Novel circuit board processing technology and processing equipment thereof
By applying thermosetting glue on the PI film and die-cutting, copper foil stacking and pulse discharge connection lamp beads, the problems of environmental protection risks and low efficiency are solved, and environmentally friendly and efficient flexible circuit board production is achieved.
Patent Information
- Application Number
- CN202510583298.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-07
- Publication Date
- 2025-07-11
AI Technical Summary
There are environmental risks and low production efficiency problems during the processing of existing soft wire circuit boards, especially the high cost of wastewater treatment, harmful gas volatility and complicated processes in the wet process, resulting in high defect rate.
The new circuit board processing technology is adopted, including applying thermosetting glue on the PI film and die-cutting, superimposing the copper foil after die-cutting, connecting the lamp beads with pulse discharge, and accurately die-cut, bonding and testing with special equipment to avoid the use of acid agents and cumbersome processes.
It improves environmental protection, reduces wastewater treatment costs and harmful gas emissions, shortens production cycles, improves product quality and production efficiency, and expands the integrated application of lamp beads.
Smart Images
Figure CN120302535A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board processing, and in particular to a new circuit board processing technology and its processing equipment. Background Art
[0002] With the development of electronic devices towards miniaturization, lightweight and high reliability, flexible printed circuit boards (FPCs) are increasingly widely used in electronic products.
[0003] Currently, the mainstream processing of flexible printed circuit boards adopts a combination of wet and dry processes. In the wet process, first, a PI film and a copper foil are bonded with glue, then a chemical solution pattern is printed, and finally, the excess copper foil is etched away using an acid agent. However, during the use of the acid agent mixed solvent, not only a large amount of wastewater that needs to be strictly treated is generated, increasing the environmental protection cost, but also harmful gases are volatilized during the use of the chemical solution and the solvent, posing a threat to the physical health of the operators and presenting a relatively large potential safety hazard. In the dry process stage, the materials processed through the wet process need to be further processed into FPCs, and finally, the lamp beads are soldered. The entire process has complex procedures, and each link may introduce product defects, resulting in a high defective rate of the final product, seriously affecting production efficiency and the economic benefits of the enterprise, and thus there is a need for improvement. Summary of the Invention
[0004] The first object of the present invention is to provide a new circuit board processing technology, which has the advantages of improving environmental friendliness and production efficiency.
[0005] The above technical object of the present invention is achieved through the following technical solutions: A new circuit board processing technology, including: Step 1: Apply thermosetting glue on both the front and back sides of the PI film to form a central PI film, apply thermosetting glue on the back side of the PI film to form a top PI film, apply thermosetting glue on the front side of the PI film to form a bottom PI film, and additionally open electrode post holes on the central PI film and the top PI film; Step 2: Die-cut the central PI film, the top PI film, and the bottom PI film respectively; Step 3: Die-cut the copper foil to form a positive copper foil and a negative copper foil; Step 4: Stack the bottom PI film, the negative copper foil, the central PI film, the positive copper foil, and the top PI film in sequence and perform bonding; Step 5: Perform pulsed discharge on the end part of the electrode post of the lamp bead to melt the end part of the electrode post, pass the electrode post of the lamp bead through the electrode post hole and finally respectively abut against the positive copper foil and the negative copper foil. After the electrode post cools down, it is fixed on the positive copper foil and the negative copper foil and forms current conduction.
[0006] The present invention is further configured that: the thermosetting adhesive mainly consists of resin and curing agent, wherein the resin is phenolic resin obtained by polycondensation reaction of phenol and formaldehyde.
[0007] The present invention is further configured that: the curing agent in the thermosetting adhesive is a free radical curing agent, specifically an acrylic curing agent.
[0008] The present invention is further configured that: the thickness of the thermosetting adhesive during the laminating process is 0.001 mm, and the thickness of the PI film is 0.034 mm.
[0009] The present invention is further configured that: the thickness of the copper foil is 0.018 mm.
[0010] The present invention is further configured that: when using a jig for laminating, the temperature of the jig is controlled at 150°C - 180°C, the laminating pressure is 0.5 MPa - 1 MPa, and the laminating time is 5 s - 10 s.
[0011] The present invention is further configured that: before die-cutting the copper foil and the PI film, the flatness of the raw materials is detected, and the raw materials with a flatness deviation exceeding 0.02 mm are excluded.
[0012] The present invention is further configured that: when die-cutting the PI film coated with thermosetting adhesive, the die-cutting accuracy is controlled within the range of ±0.01 mm. When die-cutting the positive and negative electrodes of the copper foil, a numerical control die-cutting device is used to ensure that the flatness deviation of the die-cut edge does not exceed 0.005 mm.
[0013] The present invention is further configured that: when the diameter of the electrode post is between 1 - 3 mm, the pulse discharge frequency is between 100 - 500 Hz.
[0014] The second object of the present invention is to provide a new type of circuit board processing equipment, and its advantages are that the environmental protection degree is improved and the production efficiency is improved.
[0015] The above technical object of the present invention is achieved through the following technical solutions: a new type of circuit board processing equipment, applying a new type of circuit board processing process as described in any one of the above technical solutions; including: A die-cutting unit for die-cutting the PI film coated with thermosetting adhesive and die-cutting the copper foil; A laminating unit capable of realizing the laminating operation of the die-cut PI film and copper foil using a jig, the temperature of the jig can be accurately regulated within the range of 150°C - 180°C, the laminating pressure can be stably maintained at 0.5 MPa - 1 MPa, and the laminating time can be set to 5 s - 10 s; A pulse discharge unit for performing pulse discharge on the end of the electrode post of the lamp bead to melt the end of the electrode post; The detection unit can detect the flatness of copper foil and PI film before the raw materials are put into die-cutting. When the flatness deviation exceeds 0.02 mm, it will automatically issue an alarm and reject the raw material. After the lamination is completed, it can conduct electrical performance tests on the finished flexible circuit board, including conduction test and insulation resistance test. The test results can be displayed in real time, and when the conduction resistance is greater than or equal to 0.1 Ω or the insulation resistance is less than or equal to 100 MΩ, the product is judged as unqualified and marked.
[0016] In summary, the present invention has the following beneficial effects: 1. Abandon the method of etching copper foil with acid mixture solvent in the traditional wet process, avoid the generation of a large amount of acid-containing wastewater, reduce the volatilization of harmful gases, reduce environmental pollution, and at the same time greatly reduce the wastewater treatment cost, making the production process more environmentally friendly, improving the environmental protection level in the circuit board production process. At the same time, compared with the complex process of combining traditional wet and dry processes, this process reduces multiple cumbersome processes through direct die-cutting and lamination, effectively shortens the production cycle, and improves production efficiency. 2. Precise die-cutting process and control of lamination parameters ensure the accuracy and consistency of the product. The die-cutting accuracy is controlled within the range of ±0.01 mm, the flatness deviation of the die-cut edge of the copper foil does not exceed 0.005 mm, the thickness of the thermosetting adhesive, PI film and copper foil are all strictly controlled, and the temperature, pressure and time of the fixture are accurately regulated during the lamination process, so that each layer of material is closely laminated, reducing problems such as interlayer misalignment and bubbles, improving the performance and stability of the flexible circuit board, and thus improving the product quality. 3. Electrode post holes are opened on the PI film, and the connection between the lamp bead and the copper foil is realized by melting the end of the electrode post through pulsed discharge. This design makes the integration of lamp beads on the flexible circuit board more convenient and efficient, is applicable to a variety of electronic products that require the integration of lamp beads and circuit boards, and expands the application range of the product. Description of the Drawings
[0017] Figure 1 is a schematic structural diagram of the overall laminated state of this embodiment; Figure 2 is a schematic structural diagram of the separated state of this embodiment.
[0018] Reference numerals: 1, PI film; 2, thermosetting adhesive; 3, central PI film; 4, top PI film; 5, bottom PI film; 6, electrode post hole; 7, positive copper foil; 8, negative copper foil; 9, lamp bead; 10, electrode post. Detailed Embodiments
[0019] The present invention will be further described in detail below with reference to the accompanying drawings.
[0020] Embodiment 1: Reference Figures 1 to 2 , a new type of circuit board processing technology, including: Step 1: Coat thermosetting glue 2 on the front and back of PI film 1 to form the central PI film 3, coat thermosetting glue 2 on the back of PI film 1 to form the top PI film 4, coat thermosetting glue 2 on the front of PI film 1 to form the bottom PI film 5, and additionally open electrode post holes 6 on the central PI film 3 and the top PI film 4; Step 2: Die-cut the central PI film 3, the top PI film 4, and the bottom PI film 5 respectively; Step 3: Die-cut the copper foil to form the positive copper foil 7 and the negative copper foil 8; Step 4: Stack the bottom PI film 5, the negative copper foil 8, the central PI film 3, the positive copper foil 7, and the top PI film 4 in sequence and bond them; Step 5: Perform pulsed discharge on the end of the electrode post 10 of the lamp bead 9 to melt the end of the electrode post 10, pass the electrode post 10 of the lamp bead 9 through the electrode post hole 6 and finally abut against the positive copper foil 7 and the negative copper foil 8 respectively. After the electrode post 10 cools, it is fixed on the positive copper foil 7 and the negative copper foil 8 and forms current conduction.
[0021] Specifically, the thermosetting glue 2 is mainly composed of resin and curing agent. The resin is phenolic resin, which is obtained by the polycondensation reaction of phenol and formaldehyde. The curing agent in the thermosetting glue 2 is a free radical curing agent, specifically an acrylic curing agent.
[0022] Specifically, the thickness of the thermosetting glue 2 during the bonding process is 0.001mm, the thickness of the PI film is 0.034mm, and the thickness of the copper foil is 0.018mm.
[0023] Specifically, when using a jig for bonding, the temperature of the jig is controlled at 150°C - 180°C, the bonding pressure is 0.5MPa - 1MPa, and the bonding time is 5s - 10s. Before die-cutting the copper foil and the PI film, the flatness of the raw materials is detected, and the raw materials with a flatness deviation exceeding 0.02mm are removed. When die-cutting the PI film coated with thermosetting glue 2, the die-cutting accuracy is controlled within the range of ±0.01mm. When die-cutting the positive and negative electrodes of the copper foil, a numerical control die-cutting device is used to ensure that the flatness deviation of the die-cut edge does not exceed 0.005mm.
[0024] Specifically, when the diameter of the electrode post 10 is between 1 - 3mm, the pulsed discharge frequency is between 100 - 500Hz.
[0025] Example 2: A new type of circuit board processing equipment for implementing a new type of circuit board processing technology as shown in Example 1, including: A die-cutting unit, which is used to die-cut the PI film 1 coated with thermosetting adhesive 2 and the copper foil; A laminating unit, which can realize the lamination operation of the die-cut PI film and copper foil using a fixture. The temperature of the fixture can be precisely controlled within the range of 150°C - 180°C, the lamination pressure can be stably maintained at 0.5 MPa - 1 MPa, and the lamination time can be set to 5 s - 10 s; A pulsed discharge unit, which is used to perform pulsed discharge on the end of the electrode post 10 of the lamp bead 9 to melt the end of the electrode post 10; A detection unit. Before the raw materials are put into die-cutting, it can detect the flatness of the copper foil and PI film. When the flatness deviation exceeds 0.02 mm, it will automatically issue an alarm and reject the raw material. After the lamination is completed, it can perform electrical performance tests on the finished flexible circuit board, including conduction test and insulation resistance test. The test results can be displayed in real time, and when the conduction resistance is greater than or equal to 0.1 Ω or the insulation resistance is less than or equal to 100 MΩ, the product is determined to be unqualified and marked.
[0026] This specific embodiment is only an interpretation of the present invention and is not a limitation of the present invention. Those skilled in the art can make creative contributions to this embodiment according to needs after reading this specification, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.
Claims
1. A new circuit board processing technology, characterized in that, Including: Step 1: Apply thermosetting glue (2) on both the front and back sides of the PI film (1) to form a central PI film (3), apply thermosetting glue (2) on the back side of the PI film (1) to form a top PI film (4), apply thermosetting glue (2) on the front side of the PI film (1) to form a bottom PI film (5), and additionally open electrode post holes (6) on the central PI film (3) and the top PI film (4); Step 2: Die-cut the central PI film (3), the top PI film (4), and the bottom PI film (5) respectively; Step 3: Die-cut the copper foil to form a positive copper foil (7) and a negative copper foil (8); Step 4: Stack the bottom PI film (5), the negative copper foil (8), the central PI film (3), the positive copper foil (7), and the top PI film (4) in sequence, and perform lamination; Step 5: Perform pulsed discharge on the end of the electrode post (10) of the lamp bead (9) to melt the end of the electrode post (10), pass the electrode post (10) of the lamp bead (9) through the electrode post hole (6) and finally abut against the positive copper foil (7) and the negative copper foil (8) respectively. After the electrode post (10) cools down, it is fixed on the positive copper foil (7) and the negative copper foil (8) to form current conduction.
2. A novel circuit board processing technology according to claim 1, characterized in that, The thermosetting glue (2) is mainly composed of resin and curing agent. The resin is phenolic resin, which is obtained by the polycondensation reaction of phenol and formaldehyde.
3. A novel circuit board processing technology according to claim 2, characterized in that, The curing agent in the thermosetting glue (2) is a free radical curing agent, specifically an acrylic curing agent.
4. A novel circuit board processing technology according to claim 1, characterized in that, The thickness of the thermosetting glue (2) during the lamination process is 0.001 mm, and the thickness of the PI film is 0.034 mm.
5. A novel circuit board processing technology according to claim 1, characterized in that, The thickness of the copper foil is 0.018 mm.
6. A novel circuit board processing technology according to claim 1, characterized in that, When using a jig for lamination, the temperature of the jig is controlled at 150°C - 180°C, the lamination pressure is 0.5 MPa - 1 MPa, and the lamination time is 5 s - 10 s.
7. A novel circuit board processing technology according to claim 1, characterized in that, Before die-cutting the copper foil and the PI film, the flatness of the raw materials is detected, and the raw materials with a flatness deviation exceeding 0.02 mm are rejected.
8. A novel circuit board processing technology according to claim 1, characterized in that, When die-cutting the PI film coated with thermosetting glue (2), the die-cutting accuracy is controlled within the range of ±0.01 mm. When die-cutting the positive and negative electrodes of the copper foil, a numerical control die-cutting device is used to ensure that the flatness deviation of the die-cut edge does not exceed 0.005 mm.
9. A novel circuit board processing technology according to claim 1, characterized in that, When the diameter of the electrode post (10) is between 1 - 3 mm, the pulsed discharge frequency is between 100 - 500 Hz.
10. A new type of circuit board processing equipment, applying a new type of circuit board processing technology as described in any one of the above claims 1-9; characterized in that, Including: A die-cutting unit for die-cutting the PI film (1) coated with thermosetting glue (2) and die-cutting the copper foil; A lamination unit that can realize the lamination operation of the die-cut PI film and copper foil using a jig. The temperature of the jig can be accurately regulated within the range of 150°C - 180°C, the lamination pressure can be stably maintained at 0.5 MPa - 1 MPa, and the lamination time can be set to 5 s - 10 s; A pulsed discharge unit for performing pulsed discharge on the end of the electrode post (10) of the lamp bead (9) to melt the end of the electrode post (10); A detection unit that can detect the flatness of the copper foil and the PI film before the raw materials are put into die-cutting. When the flatness deviation exceeds 0.02 mm, it automatically issues an alarm and rejects the raw material; After the lamination is completed, electrical performance tests can be carried out on the finished flexible wire circuit board, including continuity tests and insulation resistance tests. The test results can be displayed in real time, and when the conduction resistance is greater than or equal to 0.1 Ω or the insulation resistance is less than or equal to 100 MΩ, the product is judged unqualified and marked.