Power supply module

Abstract

A power supply module comprises at least one sub power supply module. Each sub power supply module comprises an upper circuit board, a lower circuit board and an inductor. The inductor is arranged between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board. A lower surface of the inductor faces the lower circuit board. The inductor comprises two primary windings and two secondary windings. The two electrodes of each primary winding are arranged on the upper surface and the lower surface of the inductor respectively and connected to the upper circuit board and the lower circuit board respectively. The secondary winding is electrically connected in series with the lower circuit board through the upper circuit board or through the upper circuit board.

Description

Technical Field

[0001] The present invention relates to a power supply module, and more particularly to a power supply module suitable for a vertical power delivery (VPD) configuration. Background Art

[0002] Due to the increasingly stringent power requirements of the graphics processing unit (GPU) and the central processing unit (CPU), the power supply module needs to meet various requirements such as a wide input range, a high input voltage, a high output power, high efficiency, high density, small size, light weight, and efficient heat dissipation. Currently, the power supply module powers the GPU / CPU through a lateral power delivery (LPD) method, and output capacitors are provided between the GPU / CPU and the power supply module, resulting in a long power distribution network (PDN) path and a large transient. Summary of the Invention

[0003] The present invention provides a power supply module suitable for a vertical power delivery configuration to solve the above problems.

[0004] According to an embodiment, the power supply module of the present invention includes at least one sub-power supply module. Each sub-power supply module includes an upper circuit board, a lower circuit board, and an inductor. The lower circuit board is disposed opposite to the upper circuit board. The lower circuit board has a plurality of power electrodes. The plurality of power electrodes are disposed on a mounting surface of the lower circuit board. The plurality of power electrodes are configured to be mounted to a system board. The inductor is disposed between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board. A lower surface of the inductor faces the lower circuit board. The inductor includes two primary windings and two secondary windings. Two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The secondary windings are electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board.

[0005] In an embodiment, two electrodes of each secondary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The inductor further includes two connectors. Two end portions of each connector are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, so that the secondary windings are electrically connected in series via the upper circuit board, the lower circuit board, and the two connectors.

[0006] In one embodiment, the two connecting members are disposed within a magnetic body of the inductor and located on two opposite sides of the magnetic body.

[0007] In one embodiment, the inductor further includes two power conducting members. Two end portions of each of the power conducting members are respectively disposed on the upper surface and the lower surface of the inductor.

[0008] In one embodiment, the two power conducting members are disposed within a magnetic body of the inductor and located on two opposite sides of the magnetic body.

[0009] In one embodiment, the power supply module includes a plurality of sub - power supply modules. The lower circuit boards of the plurality of sub - power supply modules are integrated into a single lower circuit board. The upper circuit boards of the plurality of sub - power supply modules are separated from each other.

[0010] In one embodiment, two electrodes of each of the secondary windings are disposed on the upper surface of the inductor and connected to the upper circuit board, such that the secondary windings are electrically connected in series via the upper circuit board.

[0011] In one embodiment, the power supply module includes at least one control electrode configured to receive a control signal from a power component on the upper circuit board via a signal connection structure.

[0012] In one embodiment, the power supply module includes a power controller disposed on the upper circuit board. The power controller transmits a control signal to a power component on the upper circuit board via the upper circuit board. There is no control electrode disposed on the lower circuit board. The control signal is only transmitted via the upper circuit board.

[0013] In one embodiment, the inductor has a symmetric structure.

[0014] In one embodiment, two power switches are disposed on the upper circuit board. The two power switches are connected in series at a switch pad to form a half - bridge power component or a full - bridge power component.

[0015] In one embodiment, the switch pad is electrically connected to one of the two electrodes of the primary winding disposed on the upper surface of the inductor. The other of the two electrodes of the primary winding disposed on the lower surface of the inductor is electrically connected to an output electrode of the lower circuit board. One of the two primary windings and one of the two power switches form a phase power output.

[0016] In one embodiment, the power supply module further includes a plurality of output capacitors. The lower surface of the inductor has a groove configured to accommodate the plurality of output capacitors.

[0017] In one embodiment, the power supply module further includes a plurality of input capacitors embedded in the upper surface of the inductor.

[0018] In one embodiment, the lower circuit board is provided with a plurality of output capacitors and no input capacitors, and the upper circuit board is provided with a plurality of input capacitors and no output capacitors.

[0019] According to one embodiment, the power supply module of the present invention includes at least one sub-power supply module. Each sub-power supply module includes an upper circuit board, a lower circuit board, and an inductor. The lower circuit board is disposed opposite to the upper circuit board. The lower circuit board has a plurality of power electrodes. The plurality of power electrodes are disposed on a mounting surface of the lower circuit board. The plurality of power electrodes are configured to be mounted to a system board. The inductor is disposed between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board. A lower surface of the inductor faces the lower circuit board. The inductor includes two primary windings and two secondary windings. Two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. Two electrodes of each secondary winding are disposed on the lower surface of the inductor, and are connected to the lower circuit board, such that the secondary winding is electrically connected in series with the system board via the lower circuit board.

[0020] In one embodiment, a plurality of output capacitors are embedded in the lower circuit board.

[0021] In summary, two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, such that power components on the upper circuit board can transmit power to the system board connected to the lower circuit board. In one embodiment, the secondary winding can be electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board. In another embodiment, the secondary winding can be electrically connected in series with the system board via the lower circuit board. With the above configuration, the two primary windings and the two power switches can form a two-phase power output. Thus, the power supply module of the present invention can be stacked with the system board through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the power supply module is stacked with the system board, the power transmission path can be minimized to reduce the parasitic inductance and reduce the size of the system board.

[0022] The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A perspective view of a power supply module according to an embodiment of the present invention.

[0024] Figure 2 is Figure 1Exploded view of the power supply module in

[0025] Figure 3 is Figure 1 Exploded view of the sub - power supply module in

[0026] Figure 4 is Figure 3 Stereogram of the inductor in from another perspective.

[0027] Figure 5 is Figure 3 Stereogram of the inductor in after removing the thermal conductive filler.

[0028] Figure 6 is Figure 1 Schematic diagram of a partial configuration of the power supply module in

[0029] Figure 7 is Figure 6 Schematic diagram of the equivalent circuit of the power supply module in

[0030] Figure 8 is the stereogram of an inductor according to another embodiment of the present invention.

[0031] Figure 9 is the stereogram of two primary windings and a secondary winding according to another embodiment of the present invention.

[0032] Figure 10 is the stereogram of a sub - power supply module according to another embodiment of the present invention.

[0033] Figure 11 is Figure 10 Side view of the sub - power supply module in

[0034] Figure 12 is the stereogram of a sub - power supply module according to another embodiment of the present invention.

[0035] Figure 13 is the stereogram of a sub - power supply module according to another embodiment of the present invention.

[0036] Figure 14 is Figure 13 Internal stereogram of the sub - power supply module in

[0037] Figure 15 is Figure 13 Stereogram of the sub - power supply module in from another perspective.

[0038] Figure 16 is the schematic diagram of a power supply system according to an embodiment of the present invention.

[0039] Among them, the reference numerals are explained as follows:

[0040] 1: Power supply module

[0041] 1', 1": Sub-power supply module

[0042] 3, 50: System board

[0043] 5: Power supply system

[0044] 7: Power supply unit

[0045] 10: Upper circuit board

[0046] 12: Lower circuit board

[0047] 14: Inductor

[0048] 16: Power controller

[0049] 50a: First side

[0050] 50b: Second side

[0051] 52: First-stage power supply module

[0052] 54: Second-stage power supply module

[0053] 56: Thermal conduction structure

[0054] 58: Heat dissipation structure

[0055] 60: Heat dissipation device

[0056] 62: Conductive post

[0057] 70: Power line

[0058] 140a, 140b, 140a', 140b': Primary winding

[0059] 142a, 142b, 142a', 142b': Secondary winding

[0060] 144: Magnetic body

[0061] 146a, 146b: Connector

[0062] 148a, 148b: Power conduction component

[0063] 150: Thermal conductive filler

[0064] 152a, 152b: Power component

[0065] 154: Signal connection structure

[0066] 156, 158: Groove

[0067] 500: Processor

[0068] 502: Heat dissipation surface

[0069] 520: Mounting surface

[0070] 1400, 1402, 1420, 1422: Electrodes

[0071] 1460, 1462, 1480, 1482: Ends

[0072] 1520: Power switch

[0073] E1: Voltage input terminal

[0074] E2: Voltage output terminal

[0075] S1: Upper surface

[0076] S2: Lower surface

[0077] SW0, SW1, SW2, SW3: Switch pads

[0078] Vout: Output electrode

[0079] Vin: Input electrode

[0080] GND: Ground electrode

[0081] Cout: Output capacitor

[0082] Cin: Input capacitor

[0083] T00, T01, T10, T11, T20, T21, T30, T31: Contacts Detailed implementation manners

[0084] Please refer to Figures 1 to 7 , Figure 1 , which is a perspective view of the power supply module 1 according to an embodiment of the present invention, Figure 2 is Figure 1 the exploded view of the power supply module 1 in Figure 3 is Figure 1 the exploded view of the sub - power supply module 1' in Figure 4 is Figure 3 the perspective view of the inductor 14 in Figure 5 is Figure 3 the perspective view of the inductor 14 after removing the thermal conductive filler in Figure 6 is Figure 1 the schematic diagram of a partial configuration of the power supply module 1 in Figure 7 is Figure 6 the schematic diagram of the equivalent circuit of the power supply module 1 in

[0085] As shown in Figures 1 to 3As shown in the figure, the power supply module 1 includes at least one sub-power supply module 1'. Each sub-power supply module 1' includes an upper circuit board 10, a lower circuit board 12, and an inductor 14. The lower circuit board 12 is disposed opposite to the upper circuit board 10, and the inductor 14 is disposed between the upper circuit board 10 and the lower circuit board 12. In this embodiment, the power supply module 1 may include a plurality of sub-power supply modules 1', wherein the lower circuit boards 12 of the plurality of sub-power supply modules 1' can be integrated into a single lower circuit board 12, and the upper circuit boards 10 of the plurality of sub-power supply modules 1' can be separated from each other. Therefore, the thermal stresses of the sub-power supply modules 1' do not interfere with each other, so as to reduce the overall thermal stress of the power supply module 1. However, the present invention is not limited to the embodiments illustrated in the figures. In another embodiment, the lower circuit boards 12 of the plurality of sub-power supply modules 1' may also be separated from each other. In addition, the number of sub-power supply modules 1' can be determined according to actual applications.

[0086] As Figures 3 to 6 shown, an upper surface S1 of the inductor 14 faces the upper circuit board 10, and a lower surface S2 of the inductor 14 faces the lower circuit board 12. In this embodiment, the inductor 14 may include two primary windings 140a, 140b and two secondary windings 142a, 142b, wherein the primary winding 140a and the secondary winding 142a form a pair of windings, and the primary winding 140b and the secondary winding 142b form another pair of windings. In practical applications, the inductor 14 may include a magnetic body 144 (for example, a magnetic core), wherein the upper surface S1 and the lower surface S2 may be opposite surfaces of the magnetic body 144. The two primary windings 140a, 140b and the two secondary windings 142a, 142b may be molded in the magnetic body 144. The two primary windings 140a, 140b and the two secondary windings 142a, 142b are electrically insulated within the magnetic body 144. For example, the two primary windings 140a, 140b and the two secondary windings 142a, 142b may be arranged at intervals or coated with an insulating layer.

[0087] Two electrodes 1400, 1402 of each primary winding 140a, 140b are respectively disposed on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the electrode 1400 of each primary winding 140a, 140b is disposed on the upper surface S1 of the inductor 14 and is connected to the upper circuit board 10; the electrode 1402 of each primary winding 140a, 140b is disposed on the lower surface S2 of the inductor 14 and is connected to the lower circuit board 12.

[0088] As Figure 6 and Figure 7As shown, the secondary windings 142a and 142b can be electrically connected in series via the upper circuit board 10 and the lower circuit board 12. In this embodiment, the two electrodes 1420 and 1422 of each of the secondary windings 142a and 142b are respectively disposed on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the electrodes 1420 of each of the secondary windings 142a and 142b are disposed on the upper surface S1 of the inductor 14 and are connected to the upper circuit board 10; the electrodes 1422 of each of the secondary windings 142a and 142b are disposed on the lower surface S2 of the inductor 14 and are connected to the lower circuit board 12.

[0089] In this embodiment, the inductor 14 may further include two connecting members 146a and 146b. The two ends 1460 and 1462 of each of the connecting members 146a and 146b are respectively disposed on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the ends 1460 of each of the connecting members 146a and 146b are disposed on the upper surface S1 of the inductor 14 and are connected to the upper circuit board 10; the ends 1462 of each of the connecting members 146a and 146b are disposed on the lower surface S2 of the inductor 14 and are connected to the lower circuit board 12.

[0090] As Figure 6 shown, the electrode 1420 of the secondary winding 142a can be electrically connected to the end 1460 of the connecting member 146a via the upper circuit board 10, the electrode 1422 of the secondary winding 142a can be electrically connected to the end 1462 of the connecting member 146b via the lower circuit board 12, and the electrode 1420 of the secondary winding 142b can be electrically connected to the end 1460 of the connecting member 146b via the upper circuit board 10, so that the secondary windings 142a and 142b are electrically connected in series via the upper circuit board 10, the lower circuit board 12 and the two connecting members 146a and 146b. It should be noted that the electrode 1420 of the secondary winding 142b of a sub-power supply module 1' can be electrically connected to the end 1462 of the connecting member 146a of an adjacent sub-power supply module 1' via the lower circuit board 12, so that two adjacent sub-power supply modules 1' are electrically connected to each other.

[0091] In this embodiment, the inductor 14 may further include two power conduction members 148a and 148b. The two ends 1480 and 1482 of each of the power conduction members 148a and 148b are respectively disposed on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the ends 1480 of each of the power conduction members 148a and 148b are disposed on the upper surface S1 of the inductor 14 and are connected to the upper circuit board 10; the ends 1482 of each of the power conduction members 148a and 148b are disposed on the lower surface S2 of the inductor 14 and are connected to the lower circuit board 12.

[0092] In this embodiment, the two connectors 146a and 146b can be disposed on two opposite sides of the inductor 14 and are covered by a heat-conductive filler 150. Similarly, the two power conductors 148a and 148b can also be disposed on two opposite sides of the inductor 14 and are covered by the heat-conductive filler 150. Therefore, the inductor 14 can be a symmetric structure. There are no connectors and power conductors disposed on the other two sides of the inductor 14, thereby simplifying the manufacturing process of the inductor 14 and reducing the manufacturing cost.

[0093] In this embodiment, two power components 152a and 152b can be disposed on the upper circuit board 10. The power components 152a and 152b can be Dr.MOS mainly composed of a driver IC (driver IC) and a metal-oxide-semiconductor field-effect transistor (MOSFET), but are not limited thereto. The sub-power supply module 1' can include at least one control electrode configured to receive a control signal from the power components 152a and 152b on the upper circuit board 10 via a signal connection structure 154. The signal connection structure 154 can shorten the signal transmission path to make the operation more stable. Each of the power components 152a and 152b can include two power switches 1520, where the two power switches 1520 are disposed on the upper circuit board 10 and are connected in series at a switch pad to form a half-bridge power component or a full-bridge power component. As Figure 7 shown, the two power switches 1520 of the power component 152a of a sub-power supply module 1' are connected in series at a switch pad SW0, the two power switches 1520 of the power component 152b of a sub-power supply module 1' are connected in series at a switch pad SW1, the two power switches 1520 of the power component 152a of another sub-power supply module 1' are connected in series at a switch pad SW2, and the two power switches 1520 of the power component 152b of another sub-power supply module 1' are connected in series at a switch pad SW3.

[0094] In this embodiment, the lower circuit board 12 can have a plurality of power electrodes, and the plurality of power electrodes are disposed on a mounting surface of the lower circuit board 12, where the plurality of power electrodes are configured to be mounted to a system board 3 (as Figure 1 shown). In practical applications, the system board 3 can be a server equipped with a central processing unit (CPU), a graphics processing unit (GPU), a random access memory (RAM), a hard disk drive (HDD), a solid state disk (SSD), a network interface, etc. AsFigure 6 As shown, the power electrodes may include a plurality of output electrodes Vout, a plurality of input electrodes Vin, and a plurality of ground electrodes GND.

[0095] In this embodiment, the power supply module 1 may further include a plurality of output capacitors Cout and a plurality of input capacitors Cin. The output capacitors Cout may be disposed on the lower circuit board 12. As Figure 4 shown, the lower surface S2 of the inductor 14 may have a groove 156 configured to accommodate a plurality of output capacitors Cout. In this embodiment, the primary windings 140a, 140b, the secondary windings 142a, 142b, the connectors 146a, 146b, and / or the power conductors 148a, 148b may protrude from the magnetic body 144 to form a groove 156 therebetween. In addition, the input capacitors Cin may be disposed on the upper circuit board 10 and surround the power components 152a, 152b. In this embodiment, the lower circuit board 12 may be equipped with a plurality of output capacitors Cout without input capacitors, and the upper circuit board 10 may be equipped with a plurality of input capacitors Cin without output capacitors.

[0096] As Figure 6 and Figure 7 shown, T00, T01, T10, T11, T20, T21, T30, and T31 represent a plurality of contacts of the secondary windings 142a, 142b of the dual-supply module 1'. The secondary windings 142a, 142b of the dual-supply module 1' are electrically connected in series via the upper circuit board 10, the lower circuit board 12, and the connectors 146a, 146b. In addition, the switch pad SW0 is electrically connected to one of the two electrodes 1400, 1402 of the primary winding 140a disposed on the upper surface S1 of the inductor 14, and the other of the two electrodes 1400, 1402 of the primary winding 140a disposed on the lower surface S2 of the inductor 14 is electrically connected to the output electrode Vout of the lower circuit board 12. It should be noted that the switch pads SW1, SW2, and SW3 are connected to the primary winding 140a or 140b in the same manner as the switch pad SW0, which will not be elaborated here. Therefore, in one sub-power supply module 1', one of the two primary windings 140a, 140b and one of the two power switches 1520 form a one-phase power output, such that the two primary windings 140a, 140b and the two power switches 1520 can form a two-phase power output. Each phase of the power output can be powered in parallel by the circuit layout of the lower circuit board 12 or the system board 3.

[0097] With the above configuration, the power supply module 1 of the present invention can be stacked with the system board 3 through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the power supply module 1 is stacked with the system board 3, the power transmission path can be minimized to reduce parasitic inductance and the size of the system board.

[0098] Please refer to Figure 8 , Figure 8 which is a perspective view of the inductor 14 according to another embodiment of the present invention.

[0099] As Figure 8 shown, the two connectors 146a, 146b and the two power conduction members 148a, 148b can be disposed within the magnetic body 144 of the inductor 14 and are located on two opposite sides of the magnetic body 144.

[0100] Please refer to Figure 9 , Figure 9 which is a perspective view of the two primary windings 140a', 140b' and the two secondary windings 142a', 142b' according to another embodiment of the present invention.

[0101] Figure 5 The two primary windings 140a, 140b and the two secondary windings 142a, 142b shown in Figure 9 can be replaced with the two primary windings 140a', 140b' and the two secondary windings 142a', 142b' shown in Figure 3 . After replacement, the two electrodes 1420, 1422 of each secondary winding 142a', 142b' are disposed on the upper surface S1 of the inductor 14 and are connected to the upper circuit board 10 (as Figure 3 shown), such that the secondary windings 142a', 142b' are electrically connected in series via the upper circuit board 10. Therefore, Figure 5 and Figure 6 the connectors 146a, 146b shown in Figure 6 can be omitted, and the number of output capacitors disposed on the lower circuit board 12 can be increased.

[0102] Please refer to Figure 10 and Figure 11 , Figure 10 which is a perspective view of the sub-power supply module 1' according to another embodiment of the present invention, Figure 11 and Figure 10 is a side view of the sub-power supply module 1' in Figure 11 .

[0103] As Figure 10 and Figure 11As shown, the sub-power supply module 1' further includes a power controller 16 disposed on the upper circuit board 10. The power controller 16 transmits control signals to the power components 152a, 152b on the upper circuit board 10 via the circuit wiring of the upper circuit board 10. In this embodiment, no control electrodes are provided on the lower circuit board 12, and the control signals are only transmitted via the upper circuit board 10. Therefore, the control signals to be transmitted by the signal connection structure 154 are fewer, enabling the signal connection structure 154 to be made smaller. In addition, a groove 158 can be formed on the upper surface S1 of the inductor 14 and configured to accommodate the input capacitor Cin. Thus, the input capacitor Cin can be disposed on two opposite sides of the upper circuit board 10 to increase the number of input capacitors Cin according to actual requirements.

[0104] Please refer to Figure 12 , Figure 12 which is a perspective view of the sub-power supply module 1' according to another embodiment of the present invention.

[0105] As Figure 12 shown, the groove 158 described above can be omitted from the sub-power supply module 1', and a plurality of input capacitors Cin can be embedded in the upper surface S1 of the inductor 14.

[0106] Please refer to Figures 13 to 15 , Figure 13 which is a perspective view of the sub-power supply module 1” according to another embodiment of the present invention, Figure 14 and Figure 13 is an internal perspective view of the sub-power supply module 1” in Figure 15 , Figure 13 and is a perspective view of the sub-power supply module 1” in

[0107] Figure 1 The sub-power supply module 1' shown can be Figure 13 replaced with the sub-power supply module 1”. The main difference between the sub-power supply module 1” and the above-described sub-power supply module 1' is that the two electrodes 1420, 1422 of each secondary winding 142a, 142b are disposed on the lower surface S2 of the inductor 14 and connected to the lower circuit board 12 (as Figure 14 shown), such that the secondary windings 142a, 142b are electrically connected in series with the system board 3 via the lower circuit board 12. In this embodiment, a plurality of output capacitors Cout can be embedded in the lower circuit board 12, as Figure 15 shown.

[0108] Please refer to Figure 16 , Figure 16 which is a schematic diagram of a power supply system 5 according to an embodiment of the present invention.

[0109] As Figure 16As shown, the power supply system 5 includes a system board 50, a first-stage power supply module 52, a second-stage power supply module 54, a heat conduction structure 56, a heat dissipation structure 58, and a heat dissipation device 60. The system board 50 includes a processor 500, the processor 500 is located on a first surface 50a of the system board 50, and the first-stage power supply module 52 is disposed on a second surface 50b of the system board 50, where the first surface 50a and the second surface 50b are opposite. In this embodiment, the system board 50 can be a server equipped with a central processing unit (CPU), a graphics processing unit (GPU), a random access memory (RAM), a hard disk drive (HDD), a solid-state disk (SSD), a network interface, etc., and the processor 500 can be a central processing unit, a graphics processing unit or a similar component. The second-stage power supply module 54 is disposed on the first-stage power supply module 52. The heat conduction structure 56 is sandwiched between the first-stage power supply module 52 and the second-stage power supply module 54, and opposite two sides of the heat conduction structure 56 are respectively in contact with the first-stage power supply module 52 and the second-stage power supply module 54. Thus, the system board 50, the first-stage power supply module 52, and the second-stage power supply module 54 are stacked on each other through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the heat conduction structure 56 is sandwiched between the first-stage power supply module 52 and the second-stage power supply module 54, the heat conduction structure 56 can dissipate heat from the first-stage power supply module 52 and the second-stage power supply module 54.

[0110] The heat dissipation structure 58 is disposed outside the first-stage power supply module 52 and the second-stage power supply module 54, and the heat conduction structure 56 is connected to the heat dissipation structure 58. In practical applications, the heat conduction structure 56 and the heat dissipation structure 58 can be combined into a heat dissipation mechanism, such as a cold plate, a heat pipe, a radiator, or a combination thereof, to dissipate heat from the first-stage power supply module 52 and the second-stage power supply module 54.

[0111] The heat dissipation device 60 is disposed on a heat dissipation surface 502 of the processor 500 and is configured to dissipate heat from the processor 50. In practical applications, the heat dissipation device 60 can be a cold plate, a heat pipe, a radiator, or a combination thereof. The heat dissipation structure 58 can pass through the system board 50 and be connected to the heat dissipation device 60, so that the heat dissipation structure 58 can conduct heat to the heat dissipation device 60 for heat dissipation.

[0112] In this embodiment, an installation surface 520 of the first-stage power supply module 52 is welded to the system board 50, and the second-stage power supply module 54 and the first-stage power supply module 52 are stacked in sequence from far away from the installation surface 520 to the installation surface 520, so that the second-stage power supply module 54 and the first-stage power supply module 52 are serially powered in sequence. Since the first-stage power supply module 52 and the system board 50 are stacked on each other, the processor 500 is vertically stacked with the first-stage power supply module 52.

[0113] In this embodiment, a voltage input terminal E1 is only provided on the second-stage power supply module 54, and a voltage output terminal E2 is only provided on the installation surface 520 of the first-stage power supply module 52. In other words, no voltage input terminal is provided on the installation surface 520 of the first-stage power supply module 52. In addition, a power line 70 of a power supply unit 7 is connected to the voltage input terminal E1 of the second-stage power supply module 54, and a conductive post 62 is connected to the first-stage power supply module 52 and the second-stage power supply module 54.

[0114] During the operation of the power supply system 5, an input voltage is transmitted to the voltage input terminal E1 of the second-stage power supply module 54 via the power line 70. The second-stage power supply module 54 is configured to convert the input voltage into an intermediate output voltage. The conductive post 62 is configured to transmit the intermediate output voltage from the second-stage power supply module 54 to the first-stage power supply module 52. The first-stage power supply module 52 is configured to convert the intermediate output voltage into a target output voltage. Then, the first-stage power supply module 52 provides the target output voltage to the processor 500 via a circuit wiring of the system board 50 from a plurality of power electrodes on the installation surface 520. In this embodiment, the first-stage power supply module 52 can be implemented by the above-mentioned power supply module 1, which will not be elaborated here. In addition, the second-stage power supply module 54 mainly consists of a main board, a control board, a transformer located between the main board and the control board, and other related voltage conversion components.

[0115] In this embodiment, the target output voltage is less than the intermediate output voltage, and the intermediate output voltage is less than the input voltage. For example, the input voltage can be 48V, the intermediate output voltage can be 6V, and the target output voltage can be 1V. It should be noted that the input voltage, the intermediate output voltage, and the target output voltage can be determined according to actual applications, and the present invention is not limited to the above embodiments.

[0116] In summary, in the power supply module of the present invention, the two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, so that the power components on the upper circuit board can transmit power to the system board connected to the lower circuit board. In one embodiment, the secondary windings can be electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board. In another embodiment, the secondary windings can be electrically connected in series via the lower circuit board and the system board. With the above configuration, the two primary windings and the two power switch components can form a two-phase power output or two output voltages. Thereby, the power supply module of the present invention can be stacked with the system board through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the power supply module is stacked with the system board, the power transmission path can be minimized to reduce the parasitic inductance and reduce the size of the system board. In addition, in the power supply system of the present invention, the system board, the first-stage power supply module, and the second-stage power supply module are stacked with each other through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the heat conduction structure is sandwiched between the first-stage power supply module and the second-stage power supply module, the heat conduction structure can dissipate heat from the first-stage power supply module and the second-stage power supply module.

[0117] The above are only the preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.

Claims

1. A power supply module includes at least one sub - power supply module, and each sub - power supply module includes: An upper circuit board; A lower circuit board disposed opposite to the upper circuit board. The lower circuit board has a plurality of power electrodes which are disposed on a mounting surface of the lower circuit board, and the plurality of power electrodes are configured to be mounted to a system board; and An inductor disposed between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board, and a lower surface of the inductor faces the lower circuit board. The inductor includes two primary windings and one secondary winding. Two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The secondary winding is electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board.

2. The power supply module according to claim 1, wherein two electrodes of each secondary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The inductor further includes two connection members. Two ends of each connection member are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, so that the secondary winding is electrically connected in series via the upper circuit board, the lower circuit board and the two connection members.

3. The power supply module according to claim 2, wherein the two connection members are disposed in a magnetic body of the inductor and are located on two opposite sides of the magnetic body.

4. The power supply module according to claim 1, wherein the inductor further includes two power conduction members, and two ends of each power conduction member are respectively disposed on the upper surface and the lower surface of the inductor.

5. The power supply module according to claim 4, wherein the two power conduction members are disposed in a magnetic body of the inductor and are located on two opposite sides of the magnetic body.

6. The power supply module according to claim 1 includes a plurality of sub - power supply modules, wherein the lower circuit boards of the plurality of sub - power supply modules are integrated into a single lower circuit board, and the upper circuit boards of the plurality of sub - power supply modules are separated from each other.

7. The power supply module according to claim 1, wherein two electrodes of each secondary winding are disposed on the upper surface of the inductor and are connected to the upper circuit board, so that the secondary winding is electrically connected in series via the upper circuit board.

8. The power supply module according to claim 1, wherein the sub - power supply module includes at least one control electrode configured to receive a control signal from a power component on the upper circuit board via a signal connection structure.

9. The power supply module according to claim 1, wherein the power supply module includes a power controller disposed on the upper circuit board. The power controller transmits a control signal to a power component on the upper circuit board via the upper circuit board. There is no control electrode disposed on the lower circuit board, and the control signal is only transmitted via the upper circuit board.

10. The power supply module according to claim 1, wherein the inductor is of a symmetric structure.

11. The power supply module as claimed in claim 1, wherein two power switches are disposed on the upper circuit board, and the two power switches are connected in series at a switch pad to form a half-bridge power element or a full-bridge power element.

12. The power supply module as claimed in claim 11, wherein the switch pad is electrically connected to one of the two electrodes of the primary winding disposed on the upper surface of the inductor, and the other of the two electrodes of the primary winding disposed on the lower surface of the inductor is electrically connected to an output electrode of the lower circuit board, and one of the two primary windings and one of the two power switches form a phase power output.

13. The power supply module as claimed in claim 1, further comprising a plurality of output capacitors, wherein a groove is formed on the lower surface of the inductor and configured to receive the plurality of output capacitors.

14. The power supply module as claimed in claim 1, further comprising a plurality of input capacitors embedded in the upper surface of the inductor.

15. The power supply module as claimed in claim 1, wherein the lower circuit board is provided with a plurality of output capacitors and no input capacitors, and the upper circuit board is provided with a plurality of input capacitors and no output capacitors.

16. A power supply module, comprising at least one sub-power supply module, each of the sub-power supply modules comprising: an upper circuit board; a lower circuit board disposed opposite to the upper circuit board, the lower circuit board having a plurality of power electrodes disposed on a mounting surface of the lower circuit board, and the plurality of power electrodes are configured to be mounted to a system board; and an inductor disposed between the upper circuit board and the lower circuit board, an upper surface of the inductor facing the upper circuit board, a lower surface of the inductor facing the lower circuit board, the inductor comprising two primary windings and two secondary windings, two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor and are respectively connected to the upper circuit board and the lower circuit board, two electrodes of each secondary winding are disposed on the lower surface of the inductor and are connected to the lower circuit board, such that the secondary winding is electrically connected in series with the system board via the lower circuit board.

17. The power supply module as claimed in claim 16, wherein a plurality of output capacitors are embedded in the lower circuit board.

Images