Manual test tool and test method for semiconductor module

Abstract

The invention provides a manual test tool and a test method for a semiconductor module, and the tool comprises two guide parts which are arranged in a manner of extending in a second direction; a first moving seat and a second moving seat, the two ends of the first moving seat are respectively arranged on the guide parts at the two sides in a sliding manner, the two ends of the second moving seat are respectively arranged on the guide parts at the two sides in a sliding manner, the first moving seat is provided with at least one first power-on contact structure, and the second moving seat is provided with at least one second power-on contact structure; the detection head structure is located between the first moving seat and the second moving seat, the two ends of the detection head structure are arranged on the guide parts on the two sides in a sliding mode respectively, and the detection head structure comprises at least one downward pressing detection assembly. The module test fixture solves the problem that the module test fixture in the prior art is single in type of semiconductor modules correspondingly tested and does not have universality, so that the cost of the fixture is increased.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor module detection, and more specifically, to a manual test tool and a test method for a semiconductor module. Background Art

[0002] A power semiconductor module is a combination of certain functions and modes. A power semiconductor module is a high-power electronic power device assembled and potted into one body according to certain functions. The power semiconductor module can achieve different functions according to different encapsulated components, such as semiconductor field effect transistors, insulated gate bipolar transistors, and power integrated circuits. The shapes of power semiconductor modules are various, and among them, a module with conductive pins parallel to the bottom plate is commonly used.

[0003] When the existing module test fixture measures a power semiconductor module, a special detection fixture is usually used, that is, a module test fixture can only detect one type of semiconductor module. When the size of the semiconductor module changes, a corresponding specification of the module test fixture needs to be designed, resulting in the need for many module test fixtures during the production process of the semiconductor module, without universality, leading to an increase in fixture costs.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] The purpose of the present application is to provide a manual test tool and a test method for a semiconductor module, which solve the problem that the module test fixture in the existing technology has a single type of semiconductor module corresponding to the test and no universality, resulting in an increase in fixture costs.

[0006] To achieve the above purpose, the technical solution adopted in the present application is:

[0007] On the one hand, the present application provides a manual test tool for a semiconductor module, including: two guiding parts spaced apart on both sides in the first direction, and each guiding part extends in the second direction;

[0008] A first moving seat and a second moving seat spaced apart on both sides in the second direction. The two ends of the first moving seat are respectively slidably arranged on the guiding parts on both sides, and the two ends of the second moving seat are respectively slidably arranged on the guiding parts on both sides. At least one first energized contact structure is arranged on the first moving seat, and at least one second energized contact structure is arranged on the second moving seat;

[0009] A detection head structure, which is located between the first moving seat and the second moving seat, and the two ends of the detection head structure are respectively slidably arranged on the guiding parts on both sides. The detection head structure includes at least one downward pressing detection component;

[0010] The first energized contact structure and the second energized contact structure are matched with the positions of the electrode pins of the semiconductor module to be detected by sliding along the guiding part, and the pressing detection assembly is matched with the positions of the functional pins of the semiconductor module to be detected by sliding along the guiding part.

[0011] In an alternative embodiment, the guiding part includes: a main guide rail extending along the second direction;

[0012] The first moving seat includes: a main bearing beam extending along the first direction;

[0013] The first locking feet are arranged at both ends of the main bearing beam in the first direction;

[0014] The first main sliding table is arranged on the first locking feet and is matched with the main guide rail;

[0015] The main bearing beam slides on the main guide rail through the first main sliding tables on both sides to lock the position of the main bearing beam through the first locking feet.

[0016] In an alternative embodiment, the manual test tool further includes a bottom plate, and a cooling plate is arranged on the bottom plate for carrying the semiconductor module to be detected;

[0017] Two rows of threaded holes are formed in the bottom plate, and the two rows of threaded holes are respectively located outside the main guide rails on both sides;

[0018] The first locking feet protrude from the side surface of the main bearing beam in the first direction and are provided with locking holes;

[0019] Locking screws are used to pass through the locking holes, and the first locking feet lock the position of the main bearing beam by connecting the threaded holes through the locking screws.

[0020] In an alternative embodiment, an adjustment groove is arranged on the main bearing beam and extends along the first direction;

[0021] The first energized contact structure includes: an adjustable bracket, a docking boss is arranged at the bottom of the adjustable bracket, and the adjustable bracket is embedded in the adjustment groove through the docking boss and is adjustable in both the first direction and the second direction.

[0022] In an alternative embodiment, the first energized contact structure further includes: a push-pull clamp arranged on the adjustable bracket;

[0023] A movable frame is connected to the push-pull clamp and moves up and down by the drive of the push-pull clamp;

[0024] Two electrode assemblies, both of the two electrode assemblies include an electrode bearing table and an energized contact;

[0025] The electrode carrier table is provided with adjustment waist-shaped holes extending in the first direction and is connected to the movable frame by passing through screws.

[0026] In an optional embodiment, the electrode carrier table includes: a carrier connection plate, and the adjustment waist-shaped holes are arranged on the carrier connection plate so that the carrier connection plate is adjustably arranged on the movable frame;

[0027] There are two adjustment waist-shaped holes on the carrier connection plate, and the two adjustment waist-shaped holes are arranged at intervals in the up-down direction.

[0028] In an optional embodiment, the adjustable bracket includes: a first adjustment seat, and a first waist-shaped hole extending in the first direction is provided on the first adjustment seat;

[0029] A second adjustment seat, the second adjustment seat includes a base horizontal plate and a base vertical plate, a second waist-shaped hole extending in the second direction is provided on the base horizontal plate, and the second adjustment seat is connected to the first adjustment seat by passing through the second waist-shaped hole with screws;

[0030] The base vertical plate is arranged in the up-down direction, and the push-pull type clamp is located at the top of the base vertical plate.

[0031] In an optional embodiment, second main slide tables are arranged at both ends of the detection head structure in the first direction, and the detection head structure slides on the main guide rail through the second main slide tables on both sides;

[0032] Second locking feet are arranged on the second main slide tables, and the position of the moved detection head structure is locked through the second locking feet.

[0033] In an optional embodiment, the detection head structure includes: a hinge seat and a clamping seat, the hinge seat and the clamping seat are respectively arranged at intervals on both sides in the first direction, and at least one to-be-detected position is formed between the hinge seat and the clamping seat, and the to-be-detected position is used for placing the semiconductor module to be detected;

[0034] A support frame, one end of the support frame is hinged to the hinge seat and the other end is detachably connected to the clamping seat, and the support frame is used for;

[0035] At least one downward pressure detection component, and the downward pressure detection component is arranged on the support frame;

[0036] The downward pressure detection component leaves above the to-be-detected position or is suspended above the to-be-detected position through the flipping of the support frame;

[0037] The downward pressure detection component suspended above the to-be-detected position is used to move downward and contact the functional pins of the semiconductor module.

[0038] On the other hand, the present application also proposes a manual testing method for a semiconductor module, which is applied to the manual testing tool as described above. Among them, the manual testing method includes the steps:

[0039] Place the semiconductor module to be detected on the cooling plate and position it.

[0040] Push the first moving seat to match the position of the first energized contact structure with the electrode pin at one end of the semiconductor module, and lock the position of the first moving seat.

[0041] Push the second moving seat to match the position of the second energized contact structure with the electrode pin at the other end of the semiconductor module, and lock the position of the second moving seat.

[0042] Push the detection head structure to match the position of the detection head structure with the functional pin on the semiconductor module, and lock the position of the pushed detection head structure.

[0043] Manually press the first energized contact structure, the second energized contact structure and the detection head structure, so that the first energized contact structure and the second energized contact structure are connected to the electrode pins to supply power to the semiconductor module, and the detection head structure is connected to the functional pins to detect the semiconductor module.

[0044] The beneficial effects of a manual testing tool and a testing method for a semiconductor module provided by the present application are at least as follows: by arranging two guiding parts at intervals on both sides in the first direction, and respectively arranging a movable first moving seat and a second moving seat on the guiding parts, by sliding the first moving seat, the first energized contact structure can be moved along the second direction, and by sliding the second moving seat, the second energized contact structure can be moved along the second direction; by arranging the detection head structure to slide on the guiding part, the detection head structure can be adjusted in position in the second direction, and the pressing detection component thereon can be adjusted to the corresponding position of the semiconductor module to be detected. When detecting different semiconductor modules, according to the sizes of different semiconductor modules, the first energized contact structure and the second energized contact structure are matched with the positions of the electrode pins of the semiconductor module to be detected by sliding along the guiding part, and the pressing detection component is matched with the positions of the functional pins of the semiconductor module to be detected by sliding along the guiding part, and then detection is carried out, so that different semiconductor modules can be detected, the versatility is improved, different semiconductor modules can be detected by using one testing device, the number of testing devices is reduced, and the production cost is lowered. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0046] Figure 1 Schematic diagram of the structure of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0047] Figure 2 Exploded view of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0048] Figure 3 Exploded view of the first moving seat of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0049] Figure 4 Schematic diagram of the structure of the first energizing contact structure of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0050] Figure 5 Exploded view of the first energizing contact structure of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0051] Figure 6 Schematic diagram of the structure of the first energizing contact structure of a manual test tool for a semiconductor module provided by an embodiment of the present application from another perspective;

[0052] Figure 7 Schematic diagram of the structure of the detection head structure of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0053] Figure 8 Exploded view of the detection head structure of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0054] Figure 9 Exploded view of the support frame part of the detection head structure of a manual test tool for a semiconductor module provided by an embodiment of the present application;

[0055] Figure 10 Schematic diagram of the structure of the downward pressure detection component of the detection head structure of a manual test tool for a semiconductor module provided by an embodiment of the present application.

[0056] Among them, the reference numerals in the figure are as follows:

[0057] 10. Semiconductor module; 100. Base plate; 110. Cooling plate; 120. Threaded hole; 130. Guide part; 131. Main guide rail; 140. First moving seat; 141. Main bearing beam; 142. First locking foot; 143. First main slide; 144. Locking hole; 145. Position adjustment groove; 150. Second moving seat; 160. Second main slide; 161. Second locking foot; 170. Position to be inspected; 171. Positioning block; 200. First energized contact structure; 2100. Adjustable bracket; 2110. First adjustment seat; 2111. First kidney-shaped hole; 2112. Docking boss; 2120. Second adjustment seat; 2121. Base horizontal plate; 2122. Base vertical plate; 2123. Second kidney-shaped hole; 2124. Upper support plate; 2130. Guide rail; 2140. Clearance window; 2200. Push-pull clamp; 2300. Movable frame; 2310. Guide bar; 2320. Slide; 2400. Electrode assembly; 2410. Electrode bearing platform; 2411. Adjustment kidney-shaped hole; 2412. Bearing connecting plate; 2413. Guide groove; 2414. Bearing mounting plate; 2420. Energized contact; 2421. Wire connector; 2422. Connection flange; 2500. Insulating plate; 2510. Fixed block; 300. Detection head structure; 3100. Hinge seat; 3200. Clamping seat; 3220. Side stop block; 3221. Locking kidney-shaped hole; 3222. Mounting post; 3230. Bayonet; 3400. Support frame; 3410. Cross beam; 3420. First support leg; 3430. Second support leg; 3431. Clamping part; 3432. Open slot; 3440. Clamping assembly; 3441. Clamping post; 3442. Handle part; 3443. Elastic part; 3500. Press-down detection assembly; 3510. Detection support seat; 3511. Support vertical plate; 3512. Support horizontal plate; 3513. Positioning convex block; 3520. Push-pull presser; 3530. Pressure plate; 3531. Detection joint; 3540. Guide slide bar; 3541. Guide slide sleeve; 400. Second energized contact structure. Detailed implementation manners

[0058] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0059] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly located on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The orientations or positions indicated by terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positions shown in the drawings, and are only for convenience of description and should not be construed as a limitation to the technical solution of the present invention. The terms "first" and "second" are only used for convenience of description and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. The meaning of "a plurality" is two or more, unless otherwise specifically and clearly defined.

[0060] Embodiment 1

[0061] As Figure 1 、 Figure 2 shown, this embodiment provides a manual test tool for a semiconductor module, including: two guiding parts 130, a first moving seat 140 and a first energizing contact structure 200, a second moving seat 150 and a second energizing contact structure 400, and a detection head structure 300. For convenience of structural description, the left-right direction is taken as the first direction, and the front-rear direction is taken as the second direction. The two guiding parts 130 are respectively arranged at intervals on both sides in the left-right direction, and each guiding part 130 extends a predetermined length in the front-rear direction. The first moving seat 140 and the second moving seat 150 are respectively arranged at intervals on both sides in the front-rear direction, and can be respectively locked after sliding on the guiding parts 130, so as to adjust the front-rear positions of the first moving seat 140 and the second moving seat 150. The two ends of the first moving seat 140 are respectively slidably arranged on the guiding parts 130 on both sides, the two ends of the second moving seat 150 are respectively slidably arranged on the guiding parts 130 on both sides, at least one first energizing contact structure 200 is arranged on the first moving seat 140, and can move back and forth following the first moving seat 140. At least one second energizing contact structure 400 is arranged on the second moving seat 150, and can move back and forth following the second moving seat 150. The detection head structure 300 is located between the first moving seat 140 and the second moving seat 150, and the two ends of the detection head structure 300 are respectively slidably arranged on the guiding parts 130 on both sides, and the detection head structure 300 includes at least one downward pressing detection component 3500. The first energizing contact structure 200 and the second energizing contact structure 400 are matched with the positions of the electrode pins of the semiconductor module 10 to be detected by sliding along the guiding parts 130, and the downward pressing detection component 3500 is matched with the positions of the functional pins of the semiconductor module 10 to be detected by sliding along the guiding parts 130.

[0062] As Figure 1 、 Figure 2As shown in the figure, a manual testing tool for a semiconductor module according to this embodiment includes two guiding parts 130 arranged at intervals on both sides in the left-right direction, and a movable first moving seat 140 and a second moving seat 150 are respectively arranged on the guiding parts 130. By sliding the first moving seat 140, the first energized contact structure 200 can be moved along the front-back direction, and by sliding the second moving seat 150, the second energized contact structure 400 can be moved along the second direction. By arranging the detection head structure 300 to slide on the guiding part 130, the position of the detection head structure 300 can be adjusted in the second direction, and the pressing detection component 3500 thereon can be adjusted to a position corresponding to the semiconductor module 10 to be detected. When detecting different semiconductor modules 10, according to the sizes of different semiconductor modules 10, the first energized contact structure 200 and the second energized contact structure 400 are matched with the positions of the electrode pins of the semiconductor module 10 to be detected by sliding along the guiding part 130, and the pressing detection component 3500 is matched with the positions of the functional pins of the semiconductor module 10 to be detected by sliding along the guiding part 130, and then detection is carried out. Thus, different semiconductor modules 10 can be detected, improving versatility. Using one testing device can detect different semiconductor modules 10, reducing the number of testing devices and lowering production costs.

[0063] As Figure 2 , Figure 3 shown, further, the structures of the first moving seat 140 and the second moving seat 150 in this embodiment can be the same, and the first energized contact structure 200 and the second energized contact structure 400 thereon can be the same. They are just arranged at different front-back positions on the guiding part 130. In this embodiment, the structure of the first moving seat 140 and the first energized contact structure 200 are described. The form of the second moving seat 150 and the second channel contact structure can refer to the specific structures of the first moving seat 140 and the first energized contact structure 200.

[0064] As Figure 2 , Figure 3As shown, the guiding part 130 of this embodiment specifically includes: a main guide rail 131, and the main guide rail 131 extends a predetermined length in the front-rear direction. The first moving seat 140 specifically includes: a main bearing beam 141, a first locking foot 142, and a first main sliding table 143. The main bearing beam 141 extends along the first direction, the first locking feet 142 are arranged at both ends of the main bearing beam 141 in the first direction, and the first main sliding table 143 is arranged on the first locking feet 142 and is matched with the main guide rail 131. The main bearing beam 141 slides on the main guide rail 131 through the first main sliding tables 143 on both sides to lock the position of the main bearing beam 141 through the first locking feet 142. In the specific structure, the main bearing beam 141 adopts a strip-shaped structure and is lifted and suspended through the first locking feet 142 and the first main sliding tables 143. The first locking foot 142 adopts a "z"-shaped structure, which includes an upper plate and a lower plate, and a step is formed between the upper plate and the lower plate. The upper plate is fixedly connected to the first main sliding table 143, and the upper plate is fixedly connected to one end of the main bearing beam 141. Through the cooperation of the first main sliding table 143 and the main guide rail 131, the stable movement of the first moving seat 140 is realized.

[0065] As Figure 2 , Figure 3 shown, further, the manual test tool of this embodiment further includes a bottom plate 100, and a cooling plate 110 is arranged on the bottom plate 100. The cooling plate 110 is used to carry the semiconductor module 10 to be detected. During the test of the semiconductor module 10, the heat generation is relatively large, and heat dissipation is carried out through the cooling plate 110 to ensure the stability of the detection. Two rows of threaded holes 120 are opened on the bottom plate 100, and the two rows of threaded holes 120 are respectively located outside the main guide rails 131 on both sides. The lower plate of the first locking foot 142 protrudes from the side surface of the main bearing beam 141 in the first direction and is provided with a locking hole 144. A locking screw is used to pass through the locking hole 144, and the first locking foot 142 locks the position of the main bearing beam 141 by connecting the threaded hole 120 through the locking screw. The two rows of threaded holes 120 can be arranged at equal intervals. After the front-rear position of the first moving seat 140 is adjusted, the first moving seat 140 is locked at the adjusted position by passing the locking screw through the kidney-shaped hole and screwing it into the threaded hole 120.

[0066] As Figure 2 , Figure 3 , Figure 4As shown, further, an adjustment groove 145 is provided on the main bearing beam 141 of this embodiment, and the adjustment groove 145 extends along the first direction. The first energized contact structure 200 includes: an adjustable bracket 2100, a docking boss 2112 is provided at the bottom of the adjustable bracket 2100, and the adjustable bracket 2100 is embedded in the adjustment groove 145 through the docking boss 2112, and its position in the first direction and the second direction is adjustable. By matching the adjustment sleeve with the docking boss 2112, the first energized contact structure 200 can be quickly positioned on the main bearing beam 141, making the assembly accuracy higher and improving the disassembly and assembly efficiency.

[0067] As Figure 1 , Figure 4 , Figure 5 As shown, the first energized contact structure further includes: a push-pull clamp 2200, a movable frame 2300, and two electrode assemblies 2400. When testing the semiconductor module, the adjustable bracket 2100 is vertically arranged in the up and down direction, and the position of the adjustable bracket 2100 in the first direction and the second direction is adjustable, so that the parts installed on the adjustable bracket 2100 can be adjusted in position on the horizontal plane. The push-pull clamp 2200 is arranged on the adjustable bracket 2100, the movable frame 2300 is connected to the push-pull clamp 2200, and moves up and down under the drive of the push-pull clamp 2200. A plurality of electrode assemblies 2400 are all arranged on the movable frame 2300. When the movable frame 2300 moves up and down, it drives the plurality of electrode assemblies 2400 to move up and down synchronously. Two electrode assemblies 2400 can be provided in this embodiment, and each electrode assembly 2400 includes an electrode carrier 2410 and an energized contact 2420. When it is necessary to detect the semiconductor module below, press down the push-pull clamp 2200 to move the movable frame 2300 downward, and the energized contact 2420 moves downward through the downward movement of the movable frame 2300 to contact the electrode pins of the semiconductor module 10 to be detected. Thus, a plurality of energized contacts 2420 can be simultaneously docked with a plurality of electrode pins on the semiconductor module 10 respectively to achieve efficient energized connection. An adjustment kidney-shaped hole 2411 extending along the first direction is provided on the electrode carrier 2410, and it is connected to the movable frame 2300 by passing through and screwing. By screwing the screw through the adjustment kidney-shaped hole 2411 to connect the electrode carrier 2410 to the movable frame 2300, the left and right position of the electrode carrier 2410 on the movable frame 2300 is adjustable. Therefore, when the distance between the electrode pins of the semiconductor module is different, the distance between the two electrode carriers 2410 can be adjusted, so that the distance between the energized contacts 2420 is adjusted to adapt to different models of semiconductor modules.

[0068] As Figure 1 , Figure 4 , Figure 5As shown, for the first power-on contact structure of the manual test of a semiconductor module in this embodiment, a push-pull clamp 2200 is arranged on the adjustable bracket 2100, a movable frame 2300 is arranged on the push-pull clamp 2200, and an electrode assembly 2400 is arranged on the movable frame 2300. When it is necessary to connect the electrode pins of the semiconductor module, only need to pull the push-pull clamp 2200, and the movable frame 2300 moves downward under the drive of the push-pull clamp 2200, so that the electrode assembly 2400 thereon also moves downward, so that the power-on contact 2420 of the electrode assembly 2400 moves downward and presses on the electrode pins of the semiconductor module below, thereby realizing the docking with the electrode pins and supplying power to them. In this way, multiple electrode pins of the semiconductor module can be powered on through one operation, greatly improving the docking efficiency. Moreover, the position of the power-on contact 2420 on the electrode assembly 2400 is relatively fixed during the docking process, and it can only be docked to the correct electrode pins of the semiconductor module, and there will be no misclamping situation. And an adjustment waist-shaped hole 2411 extending in the first direction is opened on the electrode carrier 2410, and the position of the adjustment waist-shaped hole 2411 and the screw can be adjusted to adjust the relative position of the electrode carrier 2410 on the movable frame 2300. Then, the relative positions of the two electrode assemblies 2400 can be adjusted, so as to adapt to semiconductor modules with electrode pins at different distances for power-on, improving the versatility of this first power-on contact structure.

[0069] As Figure 3 , Figure 4 , Figure 5As shown in the figure, further, the adjustable bracket 2100 of this embodiment specifically includes: a first adjustment base 2110 and a second adjustment base 2120. A first kidney-shaped hole 2111 extending in the first direction is provided on the first adjustment base 2110. A screw is passed through the first kidney-shaped hole 2111 to connect the first adjustment base 2110 to the frame, so that the position of the first adjustment base 2110 on the frame can be adjusted in the left-right direction, enabling multiple electrode assemblies 2400 to be synchronously adjusted in the left-right direction of the frame. The second adjustment base 2120 includes a base horizontal plate 2121 and a base vertical plate 2122. A second kidney-shaped hole 2123 extending in the second direction is provided on the base horizontal plate 2121, and it is connected to the first adjustment base 2110 by passing a screw through the second kidney-shaped hole 2123; the base horizontal plate 2121 is horizontally arranged on the first adjustment base 2110 through the second kidney-shaped hole 2123, so that the position of the second adjustment base 2120 on the first adjustment base 2110 can be adjusted in the front-back direction. Thus, the synchronous adjustment of the positions of multiple electrode assemblies 2400 in the front-back direction is achieved. The base vertical plate 2122 is arranged in the up-down direction, and the push-pull clamp 2200 is located at the top of the base vertical plate 2122. By arranging the push-pull clamp 2200 at the top of the base vertical plate 2122, the push-pull clamp 2200 can drive the movable frame 2300 to move in the up-down direction.

[0070] As Figure 3 , Figure 4 , Figure 5 shown in the figure, further, the electrode carrier 2410 of this embodiment specifically includes: a carrier connection plate 2412, and an adjustment kidney-shaped hole 2411 is provided on the carrier connection plate 2412 to enable the carrier connection plate 2412 to be adjustably arranged on the movable frame 2300. The back surface of the carrier connection plate 2412 abuts against the movable frame 2300 and is fixed by passing a screw through the adjustment kidney-shaped hole 2411. There are two adjustment kidney-shaped holes 2411 on the carrier connection plate 2412, and the two adjustment kidney-shaped holes 2411 are spaced apart in the up-down direction. Threaded holes are provided on the movable frame 2300 at positions corresponding to the adjustment kidney-shaped holes 2411. By using two adjustment kidney-shaped holes 2411 arranged side by side up and down and connecting them with two screws in the up-down direction, the electrode carrier 2410 is restricted to move only in the left-right direction.

[0071] As Figure 3 , Figure 4 , Figure 5As shown in the figure, further, a guiding bar 2310 is arranged on the movable frame 2300 along the first direction; the guiding bar 2310 extends in the left-right direction as a whole. A guiding groove 2413 is formed on the side of the bearing connecting plate 2412 facing the movable frame 2300. The bearing connecting plate 2412 is sleeved on the guiding bar 2310 through the guiding groove 2413 and slides thereon. The bearing connecting plates 2412 of multiple electrode assemblies 2400 are located on the left and right sides of the guiding bar 2310 and are matched with the guiding bar 2310 through the guiding grooves 2413. In this way, when adjusting the position of the electrode assembly 2400, the bearing connecting plate 2412 can only move and adjust in the left-right direction, ensuring that the vertical position and the front-back position of the bearing connecting plate 2412 remain unchanged during adjustment, which is convenient for adjusting the position of the electrode assembly 2400. In addition, a spacing block protrudes in the middle of the guiding bar 2310. The spacing block divides the guiding bar 2310 into two parts on the left and right and forms a step between the two parts on the left and right. The adjustment positions of the bearing connecting plates 2412 on the left and right sides are separated by the spacing block, which helps to directly position the electrode assemblies 2400 on both sides and is convenient for installation.

[0072] As Figure 3 , Figure 4 , Figure 5 shown in the figure, further, the electrode bearing table 2410 of this embodiment further includes: a bearing mounting plate 2414, and the bearing mounting plate 2414 is arranged perpendicular to the bearing connecting plate 2412. The energized contact 2420 is provided with a connecting flange 2422. The energized contact 2420 penetrates through the bearing mounting plate 2414 and makes the connecting flange 2422 located below the bearing mounting plate 2414. The energized contact 2420 is fixedly connected to the bearing mounting plate 2414 through the connecting flange 2422. The bearing mounting plate 2414 provides an installation position for the energized contact 2420. In the specific process, the bearing mounting plate 2414 is horizontally arranged and extends a predetermined length towards the electrode assembly 2400 on the other side. A through hole is formed at one end of the bearing mounting plate 2414 facing the electrode assembly 2400 on the other side. The energized contact 2420 is inserted into the through hole from bottom to top and can be stably fixed on the lower surface of the bearing mounting plate 2414 through the connecting flange below.

[0073] As Figure 3 , Figure 4 , Figure 5As shown, further, a guide rail 2130 is provided on the adjustable bracket 2100 of this embodiment in the up and down direction. A slide table 2320 is provided on the side of the movable frame 2300 facing away from the electrode assembly 2400. The movable frame 2300 is movably arranged in the up and down direction by matching the slide table 2320 with the guide rail 2130. In a specific structure, two guide rails 2130 are arranged at intervals in the left and right directions, and slide tables 2320 are respectively provided on the left and right sides of the back surface of the movable frame 2300. By sliding the slide table 2320 on the guide rail 2130, the movable frame 2300 can be stably moved up and down under the drive of the push-pull type clamp 2200.

[0074] As Figure 3 , Figure 4 , Figure 5 As shown, further, a upper support plate 2124 is provided at the top of the base vertical plate 2122 of this embodiment, and the upper support plate 2124 extends in a direction away from the base horizontal plate 2121; the push-pull type clamp 2200 is fixedly arranged on the upper support plate 2124, and the pressure rod of the push-pull type clamp 2200 penetrates through the upper support plate 2124 and is connected to the movable frame 2300. The push-pull type clamp 2200 of this embodiment can adopt a WDC36202M type push-pull type clamp. The upper support plate 2124 can stably support the push-pull type clamp 2200, so that the movable frame 2300 is located below the upper support plate 2124 and moves up and down stably.

[0075] As Figure 3 , Figure 4 , Figure 5 As shown, further, an insulating plate 2500 is provided between the two energized contacts 2420 of this embodiment to separate the two energized contacts 2420. The insulating plate 2500 separates multiple (two) electrode assemblies 2400, avoiding mutual interference between the arcs of the respective energized contacts 2420 and ensuring the stability and safety of power use.

[0076] As Figure 5 , Figure 6As shown in the figure, further, an emptying window 2140 is formed on the adjustable bracket 2100 of this embodiment; a fixing block 2510 is provided on the adjustable bracket 2100. The fixing block 2510 passes through the emptying window 2140 and protrudes toward the side of the electrode assembly 2400, and the insulating plate 2500 is fixed on the fixing block 2510. In a specific structure, the adjustable bracket 2100 is hollowed out through the avoidance window, which can reduce the weight and save costs while ensuring the structural strength of the adjustable bracket 2100. In addition, the inner wall of the emptying window 2140 provides an installation position for the fixing block 2510. The fixing block 2510 can extend a certain length in the front-rear direction and is installed on the inner wall of the emptying window 2140, so that the fixing block 2510 has sufficient support length and installation position, ensuring the connection stability of the insulating plate 2500.

[0077] As Figure 5 , Figure 6 shown in the figure, further, a wire joint 2421 is connected to the energized contact 2420 of this embodiment. The wire joint 2421 extends toward the adjustable bracket 2100 and passes through the emptying window 2140. The wire joint 2421 passes through the emptying window 2140 to supply power to the energized contact 2420. The emptying window 2140 can limit multiple wire joints 2421 within the emptying window 2140, avoiding the problem of clutter after the wire joints 2421 are wired, optimizing the structure, and ensuring electrical safety.

[0078] As Figure 1 , Figure 2 shown in the figure, further, second main sliders 160 are provided at both ends of the detection head structure 300 in the first direction. The detection head structure 300 slides on the main guide rail 131 through the second main sliders 160 on both sides; a second locking foot 161 is provided on the second main slider 160 to lock the position of the moved detection head structure 300 through the second locking foot 161. The detection head structure 300 can be stably slid on the main guide rail 131 to a predetermined position and locked through the second main slider 160 and the second locking foot 161. The specific structure is the same as that of the first main slider 143 and the first locking foot 142, and the working process refers to the above description.

[0079] As Figure 2 , Figure 7 , Figure 8As shown in the figure, further, the detection head structure 300 of this embodiment specifically includes: a hinge seat 3100, a clamping seat 3200, a support frame 3400, and at least one downward pressing detection component 3500. The hinge seat 3100 and the clamping seat 3200 are respectively arranged at intervals on both sides in the first direction (left - right direction), and at least one detection position 170 is formed between the hinge seat 3100 and the clamping seat 3200. The detection position 170 is used to place the semiconductor module 10 to be detected. For example, in this embodiment, taking the setting of 3 detection positions 170 as an example, the 3 detection positions 170 are arranged side by side at intervals in the left - right direction and can place 3 semiconductor modules 10 to be detected at the same time. Positioning blocks 171 (L - shaped) are usually correspondingly arranged on the detection position 170 to limit the placement position of the semiconductor module 10 for convenient testing. One end of the support frame 3400 is hinged to the hinge seat 3100, and the other end is detachably connected to the clamping seat 3200. The left and right ends of the support frame 3400 are respectively connected to the hinge seat 3100 and the clamping seat 3200 to support the middle part and suspend it above at least one detection position 170. The downward pressing detection component 3500 is arranged on the support frame 3400. In this embodiment, 3 corresponding downward pressing detection components 3500 can be set. Through the support of the support frame 3400, the downward pressing detection component 3500 is located above the detection position 170. Each downward pressing detection component 3500 includes a plurality of detection connectors 3531. The plurality of detection connectors 3531 correspond to the functional pins on the semiconductor module 10 to be detected and are used to connect to an external detector through wires to conduct electrical signals to the detector for functional testing, so as to detect whether the semiconductor module 10 is qualified.

[0080] The downward pressing detection component 3500 in this embodiment has an open state and a detection state through the flipping of the support frame 3400. In the open state, the support frame 3400 flips upward so that one end leaves the clamping seat 3200, thereby making the support frame 3400 leave above the detection position 170 and giving way to the space above the detection position to be detected, thus facilitating the taking and placing of the semiconductor module 10. In the detection state, the support frame flips downward so that one end is connected to the clamping seat 3200, thereby making the support frame 3400 suspend above the detection position 170. The downward pressing detection component 3500 faces the semiconductor module 10 to be detected. The downward pressing detection component 3500 suspended above the detection position 170 is used to move downward and contact the functional pins of the semiconductor module 10.

[0081] Such as Figure 7 、 Figure 8 、 Figure 9As shown, a detection head structure 300 for manual testing of a semiconductor module 10 according to this embodiment has a to-be-inspected position 170 arranged between a hinge seat 3100 and a clamping seat 3200. One end of a support frame 3400 is hinged to the hinge seat 3100, and the other end is detachably connected to the clamping seat 3200. A downward pressing detection assembly 3500 is arranged on the support frame 3400. When detection is to be performed, the support frame 3400 is clamped on the clamping seat 3200, so that the downward pressing detection assembly 3500 is located above the to-be-inspected position 170, and thus a plurality of detection connectors 3531 on the downward pressing detection assembly 3500 are opposite to the functional pins of the to-be-tested semiconductor module 10 below. By pushing the downward pressing detection assembly 3500 downward, all the detection connectors 3531 move downward and contact the functional pins of the semiconductor module 10, realizing electrical connection with the semiconductor module 10 for functional detection. Since the downward movement of the plurality of detection connectors 3531 can be completed by one downward push to complete the contact electrical connection, there is no need for manual docking of each pin one by one, greatly improving the installation efficiency and thus the detection efficiency. After the detection is completed, the downward pressing detection assembly 3500 is lifted back to its original position, and all the detection connectors 3531 move upward to disengage from the functional pins of the semiconductor module 10. Then the support frame 3400 is lifted upward, and the downward pressing detection assembly 3500 is separated from above the to-be-inspected position 170 by the flipping of the support frame 3400, and the space above the to-be-inspected position 170 is opened, so that the detected semiconductor module 10 can be conveniently taken out.

[0082] As Figure 8 、 Figure 9 shown, further, the support frame 3400 of this embodiment specifically includes: a cross beam 3410, a first support leg 3420, and a second support leg 3430. The cross beam 3410 extends along a first direction. The cross beam 3410 is a long strip arranged in the left-right direction, and multiple mounting holes, such as long strip holes, are arranged on the cross beam 3410, so as to serve as the mounting position of the downward pressing detection assembly 3500. The first support leg 3420 is fixed at one end of the cross beam 3410 and is hinged to the hinge seat 3100. The second support leg 3430 is fixed at the other end of the cross beam 3410 and can be inserted into the clamping seat 3200. The first support leg 3420 and the second support leg 3430 are integrally formed at the left and right ends of the cross beam 3410 respectively, and can extend downward perpendicular to the cross beam 3410. Both the first support leg 3420 and the second support leg 3430 can adopt a plate-like structure. A hinge rod is passed through the first support leg 3420 on the left side, and the hinge rod is also passed through the hinge seat 3100, so that the cross beam 3410 can be flipped around the hinge rod. The second support leg 3430 can be clamped or separated from the clamping seat 3200.

[0083] As Figure 8 、 Figure 9As shown in the figure, further, the clamping seat 3200 of this embodiment includes: side stoppers 3220, which are arranged on both sides of the second locking leg 161 in the second direction, and a clamping opening 3230 is formed between the two side stoppers 3220 on both sides; the second support leg 3430 is embedded in the clamping opening 3230 by flipping. In the specific structure, the second locking leg 161 can serve as the support seat on the right side to lock the position of the entire detection head structure 300. On the front and back sides of the top surface of the second locking leg 161, the second support leg 3430 located in the clamping opening 3230 is limited by the side stoppers 3220 respectively. During the flipping process of the support frame 3400, the second support leg 3430 enters and exits the clamping opening 3230 to realize the conversion between the open state and the detection state.

[0084] As Figure 8 , Figure 9 shown in the figure, further, the second support leg 3430 of this embodiment is provided with a clamping portion 3431, and the clamping seat 3200 is provided with a clamping component 3440. The clamping component 3440 is located in the clamping opening 3230 and is used to cooperate with the clamping portion 3431 to lock the second support leg 3430. In the detection state, it is necessary to clamp the second support leg 3430 in the clamping opening 3230, so that when the downward pressing detection component 3500 moves downward and contacts the functional pins of the semiconductor module 10, the connection is more stable.

[0085] As Figure 8 , Figure 9 shown in the figure, further, the clamping portion 3431 of this embodiment specifically includes an opening groove 3432, and the notch of the opening groove 3432 is opened on the side surface of the clamping portion 3431 in the first direction. The corresponding clamping component 3440 specifically includes: a clamping post 3441 and an elastic member 3443. The clamping post 3441 is movably arranged on the side stopper 3220 in the first direction. One end of the elastic member 3443 is connected to the clamping post 3441, and the other end is connected to the side stopper 3220. The clamping post 3441 is embedded in the opening groove 3432 under the elastic force of the elastic member 3443. In the specific structure, the clamping seat 3200 is located on the right side of the entire structure. The opening groove 3432 is arranged on the right outer wall of the second support leg 3430, and the clamping post 3441 is located on the right side of the second support leg 3430. The left end of the elastic member 3443 is connected to the side stopper 3220, and the right end is connected to the clamping post 3441. The elastic member 3443 pulls the clamping post 3441 from right to left, so that the clamping post 3441 can be pulled and clamped into the opening groove 3432 to achieve locking. When an external force pulls the clamping post 3441 from left to right, the clamping post 3441 can be separated from the opening groove 3432 to achieve unlocking. In this way, the locking and unlocking processes are both very convenient, improving the detection efficiency.

[0086] As Figure 8 , Figure 9As shown in the figure, further, locking waist-shaped holes 3221 are formed in the side stoppers 3220 on both sides of this embodiment, and the locking waist-shaped holes 3221 extend along the first direction. The clamping posts 3441 are inserted into the locking waist-shaped holes 3221 of the side stoppers 3220 on both sides, and both ends of the clamping posts 3441 protrude from the surfaces of the side stoppers 3220 to form protruding ends; elastic members 3443 are respectively connected to the protruding ends at both ends, and the elastic members 3443 on both sides are respectively connected to the mounting posts 3222 of the side stoppers 3220 on both sides. In a specific structure, mounting posts 3222 are provided on the outer sides of the front and rear side stoppers 3220, elastic members 3443 are provided on the front and rear mounting posts 3222, and the elastic members 3443 on the front and rear sides are respectively connected to the front and rear ends of the clamping posts 3441. Thus, elasticity can be applied to both ends of the clamping posts 3441, enabling the clamping posts 3441 to move left and right along the locking waist-shaped holes 3221, with more uniform force application. When the clamping posts 3441 are inserted into the opening grooves 3432, they are not easily disengaged, and the locking stability is stronger.

[0087] As Figure 8 , Figure 9 shown in the figure, further, a handle portion 3442 is provided on the side of the clamping post 3441 away from the opening groove 3432, and the handle portion 3442 is located within the bayonet 3230 to drive the movement of the handle portion 3442. Through the handle portion 3442, the operator can conveniently pull the clamping post 3441 by hand, making the unlocking process of the support frame 3400 more convenient.

[0088] As Figure 8 , Figure 10 shown in the figure, further, the downward pressure detection component 3500 of this embodiment specifically includes: a detection support base 3510, a push-pull presser 3520, and a pressing plate 3530. The detection support base 3510 is arranged on the support frame 3400, the push-pull presser 3520 is arranged on the detection support base 3510, the pressing plate 3530 is connected to the push-pull presser 3520 and moves in the up and down direction under the drive of the push-pull presser 3520, and a plurality of detection connectors 3531 are arranged on the pressing plate 3530 and contact the functional pins of the semiconductor module 10 through the movement of the pressing plate 3530. The push-pull presser 3520 is fixed by the detection support base 3510, enabling the pressing plate 3530 to be suspended above the semiconductor module 10. The push-pull presser 3520 can adopt a WDC301 push-pull pressing type quick clamp, and the push-pull presser 3520 can drive the pressing plate 3530 to move up and down.

[0089] As Figure 8 , Figure 9As shown in the figure, further, the detection support base 3510 of this embodiment specifically includes: a support vertical plate 3511 and a support horizontal plate 3512. The support vertical plate 3511 is arranged on the support frame 3400, and the push-pull presser 3520 is connected to the support vertical plate 3511; the support horizontal plate 3512 is perpendicularly connected to the support vertical plate 3511, and a through hole is provided on the support horizontal plate 3512. The push rod of the push-pull presser 3520 passes through the through hole and is connected to a pressing plate 3530 below the support horizontal plate 3512. A positioning convex block 3513 is provided on the back surface of the support vertical plate 3511. The positioning convex block 3513 and the lower region of the back surface of the support vertical plate 3511 form an installation step. During the process of fixing the support vertical plate 3511 on the support frame 3400, the positioning convex block 3513 is abutted against the upper surface of the cross beam 3410, and the installation step is attached to the front surface of the cross beam 3410 to realize the position positioning of the detection support base 3510, and then it is fixed by screws, so that the installation accuracy of the detection support base 3510 is high and it is convenient for disassembly and assembly.

[0090] As Figure 8 , Figure 9 shown in the figure, further, a guiding slide bar 3540 is provided on the pressing plate 3530 of this embodiment, and a guiding slide sleeve 3541 is provided on the support horizontal plate 3512. The guiding slide bar 3540 is movably inserted into the guiding slide sleeve 3541 in the up and down direction. During the process of the push-pull presser 3520 pushing and pressing the pressing plate 3530 up and down, the up and down movement process of the pressing plate 3530 is made more stable through the directional sliding of the guiding slide bar 3540 in the guiding slide sleeve 3541.

[0091] Embodiment Two

[0092] This embodiment proposes a manual testing method for a semiconductor module, which is applied to the manual testing tool as described above. Among them, the manual testing method includes the steps:

[0093] S100. Place the semiconductor module to be detected on the cooling plate and perform positioning;

[0094] S200. Push the first moving seat to match the position of the first energized contact structure with the electrode pin at one end of the semiconductor module, and lock the position of the first moving seat;

[0095] S300. Push the second moving seat to match the position of the second energized contact structure with the electrode pin at the other end of the semiconductor module, and lock the position of the second moving seat;

[0096] S400. Push the detection head structure to match the position of the detection head structure with the functional pin on the semiconductor module, and lock the position of the pushed detection head structure;

[0097] Press the first energized contact structure, the second energized contact structure, and the detection head structure manually, so that the first energized contact structure and the second energized contact structure are connected to the electrode pins to supply power to the semiconductor module, and the detection head structure is connected to the function pins to detect the semiconductor module.

[0098] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A manual test tool for a semiconductor module, characterized in that, Comprising: Two guiding parts respectively arranged at intervals on both sides in the first direction, each of the guiding parts extending along the second direction; A first moving seat and a second moving seat respectively arranged at intervals on both sides in the second direction, both ends of the first moving seat being slidably arranged on the guiding parts on both sides respectively, both ends of the second moving seat being slidably arranged on the guiding parts on both sides respectively, at least one first energized contact structure being arranged on the first moving seat, and at least one second energized contact structure being arranged on the second moving seat; A detection head structure, the detection head structure being located between the first moving seat and the second moving seat, and both ends of the detection head structure being slidably arranged on the guiding parts on both sides respectively, the detection head structure including at least one downward pressure detection component; The first energized contact structure and the second energized contact structure are matched with the positions of the electrode pins of the semiconductor module to be detected by sliding along the guiding parts, and the downward pressure detection component is matched with the positions of the function pins of the semiconductor module to be detected by sliding along the guiding parts.

2. The manual testing tool for the semiconductor module according to claim 1, characterized in that, The guiding part includes: a main guide rail, the main guide rail extending along the second direction; The first moving seat includes: a main bearing beam, the main bearing beam extending along the first direction; First locking feet, the first locking feet being arranged at both ends of the main bearing beam in the first direction; A first main sliding table, the first main sliding table being arranged on the first locking feet and being matched with the main guide rail; The main bearing beam slides on the main guide rail through the first main sliding tables on both sides to lock the position of the main bearing beam through the first locking feet.

3. The manual testing tool for the semiconductor module according to claim 2, wherein, The manual testing tool further includes a bottom plate, a cooling plate being arranged on the bottom plate, the cooling plate being used for carrying the semiconductor module to be detected; Two rows of threaded holes are opened on the bottom plate, the two rows of threaded holes being respectively located outside the main guide rails on both sides; The first locking feet protrude from the side surface of the main bearing beam in the first direction and are provided with locking holes; Locking screws are used to penetrate through the locking holes, and the first locking feet lock the position of the main bearing beam by connecting the threaded holes through the locking screws.

4. The manual testing tool for the semiconductor module according to claim 2, characterized in that, An adjustment groove is arranged on the main bearing beam, the adjustment groove extending along the first direction; The first energized contact structure includes: an adjustable bracket, a docking boss being arranged at the bottom of the adjustable bracket, the adjustable bracket being embedded in the adjustment groove through the docking boss and being adjustable in position in both the first direction and the second direction.

5. The manual test tool for the semiconductor module according to claim 4, characterized in that, The first energized contact structure further includes: a push-pull clamp, the push-pull clamp being arranged on the adjustable bracket; A movable frame, the movable frame being connected to the push-pull clamp and moving up and down by the drive of the push-pull clamp; Two electrode assemblies, both of the two electrode assemblies including an electrode bearing table and an energized contact; An adjustment kidney-shaped hole extending along the first direction is opened on the electrode bearing table, and the electrode bearing table is connected to the movable frame by passing through screws.

6. The manual testing tool for the semiconductor module according to claim 5, characterized in that, The electrode bearing table includes: a bearing connecting plate, the adjustment kidney-shaped hole being arranged on the bearing connecting plate so that the bearing connecting plate is adjustable and arranged on the movable frame, There are two of the adjustment kidney-shaped holes on the load-bearing connecting plate, and the two adjustment kidney-shaped holes are arranged at intervals in the up and down direction.

7. The manual test tool for the semiconductor module according to claim 5, wherein, The adjustable bracket includes: a first adjustment seat, and a first kidney-shaped hole extending in a first direction is provided on the first adjustment seat; A second adjustment seat, the second adjustment seat includes a base horizontal plate and a base vertical plate, a second kidney-shaped hole extending in a second direction is provided on the base horizontal plate, and the second adjustment seat is connected to the first adjustment seat by screws passing through the second kidney-shaped hole; The base vertical plate is arranged in the up and down direction, and the push-pull clamp is located at the top of the base vertical plate.

8. The manual testing tool for the semiconductor module according to claim 2, characterized in that, Second main sliding platforms are arranged at both ends of the detection head structure in the first direction, and the detection head structure slides on the main guide rail through the second main sliding platforms on both sides; Second locking feet are arranged on the second main sliding platforms, and the position of the detection head structure after moving is locked by the second locking feet.

9. The manual testing tool for a semiconductor module according to claim 8, characterized in that, The detection head structure includes: a hinge seat and a clamping seat, the hinge seat and the clamping seat are respectively arranged at intervals on both sides in the first direction, and at least one position to be detected is formed between the hinge seat and the clamping seat, and the position to be detected is used for placing a semiconductor module to be detected; A support frame, one end of the support frame is hinged to the hinge seat, and the other end is detachably connected to the clamping seat, and the support frame is used for; At least one downward pressing detection component, and the downward pressing detection component is arranged on the support frame; The downward pressing detection component leaves above the position to be detected or is suspended above the position to be detected through the flipping of the support frame; The downward pressing detection component suspended above the position to be detected is used to move downward and contact the functional pins of the semiconductor module.

10. A manual testing method for a semiconductor module, applied to the manual testing tool as described in any one of claims 1-9, characterized in that, The manual testing method includes the steps: Place the semiconductor module to be detected on the cooling plate and perform positioning; Push the first moving seat to match the position of the first power-on contact structure with the electrode pins at one end of the semiconductor module, and lock the position of the first moving seat; Push the second moving seat to match the position of the second power-on contact structure with the electrode pins at the other end of the semiconductor module, and lock the position of the second moving seat; Push the detection head structure to match the position of the detection head structure with the functional pins on the semiconductor module, and lock the position of the pushed detection head structure; Manually press the first power-on contact structure, the second power-on contact structure and the detection head structure, so that the first power-on contact structure and the second power-on contact structure are connected to the electrode pins to supply power to the semiconductor module, and the detection head structure is connected to the functional pins to detect the semiconductor module.

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