Work order resource quantity evaluation method and device, computer equipment and readable storage medium

Abstract

The invention relates to a work order resource quantity evaluation method and device, computer equipment, a computer readable storage medium and a computer program product. The method comprises the steps of performing parameter extraction on a design file of a PCB to obtain process resource data and production plan data; mapping the process resource data according to a process resource mapping rule adapted to the process resource type to which the process resource data belongs to obtain a process resource metric value; determining a production plan mapping rule according to the process resource type and the production plan data, and obtaining a production plan adjustment coefficient according to the production plan mapping rule; and adjusting the process resource metric value according to the production plan adjustment coefficient to obtain a work order resource quantity. By adopting the method, the efficiency and precision of work order resource quantity evaluation can be considered.

Description

Technical Field

[0001] This application relates to the field of industrial production technologies, and particularly to a method, device, computer equipment, computer-readable storage medium, and computer program product for evaluating the quantity of work order resources. Background Art

[0002] The cycle of electronic product design and manufacturing is relatively long. Especially during hardware prototype design and small-batch production, how to quickly obtain quotes and ensure production efficiency becomes a major challenge. On the one hand, engineers, startups, and small and medium-sized enterprises often need to quickly iterate hardware designs, and traditional manufacturers usually cannot provide fast and customized quotes and production services. On the other hand, with the accelerating innovation speed of electronic products, the demand side hopes to conduct small-batch production at a lower cost in order to enter the market for testing and verification as early as possible, so it is necessary to pre-evaluate the work order resources. Summary of the Invention

[0003] Based on this, it is necessary to provide a method, device, computer equipment, computer-readable storage medium, and computer program product for evaluating the quantity of work order resources that can improve accuracy on the premise of ensuring efficiency for the above technical problems.

[0004] In a first aspect, this application provides a method for evaluating the quantity of work order resources, and the method includes:

[0005] Extract parameters from the design file of the PCB board to obtain process resource data and production plan data;

[0006] Map the process resource data according to the process resource mapping rules adapted to the type of process resources to which the process resource data belongs to obtain process resource measurement values;

[0007] Determine a production plan mapping rule based on the type of process resources and the production plan data, and obtain a production plan adjustment coefficient according to the production plan mapping rule;

[0008] Adjust the process resource measurement value according to the production plan adjustment coefficient to obtain the quantity of work order resources.

[0009] In one of the embodiments, the type of process resources includes production process types, and the process resource data includes material resource data, surface process types, and board-level structure characteristics under the production process types; the process resource measurement values include material resource measurement values, surface process resource measurement values, and production process resource measurement values;

[0010] The mapping of the process resource data according to the process resource mapping rules adapted to the type of process resources to which the process resource data belongs to obtain process resource measurement values includes:

[0011] Map according to the material resource data of the supplier to obtain the material resource measurement value;

[0012] Map according to the type of surface process to obtain the surface process resource measurement value;

[0013] Determine the production process resource measurement value according to the board-level structure characteristics under the type of production process.

[0014] In one embodiment, the board-level structure characteristics include the required thickness and number of layers of the PCB board; the determining the production process resource measurement value according to the board-level structure characteristics under the type of production process includes:

[0015] Map according to the thickness and the thickness weight corresponding to the thickness to obtain the thickness resource measurement value positively correlated with the thickness;

[0016] Map according to the number of layers and the layer weight corresponding to the number of layers to obtain the layer resource measurement value positively correlated with the number of layers; the layer weight is greater than the thickness weight;

[0017] Combine the thickness resource measurement value and the layer resource measurement value to obtain the production process resource measurement value;

[0018] Wherein, when the number of layers is in the first layer number interval, the layer weight and the number of layers show a first positive correlation change trend; when the number of layers is in the second layer number interval, the layer weight and the number of layers show a second positive correlation change trend; the number in the first layer number interval is less than the number in the second layer number interval; the change speed of the first positive correlation change trend is less than the change speed of the second positive correlation change trend.

[0019] In one embodiment, the production plan data includes the required quantity of PCB boards, the production plan adjustment coefficient includes the demand quantity adjustment coefficient, and the demand quantity adjustment coefficient is used to lower the process resource measurement value; the production plan mapping rule includes the production quantity mapping rule and the production efficiency mapping rule;

[0020] The determining the production plan mapping rule according to the process resource type and the production plan data, and obtaining the production plan adjustment coefficient according to the production plan mapping rule includes:

[0021] When the required quantity of PCB boards is in the first quantity interval, determine the production quantity mapping rule according to the process resource type, and determine the demand quantity adjustment coefficient negatively correlated with the required quantity of PCB boards according to the production quantity mapping rule;

[0022] When the required quantity of the PCB boards is in the second quantity range, determine the production efficiency mapping rule according to the types of process resources and the integration efficiency of the supply chain, and determine the demand quantity adjustment coefficient negatively correlated with the required quantity of the PCB boards according to the production efficiency mapping rule;

[0023] Wherein, the quantity in the first quantity range is less than the quantity in the second quantity range.

[0024] In one embodiment, the production plan data includes the production demand time of the PCB boards, and the production plan mapping rule includes the production time mapping rule;

[0025] The step of determining the production plan mapping rule according to the types of process resources and the production plan data, and obtaining the production plan adjustment coefficient according to the production plan mapping rule includes:

[0026] When the demand time of the PCB boards is in the first time range, the production plan adjustment coefficient does not contain the supply time adjustment coefficient, and the supply time adjustment coefficient is used to increase the process resource measurement value;

[0027] When the demand time of the PCB boards is in the second time range, map according to the production time mapping rule negatively correlated with the production demand time of the PCB boards under the types of process resources, and obtain the supply time adjustment coefficient in the production plan adjustment coefficient according to the production time mapping rule; the time in the first time range is shorter than the time in the second time range.

[0028] In one embodiment, the method further includes:

[0029] Display the adjustment result of the process resource measurement value included in the work order resource quantity, as well as the process resource measurement value and the production plan adjustment coefficient used to obtain the adjustment result; and / or,

[0030] Generate an optimization suggestion for the process resource data according to the work order resource quantity, and the optimization suggestion is used to indicate the materials to be replaced or the surface process of the process resource data.

[0031] In a second aspect, the present application further provides a work order resource quantity evaluation device, including:

[0032] An extraction module, configured to extract parameters from the design file of the PCB boards to obtain process resource data and production plan data;

[0033] A process module, configured to map the process resource data according to the process resource mapping rule adapted to the types of process resources to which the process resource data belongs, to obtain a process resource measurement value;

[0034] A planning module, configured to determine a production plan mapping rule according to the type of process resources and the production plan data, and obtain a production plan adjustment coefficient according to the production plan mapping rule;

[0035] An integration module, configured to adjust the process resource measurement value according to the production plan adjustment coefficient to obtain the work order resource quantity.

[0036] In a third aspect, the present application further provides a computer device. The computer device includes a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of evaluating the work order resource quantity in any of the above embodiments are implemented.

[0037] In a fourth aspect, the present application further provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of evaluating the work order resource quantity in any of the above embodiments are implemented.

[0038] In a fifth aspect, the present application further provides a computer program product. The computer program product includes a computer program, and when the computer program is executed by a processor, the steps of evaluating the work order resource quantity in any of the above embodiments are implemented.

[0039] For the above work order resource quantity evaluation method, device, computer device, computer-readable storage medium and computer program product, parameter extraction is performed on the design file of the PCB board to obtain process resource data and production plan data, thereby bypassing events such as image rendering of the design file, directly performing data extraction on the parameters, efficiently dividing the process resource data in the production process, and the production plan data for overall planning of the production results, thereby forming two dimensions for work order resource analysis. For the dimension in the production process, first map the process resource data according to the process resource mapping rule adapted to the type of process resources to which the process resource data belongs to obtain a process resource measurement value, and use the process resource measurement value to represent the resources required in the production process; for the dimension before the production process, form two dimensions of the mapping process according to the type of process resources and the production plan data to more accurately determine the production plan mapping rule, and obtain a production plan adjustment coefficient according to the production plan mapping rule, so as to more precisely reflect the resource supply situation required for resource integration through the production plan adjustment coefficient; furthermore, adjust the process resource measurement value according to the production plan adjustment coefficient to obtain an adjusted measurement value, thereby comprehensively integrating the resource measurement values before and during the production process, so as to more accurately obtain the adjusted measurement value; finally, perform overall planning according to the adjusted measurement value to obtain the work order resource quantity, and use the work order resource quantity to reflect the resources required for PCB board production. Description of the Drawings

[0040] To more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the following will briefly introduce the accompanying drawings required for the description of the embodiments of the present application or the related art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0041] Figure 1 It is an application environment diagram of the work order resource quantity evaluation method in an embodiment;

[0042] Figure 2 It is a schematic flowchart of the work order resource quantity evaluation method in an embodiment;

[0043] Figure 3 It is a schematic flowchart of obtaining the process resource measurement value in an embodiment;

[0044] Figure 4 It is a structural block diagram of the work order resource quantity evaluation device in an embodiment;

[0045] Figure 5 It is an internal structure diagram of a computer device in an embodiment. Detailed implementation manners

[0046] In order to make the purpose, technical solutions and advantages of the present application clearer, the following further details the present application in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0047] The work order resource quantity evaluation method provided by the embodiments of the present application can be applied to, for example Figure 1 the application environment shown. Among them, the terminal 102 communicates with the server 104 through the network. The data storage system can store the data that the server 104 needs to process. The data storage system can be integrated on the server 104, or placed in the cloud or other network servers.

[0048] Among them, the terminal 102 can be, but is not limited to, various personal computers, laptop computers, smart phones, tablet computers and Internet of Things devices. The Internet of Things devices can be smart vehicle-mounted devices, projection devices, etc. The server 104 can be an independent physical server, or a server cluster or distributed system composed of multiple physical servers, or a cloud server providing cloud computing services.

[0049] In an exemplary embodiment, as Figure 2 shown, a work order resource quantity evaluation method is provided. This method is applied to Figure 1Taking the terminal 102 in it as an example, the following steps 202 to 208 are included. Among them:

[0050] Step 202, extract parameters from the design file of the PCB board to obtain process resource data and production plan data.

[0051] The PCB board (Printed Circuit Board) is the board required for electronic devices and is used to carry electronic components. When the PCB board is a board without electronic component patches such as resistors and integrated circuits, the types of process resources and the amount of production plan data are relatively small. Even for customized special-shaped PCB boards, the amount of work order resources can be efficiently determined by setting corresponding mapping rules.

[0052] The design file is an image resource that can render the PCB board and can be applied to the production of the PCB board. The design file includes discrete data such as the raw materials of the PCB board, the structural information of the PCB board, the processes required for PCB board processing, the required quantity of the PCB board, and the required time of the PCB board. Optionally, in the case of modifying the design file of the PCB board or the parameters contained in the design file, return to the step of extracting parameters from the design file of the PCB board to avoid data anomalies.

[0053] Since the design file is the file content provided from the perspective of PCB board design, the data contained in the design file is relatively discrete, and data such as the required quantity of the PCB board and the required time of the PCB board as adjustment coefficients of measurement values help to ensure accuracy. Therefore, the design file in this embodiment is divided into process resource data and production plan data, and the functions of these two types are different.

[0054] The process resource data is the data in the production process and is used to represent the amount of resources required for processing each PCB board. The process resource data is directly related to the amount of resources required in the production process. The process resource data includes data such as the raw materials of the PCB board and the processes required for PCB board processing.

[0055] The production plan data is the data representing the production result and is used to plan the production result of the PCB board. The production plan data is related to the production result. The production plan data includes discrete data such as the required quantity of the PCB board and the required time of the PCB board.

[0056] The parameter extraction software can be used to extract the parameters of the PCB board design file to obtain the parameter data of the design file. According to the corresponding relationship between the types of the parameter data of the design file and the process resource data, the process resource data in the parameter data is determined. According to the corresponding relationship between the types of the parameter data of the design file and the production plan data, the production plan data in the parameter data is determined. Thus, through the pre-set corresponding relationship of types, parameter induction is carried out to more accurately obtain the data under different dimensions, forming two-dimensional data processing methods.

[0057] Step 204: Map the process resource data according to the process resource mapping rule adapted to the type of the process resource data to obtain the process resource measurement value.

[0058] The process resource type is the process category and resource category of the PCB board during the production process. Since there are a large number of types of process resource data, setting the process resource mapping rule through the process resource type helps to ensure the processing efficiency. The process resource type mainly includes two dimensions: production process resources and material resources. The data of production process resources include the board-level structure characteristics under the surface process type and the production process type. The board-level structure characteristics under the surface process type can be set for the surface process of the PCB board, and the board-level structure characteristics under the production process type can be set for the structural process of the PCB board.

[0059] The process resource mapping rule is a mapping method corresponding to the process resource type. The process resource mapping rule can be in the form of a mapping table, a function form, or an image form. Since the process resource type is obtained by classifying the content of the PCB board design file, it belongs to the data decoupled from the design file, has high flexibility, and the process resource mapping rule is also outside the design file. Therefore, the processing method can be adaptively adjusted according to the requirements of the process resource type to more accurately obtain the corresponding process resource measurement value.

[0060] The process resource measurement value is an index that quantifies the usage amount of different process resources. The introduction of the measurement value helps to show the usage situation of the process resources from the perspective of the production process, so as to conduct an overall analysis of the resources used by different processes and materials, facilitating the formation of the scheduling analysis result in this dimension. The process resource measurement value can be, but is not limited to, the amount of equipment required in the production process, the energy consumption, the capital cost, or the quotation.

[0061] Exemplarily, when there are multiple sub - rules in the process resource mapping rule adapted to the type of process resource to which the process resource data belongs, mapping can be performed according to the sub - rule matched by the process resource data to more accurately obtain the process resource measurement value. When the process resource mapping rule adapted to the type of process resource to which the process resource data belongs is a mapping table, the process resource data can be mapped according to each mapping table to obtain the mapping result of the process resource data; and the process resource measurement value can be obtained based on the mapping result of the process resource data.

[0062] Step 206: Determine the production plan mapping rule according to the process resource type and the production plan data, and obtain the production plan adjustment coefficient according to the production plan mapping rule.

[0063] The production plan mapping rule is a mapping rule that has a corresponding relationship with two types of data, namely the process resource type and the production plan data. In the production field of PCB boards, since the process resource type can to a certain extent reflect the usage of the corresponding process, and the data volume and uncertainty of the process resource type are much smaller than those of the process resource data, the process resource type is the basis of the production plan data. On this basis, since the production plan data directly reflects the production result, the data volume and uncertainty involved are relatively small, and the adjustment of the production plan data may affect the usage and configuration of process resources. Therefore, the production plan mapping rule is determined from the two perspectives of the process resource type and the production plan data to more accurately analyze the production plan adjustment coefficient in the PCB board production process from the perspective of the production result.

[0064] The production plan mapping rule can be in the form of a mapping table, a function form, or an image form. Since the process resource type is obtained by classifying the content of the PCB board design file and belongs to the data decoupled from the design file, it has high flexibility, and the production plan mapping rule is also outside the design file. Therefore, a new control dimension can be formed according to the requirements of the process resource type to conduct overall analysis from the perspective of the production result, clarify the difference between the process resource measurement value and the actual production, and this difference is adjusted by the production plan adjustment coefficient.

[0065] The production plan adjustment coefficient is an index that quantifies the quantity of PCB boards under different process resources. The introduction of the production plan adjustment coefficient helps to show the degree of change of process resources under large - scale production from the perspectives of batch size and delivery time, so as to conduct an overall analysis of the resources of batch size and delivery time, facilitating the formation of the scheduling analysis result in this dimension. The production plan adjustment coefficient can be a specific value or a percentage value. The dimension where the production plan adjustment coefficient is located can be, but is not limited to, the quantity of equipment required in the production process, energy consumption, capital cost, or quotation. For example, the production plan adjustment coefficient can be 10 pieces of equipment, or adjust 10% of the equipment.

[0066] In the case where there are multiple types of production plan adjustment coefficients, one type of production plan adjustment coefficient can be used to increase the process resource measurement value, and another type of production plan adjustment coefficient can be used to decrease the process resource measurement value to form multi-dimensional adjustments.

[0067] Step 208: Adjust the process resource measurement value according to the production plan adjustment coefficient to obtain the work order resource quantity.

[0068] The work order resource quantity is the resource quantity required in the PCB board production process. The work order resource quantity at least includes the adjustment result of the process resource measurement value, or the cumulative value of the adjustment results of the process resource measurement values. The work order resource quantity can also include the production plan adjustment coefficient, the process resource measurement value, and the process resource measurement value to accurately represent the production resources. Exemplarily, the work order resource quantity can be an industrial quotation sheet or an industrial production resource sheet.

[0069] In one embodiment, adjusting the process resource measurement value according to the production plan adjustment coefficient to obtain the work order resource quantity includes: in the case where there are multiple process resource measurement values, based on each process resource type and production plan data, determining the production plan mapping rule corresponding to each process resource type, and according to the production plan mapping rule corresponding to each process resource type, obtaining the production plan adjustment coefficient corresponding to each process resource type; then adjusting the process resource measurement value through the production plan adjustment coefficient corresponding to each process resource type to obtain the work order resource quantity.

[0070] In another embodiment, adjusting the process resource measurement value according to the production plan adjustment coefficient to obtain the work order resource quantity includes: in the case where there are multiple process resource measurement values, based on a preset process resource type and production plan data, determining the overall production plan mapping rule, and according to the production plan mapping rule corresponding to the overall production plan mapping rule, obtaining the overall production plan adjustment coefficient; then adjusting the process resource measurement value through the production plan adjustment coefficient corresponding to the overall production plan adjustment coefficient to obtain the work order resource quantity.

[0071] Exemplarily, the process resource metrics include data such as material cost, processing resources, surface treatment resources, transportation resources, rush resources, etc.; among them, the material cost is the material resource value calculated based on the materials selected by the user (such as FR4, aluminum substrate) and the real-time market price. The processing resources are the engineering or value calculated based on the production complexity (such as the number of layers, aperture, process requirements); the surface treatment resources are the resource values calculated according to the selected surface treatment process (such as HASL, ENIG, gold plating, etc.). The transportation resources are the logistics resource values calculated according to the production location and the delivery location. If it is an international order, resources such as tariffs and international transportation costs also need to be considered. The rush resources are that if the user requests rush delivery, the system will automatically charge a rush fee. For processing resources such as processing resources, they can be adjusted through the production plan adjustment coefficient to obtain the work order resource quantity.

[0072] In the above work order resource quantity evaluation method, parameter extraction is performed on the design file of the PCB board to obtain process resource data and production plan data, so as to bypass events such as image rendering of the design file, directly perform data extraction for parameters, efficiently divide the process resource data in the production process, and the production plan data used for overall planning of the production results, thereby forming two dimensions of work order resource analysis. For the dimension during the production process, first, according to the process resource mapping rules adapted to the type of process resource to which the process resource data belongs, the process resource data is mapped to obtain the process resource metrics, and the process resource metrics are used to represent the resources required for the production process; for the dimension before the production process, according to the type of process resource and the production plan data, two dimensions of the mapping process are formed to more accurately determine the production plan mapping rules, and according to the production plan mapping rules, the production plan adjustment coefficient is obtained, so as to more precisely reflect the resource supply situation required for resource integration through the production plan adjustment coefficient; furthermore, according to the production plan adjustment coefficient, the process resource metrics are adjusted to obtain the adjusted metrics, so as to comprehensively consider the resource metrics before and during the production process, and thus more accurately obtain the adjusted metrics; finally, overall planning is performed according to the adjusted metrics to obtain the work order resource quantity, and the work order resource quantity is used to reflect the resources required for PCB board production.

[0073] In some embodiments, the type of process resource includes the type of production process, and the process resource data includes material resource data, the type of surface process, and the board-level structure characteristics under the type of production process; the process resource metrics include material resource metrics, surface process resource metrics, and production process resource metrics.

[0074] The material resource data is the material required for the production process, and the material resource data includes at least the material category of the PCB board. For example, the material category of the PCB board can be, but is not limited to, categories such as FR4, aluminum substrate, copper substrate, etc.

[0075] The types of surface processes are the types of processing on the surface of the PCB board, which are related to the solderability, durability, and electrical conductivity of the PCB board surface. The types of surface processes include, but are not limited to, HASL, ENIG, gold plating, etc.

[0076] The types of production processes are the types of processing for the complex internal structure of the PCB board, which are related to the basic structure design of the PCB board and can reflect the circuit complexity. The board-level structure features are the structural features on the PCB board, which are used to provide the analysis dimension under the corresponding process types; the board-level structure features of the production process types include, but are not limited to, information such as the number of layers, thickness, hole diameter, area greater than the preset value, and hole specifications.

[0077] The material resource measurement value is the measurement value obtained by mapping from the perspective of material resources, and the material resource measurement value is related to the production materials of the PCB board. The surface process resource measurement value is the measurement value obtained by mapping from the types of surface processes, and the surface process resource measurement value is related to the surface processes adopted by the PCB board, which is used to reflect the amount of resources required for the surface processing of the PCB board; the production process resource measurement value is the measurement value obtained by mapping from the types of production processes, and the production process resource measurement value is related to the production processes adopted by the PCB board, which is used to reflect the amount of resources required for the production and processing of the PCB board.

[0078] As Figure 3 shown, according to the process resource mapping rules adapted to the types of process resources to which the process resource data belong, the process resource data is mapped to obtain the process resource measurement value, including:

[0079] Step 302, map according to the material resource data of the supplier to obtain the material resource measurement value.

[0080] The material resource data of the supplier is the real-time data provided by the supplier. Since there are relatively many types of suppliers, mapping according to the material resource data of the supplier can convert the dimension of the material resource data into the dimension of the measurement value for comprehensive consideration.

[0081] The candidate material resource data provided by each supplier can be searched and compared according to the material resource data in the design document to obtain the material resource data of the supplier that matches the design document. The real-time material resource data provided by the supplier can be obtained in real time, and the material resource measurement value can be determined according to the real-time material resource data provided by the supplier.

[0082] Exemplarily, based on the selection results of material resource data such as FR4, aluminum substrate, copper substrate, etc. selected by the user, and the real-time prices provided by suppliers, the cost of raw materials can be calculated. Different materials such as FR4, aluminum substrate, copper substrate, etc. have different resource measurement values. Appropriate material types can be selected according to the actual situation and incorporated into the quotation calculation. Since the material resource measurement values usually change dynamically according to market fluctuations, the system can obtain the real-time quotation information of suppliers to make the material resource measurement values more accurate.

[0083] Step 304: Map according to the types of surface processes to obtain surface process resource measurement values.

[0084] Based on the types of surface processes in the design document, the surface process resource measurement values can be directly found in the mapping table. Or first calculate the similarity between the types of surface processes contained in the design document and the candidate types of surface processes corresponding to the types of surface processes to obtain the candidate type of surface process with the greatest similarity; then map according to the candidate type of surface process with the greatest similarity to obtain the surface process resource measurement values; thus, through the calculation of similarity, the types of surface processes in the design document are adaptively adjusted, enhancing the adaptability of the types of surface processes and obtaining the surface process resource measurement values more accurately; and then through another round of mapping, the accuracy of the surface process resource measurement values is ensured.

[0085] Exemplarily, HASL (Hot Air Solder Leveling) is a relatively common process, and the surface process resource measurement value corresponding to HASL is relatively low. Correspondingly, the surface process resource measurement values corresponding to ENIG (Electroless Nickel Immersion Gold) and OSP (Organic Solderability Preservatives) are relatively high, and the surface process resource measurement values can be automatically adjusted based on the process selected by the user.

[0086] Step 306: Determine the production process resource measurement values according to the board-level structure characteristics under the types of production processes.

[0087] Based on the board-level structure characteristics under the types of production processes, mapping can be performed to obtain the weights corresponding to the board-level structure characteristics; then, through weighting the board-level structure characteristics and the weights corresponding to the board-level structure characteristics, the production process resource measurement values are obtained.

[0088] Exemplarily, the board-level structure features are related to complexity. That is to say, on the one hand, when the board-level structure features of the design document include structures such as multi-layer boards, large-area boards, blind vias, and micro-vias, the system will set a sub-item measurement value that is positively correlated with the threshold according to the complexity of the design document, and obtain the production process resource measurement value based on this sub-item measurement value. For example, the production difficulty of 4-layer and 6-layer PCB boards is greater than that of 2-layer boards, and the system will automatically adjust the production cost according to the number of layers. On the other hand, if the design document requires special processes, such as high-frequency PCBs, high-temperature resistant materials, etc., the system will add additional sub-item measurement values according to the process requirements to obtain the production process resource measurement value.

[0089] In this embodiment, mapping is performed according to the material resource data of the supplier, so that the material resource data is adjusted according to the supplier adaptability, and thus the supplier with the lowest material resource measurement value is selected; at the same time, the process types are decoupled into surface process types and production process types, and these two process types are evaluated separately. Since the surface process type does not involve structural information, the calculation process of the board-level structure features can be omitted to efficiently determine the surface process resource measurement value; while the processing resources involved in the production process type are more complex, and can be further refined through the board-level structure features to map out the production process resource measurement value. Thus, through the three measurement values contained in the process resource measurement value, accurate analysis is carried out from the perspective of the production process, so that the production process resource measurement value can better fit the resources required for actual production, thereby ensuring relatively high production scheduling efficiency.

[0090] In some embodiments, the board-level structure features include the required thickness and number of layers of the PCB board; determining the production process resource measurement value according to the board-level structure features under the production process type includes: mapping according to the thickness and the thickness weight corresponding to the thickness to obtain a thickness resource measurement value that is positively correlated with the thickness; mapping according to the number of layers and the layer weight corresponding to the number of layers to obtain a layer resource measurement value that is positively correlated with the number of layers; the layer weight is greater than the thickness weight; combining the thickness resource measurement value and the layer resource measurement value to obtain the production process resource measurement value;

[0091] Wherein, when the number of layers is in the first layer number interval, the layer weight and the number of layers show a first positive correlation change trend; when the number of layers is in the second layer number interval, the positive correlation change trend between the layer weight and the number of layers shows a second change trend; the number in the first layer number interval is less than the number in the second layer number interval; the change speed of the first positive correlation change trend is less than the change speed of the second positive correlation change trend.

[0092] The thickness is the total thickness of the PCB board material itself and the superposition of the materials of each internal layer. The thickness can be used to obtain a thickness weight, which is a weight for converting the thickness into a metric value. The greater the thickness, the greater the thickness weight corresponding to the thickness, the greater the corresponding thickness resource metric value, and the more production resources required for the thickness; correspondingly, the smaller the thickness, the smaller the thickness weight corresponding to the thickness, the smaller the corresponding thickness resource metric value, and the fewer production resources required for the thickness. Thus, the thickness weight is dynamically variable to ensure accuracy.

[0093] The number of layers refers to the number of conductive layers in the circuit board, and the number of layers is related to the wiring density, performance, and functional complexity of the PCB board. The number of layers reflects the functional complexity of the PCB. The more layers, the more circuit functions can be integrated. Since multi-layer boards require multiple processes such as pressing, drilling, and electroplating, for each additional layer, the number of internal signal and power layers in the PCB also increases. When designing, factors such as signal integrity, crosstalk, and ground plane need to be considered, which greatly increases the design complexity and requires more engineering time and effort. Moreover, more stringent quality control is required. These additional process steps and quality control requirements significantly increase the metric value of the resources for the number of layers in manufacturing.

[0094] The number of layers can be used to obtain a layer weight, which is a weight for converting the number of layers into a metric value. Exemplarily, the greater the number of layers, the greater the layer weight corresponding to the number of layers, and the greater the corresponding layer resource metric value; correspondingly, the smaller the number of layers, the smaller the layer weight corresponding to the number of layers, and the smaller the corresponding layer resource metric value.

[0095] The first layer number interval and the second layer number interval are intervals divided according to the layer number threshold. Since the number in the first layer number interval is less than the number in the second layer number interval, two adaptable positive correlation change trends can be formed to ensure the processing efficiency.

[0096] The first positive correlation change trend and the second positive correlation change trend are two positive correlation change trends. Each positive correlation change trend means that: the greater the number of layers, the greater the layer weight corresponding to the number of layers, the greater the corresponding layer resource metric value, and the more production resources required for the number of layers; correspondingly, the smaller the number of layers, the smaller the layer weight corresponding to the number of layers, the smaller the corresponding layer resource metric value, and the fewer production resources required for the number of layers. Thus, the layer weight is dynamically variable to ensure accuracy.

[0097] The change speeds of the first positive correlation change trend and the second positive correlation change trend are different. The change speed of the first positive correlation change trend, which is less than the change speed of the second positive correlation change trend, means that: when the change value of the number of layers is the same, the change value of the layer weight in the first change trend is greater than the change value of the layer weight in the second change trend.

[0098] In this embodiment, the number of layers and the thickness of the PCB board are decoupled into two aspects, and each of these two aspects has its own weight. Since the number of layers has a greater relationship with the internal signals and other layers of the PCB, the value of the adjustment of the number of layers through the weight of the number of layers is larger, so as to more accurately evaluate the corresponding metric value. On this basis, according to the layer number interval, the positive correlation change trend is adjusted, and the larger the layer number interval, the greater the positive correlation change trend, so that the corresponding relationship between the number of layers and the layer resource metric value is adaptively adjusted, so that the layer resource metric value can be biased towards performance and functional complexity, thereby ensuring that the production process resource metric value is closer to the actual production process.

[0099] In some embodiments, the production plan data includes the number of PCB boards required, the production plan adjustment coefficient includes the required quantity adjustment coefficient, and the required quantity adjustment coefficient is used to lower the process resource metric value; the production plan mapping rule includes the production quantity mapping rule and the production efficiency mapping rule.

[0100] Determine the production plan mapping rule according to the type of process resources and the production plan data, and obtain the production plan adjustment coefficient according to the production plan mapping rule, including: when the number of PCB boards required is in the first quantity interval, determine the production quantity mapping rule according to the type of process resources, and according to the production quantity mapping rule, determine the required quantity adjustment coefficient that is negatively correlated with the number of PCB boards required; when the number of PCB boards required is in the second quantity interval, determine the production efficiency mapping rule according to the type of process resources and the integration efficiency corresponding to the supply chain, and according to the production efficiency mapping rule, determine the required quantity adjustment coefficient that is negatively correlated with the number of PCB boards required; where the quantity in the first quantity interval is less than the quantity in the second quantity interval.

[0101] The number of PCB boards required is the number of PCB boards generated in the design document. Both the first quantity interval and the second quantity interval are quantity intervals of PCB boards; the quantity in the first quantity interval is less than the quantity in the second quantity interval, and the first quantity interval and the second quantity interval respectively correspond to different mapping rules.

[0102] The production quantity mapping rule and the production efficiency mapping rule are different mapping rules. The production quantity mapping rule, as well as the production efficiency mapping rule, are both negatively correlated with the number of PCB boards required. However, the change rules of the two are different. The production quantity mapping rule is approximately linearly changed, while the production efficiency mapping rule is related to efficiency.

[0103] The production quantity mapping rule is related to the type of process resources. Since the type of process resources can be directly set, the efficiency of mapping through the production quantity mapping rule is relatively high. The production quantity mapping rule can be in the form of a mapping table to ensure the mapping efficiency within the first quantity interval.

[0104] The production efficiency mapping rule is not only related to the types of process resources, but also to the integration efficiency corresponding to the supply chain. The integration efficiency includes, but is not limited to, the efficiency in aspects such as procurement efficiency, logistics efficiency, and supplier management. The production efficiency mapping rule can more accurately evaluate the adjustment coefficient of the required quantity of resources.

[0105] In an example, the production efficiency mapping rule is determined based on the samples of the types of process resources, the samples of the integration efficiency corresponding to the supply chain, the samples of the required quantity of PCB boards, and the samples of the adjustment coefficient of the required quantity; in this case, based on the samples of the types of process resources and the samples of the integration efficiency corresponding to the supply chain, the samples of the required quantity of PCB boards form the first sample dimension feature, and the samples of the adjustment coefficient of the required quantity form the second sample dimension feature.

[0106] Specifically, model fitting can be performed according to the first sample dimension feature to obtain a sample dimension feature model; according to the deviation between the first sample dimension feature and the first sample dimension feature model, abnormal filtering is performed on the sample dimension feature to obtain the filtered first sample dimension feature; the feature difference between the filtered first sample dimension feature and the initial first sample dimension feature is determined.

[0107] Adjust the initial production efficiency mapping rule according to the feature difference to obtain the adjusted production efficiency mapping rule and the corresponding adjusted feature deviation. Until the adjusted feature deviation meets the deviation minimization condition, determine the corrected production efficiency mapping rule according to the adjusted production efficiency mapping rule, including: adjust the initial production efficiency mapping rule according to the feature difference to obtain the adjusted production efficiency mapping rule, and according to the adjusted production efficiency mapping rule, determine the adjusted feature deviation between the adjusted first sample dimension feature and the adjusted first sample dimension feature. Until the adjusted feature deviation meets the deviation minimization condition, determine the corrected production efficiency mapping rule according to the adjusted production efficiency mapping rule.

[0108] Specifically, before the adjusted feature deviation meets the deviation minimization condition, make successive adjustments from the initial production efficiency mapping rule to obtain the adjusted production efficiency mapping rule each time; according to the adjusted production efficiency mapping rule each time, convert the sample dimension feature model, and the adjusted first sample dimension feature and the adjusted feature deviation obtained from each adjustment can be obtained; then, judge whether the adjusted production efficiency mapping rule meets the deviation minimization condition through the adjusted feature deviation obtained from each adjustment. When the adjusted feature deviation meets the deviation minimization condition, the corrected production efficiency mapping rule can be determined according to the adjusted production efficiency mapping rule, and there is no need to determine the adjusted feature deviation between the adjusted first sample dimension feature and the adjusted first sample dimension feature again.

[0109] The deviation minimization condition is the minimization condition set for the adjusted feature deviation. When the adjusted feature deviation is less than a certain threshold, it can be determined that the adjusted feature deviation meets the deviation minimization condition; at this time, the adjusted production efficiency mapping rule used to determine this adjusted feature deviation can be used as the corrected production efficiency mapping rule, or the adjusted production efficiency mapping rule used to determine this adjusted feature deviation is mapped or otherwise processed to obtain the corrected production efficiency mapping rule. When the adjusted feature deviation meets the deviation minimization condition, this means that the adjusted production efficiency mapping rule can be subjected to multiple model fittings, and the filtered first sample dimension features can be continuously adjusted to complete the solution process of the fitting model.

[0110] The sample dimension feature model is obtained by means of model fitting, and the correlation relationship between the first sample dimension features is established and filtered accordingly, which can make the sample dimension feature model have strong robustness and is not easily affected by external environmental interference to affect the rule correction process. On this basis, the adjustment is made according to the feature difference until the minimization condition is met. Since the adjusted feature deviation is relatively small, this processing process can have higher accuracy.

[0111] In this embodiment, based on different quantity intervals of mass production, adjustment coefficients in various situations are obtained by different means. In the first quantity interval, the demand quantity of PCB boards is relatively small, and the process resource types can be mapped to ensure the processing efficiency; in the second quantity interval, the demand quantity of PCB boards is relatively large, and it is necessary to evaluate in combination with the corresponding integration efficiency of the supply chain to ensure the accuracy.

[0112] In some embodiments, the production plan data includes the production demand time of PCB boards. The production plan mapping rule is determined according to the process resource types and the production plan data, and according to the production plan mapping rule, the production plan adjustment coefficient is obtained, including: when the demand time of the PCB board is in the first time interval, the production plan adjustment coefficient does not contain the supply time adjustment coefficient, and the supply time adjustment coefficient is used to increase the process resource measurement value; when the demand time of the PCB board is in the second time interval, mapping is performed according to the production time mapping rule that is negatively correlated with the production demand time of the PCB board under the process resource types, and according to the production time mapping rule, the supply time adjustment coefficient in the production plan adjustment coefficient is obtained; the time in the first time interval is shorter than the time in the second time interval.

[0113] The production demand time of the PCB board is the construction period of the PCB board generation; the longer the production demand time of the PCB board, the farther the completion time of the PCB board production.

[0114] The first time interval and the second time interval are different time intervals, and the time in the first time interval is shorter than the time in the second time interval, thus forming an alternative choice for the supply time adjustment coefficient; in this case, the presence or absence of the supply time adjustment coefficient is used to adaptively adjust the corresponding measurement value to more accurately evaluate the work order resources.

[0115] The production time mapping rule is negatively correlated with the production demand time of the PCB board under the type of process resource. For a specific type of process resource, the greater the production demand time of the PCB board, the greater the adjustment ability of the supply time adjustment coefficient; for a specific type of process resource, the smaller the production demand time of the PCB board, the smaller the adjustment ability of the supply time adjustment coefficient. Thus, a mapping rule is set for a specific type of process resource to ensure the processing efficiency.

[0116] In this embodiment, through the first time interval and the second time interval, it is determined whether the supply time adjustment coefficient needs to exist. If the production demand time of the PCB board is within the first time interval, there is no need to set the supply time adjustment coefficient accordingly, nor to adjust the measurement value based on this; if the production demand time of the PCB board is within the second time interval, there is a supply time adjustment coefficient, and the measurement value is adjusted accordingly, so as to more accurately evaluate the efficiency.

[0117] In some embodiments, the method further includes: displaying the adjustment result of the process resource measurement value included in the work order resource quantity, as well as the process resource measurement value and the production plan adjustment coefficient used to obtain the adjustment result; and / or, generating an optimization suggestion for the process resource data according to the work order resource quantity, where the optimization suggestion is used to indicate the materials to be replaced or the surface process of the process resource data.

[0118] The adjustment result is the result obtained by adjusting the process resource measurement value with the production plan adjustment coefficient. Since there are generally multiple dimensions for the process resource measurement value, and the adjustment result is obtained by comprehensively adjusting the process resource measurement values of multiple dimensions. The process resource measurement value and the production plan adjustment coefficient can form the specific details of the process resource measurement value, thereby ensuring the refinement of the information transparency granularity.

[0119] The optimization suggestion is the adjustment information for the process resource data; the optimization suggestion can reflect the adjustable dimensions of the process resource data. Since the materials to be replaced and the surface process mainly involve factors such as the solderability, conductivity, and corrosion resistance of the PCB, and the replaceability of these two elements has relatively low technical requirements, optimization suggestions are provided from the production perspective in order to reduce the work order resource quantity.

[0120] In this embodiment, when presenting the adjustment results to form an overall dimension and then presenting the measurement values and adjustment coefficients used to constitute the adjustment results respectively, the overall adjustment process can be made relatively transparent, which helps to determine the amount of resources adjusted in each step for easy traceability or adjustment. When generating optimization suggestions for process resource data, feedback can be provided through the optimization suggestions to make the order resource amount appropriate.

[0121] In one example, the overall solutions of the above embodiments are elaborated through specific steps. This embodiment automates the quotation, reduces manual intervention, and improves efficiency and accuracy. It has intelligent and data-driven optimization for production optimization and cost control based on historical data; and supports small-batch production and rapid prototyping to reduce R & D and production costs. Moreover, it provides an integrated production service that integrates processes such as design, manufacturing, procurement, and assembly. These innovations enable the industrial order resource amount evaluation method to provide more efficient, flexible, and transparent services in the hardware manufacturing and prototype development processes, realizing the transformation of products from design to production faster and at lower cost.

[0122] In a specific embodiment, both the resources and resource measurement values are factors such as price and working hours for easy quotation. At this time, the solution of this embodiment is an industrial order valuation method, which automatically calculates the production cost and provides an instant quotation based on the design files submitted by the user, the selected production options, and the real-time production environment information. The main business logic and process of quotation calculation involve multiple links, from design file parsing, process and material selection to production scale and timeliness adjustment, and each link will affect the final valuation result.

[0123] The above step 202 specifically includes: 1. User input and requirement collection, and 2. Design file parsing.

[0124] 1. User input and requirement collection

[0125] 1.1 Order requirement submission

[0126] Order creation: The user submits a production order through the platform and fills in basic information such as product type, production quantity, delivery time, etc. Design file upload: The user uploads design files (usually PCB design files such as Gerber, ODB++), and the system automatically reads the design data in these files.

[0127] 1.2 Production parameter selection

[0128] Users can select the following parameters to further refine production requirements: board type (such as FR4, aluminum substrate, copper substrate, etc.); surface treatment process (such as HASL, ENIG, electroplating, etc.); number of layers (such as single-sided board, double-sided board, multi-layer board); hole diameter, trace width (automatically extracted according to the design file); batch requirement (such as sample, small batch, large batch production); delivery time (standard delivery, urgent delivery); these parameters and the content of the design file will directly affect the calculation of the quotation.

[0129] 2. Design File Parsing

[0130] 2.1 Design File Parsing. Automatically parse the PCB design file: The system uses parsing tools (such as open-source libraries like pygerber) to automatically read the design file uploaded by the user. The Gerber file contains important information such as board size, number of layers, hole diameter, component position, and circuit layout. The system will automatically extract this data for subsequent processing. Extract key parameters: Board size: Calculate the area of the PCB board. Number of layers: Determine whether it is a single-sided board, double-sided board, multi-layer board, etc. Hole positions and diameters: Extract different types of holes and hole diameters (such as vias, blind vias, etc.). Component layout and traces: Evaluate the process complexity based on the components and traces in the design file.

[0131] 2.2 Design Rationality Check

[0132] Check for incorrect or non-compliant designs: The system automatically checks the rationality and manufacturability of the design file. For example, check whether the minimum hole diameter, minimum line width, and design rules meet the production requirements to avoid quotation deviation or production failure caused by the design submitted by the user not meeting the manufacturing standards. Optimization suggestions: If there are problems with the design file, the system will prompt the user to make modifications or optimizations to reduce possible additional costs.

[0133] Step 204 specifically includes production process selection and material cost calculation. This calculation process specifically includes:

[0134] 3.1 Material Cost Calculation. Select the material type: The system calculates the cost of raw materials based on the materials selected by the user (such as FR4, aluminum substrate, etc.) and the real-time prices provided by the suppliers. Different materials such as FR4, aluminum substrate, and copper substrate have different prices. The system will select the appropriate material type according to the actual situation and include it in the quotation calculation. Material prices usually fluctuate dynamically according to the market. The system can obtain the real-time quotation information of the suppliers.

[0135] 3.2 Selection of surface treatment process. Surface treatment process cost: Surface treatment (such as HASL, ENIG, gold plating, etc.) is also an important factor in the quotation. Different treatment processes have different impacts on production costs, and the system will calculate the costs of different processes according to design requirements and production requirements. HASL (Hot Air Solder Leveling) is a relatively common and inexpensive process, while treatment processes such as ENIG (Electroless Nickel Immersion Gold) and OSP (Organic Solderability Preservative) are more expensive, and the system will automatically adjust the quotation based on the process selected by the user.

[0136] 3.3 Evaluation of production process difficulty. Complexity markup: For complex designs (such as multi-layer boards, large-area boards, blind vias, micro-vias, etc.), the system will add a markup according to the complexity of the design. For example, the production of 4-layer and 6-layer PCB boards is more difficult than that of 2-layer boards, and the system will automatically adjust the production cost according to the number of layers. Special process requirements: If the design requires special processes, such as high-frequency PCBs, high-temperature resistant materials, etc., the system will add additional costs according to the process requirements.

[0137] Step 206 specifically includes the steps of 4. Impact of batch quantity and delivery time, which specifically include:

[0138] 4.1 Impact of production batch quantity. Small batch production: The production cost per PCB is usually higher in small batch production because the equipment needs to be adjusted frequently and the production efficiency is low. The system will automatically adjust the quotation according to the small batch production selected by the user and increase the unit cost. Large batch production: In large batch production, the production cost per unit product is usually lower because the production line has higher efficiency in large batch production. The system will automatically optimize the price according to the production batch quantity and give a more competitive quotation.

[0139] 4.2 Impact of delivery time. Standard delivery time: If the standard delivery time is selected by the user, the system will automatically generate a reasonable delivery time according to production capacity and scheduling. Urgent delivery: If the user requests urgent delivery, the system will consider the scheduling of production resources and additional manpower / equipment requirements, thereby increasing the production cost and raising the quotation accordingly. Urgent orders usually require additional payment, and the system will dynamically adjust the quotation according to the urgency of the production time.

[0140] Step 208 specifically includes 5. Cost synthesis and quotation generation, 6. Quotation adjustment and optimization, and 7. Quotation confirmation and order generation, and these steps specifically include:

[0141] 5. Cost synthesis and quotation generation

[0142] 5.1 Cost Composition. The material cost refers to the cost calculated based on the materials selected by the user (such as FR4, aluminum substrate) and the real-time market price. The processing fee refers to the processing cost calculated based on the production complexity (such as number of layers, hole diameter, process requirements). The surface treatment fee refers to the fee calculated according to the selected surface treatment process (such as HASL, ENIG, gold plating, etc.). The transportation cost refers to the logistics cost calculated based on the production location and the delivery location. For international orders, customs duties, international transportation costs, etc. also need to be considered. The rush fee refers to the additional fee automatically charged by the system if the user requests rush delivery.

[0143] 5.2 Quotation Generation. Instant feedback means that after calculating all costs, the system will automatically generate the final quotation and display it to the user. The quotation will show the detailed composition of each cost item to ensure transparency. Discounts and promotions mean that if the user selects large-volume production or long-term cooperation, the system will automatically apply discounts and adjust the quotation.

[0144] 6. Quotation Adjustment and Optimization

[0145] 6.1 Dynamic Adjustment. Material price fluctuations mean that the system will obtain the material prices of suppliers in real time. If the market price fluctuates greatly, the system will recalculate and adjust the quotation. Production progress and scheduling mean that if the user's order conflicts with other orders or needs to be prioritized, the system will adjust the production schedule and recalculate the quotation.

[0146] 6.2 User Optimization Suggestions. Based on the quotation information, the system may provide optimization suggestions to the user. For example, it may recommend that the user use different materials or change the surface treatment process to reduce costs or shorten the production cycle.

[0147] 7. Quotation Confirmation and Order Generation. User confirmation means that after viewing the quotation information, the user can confirm the order. If the user is not satisfied with certain aspects, they can return to adjust the design or production parameters, and the system will update the quotation in real time. Generating an order means that once the user confirms the quotation, the system will generate a formal order and guide the user to make a payment.

[0148] Thus, an accurate quotation is automatically generated: Through the integrated automated quotation engine, the system can automatically generate a production quotation based on the design files (such as Gerber files) submitted by the user. This process greatly reduces manual intervention and errors, improving the accuracy of the quotation. Saving time and labor costs: Traditional quotation methods usually require manual calculation and review, which may lead to long waiting times. Through automation, customers can obtain quotations in real time without waiting for a long time for manual feedback, significantly improving the order processing speed.

[0149] Reduce error rate: The automated system can accurately calculate the production cost of products, including materials, processes, processing difficulty, etc., avoiding omissions and errors in manual calculations and ensuring the accuracy of quotations.

[0150] Support personalized needs: The quotation system of LCSC not only supports standardized orders but also can handle highly customized requirements. The system can flexibly adjust quotations according to the customer's design requirements (such as the size, number of layers, hole positions, surface treatment, etc. of the PCB board).

[0151] Highly adaptable to different production processes: The system supports the selection of multiple production processes and material options. For example, different types of PCB surface treatments (such as HASL, ENIG, etc.). Customers can choose the most suitable option according to actual needs and obtain real-time price feedback.

[0152] Small batch and rapid prototyping: The system supports quotations for small batch production, enabling engineers and startups to quickly manufacture hardware prototypes at low cost to verify the feasibility of the design. This is crucial for hardware innovation and rapid iteration.

[0153] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear description in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same moment but can be executed at different moments. The execution order of these steps or stages is not necessarily sequential either, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0154] Based on the same inventive concept, the embodiments of the present application also provide a work order resource quantity evaluation device for implementing the work order resource quantity evaluation method involved above. The implementation solutions for solving problems provided by this device are similar to the implementation solutions described in the above method. Therefore, the specific limitations in one or more embodiments of the work order resource quantity evaluation device provided below can refer to the limitations on the work order resource quantity evaluation method in the above text and will not be repeated here.

[0155] In an exemplary embodiment, as Figure 4 shown, a work order resource quantity evaluation device is provided, including:

[0156] An extraction module 402, configured to extract parameters from the design file of the PCB board to obtain process resource data and production plan data;

[0157] A process module 404, configured to map the process resource data according to a process resource mapping rule adapted to the type of the process resource to which the process resource data belongs, so as to obtain a process resource measurement value;

[0158] A planning module 406, configured to determine a production plan mapping rule according to the type of the process resource and the production plan data, and obtain a production plan adjustment coefficient according to the production plan mapping rule;

[0159] An integration module 408, configured to adjust the process resource measurement value according to the production plan adjustment coefficient to obtain a work order resource quantity.

[0160] In one embodiment, the type of the process resource includes a production process type, and the process resource data includes material resource data, a surface process type, and board-level structure features under the production process type; the process resource measurement value includes a material resource measurement value, a surface process resource measurement value, and a production process resource measurement value;

[0161] The process module 404 is configured to:

[0162] Map according to the material resource data of the supplier to obtain the material resource measurement value;

[0163] Map according to the surface process type to obtain the surface process resource measurement value;

[0164] Determine the production process resource measurement value according to the board-level structure features under the production process type.

[0165] In one embodiment, the board-level structure features include the required thickness and the number of layers of the PCB board; the process module 404 is configured to:

[0166] Map according to the thickness and the thickness weight corresponding to the thickness to obtain a thickness resource measurement value that is positively correlated with the thickness;

[0167] Map according to the number of layers and the layer weight corresponding to the number of layers to obtain a layer resource measurement value that is positively correlated with the number of layers; the layer weight is greater than the thickness weight;

[0168] Combine the thickness resource measurement value and the layer resource measurement value to obtain a production process resource measurement value;

[0169] Wherein, when the number of layers is in the first layer number range, the layer weight changes in a first positive correlation trend with the number of layers; when the number of layers is in the second layer number range, the layer weight changes in a second positive correlation trend with the number of layers; the number in the first layer number range is less than the number in the second layer number range; the change speed of the first positive correlation trend is less than the change speed of the second positive correlation trend.

[0170] In one embodiment, the production plan data includes the required quantity of PCB boards, the production plan adjustment coefficient includes a demand quantity adjustment coefficient, and the demand quantity adjustment coefficient is used to lower the process resource measurement value; the production plan mapping rules include a production quantity mapping rule and a production efficiency mapping rule.

[0171] The planning module 406 is configured to:

[0172] When the required quantity of PCB boards is in the first quantity range, determine the production quantity mapping rule according to the type of process resources, and determine the demand quantity adjustment coefficient negatively correlated with the required quantity of PCB boards according to the production quantity mapping rule.

[0173] When the required quantity of PCB boards is in the second quantity range, determine the production efficiency mapping rule according to the type of process resources and the integration efficiency of the supply chain, and determine the demand quantity adjustment coefficient negatively correlated with the required quantity of PCB boards according to the production efficiency mapping rule.

[0174] Wherein, the number in the first quantity range is less than the number in the second quantity range.

[0175] In one embodiment, the production plan data includes the production demand time of PCB boards, and the production plan mapping rule includes a production time mapping rule.

[0176] The planning module 406 is configured to:

[0177] When the demand time of the PCB board is in the first time range, the production plan adjustment coefficient does not include a supply time adjustment coefficient, and the supply time adjustment coefficient is used to increase the process resource measurement value.

[0178] When the demand time of the PCB board is in the second time range, perform mapping according to the production time mapping rule negatively correlated with the production demand time of the PCB board under the type of process resources, and obtain the supply time adjustment coefficient in the production plan adjustment coefficient according to the production time mapping rule; the time in the first time range is shorter than the time in the second time range.

[0179] In one embodiment, the comprehensive module 408 is configured to:

[0180] display the adjustment result of the process resource measurement value included in the work order resource quantity, as well as the process resource measurement value and the production plan adjustment coefficient used to obtain the adjustment result; and / or,

[0181] generate an optimization suggestion for the process resource data according to the work order resource quantity, where the optimization suggestion is used to indicate the material to be replaced or the surface process of the process resource data.

[0182] Each module in the above work order resource quantity evaluation device can be implemented in whole or in part by software, hardware, and their combination. The above modules can be embedded in the processor of the computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above modules.

[0183] In an exemplary embodiment, a computer device is provided. The computer device can be a terminal, and its internal structure diagram can be as Figure 5 shown. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit, and an input device. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface, the display unit, and the input device are connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used for the processor to exchange information with external devices. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner. The wireless manner can be achieved through WIFI, a mobile cellular network, near field communication (NFC), or other technologies. The computer program, when executed by the processor, implements a work order resource quantity evaluation method. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covered on the display screen, or a button, a trackball, or a touchpad provided on the housing of the computer device, or an external keyboard, a touchpad, or a mouse, etc.

[0184] Those skilled in the art can understand, Figure 5The structure shown is only a block diagram of some structures related to the solution of this application, and does not constitute a limitation on the computer device to which the solution of this application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0185] In one embodiment, a computer device is further provided, including a memory and a processor. A computer program is stored in the memory, and when the processor executes the computer program, the steps in the above-mentioned method embodiments are implemented.

[0186] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0187] In one embodiment, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0188] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use, and processing of relevant data need to comply with relevant regulations.

[0189] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include Read-Only Memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, Resistive Random Access Memory (ReRAM), Magnetoresistive Random Access Memory (MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (PCM), graphene memory, etc. Volatile memory can include Random Access Memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, data processing logics based on quantum computing, Artificial Intelligence (AI) processors, etc., without limitation.

[0190] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in the present application.

[0191] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. A method for evaluating the quantity of work order resources, characterized in that The method includes: Performing parameter extraction on the design file of the PCB board to obtain process resource data and production plan data; Mapping the process resource data according to the process resource mapping rules adapted to the type of process resources to which the process resource data belongs, to obtain process resource measurement values; Determining a production plan mapping rule according to the type of process resources and the production plan data, and obtaining a production plan adjustment coefficient according to the production plan mapping rule; Adjusting the process resource measurement values according to the production plan adjustment coefficient to obtain the work order resource quantity.

2. The method according to claim 1, wherein The type of process resources includes production process types, and the process resource data includes material resource data, surface process types, and board-level structure characteristics under the production process types; The process resource measurement values include material resource measurement values, surface process resource measurement values, and production process resource measurement values; The mapping the process resource data according to the process resource mapping rules adapted to the type of process resources to which the process resource data belongs, to obtain process resource measurement values, includes: Mapping according to the material resource data of the supplier to obtain the material resource measurement values; Mapping according to the surface process types to obtain the surface process resource measurement values; Determining the production process resource measurement values according to the board-level structure characteristics under the production process types.

3. The method according to claim 2, characterized in that, The board-level structure characteristics include the required thickness and number of layers of the PCB board; the determining the production process resource measurement values according to the board-level structure characteristics under the production process types, includes: Mapping according to the thickness and the thickness weight corresponding to the thickness to obtain the thickness resource measurement values positively correlated with the thickness; Mapping according to the number of layers and the layer weight corresponding to the number of layers to obtain the layer resource measurement values positively correlated with the number of layers; the layer weight is greater than the thickness weight; Combining the thickness resource measurement values and the layer resource measurement values to obtain production process resource measurement values; Wherein, when the number of layers is in the first layer number interval, the layer weight and the number of layers have a first positive correlation change trend; when the number of layers is in the second layer number interval, the layer weight and the number of layers have a second positive correlation change trend; the number in the first layer number interval is less than the number in the second layer number interval; the change speed of the first positive correlation change trend is less than the change speed of the second positive correlation change trend.

4. The method according to claim 1, wherein The production plan data includes the required quantity of PCB boards, the production plan adjustment coefficient includes a demand quantity adjustment coefficient, and the demand quantity adjustment coefficient is used to lower the process resource measurement values; the production plan mapping rules include production quantity mapping rules and production efficiency mapping rules; The determining a production plan mapping rule according to the type of process resources and the production plan data, and obtaining a production plan adjustment coefficient according to the production plan mapping rule, includes: When the required quantity of the PCB board is in the first quantity range, determine the production quantity mapping rule according to the type of process resources, and determine the required quantity adjustment coefficient negatively correlated with the required quantity of the PCB board according to the production quantity mapping rule; When the required quantity of the PCB board is in the second quantity range, determine the production efficiency mapping rule according to the type of process resources and the integration efficiency of the supply chain, and determine the required quantity adjustment coefficient negatively correlated with the required quantity of the PCB board according to the production efficiency mapping rule; Wherein, the quantity in the first quantity range is less than the quantity in the second quantity range.

5. The method according to claim 1, characterized in that, The production plan data includes the production demand time of the PCB board, and the production plan mapping rule includes the production time mapping rule; Determining the production plan mapping rule according to the type of process resources and the production plan data, and obtaining the production plan adjustment coefficient according to the production plan mapping rule, includes: When the demand time of the PCB board is in the first time range, the production plan adjustment coefficient does not include the supply time adjustment coefficient, and the supply time adjustment coefficient is used to increase the process resource measurement value; When the demand time of the PCB board is in the second time range, map according to the production time mapping rule negatively correlated with the production demand time of the PCB board under the type of process resources, and obtain the supply time adjustment coefficient in the production plan adjustment coefficient according to the production time mapping rule; The time in the first time range is shorter than the time in the second time range.

6. The method according to claim 1, wherein The method further includes: Display the adjustment result of the process resource measurement value included in the work order resource quantity, as well as the process resource measurement value and the production plan adjustment coefficient used to obtain the adjustment result; and / or, Generate an optimization suggestion for the process resource data according to the work order resource quantity, and the optimization suggestion is used to indicate the material to be replaced or the surface process of the process resource data.

7. A work order resource quantity evaluation device, characterized in that, The device includes: An extraction module for extracting parameters from the design file of the PCB board to obtain process resource data and production plan data; A process module for mapping the process resource data according to the process resource mapping rule adapted to the type of process resources to obtain a process resource measurement value; A planning module for determining a production plan mapping rule according to the type of process resources and the production plan data, and obtaining a production plan adjustment coefficient according to the production plan mapping rule; An integration module for adjusting the process resource measurement value according to the production plan adjustment coefficient to obtain a work order resource quantity.

8. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, the steps of the method according to any one of claims 1 to 6 are implemented.

Images