Processing method of deep-cavity O-shaped sealing groove of gas distribution plate and gas distribution plate

Abstract

The invention belongs to the technical field of machining, and relates to a method for machining a deep-cavity O-shaped sealing groove of a gas distribution plate and the gas distribution plate, and the method comprises the following steps: (1) determining a machining part of the deep-cavity O-shaped sealing groove on the surface of the gas distribution plate; (2) performing in-groove roughing on the processing part by adopting a straight groove cutter to obtain an initial groove; (3) performing in-groove chamfering on the initial groove by adopting a chute cutter to obtain a deep-cavity O-shaped sealing groove; wherein the straight groove cutter and the inclined groove cutter respectively and independently comprise a cutting unit and a fixing unit, and the cutting unit comprises a cutting edge and a chip removal part; the angle of a cutting edge of the straight groove cutter is 90 degrees, and the angle of a cutting edge of the inclined groove cutter is smaller than 90 degrees. By designing the specific forming tool, smooth machining of the deep-cavity O-shaped sealing groove in the surface of the gas distribution disc is achieved, the machining precision and the production efficiency are improved, and large-scale application and popularization are facilitated.

Description

Technical Field

[0001] The present invention belongs to the technical field of machining, and relates to a gas distribution plate, in particular to a machining method for a deep cavity O-shaped sealing groove of a gas distribution plate and a gas distribution plate. Background Art

[0002] The gas distribution plate is an essential key component in the semiconductor manufacturing process and is widely used in processes such as chemical vapor deposition (CVD). Its main function is to uniformly mix various gaseous raw materials and then introduce them into the reaction chamber, enabling the gas to reach the wafer surface evenly and at a constant speed, thereby achieving film deposition. Therefore, the machining accuracy and quality of the gas distribution plate directly affect key performance indicators such as film uniformity, density, and coverage in the semiconductor manufacturing process.

[0003] During the machining process of the gas distribution plate, the machining of the deep cavity O-shaped sealing groove is a highly challenging task. This type of sealing groove is usually located at the bottom of the product, with a relatively large depth (such as 26.7 mm), and the angle of the groove is generally 66°. Traditional turning tool holders and grooving tool holders have obvious limitations when machining such sealing grooves. On the one hand, the traditional turning tool holder has a flat angle (180°) and cannot machine a 66° slope. On the other hand, a section of clamping is left at the bottom of the traditional grooving tool holder, resulting in interference with the side wall of the product and inability to complete the machining. In addition, although some existing machining methods can machine sealing grooves with a certain depth and angle, there is still room for further improvement in terms of machining efficiency, tool life, and machining accuracy.

[0004] In short, the existing technology generally faces problems such as the machining angle not meeting the requirements, interference between the tool and the product, and low machining efficiency and quality when machining the deep cavity O-shaped sealing groove of the gas distribution plate. These problems limit the machining accuracy and production efficiency of the gas distribution plate, and thus affect the overall quality and efficiency of semiconductor manufacturing. Summary of the Invention

[0005] Aiming at the deficiencies of the existing technology, the purpose of the present invention is to provide a machining method for a deep cavity O-shaped sealing groove of a gas distribution plate and a gas distribution plate. By designing a specific forming tool, the smooth machining of the deep cavity O-shaped sealing groove on the surface of the gas distribution plate is realized, the machining accuracy and production efficiency are improved, which is conducive to large-scale popularization and application.

[0006] To achieve the purpose of this invention, the following technical solutions are adopted:

[0007] In the first aspect, the present invention provides a machining method for a deep cavity O-shaped sealing groove of a gas distribution plate, including the following steps:

[0008] (1) Determine the machining position of the deep cavity O-shaped sealing groove on the surface of the gas distribution plate;

[0009] (2) Use a straight groove tool to rough machine the groove in the machining part to obtain an initial groove;

[0010] (3) Use an inclined groove tool to chamfer the inner groove of the initial groove to obtain a deep cavity O-ring seal groove.

[0011] Wherein, the straight groove tool and the inclined groove tool each independently include a cutting unit and a fixing unit, and the cutting unit includes a cutting edge and a chip removal part; the cutting edge angle of the straight groove tool is 90°, and the cutting edge angle of the inclined groove tool < 90°.

[0012] By designing a specific forming tool, especially by designing a specific cutting edge angle, the forming tool can machine a groove with a specific angle, thus realizing the smooth machining of the deep cavity O-ring seal groove on the surface of the gas distribution plate, reducing the tool change and adjustment time during the machining process, improving the machining accuracy and production efficiency, reducing the tool cost, and being conducive to large-scale popularization and application.

[0013] Preferably, the front end of the cutting edge of the straight groove tool is a PCD (polycrystalline diamond) blade, and the rear end of the cutting edge is a tungsten carbide blade.

[0014] Preferably, the inclination angle at the bottom of the cutting edge of the straight groove tool is 1° - 3°, and the inclination depth is 20 - 40 mm.

[0015] Preferably, the spindle speed for rough machining the groove is 200 - 300 rpm, and the feed rate is 0.05 - 0.1 mm / r.

[0016] Preferably, both the front end and the rear end of the cutting edge of the inclined groove tool are PCD blades.

[0017] Preferably, the cutting edge angle of the inclined groove tool is 60° - 70°.

[0018] Preferably, the spindle speed for chamfering the inner groove is 350 - 500 rpm, and the feed rate is 0.02 - 0.04 mm / r.

[0019] Preferably, the rough machining of the groove and the chamfering of the inner groove are respectively accompanied by cooling treatment.

[0020] Wherein, the cooling treatment includes: spraying coolant onto the machining part.

[0021] Preferably, the depth of the deep cavity O-ring seal groove is 20 - 30 mm.

[0022] In a second aspect, the present invention provides a gas distribution plate, on the surface of which there is a deep cavity O-ring seal groove, and the deep cavity O-ring seal groove is manufactured by the manufacturing method described in the first aspect.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] By designing a specific forming tool, especially by designing a specific cutting edge angle, the forming tool can machine a groove with a specific angle, thereby achieving the smooth machining of the deep cavity O-shaped sealing groove on the surface of the gas distribution plate, reducing the tool change and adjustment time during the machining process, improving the machining accuracy and production efficiency, reducing the tool cost, and being conducive to large-scale popularization and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of a straight groove tool used in the machining method provided by the present invention;

[0026] Figure 2 is a schematic structural diagram of an inclined groove tool used in the machining method provided by the present invention;

[0027] Figure 3 is a partial schematic diagram of the gas distribution plate obtained by the machining method provided by the present invention.

[0028] Wherein: 10 - cutting unit; 11 - cutting edge; 12 - chip removal part; 20 - fixing unit. DETAILED DESCRIPTION OF THE INVENTION

[0029] The technical solution of the present invention will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be construed as specific limitations on the present invention.

[0030] An embodiment of the present invention provides a machining method for a deep cavity O-shaped sealing groove of a gas distribution plate, including the following steps:

[0031] (1) Determine the machining part of the deep cavity O-shaped sealing groove on the surface of the gas distribution plate;

[0032] (2) Use a straight groove tool to rough machine the inside of the machining part to obtain an initial groove;

[0033] (3) Use an inclined groove tool to chamfer the inside of the initial groove to obtain a deep cavity O-shaped sealing groove.

[0034] Wherein, the straight groove tool and the inclined groove tool each independently include a cutting unit and a fixing unit, and the cutting unit includes a cutting edge and a chip removal part; the cutting edge angle of the straight groove tool is 90°, and the cutting edge angle of the inclined groove tool < 90°.

[0035] By designing a specific forming tool, especially by designing a specific cutting edge angle, the present invention enables the forming tool to machine a groove with a specific angle, thereby achieving the smooth machining of the deep cavity O-shaped sealing groove on the surface of the gas distribution plate, reducing the tool change and adjustment time during the machining process, improving the machining accuracy and production efficiency, reducing the tool cost, and being conducive to large-scale popularization and application.

[0036] In some embodiments, the front end of the cutting edge of the straight groove tool is a PCD blade, and the rear end of the cutting edge is a tungsten carbide blade.

[0037] In the present invention, the PCD blade has extremely high hardness and wear resistance, and can withstand large cutting forces and high-temperature environments. Setting it at the front end of the cutting edge of the straight groove tool can withstand a larger roughing force area, thereby achieving higher cutting efficiency; the tungsten carbide blade has good toughness, and setting it at the rear end of the cutting edge of the straight groove tool can better discharge chips, avoid chip accumulation and blockage, and thus ensure the smoothness of the machining process.

[0038] In some embodiments, the inclination angle of the bottom of the cutting edge of the straight groove tool is 1° - 3°. For example, it can be 1°, 1.2°, 1.4°, 1.6°, 1.8°, 2°, 2.2°, 2.4°, 2.6°, 2.8°, or 3°, but is not limited to the listed values, and other unlisted values within this numerical range are equally applicable.

[0039] When machining a deep cavity O-shaped sealing groove, the distance between the sealing groove and the side wall is generally very small (only 1.5 mm). Traditional tools are prone to interference with the side wall during the machining process, resulting in the inability to perform machining. The present invention specifically limits the inclination angle of the bottom of the cutting edge of the straight groove tool to 1° - 3°, enabling the tool to maintain a certain gap with the side wall during the machining process, thereby avoiding direct contact and interference with the side wall, ensuring that the tool can smoothly enter the deep cavity for machining without damaging the side wall or causing machining interruption.

[0040] In some embodiments, the inclination depth of the bottom of the cutting edge of the straight groove tool is 20 - 40 mm. For example, it can be 20 mm, 22 mm, 24 mm, 26 mm, 28 mm, 30 mm, 32 mm, 34 mm, 36 mm, 38 mm, or 40 mm, but is not limited to the listed values, and other unlisted values within this numerical range are equally applicable.

[0041] By limiting the inclination depth of the bottom of the cutting edge of the straight groove tool, the present invention provides sufficient space for chip discharge, thereby avoiding chip accumulation and blockage, reducing tool wear and secondary damage to the machined surface.

[0042] In some embodiments, the spindle speed for roughing the groove is 200 - 300 rpm. For example, it can be 200 rpm, 210 rpm, 220 rpm, 230 rpm, 240 rpm, 250 rpm, 260 rpm, 270 rpm, 280 rpm, 290 rpm, or 300 rpm. However, it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0043] In some embodiments, the feed rate for roughing the groove is 0.05 - 0.1 mm / r. For example, it can be 0.05 mm / r, 0.06 mm / r, 0.07 mm / r, 0.08 mm / r, 0.09 mm / r, or 0.1 mm / r. However, it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0044] In some embodiments, both the front end and the rear end of the cutting edge of the inclined groove tool are PCD blades.

[0045] Since PCD blades have extremely high hardness and wear resistance, they can provide extremely high machining accuracy and surface finish in the finishing stage, reduce scratches and burrs on the machined surface. At the same time, such blades can withstand high cutting speeds and high feed rates, ensuring stable cutting performance.

[0046] In some embodiments, the cutting edge angle of the inclined groove tool is 60° - 70°. For example, it can be 60°, 61°, 62°, 63°, 64°, 65°, 66°, 67°, 68°, 69°, or 70°. However, it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0047] In some embodiments, the spindle speed for chamfering the groove is 350 - 500 rpm. For example, it can be 350 rpm, 360 rpm, 370 rpm, 380 rpm, 390 rpm, 400 rpm, 410 rpm, 420 rpm, 430 rpm, 440 rpm, 450 rpm, 460 rpm, 470 rpm, 480 rpm, 490 rpm, or 500 rpm. However, it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0048] In some embodiments, the feed rate of the chamfering inside the groove is 0.02 - 0.04 mm / r. For example, it can be 0.02 mm / r, 0.022 mm / r, 0.024 mm / r, 0.026 mm / r, 0.028 mm / r, 0.03 mm / r, 0.032 mm / r, 0.034 mm / r, 0.036 mm / r, 0.038 mm / r or 0.04 mm / r. However, it is not limited to the listed values, and other unlisted values within this numerical range are equally applicable.

[0049] In some embodiments, roughing inside the groove and chamfering inside the groove are respectively accompanied by cooling treatment.

[0050] In some embodiments, the cooling treatment includes: spraying coolant onto the machining part.

[0051] In some embodiments, the depth of the deep cavity O-ring seal groove is 20 - 30 mm. For example, it can be 20 mm, 21 mm, 22 mm, 23 mm, 24 mm, 25 mm, 26 mm, 27 mm, 28 mm, 29 mm or 30 mm. However, it is not limited to the listed values, and other unlisted values within this numerical range are equally applicable.

[0052] An embodiment of the present invention further provides a gas distribution plate, on the surface of which there is a deep cavity O-ring seal groove, and the deep cavity O-ring seal groove is manufactured by using the machining method described in any of the above embodiments.

[0053] The numerical ranges described in the present invention include not only the above-listed point values, but also any point values between the above numerical ranges that are not listed. Due to space limitations and for the sake of brevity, the present invention does not exhaustively list the specific point values included in the described ranges.

[0054] Example 1

[0055] This embodiment provides a machining method for a deep cavity O-ring seal groove of a gas distribution plate, which specifically includes the following steps:

[0056] (1) Determine the machining part of the deep cavity O-ring seal groove on the surface of the gas distribution plate;

[0057] (2) Use a straight groove tool to perform roughing inside the machining part, control the spindle speed to be 250 rpm, the feed rate to be 0.08 mm / r, and spray coolant onto the machining part for cooling treatment to obtain an initial groove;

[0058] (3) Use an inclined groove tool to perform chamfering inside the initial groove, control the spindle speed to be 420 rpm, the feed rate to be 0.03 mm / r, and spray coolant onto the machining part for cooling treatment to obtain a deep cavity O-ring seal groove with a depth of 25 mm.

[0059] As Figure 1 shown, the straight groove tool is divided into a cutting unit 10 and a fixing unit 20, and the cutting unit 10 is divided into a cutting edge 11 and a chip removal part 12. The angle β1 of the cutting edge 11 of the straight groove tool is 90°. The front end of the cutting edge 11 is a PCD blade, the rear end is a tungsten carbide blade, the inclination angle α at the bottom is 2°, and the inclination depth d is 30 mm.

[0060] As Figure 2 shown, the inclined groove tool is divided into a cutting unit 10 and a fixing unit 20, and the cutting unit 10 is divided into a cutting edge 11 and a chip removal part 12. The angle β2 of the cutting edge 11 of the inclined groove tool is 66°. Both the front end and the rear end of the cutting edge 11 are PCD blades.

[0061] The gas distribution plate obtained by using the processing method provided in this embodiment is shown in Figure 3 , and the part circled in red in the figure is the deep cavity O-shaped sealing groove.

[0062] Embodiment 2

[0063] This embodiment provides a processing method for the deep cavity O-shaped sealing groove of a gas distribution plate, which specifically includes the following steps:

[0064] (1) Determine the processing part of the deep cavity O-shaped sealing groove on the surface of the gas distribution plate;

[0065] (2) Use a straight groove tool to rough machine the inside of the processing part, control the spindle speed to be 200 rpm, the feed rate to be 0.1 mm / r, and spray coolant onto the processing part for cooling treatment to obtain an initial groove;

[0066] (3) Use an inclined groove tool to chamfer the inside of the initial groove, control the spindle speed to be 350 rpm, the feed rate to be 0.04 mm / r, and spray coolant onto the processing part for cooling treatment to obtain a deep cavity O-shaped sealing groove with a depth of 20 mm.

[0067] As Figure 1 shown, the straight groove tool is divided into a cutting unit 10 and a fixing unit 20, and the cutting unit 10 is divided into a cutting edge 11 and a chip removal part 12. The angle β1 of the cutting edge 11 of the straight groove tool is 90°. The front end of the cutting edge 11 is a PCD blade, the rear end is a tungsten carbide blade, the inclination angle α at the bottom is 1°, and the inclination depth d is 25 mm.

[0068] As Figure 2 shown, the inclined groove tool is divided into a cutting unit 10 and a fixing unit 20, and the cutting unit 10 is divided into a cutting edge 11 and a chip removal part 12. The angle β2 of the cutting edge 11 of the inclined groove tool is 60°. Both the front end and the rear end of the cutting edge 11 are PCD blades.

[0069] The gas distribution plate obtained by using the processing method provided in this embodiment is shown in Figure 3 , and the part circled in red in the figure is the deep cavity O-ring seal groove.

[0070] Embodiment 3

[0071] This embodiment provides a processing method for the deep cavity O-ring seal groove of the gas distribution plate, which specifically includes the following steps:

[0072] (1) Determine the processing position of the deep cavity O-ring seal groove on the surface of the gas distribution plate;

[0073] (2) Use a straight groove cutter to rough machine the inside of the processing position, control the spindle speed at 300 rpm, the feed rate at 0.05 mm / r, and spray coolant onto the processing position for cooling treatment to obtain an initial groove;

[0074] (3) Use an inclined groove cutter to chamfer the inside of the initial groove, control the spindle speed at 500 rpm, the feed rate at 0.02 mm / r, and spray coolant onto the processing position for cooling treatment to obtain a deep cavity O-ring seal groove with a depth of 30 mm.

[0075] As Figure 1 shown, the straight groove cutter is divided into a cutting unit 10 and a fixing unit 20, and the cutting unit 10 is divided into a cutting edge 11 and a chip removal part 12. The angle β1 of the cutting edge 11 of the straight groove cutter is 90°, the front end of the cutting edge 11 is a PCD blade, the rear end is a tungsten carbide blade, the inclination angle α at the bottom is 3°, and the inclination depth d is 40 mm.

[0076] As Figure 2 shown, the inclined groove cutter is divided into a cutting unit 10 and a fixing unit 20, and the cutting unit 10 is divided into a cutting edge 11 and a chip removal part 12. The angle β2 of the cutting edge 11 of the inclined groove cutter is 70°, and both the front end and the rear end of the cutting edge 11 are PCD blades.

[0077] The gas distribution plate obtained by using the processing method provided in this embodiment is shown in Figure 3 , and the part circled in red in the figure is the deep cavity O-ring seal groove.

[0078] Embodiment 4

[0079] This embodiment provides a processing method for the deep cavity O-ring seal groove of the gas distribution plate. Except that the rear end of the cutting edge 11 of the straight groove cutter is changed to a PCD blade, the remaining steps and conditions are the same as those in Embodiment 1, so they will not be elaborated here.

[0080] Compared with Embodiment 1, since the rear end of the cutting edge 11 of the straight groove tool used in this embodiment is a PCD blade, and the toughness of the PCD blade is inferior to that of the tungsten carbide blade, chip accumulation and blockage are likely to occur during the rough machining of the groove.

[0081] Embodiment 5

[0082] This embodiment provides a processing method for the deep cavity O-shaped sealing groove of the gas distribution disc. Except that no inclined angle α is reserved at the bottom of the straight groove tool, the remaining steps and conditions are the same as those in Embodiment 1, so they will not be elaborated here.

[0083] Compared with Embodiment 1, since no inclined angle α is reserved at the bottom of the straight groove tool used in this embodiment, the tool is likely to interfere with the side wall during the machining process, thus affecting the smooth progress of the rough machining of the groove.

[0084] It can be seen that the present invention designs a specific forming tool, especially a specific cutting edge angle, so that the forming tool can machine a groove with a specific angle, thus realizing the smooth machining of the deep cavity O-shaped sealing groove on the surface of the gas distribution disc, reducing the tool replacement and adjustment time during the machining process, improving the machining accuracy and production efficiency, reducing the tool cost, and being conducive to large-scale popularization and application.

[0085] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention fall within the protection scope and the disclosure scope of the present invention.

Claims

1. A processing method for a deep cavity O-shaped sealing groove of a gas distribution plate, characterized in that, The processing method includes the following steps: (1) Determine the processing position of the deep cavity O-ring seal groove on the surface of the gas distribution plate; (2) Use a straight groove tool to rough machine the inside of the groove at the processing position to obtain an initial groove; (3) Use an inclined groove tool to chamfer the inside of the initial groove to obtain a deep cavity O-ring seal groove; Wherein, the straight groove tool and the inclined groove tool each independently include a cutting unit and a fixing unit, and the cutting unit includes a cutting edge and a chip removal part; the cutting edge angle of the straight groove tool is 90°, and the cutting edge angle of the inclined groove tool < 90°.

2. The processing method according to claim 1, wherein The front end of the cutting edge of the straight groove tool is a PCD blade, and the rear end of the cutting edge is a tungsten carbide blade.

3. The processing method according to claim 1, characterized in that, The inclination angle at the bottom of the cutting edge of the straight groove tool is 1° - 3°, and the inclination depth is 20 - 40 mm.

4. The processing method according to claim 1, characterized in that The spindle speed for rough machining the inside of the groove is 200 - 300 rpm, and the feed rate is 0.05 - 0.1 mm / r.

5. The processing method according to claim 1, characterized in that, Both the front end and the rear end of the cutting edge of the inclined groove tool are PCD blades.

6. The processing method according to claim 1, wherein The cutting edge angle of the inclined groove tool is 60° - 70°.

7. The processing method according to claim 1, characterized in that, The spindle speed for chamfering the inside of the groove is 350 - 500 rpm, and the feed rate is 0.02 - 0.04 mm / r.

8. The processing method according to claim 1, characterized in that, Rough machining the inside of the groove and chamfering the inside of the groove are respectively accompanied by cooling treatment; Wherein, the cooling treatment includes: spraying a coolant onto the processing position.

9. The processing method according to claim 1, characterized in that, The depth of the deep cavity O-ring seal groove is 20 - 30 mm.

10. A gas distribution plate, characterized in that, The surface of the gas distribution plate is provided with a deep cavity O-ring seal groove, and the deep cavity O-ring seal groove is made by the processing method according to any one of claims 1 - 9.

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