Multi-point glue dispensing method and LED glue dispensing packaging system

Abstract

The invention discloses a multi-point glue dispensing method and an LED glue dispensing packaging system, the multi-point glue dispensing method is used for carrying out glue dispensing packaging on an LED, and the multi-point glue dispensing method comprises the following steps: A, matching with silica gel according to the proportion of fluorescent powder or matching with the silica gel according to the wavelength of the fluorescent powder or matching with the silica gel according to the particle size of the fluorescent powder; stirring and defoaming to obtain glue, wherein the stirring time is 5-10 minutes; b, carrying out glue dispensing on the LED by using glue, then carrying out sedimentation centrifugation on the fluorescent powder, then carrying out glue pumping on the LED, and carrying out sedimentation centrifugation for 5-10 minutes; and C, sequentially and repeatedly executing the step A and the step B at least once. The problems that the glue is poor in flowability and cannot be leveled after dispensing due to the fact that the glue concentration is high during one-time dispensing are solved.

Description

Technical Field

[0001] The present invention relates to the field of dispensing encapsulation, and particularly to a multi-point dispensing method and an LED dispensing encapsulation system. Background Art

[0002] LEDs are widely used in many fields such as lighting, display, backlight, automotive electronics, etc. Taking the lighting market as an example, LED lighting gradually replaces traditional lighting products with its advantages of energy saving and long lifespan, and the market scale continues to expand. To meet the growing market demand, efficient and reliable encapsulation technology is needed to ensure the production of LEDs.

[0003] LED chips are very fragile and are easily affected by external environmental factors such as moisture, oxygen, dust, etc. These factors will reduce the performance and lifespan of the chips. Dispensing encapsulation can form a protective film on the chip surface to isolate the interference of the external environment and protect the chip from damage. By selecting a suitable encapsulation glue and precisely coating it around the chip using the dispensing process, effective refraction and scattering of light can be achieved, reducing total internal reflection of light inside the chip, thereby improving the light extraction efficiency of the LED.

[0004] The existing dispensing method stirs phosphor with silica gel and then performs dispensing to dot the fluorescent glue into the bracket cup; since the lamp beads require a very low color temperature, when the amount of phosphor is large and the amount of glue is small, the viscosity of the fluorescent glue is high, and the fluidity of the glue is poor after dispensing and it cannot level off, resulting in abnormal appearance after encapsulation of the lamp bead products and affecting the quality of the products. Summary of the Invention

[0005] In view of the above deficiencies of the prior art, the purpose of the present invention is to provide a multi-point dispensing method and an LED dispensing encapsulation system to solve the problem that the glue concentration is high during single-point dispensing, resulting in poor fluidity of the glue after dispensing and inability to level off.

[0006] The technical solution of the present invention is as follows:

[0007] A multi-point dispensing method for dispensing encapsulation of LEDs, the multi-point dispensing method includes the following steps:

[0008] A. After matching according to the ratio of phosphor with silica gel or according to the wavelength of phosphor with silica gel or according to the particle size of phosphor with silica gel, perform stirring and defoaming to obtain glue, and the stirring time is 5 - 10 minutes;

[0009] B. After dispensing the LED with the glue, perform sedimentation centrifugation on the phosphor, and then perform glue extraction on the LED, and the sedimentation centrifugation time is 5 - 10 minutes;

[0010] C. Sequentially repeat steps A and B at least once.

[0011] Optionally, the step of matching the phosphor with silica gel according to the proportion of the phosphor specifically includes:

[0012] Divide the phosphor into N equal parts, where N is a positive integer greater than 1;

[0013] Mix 1 / N of the phosphor with silica gel.

[0014] Optionally, the number of times of sequentially repeating steps A and B in step C is N times.

[0015] Optionally, the step of matching the phosphor with silica gel according to the wavelength of the phosphor specifically includes:

[0016] Divide the phosphor into long-wave phosphor, medium-wave phosphor, and short-wave phosphor according to the wavelength from long to short;

[0017] Mix the long-wave phosphor, medium-wave phosphor, or short-wave phosphor with silica gel.

[0018] Optionally, in step C, when repeating step A, mix the long-wave phosphor, medium-wave phosphor, and short-wave phosphor with silica gel in sequence.

[0019] Optionally, the step of matching the phosphor with silica gel according to the particle size of the phosphor specifically includes:

[0020] Divide the phosphor into large-particle phosphor, medium-particle phosphor, and small-particle phosphor according to the particle size from large to small;

[0021] Mix the large-particle phosphor, medium-particle phosphor, or small-particle phosphor with silica gel.

[0022] Optionally, in step C, when repeating step A, mix the large-particle phosphor, medium-particle phosphor, and small-particle phosphor with silica gel in sequence.

[0023] Optionally, the range of the ambient temperature when performing steps A and B is 20 - 30 °C.

[0024] Optionally, the phosphor is sedimented and centrifuged by a drum-type centrifugation method at a rotational speed of 1500 revolutions per minute.

[0025] The present invention also provides an LED dispensing and encapsulation system, including a dispenser and an LED to be dispensed. The user performs dispensing and encapsulation on the LED to be dispensed through the dispenser by the multi-point dispensing method described above.

[0026] In the technical solution of the present invention, first, through step A, the phosphor is matched with silica gel according to the proportion of the phosphor, or the phosphor is matched with silica gel according to the wavelength of the phosphor, or the phosphor is matched with silica gel according to the particle size of the phosphor, and then stirring and defoaming are carried out to obtain glue. The stirring time is 5-10 minutes, so as to ensure the uniformity of the glue and make the surface of the glue smoother and flatter. Then, step B is adopted. After dispensing the glue on the LED, sedimentation centrifugation is carried out on the phosphor, and then the glue is pumped out from the LED. The sedimentation centrifugation time is 5-10 minutes, which ensures the uniformity and transparency of the glue and enables the glue to better penetrate the surface and contact area of the LED, thereby enhancing the adhesion of the glue. Step C is to repeat step A and step B at least once in sequence, split the formula of the phosphor and silica gel, and adopt the method of multiple dispensing to reduce the viscosity of the glue for single dispensing. In this way, the present invention can improve the fluidity of the glue after dispensing through the above steps, so as to facilitate the dispensing operation and ensure the normal appearance of the lamp bead product after encapsulation. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0028] Figure 1 It is a flowchart of the method steps of an embodiment of the multi-point dispensing method of the present invention.

[0029] Figure 2 It is a flowchart of the method steps of another embodiment of the multi-point dispensing method of the present invention.

[0030] Figure 3 It is a flowchart of the method steps of yet another embodiment of the multi-point dispensing method of the present invention.

[0031] Figure 4 It is a flowchart of the method steps of still another embodiment of the multi-point dispensing method of the present invention.

[0032] Figure 5 It is a schematic diagram of the phosphor suspended on the silica gel during the centrifugal precipitation of the phosphor of the present invention.

[0033] Figure 6 It is a schematic diagram after the centrifugal precipitation of the phosphor of the present invention. Detailed Embodiments

[0034] To make the purpose, technical solutions and effects of the present invention clearer and more definite, the following further describes the present invention in detail with reference to the accompanying drawings and by way of examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0035] In the embodiments and the claims, unless otherwise specifically defined in the text for articles, the articles "a", "an", "the", and "said" may also include plural forms. If there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one such feature.

[0036] It should be further understood that the term "comprising" used in the specification of the present invention means the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or their groups. It should be understood that when an element is "connected" or "coupled" to another element, it can be directly connected or coupled to other elements, or there may also be intermediate elements. In addition, the "connection" or "coupling" used here may include wireless connection or wireless coupling. The phrase "and / or" used here includes all or any unit and all combinations of one or more related listed items.

[0037] Those skilled in the art of the present technology can understand that, unless otherwise defined, all terms used herein (including technical terms and scientific terms) have the same meaning as the general understanding of those of ordinary skill in the art to which the present invention pertains. It should also be understood that terms such as those defined in a general dictionary should be understood to have a meaning consistent with their meaning in the context of the prior art, and will not be interpreted with an idealized or overly formal meaning unless specifically defined as here.

[0038] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or inability to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0039] LEDs have a wide range of applications in many fields such as lighting, display, backlight, automotive electronics, etc. Taking the lighting market as an example, LED lighting gradually replaces traditional lighting products with its advantages such as energy saving and long lifespan, and the market scale continues to expand. To meet the growing market demand, efficient and reliable packaging technologies are needed to ensure the production of LEDs.

[0040] LED chips are very fragile and vulnerable to external environmental factors such as moisture, oxygen, dust, etc. These factors will reduce the performance and lifespan of the chips. Dotting encapsulation can form a protective film on the chip surface, isolating the interference of the external environment and protecting the chip from damage. By selecting the appropriate encapsulation glue and precisely coating it around the chip using the dotting process, effective refraction and scattering of light can be achieved, reducing total internal reflection of light inside the chip, thereby improving the light extraction efficiency of the LED.

[0041] In the existing dotting method, after the phosphor is mixed with silica gel and stirred, dotting is carried out, and the fluorescent glue is dotted into the bracket cup. Since the color temperature requirement of the lamp bead is very low, when a large amount of phosphor and a small amount of glue are needed, the viscosity of the fluorescent glue is high, and the fluidity of the glue is poor after dotting and it cannot level off, resulting in abnormal appearance after the encapsulation of the lamp bead product and affecting the quality of the product.

[0042] To solve the above problems, the present invention proposes a multi - point dotting method for dotting encapsulation of LEDs.

[0043] Refer to Figure 1 , in one embodiment, the multi - point dotting method includes the following steps:

[0044] S100. After matching the phosphor with silica gel according to the proportion of the phosphor, or according to the wavelength of the phosphor, or according to the particle size of the phosphor, stir and degas to obtain the glue, and the stirring time is 5 - 10 minutes;

[0045] S200. After dotting the LED with the glue, perform sedimentation centrifugation on the phosphor, and then perform glue extraction on the LED. The sedimentation centrifugation time is 5 - 10 minutes;

[0046] S300. Sequentially repeat steps S100 and S200 at least once.

[0047] In this embodiment, the combination of phosphor and silicone can be in different ratios. For example, the ratio of phosphor to silicone is 1:1. It can also be the phosphor ratio of this solution and the existing solution. For example, the ratio of phosphor to silicone in the existing solution is 2:1, then the ratio of phosphor to silicone in this embodiment is 1:1, or other ratios. By reducing the ratio of phosphor in the glue, the viscosity of the mixed fluorescent glue can be reduced, thereby increasing the fluidity of the fluorescent glue. The combination of phosphor and silicone can also be determined according to other characteristics of the phosphor, such as the fluorescence wavelength or particle size of the phosphor. Matching the phosphor with silicone according to the wavelength of the phosphor can improve the excitation effect of the phosphor and reduce the efficiency difference caused by the mutual excitation between phosphors. Matching the phosphor with silicone according to the particle size of the phosphor can improve the xy coordinate landing point of the lamp bead because the phosphor particles settle in order from large to small, and the light emission is more concentrated. The specific combination of phosphor and silicone can be selected according to the actual situation and user needs, and the combination includes but is not limited to the above solutions.

[0048] It can be understood that phosphor and silicone are two different substances. By stirring, the phosphor can be evenly dispersed in the silicone. If sufficient stirring is not carried out, the phosphor may agglomerate, resulting in a large difference in the local fluorescence effect of the glue. Uniform mixing also helps to ensure the stability of the overall performance of the glue. After the phosphor is evenly distributed in the silicone, the fluorescence characteristics and physical properties (such as viscosity, hardness, etc.) of the glue can be consistent in each part. In subsequent use, whether it is coating, molding or curing, the glue can exhibit stable performance and reduce quality problems caused by uneven composition. In addition, during the mixing process of phosphor and silicone, air will inevitably be introduced to form bubbles. These bubbles will affect the quality and performance of the glue. For example, bubbles will reduce the strength and sealing performance of the glue, and may cause defects such as voids and cracks in the product after curing. Therefore, degassing the glue can make the surface of the glue smoother and improve the appearance quality of the product.

[0049] It should be noted that controlling the stirring time within 5 - 10 minutes can ensure that the phosphor and silicone have sufficient time for thorough mixing. If the stirring time is too short, the phosphor may not be fully dispersed in the silicone, resulting in uneven mixing; while if the stirring time is too long, it may cause the temperature of the glue to rise, affecting its performance and even potentially causing premature curing of the silicone. Prolonged stirring may have a negative impact on the performance of the glue. For example, excessive stirring may damage the molecular structure of the silicone, reducing its viscosity and elasticity; at the same time, it may also damage the surface structure of the phosphor, affecting its fluorescence performance. Therefore, controlling the stirring time within an appropriate range can ensure the mixing effect while avoiding problems caused by excessive stirring. In this way, in LED packaging, a uniform distribution of the phosphor can ensure stable color coordinates of the white LED, no dark areas in the colloid after degassing, and improved light extraction quality.

[0050] After dispensing glue on the LED, it is necessary to perform sedimentation centrifugation on the phosphor. Through sedimentation centrifugation, the phosphor can be evenly distributed, reducing the generation of internal stress, enhancing the bonding force between the glue and various components, and improving the reliability of LED packaging; and the centrifugal precipitation can adjust the concentration of the phosphor at different positions in the glue according to requirements. The concentration of the phosphor can be appropriately increased near the LED chip to fully absorb the blue light emitted by the chip (for common blue light-excited LEDs) and convert it into light of other colors; while the concentration is reduced at positions far from the chip to reduce scattering and absorption losses of light during propagation and improve the light efficiency. And the process of pumping out the glue can effectively remove the bubbles that may be generated during the dispensing and mixing processes, ensuring the uniformity and transparency of the glue; and through pumping out the glue, the glue can better penetrate the surface and contact area of the LED, thereby enhancing the adhesiveness of the glue and ensuring a firm bond between the LED and the packaging material.

[0051] Furthermore, step S300 is to sequentially repeat step S100 and step S200 at least once. In this way, the formula of the phosphor and silicone is split, and by using the method of multiple dispensing, while keeping the total amount of the phosphor unchanged, the content of the phosphor in the glue for a single dispensing is reduced, thereby reducing the viscosity of the fluorescent glue and improving the fluidity of the glue after dispensing to facilitate the dispensing operation and ensure the normal appearance of the lamp bead product after packaging.

[0052] The technical solution of the present invention first matches the phosphor with silicone according to the proportion of the phosphor, or matches the phosphor with silicone according to the wavelength of the phosphor, or matches the phosphor with silicone according to the particle size of the phosphor, and then stirs and defoams to obtain glue. The stirring time is 5-10 minutes, so as to ensure the uniformity of the glue and make the surface of the glue smoother and flatter. Then, step S200 is adopted. After dispensing the glue on the LED, the phosphor is subjected to sedimentation centrifugation, and then the glue on the LED is extracted. The sedimentation centrifugation time is 5-10 minutes to ensure the uniformity and transparency of the glue, and make the glue better penetrate into the surface and contact area of the LED, thereby enhancing the adhesion of the glue. Step S300 is to repeat step S100 and step S200 at least once in sequence, split the formula of the phosphor and silicone, and adopt the method of dispensing glue multiple times to reduce the viscosity of the glue dispensed each time. In this way, the present invention can improve the fluidity of the glue after dispensing through the above steps, so as to facilitate the dispensing operation and ensure the normal appearance of the lamp bead product after encapsulation.

[0053] Referring to Figure 2 , in an embodiment, the step of matching the phosphor with the glue according to the proportion of the phosphor specifically includes:

[0054] S111. Divide the phosphor into N equal parts, where N is a positive integer greater than 1;

[0055] S112. Mix 1 / N of the phosphor with silicone.

[0056] In this embodiment, the phosphor is divided into N equal parts. Taking three parts as an example, the phosphor in the original formula needs to be split into three equal parts. In this way, the amount of phosphor dispensed each time is only 1 / 3 of the original amount. In this way, the concentration of the glue dispensed each time is 1 / 3 lower than the original, and the viscosity of the glue can be reduced, thereby increasing the fluidity of the glue. The specific number of equal parts can be selected according to the actual situation and user needs. For example, if the fluidity of the glue is still low after being divided into three parts, it can be divided into four parts or more; if the fluidity is high, it can also be divided into two parts.

[0057] Further, in this embodiment, the number of times of sequentially repeating step S100 and step S200 in step S300 is N times. After dividing the phosphor into N equal parts, to ensure that the total amount of phosphor dispensed remains unchanged and avoid reducing the luminous effect, step S100 and step S200 can be repeated N times. For example, if the phosphor is divided into 3 parts, the steps of dispensing glue, centrifuging and precipitating the phosphor, and extracting the glue are performed 3 times.

[0058] Referring to Figure 3 , in an embodiment, the step of matching the phosphor with the silicone according to the wavelength of the phosphor specifically includes:

[0059] S113. Divide the phosphor powders into long - wavelength phosphor powders, medium - wavelength phosphor powders, and short - wavelength phosphor powders according to the wavelength from long to short;

[0060] S114. Mix the long - wavelength phosphor powders, medium - wavelength phosphor powders, or short - wavelength phosphor powders with silica gel.

[0061] In this embodiment, mixing the phosphor powders with silica gel according to the wavelength of the phosphor powders can improve the excitation effect of the phosphor powders when dispensing the obtained glue, thereby avoiding the situation of poor efficiency caused by the mutual excitation between the phosphor powders. For example, if the phosphor powders include red phosphor powders and yellow - green phosphor powders, and the red phosphor powders are divided into long - wavelength red powders and short - wavelength red powders, then the long - wavelength red powders correspond to the long - wavelength phosphor powders, the short - wavelength red powders correspond to the medium - wavelength phosphor powders, and the yellow - green phosphor powders correspond to the short - wavelength phosphor powders. After mixing different - wavelength phosphor powders with silica gel, the obtained glue is used for dispensing. The specific wavelengths of different powders in the phosphor powders can be determined according to the actual situation, and there can be four or more different - wavelength phosphor powders.

[0062] Further, in this embodiment, in the step S300, when repeating the step S100, the long - wavelength phosphor powders, medium - wavelength phosphor powders, and short - wavelength phosphor powders are successively mixed with silica gel. In the case of having three - wavelength phosphor powders, the glue mixed with long - wavelength red powders and silica gel can be used for the first dispensing, the glue mixed with short - wavelength red powders and silica gel can be used for the second dispensing, and the glue mixed with yellow - green phosphor powders and silica gel can be used for the third dispensing. In this way, the situation of poor efficiency caused by the mutual excitation between the phosphor powders can be avoided.

[0063] Refer to Figure 4 , in an embodiment, the step of matching the phosphor powders with silica gel according to the particle size of the phosphor powders specifically includes:

[0064] S115. Divide the phosphor powders into large - particle phosphor powders, medium - particle phosphor powders, and small - particle phosphor powders according to the particle size from large to small;

[0065] S116. Mix the large - particle phosphor powders, medium - particle phosphor powders, or small - particle phosphor powders with silica gel.

[0066] In this embodiment, dispensing can be carried out in batches according to the particle size of the phosphor powders, and dispensing is carried out in batches from large to small according to the particle size of the phosphor powders. In this way, the xy - coordinate landing point of the lamp beads can be effectively improved because the phosphor powders settle in batches from large to small, and the light emission is more concentrated; the powders with different particle sizes in the phosphor powders can be determined according to the actual situation, and there can also be four or more different - particle - size phosphor powders.

[0067] Further, in this embodiment, in the step S300, when repeating the step S100, the large-sized phosphor powder, the medium-sized phosphor powder, and the small-sized phosphor powder are sequentially combined and mixed with silicone. In the case of having three sizes of phosphor powders, the glue for the first dispensing can be the mixture of the large-sized phosphor powder and silicone, the glue for the second dispensing can be the mixture of the medium-sized phosphor powder and silicone, and the glue for the third dispensing can be the mixture of the small-sized phosphor powder and silicone. In this way, the xy coordinate landing point of the lamp beads can be effectively improved, and the light emission can be made more concentrated.

[0068] In one embodiment, when performing the step S100 and the step S200, the ambient temperature ranges from 20 to 30 °C; the phosphor powder is subjected to sedimentation centrifugation by a drum-type centrifugation method, and the rotation speed is 1500 revolutions per minute.

[0069] In this embodiment, controlling the ambient temperature range to 20 - 30 °C can make the viscosity of the dispensing material (such as silicone) relatively moderate, which is beneficial to uniform coating and filling, and ensures that the glue can fully cover the LED chip and the phosphor powder; the appropriate temperature can also promote the curing reaction of the dispensing material, ensuring that the packaged LED lamp beads have good mechanical strength and heat resistance; and at an appropriate temperature, the generation of bubbles is reduced, ensuring the optical performance and reliability of the package. Through drum-type centrifugal sedimentation, at a rotation speed of 1500 revolutions per minute, the larger-sized phosphor powder will settle to the bottom of the container faster due to the greater centrifugal force, while the smaller-sized phosphor powder will settle relatively slower. In this way, the size grading of the phosphor powder can be achieved, and the phosphor powders in different size ranges can be separated, so as to select the phosphor powder with a suitable size for packaging according to actual needs, improving the light emission quality of the LED. And the phosphor powder particles are prone to form aggregates during storage and transportation, which will affect their dispersion uniformity in silicone. The centrifugal force and shear force generated by drum-type centrifugation can break the aggregates of the phosphor powder, making the phosphor powder particles fully dispersed. At a rotation speed of 1500 revolutions per minute, this dispersion effect is relatively ideal, which can ensure that the phosphor powder is more uniform when mixed with silicone, so that the light emitted by the LED is more uniform, avoiding problems such as color differences and light spots.

[0070] The present invention also proposes an LED dispensing and packaging system.

[0071] In one embodiment, the LED dispensing and packaging system includes a dispenser and an LED to be dispensed. The user performs dispensing and packaging on the LED to be dispensed by the dispenser using the multi-point dispensing method described above. It can be understood that by performing dispensing and packaging on the LED to be dispensed through the above multi-point dispensing method, the viscosity of the glue for a single dispensing can be reduced by multiple dispensing, and the fluidity of the glue after dispensing can be improved, so as to facilitate the dispensing operation on the LED and ensure the normal appearance of the LED lamp bead product after packaging. The situation of the phosphor powder suspended on the silicone during centrifugal precipitation after dispensing can be referred toFigure 5 , the phosphor is suspended on the silica gel; the situation after the phosphor is centrifuged and precipitated after dispensing can be referred to Figure 6 . The surfaces of the lamp beads are all silica gel, and a syringe can be used to pump the silica gel out of the lamp beads, removing 2 / 3 of the silica gel.

[0072] It should be understood that the application of the present invention is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present invention.

Claims

1. A multi - point gluing method for dot - gluing and encapsulating LEDs, characterized in that, It includes the following steps: A. After matching the phosphor with silica gel according to the proportion of the phosphor, or according to the wavelength of the phosphor, or according to the particle size of the phosphor, stir and defoam to obtain glue, and the stirring time is 5 - 10 minutes; B. Use the glue to dispense the LED, then sediment and centrifuge the phosphor, and then extract the glue from the LED. The sedimentation and centrifugation time is 5 - 10 minutes; C. Sequentially repeat steps A and B at least once.

2. The multi-point glue application method according to claim 1, characterized in that The step of matching the phosphor with silica gel according to the proportion of the phosphor specifically includes: Divide the phosphor into N equal parts, where N is a positive integer greater than 1; Match and mix 1 / N of the phosphor with silica gel.

3. The multi-point glue application method according to claim 2, wherein, In step C, the number of times of sequentially repeating steps A and B is N times.

4. The multi-point dispensing method according to claim 1, wherein The step of matching the phosphor with silica gel according to the wavelength of the phosphor specifically includes: Divide the phosphor into long-wavelength phosphor, medium-wavelength phosphor, and short-wavelength phosphor according to the wavelength from long to short; Match and mix the long-wavelength phosphor, medium-wavelength phosphor, or short-wavelength phosphor with silica gel.

5. The multi-point glue application method according to claim 4, characterized in that, In step C, when repeating step A, sequentially match and mix the long-wavelength phosphor, medium-wavelength phosphor, and short-wavelength phosphor with silica gel.

6. The multi-point glue application method according to claim 1, characterized in that The step of matching the phosphor with silica gel according to the particle size of the phosphor specifically includes: Divide the phosphor into large-particle phosphor, medium-particle phosphor, and small-particle phosphor according to the particle size from large to small; Match and mix the large-particle phosphor, medium-particle phosphor, or small-particle phosphor with silica gel.

7. The multi-point glue application method according to claim 6, characterized in that, In step C, when repeating step A, sequentially match and mix the large-particle phosphor, medium-particle phosphor, and small-particle phosphor with silica gel.

8. The multi-point dispensing method according to claim 1, characterized in that, When performing steps A and B, the ambient temperature ranges from 20 - 30 °C.

9. The multi-point glue application method according to claim 1, characterized in that, Use a drum-type centrifugation method to sediment and centrifuge the phosphor, and the rotation speed is 1500 revolutions per minute.

10. An LED dispensing and encapsulation system, characterized in that, It includes a dispenser and an LED to be dispensed. The user uses the dispenser to perform the multi-point dispensing method according to any one of claims 1 - 9 to dispense and encapsulate the LED to be dispensed.

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