NTC (Negative Temperature Coefficient) chip welding machine and processing method

Abstract

The invention relates to the field of resistor production equipment, and discloses an NTC (Negative Temperature Coefficient) chip welding machine and a processing method, which can be used for efficiently processing thermistor products and are high in yield. The device comprises a rack and is provided with a cable conveying device; the wire cutting and stripping device is arranged on the rack and used for cutting the cable and stripping the two ends of the cut cable; the first tin soldering mechanism is arranged on the rack, and the first tin soldering mechanism is used for tin soldering of the two ends of the cable; the shaping device is arranged on the rack and used for shaping the two ends of the first end of the cable into a V shape; the chip placing device is arranged on the rack, and the chip placing device is used for placing a chip between the V shapes of the first ends of the cables; the second tin soldering device is arranged on the rack, and the second tin soldering device is used for tin soldering of the first end of the cable and the chip; and the rubber coating device is arranged on the rack, and the rubber coating device is used for placing the cable on the pasting plate and pasting the cable through an adhesive tape.

Description

Technical Field

[0001] The present invention relates to the field of resistor production equipment, in particular to an NTC chip welding machine and a thermal processing method. Background Art

[0002] The single-end glass encapsulated NTC thermistor has a transition metal oxide ceramic as the core, with metal electrodes covered at both ends, and is hermetically encapsulated with borosilicate glass externally and a lead is led out from a single end. Utilizing the characteristic that its resistance exponentially decreases with the increase of temperature, it realizes functions such as high-precision temperature detection, surge current suppression, circuit temperature compensation, and overheat protection; the glass encapsulation endows it with advantages such as high temperature resistance, moisture and corrosion resistance, and anti-mechanical shock, and is widely used in temperature monitoring and control in harsh environments such as automotive electronics, industrial equipment, and medical instruments. It is more stable than epoxy resin encapsulation and more compact than metal encapsulation, and is an ideal choice for high-reliability temperature management scenarios.

[0003] As an important electronic component, thermistors are widely used in various electrical products. During the production and manufacturing process of these products, thermistors need to be welded to wires. Currently, most of such welding processes rely on manual operations, not only with low welding efficiency, but also with the continuous increase of labor costs, manual welding further pushes up the production and manufacturing costs. Therefore, adopting an automated processing method has become a common choice in the industry.

[0004] The existing thermistor processing production lines usually adopt the following process: First, the cut wire is attached to the sticker board through a rubber coating process, and then subsequent processing is carried out on one end of the wire. However, this processing mode has obvious drawbacks. Once an error occurs in a certain processing step, the products on the entire sticker board need to be reworked, which not only wastes a large amount of time and resources, but also seriously affects the production efficiency and processing quality, and is obviously not conducive to efficient and stable production and processing. Summary of the Invention

[0005] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides an NTC chip welding machine, which can efficiently process thermistor products with a high yield.

[0006] The present invention also provides a thermal resistor chip welding and processing method having the above NTC chip welding machine.

[0007] On the one hand, the NTC chip welding machine according to an embodiment of the present invention includes:

[0008] A frame provided with a wire feeding device;

[0009] A wire cutting and stripping device provided on the frame, and the wire cutting and stripping device is used for cutting the wire and stripping the two ends of the cut wire;

[0010] The first soldering mechanism is provided on the frame, and the first soldering mechanism is used for soldering both ends of the cable.

[0011] The shaping device is provided on the frame, and the shaping device is used to shape the two ends of the first end of the cable into a V shape.

[0012] The chip placement device is provided on the frame, and the chip placement device is used to place the chip between the V shapes at the first end of the cable.

[0013] The second soldering device is provided on the frame, and the second soldering device is used for soldering the first end of the cable and the chip.

[0014] The rubber coating device is provided on the frame, and the rubber coating device is used to place the cable on the pasting board and bond it with tape.

[0015] The transportation device is used to transport the cable starting from the wire cutting and stripping device, and sequentially along the first soldering mechanism, the wire expanding and cutting device, the shaping device, the chip placement device, the second soldering device, and the rubber coating device.

[0016] According to some embodiments of the present invention, the wire cutting and stripping device includes:

[0017] The first wire clamping mechanism includes a first chuck and a first wire feeding power component, and the first wire feeding power component can drive the first chuck to rotate and move in a straight line direction.

[0018] The wire cutting and stripping mechanism is used for cutting and stripping the cable.

[0019] The second wire clamping mechanism includes a second chuck and a second wire feeding power component, and the second wire feeding power component can drive the second chuck to rotate and move in a straight line direction. The first soldering mechanism is provided below the first wire clamping mechanism and the second wire clamping mechanism.

[0020] The first wire clamping mechanism, the wire cutting and stripping mechanism, and the second wire clamping mechanism are sequentially provided on the frame.

[0021] According to some embodiments of the present invention, it further includes a wire expanding and cutting device provided before the shaping device processes. The wire expanding and cutting device includes:

[0022] The upper cutting knife unit includes an upper cutting knife and a wire separating knife provided on the upper cutting knife. The wire separating knife is used to insert between the two ends of the first end of the cable, and the two ends of the first end of the cable are separated.

[0023] The lower cutting knife unit includes a lower cutting knife and a wire pressing device cooperating with the wire separating knife.

[0024] When the upper cutting tool unit and the lower cutting tool unit are closed, they can separate and cut the first end of the cable flatly;

[0025] A cutting tool power member, the upper cutting tool unit and the lower cutting tool unit reciprocate horizontally under the drive of the cutting tool power member.

[0026] According to some embodiments of the present invention, it further includes a wire pressing mechanism arranged after the shaping device, and the wire pressing mechanism includes:

[0027] A wire pressing bracket;

[0028] A first pressing plate and a second pressing plate, movably arranged on the wire pressing bracket, and a pressing surface is arranged on one side of the first pressing plate and the second pressing plate close to each other;

[0029] A wire pressing power member, used to drive the first pressing plate and the second pressing plate to approach or move away from each other, so that the two pressing surfaces respectively abut against the first end of the cable.

[0030] According to some embodiments of the present invention, the shaping device includes:

[0031] A shaping bracket, movably arranged on the frame;

[0032] A left clamp and a right clamp, rotatably installed on the shaping bracket, and a first inclined surface is arranged on one side of the left clamp and the right clamp close to each other;

[0033] A fixed block, arranged between the left clamp and the right clamp, and second inclined surfaces in a V shape are arranged on both sides of the fixed block. In the clamped state, the second inclined surfaces are respectively parallel to the first inclined surfaces;

[0034] A shaping power member, arranged on the bracket, the shaping power member is used to drive the shaping bracket to move and make the left clamp and the right clamp approach or move away from each other, so that both ends of the first end of the cable are in a V shape.

[0035] According to some embodiments of the present invention, the chip placing device includes:

[0036] A picking mechanism, used to automatically pick up the chip;

[0037] A chip clamping mechanism, used to clamp the chip picked up by the picking mechanism;

[0038] A chip assembling power member, capable of driving the picking mechanism to move to the chip clamping mechanism, and driving the chip clamping mechanism to move between the V shapes at the first end of the cable.

[0039] According to some embodiments of the present invention, it further includes a detection device disposed after the processing of the chip placement device. The detection device includes a camera, and the camera is used to detect whether the chip is placed in the middle of the V-shaped mechanism of the cable.

[0040] According to some embodiments of the present invention, the second soldering device includes:

[0041] A flux tank, movably disposed on the frame;

[0042] A solder tank, movably disposed on the frame;

[0043] A solder driving member, used to drive the flux tank and the solder tank to move in the up and down direction.

[0044] According to some embodiments of the present invention, the encapsulation device includes:

[0045] A guiding track, disposed on the frame;

[0046] An adhesive mechanism, including an adhesive wheel, and the adhesive wheel is used to closely adhere to the back of the tape to make the tape adhere to the sticker board.

[0047] A feeding mechanism, disposed on the frame, and the feeding mechanism is used to convey the sticker board towards the adhesive mechanism;

[0048] A feeding device, disposed on the frame, and the feeding device is used to send out the sticker board of the adhesive mechanism;

[0049] A cutting mechanism, the frame is provided with a cutting gap, and the cutter of the cutting mechanism is used to insert into the cutting gap to cut the tape;

[0050] The feeding mechanism, the adhesive mechanism, the cutting mechanism and the cutting mechanism are sequentially disposed on the frame along the guiding track.

[0051] On the other hand, a method for welding and processing a thermistor chip according to an embodiment of the present invention is applied to the NTC chip welding machine according to any one of claims 1 to 9, and is characterized in that it includes the following steps:

[0052] S100, the wire stripping and cutting device cuts the cable and strips the two ends of the cable;

[0053] S200, the first soldering mechanism solders the two ends of the cable respectively;

[0054] S300, the shaping device presses the first end of the cable to make the first end of the cable in a V shape;

[0055] S400, the chip placement device places the chip and inserts the chip into the middle of the first end of the cable;

[0056] S500. The second soldering device solders the cable and the chip;

[0057] S600. The rubber coating device places the cable on the sticker board and bonds it with tape.

[0058] The embodiments of the present invention have at least the following beneficial effects:

[0059] The cable feeding device is used to provide a coiled cable for the production line. The wire cutting and stripping mechanism is used to cut the cable and process it into a state where two sections are stripped. The first soldering mechanism solders the stripped cable, which can harden the first end of the cable while protecting the exposed structure of the cable, preparing for subsequent steps; the shaping device can shape the first end of the cable into a V shape, which is beneficial for subsequent chip clamping. Due to the effect of the first soldering, its V-shaped state can maintain the shape; the chip placing device can install the chip between the V shapes at the first end of the cable. Due to the effect of soldering, the stability of the cable is increased, so that the chip can be stably clamped by both ends of the first end of the cable; the second soldering device simultaneously solders the chip at the first end of the cable, so that the chip can be fixed on the cable; the rubber coating device can place the cable on the sticker board and fix the cable on the sticker board with tape, completing the production of the thermistor.

[0060] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0061] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0062] Figure 1 is the overall structural schematic diagram of the NTC chip welding machine according to the embodiment of the present invention;

[0063] Figure 2 is the overall structural schematic diagram of the wire cutting and stripping device according to the embodiment of the present invention;

[0064] Figure 3 is the structural schematic diagram of the first wire clamping mechanism and the second wire clamping mechanism according to the embodiment of the present invention;

[0065] Figure 4 is the structural schematic diagram of the first wire clamping mechanism according to the embodiment of the present invention;

[0066] Figure 5 is the structural schematic diagram of the wire expanding and cutting device according to the embodiment of the present invention;

[0067] Figure 6 is the structural schematic diagram of the upper cutting knife unit and the lower cutting knife unit according to the embodiment of the present invention;

[0068] Figure 7 Schematic diagram of the overall structure of the shaping device according to an embodiment of the present invention;

[0069] Figure 8 Schematic diagram of the structure of the chip placing device according to an embodiment of the present invention;

[0070] Figure 9 Schematic diagram of the structure of the second soldering device according to an embodiment of the present invention;

[0071] Figure 10 Schematic diagram of the overall structure of the encapsulation device according to an embodiment of the present invention;

[0072] Figure 11 Front view structure diagram of the encapsulation device according to an embodiment of the present invention;

[0073] Figure 12 is Figure 11 Enlarged structure diagram of the dashed part;

[0074] Figure 13 Partial structure diagram of the encapsulation device according to an embodiment of the present invention;

[0075] Figure 14 Partial structure diagram of the encapsulation device according to an embodiment of the present invention;

[0076] Figures 15 - 16 Schematic diagram of the structure of the discharge channel;

[0077] Reference numerals:

[0078] Frame 100;

[0079] Wire cutting and stripping device 200, first wire clamping mechanism 210, first chuck 211, first rotating head 211a, first wire feeding power member 211b, second wire feeding power member 211c, guiding portion 211d, crimping portion 211e, first wire feeding power assembly 212, bending plate 213, wire cutting and stripping mechanism 220, second wire clamping mechanism 230, wire pulling mechanism 240, wire winding and unwinding mechanism 250;

[0080] First soldering mechanism 300;

[0081] Wire expanding and cutting device 400, upper cutting knife unit 420, lower cutting knife unit 410;

[0082] Shaping device 500, shaping bracket 510, left clamp 520, right clamp 530, fixed block 540;

[0083] Chip placing device 600, picking mechanism 610, chip clamping mechanism 620, vibrating disk 630, discharge channel 640, bearing surface 641, contact surface 642, material table 643;

[0084] Second soldering device 700, flux tank 710, solder tank 720;

[0085] Plastic coating device 800, guiding track 810, stepped groove 811, adhesive mechanism 820, adhesive wheel 821, pressure rubber wheel 822, first elastic member 823, second elastic member 824, feeding mechanism 830, feeding plate 831, feeding power member 832, feeding mechanism 840, clamping assembly 841, feeding power member 842, cutting mechanism 850, cutting gap 854, upper plate mechanism 860, board storage bracket 861, feeding plate 862, upper plate power member 863, wire pasting mechanism 870;

[0086] Wire pressing mechanism 900, wire pressing bracket 910, first pressing plate 920, second pressing plate 930, detection device 940. Detailed implementation manners

[0087] The following content will describe several embodiments of the present invention, including embodiments corresponding to the drawings. It can be understood that the drawings are used to assist in understanding the technical features and technical solutions of the present invention, and should not be construed as limiting the protection scope of the present invention.

[0088] The following will clearly and completely describe the concept, specific structure and technical effects generated by the present invention in combination with the embodiments and the drawings, so as to fully understand the purpose, solution and effect of the present invention. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0089] It should be noted that unless otherwise clearly defined, when a certain feature is referred to as "fixed", "connected", "installed" to another feature, it can be directly fixed and connected to another feature, or indirectly fixed and connected to another feature. The words such as "fixed", "connected", "installed" should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0090] It should be noted that the descriptions of the orientation or positional relationship indicated by the upper, lower, left, right, top, bottom, front, rear, inner, outer, etc. in the present invention are based on the orientation or positional relationship of the drawings or embodiments, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0091] It should be noted that the term "and / or" used in the present invention includes any combination of one or more related listed items. The meaning of several is one or more, the meaning of multiple is two or more, and understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number.

[0092] It should be noted that in the present invention, if the first and second are described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0093] It should be noted that unless otherwise clearly defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art of this technology. The terms used in the description of this specification are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

[0094] Referring to Figures 1 - 16 , a basic embodiment of the first aspect of the present invention provides an NTC chip soldering machine, including:

[0095] A frame 100, provided with a cable wiring device;

[0096] A wire cutting and stripping device 200, provided on the frame 100, and the wire cutting and stripping device 200 is used for cutting the cable and stripping the two ends of the cut cable;

[0097] A first soldering mechanism 300, provided on the frame 100, and the first soldering mechanism 300 is used for soldering the two ends of the cable;

[0098] An expanding and wire cutting device 400, provided on the frame 100, and the expanding and wire cutting device 400 is used for separating the two ends of the first end of the cable and cutting the cable;

[0099] A shaping device 500, provided on the frame 100, and the shaping device 500 is used for shaping the two ends of the first end of the cable into a V shape;

[0100] A chip placing device 600, provided on the frame 100, and the chip placing device 600 is used for placing the chip between the V shapes at the first end of the cable;

[0101] A second soldering device 700, provided on the frame 100, and the second soldering device 700 is used for soldering the first end of the cable and the chip;

[0102] A rubber coating device 800, provided on the frame 100, and the rubber coating device 800 is used for placing the cable on the sticker board and bonding it with tape;

[0103] A transportation device, used for transporting the cable starting from the wire cutting and stripping device 200, successively along the first soldering mechanism 300, the expanding and wire cutting device 400, the shaping device 500, the chip placing device 600, the second soldering device 700, and the rubber coating device 800.

[0104] A basic embodiment of the second aspect of the present invention provides a method for soldering and processing a thermistor chip, including the following steps:

[0105] S100, The wire stripping and cutting device cuts the cable and strips the two ends of the cable.

[0106] S200, The first soldering mechanism solders the two ends of the cable respectively.

[0107] S300, The shaping device 500 presses the first end of the cable to make the first end of the cable in a V shape.

[0108] S400, The chip placing device 600 places the chip and inserts the chip into the middle of the first end of the cable.

[0109] S500, The second soldering device solders the cable and the chip.

[0110] S600, The rubber coating device places the cable on the sticker board and bonds it with tape.

[0111] According to the embodiments of the present invention, by setting like this, at least the following effects can be achieved. The cable feeding device is used to provide a coiled cable for the production line. The wire cutting and stripping mechanism 220 is used to cut the cable and process the cable into two sections with stripped ends. The first soldering mechanism 300 solders the stripped cable, which can harden the first end of the cable while protecting the exposed structure of the cable, preparing for the subsequent steps. The shaping device 500 can shape the first end of the cable into a V shape, which is beneficial for the subsequent clamping of the chip. Due to the effect of the first soldering, its V-shaped state can maintain the shape. The chip placing device 600 can install the chip between the V shapes at the first end of the cable. Due to the effect of soldering, the stability of the cable is increased, so that the chip can be stably clamped by the two ends of the first end of the cable. The second soldering device 700 solders the chip at the first end of the cable at the same time, so that the chip can be fixed on the cable. The rubber coating device 800 can place the cable on the sticker board and fix the cable on the sticker board with tape, completing the production of the thermistor.

[0112] It should be noted that the corresponding product cable generally consists of two wires. The two wires at its end become the two ends of the cable. The two ends of the cable are called the first end and the second end of the cable. The first end is the main processing part. When processing, it is necessary to first expand the gap between the two wires at the first end of the cable, that is, the above two ends, to facilitate subsequent shaping and chip clamping operations.

[0113] It should be noted that the transportation device includes clamping jaws and a transfer mechanism. Multiple cut cables can be clamped on the clamping jaws at the same time. The transfer mechanism is composed of one or more of a linear motor, a cylinder, a telescopic motor, and a conveyor belt, and can drive the clamping jaws to move up and down, left and right, or forward and backward. Since the transportation device is a combination and application of conventional power structures, it can be clearly seen from the figure or is a commonly used technical means, which is not the main content protected by this application. Therefore, it will not be described in detail.

[0114] In some embodiments, the wire cutting and stripping device 200 includes:

[0115] The first wire clamping mechanism 210 includes a first clamping head 211 and a first wire feeding power component 212. The first wire feeding power component 212 can drive the first clamping head 211 to rotate and move in a straight line direction;

[0116] The wire cutting and stripping mechanism 220 is used for wire cutting and wire stripping of the cable;

[0117] The second wire clamping mechanism 230 includes a second clamping head and a second wire feeding power component. The second wire feeding power component can drive the second clamping head to rotate and move in a straight line direction. The first soldering mechanism is arranged below the first wire clamping mechanism 210 and the second wire clamping mechanism 230;

[0118] The first wire clamping mechanism 210, the wire cutting and stripping mechanism 220, and the second wire clamping mechanism 230 are sequentially arranged on the frame 100.

[0119] Under this setting, the wire feeding wheel can transport the cable to the first wire clamping mechanism 210. Further, the wire feeding wheel can transport the cable from the first wire clamping mechanism 210 to the wire cutting and stripping mechanism 220. Then, the wire cutting and stripping mechanism 220 performs wire stripping on the first end of the cable, further transports the cable and transports it to the second wire clamping mechanism 230. The second wire clamping mechanism 230 can clamp the cable. The wire cutting and stripping mechanism 220 cuts the cable, and the cable is divided into two sections. The wire cutting and stripping mechanism 220 performs wire stripping on the second end of the cable in the second wire clamping mechanism 230. At this time, a cable with both ends stripped is obtained; the first wire feeding power component 212 drives the first clamping head 211 to rotate so that the end of the cable faces the first soldering mechanism, and then drives the first clamping head 211 to move towards the first soldering mechanism so that the first end of the cable completes the soldering operation. Similarly, the second moving power component can perform the soldering operation on the second end of the cable; the whole device can automatically cut the cable and perform wire stripping and soldering on both ends of the cable, with a high degree of automation.

[0120] It should be noted that the first soldering mechanism includes a soldering bath 720 filled with soldering fluid and a flux bath 710 filled with flux. The first wire clamping mechanism 210 can successively face the flux bath 710 and the soldering bath 720 and move towards the bath to effectively solder the end of the wire. The same applies to the second wire clamping mechanism 230.

[0121] It should be noted that the wire stripping and cutting mechanism is a common technical means in the field of wire processing, and the specific steps of wire stripping and cutting by the wire stripping and cutting mechanism do not involve the content of protection. Therefore, the specific structure will not be described in detail.

[0122] In some embodiments, a wire pulling mechanism 240 is further included. The wire pulling mechanism 240 is used to pull the wire of the first wire clamping mechanism 210 to the second wire clamping mechanism 230. The distance between the first wire clamping mechanism 210 and the second wire clamping mechanism 230 is relatively long. Through the wire pulling mechanism 240, the wire can be moved to the second wire clamping mechanism 230 over a long distance, which is convenient for use.

[0123] In addition, under the operation of the first wire feeding power component 212 and the second wire feeding power component, after the first clamping head 211 and the second clamping head are close to each other, the second clamping head can clamp the wire, and the wire of the first wire clamping mechanism 210 can also be pulled to the second wire clamping mechanism 230.

[0124] In some embodiments, the wire pulling mechanism 240 includes a guide rail and a third clamping head. The guide rail is provided on the frame 100, and the third clamping head is transported along the guide rail. Through the function of the guide rail, the wire can be transported over a long distance along a predetermined route.

[0125] In some embodiments, the first wire feeding power component 212 includes:

[0126] A first rotating head 211a, rotatably provided on the frame 100. The first rotating head 211a is provided with a first sliding groove arranged in a straight line direction, and the first clamping head 211 is arranged to slide in the first sliding groove;

[0127] A first wire feeding power member 211b, driving the first rotating head 211a to rotate;

[0128] A second wire feeding power member 211c, capable of driving the first clamping head 211 to slide based on the first rotating head 211a.

[0129] The second wire feeding power component includes:

[0130] A second rotating head, rotatably provided on the frame 100. The second rotating head is provided with a second sliding groove arranged in a straight line direction, and the second clamping head is arranged to slide in the first sliding groove;

[0131] A third wire feeding power member, driving the second rotating head to rotate;

[0132] The fourth wire feeding power component can drive the second chuck to slide based on the second rotating head.

[0133] In this setting, the rotating head can rotate to change the orientation of the cable end. The cable end faces the first soldering mechanism. Based on this direction, the chuck moves in a straight line direction, so that the cable end is inserted into the first soldering mechanism, enabling the workpiece to be soldered quickly.

[0134] In some embodiments, the first chuck 211 includes:

[0135] A guiding part 211d is provided with a guiding hole for guiding the cable. A through hole is provided on the side wall of the guiding part 211d, and the through hole is communicated with the guiding hole;

[0136] A crimping part 211e can be close to or away from the through hole, and the crimping part 211e is used for crimping the cable in the guiding hole.

[0137] In this setting, the cable can be transported along the guiding hole, and the guiding hole plays a guiding role. The crimping part 211e approaches the through hole, so that the crimping plate abuts against and presses the cable tightly, fixing the cable in the guiding part 211d and preventing the cable from moving, which may affect steps such as wire cutting, wire shearing, and soldering.

[0138] In some embodiments, the first wire clamping mechanism 210 further includes a bending plate 213. The bending plate 213 is arranged on the first chuck 211 and on the side away from the wire cutting and stripping mechanism 220, and the bending plate 213 bends downward.

[0139] In this setting, the bending plate 213 plays a role in preventing the cable from being bent. When the first wire clamping mechanism 210 rotates towards the first soldering mechanism, the cable will be bent. The bending plate 213 can make the cable bend in a gentle curve instead of being directly bent, resulting in cable damage.

[0140] In some embodiments, there are two first soldering mechanisms, which are respectively arranged below the first wire clamping mechanism 210 and the second wire clamping mechanism 230. The two first soldering mechanisms respectively correspond to the first wire clamping mechanism 210 and the second wire clamping mechanism 230, and solder the two ends of the cable respectively after cutting.

[0141] In some embodiments, the wire cutting and stripping mechanism 220 successively includes a first stripping component, a wire cutting component, and a second stripping component. The first stripping component is arranged on the side close to the first wire clamping mechanism 210, and the second stripping component is arranged on the side close to the wire clamping component. The first stripping mechanism is used to strip the outer skin of the first end of the cable, the wire cutting mechanism is used to cut the cable, and the second stripping mechanism is used to strip the outer skin of the second end of the cable after cutting.

[0142] In some embodiments, it further includes a wire winding and unwinding mechanism 250. The wire winding and unwinding mechanism 250 includes:

[0143] Bracket;

[0144] Wire feeding wheel, rotatably arranged on the bracket;

[0145] First fixed wheel, rotatably arranged on the bracket;

[0146] Wire take-up assembly, including a tensioning wheel and a wire take-up power member. The tensioning wheel is slidably arranged on the bracket, and the wire take-up power member is used to drive the wire take-up wheel to approach or move away from the tensioning wheel;

[0147] Second fixed wheel, rotatably arranged on the bracket.

[0148] In this setting, the cable is transported along the wire feeding wheel, the first fixed wheel, the wire take-up assembly, the second fixed wheel, and the first wire clamping mechanism 210 in sequence. A large amount of cables are placed in advance on the wire feeding wheel to prepare for subsequent work. The first fixed wheel plays a role in adjusting the tension. The wire take-up assembly can move the cable towards or away from the wire stripping and cutting mechanism in the first wire clamping mechanism 210, facilitating wire stripping and cutting operations.

[0149] In some embodiments, it further includes an expanding and cutting device 400 provided before the shaping device 500 processes. The expanding and cutting device 400 includes:

[0150] Upper cutting knife unit 420, including an upper cutting knife and a wire separating knife arranged on the upper cutting knife. The wire separating knife is used to insert between the two ends of the first end of the cable, and the two ends of the first end of the cable are separated;

[0151] Lower cutting knife unit 410, including a lower cutting knife and a wire pressing device cooperating with the wire separating knife;

[0152] When the upper cutting knife unit 420 and the lower cutting knife unit 410 are closed, they can separate and cut the first end of the cable flat;

[0153] Cutting knife power member, the upper cutting knife unit 420 and the lower cutting knife unit 410 reciprocate horizontally under the drive of the cutting knife power member.

[0154] The structure can refer to the existing patent, application number: 202321405344.1, patent name: An automatic line for welding thermistor chips. The parallel wire ends are separated by a cutting knife, and the parallel wire ends are cut off by closing the upper cutting knife and the lower cutting knife, which can quickly separate and cut the parallel wire ends flat before welding. The expanding and cutting device 400 can separate the two ends of the cable, which is beneficial to the subsequent shaping steps, and through the cutting operation, cut off the redundant cable to ensure that the length of the first end of the cable is consistent and improve the consistency of product quality.

[0155] In some embodiments, it further includes a wire pressing mechanism 900 provided after the shaping device processes. The wire pressing mechanism 900 includes:

[0156] Wire pressing bracket 910;

[0157] The first pressing plate 920 and the second pressing plate 930 are movably arranged on the wire pressing bracket 910, and the sides of the first pressing plate 920 and the second pressing plate 930 close to each other are provided with pressing surfaces;

[0158] A wire pressing power component is used to drive the first pressing plate 920 and the second pressing plate 930 to approach or move away from each other, so that the two pressing surfaces respectively abut against the first ends of the wire cables.

[0159] Under this setting, by the first pressing plate 920 and the second pressing plate 930 approaching each other, the first ends of the wire cables are crimped, keeping the first ends of the structure in a plane, making the V-shaped structures all located in the same vertical plane, and preventing the V-shaped mechanism from deforming when the shaping device 500 disengages from the wire cables.

[0160] In some embodiments, the shaping device 500 includes:

[0161] A shaping bracket 510 is movably arranged on the frame 100;

[0162] A left clamp 520 and a right clamp 530 are rotatably mounted on the shaping bracket 510, and the sides of the left clamp 520 and the right clamp 530 close to each other are provided with first inclined surfaces;

[0163] A fixed block 540 is arranged between the left clamp 520 and the right clamp 530, and both sides of the fixed block 540 are provided with V-shaped second inclined surfaces. In the clamping state, the second inclined surfaces are respectively parallel to the first inclined surfaces;

[0164] A shaping power component is arranged on the bracket. The shaping power component is used to drive the shaping bracket 510 to move and drive the left clamp 520 and the right clamp 530 to approach or move away from each other, so that the two ends of the first end of the wire cable are in a V shape.

[0165] The structure can refer to the existing patent, application number: 202321405432.1, patent name: An automatic line for welding parallel thermistor chip elements. The shaping bracket 510 is movably arranged on the frame 100, which can make the shaping bracket 510 approach or move away from the wire cable, enabling the fixed block 540 to be inserted into the middle of the first end of the wire cable, and then closing or separating the left clamp 520 and the right clamp 530 to automatically form a V-shaped structure at the end of the parallel wires, with high working efficiency.

[0166] In some embodiments, the chip placement device 600 includes:

[0167] A feeding device is used to provide chips;

[0168] A picking mechanism 610 is used to automatically pick up chips;

[0169] A chip clamping mechanism 620 for clamping the chip picked up by the picking mechanism;

[0170] A chip assembly power component capable of driving the picking mechanism 610 to move to the chip clamping mechanism 620 and driving the chip clamping mechanism 620 to move between the Vs at the first end of the cable.

[0171] The structure can refer to the existing patent, application number: 202310654482.1, patent name: An automatic chip welding line. The picking mechanism is provided with a suction cup capable of adsorbing chips. The chip placement device includes a picking mechanism, a chip clamping mechanism, and a chip assembly power component. The picking mechanism is used to automatically pick up chips. The chip clamping mechanism is used to clamp the chips picked up by the picking mechanism. The chip assembly power component can drive the picking device to move to the clamping mechanism and drive the clamping mechanism to move to the middle of the V-shaped structure at the first end of the cable. After the picking mechanism picks up the chips, it transports the chips to the chip clamping mechanism. The chip clamping mechanism clamps the chips and transports the chips to the first end of the cable so that the ends of the V-shaped structure clamp the chips.

[0172] In some embodiments, the feeding device includes:

[0173] A vibrating bowl;

[0174] A discharge channel that communicates with the outlet of the vibrating bowl. The discharge channel is provided with a bearing surface and a contact surface. The bearing surface is connected to the side wall of the outlet of the vibrating bowl that is far from the center of the vibrating bowl. The bearing surface is inclined. The bearing surface is used to bear the main plane of the product, and the contact surface is used to bear the side surface of the product.

[0175] Under this setting, the vibrating bowl is an auxiliary feeding device for an automatic assembly or automatic processing machine. It can arrange chip products in an orderly manner. A discharge channel is provided at the outlet of the vibrating bowl. The inclination angle of the side wall of the vibrating bowl far from the center is set at the angle of the bearing surface. Through the vibration effect of the vibrating bowl, the chip products can be neatly arranged on the side wall of the bearing surface far from the center. The bearing surface of the discharge channel is connected to the side wall of the outlet of the vibrating bowl that is far from the center of the vibrating bowl, so that the chip products can be discharged along the bearing surface from the outlet; the inclined bearing surface can bear the main plane of the chip products, and one side surface of the chip products abuts, so that the chip products can be discharged obliquely. Since the discharge channel only limits one side surface of the chip products and does not limit the other side surface, it can adapt to chip products of different sizes without the need to replace the discharge channel, improving efficiency.

[0176] It can be understood that this application generally processes chip products. The chip products are flat plane structures. The products are mainly divided into a main plane and a side surface. The main plane is the surface with both longer length and width, and the side surface is the surface with one of the length or width being shorter.

[0177] In some embodiments, the inclination angle of the bearing surface gradually decreases from the side close to the vibrating tray to the side far from the vibrating tray. The smaller the inclination angle, the more the main plane of the chip product is biased upward, which is beneficial for the picking mechanism to pick up the chip; in addition, since the inclination angle decreases from large to small, the vibration center is located at the vibrating tray, and the discharge channel is driven by the vibrating tray to vibrate together, so the vibration ability of the discharge channel itself is small, and the movement ability of the chip is also small. The gradually decreasing inclination angle is beneficial for the chip product to move along the discharge channel.

[0178] In some embodiments, the contact surface is inclined. Both the bearing surface and the inclined surface are inclined, and the included angle formed by the bearing surface and the inclined surface is close to 90 degrees, so that the contact surface can contact the side surface of the product.

[0179] In some embodiments, there is a material table on the side of the discharge channel far from the vibrating tray. One side of the material table is connected to the lower end of the bearing surface, and the adjacent side is connected to the contact surface. The material table is used to store the redundant chips. Some chips that are not picked up by the picking mechanism in time are collected by the material table. One side of the material table is connected to the lower end of the bearing surface, so that the chips can slide along the bearing surface during transportation.

[0180] In some embodiments, it further includes a protective cover, and the protective cover is arranged above the discharge channel. The protective cover prevents the chips from falling.

[0181] In some embodiments, it further includes a picking mechanism, and the picking mechanism includes:

[0182] A suction nozzle;

[0183] A picking power member that can drive the suction nozzle to rotate and move in the radial direction.

[0184] The picking power member includes a telescopic power part and a rotating power part. The telescopic power part drives the suction nozzle to approach or move away from the discharge channel, and the rotating power part drives the suction nozzle and the telescopic power part to rotate together.

[0185] In this setting, the suction nozzle is provided with negative pressure, and the chip can be adsorbed through the negative pressure. After the suction nozzle rotates to align with the discharge channel, after adsorbing the obliquely placed chip, the rotating power part drives the suction nozzle to rotate to a horizontal posture. The telescopic power part moves to approach the chip to adsorb the chip or approach or move away from the chip clamping mechanism.

[0186] In some embodiments, the chip clamping mechanism includes a fixture for clamping the product, and the groove width of the fixture is equal to the width of the chip.

[0187] In some embodiments, it further includes a detection device disposed after the processing of the chip placement device 600. The detection device 940 includes a camera, and the camera is used to detect whether the chip is placed in the middle of the V-shaped mechanism of the cable. The camera is a CCD camera, and the CCD camera can capture whether the chip is placed in the end of the V shape.

[0188] In some embodiments, the second soldering device includes:

[0189] A flux tank 710, movably disposed on the frame 100;

[0190] A solder tank 720, movably disposed on the frame 100;

[0191] A solder power member for driving the flux tank 710 and the solder tank 720 to move in the vertical direction.

[0192] With this setting, the flux tank 710 and the solder tank 720 can be respectively close to or away from the cable, so that the first end of the cable can be soldered in place, and the chip and the cable can be soldered and fixed.

[0193] In some embodiments, the encapsulation device 800 includes:

[0194] A guiding track 810, disposed on the frame 100;

[0195] An adhesive mechanism 820, including an adhesive wheel 821, and the adhesive wheel 821 is used to closely adhere to the back of the tape, so that the tape adheres to the sticker board.

[0196] A feeding mechanism 830, disposed on the frame 100, and the feeding mechanism is used to convey the sticker board towards the adhesive mechanism 820;

[0197] A feeding mechanism 840, disposed on the frame 100, and the feeding mechanism 840 is used to send out the sticker board of the adhesive mechanism 820;

[0198] A cutting mechanism 850, the frame 100 is provided with a cutting gap 854, and the cutter of the cutting mechanism 850 is used to insert into the cutting gap 854 to cut the tape;

[0199] The feeding mechanism 830, the adhesive mechanism 820, the cutting mechanism 850 and the cutting mechanism 850 are sequentially disposed on the frame 100 along the guiding track 810.

[0200] Under this setting, the feeding mechanism 830 is used to provide the bonding plate for the adhesive mechanism 820, and the feeding mechanism 840 is used to send out the bonding plate of the adhesive mechanism 820. When the bonding plate moves along the guiding track 810 and passes through the adhesive mechanism 820, the adhesive wheel 821 of the adhesive mechanism 820 can attach the tape to the bonding plate, so that the cable on the bonding plate is fixed on the bonding plate. After the adhesive step is completed, the feeding mechanism 840 can drive the bonding plate to move, so as to form a certain gap between this bonding plate and the next bonding plate (hereinafter referred to as the first bonding plate and the second bonding plate). At this time, the feeding mechanism 830 and the feeding mechanism 840 work simultaneously, so that the first bonding plate and the second bonding plate continue to move until the first bonding plate and the second bonding plate are respectively located on both sides of the cutting gap 854. The cutter of the cutting mechanism 850 works to cut the tape, and the tapes on the first bonding plate and the second bonding plate are separated, forming a certain cutting gap between the bonding plates, which is conducive to the insertion of the cutter and has a better cutting effect.

[0201] In some embodiments, the adhesive mechanism 820 further includes a pressure roller 822. The pressure roller 822 is arranged on the side of the adhesive wheel 821 away from the feeding mechanism 830. The pressure roller 822 is used to closely adhere to the back of the tape, so that the tape is further adhered to the bonding plate. The pressure roller 822 can further press the tape, improve the bonding degree of the tape, and ensure the adhesive quality.

[0202] In some embodiments, the adhesive mechanism 820 further includes a first elastic member 823. One end of the first elastic member 823 is connected to the frame 100, and the other end is connected to the pressure roller 822. The first elastic member 823 drives the pressure roller 822 to abut against the bonding plate through elastic force. There is a cable on the bonding plate, and the diameter of the cable is greater than the height of the groove on the bonding plate. Driven by elastic force, the pressure roller 822 is kept in contact with the upper surfaces of the bonding plate and the cable, which can make the tape fit well on the bonding plate and improve the quality.

[0203] In some embodiments, the adhesive mechanism 820 further includes a second elastic member 824. One end of the second elastic member 824 is connected to the frame 100, and the other end is connected to the adhesive wheel 821. The second elastic member 824 drives the adhesive wheel 821 to abut against the bonding plate through elastic force. There is a cable on the bonding plate, and the diameter of the cable is greater than the height of the groove on the bonding plate. Driven by elastic force, the adhesive wheel is kept in contact with the upper surfaces of the bonding plate and the cable, which can make the tape fit well on the bonding plate and improve the quality.

[0204] In some embodiments, the guiding track 810 includes two stepped grooves 811. The stepped grooves 811 are used to support both sides of the bonding plate, and a power driving gap is provided between the two stepped grooves 811. The guiding track 810 has a guiding function. The stepped grooves 811 provided on both sides are used to place the bonding plate, which can prevent the bonding plate from leaving. The power driving gap between the two stepped grooves 811 is used to provide space for the feeding mechanism 830 and the feeding mechanism 840, so that the feeding mechanism 830 and the feeding mechanism 840 can move the bonding plate through the power driving gap.

[0205] In some embodiments, the feeding mechanism 830 includes:

[0206] A feeding plate 831, disposed on the guiding track;

[0207] A feeding power member 832, configured to drive the feeding plate 831 to move in a direction close to or away from the adhesive mechanism 820.

[0208] In this setting, by pushing the pasting plate with the feeding plate 831, the unprocessed pasting plate can slide along the guiding track 810.

[0209] In some embodiments, the feeding mechanism 840 includes:

[0210] A clamping assembly 841, including an upper clamping plate and a lower clamping plate, and the upper clamping plate and the lower clamping plate can approach or separate from each other;

[0211] A feeding power member 842, configured to drive the clamping assembly 841 to move in a direction close to or away from the adhesive mechanism 820.

[0212] In this setting, by clamping the pasting plate with the clamping assembly 841, the clamping assembly 841 can carry the pasting plate to move, and the feeding power member 842 drives the clamping assembly 841 to move, so that the processed pasting plate can move away from the adhesive mechanism 820.

[0213] In some embodiments, an upper plate mechanism 860 is further included, and the upper plate mechanism 860 includes:

[0214] A plate storage bracket 861, disposed on the frame 100. The plate storage bracket 861 is provided with a material slot and a feeding slot. The material slot is arranged in the vertical direction, the feeding slot is disposed below the material slot and communicates with the material slot, and the feeding slot is arranged in the front-back direction;

[0215] A feeding plate 862, moving along the feeding slot;

[0216] An upper plate power member 863, driving the feeding plate 862 to move in a direction close to or away from the guiding track 810.

[0217] In this setting, the material slot is used to stack a plurality of pasting plates. The feeding plate 862 moves along the feeding slot, so that the pasting plate located below the material slot and in the feeding slot can move along the feeding slot and be transported to the guiding track 810. The feeding plate 862 withdraws, and the pasting plates on the material slot fall due to their own gravity, and the lowermost pasting plate falls into the feeding slot.

[0218] In some embodiments, a wire pasting mechanism 870 is further included, and the wire pasting mechanism 870 includes:

[0219] A plurality of wire pasting chucks, respectively disposed on both sides of the guiding track 810, and the wire pasting mechanism 870 can clamp or release the wire;

[0220] The wire - pasting power component is used to drive the wire - pasting mechanism 870 to move in the up - and - down direction.

[0221] In this setting, the wire - pasting chuck is used to install the cable at the groove on the pasting board, facilitating the subsequent attachment of the adhesive tape by the adhesive mechanism 820 to bond the cable and the pasting board.

[0222] In some embodiments, the wire - pasting mechanism 870 further includes:

[0223] A plurality of wire - feeding chucks, which are arranged in one - to - one correspondence with the wire - pasting chuck, and the wire - feeding chuck can clamp or release the cable;

[0224] The wire - feeding power component is used to drive the transfer of the wire - feeding chuck to transport the cable to the wire - pasting chuck.

[0225] In this setting, the wire - feeding chuck is used to transport the cable to the wire - pasting chuck.

[0226] It should be noted that in this specification, terms such as "one embodiment", "some embodiments", "basic embodiment", "extended embodiment" can be used to describe several embodiments of the present invention. The specific features, structures, materials or characteristics in several embodiments can be combined under the condition of conforming to the principles and purposes of the present invention.

[0227] Although some embodiments of the present invention have been shown and described in this specification, the present invention should not be limited to the above - mentioned embodiments. As long as it achieves the technical effects of the present invention by the same or equivalent means, any changes, modifications, equivalent substitutions and equivalent variations to these embodiments within the spirit and principles disclosed in the present invention, without departing from the principles and purposes of the present invention, should be included within the scope of protection disclosed by the present invention and should be considered to belong to the protection scope of the present invention.

Claims

1. An NTC chip soldering machine, characterized in that Comprising: A frame (100) provided with a cable wire feeding device; A wire cutting and stripping device (200) provided on the frame (100), the wire cutting and stripping device (200) being used for cutting the cable and stripping the two ends of the cut cable; A first soldering mechanism (300) provided on the frame (100), the first soldering mechanism (300) being used for soldering the two ends of the cable; A shaping device (500) provided on the frame (100), the shaping device (500) being used for shaping the two ends of the first end of the cable into a V shape; A chip placing device (600) provided on the frame (100), the chip placing device (600) being used for placing a chip between the V shapes at the first end of the cable; A second soldering device (700) provided on the frame (100), the second soldering device (700) being used for soldering the first end of the cable and the chip; A rubber coating device (800) provided on the frame (100), the rubber coating device (800) being used for placing the cable on a sticker board and bonding it with a tape; A transporting device for transporting the cable starting from the wire cutting and stripping device (200) and sequentially along the first soldering mechanism (300), the shaping device (500), the chip placing device (600), the second soldering device (700), and the rubber coating device (800).

2. The NTC chip soldering machine according to claim 1, wherein: The wire cutting and stripping device (200) includes: A first wire clamping mechanism (210) including a first chuck (211) and a first wire feeding power component (212), the first wire feeding power component (212) being capable of driving the first chuck (211) to rotate and move in a linear direction; A wire cutting and stripping mechanism (220) for cutting and stripping the cable; A second wire clamping mechanism (230) including a second chuck and a second wire feeding power component, the second wire feeding power component being capable of driving the second chuck to rotate and move in a linear direction, the first soldering mechanism being provided below the first wire clamping mechanism (210) and the second wire clamping mechanism (230); The first wire clamping mechanism (210), the wire cutting and stripping mechanism (220), and the second wire clamping mechanism (230) are sequentially provided on the frame (100).

3. The NTC chip soldering machine according to claim 1, wherein: It further includes a wire expanding and cutting device (400) provided before the processing of the shaping device (500), the wire expanding and cutting device (400) including: An upper cutting knife unit (420) including an upper cutting knife and a wire separating knife provided on the upper cutting knife, the wire separating knife being used for inserting between the two ends of the first end of the cable to separate the two ends of the first end of the cable; A lower cutting knife unit (410) including a lower cutting knife and a wire pressing device cooperating with the wire separating knife; When the upper cutting knife unit (420) and the lower cutting knife unit (410) are closed, they can separate and cut the first end of the cable flat; A cutting knife power component, the upper cutting knife unit (420) and the lower cutting knife unit (410) reciprocatingly move horizontally under the drive of the cutting knife power component.

4. The NTC chip soldering machine according to claim 1, wherein: It further includes a wire pressing mechanism (900) provided after the processing of the shaping device, the wire pressing mechanism (900) including: A wire pressing bracket (910); The first pressing plate (920) and the second pressing plate (930) are movably arranged on the wire pressing bracket (910), and the sides of the first pressing plate (920) and the second pressing plate (930) close to each other are provided with pressing surfaces; A wire pressing power member is used to drive the first pressing plate (920) and the second pressing plate (930) to approach or separate from each other, so that the two pressing surfaces respectively abut against the first ends of the cables.

5. The NTC chip soldering machine according to claim 1, characterized in that: The shaping device (500) includes: A shaping bracket (510) is movably arranged on the frame (100); A left clamp (520) and a right clamp (530) are rotatably installed on the shaping bracket (510), and the sides of the left clamp (520) and the right clamp (530) close to each other are provided with first inclined surfaces; A fixed block (540) is arranged between the left clamp (520) and the right clamp (530), and both sides of the fixed block (540) are provided with V-shaped second inclined surfaces. In the clamping state, the second inclined surfaces are respectively parallel to the first inclined surfaces; A shaping power member is arranged on the bracket, and the shaping power member is used to drive the shaping bracket (510) to move and make the left clamp (520) and the right clamp (530) approach or separate from each other, so that both ends of the first end of the cable are V-shaped.

6. The NTC chip soldering machine according to claim 1, wherein: The chip placing device (600) includes: A picking mechanism (610) is used to automatically pick up chips; A chip clamping mechanism (620) is used to clamp the chips picked up by the picking mechanism (610); A chip assembling power member can drive the picking mechanism (610) to move to the chip clamping mechanism (620), and drive the chip clamping mechanism (620) to move between the V-shapes at the first end of the cable.

7. The NTC chip soldering machine according to claim 1, characterized in that: It further includes a detection device arranged after the processing of the chip placing device (600). The detection device (940) includes a camera, and the camera is used to detect whether the chip is placed in the middle of the V-shaped mechanism of the cable.

8. The NTC chip soldering machine according to claim 1, wherein: The second soldering device includes: A flux tank (710) is movably arranged on the frame (100); A soldering tank (720) is movably arranged on the frame (100); A soldering power member is used to drive the flux tank (710) and the soldering tank (720) to move in the up and down direction.

9. The NTC chip soldering machine according to claim 1, wherein: The encapsulation device (800) includes: A guiding track (810) is arranged on the frame (100); An adhesive mechanism (820) includes an adhesive wheel (821), and the adhesive wheel (821) is used to closely adhere to the back of the tape to make the tape adhere to the pasting plate; A feeding mechanism (830) is arranged on the frame (100), and the feeding mechanism (830) is used to convey the pasting plate towards the adhesive mechanism (820); A feeding mechanism (840) is arranged on the frame (100), and the feeding mechanism (840) is used to send out the pasting plate of the adhesive mechanism (820); A cutting mechanism (850), a cutting gap (854) is arranged on the frame (100), and the cutter of the cutting mechanism (850) is used to insert into the cutting gap (854) to cut the tape; The feeding mechanism (830), the adhesive mechanism (820), the cutting mechanism (850), and the cutting mechanism (850) are sequentially arranged on the frame (100) along the guiding track (810).

10. A method for soldering and processing a thermistor chip, which is applied to the NTC chip soldering machine described in any one of claims 1 to 9, and is characterized in that, Comprising the following steps: S100, the wire stripping and cutting device cuts the wire and strips the two ends of the wire; S200, the first soldering mechanism solders the two ends of the wire respectively; S300, the shaping device (500) presses the first end of the wire so that the first end of the wire is in a V shape; S400, the chip placing device (600) places the chip and inserts the chip into the middle of the first end of the wire; S500, the second soldering device solders the wire and the chip; S600, the encapsulation device places the wire on the sticker board and bonds it with the tape.

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