Flushing device for silicon parts with micropores

Abstract

The invention relates to the field of silicon material processing devices, in particular to flushing equipment for silicon parts with micropores, which comprises a working space, a liquid supply mechanism and a supporting mechanism, and the supporting mechanism comprises a first supporting piece and a second supporting piece; the first supporting pieces and the second supporting pieces are distributed in a staggered mode in the plane direction parallel to the loading face. The driving assembly is used for driving the supporting mechanism to be alternately switched between a first state and a second state, in the first state, the supporting face of the first supporting piece coincides with the loading face, and an interval space is formed between the supporting face of the second supporting piece and the loading face; in the second state, the supporting face of the second supporting piece coincides with the loading face, and an interval space is formed between the supporting face of the first supporting piece and the loading face. The supporting mechanisms are cyclically alternated, so that the first supporting piece and the second supporting piece can cyclically support the silicon component; and in addition, along with the circulation process, all micropores in the silicon part can be washed by the cleaning liquid.

Description

Technical Field

[0001] The present application relates to the field of silicon material processing devices, and particularly to a flushing device for silicon components with micropores. Background Art

[0002] Silicon materials, as common materials in the semiconductor industry, have extensive applications in this field.

[0003] For some silicon components that need to process a large number of micropores on the surface (where the micropores axially penetrate the silicon components), after the micropores are processed, the silicon components need to be flushed to wash away the impurities remaining in the micropores; due to the small pore diameter of the micropores, directly using the cleaning liquid cannot wash away the impurities in the micropores, so usually a high-pressure cleaning liquid is used for cleaning, that is, after the silicon component is loaded, a high-pressure cleaning liquid is provided from one side of the silicon component, and under the action of pressure, the cleaning liquid will flow through the micropores to the other side of the silicon component. When the cleaning liquid flows through the micropores, the impurities in the micropores can be carried out to achieve cleaning.

[0004] Although this pressurized cleaning method can well wash away the impurities in the micropores, there are still deficiencies: since the micropores are generally distributed in the middle area of the silicon component, in order not to block the micropores, the silicon component is usually clamped and fixed at the edge position of the silicon component. This method can avoid blocking the micropores during clamping, but this method will make the area of the silicon component close to the middle area have no support. In this way, under the high pressure during cleaning, the silicon component is likely to break and other problems, so there is still room for improvement. Summary of the Invention

[0005] In order to solve at least one technical problem mentioned in the background art, the purpose of the present application is to provide a flushing device for silicon components with micropores.

[0006] To achieve the above purpose, the present application provides the following technical solutions.

[0007] A flushing device for silicon components with micropores, characterized by comprising: A working space, the working space includes a loading surface, the silicon component can be loaded and fixed on the loading surface. When the silicon component is loaded on the loading surface, the silicon component divides the working space into a first space and a second space, and the first space and the second space are communicated through the micropores of the silicon component; A liquid supply mechanism for filling the cleaning liquid into the first space; A support mechanism provided in the second space for supporting the silicon component, the support mechanism includes at least one first support member and at least one second support member; the first support member and the second support member are distributed in a staggered manner in the plane direction parallel to the loading surface; The device further includes a driving component, which is used to drive the supporting mechanism to alternately switch between a first state and a second state. In the first state, the supporting surface of the first support member coincides with the loading surface, and a spaced space is formed between the supporting surface of the second support member and the loading surface; in the second state, the supporting surface of the second support member coincides with the loading surface, and a spaced space is formed between the supporting surface of the first support member and the loading surface.

[0008] As an optional implementation manner of the present application, the supporting mechanism moves along a first direction to realize the switching between the first state and the second state, and the first direction is perpendicular to the loading surface.

[0009] As an optional implementation manner of the present application, the driving component includes: A first driving disk, which can rotate around a first axis, the first axis is parallel to the first direction, the first driving disk includes a circumferential first track surface with the first axis as the central axis, the first track surface includes a first base surface and a first convex surface protruding parallel to the first direction from the first base surface; both ends of the first convex surface are connected to the first base surface through inclined first guide surfaces; A first guide wheel, which is relatively fixed to the first support member; the first guide wheel can rotate circumferentially on the first track surface relative to the first track surface. When the first guide wheel is on the first convex surface, the supporting surface of the first support member coincides with the loading surface; A second driving disk, which can rotate around the first axis, the second driving disk includes a circumferential second track surface with the first axis as the central axis, the second track surface includes a second base surface and a second convex surface protruding parallel to the first direction from the second base surface; both ends of the second convex surface are connected to the second base surface through inclined second guide surfaces; A second guide wheel, which is relatively fixed to the second support member; the second guide wheel can rotate circumferentially on the second track surface relative to the second track surface; when the second guide wheel is on the second convex surface, the supporting surface of the second support member coincides with the loading surface; The first track surface and the second track surface are configured such that when the first guide wheel is on the first base surface or the first guide surface, the second guide wheel is on the second convex surface, so that the supporting mechanism enters the second state; when the second guide wheel is on the second base surface or the second guide surface, the first guide wheel is on the first convex surface, so that the supporting mechanism enters the first state.

[0010] As an optional implementation manner of the present application, at least a part of the adjacent ends of the first convex surface and the second convex surface coincide to form a coincident section. When the first guide wheel and the second guide wheel are in the coincident section, the supporting mechanism enters an intermediate state. In the intermediate state, the supporting surfaces of both the first support member and the second support member coincide with the loading surface.

[0011] As an alternative embodiment of the present application, the first convex surface includes two sections, the two sections of the first convex surface are symmetrically arranged about the first axis, and the spaced area between the ends of the two sections of the first convex surface forms the first base surface; the first guide wheels include two, and the two first guide wheels are symmetrically arranged about the first axis; And / or, the second convex surface includes two sections, the two sections of the second convex surface are symmetrically arranged about the first axis, and the spaced area between the ends of the two sections of the second convex surface forms the second base surface; the second guide wheels include two, and the two second guide wheels are symmetrically arranged about the first axis.

[0012] As an alternative embodiment of the present application, the first driving disk is provided with a first protruding portion, the top surface of the first protruding portion forms the first convex surface, and the end surface of the first protruding portion forms the first guiding surface; And / or the second driving disk is provided with a second protruding portion, the top surface of the second protruding portion forms the second convex surface, and the end surface of the second protruding portion forms the second guiding surface.

[0013] As an alternative embodiment of the present application, the driving mechanism further includes a rotating shaft and a motor for driving the rotating shaft to rotate, the first driving disk and the second driving disk are coaxially fixed on the rotating shaft, and the axis of the rotating shaft forms the first axis.

[0014] As an alternative embodiment of the present application, the driving mechanism further includes a first elastic member and a second elastic member, the first elastic member is used to provide a first elastic force for the first support member, and under the action of the first elastic force, the first support member has a tendency to move away from the loading surface side along the first direction; the second elastic member is used to provide a second elastic force for the second support member, and under the action of the second elastic force, the second support member has a tendency to move away from the loading surface side along the first direction.

[0015] As an alternative embodiment of the present application, the device includes a machine table and a cover body, the cover body can move along the first direction to cover the machine table, a positioning groove for embedding a silicon component is formed on the top surface of the machine table, and the groove bottom surface of the positioning groove forms the loading surface; in the loading state, the silicon component is pressed between the cover body and the loading surface by the cover body.

[0016] As an alternative embodiment of the present application, a water outlet is provided at the bottom of the second space.

[0017] Compared with the prior art, the advantages of adopting this solution are as follows: During flushing, the driving mechanism drives the supporting mechanism to switch back and forth between the first state and the second state. In this way, when the supporting mechanism moves to the first state, the first supporting member supports the middle part of the silicon component. At this time, since the first supporting member is in contact with the bottom surface of the silicon component, some micropores in the middle part of the silicon component will be blocked by the first supporting member, and the cleaning liquid cannot pass through these micropores normally. At this time, it is equivalent to that the flushing liquid only flushes the micropores that are not blocked by the first supporting member.

[0018] Then the supporting mechanism enters the second state. At this time, the second supporting member supports the middle part of the silicon component. Similarly, the second supporting member will block the micropores in the corresponding area of the second supporting member while supporting. The micropores in the part corresponding to the first supporting member will be opened because of the distance of the first supporting member, so that the micropores previously blocked by the first supporting member can be flushed.

[0019] Such alternating cycles enable the first support member and the second support member to cyclically support the silicon component; and along with the cycle process, all micropores on the silicon component can be rinsed by the cleaning liquid.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become readily understood. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, wherein: In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0022] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 A cross-sectional view of the present application; Figure 3 This is a cross-sectional view of the cover body of the present application in a closed state; Figure 4 This is a schematic diagram of the structure of the support mechanism and drive assembly of this application; Figure 5 This is a schematic diagram of the structure of the support mechanism and drive assembly of this application in a disassembled state; Figure 6 This is a schematic diagram of the local structure of the drive component of this application; Figure 7 A top view of the support mechanism of this application; Figure 8 This is a top view of the support mechanism of the present application in a first state; Figure 9 The top view of the support mechanism of this application in the middle state; Figure 10 The top view of the support mechanism of this application in the second state; Figure 11 The top view of the silicon component with micropores.

[0023] Explanation of the reference numerals in the figure: M, working space; M1, first space; M2, second space; M21, water outlet; A, overlapping section.

[0024] 1, machine platform; 11, positioning groove; 111, loading surface; 2, cover body; 21, hydraulic cylinder; 22, liquid outlet pipe; 23, sealing ring; 3, support mechanism; 31, first support member; 310, first fixing plate; 311, first connecting rod; 312, first spring; 313, first connecting block; 32, second support member; 320, second fixing plate; 321, second connecting rod; 322, second spring; 323, second connecting block; 4, drive assembly; 41, first drive disk; 411, first base surface; 412, first convex surface; 413, first guide surface; 414, first protruding portion; 42, second drive disk; 421, second base surface; 422, second convex surface; 423, second guide surface; 424, second protruding portion; 43, first guide wheel; 44, second guide wheel; 45, rotating shaft. Detailed implementation manners

[0025] To make the objectives, features, and advantages of this application more obvious and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of this application.

[0026] Referring to Figures 1-10 as shown, this embodiment provides a flushing device, which is mainly used for silicon components with micropores, such as Figure 11 as shown, the silicon component is generally disk-shaped, and a number of micro-through holes are machined in the middle area of the silicon component, for example, micropores with a pore diameter of 0.5 mm - 3 mm; the micropores penetrate the silicon component, and this device is mainly used to flush away the impurities remaining in the micropores.

[0027] Such as Figure 2 and Figure 3As shown, the device mainly includes a working space M, a liquid supply mechanism, and a support mechanism 3. The following will specifically describe each component of the device. For convenience of description, in this embodiment, the claimed first direction can be understood as the vertical direction.

[0028] The working space M serves as the space for flushing the silicon component. Among them, as Figure 2 shown, the working space M includes a loading surface 111, and the silicon component can be loaded and fixed on the loading surface 111, where the loading surface 111 is a flat surface; for example, in this embodiment, the loading surface 111 is a horizontal plane.

[0029] As Figure 3 shown, when the silicon component (as shown by part N in Figure 3 ) is loaded on the loading surface 111, the silicon component divides the working space M into a first space M1 in the upper part and a second space M2 in the lower part. The first space M1 and the second space M2 are connected through the micropores of the silicon component.

[0030] Among them, the first space M1 is mainly used for introducing the cleaning liquid, and the second space M2 serves as the space for the cleaning liquid to flow out and the installation space for the support mechanism 3.

[0031] Regarding the specific formation of the installation space, it can be, as Figure 1 shown, the device includes a machine table 1 and a cover 2. The cover 2 can move along the first direction to cover the machine table 1, that is, the cover 2 can move vertically to achieve opening or closing; for example, the cover 2 is fixed to a hydraulic cylinder 21, and the hydraulic cylinder 21 drives the cover 2 to move vertically to achieve the opening / closing of the cover 2, where the hydraulic cylinder 21 is fixed to a frame (not shown in the figure).

[0032] As Figure 3 shown, when the cover 2 covers the machine table 1, the cover 2 and the machine table 1 together enclose the working space M. At this time, the space inside the cover 2 constitutes the first space M1, and the space inside the machine table 1 constitutes the second space M2.

[0033] The silicon component is placed on the machine table 1. In order to position the silicon component, in some embodiments, as Figure 1 shown, the top surface of the machine table 1 is provided with a positioning groove 11 for the silicon component to be embedded. The positioning groove 11 is basically similar to the diameter of the silicon component for the silicon component to be embedded; at this time, the bottom surface of the positioning groove 11 constitutes the aforementioned loading surface 111.

[0034] When loading the silicon component, the silicon component is placed in the positioning groove 11, supported by the loading surface 111, and then the lower edge of the cover 2 presses on the edge of the upper surface of the silicon component, thereby pressing the silicon component tightly to achieve the loading of the silicon component.

[0035] To improve the sealing performance of the cover 2, a sealing ring 23 is provided along the lower edge of the cover 2. When the cover 2 is in the closed state, the sealing ring 23 is pressed against the top surface of the silicon component by the cover 2 to form a seal.

[0036] It should be noted that the micropores of the silicon component are mainly in the middle region of the silicon component, and there are basically no micropores in the edge region of the silicon component. Therefore, pressing the edge of the silicon component by the cover 2 will not block the micropores.

[0037] The liquid supply mechanism is mainly used to fill the cleaning liquid into the first space M1. The cleaning liquid can be a washing liquid, or clean water, or an acid solution, etc., which is not specifically limited here. The liquid supply mechanism mainly includes a liquid pump. The inlet end of the liquid pump is connected to the liquid source storing the cleaning liquid, and the outlet end is connected to the first space M1 through the liquid outlet pipe 22. In some embodiments, the end of the liquid outlet pipe 22 far from the liquid pump is fixed on the cover 2.

[0038] After the silicon component is loaded, the cleaning liquid is pumped into the first space M1 through the liquid pump. When the first space M1 is filled with the cleaning liquid and the cleaning liquid continues to be pumped in, the cleaning liquid in the first space M1 will generate a relatively large pressure. Under this pressure, the cleaning liquid can pass through the micropores and flow into the second space M2. During this process, the cleaning liquid flowing through the micropores can carry out the impurities in the micropores, so as to achieve the purpose of flushing. To discharge the waste liquid in the second space M2, a water outlet M21 is provided at the bottom of the second space M2.

[0039] In this embodiment, the bottom of the silicon component is mainly supported by the loading surface 111, and the middle region of the silicon component is basically in a suspended state without any support. When flushing, the upper surface of the silicon component will bear the hydraulic pressure from the first space M1, so that the silicon component is easily broken. Therefore, in this embodiment, a support mechanism 3 is also provided in the second space M2 to support the middle part of the silicon component. Specifically: As Figure 4 shown, the support mechanism 3 includes at least one first support member 31 and at least one second support member 32. The first support member 31 and the second support member 32 are distributed in a staggered manner in the plane direction parallel to the loading surface 111, that is, the first support member 31 and the second support member 32 are distributed in a staggered manner in the horizontal direction.

[0040] For example, as Figure 4 、 Figure 7 shown, in this embodiment, the case of using 4 first support members 31 and 4 second support members 32 is shown. The 8 support members are alternately distributed in a circular shape around the first axis, that is, there is a second support member 32 between two adjacent first support members 31. Here, the first axis is parallel to the vertical direction, or perpendicular to the loading surface 111.

[0041] Among them, the top surfaces of the first support member 31 and the second support member 32 are both horizontal planes, serving as the support surfaces for supporting the silicon component. In addition, the support surfaces of the four first support members 31 are at the same height, and the four first support members 31 are relatively fixed. The support surfaces of the four second support members 32 are at the same height, and the four second support members 32 are relatively fixed.

[0042] For example, as Figure 5 shown, the four first support members 31 are respectively fixed on the same first fixing disk 310 through four first connecting rods 311; correspondingly, the four second support members 32 are respectively fixed on the same second fixing disk 320 through four second connecting rods 321. The first fixing disk 310 is located directly above the second fixing disk 320, and there is a vertical interval between the two. In this way, as long as the fixing disk moves vertically, all the support members fixed on the fixing disk can be driven to move synchronously.

[0043] Both the first support member 31 and the second support member 32 can move along the first direction; in addition: The device further includes a driving assembly 4, and the driving assembly 4 is used to drive the support mechanism 3 to alternately switch between a first state and a second state: In the first state, as Figure 3 shown in the state, the support surface (top surface) of the first support member 31 coincides with the loading surface 111, and there is an interval space in the vertical direction between the support surface (top surface) of the second support member 32 and the loading surface 111. At this time, it is equivalent that the top surface of the first support member 31 is at the same height as the loading surface 111, so as to fit the bottom surface of the silicon component to form support for the silicon component; at the same time, the top surface of the second support member 32 is lower than the loading surface 111, so that the top surface of the second support member 32 will not fit the bottom surface of the silicon component.

[0044] In the second state (not shown in the figure), the support surface of the second support member 32 coincides with the loading surface 111, and there is an interval space in the vertical direction between the support surface of the first support member 31 and the loading surface 111. This state is exactly opposite to the first state. That is, in this state, the top surface of the second support member 32 fits the bottom surface of the silicon component to form support for the silicon component. At the same time, the first support member 31 is lower than the bottom surface of the silicon component and does not contact the bottom surface of the silicon component.

[0045] During rinsing, the driving mechanism drives the support mechanism 3 to alternately switch between the first state and the second state. In this way, when the support mechanism 3 moves to the first state, the first support member 31 forms support for the middle part of the silicon component. At this time, since the first support member 31 fits the bottom surface of the silicon component, some micropores in the middle part of the silicon component will be blocked by the first support member 31, and the cleaning liquid cannot normally pass through these micropores; at this time, it is equivalent that the rinsing liquid only rinses the micropores not blocked by the first support member 31.

[0046] Then the support mechanism 3 enters the second state. At this time, the second support member 32 supports the middle part of the silicon component. Similarly, while the second support member 32 is supporting, it will block the micropores in the corresponding area of the second support member 32, and the micropores in the part corresponding to the first support member 31 will be opened because the first support member 31 moves away, so that the micropores previously blocked by the first support member 31 can be flushed.

[0047] In this way, the first support member 31 and the second support member 32 can cyclically support the silicon component; and as the cycle progresses, all the micropores on the silicon component can be flushed by the cleaning liquid.

[0048] In some embodiments, the support mechanism 3 mainly realizes the switching between the first state and the second state by moving along the first direction, and the first direction is perpendicular to the loading surface 111.

[0049] In order to be able to drive the above actions of the support mechanism 3, in some embodiments, as Figure 4 shown, the driving assembly 4 mainly includes a first driving disk 41, a first guide wheel 43, a second driving disk 42, a second guide wheel 44, etc., which will be described one by one below: In some embodiments, as Figure 6 shown, both the first driving disk 41 and the second driving disk 42 are in a disk structure, and the two are coaxially arranged based on the first axis. Among them, as Figure 4 shown, the first driving disk 41 is located above the second driving disk 42; and the first driving disk 41 is located between the first fixed disk 310 and the second fixed disk 320.

[0050] The first driving disk 41 can rotate around the first axis. Here, the first axis can be considered as the axis of the first driving disk 41 and the second driving disk 42, and the first axis is parallel to the first direction.

[0051] The first driving disk 41 includes a circumferential first track surface with the first axis as the center line. As Figure 6 shown, the first track surface includes a first base surface 411 and a first convex surface 412 protruding parallel to the first direction from the first base surface 411; both ends of the first convex surface 412 are connected to the first base surface 411 through inclined first guide surfaces 413.

[0052] In some embodiments, the specific structure of the first guiding surface 413 may be that a circular-arc-shaped first protrusion 414 is fixed on the upper surface of the first driving disk 41. The top surface of the first protrusion 414 constitutes the first convex surface 412, and the end surface of the protrusion is inclined to form the first guiding surface 413. At this time, a partial area on the upper surface of the first driving disk 41 constitutes the first base surface 411. The function of the inclined first guiding surface 413 is to guide the first guide wheel 43 to travel between the first base surface 411 and the first convex surface 412.

[0053] As Figure 5 shown, the first guide wheel 43 is kept relatively fixed with respect to the first support member 31. For example, in this embodiment, the first guide wheel 43 is fixed to the bottom of the first fixed disk 310. Thus, when the first driving disk 41 is driven to rotate, the first guide wheel 43 can rotate circumferentially on the first track surface relative to the first track surface. Substantially, the first guide wheel 43 remains stationary while the first track surface rotates circumferentially. From the perspective of the relativity of motion, it can be understood that the first guide wheel 43 moves circumferentially relative to the first track surface.

[0054] Thus, when the first guide wheel 43 moves from the first base surface 411 along the first guiding surface 413 to the first convex surface 412, the first guide wheel 43 will gradually rise, and then gradually lift the entire first support member 31 until the first guide wheel 43 is at the first convex surface 412 and reaches the highest point. At this time, the top surface of the first support member 31 is exactly flush with the loading surface 111, realizing the support for the silicon component, that is, when the first guide wheel 43 is on the first convex surface 412, the support surface of the first support member 31 coincides with the loading surface 111.

[0055] When the first guide wheel 43 moves from the first convex surface 412 along the first guiding surface 413 to the first base surface 411, the first guide wheel 43 will gradually descend, and then drive the first support member 31 to descend. When the first guide wheel 43 is at the first base surface 411, the first support member 31 is at the lowest position. At this time, the top surface of the first support member 31 is spaced from the bottom surface of the silicon component to relieve the shielding of the bottom surface of the silicon component.

[0056] The second driving disk 42 can rotate around the first axis. The second driving disk 42 includes a circumferential second track surface with the first axis as the central axis. As Figure 6 shown, the second track surface includes a second base surface 421 and a second convex surface 422 that protrudes from the second base surface 421 in parallel along the first direction. Both ends of the second convex surface 422 are connected to the second base surface 421 through inclined second guiding surfaces 423.

[0057] In some embodiments, the specific structure of the second guiding surface 423 may be that a second convex portion 424 in an arc shape is fixed on the upper surface of the second driving disk 42. The top surface of the second convex portion 424 constitutes the second convex surface 422, and the end surface of the second convex portion 424 is inclined to form the second guiding surface 423. At this time, a partial area on the upper surface of the second driving disk 42 constitutes the second base surface 421. The function of the inclined second guiding surface 423 is to guide the second guide wheel 44 to travel between the second base surface 421 and the second convex surface 422.

[0058] The second guide wheel 44 is kept relatively fixed with respect to the second support member 32. For example, in this embodiment, Figure 4 as shown, the second guide wheel 44 is fixed to the bottom of the second fixing disk 320.

[0059] In this way, when the second driving disk 42 is driven to rotate, the second guide wheel 44 can rotate circumferentially on the second track surface with respect to the second track surface.

[0060] The movement of the second guide wheel 44 on the second track surface is basically the same as the movement principle of the first guide wheel 43 with respect to the first track surface, and reference can be made to the description of the first guide wheel 43 part.

[0061] In this way, when the second guide wheel 44 is on the second convex surface 422, at this time, the second support member 32 is at the highest point, and the support surface of the second support member 32 coincides with the loading surface 111 to support the silicon component.

[0062] In addition, the first track surface and the second track surface are further configured as: As Figure 10 shown, when the first guide wheel 43 is on the first base surface 411 or the first guiding surface 413, the second guide wheel 44 is on the second convex surface 422, so that the support mechanism 3 enters the second state; As Figure 8 shown, when the second guide wheel 44 is on the second base surface 421 or the second guiding surface 423, the first guide wheel 43 is on the first convex surface 412, so that the support mechanism 3 enters the first state.

[0063] As a way to satisfy the above configuration of the track surface, in some embodiments: As Figure 6 shown, the first convex portion 414 is provided in two sections, so that the first convex surface 412 is formed in two sections. The two sections of the first convex surface 412 are symmetrically arranged about the first axis, and the interval area between the ends of the two sections of the first convex surface 412 constitutes the first base surface 411; the first guide wheel 43 includes two, and the two first guide wheels 43 are symmetrically arranged about the first axis.

[0064] In addition, the second convex portion 424 is also provided in two sections, so that the second convex surface 422 is formed in two sections. The two sections of the second convex surface 422 are symmetrically arranged about the first axis, and the interval region between the ends of the two sections of the second convex surface 422 constitutes the second base surface 421. There are two second guide wheels 44, and the two second guide wheels 44 are symmetrically arranged about the first axis.

[0065] As Figure 8 shown, this state can be recorded as the initial state. The midpoints of the two sections of the first convex surface 412 are respectively at the 12 o'clock and 6 o'clock positions, and the two first guide wheels 43 are respectively at the 12 o'clock and 6 o'clock positions on the circumference where the first convex surface 412 is located; the midpoints of the two sections of the second convex surface 422 are respectively at the 3 o'clock and 9 o'clock positions. Correspondingly, the two second guide wheels 44 are respectively at the 12 o'clock and 6 o'clock positions on the circumference where the second convex surface 422 is located. Among them, the diameter of the circumference where the first track surface is located is larger than the diameter of the circumference where the second track surface is located.

[0066] At this time, the specific composition of the first track surface can be understood as: the two sections of the first convex surface 412 and the part of the top surface of the first driving disk 41 between the two sections of the first convex surface 412 constitute it. The same is true for the second track surface, and no specific description will be given here.

[0067] In addition, as Figure 8 shown, at least part of the adjacent ends of the first convex surface 412 and the second convex surface 422 coincide to form a coincident section A. When the first guide wheel 43 and the second guide wheel 44 are in the coincident section A, the support mechanism 3 enters the intermediate state. In the intermediate state, the support surfaces of the first support member 31 and the second support member 32 both coincide with the loading surface 111. At this time, it is equivalent to the bottom surface of the silicon component being supported by the first support member 31 and the second support member 32 at the same time.

[0068] The reason for setting the coincident section A is to form a buffer state (i.e., the intermediate state) during the switching process between the first state and the second state. Without the intermediate state, the following situation will occur. When one of the first support member 31 and the second support member 32 is descending and the other is ascending, during this process, neither the first support member 31 nor the second support member 32 can support the silicon component, which is equivalent to having a blank period. For this reason, the intermediate state is designed to well avoid the occurrence of the blank period. The specific process is as follows: First, the first driving disk 41 and the second driving disk 42 are in the initial state as Figure 8 shown: In this state, the first guide wheel 43 is in the middle region of the first convex surface 412. At this time, the first support member 31 is in the state of supporting the silicon component. At the same time, the second guide wheel 44 is at the position of the second base surface 421. At this time, the second support member 32 is in the state of spacing the support member. In this state, the support mechanism 3 is in the aforementioned first state.

[0069] Next, as the first driving disk 41 and the second driving disk 42 rotate clockwise, the first driving disk 41 and the second driving disk 42 will rotate to the state as shown in Figure 9 shown. At this time, the first support member 31 is at the overlapping section A position of the first convex surface 412, and the second support member 32 is at the overlapping section A position of the second convex surface 422. In this way, both the first support member 31 and the second support member 32 are in the state of supporting the silicon component; that is, the support mechanism 3 is in the aforementioned intermediate state.

[0070] Next, the first driving disk 41 and the second driving disk 42 continue to rotate clockwise, and the two driving disks rotate to the state as shown in Figure 10 shown. At this time, the first guide wheel 43 is at the first base surface 411 position, and the second guide wheel 44 is at the second convex surface 422 position. In this way, the first support member 31 is in the state of spacing the silicon component, and the second support member 32 is in the state of supporting the silicon component, that is, the support mechanism 3 is in the aforementioned second state.

[0071] In this way, by repeating this cycle, the support mechanism 3 can be cycled in turn between the first state, the intermediate state, and the second state to realize the support of the silicon component.

[0072] In order to enable the first driving disk 41 and the second driving disk 42 to rotate in the same direction synchronously, in some embodiments, the driving mechanism further includes a rotating shaft 45 and a motor for driving the rotation of the rotating shaft 45. The rotating shaft 45 is rotatably connected in the machine table 1, and the axis of the rotating shaft 45 constitutes the first axis. In addition, the first driving disk 41 and the second driving disk 42 are coaxially fixed on the rotating shaft 45.

[0073] In this way, when the motor drives the rotating shaft 45 to rotate, the two driving disks can be driven to rotate in the same direction synchronously. As for the connection between the motor and the rotating shaft 45, it can be belt drive, gear drive, or direct shaft connection drive, etc., which is specifically selected according to actual needs. Among them, the rotating shaft 45 can rotatably pass through the second fixed disk 320.

[0074] In order to provide a restoring force for the first support member 31 and the second support member 32, and the restoring force is mainly used to drive the support member to move downward. In this embodiment, the driving mechanism further includes a first elastic member and a second elastic member.

[0075] As shown in Figure 4As shown, the first elastic member is used to provide a first elastic force for the first support member 31. Under the action of the first elastic force, the first support member 31 has a tendency to move away from the loading surface 111 side along the first direction, that is, a tendency to move downward. Specifically: The first elastic member uses a first spring 312. Part of the rod body of the first link 311 is vertically arranged to form a first vertical section. A first connecting block 313 is fixed on the inner peripheral wall of the second space M2. The first vertical section is vertically movably inserted through the first connecting block 313. The first spring 312 is sleeved on the first vertical section, and both ends are respectively fixed to the first connecting block 313 and the bottom wall of the first support member 31. The first spring 312 is a tension spring, which generates a downward pulling force on the first support member 31.

[0076] The second elastic member is used to provide a second elastic force for the second support member 32. Under the action of the second elastic force, the second support member 32 has a tendency to move away from the loading surface 111 side along the first direction, that is, a tendency to move downward.

[0077] The second support member 32 uses a second spring 322. Part of the rod body of the second link 321 is vertically arranged to form a second vertical section. A second connecting block 323 is fixed on the inner peripheral wall of the second space M2. The second vertical section is vertically movably inserted through the second connecting block 323. The second escape spring is sleeved on the second vertical section, and both ends are respectively fixed to the second connecting block 323 and the bottom wall of the second support member 32. The second spring 322 is also a tension spring, which generates a downward pulling force on the second support member 32.

[0078] As for the specific number of the first spring 312 and the second spring 322, it can be selected according to actual needs. For example, in this embodiment, it is shown that the first spring 312 includes two, which are respectively arranged on two first links 311. Correspondingly, two second springs 322 are also provided, which are respectively arranged on two second links 321; of course, it can also be that one first spring 312 is arranged on each first link 311, and one second spring 322 is arranged on each second link 321.

[0079] Both the first guide wheel 43 and the second guide wheel 44 use universal rollers. Specifically, the universal roller includes a vertically arranged wheel shaft and rolling balls arranged at the end of the wheel shaft. In the first guide wheel 43, the upper end of its wheel shaft is fixed to the bottom of the first fixed disk 310. In the second guide wheel 44, the upper end of the wheel shaft is fixed to the bottom of the second fixed disk 320.

[0080] It should be understood that various forms of the processes shown above can be used, reordering, adding or deleting steps. For example, the steps described in this application can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this application can be achieved. This is not limited herein.

[0081] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0082] As described above, the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A rinsing device for a silicon component having micropores, characterized in that, Comprising: A working space, the working space including a loading surface on which the silicon component can be loaded and fixed. When the silicon component is loaded on the loading surface, the silicon component divides the working space into a first space and a second space, and the first space and the second space communicate with each other through the micropores of the silicon component; A liquid supply mechanism for filling the first space with a cleaning liquid; A support mechanism disposed in the second space for supporting the silicon component, the support mechanism including at least one first support member and at least one second support member; the first support member and the second support member are staggeredly distributed in a plane parallel to the loading surface; The device further includes a driving assembly for driving the support mechanism to alternately switch between a first state and a second state. In the first state, the supporting surface of the first support member coincides with the loading surface, and a spaced space is formed between the supporting surface of the second support member and the loading surface; in the second state, the supporting surface of the second support member coincides with the loading surface, and a spaced space is formed between the supporting surface of the first support member and the loading surface.

2. The rinsing device for a silicon component having micropores according to claim 1, characterized in that, The support mechanism moves along a first direction to achieve the switching between the first state and the second state, and the first direction is perpendicular to the loading surface.

3. The flushing device for a silicon component having micropores according to claim 2, characterized in that, The driving assembly includes: A first driving disk that can rotate around a first axis, the first axis being parallel to the first direction. The first driving disk includes a circumferential first track surface with the first axis as the center line, and the first track surface includes a first base surface and a first convex surface protruding parallel to the first direction from the first base surface; both ends of the first convex surface are connected to the first base surface through inclined first guide surfaces; A first guide wheel that remains relatively fixed with the first support member; the first guide wheel can rotate circumferentially on the first track surface relative to the first track surface. When the first guide wheel is on the first convex surface, the supporting surface of the first support member coincides with the loading surface; A second driving disk that can rotate around the first axis, the second driving disk includes a circumferential second track surface with the first axis as the center line, and the second track surface includes a second base surface and a second convex surface protruding parallel to the first direction from the second base surface; both ends of the second convex surface are connected to the second base surface through inclined second guide surfaces; A second guide wheel that remains relatively fixed with the second support member; the second guide wheel can rotate circumferentially on the second track surface relative to the second track surface; when the second guide wheel is on the second convex surface, the supporting surface of the second support member coincides with the loading surface; The first track surface and the second track surface are configured such that when the first guide wheel is on the first base surface or the first guide surface, the second guide wheel is on the second convex surface, so that the support mechanism enters the second state; when the second guide wheel is on the second base surface or the second guide surface, the first guide wheel is on the first convex surface, so that the support mechanism enters the first state.

4. The flushing device for a silicon component with micropores according to claim 3, characterized in that, At least a part of the adjacent ends of the first convex surface and the second convex surface coincide to form a coincident section. When the first guide wheel and the second guide wheel are in the coincident section, the support mechanism enters an intermediate state. In the intermediate state, the supporting surfaces of both the first support member and the second support member coincide with the loading surface.

5. The rinsing device for a silicon component having micropores according to claim 3, characterized in that, The first convex surface includes two segments, and the two segments of the first convex surface are symmetrically arranged with respect to the first axis. The spaced area between the ends of the two segments of the first convex surface forms the first base surface; there are two first guide wheels, and the two first guide wheels are symmetrically arranged with respect to the first axis. And / or, the second convex surface includes two segments, and the two segments of the second convex surface are symmetrically arranged with respect to the first axis. The spaced area between the ends of the two segments of the second convex surface forms the second base surface; there are two second guide wheels, and the two second guide wheels are symmetrically arranged with respect to the first axis.

6. The flushing device for a silicon component having micropores according to claim 3, characterized in that, The first driving disk is provided with a first convex portion, the top surface of the first convex portion forms the first convex surface, and the end surface of the first convex portion forms the first guiding surface. And / or the second driving disk is provided with a second convex portion, the top surface of the second convex portion forms the second convex surface, and the end surface of the second convex portion forms the second guiding surface.

7. The rinsing device for a silicon component having micropores according to claim 3, characterized in that, The driving mechanism further includes a rotating shaft and a motor for driving the rotating shaft to rotate. The first driving disk and the second driving disk are coaxially fixed on the rotating shaft, and the axis of the rotating shaft forms the first axis.

8. The flushing device for a silicon component with micropores according to claim 3, characterized in that, The driving mechanism further includes a first elastic member and a second elastic member. The first elastic member is used to provide a first elastic force for the first supporting member. Under the action of the first elastic force, the first supporting member has a tendency to move away from the loading surface side along the first direction; the second elastic member is used to provide a second elastic force for the second supporting member. Under the action of the second elastic force, the second supporting member has a tendency to move away from the loading surface side along the first direction.

9. The rinsing device for a silicon component having micropores according to claim 1, characterized in that, The device includes a machine table and a cover body. The cover body can move along the first direction to cover the machine table. A positioning groove for embedding a silicon component is formed on the top surface of the machine table, and the groove bottom surface of the positioning groove forms the loading surface; in the loading state, the silicon component is pressed between the cover body and the loading surface by the cover body.

10. The flushing device for a silicon component having micropores according to claim 1, characterized in that, A water outlet is provided at the bottom of the second space.

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