Manufacturing method of novel high-heat-dissipation PCB (Printed Circuit Board)

Abstract

The invention relates to the technical field of PCB manufacturing, in particular to a novel high-heat-dissipation PCB manufacturing method which comprises the following steps: preparing a high-quality copper plate or aluminum plate as a substrate material, preparing RCF heat-conducting glue and other necessary auxiliary materials at the same time, uniformly placing the RCF heat-conducting glue on the copper plate / aluminum plate, then adding a copper foil for press fit, and finally preparing the substrate material and the RCF heat-conducting glue. And polishing the edge of the laminated plate by using edge polishing equipment, drilling a line exposure positioning hole according to the design requirement, depositing a copper layer of 1 mu m on the hole wall by adopting a chemical copper deposition process, and then carrying out copper plating on the whole plate by using a VCP electroplating process. According to the manufacturing method of the novel high-heat-dissipation PCB, the heat dissipation performance and the electrical performance of the PCB are remarkably improved by optimizing the substrate material, selecting the heat-conducting glue, laminating the program and processing steps, and the requirements of electronic equipment for high performance, high stability and high reliability are met.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board manufacturing, and specifically to a method for manufacturing a new type of high heat dissipation PCB board. Background Art

[0002] PCB, that is, printed circuit board, is a substrate used to connect various electronic components in electronic devices. By covering an insulating substrate with a layer of conductive material and forming a predetermined circuit pattern through processes such as etching, drilling, and electroplating, the electrical connection between electronic components is achieved. PCB is an essential part of electronic devices, which carries electronic components and ensures that they can work properly according to the design requirements.

[0003] Generally, the manufacturing of traditional PCB usually includes substrate preparation, copper cladding, circuit design, exposure and development, etching, drilling, electroplating, solder mask and silk screen printing. However, with the continuous miniaturization and high performance of electronic devices, traditional PCB has many deficiencies in heat dissipation. The substrate material of traditional PCB (such as FR-4) has poor thermal conductivity and cannot effectively dissipate the heat generated by electronic components. Due to poor heat dissipation, electronic components are prone to performance degradation, shortened lifespan or even damage due to overheating. Component overheating may cause the electronic device to work unstably, resulting in failures or malfunctions.

[0004] Based on this, the present invention provides a method for manufacturing a new type of high heat dissipation PCB board to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a method for manufacturing a new type of high heat dissipation PCB board to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A method for manufacturing a new type of high heat dissipation PCB board is provided, including the following steps:

[0008] S1. Prepare high-quality copper or aluminum plates as the substrate material, and at the same time prepare RCF thermal conductive adhesive and other necessary auxiliary materials. Strictly inspect the quality, appearance and size of the copper or aluminum plates to ensure they are consistent with the design requirements, laying a solid foundation for the subsequent steps;

[0009] S2. Place the RCF thermal conductive adhesive evenly on the copper / aluminum plate, then add copper foil for lamination, and use a high TG lamination process to ensure that the laminated plate has good thermal conductivity and structural stability;

[0010] S3. Use edge grinding equipment to grind the edges of the laminated plate to ensure that the edges are flat, smooth and free of burrs, providing a good processing foundation for the subsequent drilling and electroplating steps;

[0011] S4. Drill the circuit exposure positioning holes according to the design requirements. In order to reduce the thermal damage and mechanical damage during the drilling process, the parameters are produced with a feed rate reduced by 50% according to the normal parameters to ensure the drilling accuracy and the quality of the board material;

[0012] S5. Use the chemical copper plating process to deposit a 1-μm copper layer on the hole walls to achieve the electrical conduction of the whole board. Subsequently, use the VCP electroplating process to electroplate copper on the whole board to ensure that the copper thickness and the hole copper thickness meet the requirements, and improve the electrical conductivity and corrosion resistance of the board material;

[0013] S6. Clean the board surface using micro-etching solution and brushing process, and then press a layer of photosensitive dry film. Present the required pattern on the copper clad laminate through exposure, development, etching, and stripping methods to form the second outer layer circuit;

[0014] S7. Repeat the processes of lamination, drilling, electroplating, and circuit manufacturing according to the number of layers of the board material. Place the RCF thermal conductive adhesive on the completed circuit before each lamination, and remove the thermal conductive adhesive at the positioning holes to ensure the consistent thermal conductivity between multiple layers;

[0015] S8. Print a layer of photosensitive ink on the board surface and perform pre-baking. Use an exposure machine for ultraviolet irradiation to cause the ink to undergo a polymerization reaction. After exposure, use a developing line to develop the opening pattern. After development, perform secondary cleaning on the board surface using volcanic ash and brushing process to ensure a stronger bonding force between the solder mask layer and the board material and a better solder mask effect;

[0016] S9. Perform the final shaping of the product, and then conduct conduction and insulation tests to ensure that the electrical performance of the board material meets the customer requirements. Finally, package and protect the qualified products to ensure that they are not damaged during transportation and storage.

[0017] Preferably, the implementation process of step S1 is as follows:

[0018] S1.1. Prepare copper or aluminum plates with a material purity greater than 99.9% and a thickness in the range of 1.0 - 3.0 mm, and the surface flatness ≤ 0.1 mm;

[0019] S1.2. Use an optical measuring instrument to accurately measure the dimensions of the copper / aluminum plate to ensure that the length and width error is ±0.5 mm and the thickness error is ±0.05 mm;

[0020] S1.3. Visually inspect the surface of the substrate, without scratches, oxidation, oil stain defects, and no burrs at the edges;

[0021] S1.4. Conduct ultrasonic flaw detection to ensure that there are no cracks and inclusion defects inside the substrate;

[0022] S1.5. Check the substrate size, shape and material according to the design drawings to ensure they are exactly the same.

[0023] Preferably, the implementation process of step S2 is as follows:

[0024] S2.1. Uniformly coat the RCF thermal conductive adhesive on the copper / aluminum plate, with the adhesive layer thickness being 0.1 - 0.2 mm, and use an automatic glue coater to ensure uniformity;

[0025] S2.2. Cover the copper foil with a thickness of 0.035 mm, use a high - TG laminator, set the temperature at 180 °C, the pressure at 10 MPa, and the lamination time at 30 minutes;

[0026] S2.3. After lamination, cool it to room temperature and check the flatness of the plate surface to ensure there are no obvious waves or bubbles.

[0027] Preferably, the implementation process of step S3 is as follows:

[0028] S3.1. Use an automatic edge grinder with a grinding wheel grit of 120 mesh and a rotation speed of 2800 r / min to conduct preliminary grinding on the edge of the plate;

[0029] S3.2. Replace the grinding wheel with 240 mesh and conduct fine grinding to ensure the edge is smooth and the fillet radius R ≤ 0.2 mm;

[0030] S3.3. Check the edge dimensions with a vernier caliper to ensure they meet the design requirements and there are no burrs.

[0031] Preferably, the implementation process of step S4 is as follows:

[0032] S4.1. According to the design drawings, use a CNC drill press with a drill bit diameter of 0.2 - 6.0 mm, and reduce the feed rate to 50% of the normal parameter, that is, the maximum feed rate does not exceed 200 mm / min;

[0033] S4.2. Use a coolant during the drilling process with a temperature of 20 - 30 °C to reduce thermal damage;

[0034] S4.3. Check the hole diameter after drilling, with an error of ±0.05 mm and a hole position deviation of ±0.1 mm.

[0035] Preferably, the implementation process of step S5 is as follows:

[0036] S5.1. Conduct electroless copper plating with the electroless copper plating solution temperature at 25 °C, pH value at 12.5, and electroless copper plating time at 30 minutes to form a 1 - μm copper layer;

[0037] S5.2. Use a VCP electroplating line with a current density of 2 ASD and an electroplating time of 60 minutes to ensure that the copper thickness reaches the design requirements and the hole copper thickness ≥ 25 μm;

[0038] S5.3. After electroplating, clean with deionized water at a water temperature of 25°C for 5 minutes to ensure no residual electrolyte solution.

[0039] Preferably, the implementation process of step S6 is as follows:

[0040] S6.1. Use micro-etching solution for 3 minutes at a temperature of 30°C to remove the surface oxide layer.

[0041] S6.2. Press and laminate the photosensitive dry film using a roller laminator at a pressure of 3 MPa, a temperature of 110°C, and for 10 seconds.

[0042] S6.3. Expose using an ultraviolet exposure machine with an energy of 100 mJ / cm 2 , for 8 seconds.

[0043] S6.4. Develop at a developer solution temperature of 30°C for 45 seconds, and check the circuit clarity after water washing.

[0044] S6.5. Etch at an etchant solution temperature of 45°C with an etching rate of 30 um / min until the copper layer is completely removed.

[0045] S6.6. Remove the film using a film remover at a temperature of 50°C for 5 minutes to ensure complete removal of the dry film.

[0046] Preferably, the implementation process of step S7 is as follows:

[0047] S7.1. Repeat step S2. Before laminating each layer, clean the surface, remove the thermal conductive adhesive at the positioning holes, and use a special cleaner for 2 minutes.

[0048] S7.2. Repeat steps S4 to S6. Drilling, electroplating, and circuit production for each layer shall meet the design requirements.

[0049] S7.3. When laminating multiple layers, align each layer and use a positioning system with an error of ±0.05 mm.

[0050] Preferably, the implementation process of step S8 is as follows:

[0051] S8.1. Print photosensitive ink using a screen printing machine with an ink thickness of 15 - 25 um and a printing speed of 200 mm / s.

[0052] S8.2. Pre-bake at a temperature of 80°C for 15 minutes.

[0053] S8.3. Ultraviolet exposure with an energy of 150 mJ / cm 2 , for 12 seconds.

[0054] S8.4. Development, with the developer temperature at 30°C and the time at 60 seconds. Check the window pattern after water washing.

[0055] S8.5. Secondary cleaning, using volcanic ash and a grinding brush, with a rotation speed of 1500 r / min and a time of 2 minutes, to ensure a firm bond between the solder mask and the board material.

[0056] Preferably, the implementation process of step S9 is as follows:

[0057] S9.1. Use a CNC milling machine for shaping, with a milling cutter diameter of 3 - 6 mm and a feed rate of 200 mm / min, to ensure a dimensional accuracy of ±0.1 mm;

[0058] S9.2. Conductivity test, using a flying probe tester, with a test voltage of 5V and a current of 10 mA, to ensure that all circuits are conductive;

[0059] S9.3. Insulation test, using an insulation resistance tester, with a test voltage of 500V and an insulation resistance ≥ 10 MΩ;

[0060] S9.4. Vacuum package the qualified products, using a PE bag, with a sealing temperature of 180°C and a time of 3 seconds, to ensure moisture and dust protection;

[0061] S9.5. Attach labels, indicating the product model, production date, and batch number, place them in a special packing box, and prepare for shipment.

[0062] Compared with the prior art, the beneficial effects of the present invention are:

[0063] By selecting high-quality copper or aluminum plates as the substrate material and using RCF thermal conductive adhesive between layers, the present invention significantly improves the thermal conductivity of the PCB. Using a high-TG lamination process for lamination ensures the structural stability of the board material. Through precise measurement, drilling, electroplating, and circuit manufacturing process steps, the electrical performance and dimensional accuracy of the PCB are ensured. Through edge grinding and cleaning process steps, a good processing foundation is provided for subsequent drilling, electroplating, and circuit manufacturing, reducing errors and defects during the processing and improving the quality of the PCB. Through process steps such as photosensitive ink printing, pre-baking, ultraviolet exposure, development, and secondary cleaning, a firm solder mask is made. Therefore, the method for manufacturing a novel high-heat-dissipation PCB board of the present invention significantly improves the heat dissipation performance and electrical performance of the PCB by optimizing the substrate material, thermal conductive adhesive selection, lamination process, and processing process steps, meeting the requirements of electronic devices for high performance, high stability, and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a flowchart of the method for manufacturing a high-heat-dissipation PCB board of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0065] Next, in combination with the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0066] Embodiment 1

[0067] Please refer to Figure 1 , the present invention proposes a method for manufacturing a new type of high heat dissipation PCB board, including the following steps:

[0068] S1. Prepare high-quality copper plates or aluminum plates as substrate materials, and at the same time prepare RCF thermal conductive glue and other necessary auxiliary materials. Strictly inspect the quality, appearance and size of the copper plates or aluminum plates to ensure consistency with the design requirements, laying a solid foundation for the subsequent steps;

[0069] Specifically, the specific implementation steps of this step are:

[0070] S1.1. Prepare copper plates or aluminum plates with a material purity greater than 99.9%, a thickness in the range of 1.0 - 3.0 mm, and a surface flatness ≤ 0.1 mm;

[0071] S1.2. Use an optical measuring instrument to accurately measure the size of the copper / aluminum plate to ensure a length and width error of ±0.5 mm and a thickness error of ±0.05 mm;

[0072] S1.3. Visually inspect the surface of the substrate, without scratches, oxidation, oil stain defects, and no burrs at the edges;

[0073] S1.4. Conduct ultrasonic flaw detection to ensure that there are no cracks or inclusion defects inside the substrate;

[0074] S1.5. According to the design drawing, check the size, shape and material of the substrate to ensure complete consistency;

[0075] S2. Place the RCF thermal conductive glue evenly on the copper / aluminum plate, then add copper foil for lamination, and use a high TG lamination process to ensure that the laminated plate has good thermal conductivity and structural stability;

[0076] Specifically, the specific implementation steps of this step are:

[0077] S2.1. Evenly coat the RCF thermal conductive glue on the copper / aluminum plate, with a glue layer thickness of 0.1 - 0.2 mm, and use an automatic glue coater to ensure uniformity;

[0078] S2.2. Cover the copper foil with a thickness of 0.035 mm. Use a high-TG laminator, set the temperature at 180 °C, the pressure at 10 MPa, and the lamination time at 30 minutes.

[0079] S2.3. After lamination, cool it to room temperature and check the flatness of the plate surface to ensure there are no obvious waves or bubbles.

[0080] S3. Use edge-grinding equipment to grind the edges of the laminated plate to ensure the edges are flat, smooth, and burr-free, providing a good processing foundation for subsequent drilling and electroplating steps.

[0081] Specifically, the specific implementation steps of this step are as follows:

[0082] S3.1. Use an automatic edge grinder with a grinding wheel grit size of 120 mesh and a rotational speed of 2800 r / min to conduct preliminary grinding on the plate edges.

[0083] S3.2. Replace the grinding wheel with 240 mesh and conduct fine grinding to ensure the edges are smooth and the fillet radius R ≤ 0.2 mm.

[0084] S3.3. Use a vernier caliper to check the edge dimensions to ensure they meet the design requirements and are burr-free.

[0085] S4. Drill circuit exposure positioning holes according to the design requirements. To reduce thermal damage and mechanical damage during drilling, the parameters are produced with a feed rate reduced by 50% compared to ordinary parameters to ensure drilling accuracy and plate quality.

[0086] Specifically, the specific implementation steps of this step are as follows:

[0087] S4.1. According to the design drawing, use a CNC drill with a drill bit diameter of 0.2 - 6.0 mm, and reduce the feed rate to 50% of the ordinary parameters, that is, the maximum feed rate does not exceed 200 mm / min.

[0088] S4.2. Use a coolant during drilling with a temperature of 20 - 30 °C to reduce thermal damage.

[0089] S4.3. Check the hole diameter after drilling with an error of ±0.05 mm and a hole position deviation of ±0.1 mm.

[0090] S5. Adopt the electroless copper plating process to deposit a 1-μm copper layer on the hole walls to achieve electrical conductivity of the entire plate. Subsequently, use the VCP electroplating process to electroplate the entire plate with copper to ensure that the copper thickness and hole copper thickness meet the requirements, improving the electrical conductivity and corrosion resistance of the plate.

[0091] Specifically, the specific implementation steps of this step are as follows:

[0092] S5.1. Chemical copper deposition, with the temperature of the copper deposition solution at 25°C, pH value at 12.5, and copper deposition time at 30 minutes, to form a 1-μm copper layer;

[0093] S5.2. Use a VCP electroplating line, with a current density of 2 ASD and an electroplating time of 60 minutes, to ensure that the copper thickness meets the design requirements, and the hole copper thickness ≥ 25 μm;

[0094] S5.3. Clean after electroplating, use deionized water, with the water temperature at 25°C and the cleaning time at 5 minutes, to ensure no residual electrolyte;

[0095] S6. Clean the board surface using micro-etching solution and brush process, then laminate a layer of photosensitive dry film, and present the required pattern on the copper clad laminate through exposure, development, etching, and stripping methods to form the secondary outer layer circuit;

[0096] Specifically, the specific implementation steps of this step are as follows:

[0097] S6.1. Use micro-etching solution, with a treatment time of 3 minutes and a temperature of 30°C, to remove the surface oxide layer;

[0098] S6.2. Laminate the photosensitive dry film, use a roller laminator, with a pressure of 3 MPa, a temperature of 110°C, and a time of 10 seconds;

[0099] S6.3. Exposure, use an ultraviolet exposure machine, with an energy of 100 mJ / cm 2 , and a time of 8 seconds;

[0100] S6.4. Development, with the temperature of the developer at 30°C and a time of 45 seconds, check the circuit clarity after water washing;

[0101] S6.5. Etching, with the temperature of the etching solution at 45°C and an etching rate of 30 μm / min, etch until the copper layer is completely removed;

[0102] S6.6 Stripping, use a stripping agent, with a temperature of 50°C and a time of 5 minutes, to ensure complete removal of the dry film;

[0103] S7. Repeat the processes of lamination, drilling, electroplating, and circuit manufacturing according to the number of layers of the board. Place the RCF thermal conductive adhesive on the completed circuit before each lamination, and remove the thermal conductive adhesive at the positioning holes to ensure consistent thermal conductivity between multiple layers;

[0104] Specifically, the specific implementation steps of this step are as follows:

[0105] S7.1. Repeat step S2. Clean the surface before laminating each layer, remove the thermal conductive adhesive at the positioning holes, use a special cleaner, and the cleaning time is 2 minutes;

[0106] S7.2. Repeat steps S4 to S6. Drilling, electroplating, and circuit manufacturing for each layer shall meet the design requirements;

[0107] S7.3. When multi-layer lamination is carried out, alignment is achieved between each layer, and a positioning system is used with an error of ±0.05 mm.

[0108] S8. Print a layer of photosensitive ink on the surface of the board, and carry out pre-baking. Use an exposure machine for ultraviolet irradiation to cause the ink to undergo a polymerization reaction. After exposure, use a developing line to develop the window pattern. After development, use the volcanic ash and brush process to conduct secondary cleaning on the board surface to ensure stronger bonding force between the solder mask layer and the board and better solder mask effect.

[0109] Specifically, the specific implementation steps of this step are as follows:

[0110] S8.1. Print the photosensitive ink using a screen printing machine with an ink thickness of 15 - 25 um and a printing speed of 200 mm / s.

[0111] S8.2. Carry out pre-baking at a temperature of 80 °C for 15 minutes.

[0112] S8.3. Ultraviolet exposure with an energy of 150 mJ / cm 2 , for 12 seconds.

[0113] S8.4. Development with a developer temperature of 30 °C for 60 seconds, and check the window pattern after water washing.

[0114] S8.5. Secondary cleaning using volcanic ash and a brush with a rotation speed of 1500 r / min for 2 minutes to ensure firm bonding between the solder mask layer and the board.

[0115] S9. Carry out final shaping on the product, and then conduct conduction and insulation tests to ensure that the electrical performance of the board meets the customer's requirements. Finally, carry out packaging protection on the qualified products to ensure that they are not damaged during transportation and storage.

[0116] Specifically, the specific implementation steps of this step are as follows:

[0117] S9.1. Use a CNC milling machine for shaping with a milling cutter diameter of 3 - 6 mm and a feed rate of 200 mm / min to ensure a dimensional accuracy of ±0.1 mm.

[0118] S9.2. Conduction test using a flying probe tester with a test voltage of 5 V and a current of 10 mA to ensure that all circuits are conductive.

[0119] S9.3. Insulation test using an insulation resistance tester with a test voltage of 500 V and an insulation resistance ≥10 MΩ.

[0120] S9.4. Carry out vacuum packaging on the qualified products using a PE bag with a sealing temperature of 180 °C for 3 seconds to ensure moisture and dust protection.

[0121] S9.5. Apply labels indicating the product model, production date, and batch number, place them in a special packing box, and prepare for shipment.

[0122] Example 2

[0123] Please refer to Figure 1 , in practical applications, the method for manufacturing the novel high heat dissipation PCB board of the present invention is specifically as follows:

[0124] (1) Substrate preparation and inspection:

[0125] Select a copper or aluminum plate with a material purity greater than 99.9%, a thickness of 1.0 - 3.0 mm, and a surface flatness ≤ 0.1 mm as the substrate material;

[0126] Use an optical measuring instrument to accurately measure the dimensions of the substrate, and ensure that the length and width error is within ±0.5 mm and the thickness error is within ±0.05 mm;

[0127] Through visual inspection and ultrasonic flaw detection, ensure that the substrate surface has no defects such as scratches, oxidation, oil stains, etc., and there are no defects such as cracks and inclusions inside;

[0128] Finally, check the dimensions, shape, and material of the substrate according to the design drawing to ensure they are exactly the same;

[0129] In actual operation, fabricate a copper substrate with dimensions of 200 mm × 300 mm and a thickness of 2.0 mm, select a copper plate meeting the above requirements, and use an optical measuring instrument for accurate measurement to ensure the dimensions meet the requirements;

[0130] Then, through visual inspection and ultrasonic flaw detection, ensure that there are no defects on the surface and inside of the copper plate;

[0131] (2) Thermal conductive adhesive lamination:

[0132] Uniformly coat the RCF thermal conductive adhesive on the copper / aluminum plate, with the adhesive layer thickness of 0.1 - 0.2 mm;

[0133] Use an automatic gluing machine to ensure the uniformity of the adhesive layer, and then cover a copper foil with a thickness of 0.035 mm;

[0134] Place the copper plate and copper foil into a high TG laminator, set the temperature at 180 °C, the pressure at 10 MPa, and the lamination time at 30 minutes;

[0135] After lamination, cool to room temperature, check the surface flatness of the plate to ensure there are no obvious waves or bubbles;

[0136] When coating the thermal conductive adhesive, use an automatic gluing machine to ensure the uniformity of the adhesive layer;

[0137] During the lamination process, closely monitor the temperature and pressure changes of the laminator to ensure that the lamination effect meets the design requirements;

[0138] (3) Edge grinding:

[0139] Use an automatic edge grinding machine to perform preliminary grinding on the edges of the laminated plates. The grinding wheel grit size is 120 mesh and the rotational speed is 2800 r / min;

[0140] Then replace the grinding wheel with 240 mesh for fine grinding to ensure that the edges are smooth and the fillet radius R ≤ 0.2 mm;

[0141] Finally, use a vernier caliper to check the edge dimensions to ensure they meet the design requirements and are free of burrs;

[0142] During the grinding process, regularly check the wear condition of the grinding wheel and replace it in a timely manner to ensure the grinding effect;

[0143] At the same time, use a vernier caliper to check the edge dimensions multiple times to ensure they meet the design requirements;

[0144] (4) Drilling:

[0145] Use a CNC drilling machine to drill holes according to the design drawing. The drill bit diameter is 0.2 - 6.0 mm, and the feed rate is reduced to 50% of the normal parameter (i.e., the maximum feed rate does not exceed 200 mm / min);

[0146] Use a coolant (temperature 20 - 30 °C) during the drilling process to reduce thermal damage;

[0147] After drilling, check the hole diameter and hole position deviation to ensure they meet the requirements;

[0148] During the drilling process, closely monitor the operating status of the drilling machine and the coolant flow rate to ensure the drilling quality and efficiency;

[0149] At the same time, check the drilled holes multiple times to ensure that the hole diameter and hole position deviation meet the design requirements;

[0150] (5) Electroplating:

[0151] First, perform electroless copper plating treatment. The temperature of the electroless copper plating solution is 25 °C, the pH value is 12.5, and the electroless copper plating time is 30 minutes to form a 1 - μm copper layer;

[0152] Then use a VCP electroplating line for electroplating treatment. The current density is 2 ASD and the electroplating time is 60 minutes to ensure that the copper thickness reaches the design requirements and the hole copper thickness ≥ 25 μm;

[0153] Finally, use deionized water for cleaning to ensure no residual electrolyte;

[0154] During the electroplating process, closely monitor the changes in the temperature and current density of the electroplating solution to ensure that the electroplating effect meets the design requirements;

[0155] At the same time, conduct multiple inspections on the electroplated board to ensure that the copper thickness and through-hole copper thickness meet the requirements;

[0156] (6) Circuit production:

[0157] Use micro-etching solution (H2SO4 and H2O2 system) to remove the surface oxide layer (treatment time is 3 minutes, temperature is 30°C);

[0158] Then press and laminate the photosensitive dry film (pressure is 3MPa, temperature is 110°C, time is 10 seconds);

[0159] Next, perform exposure (energy is 100mJ / cm 2 , time is 8 seconds), development (developer temperature is 30°C, time is 45 seconds) and etching (etchant temperature is 45°C, etching rate is 30um / min) treatments;

[0160] Finally, use a stripping agent to remove the dry film (temperature is 50°C, time is 5 minutes);

[0161] During the circuit production process, closely monitor the time and temperature changes in each treatment step to ensure the circuit quality and clarity;

[0162] At the same time, conduct multiple inspections on the produced circuits to ensure they meet the design requirements;

[0163] (7) Multilayer lamination and circuit repeated production:

[0164] Repeat the S2 step for multilayer lamination treatment. Clean the surface and remove the thermal conductive adhesive at the positioning holes before each layer lamination (cleaning time with a special cleaner is 2 minutes);

[0165] Then repeat the S4 to S6 steps for drilling, electroplating and circuit production for each layer;

[0166] Ensure alignment between each layer during multilayer lamination (using a positioning system with an error of ±0.05mm);

[0167] During the multilayer lamination process, closely monitor the alignment between each layer and the lamination effect;

[0168] At the same time, conduct multiple inspections on the circuits of each layer to ensure they meet the design requirements;

[0169] (8) Solder mask production:

[0170] Use a screen printing machine to print photosensitive ink (ink thickness is 15 - 25um, printing speed is 200mm / s);

[0171] Then perform baking pre-baking treatment (temperature: 80°C, time: 15 minutes);

[0172] Next, perform ultraviolet exposure treatment (energy: 150 mJ / cm 2 , time: 12 seconds) and developing treatment (developer temperature: 30°C, time: 60 seconds);

[0173] Finally, perform secondary cleaning treatment using volcanic ash and abrasive brush (rotation speed: 1500 r / min, time: 2 minutes) to ensure a firm bond between the solder mask layer and the board;

[0174] During the production process of the solder mask layer, closely monitor the printing quality and exposure effect;

[0175] Meanwhile, conduct multiple inspections on the produced solder mask layer to ensure compliance with the design requirements;

[0176] (9) Forming and testing packaging:

[0177] Perform forming treatment using a CNC milling machine (milling cutter diameter: 3 - 6 mm, feed rate: 200 mm / min) to ensure dimensional accuracy of ±0.1 mm;

[0178] Then conduct continuity testing and insulation testing to ensure that all circuits are conductive and the insulation resistance is ≥10 MΩ;

[0179] Finally, perform vacuum packaging treatment on the qualified products (using a PE bag for encapsulation, temperature: 180°C, time: 3 seconds), and attach labels indicating the product model, production date, and batch number, then place them in a special packing box for preparation for shipment;

[0180] During the forming process, closely monitor the operating status of the milling machine and dimensional accuracy;

[0181] Meanwhile, conduct multiple continuity tests and insulation tests on the finished products to ensure that the electrical performance meets the design requirements;

[0182] After testing, conduct appearance inspection, and compare the products with 100% AVI scanning according to the customer's standards. Select the products that do not meet the requirements for repair or scrapping;

[0183] Finally, perform vacuum packaging and labeling on the qualified products, and ensure the quality of the packing box and the clarity of the label.

[0184] Through the above steps, the present invention significantly improves the thermal conductivity of the PCB by selecting high-quality copper or aluminum plates as the substrate material and using RCF thermal conductive adhesive between layers, uses a high-TG lamination process for lamination to ensure the structural stability of the board, and through precise measurement, drilling, electroplating, circuit manufacturing and other process steps, ensures the electrical performance and dimensional accuracy of the PCB. Through edge grinding and cleaning process steps, a good processing foundation is provided for subsequent drilling, electroplating and circuit manufacturing, reducing errors and defects during the processing and improving the quality of the PCB. Through process steps such as photosensitive ink printing, pre-baking, ultraviolet exposure, development and secondary cleaning, a firm solder mask is fabricated. Therefore, the method for manufacturing a novel high heat dissipation PCB board of the present invention significantly improves the heat dissipation performance and electrical performance of the PCB by optimizing the substrate material, thermal conductive adhesive selection, lamination process and processing process steps, meeting the requirements of electronic devices for high performance, high stability and high reliability.

[0185] In the description of this specification, the description with reference to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0186] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A manufacturing method of a novel high heat dissipation PCB board, characterized in that, It includes the following steps: S1. Prepare high-quality copper or aluminum plates as substrate materials, and at the same time prepare RCF thermal conductive adhesive and other necessary auxiliary materials; S2. Place the RCF thermal conductive adhesive evenly on the copper / aluminum plate, and then add copper foil for lamination; S3. Use edge grinding equipment to grind the edges of the laminated plate; S4. Drill circuit exposure positioning holes according to the design requirements; S5. Adopt the chemical copper deposition process to deposit a 1um copper layer on the hole wall, and then use the VCP electroplating process to electroplate the whole board with copper; S6. Clean the board surface using micro-etching solution and brush process, then laminate a layer of photosensitive dry film, and present the required pattern on the copper clad laminate through exposure, development, etching and stripping methods; S7. Repeat the processes of lamination, drilling, electroplating and circuit production according to the number of layers of the board. Before each lamination, place the RCF thermal conductive adhesive on the completed circuit, and remove the thermal conductive adhesive at the positioning holes; S8. Print a layer of photosensitive ink on the board surface, and perform pre-baking. Use an exposure machine for ultraviolet irradiation to make the ink undergo a polymerization reaction. After exposure, use a developing line to develop the open window pattern, and perform secondary cleaning on the board surface using volcanic ash and brush process after development; S9. Perform the final shaping of the product, and then conduct conduction and insulation tests.

2. The manufacturing method of a novel high heat dissipation PCB board according to claim 1, characterized in that, The implementation process of step S1 is as follows: S1.

1. Prepare copper or aluminum plates with a material purity greater than 99.9%, a thickness in the range of 1.0 - 3.0mm, and a surface flatness ≤ 0.1mm; S1.

2. Use an optical measuring instrument to accurately measure the dimensions of the copper / aluminum plate to ensure that the length and width error is ±0.5mm and the thickness error is ±0.05mm; S1.

3. Visually inspect the surface of the substrate, without scratches, oxidation, oil stain defects, and no burrs on the edges; S1.

4. Conduct ultrasonic flaw detection to ensure that there are no cracks and inclusion defects inside the substrate; S1.

5. According to the design drawing, check the size, shape and material of the substrate to ensure they are completely consistent.

3. A method for manufacturing a new type of high heat dissipation PCB board according to claim 1, characterized in that The implementation process of step S2 is as follows: S2.

1. Evenly coat the RCF thermal conductive adhesive on the copper / aluminum plate, with a glue layer thickness of 0.1 - 0.2mm, and use an automatic gluing machine to ensure uniformity; S2.

2. Cover the copper foil with a thickness of 0.035mm, use a high-TG laminating machine, set the temperature at 180°C, the pressure at 10MPa, and the lamination time at 30 minutes; S2.

3. After lamination, cool to room temperature, and check the surface flatness of the plate to ensure there are no obvious waves and bubbles.

4. A manufacturing method of a novel high heat dissipation PCB board according to claim 1, characterized in that The implementation process of step S3 is as follows: S3.

1. Use an automatic edge grinder with a grinding wheel grit of 120 mesh and a rotational speed of 2800r / min to perform preliminary grinding on the edges of the plate; S3.

2. Replace the 240-mesh grinding wheel for fine grinding to ensure smooth edges and a fillet radius R ≤ 0.2mm; S3.

3. Check the edge dimensions with a vernier caliper to ensure they meet the design requirements and there are no burrs.

5. A method for manufacturing a novel high heat dissipation PCB board according to claim 1, characterized in that, characterized in that, The implementation process of step S4 is as follows: S4.

1. According to the design drawing, use a CNC drill with a drill bit diameter of 0.2 - 6.0mm, and reduce the feed rate to 50% of the normal parameter, that is, the maximum feed rate does not exceed 200mm / min; S4.

2. Use coolant during the drilling process at a temperature of 20 - 30°C to reduce thermal damage; S4.

3. Check the hole diameter after drilling with an error of ±0.05 mm and a hole position deviation of ±0.1 mm.

6. A method for manufacturing a novel high heat dissipation PCB board according to claim 1, characterized in that The implementation process of step S5 is as follows: S5.

1. Chemical copper deposition, with the temperature of the copper deposition solution at 25°C, pH value at 12.5, and copper deposition time of 30 minutes to form a 1 - μm copper layer; S5.

2. Use a VCP electroplating line with a current density of 2 ASD and an electroplating time of 60 minutes to ensure that the copper thickness meets the design requirements, and the hole copper thickness ≥ 25 μm; S5.

3. Clean after electroplating with deionized water at a water temperature of 25°C and a cleaning time of 5 minutes to ensure no residual electrolyte.

7. A manufacturing method of a novel high heat dissipation PCB board according to claim 1, characterized in that The implementation process of step S6 is as follows: S6.

1. Use micro - etching solution for 3 minutes at a temperature of 30°C to remove the surface oxide layer; S6.

2. Press and laminate the photosensitive dry film using a roller - type laminating machine with a pressure of 3 MPa, a temperature of 110°C, and a time of 10 seconds; S6.

3. Exposure, using an ultraviolet exposure machine with an energy of 100 mJ / cm 2 , for a time of 8 seconds; S6.

4. Develop, with the temperature of the developing solution at 30°C and a time of 45 seconds, and check the circuit clarity after water washing; S6.

5. Etch, with the temperature of the etching solution at 45°C and an etching speed of 30 μm / min until the copper layer is completely removed; S6.

6. Remove the film using a film remover at a temperature of 50°C and a time of 5 minutes to ensure complete removal of the dry film.

8. A method for manufacturing a novel high heat dissipation PCB board according to claim 1, characterized in that The implementation process of step S7 is as follows: S7.

1. Repeat step S2, clean the surface before each layer lamination, remove the thermal conductive adhesive at the positioning holes using a special cleaner with a cleaning time of 2 minutes; S7.

2. Repeat steps S4 to S6, and the drilling, electroplating, and circuit production for each layer must meet the design requirements; S7.

3. When laminating multiple layers, align each layer using a positioning system with an error of ±0.05 mm.

9. A method for manufacturing a novel high heat dissipation PCB board according to claim 1, characterized in that The implementation process of step S8 is as follows: S8.

1. Print photosensitive ink using a screen printing machine with an ink thickness of 15 - 25 μm and a printing speed of 200 mm / s; S8.

2. Pre - bake at a temperature of 80°C for 15 minutes; S8.

3. UV exposure, energy 150 mJ / cm 2 , time 12 seconds; S8.

4. Develop, with the temperature of the developing solution at 30°C and a time of 60 seconds, and check the opening pattern after water washing; S8.

5. Secondary cleaning using volcanic ash and a brush with a rotation speed of 1500 r / min for 2 minutes to ensure a firm bond between the solder mask layer and the board.

10. A manufacturing method of a novel high heat dissipation PCB board according to claim 1, characterized in that, characterized in that, The implementation process of step S9 is as follows: S9.

1. Use a CNC milling machine for shaping with a milling cutter diameter of 3 - 6 mm and a feed rate of 200 mm / min to ensure a dimensional accuracy of ±0.1 mm; S9.

2. Conductivity test using a flying probe tester with a test voltage of 5 V and a current of 10 mA to ensure all circuits are conductive; S9.

3. Insulation test using an insulation resistance tester with a test voltage of 500 V and an insulation resistance ≥ 10 MΩ; S9.

4. Vacuum - pack the qualified products using a PE bag at a packaging temperature of 180°C for 3 seconds to ensure moisture and dust protection; S9.

5. Attach labels indicating the product model, production date, and batch number, place them in a special packaging box, and prepare for storage out.

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