LED packaging structure and light-emitting assembly

Abstract

The invention relates to the field of LEDs, and provides an LED packaging structure and a light-emitting assembly. The LED packaging structure comprises a conductive structure, an LED chip and a packaging body. The LED chip is conductively connected to the conductive structure. The packaging body coats the conductive structure; the packaging body is provided with a top surface and a bottom surface which are opposite to each other along the LED chip, and an outer side surface connected between the top surface and the bottom surface; and the outer side surface is step-shaped. The conductive structure is provided with a power connection end, and the power connection end is exposed out of the packaging body. The LED packaging structure has the beneficial effects that the heat dissipation effect of the LED packaging structure is good, and the conductive structure and the packaging body are not easy to separate from each other.

Description

Technical Field

[0001] The present application relates to the field of LEDs, and more specifically, to an LED packaging structure and a light-emitting component. Background Art

[0002] In some known technologies, the LED packaging structure has poor heat dissipation capability, and the LED packaging structure is prone to cracking of the packaging shell of the packaging structure due to thermal stress, or causing the conductive metal part of the packaging structure and the packaging shell to separate from each other. Summary of the invention

[0003] The present application provides an LED packaging structure and a light-emitting component to solve the problem of poor heat dissipation capability of the LED packaging structure in the prior art.

[0004] In a first aspect, an embodiment of the present application provides an LED packaging structure, which includes a conductive structure, an LED chip, and a packaging body. The LED chip is conductively connected to the conductive structure. The packaging body covers the conductive structure; the packaging body has a top surface and a bottom surface opposite to the LED chip, and an outer side surface connected between the top surface and the bottom surface; the outer side surface is stepped. Among them, the conductive structure has a power connection terminal, and the power connection terminal is exposed from the packaging body.

[0005] The LED packaging structure of the present application facilitates the release of thermal stress by making the outer side of the packaging body into a stepped shape, thereby reducing the problem of the packaging body being broken or the packaging body and the conductive structure being delaminated due to thermal stress when the LED packaging structure is used. In addition, the outer side of the packaging body is stepped, which can also increase the area of the outer side and improve the heat dissipation capacity of the LED packaging structure.

[0006] In a possible implementation, the LED package structure is a side-emitting LED. The outer side surface of the package body includes a mounting side surface, and the mounting side surface is stepped. The mounting side surface includes a first surface area, a second surface area, and a step surface, and the step surface is connected between the first surface area and the second surface area. The second surface area is concave relative to the first surface area, so that when the first surface area is superimposed on a circuit board, there is a gap between the second surface area and the circuit board. The electrical terminal is exposed from the second surface area.

[0007] In a possible implementation manner, the electrical connection terminal is located at the junction of the bottom surface of the package body and the second surface area, and is exposed from the bottom surface of the package body and the second surface area respectively.

[0008] In a possible implementation, the power connection terminal includes a first exposed surface exposed at the bottom surface of the package body and a second exposed surface exposed at the second surface area. The power connection terminal is provided with a cutout, which passes through the first exposed surface and the second exposed surface.

[0009] In a possible implementation manner, the cutout is in the shape of a quarter sphere, and the center of the sphere is located on the intersection line of the first exposed surface and the second exposed surface.

[0010] In a possible implementation, the conductive structure further includes a conductive plate; the LED chip is disposed on one side surface of the conductive plate and is electrically connected to the conductive plate. The power connection end protrudes from one side of the conductive plate and protrudes toward the bottom surface of the encapsulation body. The conductive structure further includes one or more exposed blocks; the exposed blocks protrude from the side surface of the conductive plate and are exposed on the outer side surface of the encapsulation body.

[0011] In a possible implementation, the LED encapsulation structure is a forward-emitting LED. The conductive structure further includes a conductive plate, the LED chip is disposed on one side surface of the conductive plate and is electrically connected to the conductive plate. The power connection end protrudes from the side surface of the conductive plate facing away from the LED chip and is exposed on the bottom surface of the encapsulation body; and, the power connection end is recessed in the circumferential direction relative to the conductive plate, so that the conductive structure is stepped. The conductive structure further includes one or more exposed blocks; the exposed blocks protrude from the side surface of the conductive plate and are exposed on the outer side surface of the encapsulation body. The outer side surface has a stepped surface facing the thickness direction of the LED encapsulation structure, and the exposed blocks are at least partially exposed on the stepped surface.

[0012] In a possible implementation, the encapsulation body includes a first part and a second part, and the first part is located on one side of the second part along the thickness direction of the LED encapsulation structure. The conductive structure is coated on the first part, and the second part protrudes outward or inward laterally relative to the first part, so that the outer side surface of the encapsulation body is stepped. The conductive structure has a support surface facing away from the bottom surface of the encapsulation body; The second part is provided with an accommodation hole penetrating along the thickness direction, and the accommodation hole penetrates to the support surface. The LED chip is supported on the support surface; and, the accommodation hole is filled with a sealing body.

[0013] In a first aspect, an embodiment of the present application provides a light-emitting component, which includes a circuit board and the foregoing LED encapsulation structure. The power connection end of the LED encapsulation structure is welded to the circuit board, so that the LED chip is electrically connected to the circuit board.

[0014] In a possible implementation, the light-emitting component further includes a light guide plate, and the light incident surface of the light guide plate corresponds to the light-emitting surface of the LED encapsulation structure. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a perspective view of the LED encapsulation structure of this embodiment.

[0017] Figure 2is Figure 1 Another perspective view of the LED package structure of

[0018] Figure 3 is Figure 1 The exploded view of the LED package structure of

[0019] Figure 4 is Figure 1 The cross-sectional view of the LED package structure of along line A-A.

[0020] Figure 5 is Figure 1 The front view of the LED package structure of

[0021] Figure 6 is Figure 5 The cross-sectional view of the LED package structure of along line B-B.

[0022] Figure 7 is the perspective view of one part (taking the positive part as an example) of the conductive structure in 3.

[0023] Figure 8 is Figure 5 The cross-sectional view along line C-C.

[0024] Figure 9 is the schematic diagram of the light-emitting component of this embodiment.

[0025] Figure 10 is Figure 9 The cross-sectional view along line D-D.

[0026] Figure 11 is the perspective view of the LED package structure of another embodiment.

[0027] Figure 12 is Figure 11 Another perspective view of the LED package structure of

[0028] Figure 13 is Figure 11 The top view of the LED package structure of

[0029] Figure 14 is Figure 11 The bottom view of the LED package structure of

[0030] Figure 15 is Figure 11 The exploded view of the LED package structure of

[0031] Figure 16 is Figure 13 The cross-sectional view of the LED package structure of along line E-E.

[0032] Description of main component symbols: 100 - light-emitting component; 110 - circuit board; 111 - pad; 120 - light guide plate; 130 - solder; 10, 10a - LED packaging structure; 11 - conductive structure; 12 - LED chip; 13 - package body; 14 - sealing body; 15 - power connection end; 16 - positive part; 17 - negative part; 18 - conductive lead; 19 - exposed block; 20 - substrate; 21 - lower convex part; 22 - first part; 23 - second part; 24 - conductive plate; K1 - receiving hole; P1 - top surface; P2 - bottom surface; P3 - outer side surface; P4 - mounting side surface; P5 - first surface area; P6 - second surface area; P7, P13 - stepped surface; P8 - first exposed surface; P9 - second exposed surface; P10 - supporting surface; P11 - light-emitting surface; P12 - light-incident surface; C1 - notch; f1 - gap; Z - thickness direction. Detailed implementation manners

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0034] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific implementation manners and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0036] Some implementation manners of the present application will be described in detail. Without conflict, the following implementation manners and the features in the implementation manners can be combined with each other.

[0037] Embodiment 1 Figure 1 This is a perspective view of the LED packaging structure 10 of this embodiment. Figure 2 For Figure 1 Another perspective view of the LED packaging structure 10. Figure 3 For Figure 1Exploded view of the LED packaging structure 10. Figure 4 is Figure 1 Cross-sectional view of the LED packaging structure 10 along line A-A.

[0038] See Figures 1 - 4 , this embodiment provides an LED packaging structure 10, which is a side-emitting type LED.

[0039] The LED packaging structure 10 includes a conductive structure 11, an LED chip 12, a package body 13, and a sealing body 14.

[0040] The LED chip 12 is electrically connected to the conductive structure 11 and can be connected to an external circuit through the conductive structure 11. The package body 13 covers the conductive structure 11. The package body 13 has a top surface P1 and a bottom surface P2 opposite to the LED chip 12, and an outer side surface P3 connected between the top surface P1 and the bottom surface P2. Among them, the conductive structure 11 has a power connection end 15, and the power connection end 15 is exposed outside the package body 13 so that the LED packaging structure 10 can be electrically connected to an external circuit.

[0041] The outer side surface P3 is stepped. The outer side surface P3 can be stepped on each side or only on some sides.

[0042] In the LED packaging structure 10 of this embodiment, by making the outer side surface P3 of the package body 13 stepped, it is beneficial to release thermal stress and reduce the problem that the package body 13 cracks or the package body 13 delaminates from the conductive structure 11 due to thermal stress during the use of the LED packaging structure 10. In addition, the stepped outer side surface P3 of the package body 13 can also increase the area of the outer side surface P3, improve the heat dissipation ability of the LED packaging structure 10, and is beneficial to improving the service life of the LED packaging structure 10.

[0043] Continuing to refer to Figure 3 and Figure 4 , in this embodiment, the conductive structure 11 includes two mutually disconnected parts. One part is a positive electrode part 16 for connecting the positive electrode of the LED chip 12, and the other part is a negative electrode part 17 for connecting the negative electrode of the LED chip 12. The positive electrode part 16 has a power connection end 15 for connecting the positive electrode of the external circuit. The negative electrode part 17 also has a power connection end 15 for connecting the negative electrode of the external circuit. The LED chip 12 can be stacked on the conductive structure 11.

[0044] The accommodation hole K1 surrounded by the package body 13 and the conductive structure 11 is filled with glue to form a sealing body 14 to seal the LED chip 12 inside the LED packaging structure 10. The sealing body 14 can be made of a light-transmitting material. In this way, the light emitted by the LED chip 12 can pass through the sealing body 14. A fluorescent layer can be provided on the outer surface of the sealing body 14.

[0045] Figure 5 The Figure 1 front view of the LED packaging structure 10. Figure 6 The Figure 5 cross-sectional view of the LED packaging structure 10 along line B-B.

[0046] Referring to Figure 6 and Figure 1 , in this embodiment, the surface on one side of the outer side surface P3 of the encapsulation body 13 is the mounting side surface P4, and the mounting side surface P4 is stepped. The mounting side surface P4 includes a first surface area P5, a second surface area P6, and a step surface P7, and the step surface P7 is connected between the first surface area P5 and the second surface area P6. Optionally, both the first surface area P5 and the second surface area P6 are parallel to the light-emitting direction of the LED packaging structure 10, and the step surface P7 is perpendicular to the first surface area P5 and the second surface area P6. The second surface area P6 is concave relative to the first surface area P5.

[0047] Figure 7 The perspective view of one part of the conductive structure 11 in 3 (taking the positive electrode part 16 as an example). Figure 8 The Figure 5 cross-sectional view along line C-C.

[0048] Referring to Figure 6 and Figure 7 , the positive electrode part 16 of the conductive structure 11 includes a conductive plate 24 and a power connection end 15.

[0049] The power connection end 15 is located at the junction of the bottom surface P2 of the encapsulation body 13 and the second surface area P6, and is exposed from the bottom surface P2 and the second surface area P6 of the encapsulation body 13 respectively.

[0050] The power connection end 15 has a first exposed surface P8 exposed from the bottom surface P2 of the encapsulation body 13 and a second exposed surface P9 exposed from the second surface area P6. The power connection end 15 is provided with a notch C1, and the notch C1 penetrates through the first exposed surface P8 and the second exposed surface P9. The notch C1 can increase the welding surface of the power connection end 15, which is beneficial to the welding reliability of the power connection end 15. In addition, the space provided by the notch C1 can accommodate the solder 130 (seen in Figure 10 ), which can reduce the possibility of the solder 130 overflowing from the first exposed surface P8 and the second exposed surface P9.

[0051] Optionally, the notch C1 is in a quarter-spherical shape, and the center of the sphere is located on the intersection line L1 of the first exposed surface P8 and the second exposed surface P9. The notch C1 of this shape is beneficial to accommodating the solder 130 and has a large welding surface.

[0052] The power connection terminal 15 protrudes from one side of the conductive plate 24 and protrudes towards the bottom surface P2 of the encapsulation body 13. The conductive structure 11 further includes one or more exposed blocks 19, and the exposed blocks 19 protrude outward from the side surface of the conductive plate 24 and are exposed on the outer side surface P3 of the encapsulation body 13. For example Figure 7 in, the conductive plate 24 of the positive electrode part 16 of the conductive structure 11 is substantially rectangular, and the power connection terminal 15 and the two exposed blocks 19 respectively protrude from three sides of the rectangular conductive plate 24, and the other side of the rectangular conductive plate 24 corresponds to the negative electrode part 17 of the conductive plate 24 (seen in Figure 3 ).

[0053] See Figure 8 , when the conductive structure 11 is encapsulated in the encapsulation body 13, the power connection terminals 15 and the exposed blocks 19 on the positive electrode part 16 and the negative electrode part 17 respectively expose to each side of the encapsulation body 13, which is beneficial to the reliable combination of the encapsulation body 13 and the conductive structure 11 on each side, and is beneficial to the heat dissipation of the conductive structure 11 on each side of the encapsulation body 13, and is beneficial to improving the integrity and heat dissipation capacity of the LED encapsulation structure 10.

[0054] Optionally, the conductive plate 24 of this embodiment includes a substrate 20 and a downward convex part 21. The downward convex part 21 is formed by protruding downward from one side of the substrate 20 close to the power connection terminal 15, and the power connection terminal 15 protrudes downward relative to the downward convex part 21. The substrate 20 and the downward convex part 21 of the conductive plate 24 form a stepped shape, which is beneficial to improving the reliable combination of the conductive plate 24 and the encapsulation body 13, and improving the accuracy of the relative position of the encapsulation body 13 and the conductive plate 24 through step limiting.

[0055] In this embodiment, the encapsulation body 13 includes a first part 22 and a second part 23. The first part 22 is located on one side of the second part 23 along the thickness direction Z (parallel to the light emitting direction of the LED chip 12) of the LED encapsulation structure 10. The conductive structure 11 is coated on the first part 22, and the second part 23 protrudes outward laterally relative to the first part 22, so that the outer side surface P3 of the encapsulation body 13 is stepped. The conductive structure 11 has a support surface P10 facing away from the bottom surface P2 of the encapsulation body 13. The second part 23 is provided with a receiving hole K1 penetrating along the thickness direction Z, and the receiving hole K1 penetrates to the support surface P10. The LED chip 12 is supported on the support surface P10. And, the receiving hole K1 is filled with a sealing body 14 to seal the LED chip 12 in the receiving hole K1. In this embodiment, the support surface P10 and the step surface P7 of the conductive plate 24 are coplanar. In this way, it is more beneficial to release the thermal stress during the encapsulation or use of the LED encapsulation structure 10.

[0056] Figure 9 It is a schematic diagram of the light emitting component 100 of this embodiment. Figure 10 It is Figure 9 a cross-sectional view along the line D-D.

[0057] See Figure 9 and Figure 10 , this embodiment also provides a lighting component 100. The lighting component 100 can be, for example, an LED strip.

[0058] In this embodiment, the lighting component 100 includes a circuit board 110 and at least one of the above-mentioned LED packaging structures 10. The circuit board 110 can be a flexible circuit board or a rigid PCB board. The circuit board 110 has pads 111, and the pads 111 are used for soldering connection with the power connection ends 15 of the LED packaging structure 10 through solder 130.

[0059] For example, the circuit board 110 is strip-shaped, and the lighting component 100 includes a plurality of LED packaging structures 10, and the plurality of LED packaging structures 10 are arranged at intervals along the length direction of the circuit board 110.

[0060] The power connection ends 15 of the LED packaging structure 10 are soldered to the pads 111 of the circuit board 110, so that the LED chips 12 are electrically connected to the circuit board 110.

[0061] Optionally, the lighting component 100 further includes a light guide plate 120, and the light incident surface P12 of the light guide plate 120 corresponds to the light emitting surface P11 of the LED packaging structure 10. In this way, the light emitted by the LED packaging structure 10 can be guided by the light guide plate 120.

[0062] When the LED packaging structure 10 of this embodiment is installed on the circuit board 110, the first surface area P5 is superposed on a circuit board 110. Since the second surface area P6 is concave relative to the first surface area P5, there is a gap f1 between the second surface area P6 and the circuit board 110. The power connection ends 15 are exposed from the second surface area P6. In this way, when the power connection ends 15 are soldered to the circuit board 110 through solder 130, the first surface area P5 can be flatly superposed on the circuit board 110. If too much solder 130 is applied during soldering, the excess solder 130 can be accommodated in the gap f1, which can prevent the excess solder 130 from lifting the second surface area P6 and causing the LED packaging structure 10 to be unevenly installed on the circuit board 110.

[0063] Moreover, for the power connection ends 15 with the cut C1 opened, the excess solder 130 can also be accommodated in the cut C1, which is beneficial to preventing the solder 130 from overflowing, and the soldering surface of the solder 130 and the power connection ends 15 is large, which is beneficial to ensuring reliable soldering between the power connection ends 15 and the circuit board 110.

[0064] In addition, the materials of the power connection terminal 15 (such as metal) and the encapsulation body 13 (such as plastic) are different, which may cause different deformation amounts when the LED encapsulation structure 10 is heated during encapsulation or use, resulting in the power connection terminal 15 protruding from the second surface area P6 and making the second surface area P6 uneven. In this embodiment, by making the second surface area P6 concave relative to the first surface area P5, the gap f1 between the second surface area P6 and the circuit board 110 can accommodate the protruding power connection terminal 15, avoiding the uneven installation of the LED encapsulation structure 10 caused by the unevenness of the power connection terminal 15.

[0065] In this way, the LED encapsulation structure 10 of this embodiment can ensure that the LED encapsulation structure 10 is installed flat on the circuit board 110, ensuring that the light emitted by the LED encapsulation structure 10 can enter the light guide plate 120 in an accurate direction (such as the direction perpendicular to the light incident surface P12 of the light guide plate 120), which is beneficial to improving the light-emitting effect (such as light uniformity) of the light-emitting component 100.

[0066] Embodiment Two Figure 11 It is a perspective view of an LED encapsulation structure 10a of another embodiment. Figure 12 It is Figure 11 Another perspective view of the LED encapsulation structure 10a. Figure 13 It is Figure 11 A top view of the LED encapsulation structure 10a. Figure 14 It is Figure 11 A bottom view of the LED encapsulation structure 10a. The LED encapsulation structure 10a is a positive-emitting LED. Figure 15 It is Figure 11 An exploded view of the LED encapsulation structure 10a. Figure 16 It is Figure 13 A cross-sectional view of the LED encapsulation structure 10a along the line E-E.

[0067] Refer to Figures 11 - 16 As shown, the LED encapsulation structure 10a includes a conductive structure 11, an LED chip 12, an encapsulation body 13, and a sealing body 14. The LED chip 12 is electrically connected to the conductive structure 11. For example, the LED chip 12 is electrically connected to the conductive structure 11 through a conductive lead 18. The encapsulation body 13 covers the conductive structure 11. The encapsulation body 13 has a top surface P1 and a bottom surface P2 opposite to the LED chip 12, and an outer side surface P3 connecting between the top surface P1 and the bottom surface P2; the outer side surface P3 is stepped.

[0068] The conductive structure 11 includes two disconnected parts, one of which is a positive electrode part 16 for connecting the positive electrode of the LED chip 12, and the other is a negative electrode part 17 for connecting the negative electrode of the LED chip 12. Both the positive electrode part 16 and the negative electrode part 17 of the conductive structure 11 have a conductive plate 24 and a power connection end 15. The LED chip 12 is disposed on one side surface of the conductive plate 24 and is electrically connected to the conductive plate 24.

[0069] The power connection end 15 protrudes from the side surface of the conductive plate 24 facing away from the LED chip 12 and is exposed on the bottom surface P2 of the encapsulation body 13; moreover, the power connection end 15 is recessed in the circumferential direction relative to the conductive plate 24, so that the conductive structure 11 is in a stepped shape.

[0070] The conductive structure 11 further includes one or more exposed blocks 19; the exposed blocks 19 protrude outward from the side surface of the conductive plate 24 and are exposed on the outer side surface P3 of the encapsulation body 13.

[0071] The outer side surface P3 has a stepped surface P13 facing the thickness direction Z of the LED encapsulation structure 10a, and the exposed blocks 19 are at least partially exposed on the stepped surface P13. In this way, the exposed blocks 19 have a larger exposed area, which is conducive to improving the heat dissipation ability of the LED encapsulation structure 10a through the exposed blocks 19 to the outside.

[0072] In this embodiment, the encapsulation body 13 includes a first part 22 and a second part 23. The first part 22 is located on one side of the second part 23 along the thickness direction Z (parallel to the light-emitting direction of the LED chip 12) of the LED encapsulation structure 10. The conductive structure 11 is coated on the first part 22, and the second part 23 is recessed inward along the side relative to the first part 22, so that the outer side surface P3 of the encapsulation body 13 is in a stepped shape. The conductive structure 11 has a support surface P10 facing away from the bottom surface P2 of the encapsulation body 13. The second part 23 is provided with an accommodation hole K1 penetrating along the thickness direction Z, and the accommodation hole K1 penetrates to the support surface P10. The LED chip 12 is supported on the support surface P10. Moreover, the accommodation hole K1 is filled with a sealing body 14 to seal the LED chip 12 in the accommodation hole K1. In this embodiment, the support surface P10 and the stepped surface P13 of the conductive plate 24 are coplanar. In this way, it is more conducive to the release of thermal stress during the encapsulation or use of the LED encapsulation structure 10a.

[0073] The above embodiments are only used to illustrate the technical solutions of the present application rather than to limit them. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. An LED packaging structure, characterized in that, Comprising: A conductive structure; An LED chip, conductively connected to the conductive structure; And, An encapsulation body, covering the conductive structure; The encapsulation body has a top surface and a bottom surface opposite to the LED chip, and a lateral surface connecting between the top surface and the bottom surface; the lateral surface is stepped; Wherein, the conductive structure has a power connection end, and the power connection end is exposed from the encapsulation body.

2. The LED encapsulation structure according to claim 1, wherein: The LED encapsulation structure is a side-emitting type LED; The lateral surface of the encapsulation body includes a mounting lateral surface, and the mounting lateral surface is stepped; The mounting lateral surface includes a first surface area, a second surface area, and a step surface, and the step surface is connected between the first surface area and the second surface area; The second surface area is recessed relative to the first surface area, so that when the first surface area is stacked on a circuit board, there is a gap between the second surface area and the circuit board; The power connection end is exposed from the second surface area.

3. The LED encapsulation structure according to claim 2, wherein: The power connection end is located at the junction of the bottom surface of the encapsulation body and the second surface area, and is respectively exposed from the bottom surface of the encapsulation body and the second surface area.

4. The LED encapsulation structure according to claim 3, wherein: The power connection end includes a first exposed surface exposed from the bottom surface of the encapsulation body and a second exposed surface exposed from the second surface area; The power connection end is provided with a notch, and the notch penetrates through the first exposed surface and the second exposed surface.

5. The LED encapsulation structure according to claim 4, wherein: The notch is in a quarter-spherical shape, and the center of the sphere is located on the intersection line of the first exposed surface and the second exposed surface.

6. The LED encapsulation structure according to claim 4, wherein: The conductive structure further includes a conductive plate; the LED chip is disposed on one side surface of the conductive plate and is conductively connected to the conductive plate; The power connection end protrudes from one side of the conductive plate and protrudes toward the bottom surface side of the encapsulation body; The conductive structure further includes one or more exposed blocks; the exposed blocks protrude from the side surface of the conductive plate and are exposed from the lateral surface of the encapsulation body.

7. The LED encapsulation structure according to claim 1, wherein: The LED encapsulation structure is a front-emitting LED; The conductive structure further includes a conductive plate, the LED chip is disposed on one side surface of the conductive plate and is conductively connected to the conductive plate; The power connection end protrudes from the side surface of the conductive plate facing away from the LED chip and is exposed from the bottom surface of the encapsulation body; and, the power connection end is recessed in the circumferential direction relative to the conductive plate, so that the conductive structure is stepped; The conductive structure further includes one or more exposed blocks; the exposed blocks protrude from the side surface of the conductive plate and are exposed from the lateral surface of the encapsulation body; The lateral surface has a step surface facing the thickness direction of the LED encapsulation structure, and at least a part of the exposed block is exposed from the step surface.

8. The LED encapsulation structure according to any one of claims 1-7, wherein: The encapsulation body includes a first part and a second part, and the first part is located on one side of the second part along the thickness direction of the LED encapsulation structure; The conductive structure is coated on the first part, and the second part protrudes or concaves outward or inward relative to the first part along the side, so that the outer side surface of the encapsulation body is stepped; The conductive structure has a support surface facing away from the bottom surface of the encapsulation body; The second part is provided with a receiving hole penetrating along the thickness direction, and the receiving hole penetrates to the support surface; The LED chip is supported on the support surface; and, the receiving hole is filled with a sealing body.

9. A light-emitting component, characterized in that, Comprising: A circuit board; And, At least one LED encapsulation structure according to any one of claims 1-8; the power connection end of the LED encapsulation structure is welded to the circuit board, so that the LED chip is electrically connected to the circuit board.

10. The light-emitting component according to claim 9, wherein: The light-emitting component further includes a light guide plate, and the light incident surface of the light guide plate corresponds to the light-emitting surface of the LED encapsulation structure.

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