Wafer detection device

Abstract

The invention relates to a wafer detection device, and relates to the technical field of wafer detection. The supporting seat and the detection instrument are arranged on the detection table, the driving piece is used for driving the supporting seat to move on the detection table in the specified direction, the detection instrument and the driving piece are both controlled by the controller, and the supporting seat is used for placing a wafer; the detection instrument is used for detecting the wafer and outputting a detection result to the controller, and the detection result at least comprises the offset of the supporting seat relative to the preset reference position; the controller is used for controlling the driving part to drive the supporting seat to move to a reference position based on a detection result of the detection instrument, so that the detection instrument can realize complete detection on the wafer placed on the supporting seat; the controller is also used for outputting a detection result corresponding to the wafer at the reference position, so that a detector obtains the detection result; the wafer detection position control method and device have the effect of accurately and efficiently regulating and controlling the wafer detection position.

Description

Technical Field

[0001] This application relates to the technical field of wafer detection, and particularly to a wafer detection device. Background Art

[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. The raw material of the wafer is silicon. The wafer is manufactured by melting polysilicon, then planting a seed crystal in the melt, and then slowly pulling it out to form a cylindrical single-crystal silicon ingot. After the silicon ingot is cut, ground, sliced, chamfered, polished, laser engraved, and packaged, it becomes the basic raw material of the circuit factory - a silicon wafer, that is, a wafer. Since wafers are extremely vulnerable to damage, wafers need to be detected during the manufacturing process to ensure the quality of the wafers.

[0003] Among them, the detection operation of the wafer at least includes the appearance detection of the wafer. Specifically, the wafer is placed on the detection platform, and a camera device, an amplifier, etc. are used to capture the surface image of the wafer. Then, the controller obtains and analyzes the aforementioned wafer surface image, and compares the wafer surface image with a preset qualified wafer image to determine whether there are unqualified conditions on the wafer appearance (such as surface contamination, structural defects, etc.).

[0004] In view of the above related technologies, since wafers generally have different sizes such as 4 inches, 6 inches, and 8 inches, when it is necessary to switch sizes to detect wafers of different sizes, it is necessary to adjust the position of the wafer on the detection platform so that the imaging range of the camera device can accurately cover the entire wafer. And the aforementioned adjustment operation is generally manually controlled, not only the adjustment progress is not high, but also the detection efficiency is easily affected by human operation, so it needs to be improved. Summary of the Invention

[0005] In order to achieve precise and efficient control of the wafer detection position, this application provides a wafer detection device.

[0006] A wafer detection device provided by this application includes a detection table, a support seat and a detection instrument arranged on the detection table, and a driving member for driving the support seat to move along a specified direction on the detection table. It also includes a controller. The detection instrument and the driving member are both controlled by the controller. The support seat is used to place the wafer; the detection instrument is used to detect the wafer and output a detection result to the controller. Among them, the detection result at least includes the offset of the support seat relative to a preset reference position; the controller is used to control the driving member to drive the support seat to move to the reference position based on the detection result of the detection instrument, so that the detection instrument can completely detect the wafer placed on the support seat; the controller is also used to output the detection result corresponding to the wafer at the reference position, so that the detection personnel can obtain the detection result.

[0007] By adopting the above technical solution, the controller determines the offset of the current support base relative to the reference position based on the captured image of the camera instrument included in the detection instrument. Here, the reference position can be considered as the position where the detection instrument can achieve a complete detection of the wafer, and the driving member is automatically controlled by the offset to drive the support base to move to the reference position, so that the detection instrument can achieve a complete detection of the wafer, realizing efficient and accurate regulation of the wafer position.

[0008] Preferably, it further includes a carrier plate. The wafer is arranged in the middle of the carrier plate. A plurality of clamping blocks and a moving member for driving all the clamping blocks to move in a direction close to or away from each other are also arranged on the support base. The clamping blocks are used to simultaneously press against the peripheral wall of the carrier plate during the process of being driven by the moving member and approaching each other, so as to fix the carrier plate on the support base.

[0009] By adopting the above technical solution, the arrangement of the clamping blocks and the moving member enables the support base to be applicable to the positioning of wafers of different sizes. At the same time, the clamping of the clamping blocks can be used to improve the placement stability of the wafer on the support base, further ensuring that the support base can always be in the reference position during the detection process, indirectly ensuring the detection accuracy of the wafer.

[0010] Preferably, the carrier plate includes a support ring plate, and a first transparent plate and a second transparent plate distributed up and down on the support ring plate. A placement space for placing the wafer is reserved between the first transparent plate and the second transparent plate. The first transparent plate is rotatably connected to the support ring plate; it further includes a flipping member, and the flipping member is used to drive the support ring plate to rotate to adjust the up and down positions of the first transparent plate and the second transparent plate.

[0011] By adopting the above technical solution, wafer detection often involves detecting both sides of the wafer separately. To improve the detection efficiency, this application specially designs a carrier plate that is transparent on both sides and a flipping member for driving the carrier plate to flip, so as to achieve efficient double-sided switching and detection of the wafer.

[0012] Preferably, a magnetic member for magnetic attraction and fixation is commonly connected between the first transparent plate and the support ring plate.

[0013] By adopting the above technical solution, the magnetic member is arranged to fix the rotational position of the first transparent plate relative to the support ring plate, so that the first transparent plate and the second transparent plate cooperate with each other to stably place the wafer in the placement space.

[0014] Preferably, the flipping member comprises a telescopic member, a first rack, a second rack, a transmission gear, a rotating rod and a flipping motor; the rotating rod is connected to the outer wall of the supporting ring plate, the driving end of the flipping motor is connected to the end of the rotating rod, and a notch is provided on the top of the clamping block for the rotating rod to rotate and slide; the telescopic member and the clamping block are arranged in a one-to-one correspondence and connected to the lower surface of the corresponding clamping block, and the moving member is used to drive the telescopic member to move in a direction of approaching or moving away from each other; The first rack is connected to the lower end of the telescopic component so as to move with the movement of the movable member of the telescopic component. The second rack is connected to the upper end of the telescopic component, and the length direction of the second rack and the telescopic direction of the telescopic component are parallel to the height direction of the support seat. The transmission gear is rotatably connected to the support seat, and the first rack and the second rack are jointly meshed with the transmission gear; when the clamping block is pressed against the peripheral wall of the support ring plate, the length of the telescopic component forms a clearance space between the carrier plate and the bottom wall of the support seat for the carrier plate to flip over.

[0015] By adopting the above technical scheme, in the process of using the clamping block to clamp and fix the carrier, the telescopic component will drive the carrier to move upward as a whole, so that a clearance space is reserved between the carrier and the bottom wall of the support seat for subsequent flipping of the carrier. In addition, since the height of the clearance space depends on the moving stroke of the clamping block, and the moving stroke of the clamping block depends on the size of the wafer, that is, for wafers of different sizes, the corresponding clearance space is different, that is, the distance between the wafer and the detection instrument is different, the adaptive adjustment of the detection distance between the detection instrument and wafers of different sizes can be simultaneously achieved by driving the moving part.

[0016] Preferably, the first transparent plate and the second transparent plate respectively include a movable plate and a fixed ring plate located at the periphery of the movable plate, the fixed ring plate is connected to the inner side of the supporting ring plate, and the movable plate is connected to the inner side of the fixed ring plate by a spring and slides along the height direction of the fixed ring plate; the inner wall of the supporting ring plate is provided with a buffer ring layer along its circumference, and the buffer ring layer is located at the periphery of the movable plate; a push rod is provided on the side wall of the clamping block facing the carrier plate, and when the push rod slides as the clamping block is driven by the moving part, the push rod is used to penetrate the fixed ring plate and press the corresponding movable plate, so that the corresponding movable plate slides in the direction close to the wafer and fits against the peripheral wall of the buffer ring layer, and at this time the spring between the movable plate and the fixed ring plate is deformed.

[0017] By adopting the above technical solution, while the clamping block clamps the fixed carrier plate, the movement of the clamping block is used to move the push rod and press down the movable plate, so that the movable plate is displaced relative to the fixed ring plate and moves to a position that fits the buffer ring layer, so as to further reinforce the wafer position with the help of the friction resistance between the buffer ring layer and the movable plate, so that the wafer can be firmly maintained at the reference position, reducing the problem of wafer shaking during the detection process.

[0018] Preferably, the surfaces of the first transparent plate and the second transparent plate are both provided with positioning grooves for inserting wafers, and the inner walls and peripheral walls of the positioning grooves are in contact with the side walls of the wafers.

[0019] By adopting the above technical solution, the placement position of the wafer on the first transparent plate and the second transparent plate is limited by the positioning groove, so as to further reduce the influence of the wafer position deviation during the flipping process of the carrier plate.

[0020] Preferably, the detection result includes at least a wafer image and a rotating part, wherein the rotating part is used to drive the first transparent plate and the second transparent plate to rotate respectively, and the rotating part is controlled by a controller. The controller is used to control the detection instrument to collect the wafer surface image with the first transparent plate and the second transparent plate during the rotation of the first transparent plate and the second transparent plate, and extract the glass image based on the wafer surface image, and then process the wafer image based on the glass image to obtain the wafer image after removing the glass image.

[0021] By adopting the above technical solution, during the rotation of the first transparent plate and the second transparent plate, an image of the wafer surface taken through the first transparent plate and the second transparent plate is captured, and the wafer surface image is analyzed to extract a glass image therefrom. The glass image here refers to dirt remaining on the glass surface, and the wafer image is then processed to delete the aforementioned dirt image. This operation can improve the problem of affecting the wafer yield rate due to the contamination of the first transparent plate and / or the second transparent plate itself during the wafer inspection process.

[0022] Preferably, the push rod is used to penetrate the upper fixed ring plate and press the corresponding movable plate, so that the corresponding movable plate slides in the direction close to the wafer and fits against the peripheral wall of the buffer ring layer; the inner wall of the support ring plate is rotatably connected with a docking gear, and the docking gear is connected with a driving motor for driving it to rotate; the lower surface of the movable plate is provided with a tooth groove along its circumference, and when the movable plate moves and fits against the buffer ring layer, the movable plate meshes with the docking gear through the tooth groove, the inner wall of the fixed ring plate is provided with a limiting groove and an annular groove connected to the limiting groove, and the side wall of the movable plate is provided with a movable block, when the spring is not deformed, the movable block is inserted in the limiting groove, and when the movable plate fits against the buffer ring layer, the movable block moves from the limiting groove to the annular groove.

[0023] By adopting the above technical solution, when the movable plate is pressed by the push rod and slides relative to the corresponding supporting ring plate and fits against the buffer ring layer, the movable block moves from the limiting groove to the ring groove, so that the movable plate can rotate relative to the fixed ring plate. At this time, since the docking gear is engaged with the lower surface of the movable plate, when the driving motor is started, the movable plate can realize self-rotation.

[0024] Preferably, when the detection result is abnormal, the controller is configured to calibrate the abnormal position based on the detection result and output a warning message with the abnormal position and its corresponding abnormal type.

[0025] By adopting the above technical solution, while realizing the detection, the abnormal situation is automatically calibrated and displayed, further improving the efficiency and intelligence of the wafer detection.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The controller determines the offset of the current support base relative to the reference position based on the captured image of the imaging instrument included in the detection instrument. Here, the reference position can be considered as the position where the detection instrument can achieve a complete detection of the wafer. And the driving member is automatically controlled by the offset to drive the support base to move to the reference position, so that the detection instrument can achieve a complete detection of the wafer, realizing an efficient and accurate regulation of the wafer position; 2. The present application proposes to set a flipping member to realize the flipping of the wafer for double-sided detection, efficiently switching the detection surface. At the same time, a transparent carrier plate is designed to load the wafer to cooperate with the realization of double-sided detection of the wafer. Meanwhile, the present application also uses image processing technology to solve the problem that the dirt on the structure of the transparent carrier plate itself affects the accuracy and yield of the appearance detection of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. is a schematic structural diagram of a wafer detection device disclosed in an embodiment of the present application.

[0028] Figure 2 FIG. is a structural block diagram of a wafer detection device disclosed in an embodiment of the present application.

[0029] Figure 3 FIG. is a schematic diagram for embodying the structure of the carrier plate in an embodiment of the present application.

[0030] Figure 4 is Figure 3 a cross-sectional view taken along line A-A in FIG.

[0031] Figure 5 is Figure 4 a cross-sectional view taken along line B-B in FIG.

[0032] Figure 6 FIG. is a schematic diagram for embodying the structure of the moving member and the clamping block in an embodiment of the present application.

[0033] Description of reference numerals: 1. Detection table; 2. Support seat; 21. Clamping block; 211. Flexible pad; 212. Pushing rod; 22. Wafer; 3. Driving member; 31. First linear motor module; 32. First sliding seat; 33. Second linear motor module; 34. Rotary motor; 4. Controller; 5. Detection instrument; 6. Carrier plate; 61. Support ring plate; 611. Magnetic member; 62. First transparent plate; 62. Second transparent plate; 63. Positioning groove; 64. Fixed ring plate; 641. Limit groove; 642. Ring groove; 643. Buffer layer; 65. Movable plate; 651. Movable block; 652. Spring; 7. Moving member; 8. Flipping member; 81. Telescopic member; 82. First rack; 83. Second rack; 84. Driving gear; 85. Rotating rod; 86. Flipping motor; 9. Rotating member; 91. Driving motor; 92. Docking gear. Detailed implementation manners

[0034] The following will further elaborate on this application in conjunction with the attached Figures 1-6 drawings.

[0035] An embodiment of this application discloses a wafer detection device. Refer to Figure 1 and Figure 2 , the wafer detection device includes a detection table 1, a driving member 3, a controller 4, and a detection instrument 5. Among them, a support seat 2 is slidably connected to the detection table 1, and the driving member 3 is used to drive the support seat 2 to move in a specified direction. Exemplarily, the specified directions disclosed in the embodiment of this application include Figure 1 the three directions indicated by arrow X, arrow Y, and arrow Z in the figure; specifically, the driving member 3 includes a first linear motor module 31 that reciprocally slides along the direction of arrow X, a first sliding seat 32 disposed on the slide table of the first linear motor module 31, a second linear motor module 33 along the first sliding seat 32, and a rotary motor 34 disposed on the slide table of the second linear motor module 33; wherein, the driving direction of the second linear motor module 33 is the direction indicated by arrow Y, and the support seat 2 is installed at the driving end of the rotary motor 34 to be driven by the rotary motor 34 to rotate clockwise or counterclockwise along the direction of arrow Z.

[0036] The detection instrument 5 includes a camera instrument and an amplifier, and the detection instrument 5 is facing a preset reference position on the detection table 1 for taking an image of the reference position. The controller 4 is electrically connected to the detection instrument 5 and the driving member 3. The controller 4 can specifically be a PLC controller, which is used to receive the initial image taken by the detection instrument 5 and determine the deviation amount of the center of the bearing seat 2 relative to the center of the reference position according to the position of the bearing seat 2 in the initial image. The deviation amount can be represented in coordinate form (for example, (A, -B) means moving A length in the X direction and moving B length in the direction opposite to the Y direction. Here, the "-" can be used to represent the positive or negative direction of the X or Y direction). Then, according to this deviation amount, the driving member 3 is controlled to drive the bearing seat 2 to move so that the center of the bearing seat 2 coincides with the center of the preset reference position.

[0037] Referring to Figure 3 、 Figure 4 and Figure 5 , a carrier plate 6 is arranged on the bearing seat 2. The carrier plate 6 is a carrier for placing the wafer 22, and different sizes of wafers 22 correspond to different sizes of carrier plates 6. The carrier plate 6 specifically includes a support ring plate 61, and a first transparent plate 62 and a second transparent plate 62 distributed up and down on the support ring plate 61. The first transparent plate 62 is rotatably connected to the support ring plate 61, and magnetic members 611 for magnetic fixation are jointly embedded in the side walls of the first transparent plate 62 and the support ring plate 61 facing each other. The magnetic members 611 can specifically be magnet blocks. A placement space for placing the wafer 22 is reserved between the first transparent plate 62 and the second transparent plate 62, and positioning grooves 63 for inserting the wafer 22 are respectively formed at the positions of the first transparent plate 62 and the second transparent plate 62 facing the placement space. The wafer 22 is only inserted into the lower positioning groove 63 under its own weight, that is, the thickness of the wafer 22 is not greater than the depth of a single positioning groove 63, and the peripheral wall of the wafer 22 is attached to the inner wall of the positioning groove 63.

[0038] Further, referring to Figure 4 and Figure 5The first transparent plate 62 and the second transparent plate 62 further specifically include a movable plate 65 and a fixed ring plate 64 located outside the movable plate 65, respectively. A limiting groove 641 is provided on the inner wall of the fixed ring plate 64. One end of the limiting groove 641 near the placement space is connected with an annular groove 642. The annular groove 642 is provided along the circumferential direction of the inner wall of the fixed ring plate 64. A spring 652 is connected between the movable plate 65 and the fixed ring plate 64. A movable block 651 is also integrally formed on the side wall of the movable plate 65 facing the fixed ring plate 64. When the spring 652 is not deformed, the movable block 651 is inserted into the limiting groove 641. The inner wall of the support ring plate 61 is also fixedly connected with a buffer ring layer 643 along its circumference. The buffer ring layer 643 is located on the side of the fixed ring plate 64 facing the placement space. When the movable plate 65 has a limiting groove 641 and moves into the ring groove 642, the spring 652 is deformed, and the movable plate 65 moves relative to the fixed ring plate 64 and moves toward the placement space, and moves to a position that fits the inner wall of the buffer ring layer 643.

[0039] Reference Figure 3 and Figure 6 , further comprising a moving part 7 and a flipping part 8, wherein the flipping part 8 comprises a telescopic part 81, a first rack 82, a second rack 83, a transmission gear 84, a rotating rod 85 and a flipping motor 86; the telescopic part 81 can be specifically a telescopic sleeve, and the telescopic parts 81 can be several and symmetrically arranged in pairs, and the moving part 7 can be specifically a motor screw rod combination structure, and each pair of telescopic parts 81 corresponds to a moving part 7, and the screw rod contained in each corresponding moving part 7 is a bidirectional screw rod; the bidirectional screw rod is threadedly connected to the sleeve at the lower end of the telescopic part 81, the first rack 82 is connected to the sleeve at the lower end of the telescopic part 81, and the length direction of the first rack 82 is parallel to the length direction of the bidirectional screw rod. The length direction of the second rack 83 is parallel to the telescopic direction of the telescopic part 81, and one end thereof is connected to the side wall of the telescopic rod at the upper end of the telescopic part 81 through the telescopic sleeve (wherein the telescopic direction of the telescopic sleeve is parallel to the sliding direction of the first rack 82), and the other end is slidably connected to the bottom wall of the support seat 2 along the telescopic direction parallel to the telescopic direction of the telescopic part 81. The transmission gear 84 is meshed with the first rack 82 and the second rack 83 at the same time. A plurality of clamping blocks 21 are provided in the support seat 2, and the clamping blocks 21 are arranged one by one corresponding to the telescopic parts 81. The clamping blocks 21 are connected to the top wall of the corresponding telescopic parts 81, the rotating rod 85 is connected to the outer wall of the supporting ring plate 61, and the driving end of the flip motor 86 is connected to the end wall of the rotating rod 85. The top walls of the two clamping blocks 21 are provided with gaps for the rotating rod 85 to slide in.

[0040] The carrier plate 6 loaded with the wafers 22 can be pre-placed in the support seat 2 by using a robotic arm, so that the rotating rod 85 is inserted into the relief notch. When the moving member 7 drives the telescopic member 81 to move towards each other, the telescopic member 81 will rise under the drive of the first rack 82, the second rack 83 and the transmission gear 84, and finally the clamping block 21 will press against the outer wall of the support ring plate 61. A flexible pad 211 is provided on the side wall of each clamping block 21 facing the support ring plate 61, so as to finally realize the clamping of the carrier plate 6 by the clamping block 21 through the flexible pad 211, and at the same time, the carrier plate 6 can be lifted to a height at a specified detection distance from the distance detection instrument 5. At this time, a relief space for the carrier plate 6 to flip is reserved between the carrier plate 6 and the support seat 2. When the flip motor 86 is started at this time to drive the rotating rod 85 and the carrier plate 6 to rotate 180°, the flexible pad 211 on the clamping block 21 can, while realizing the stable support of the carrier plate 6, use the deformation of the flexible pad 211 to avoid the obstruction caused to the rotation of the carrier plate 6.

[0041] Referring to Figure 5 and Figure 6 , a push rod 212 is further provided on the side wall of the two clamping blocks 21 facing the carrier plate 6. Correspondingly, a relief arc surface for the push rod 212 to abut against is provided on the upper surface of the movable plate 65 near the push rod 212. The push rod 212 slides as the clamping block 21 slides under the drive of the moving member 7, and the push rod 212 contacts the fixed ring plate 64 before the clamping block 21. And when the clamping block 21 presses against the surface of the fixed ring plate 64 through the flexible pad 211 before the clamping block 21 contacts the relief arc surface, at this time, the moving member 7 continues to drive the clamping block 21 to move towards the fixed ring plate 64 and squeeze the fixed ring plate 64. At this time, the flexible pad 211 deforms. And at the same time, the push rod 212 presses against the relief arc surface and makes the movable plate 65 slide towards the placement space, so that the movable block 651 is inserted into the ring groove 642, and the movable plate 65 moves and fits against the inner side wall of the buffer layer 643.

[0042] Correspondingly, referring to Figure 4 and Figure 5 , a tooth groove is formed in the circumferential direction of the lower surface of the movable plate 65. A rotating member 9 is further provided on the fixed ring plate 64. The rotating member 9 specifically includes a drive motor 91 and a docking gear 92; the drive shaft of the drive motor 91 is fixedly connected to the docking gear 92, the drive motor 91 is embedded in the inner wall of the support ring plate 61, and the docking gear 92 is rotatably connected to the inner wall of the support ring plate 61, so as to be engaged with the tooth groove on the corresponding movable plate 65 when the corresponding movable plate 65 moves to fit against the inner wall of the corresponding buffer layer 643. When the drive motor 91 is started, the docking gear 92 rotates, so that the engaged movable plate 65 rotates.

[0043] The rotating member 9 is controlled by the controller 4, and the controller 4 is used to control the rotating member 9 to drive the upper movable plate 65 to rotate (that is, the lower movable plate 65 and the wafer 22 in the positioning groove 63 of the lower movable plate 65 remain stationary), and each time it rotates a specified angle, it controls the detection instrument 5 to capture the surface image of the wafer 22 with the upper movable plate 65, and finally obtains the surface images of the wafer 22 captured at multiple rotation angles, and extracts the glass image from the aforementioned surface image of the wafer 22, and the glass image is specifically the stain image on the glass surface. For example, the differential method is used to calculate the differential image between each surface image of the wafer 22 and the reference image (such as the first surface image of the wafer 22), and the absolute value of all differential images is removed and averaged to obtain the glass image (that is, the stain information on the glass surface). Alternatively, the principal component analysis method is used to stack all the wafer 22 surface images into a data matrix, and the matrix is ​​PCA decomposed, and then the glass stain-related parts of the main components are extracted to reconstruct the glass image; finally, the wafer 22 image is processed to remove the glass image in the wafer 22 image. The specific removal method can be: one-to-one correspondence between the wafer 22 image and the pixel points of the glass image, and then the pixel value of the corresponding pixel point in the glass image is subtracted from the pixel value of each pixel point in the wafer 22 image. The processed wafer 22 image is denoised (such as Gaussian filtering or non-local mean filtering) and then the wafer 22 image is output.

[0044] Furthermore, the controller 4 is also used to compare the processed wafer 22 image with a preset reference image and determine the abnormal position. It can be considered that the difference between the pixel value of the pixel corresponding to the abnormal position and the pixel value of the pixel at the corresponding position in the reference image is higher than the preset difference. The abnormal type corresponding to the abnormal position is determined according to the range of the difference and the preset abnormal relationship table, wherein the abnormal type corresponding to different difference ranges is stored in the abnormal relationship table; the controller 4 is used to display the aforementioned wafer 22 image through a pre-electrically connected display screen, and mark the abnormal position and its corresponding abnormal type in the wafer 22 image.

[0045] The implementation principle of a wafer detection device in an embodiment of the present application is: with the help of a robot, a carrier 6 loaded with wafers 22 is placed in the support seat 2, so that the rotating rod 85 is placed on the clamping block 21, and then the clamping block 21 is driven by the moving part 7 to clamp on the peripheral wall of the carrier 6, so that the center of the wafer 22 in the carrier 6 is determined to be at the center of the support seat 2, and at this time, the carrier 6 is lifted to form a clearance space between it and the bottom wall of the support seat 2.

[0046] Next, the controller 4 controls the detection instrument 5 to capture an initial image. Based on the position of the support base 2 in the initial image, the controller 4 calculates the offset between the center of the support base 2 and the center of the preset reference position, and converts it into offset coordinates. Then, it controls the driving member 3 to drive the support base 2 to move until the center of the support base 2 coincides with the center of the preset reference position, thereby achieving precise positioning of the wafer 22. Finally, the detection instrument 5 is used to capture the wafer 22 at the preset reference position again for detection, and the controller 4 outputs the detection result for the detection personnel to know, ultimately realizing efficient and precise detection of the wafer 22.

[0047] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A wafer inspection device, characterized in that: The invention comprises a testing platform (1), a support seat (2) and a testing instrument (5) arranged on the testing platform (1), and a driving member (3) for driving the support seat (2) to move along a specified direction on the testing platform (1), and also comprises a controller (4), wherein the testing instrument (5) and the driving member (3) are both controlled by the controller (4), the supporting seat (2) is used to place a wafer (22); the testing instrument (5) is used to detect the wafer (22) and output the detection result to the controller (4), wherein the detection result at least includes the offset of the supporting seat (2) relative to a preset reference position; the controller (4) is used to control the driving member (3) to drive the supporting seat (2) to move to the reference position based on the detection result of the testing instrument (5), so that the testing instrument (5) can achieve complete detection of the wafer (22) placed on the supporting seat (2); the controller (4) is also used to output the detection result corresponding to the wafer (22) at the reference position, so that the detection personnel can know the detection result.

2. The wafer inspection device according to claim 1, wherein: It also includes a carrier plate (6), the wafer (22) is arranged in the middle of the carrier plate (6), and the support seat (2) is also provided with a plurality of clamping blocks (21) and a moving member (7) for driving all the clamping blocks (21) to move in a direction of approaching or moving away from each other. The clamping blocks (21) are used to press against the peripheral wall of the carrier plate (6) while being driven by the moving member (7) and approaching each other, so as to fix the carrier plate (6) on the support seat (2).

3. The wafer inspection device according to claim 2, wherein: The carrier plate (6) comprises a supporting ring plate (61), and a first transparent plate (62) and a second transparent plate (62) which are distributed vertically on the supporting ring plate (61), a placement space for a wafer (22) being reserved between the first transparent plate (62) and the second transparent plate (62), and the first transparent plate (62) is rotatably connected to the supporting ring plate (61); and further comprises a flip member (8), wherein the flip member (8) is used to drive the supporting ring plate (61) to rotate so as to adjust the vertical position of the first transparent plate (62) and the second transparent plate (62).

4. The wafer (22) inspection device according to claim 3, characterized in that: A magnetically attracted magnetic component (611) is commonly connected between the first transparent plate (62) and the supporting ring plate (61).

5. The wafer inspection apparatus according to claim 3, wherein: The flip member (8) comprises a telescopic component (81), a first rack (82), a second rack (83), a transmission gear (84), a rotating rod (85) and a flip motor (86); the rotating rod (85) is connected to the outer wall of the supporting ring plate (61); the driving end of the flip motor (86) is connected to the end of the rotating rod (85); a notch for the rotating rod (85) to rotate and slide is provided on the top of the clamping block (21); the telescopic component (81) is arranged in a one-to-one correspondence with the clamping block (21) and is connected to the lower surface of the corresponding clamping block (21); the moving member (7) is used to drive the telescopic component (81) to move in a direction of approaching or moving away from each other; The first rack (82) is connected to the lower end of the telescopic component (81) so as to move along with the movement of the telescopic component (81) by the moving member (7); the second rack (83) is connected to the upper end of the telescopic component (81); the length direction of the second rack (83) and the telescopic direction of the telescopic component (81) are both parallel to the height direction of the support seat (2); the transmission gear (84) is rotatably connected to the support seat (2), and the first rack (82) and the second rack (83) are jointly meshed with the transmission gear (84); when the clamping block (21) is pressed against the peripheral wall of the supporting ring plate (61), the length of the telescopic component (81) forms a clearance space between the carrier plate (6) and the bottom wall of the support seat (2) for the carrier plate (6) to flip over.

6. The wafer inspection device according to claim 3, characterized in that: The first transparent plate (62) and the second transparent plate (62) respectively comprise a movable plate (65) and a fixed ring plate (64) located on the periphery of the movable plate (65); the fixed ring plate (64) is connected to the inner side of the supporting ring plate (61); the movable plate (65) is connected to the inner side of the fixed ring plate (64) by sliding along the height direction of the fixed ring plate (64) via a spring (652); a buffer ring layer (643) is provided on the inner wall of the supporting ring plate (61) along its circumference; the buffer ring layer (643) is located on the periphery of the movable plate (65). A push rod (212) is provided on one side wall of the clamping block (21) facing the carrier plate (6). When the push rod (212) slides as the clamping block (21) is driven by the movable member (7), the push rod (212) is used to penetrate the fixed ring plate (64) and press the corresponding movable plate (65) so that the corresponding movable plate (65) slides in a direction close to the wafer (22) and fits against the peripheral wall of the buffer ring layer (643). At this time, the spring (652) between the movable plate (65) and the fixed ring plate (64) is deformed.

7. The wafer inspection device according to claim 3, wherein: The surfaces of the first transparent plate (62) and the second transparent plate (62) are both provided with positioning grooves (63) for inserting the wafer (22), and the inner walls and peripheral walls of the positioning grooves (63) are in contact with the side walls of the wafer (22).

8. The wafer inspection apparatus according to claim 6, wherein: The detection result at least includes an image of the wafer (22), and also includes a rotating member (9), wherein the rotating member (9) is used to drive the first transparent plate (62) and the second transparent plate (62) to rotate respectively, and the rotating member (9) is controlled by a controller (4), and the controller (4) is used to control the detection instrument (5) to collect the surface image of the wafer (22) with the first transparent plate (62) and the second transparent plate (62) during the rotation of the first transparent plate (62) and the second transparent plate (62), and to extract the glass image based on the surface image of the wafer (22), and then process the image of the wafer (22) based on the glass image to obtain the image of the wafer (22) after removing the glass image.

9. The wafer inspection device according to claim 8, wherein: The push rod (212) is used to penetrate the upper fixed ring plate (64) and press against the corresponding movable plate (65), so that the corresponding movable plate (65) slides towards the wafer (22) and fits against the circumferential wall of the buffer layer (643); a docking gear (92) is rotatably connected to the inner wall of the support ring plate (61), and the docking gear (92) is connected to a drive motor (91) for driving its rotation; a tooth groove is formed in the circumferential direction of the lower surface of the movable plate (65), and when the movable plate (65) moves and fits against the buffer layer (643), the movable plate (65) meshes with the docking gear (92) through the tooth groove. A limiting groove (641) and an annular groove (642) communicating with the limiting groove (641) are formed in the inner wall of the fixed ring plate (64). A movable block (651) is arranged on the side wall of the movable plate (65). When the spring (652) is not deformed, the movable block (651) is inserted into the limiting groove (641). When the movable plate (65) fits against the buffer layer (643), the movable block (651) moves from the limiting groove (641) to the annular groove (642).

10. The wafer inspection device according to claim 1, characterized in that: The controller (4) is used to calibrate the abnormal position based on the detection result when the detection result is abnormal, and output a warning message with the abnormal position and its corresponding abnormal type.

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