction, and a transfer mechanism 41 and a mounting mechanism 42 that move along the transverse platform 43. The transfer mechanism 41 and the mounting mechanism 42 can be driven by a screw mechanism or a rack and pinion mechanism to move linearly (x-axis direction) along the transverse platform 43. The transfer mechanism 41 can have the same structure as the mounting mechanism 42, or use an existing mounting mechanism, as long as it can transfer the chip. Compared to existing methods that use a single mounting mechanism to pick up and mount the chip, this application has higher efficiency and can greatly shorten the moving distance between the transfer mechanism and the mounting mechanism during picking and mounting, avoiding long-distance movement.

[0047] Combination Figure 2 The transfer mechanism 41 is used to move between the chip loading unit 1 and the adjustment platform 2 to pick up the chip on the workstation and transfer the chip to the adjustment platform 2; the mounting mechanism 42 is used to move between the adjustment platform 2 and the carrier board traversing unit 3, and can pick up the chip on the adjustment platform 2, cooperate with the second detection component 52 or the third detection component 53 to fine-tune the picked-up chip, and move it to the mounting position for mounting.

[0048] Combination Figure 2 and Figure 4 The chip loading unit 1 includes a rotatable support platform 20 and an xy-motion module 10 for driving the support platform 20 to move. The support platform 20 can rotate around its own axis, and the rotation can be driven by a motor. The xy-motion module 10 can drive the support platform 20 to move in the x and y axis planes, adjusting the position of the support platform 20.

[0049] Combination Figure 2 The support platform 20 has several synchronously rotating trays 30 distributed on it to carry chips of different specifications. The synchronous rotation of each tray 30 can be achieved by belt drive, or by chain drive or gear drive, etc. In this embodiment, there are three trays 30, which are evenly distributed circumferentially on the support platform 20, and can carry three different specifications of chips at the same time. The number and arrangement of the trays 30 are not limited here.

[0050] Combination Figure 4 Each of the aforementioned trays 30 can rotate on its own axis. In this embodiment, the support platform 20 and any of the aforementioned trays 30 are connected by a belt drive to achieve synchronous rotation, but this is not a limitation. In embodiments not shown, any of the aforementioned trays 30 may also be driven to rotate by an independent motor.

[0051] When the support platform 20 rotates, it will drive the material trays 30 to rotate and replace. At the same time, each material tray 30 will rotate synchronously around its own axis, which can greatly adjust the chip angle on the material tray 30, reduce the amount of chip angle deviation in subsequent adjustments, and greatly shorten the adjustment time. In conjunction with the xy moving module 10, the material tray 30 carrying the corresponding specification chip can be quickly adjusted to the picking position (the picking position of the transfer mechanism 41), improving the feeding speed.

[0052] Combination Figure 3 The adjustment platform 2 includes an adsorption platform 21 and a fine-tuning mechanism 22 for adjusting the rotation of the adsorption platform 21 along the z-axis, thereby adjusting the angle of the chip on it. The adsorption platform 21 can be adjusted in the horizontal plane to align with the transfer mechanism 41. The adsorption platform 21 can fix the chip supplied by the transfer mechanism 41 by vacuum adsorption. The fine-tuning mechanism 22 can be an electric displacement stage or a motor. The adjustment platform 2 can align the adsorption platform 21 with the transfer mechanism 41 through an xy-axis linear movement module.

[0053] Combination Figure 5 The mounting mechanism 42 includes a yz-moving module 423, a fine-tuning mechanism 422, and a pickup component 421. The yz-moving module 423 is used to adjust the pickup component 421 to move in the y-axis and z-axis directions to pick up or mount chips. The fine-tuning mechanism 422 is used to drive the pickup component 421 to adjust the chip pickup angle around the z-axis. The pickup component 421 is connected to the yz-moving module 423 via the fine-tuning mechanism 422. The yz-moving module 423, in conjunction with the transverse platform 43, can move in the x, y, and z-axis directions, thereby adjusting the position of the pickup component 421 to pick up or mount chips.

[0054] Combination Figure 6 The pickup assembly 421 includes an air bearing 4211 and a nozzle assembly 4212. The air bearing 4211 includes a bearing housing 42112 and a drive shaft 42111 passing through the bearing housing 42112. The drive shaft 42111 is supported by an air film and slides within the bearing housing 42112. The nozzle assembly 4212 is connected to the bottom end of the drive shaft 42111. The pickup assembly 421 controls the chip mounting force through a pressure regulating component 424. The pickup assembly 421 has a through-hole structure for cooperating with the vision inspection unit 5 to detect the chip pickup angle.

[0055] In this embodiment, the drive shaft 42111 is connected to the nozzle assembly 4212 by vacuum adsorption; in an embodiment not shown, it can also be mechanically fixed by a connector or a magnetic adsorption assembly can be provided in the drive shaft 42111, and the nozzle 42122 can be detached and connected to the drive shaft 42111 by an external power supply.

[0056] Combination Figure 6 The suction nozzle assembly 4212 includes a connecting portion 42121 and a suction nozzle 42122 disposed on the connecting portion 42121; the perforated structure includes a through hole 4216 disposed on the connecting portion 42121 and communicating with the suction nozzle 42122, and a placement groove 4217 disposed on the connecting portion 42121 and communicating with the through hole 4216. The placement groove 4217 is used to place a transparent plate, and the transparent plate seals one end of the through hole 4216 so that a negative pressure environment is formed in the through hole 4216 to pick up the chip; the drive shaft 42111 is also provided with a vertical groove 4215 for the vision inspection unit 5 to observe the through hole 4216.

[0057] Combination Figure 7 A drive cavity 100 is formed between the drive shaft 42111 and the bearing housing 42112, communicating with the pressure regulating component 424. The bearing housing 4211 may have a sliding groove, and the drive shaft 42111 may have a protrusion that slides within the sliding groove, forming a sealed drive cavity 100 between the protrusion and the sliding groove. The pressure regulating component 424 precisely controls the supply of air pressure to the drive cavity 100, pushing the drive shaft 42111 outward to mount the chip, and controlling the mounting force on the chip. The pressure regulating component 424 includes a proportional valve. The top of the drive shaft 42111 is also provided with a limiting component 4218 to prevent the drive shaft 42111 from detaching from the bearing housing 42112.

[0058] The drive shaft 42111 is also provided with a first air supply channel 4213 and a second air supply channel 4214. The first air supply channel 4213 is used to connect the pressure regulating component 424 to the drive cavity 100. The second air supply channel 4214 is connected to an external air source to form an air film between the bearing seat 42112 and the drive shaft 42111, so as to avoid friction or heat generation between the drive shaft 42111 and the bearing seat 42112, and improve the mounting accuracy and force control accuracy. During operation, the gas supplied to form an air film between the drive shaft 42111 and the bearing seat 42112 will not affect the pressure stability of the gas in the drive cavity 100.

[0059] Combination Figure 6In normal operation, the drive shaft 42111 extends downwards under its own weight. When mounting chips, the yz moving module 423 moves the pickup component 421 closer to the mounting area. When the nozzle 42122 touches the mounting area, it pushes the drive shaft 42111 upwards a certain distance, and then the yz moving module 423 stops moving, providing space for applying mounting force. At this time, the pressure regulating component 424 controls the supply of gas to the drive cavity 100, thereby pushing the drive shaft 42111 downwards to apply mounting force for mounting.

[0060] Combination Figure 2 and Figure 3 It also includes a glue-dipping unit 7 and a carrier board loading unit 6. The glue-dipping unit 7 includes a dispensing mechanism 72 and a scraping mechanism 73, as well as a linear drive mechanism 71 that drives the dispensing mechanism 72 and the scraping mechanism 73 to move along the y-axis. The carrier board loading unit 6 is located on one side of the carrier board traversing unit 33 and is used to provide a carrier board for the carrier board traversing unit 33. The carrier board traversing unit 33 can move along the x, y, and z axes to adjust the carrier board mounting position so that the mounting mechanism 42 can mount the chip, and cooperate with the glue-dipping unit 7 to perform glue dispensing and glue removal.

[0061] Combination Figure 2 To enable the mounting of chips of various sizes during the placement process, a nozzle storage unit 8 is also included. The nozzle storage unit 8 includes a first supply device 81 for providing nozzles 42122 to the transfer mechanism 41, and a second supply device 82 for providing nozzles 42122 to the placement mechanism 42. This allows for switching between appropriate nozzles 42122 when picking up different chips.

[0062] This application also provides a chip mounting method, including the above-mentioned high-precision chip mounting equipment, and further including the following steps:

[0063] Feeding: Chips of different specifications are placed in different trays 30 on the chip feeding unit 1.

[0064] Coarse adjustment: The chip loading unit 1, in conjunction with the first detection component 51, adjusts the chip of the required mounting specification to the pick-up station, and at the same time makes the first adjustment of the chip angle; reducing the tilt angle of the chip before pick-up, and shortening the time for subsequent chip adjustment.

[0065] Transfer: After the transfer mechanism 41 picks up the corresponding chip at the picking station, it transfers the chip to the adjustment platform 2; the adsorption platform 21 adsorbs and fixes the chip.

[0066] Fine-tuning: The adjustment platform 2, in conjunction with the visual detection unit 5, performs a second adjustment on the chip; the fine-tuning mechanism 2, in conjunction with the second detection component 52, drives the adsorption platform 21 to rotate, thereby readjusting the chip angle again.

[0067] Fine-tuning: The mounting mechanism 42 picks up the chip on the adjustment platform 2 and moves it below the second detection component 52 or the third detection component 53. It detects the angle of the chip picked up by the picking component 421 through the perforated structure to determine whether the chip angle is skewed. If there is an angle skew, the fine-tuning mechanism 422 makes a third adjustment to the chip picked up by the picking component 421. If there is no skew, it directly proceeds to the mounting step.

[0068] Placement: The placement mechanism 42, in conjunction with the third detection component 53, determines the placement position on the carrier board of the carrier board transverse unit 3, and places the picked-up chip on the corresponding placement position.

[0069] The chip angle can be adjusted three times before mounting, thereby meeting the high precision requirements of chip mounting angle and improving product quality.

Claims

1. A high precision chip mounter characterized by comprising: The chip loading unit is used for providing different specifications of chips for the transfer and mounting unit, and coarsely adjusting the angle of the chip to be picked up. The transfer and mounting unit is used for moving the chip on the chip loading unit to the adjusting platform, and the adjusting platform is used for finely adjusting the chip. After the transfer and mounting unit picks up the chip on the adjusting platform, the chip is finely adjusted. The chip loading unit comprises a support platform capable of rotating around its own axis, and an xy movement module for driving the support platform to move, a plurality of trays capable of rotating synchronously are distributed on the support platform, any of the trays can rotate by itself, and the trays rotate synchronously to adjust the angle of the chip in the horizontal plane. The adjusting platform is provided with a carrier plate transverse movement unit for adjusting the position of the carrier plate, the transfer and mounting unit comprises a transverse movement platform arranged in the conveying direction, a transfer mechanism and a mounting mechanism arranged to move along the transverse movement platform, the transfer mechanism is arranged between the chip loading unit and the adjusting platform, and the mounting mechanism is arranged between the adjusting platform and the carrier plate transverse movement unit.

2. The high precision chip mounter according to claim 1, characterized by: The mounting mechanism comprises a pickup assembly, a yz movement module for driving the pickup assembly to move, and a fine adjustment mechanism for adjusting the angle of the pickup assembly by swinging around the z-axis, a through-hole structure is arranged on the pickup assembly, the pickup assembly provides mounting pressure through a pressure adjusting part to control the mounting force of the chip.

3. The high precision chip mounter according to claim 2, characterized by: The pickup assembly comprises an air floating bearing and a suction nozzle assembly, the air floating bearing comprises a bearing seat and a driving shaft supported by an air film to slide in the bearing seat, the suction nozzle assembly is connected to the bottom of the driving shaft, and a sealed driving cavity communicating with the pressure adjusting part is formed between the driving shaft and the bearing seat; the pickup assembly is connected to the yz movement module through the fine adjustment mechanism.

4. The high precision chip mounter according to claim 3, characterized by: The through-hole structure comprises a through hole arranged on the suction nozzle assembly, a placement groove for placing a transparent plate, and a vertical groove arranged on the driving shaft, the placement groove communicates with the through hole, and the angle of the chip picked up by the suction nozzle assembly can be observed through the vertical groove.

5. The high precision chip mounter according to claim 4, characterized by: A visual detection unit for detecting the angle and state of the chip is further included, and the visual detection unit comprises a first detection part, a second detection part and a third detection part arranged opposite to the chip loading unit, the adjusting platform and the carrier plate transverse movement unit, respectively.

6. The high precision chip mounter according to claim 2, characterized by: A glue dipping unit is further included, and the glue dipping unit comprises a linear driving mechanism, a dispensing mechanism and a glue scraping mechanism arranged on the linear driving mechanism and moving along the y-axis direction.

7. The high precision chip mounter according to Claim 1, characterized by: A suction nozzle storage unit is further included, and the suction nozzle storage unit comprises a first supply device for providing suction nozzles for the transfer mechanism, and a second supply device for providing suction nozzles for the mounting mechanism.

8. The high precision chip mounter according to claim 2, characterized by: The high-precision mounting equipment of claim 6 further comprises the following steps:

9. A die attach method characterized by: Loading: placing different specifications of chips on the chip loading unit; ​ Coarse adjustment: the chip loading unit cooperates with the visual detection unit to adjust the chip of the required mounting specification to the pickup station and to make the first adjustment to the angle of the chip to be picked up; Transport: the transport mechanism transports the chip to the adjustment platform after picking up the corresponding chip at the pickup station; Fine adjustment: the adjustment platform cooperates with the visual detection unit to make the second adjustment to the chip; Fine adjustment: the mounting mechanism picks up the chip on the adjustment platform and moves to below the visual detection unit, cooperates with the visual detection unit to detect the angle of the chip picked up by the mounting mechanism, and makes the third adjustment to the picked-up chip; Mounting: the mounting mechanism cooperates with the visual detection unit to determine the mounting position on the carrier board on the carrier board transverse movement unit, and mounts the picked-up chip on the corresponding mounting position.

Images