Method for drilling injector hole through laser to eliminate tungsten pollution
Through laser drilling and surface treatment methods, the problem of tungsten pollution is solved, and a glass syringe barrel without tungsten pollution is realized. It is suitable for high-precision and high gas barrier applications, improving production efficiency and product purity.
Patent Information
- Application Number
- CN202380082518.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-11-30
- Filing Date
- 2023-11-28
- Publication Date
- 2025-07-08
AI Technical Summary
Prior art In the process of forming glass syringe barrels, the use of tungsten nails to form holes leads to tungsten contamination, affecting the purity of the protein solution, and it is difficult to completely remove residual tungsten in the cleaning step, and there are different forms of contamination or brittleness problems in other metals or ceramic tips.
The hole is drilled through the tip of the syringe barrel with a first laser and the surface of the hole is treated with a second laser to remove glass defects and debris, avoid tungsten contamination, and the processing is performed using lasers of different wavelengths and pulse modes.
A glass syringe barrel without tungsten contamination is achieved, which improves production efficiency and product purity, avoids additional cleaning steps and brittleness problems of tungsten tips, and is suitable for high-precision and high gas barrier applications.
Smart Images

Figure CN120282934A_ABST
Abstract
Description
[0001] Cross - reference to related applications
[0002] This application claims the benefit of priority of U.S. Provisional Application Serial No. 63 / 428,936, filed on November 30, 2022, under 35 U.S.C.§119, the content of which is incorporated herein by reference in its entirety and made a part hereof. Background of the Invention
[0003] This disclosure generally relates to glass syringes, and more particularly, to glass syringes without tungsten contamination.
[0004] In certain applications, such as those requiring high precision and high gas barrier properties, it is advantageous to use syringes with glass barrels. However, conventional methods of forming glass syringe barrels involve using tungsten pins to form holes in the tips. The use of tungsten during syringe barrel formation can lead to tungsten contamination, which may cause aggregation and particle formation in protein solutions. Various attempts have been made to address tungsten contamination, including cleaning steps to try to remove residual tungsten and replacing tungsten tips with other metals or ceramics. Cleaning typically does not remove all residues and may thus cause unwanted reactions with the remaining tungsten. Tips made of other metals may lead to different forms of contamination, and tips made of ceramics are too brittle to be used for small - diameter holes. Summary of the Invention
[0005] According to aspect (1), a method is provided. The method includes: drilling a hole through a tip of a syringe barrel with a first laser to provide fluid communication with an internal cavity of the syringe barrel, the internal cavity being defined by a tubular wall of the syringe barrel; treating a surface of the hole with a second laser to remelt the surface of the hole; wherein the tubular wall and the tip comprise a glass material.
[0006] According to aspect (2), the method of aspect (1) is provided, wherein the first laser operates at a first wavelength and the second laser operates at a second wavelength, and wherein the first wavelength is different from the second wavelength.
[0007] According to aspect (3), the method of aspect (2) is provided, wherein the first wavelength is 1200 nm or shorter.
[0008] According to aspect (4), the method of aspect (3) is provided, wherein the first wavelength is in the ultraviolet or visible light range.
[0009] According to aspect (5), the method of aspect (4) is provided, wherein the first wavelength is 266 nm, 355 nm, or 532 nm.
[0010] According to aspect (6), there is provided a method according to any one of aspects (1) to (5), wherein drilling the hole further comprises pulsing the first laser with a pulse of 25 nanoseconds or less.
[0011] According to aspect (7), there is provided a method according to any one of aspects (2) to (6), wherein the second laser is a CO2 laser.
[0012] According to aspect (8), there is provided a method according to aspect (7), wherein the range of the second wavelength is from 9200 nm to 10600 nm.
[0013] According to aspect (9), there is provided a method according to any one of aspects (2) to (6), wherein the second laser is a CO laser.
[0014] According to aspect (10), there is provided a method according to aspect (9), wherein the range of the second wavelength is from 5200 nm to 6000 nm.
[0015] According to aspect (11), there is provided a method according to any one of aspects (1) to (10), wherein treating the surface of the hole comprises pulsing the second laser.
[0016] According to aspect (12), there is provided a method according to any one of aspects (1) to (10), wherein the second laser is a continuous wave laser.
[0017] According to aspect (13), there is provided a method according to any one of aspects (1) to (12), wherein drilling the hole further comprises tapering the hole from a first diameter at a first end of the tip to a second diameter at a first depth of the tip, the second diameter being less than the first diameter.
[0018] According to aspect (14), there is provided a method according to aspect (13), wherein drilling the hole further comprises tapering the hole from a second diameter at a second depth of the tip to a third diameter at a second end of the tip, the third diameter being greater than the second diameter.
[0019] According to aspect (15), there is provided a method according to any one of aspects (1) to (12), wherein the hole comprises a length and a diameter, and wherein the ratio of the length to the diameter is from 15:1 to 20:1.
[0020] According to aspect (16), there is provided a method according to aspect (15), wherein the diameter is 2 mm or less.
[0021] According to aspect (17), there is provided a method according to aspect (15) or (16), wherein the range of the length is from 5 mm to 10 mm.
[0022] According to aspect (18), there is provided a method according to any one of aspects (1) to (17), wherein drilling the hole is performed at room temperature.
[0023] According to aspect (19), there is provided a method according to any one of aspects (1) to (17), wherein the drilling of the hole is carried out at a temperature at or within 20 °C of the annealing temperature of the glass material.
[0024] According to aspect (20), there is provided a method according to aspect (19), wherein the temperature is lower than the softening point of the glass material.
[0025] According to aspect (21), there is provided a method according to any one of aspects (1) to (20), wherein, before drilling the hole, the method further comprises squeezing the tubular wall to reduce the diameter of the tubular wall, thereby forming a tip.
[0026] According to aspect (22), there is provided a method according to any one of aspects (1) to (21), wherein the drilling of the hole further comprises drilling a plurality of other holes parallel to the hole of the syringe barrel on a plurality of other syringe barrels using a plurality of other first lasers or by splitting the beam of a single first laser.
[0027] According to aspect (23), there is provided a method according to any one of aspects (1) to (22), wherein the treatment of the surface of the hole further comprises treating a plurality of other surfaces of a plurality of other holes parallel to the surface of the hole using a plurality of other second lasers or by splitting the beam of a single second laser.
[0028] According to aspect (24), there is provided a syringe barrel. The syringe barrel comprises: a tubular wall that defines an internal cavity; a tip that includes a first end, a second end, and a hole extending from the first end to the second end, the hole being in fluid communication with the internal cavity; wherein the tubular wall and the tip comprise a glass material; and wherein the hole comprises a surface region that is substantially free of tungsten.
[0029] According to aspect (25), there is provided a syringe barrel according to aspect (24), wherein the hole comprises a length and a diameter, and wherein the ratio of the length to the diameter is from 15:1 to 20:1.
[0030] According to aspect (26), there is provided a syringe barrel according to aspect (25), wherein the length ranges from 5 mm to 10 mm.
[0031] According to aspect (27), there is provided a syringe barrel according to aspect (25) or (26), wherein the diameter is 2 mm or less.
[0032] According to aspect (28), there is provided a syringe barrel according to aspect (27), wherein the diameter ranges from 0.4 mm to 0.8 mm.
[0033] According to aspect (29), there is provided a syringe barrel according to any one of aspects (24) to (28), wherein the hole comprises a first tapered region, the diameter of which decreases from the first end to a first depth of the tip.
[0034] According to aspect (30), there is provided a syringe barrel according to any one of aspects (24) to (29), wherein the hole includes a second tapered region, and the diameter of the second tapered region increases from a second depth of the tip to a second end of the tip.
[0035] According to aspect (31), there is provided a syringe barrel according to any one of aspects (24) to (30), wherein the glass material is aluminosilicate glass or borosilicate glass.
[0036] According to aspect (32), there is provided a syringe barrel according to any one of aspects (24) to (31), wherein the syringe barrel complies with ISO11040-4:2015.
[0037] According to aspect (33), there is provided a method of forming a syringe barrel. The method includes: pressing a glass material tube between a first former and a second former to form a tip; drilling a hole through the tip with a first laser that generates a first light beam having a first wavelength; and treating the surface of the hole with a second laser that generates a second light beam having a second wavelength, the second wavelength being different from the first wavelength.
[0038] According to aspect (34), there is provided the method of aspect (33), wherein the first wavelength is 1200 nm or shorter.
[0039] According to aspect (35), there is provided the method of aspect (33) or (34), wherein the second wavelength ranges from 5200 nm to 6000 nm or from 9200 nm to 10600 nm.
[0040] According to aspect (36), there is provided the method of any one of aspects (33) to (35), wherein drilling includes applying pulses to the first laser at a pulse of 25 nanoseconds or shorter.
[0041] According to aspect (37), there is provided the method of any one of aspects (33) to (36), wherein treating includes applying pulses to the second laser at a pulse of 25 nanoseconds or shorter.
[0042] According to aspect (38), there is provided the method of any one of aspects (33) to (37), wherein drilling is performed at a temperature below the softening point of the glass material.
[0043] According to aspect (39), there is provided the method of any one of aspects (33) to (38), wherein the hole includes a length and a diameter, and the ratio of the length to the diameter is from 15:1 to 20:1.
[0044] According to aspect (40), there is provided the method of any one of aspects (33) to (39), wherein during drilling, the first light beam is guided through a beam scanner that changes the angle at which the first light beam contacts the tip.
[0045] According to aspect (41), there is provided a method according to any one of aspects (33) to (40), wherein during processing, a second light beam is guided through a beam scanner that changes the angle at which the second light beam contacts the surface of the hole.
[0046] According to aspect (42), there is provided a method according to any one of aspects (33) to (41), which further comprises splitting a first light beam during drilling such that a plurality of holes are drilled in a plurality of tips in parallel.
[0047] According to aspect (43), there is provided a method according to any one of aspects (33) to (42), which further comprises splitting a second light beam during processing such that a plurality of surfaces of a plurality of holes are processed in parallel.
[0048] According to aspect (44), there is provided a method according to any one of aspects (33) to (43), wherein processing the surface of the hole further comprises remelting the glass material to a depth of at most 100 μm.
[0049] Additional features and advantages will be set forth in the detailed description which follows, and in part will be obvious from the description, or may be learned by practice of the embodiments described herein, which embodiments include the detailed description which follows, the claims, as well as the drawings.
[0050] It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide an overview or framework for understanding the nature and characteristics of the claims. BRIEF DESCRIPTION OF THE DRAWINGS
[0051] The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments and, together with the description, serve to explain the principles and operation of the various embodiments. In the drawings:
[0052] Figure 1 A syringe barrel according to an exemplary embodiment is depicted;
[0053] Figure 2 Depiction of according to an exemplary embodiment Figure 1 A detailed view of the tip of the syringe barrel shown in
[0054] Figure 3 A flowchart depicting a method for forming a syringe barrel according to an exemplary embodiment; and
[0055] Figure 4 A station for forming holes in a plurality of syringe barrels in parallel according to an exemplary embodiment is depicted. DETAILED DESCRIPTION
[0056] Embodiments of the present disclosure relate to a method for laser drilling a hole through the tip of a syringe barrel, and to a syringe barrel free of tungsten contamination produced according to the disclosed method. As will be described more fully below, the disclosed method involves laser drilling a hole through the tip of a syringe barrel using a first laser, and then treating the hole with a second laser to remove any defects and debris on the surface of the hole. In conventional methods for forming a hole in the tip of a syringe barrel, a glass tube is compressed around a tungsten pin, and contact between tungsten and glass can produce contamination that may adversely affect the contents of the syringe. Because no tungsten components are used in the disclosed formation method, tungsten contamination is avoided. These and other aspects and advantages of the disclosed syringe barrel and its formation method will be described in more detail below in conjunction with the accompanying drawings. These exemplary embodiments are provided by way of illustration and not limitation.
[0057] Figure 1 An embodiment of a syringe barrel 10 is depicted. The syringe barrel includes a tubular wall 12 defining an interior cavity 14. The syringe barrel 10 has a tip 16 at one end and a flange 18 at the other end. The syringe barrel 10 including the tubular wall 12, the tip 16 and the flange 18 is made of a glass material such as aluminosilicate glass. Other glass materials, such as borosilicate glass, can also be used for the syringe barrel 10. In one or more embodiments, the syringe barrel 10 can be combined with a needle (not shown) inserted into the tip 16 and combined in place, and a plunger (not shown) is inserted from the flange 18 end of the syringe barrel 10 into the interior cavity 14 to control the dispensing of the fluid contained in the syringe barrel 10.
[0058] Figure 2 A detailed view of the tip 16 of the syringe barrel 10 is depicted. The tip 16 has a first end 20, a second end 22, and a hole 24 extending from the first end 20 to the second end 22. The hole 24 is in fluid communication with the interior cavity 14. In addition, as will be discussed more fully below, the hole 24 has a surface area 26 that is substantially free of tungsten. In one or more embodiments, the surface area 26 of the hole 24 includes not only the surface of the hole 24, but also includes glass material up to a depth of 5 μm, up to a depth of 10 μm, up to a depth of 20 μm, up to a depth of 30 μm, up to a depth of 50, or up to a depth of 100 μm. In one or more embodiments, the entire tip 16 is substantially free of tungsten, and in one or more embodiments, the entire syringe barrel 10 is substantially free of tungsten. As used herein, "substantially free" means that there is no tungsten contamination on the surface of the hole 24, the tip 16, or the syringe barrel 10, respectively, and that within the glass material of the syringe barrel 10, the glass material contains no more than an impurity amount (e.g., 0.5 mol% or less, 0.05 mol% or less, or 0.005 mol% or less) of tungsten, if any.
[0059] In one or more embodiments, the bore 24 includes a first tapered region 28, the first diameter D1 of which decreases from a first end 20 to a first depth d1 at the tip 16. In one or more embodiments, the bore 24 includes a second tapered region 30, the second diameter D2 of which increases from a second depth d2 at the tip to a second end 22 of the tip 16. In one or more embodiments, the bore 24 has a central region 32 between the first tapered region 28 and the second tapered region 30, which extends from the first depth d1 to the second depth d2. The central region 32 of the bore 24 has a generally constant third diameter D3.
[0060] In one or more embodiments, the first tapered region 28 has a surface that forms a first angle of up to 15°, up to 30°, or up to 45° with respect to the longitudinal axis 34 of the syringe barrel 10. In one or more embodiments, the second tapered region 30 has a surface that forms a second angle of up to 15°, up to 30°, or up to 45° with respect to the longitudinal axis 34 of the syringe barrel 10. In one or more embodiments, the first angle of the first tapered region 28 is the same as the second angle of the second tapered region 30. In one or more embodiments that include Figure 2 one or more of the embodiments depicted therein, the first angle of the first tapered region 28 is different from the second angle of the second tapered region 30.
[0061] In one or more embodiments, the syringe barrel 10 complies with ISO 11040-4:2015. This standard establishes the overall length of the syringe barrel 10, the thickness of the tubular wall 12, the length of the tubular wall 12, the outer diameter of the tubular wall 12, and the inner diameter of the internal cavity 14 based on the nominal volume of the syringe barrel 10. The length L and the third diameter D3 of the bore 24 can be set according to customer specifications. In one or more embodiments, the ratio of the length L to the third diameter D3 is from 15:1 to 20:1. In one or more embodiments, the length L ranges from 5 mm to 10 mm. In one or more embodiments, the third diameter D3 is 2 mm or less, specifically in the range from 0.4 mm to 0.8 mm. In one or more embodiments, the accuracy of the third diameter D3 is ±0.050 mm.
[0062] Figure 3A flowchart depicting a method 100 for forming a syringe barrel 10 such that the hole 24 is substantially free of tungsten contamination. In a first step 110 of the method 100, the end of a glass tube 112 is extruded between a first former 114 and a second former 116 to reduce the diameter of the tube 112 to form a tip 16, and the remainder of the tube 112 forms a tubular wall 12 of the syringe barrel 10. In one or more embodiments, a continuous tube 112 of glass material is extruded and cut into segments formed between formers 114, 116.
[0063] In a conventional syringe molding method, a tungsten pin is inserted into the tip while the former presses against the outer surface of the glass tube to form a hole. However, the contact between tungsten and glass can cause the glass to be contaminated with tungsten after the tungsten pin is removed. According to the present disclosure, the hole 24 is not formed simultaneously with the tip 16.
[0064] Instead, in a second step 120, a hole 24 is drilled through the tip 16 of the syringe barrel 10 with a first laser 122 to provide fluid communication with an internal cavity 14 of the syringe barrel 10. In one or more embodiments, the hole 24 is drilled at room temperature. In one or more other embodiments, the hole 24 is drilled at an elevated temperature. In one or more embodiments, the elevated temperature is below the softening point of the glass material. In one or more embodiments, the drilling 24 is performed at or within 20 °C of the annealing temperature of the glass material. Further, while the term "drilling" is used herein to describe the process of forming the hole 24 with the first laser 122, the specific removal mechanism may be more accurately described as ablation. When ablating material from the formed hole 24, the focus of the first laser 122 is scanned and translated deeper into the tip 16.
[0065] In one or more embodiments, the first laser 122 operates at a first wavelength. In one or more embodiments, the first wavelength is 1200 nm or shorter. In one or more embodiments, the first wavelength is in the ultraviolet or visible range. In one or more embodiments, the first wavelength is approximately 266 nm, approximately 355 nm, or approximately 532 nm.
[0066] In one or more embodiments, the first laser 122 is pulsed. In one or more embodiments, the first laser 122 is pulsed with a pulse of 25 nanoseconds or shorter, preferably 1 nanosecond or shorter. In one or more embodiments, the first laser 122 is a continuous wave laser.
[0067] As described above, the hole 24 can taper at one or both ends of the tip 16. Thus, in one or more embodiments, the hole 24 is drilled such that the hole 24 begins to taper at the first end 20 of the tip 16 and / or at the second end 22 of the tip 16. In one or more embodiments, the tapering of the tip 16 is achieved by angling the first laser 122 relative to the syringe barrel 10. In one or more embodiments, the tapering of the tip 16 is achieved by inserting a beam scanner between the first laser 122 and the syringe barrel 10 such that the beam scanner changes the angle at which the laser beam contacts the tip 16. Additionally, although Figure 3 the first laser 122 is depicted as being disposed on the first end 20 of the tip 16, the first laser 122 can alternatively be positioned such that the beam from the first laser 122 initially contacts the second end 22 of the tip 16. Additionally, two first lasers 122 can be used to drill the hole 24 from each end 20, 22 of the tip 16.
[0068] In the third step 130 of the method 100, the surface of the hole 24 is treated with a second laser 132 to remelt the surface region of the hole 24. Specifically, the beam from the second laser 132 scans over the surface region of the hole 24. In this manner, glass defects and debris are removed from the laser-drilled hole 24. Treatment with the second laser 132 can treat depths of up to 5 μm, up to 10 μm, up to 20 μm, up to 30 μm, up to 50 μm, or up to 100 μm. In one or more embodiments, the second laser 132 operates at a second wavelength. In one or more embodiments, the second wavelength is different from the first wavelength. In one or more embodiments, the second laser has a second wavelength in the range of 9200 nm to 10600 nm. In one or more embodiments, the second laser is a CO2 laser. In one or more embodiments, the second laser has a second wavelength in the range of 5200 nm to 6000 nm. In one or more embodiments, the second laser is a CO laser.
[0069] In one or more embodiments, the second laser 132 is pulsed. In one or more embodiments, the second laser 132 is pulsed with a pulse of 25 nanoseconds or shorter, preferably 1 nanosecond or shorter. In one or more embodiments, the second laser is a continuous wave laser.
[0070] In one or more embodiments, the second laser 132 is angled relative to the syringe barrel 10 to treat the tapered region of the hole 24. In one or more embodiments, a beam scanner is inserted between the second laser 132 and the syringe barrel 10 such that the beam scanner changes the angle at which the laser beam of the second laser 132 contacts the surface region of the hole 24. Additionally, althoughFigure 3 Depict a second laser 132 disposed on the first end 20 of the tip 16, but the second laser 132 can alternatively be positioned such that the second laser 132 processes the surface area of the hole 24 from the second end 22 of the tip 16. Additionally, two second lasers 132 can be used to process the surface area of the hole 24 from each end 20, 22 of the tip 16.
[0071] In one or more embodiments, the hole 24 can be drilled in each syringe barrel 10 in 20 seconds or less, particularly in 5 seconds or less. Conventional syringe molding techniques allow for the formation of a hole in the syringe tip while forming the tip. The production rate in such processes can be, for example, approximately 50 syringe barrels per minute. However, as described above, such syringe barrels have tungsten contamination, and in order to reduce tungsten contamination, an additional cleaning step is required, thus slowing down the syringe barrel molding process. Additionally, the tungsten tip corrodes rapidly and must be replaced regularly, for example, every few hours of operation. Alternatively, using a ceramic tip to form a hole is limited in terms of the diameter size of the hole (>1 mm) because small diameter ceramic tips are prone to breakage.
[0072] Nonetheless, according to one or more embodiments, to increase the production rate, the holes 24 can be laser drilled in parallel on several tips 16 of the syringe barrel 10, as Figure 4 shown. In one or more such embodiments, multiple first lasers 122 are used and / or the beam from a single first laser 122 is split such that multiple holes 24 can be drilled in parallel. In Figure 4 the embodiment shown, a single first laser beam 122 is used and the beam from the first laser beam 122 is split to drill multiple holes 24. Additionally, in one or more embodiments, the processing using the second laser 132 is also performed in parallel with the use of multiple second lasers 132 and / or by splitting the beam from a single second laser 132. In Figure 4 the embodiment shown, a single second laser 132 is used and the beam from the second laser beam 132 is split to process multiple holes 24. Additionally, as described above, one or more first lasers 122 can be positioned on each end of the syringe barrel 10, and similarly, one or more second lasers 132 can be positioned on each end of the syringe barrel 10. Additionally, as Figure 4 shown, each beam can be directed through a beam scanner 140 to control the position of the beam focus, for example, to taper the hole 24 or to process the conical surface of the hole 24.
[0073] In addition, particularly for non-tapered holes 24 or holes 24 that taper only at one end, the first laser 122 and the second laser 132 can be arranged on opposite sides of the hole 24. In this way, the first laser 122 can drill the hole 24 from one side, and the second laser 132 can process the hole 24 from the opposite side. In this way, one or more syringe barrels 10 do not need to travel to multiple stations to form the hole 24. In addition, the processing using the second laser 132 can be performed faster compared to the case where the syringe barrel 10 has to travel to different stations.
[0074] Although not depicted in Figure 3 it, the flange 18 (as Figure 1 shown therein) can be formed by heating the end of the syringe barrel 10 and squeezing the heated end of the syringe barrel 10 against the former.
[0075] The syringe barrel 10 produced in accordance with the present disclosure is substantially free or even completely free of tungsten contamination because tungsten is not introduced as in the conventional process by forming the hole 24 in the tip 16.
[0076] Unless otherwise expressly stated, no method set forth herein is intended to be construed as requiring that its steps be performed in a particular order. Accordingly, where a method claim does not actually recite an order to be followed by its steps or where no particular order is otherwise specifically set forth in the claims or description, no inference of any particular order is intended. Additionally, as used herein, the article "a" is intended to include one or more than one component or element and is not to be construed as meaning only one.
[0077] It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope or spirit of the disclosed embodiments. Since modifications, combinations, sub-combinations and variations of the disclosed embodiments in the spirit and substance of the combined embodiments can be conceived by those skilled in the art, the disclosed embodiments should be construed to include all such within the scope of the appended claims and their equivalents.
Claims
1. A method, comprising: drilling a hole through the tip of a syringe barrel with a first laser to provide fluid communication with an internal cavity of the syringe barrel, the internal cavity being defined by a tubular wall of the syringe barrel; processing a surface of the hole with a second laser to remelt the surface of the hole; wherein the tubular wall and the tip comprise a glass material.
2. The method according to claim 1, wherein the first laser operates at a first wavelength, the second laser operates at a second wavelength, and wherein the first wavelength is different from the second wavelength.
3. The method according to claim 2, wherein the first wavelength is 1200 nm or shorter.
4. The method according to claim 3, wherein the first wavelength is in the ultraviolet or visible light range.
5. The method according to claim 4, wherein the first wavelength is 266 nm, 355 nm or 532 nm.
6. The method according to any one of claims 1 to 5, wherein drilling the hole further comprises pulsing the first laser with a pulse of 25 nanoseconds or shorter.
7. The method according to any one of claims 2 to 6, wherein the second laser is a CO2 laser.
8. The method according to claim 7, wherein the second wavelength ranges from 9200 nm to 10600 nm.
9. The method according to any one of claims 2 to 6, wherein the second laser is a CO laser.
10. The method according to claim 9, wherein the second wavelength ranges from 5200 nm to 6000 nm.
11. The method according to any one of claims 1 to 10, wherein processing the surface of the hole comprises pulsing the second laser.
12. The method according to any one of claims 1 to 10, wherein the second laser is a continuous wave laser.
13. The method according to any one of claims 1 to 12, wherein drilling the hole further comprises tapering the hole from a first diameter at a first end of the tip to a second diameter at a first depth of the tip, the second diameter being smaller than the first diameter.
14. The method according to claim 13, wherein drilling the hole further comprises tapering the hole from the second diameter at a second depth of the tip to a third diameter at a second end of the tip, the third diameter being larger than the second diameter.
15. The method according to any one of claims 1 to 12, wherein the hole comprises a length and a diameter, and wherein the ratio of the length to the diameter is from 15:1 to 20:
1.
16. The method according to claim 15, wherein the diameter is 2 mm or shorter.
17. The method according to claim 15 or claim 16, wherein the length ranges from 5 mm to 10 mm.
18. The method according to any one of claims 1 to 17, wherein drilling the hole is performed at room temperature.
19. The method according to any one of claims 1 to 17, wherein drilling the hole is carried out at a temperature at or within 20 °C of the annealing temperature of the glass material.
20. The method according to claim 19, wherein the temperature is lower than the softening point of the glass material.
21. The method according to any one of claims 1 to 20, wherein, Before drilling the hole, the method further comprises squeezing the tubular wall to reduce the diameter of the tubular wall, thereby forming the tip.
22. The method according to any one of claims 1 to 21, wherein drilling the hole further comprises using a plurality of other first lasers or by splitting the beam of a single first laser to drill a plurality of other holes parallel to the hole of the syringe barrel on a plurality of other syringe barrels.
23. The method according to any one of claims 1 to 22, wherein treating the surface of the hole further comprises using a plurality of other second lasers or by splitting the beam of a single second laser to treat a plurality of other surfaces of a plurality of other holes parallel to the surface of the hole.
24. A syringe barrel, comprising: A tubular wall that defines an internal cavity; A tip that includes a first end, a second end, and a hole extending from the first end to the second end, the hole being in fluid communication with the internal cavity; Wherein the tubular wall and the tip comprise a glass material; and Wherein the hole comprises a surface region that is substantially free of tungsten.
25. The syringe barrel according to claim 24, wherein the hole has a length and a diameter, and wherein the ratio of the length to the diameter is from 15:1 to 20:
1.
26. The syringe barrel according to claim 25, wherein the length ranges from 5 mm to 10 mm.
27. The syringe barrel according to claim 25 or claim 26, wherein the diameter is 2 mm or less.
28. The syringe barrel according to claim 27, wherein the diameter ranges from 0.4 mm to 0.8 mm.
29. The syringe barrel according to any one of claims 24 to 28, wherein the hole comprises a first tapered region, the diameter of which decreases from the first end to a first depth of the tip.
30. The syringe barrel according to any one of claims 24 to 29, wherein the hole comprises a second tapered region, the diameter of which increases from a second depth of the tip to the second end of the tip.
31. The syringe barrel according to any one of claims 24 to 30, wherein the glass material is aluminosilicate glass or borosilicate glass.
32. The syringe barrel according to any one of claims 24 to 31, wherein the syringe barrel complies with ISO11040-4:2015.
33. A method of forming a syringe barrel, the method comprising: Pressing a glass material tube between a first former and a second former to form a tip; Drilling a hole through the tip with a first laser, the first laser generating a first beam having a first wavelength; The surface of the hole is treated with a second laser that produces a second light beam having a second wavelength different from the first wavelength.
34. The method according to claim 33, wherein the first wavelength is 1200 nm or shorter.
35. The method according to claim 33 or claim 34, wherein the second wavelength ranges from 5200 nm to 6000 nm or from 9200 nm to 10600 nm.
36. The method according to any one of claims 33 to 35, wherein drilling the hole includes applying a pulse to the first laser at a pulse of 25 nanoseconds or shorter.
37. The method according to any one of claims 33 to 36, wherein treating includes applying a pulse to the second laser at a pulse of 25 nanoseconds or shorter.
38. The method according to any one of claims 33 to 37, wherein drilling is performed at a temperature below the softening point of the glass material.
39. The method according to any one of claims 33 to 38, wherein the hole includes a length and a diameter, and wherein the ratio of the length to the diameter is from 15:1 to 20:
1.
40. The method according to any one of claims 33 to 39, wherein during drilling, the first light beam is guided through a beam scanner that changes the angle at which the first light beam contacts the tip.
41. The method according to any one of claims 33 to 40, wherein during treatment, the second light beam is guided through a beam scanner that changes the angle at which the second light beam contacts the surface of the hole.
42. The method according to any one of claims 33 to 41, further comprising splitting the first light beam during drilling such that a plurality of holes are drilled in a plurality of tips in parallel.
43. The method according to any one of claims 33 to 42, further comprising splitting the second light beam during treatment such that a plurality of surfaces of a plurality of holes are treated in parallel.
44. The method according to any one of claims 33 to 43, wherein treating the surface of the hole further comprises remelting the glass material to a depth of up to 100 μm.