Pressure sintering equipment and application method thereof

Abstract

The invention discloses pressure sintering equipment and an application method thereof.The method comprises the steps that S1, preheating is conducted, specifically, a ceramic copper-clad plate loaded with a sintering material and an electronic element is preheated in a preheating bin through a heating system; s2, sintering is carried out, specifically, the preheated ceramic copper-clad plate is conveyed from the preheating bin to a sintering bin, sintering is carried out through a heating system and a pressurizing system, and a compact bonding surface is formed among the electronic element, a sintering material and the ceramic copper-clad plate; s3, cooling: cooling the sintered ceramic copper-clad plate through a cooling system; and S4, after cooling is completed, the cooling system stops working, the pressurization system releases pressure, and the carrier transports the completed ceramic copper-clad plate to the outside of the bin through the conveying belt. According to the pressure sintering equipment and the application method thereof, pressure is applied in the sintering stage and the cooling stage, so that the warping degree of the sintered ceramic copper-clad plate is effectively reduced, and the flatness and quality of a product are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of sintering, and particularly relates to a pressure sintering device and an application method thereof. Background Art

[0002] Traditional sintering devices usually apply pressure and temperature during the sintering stage to promote the diffusion of sintered materials and achieve the bonding of components and ceramic copper clad laminates. However, during the cooling stage, the pressure is usually released, and the ceramic copper clad laminate is cooled by water cooling or air cooling. Due to the release of thermal stress and uneven material shrinkage, the ceramic copper clad laminate often warps, affecting the flatness of the product and subsequent processing. In the prior art, although the warping can be improved by designing the copper thickness of the ceramic copper clad laminate, the effect is limited and the warping problem cannot be completely solved.

[0003] Therefore, in view of the above problems, further improvements are made. Summary of the Invention

[0004] The main object of the present invention is to provide a pressure sintering device and an application method thereof, which effectively reduce the warping degree of the ceramic copper clad laminate after sintering by applying pressure during both the sintering and cooling stages, and improve the flatness and quality of the product.

[0005] To achieve the above object, the present invention provides an application method of a pressure sintering device, including the following steps:

[0006] Step S1: Preheat. The ceramic copper clad laminate carrying the sintered material and electronic components is preheated in the preheating chamber through a heating system.

[0007] Step S2: Sinter. The preheated ceramic copper clad laminate is transferred from the preheating chamber to the sintering chamber and sintered through a heating system and a pressurizing system to form a dense bonding surface between the electronic components, the sintered material and the ceramic copper clad laminate.

[0008] Step S3: Cool. The sintered ceramic copper clad laminate is cooled through a cooling system.

[0009] Step S4: After cooling is completed, the cooling system stops working, the pressurizing system releases the pressure, and the carrier transports the completed ceramic copper clad laminate out of the chamber through a conveyor belt.

[0010] As a further preferred technical solution of the above technical solution, for step S1:

[0011] Place the ceramic copper clad laminate carrying the sintered material and electronic components in a carrier. The carrier enters the preheating chamber (i.e., the preheating zone) through a conveyor belt (i.e., the loading platform). The sensor in the preheating chamber senses the entry of the material into the preheating chamber. First, start to evacuate the air (to 1 mbar), and then fill with nitrogen gas (to 1000 mbar) after the evacuation is complete. After the nitrogen filling is completed, the heating system raises the temperature to the preheating temperature (about 60% of the sintering temperature, about 150 degrees Celsius). The heating and preheating processes continue for the preheating time (180 seconds), thus avoiding cracking of the material caused by too rapid heating and facilitating the volatilization of the organic matter in the welding material.

[0012] As a further preferred technical solution of the above technical solution, for step S2:

[0013] After the preheating time ends, the carrier automatically enters the sintering chamber through the conveyor belt. The sensor in the sintering chamber senses the entry of the material into the sintering chamber. First, start to evacuate the air (to 1 mbar), and then fill with nitrogen gas (to 1000 mbar) after the evacuation is complete. After the nitrogen filling is completed, the heating system raises the temperature to the sintering temperature (252 degrees Celsius). The heating process continues for the first time (120 seconds). Finally, the pressurizing system applies a preset pressure (14 MPa) to the ceramic copper clad laminate, and this process is maintained for the second time (490 seconds), thereby promoting the diffusion between the sintered material and the substrate and forming a dense bonding surface among the electronic components, sintered material, and ceramic copper clad laminate.

[0014] As a further preferred technical solution of the above technical solution, for step S3:

[0015] After the sintering pressure is continuously applied for the third time (250 seconds), the heating system stops working, and the cooling system starts to work. The ceramic copper clad laminate is cooled to room temperature by injecting (18 degrees Celsius) cooling circulating water, and the cooling time continues for the fourth time (240 seconds), thereby preventing the ceramic copper clad laminate from warping due to the release of thermal stress and uneven material shrinkage.

[0016] As a further preferred technical solution of the above technical solution, control the parameters including the preheating temperature of the preheating chamber, the concentration of relevant gases, the concentration of relevant gases in the sintering chamber, the heating and cooling temperatures in the sintering chamber, the sintering pressure, and the working time through the control system to ensure the stability and consistency of the whole process.

[0017] As a further preferred technical solution of the above technical solution, for step S1, the evacuation rate is 50 mbar / s, and the nitrogen filling rate is 50 mbar / s;

[0018] For step S2, the material is automatically transferred to the sintering chamber, the transfer rate is 5 cm / s, and the transfer time is 20 seconds;

[0019] For step S3: The vacuum pumping rate is 50 mbar / s, and the nitrogen filling rate is 50 mbar / s;

[0020] For step S4: The carrier is automatically transferred to the unloading platform at a transfer rate of 5 cm / s for a transfer time of 15 seconds.

[0021] To achieve the above objectives, the present invention also provides a pressure sintering device, including a heating system, a pressurizing system, a cooling system, and a control system.

[0022] The beneficial effects of the present invention are as follows:

[0023] 1. Reducing warping: By applying pressure during both the sintering and cooling stages, the warping phenomenon of the ceramic copper clad laminate caused by thermal stress and uneven material shrinkage is effectively reduced.

[0024] 2. Improving flatness: Ensuring that the ceramic copper clad laminate remains flat throughout the process, improving the quality of the product and the accuracy of subsequent processing.

[0025] 3. Automatic control: The control system can monitor and adjust parameters in real time, ensuring the stability and consistency of the entire process and reducing the errors of manual operation. Brief Description of the Drawings

[0026] Figure 1 is a schematic diagram of the pressure sintering device of the present invention.

[0027] Figure 2 is a flowchart of the application of the present invention. Detailed Embodiments

[0028] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description can be applied to other implementation schemes, deformation schemes, improvement schemes, equivalent schemes, and other technical schemes without departing from the spirit and scope of the present invention.

[0029] In the preferred embodiment of the present invention, those skilled in the art should note that the ceramic copper clad laminate and the like involved in the present invention can be regarded as the prior art.

[0030] Preferred embodiment.

[0031] The present invention discloses an application method of a pressure sintering device, including the following steps:

[0032] As Figure 1-2 shown, step S1: Preheat the ceramic copper clad laminate carrying the sintering material and electronic components in the preheating chamber through the heating system;

[0033] Step S2: Sintering. Transfer the preheated ceramic copper clad laminate from the preheating chamber to the sintering chamber, and perform sintering through the heating system and the pressurizing system to form a dense bonding surface between the electronic components, the sintering material, and the ceramic copper clad laminate.

[0034] Step S3: Cooling. Cool the sintered ceramic copper clad laminate through the cooling system.

[0035] After cooling is completed, the cooling system stops working, the pressurizing system releases the pressure, and the carrier transports the completed ceramic copper clad laminate out of the chamber through the conveyor belt.

[0036] Specifically, for Step S1:

[0037] Place the ceramic copper clad laminate carrying the sintering material and electronic components in the carrier. The carrier enters the preheating chamber (i.e., the preheating zone) through the conveyor belt (i.e., the loading platform). The sensor in the preheating chamber senses the entry of the material into the preheating chamber. First, start to evacuate the air (to 1 mbar), then fill with nitrogen (to 1000 mbar) after the evacuation is complete. After filling with nitrogen, the heating system raises the temperature to the preheating temperature (about 60% of the sintering temperature, about 150 degrees Celsius). The heating-up and preheating processes last for the preheating time (180 seconds), thus avoiding cracking of the material caused by too rapid heating and facilitating the volatilization of the organic matter in the welding material.

[0038] More specifically, for Step S2:

[0039] After the preheating time ends, the carrier automatically enters the sintering chamber through the conveyor belt. The sensor in the sintering chamber senses the entry of the material into the sintering chamber. First, start to evacuate the air (to 1 mbar), then fill with nitrogen (to 1000 mbar) after the evacuation is complete. After filling with nitrogen, the heating system raises the temperature to the sintering temperature (252 degrees Celsius). The heating-up process lasts for the first time (120 seconds). Finally, the pressurizing system applies a preset pressure (14 MPa) to the ceramic copper clad laminate, and this process lasts for the second time (490 seconds), thereby promoting the diffusion between the sintering material and the substrate and forming a dense bonding surface between the electronic components, the sintering material, and the ceramic copper clad laminate.

[0040] Furthermore, for Step S3:

[0041] After the sintering pressure is continuously applied for the third time (250 seconds), the heating system stops working, and the cooling system starts to work. The ceramic copper clad laminate is cooled to room temperature by injecting (18 degrees Celsius) cooling circulating water, and the cooling time lasts for the fourth time (240 seconds), thereby preventing the ceramic copper clad laminate from warping due to the release of thermal stress and uneven material shrinkage.

[0042] Furthermore, by controlling the preheating temperature of the preheating chamber, the concentration of relevant gases, the concentration of relevant gases in the sintering chamber, the heating and cooling temperatures in the sintering chamber, the sintering pressure, and the working time through the control system, the stability and consistency of the entire process are ensured.

[0043] Preferably, for step S1, the vacuum pumping rate is 50 mbar / s, and the nitrogen filling rate is 50 mbar / s;

[0044] For step S2, the material is automatically transferred to the sintering chamber at a transfer rate of 5 cm / s and a transfer time of 20 seconds;

[0045] For step S3: the vacuum pumping rate is 50 mbar / s, and the nitrogen filling rate is 50 mbar / s;

[0046] For step S4: the carrier is automatically transferred to the blanking platform at a transfer rate of 5 cm / s and a transfer time of 15 seconds.

[0047] The present invention also discloses a pressure sintering device, including a heating system, a pressurizing system, a cooling system, and a control system, wherein:

[0048] The heating system: is used to provide a high-temperature environment required for preheating and sintering, ensure the diffusion between the sintered material and the substrate, and form a stronger interfacial bond.

[0049] The pressurizing system: includes pressure application devices in the sintering stage and the cooling stage, ensures the uniformity and density of the sintered material, and at the same time prevents warping of the ceramic copper clad laminate caused by the release of thermal stress.

[0050] The cooling system: is used to quickly cool the ceramic copper clad laminate after sintering is completed, while maintaining the application of pressure to prevent warping caused by thermal stress.

[0051] The control system: is used to precisely control the gas concentration in the chamber, the heating and cooling temperatures of the platform, the sintering pressure, the working time, etc., to ensure the stability and consistency of the entire process.

[0052] It is worth mentioning that the technical features such as the ceramic copper clad laminate involved in this invention patent application should be regarded as the prior art. The specific structure, working principle, and possible control methods and spatial arrangement methods involved in these technical features can be selected conventionally in the art, and should not be regarded as the invention points of this invention patent. This invention patent will not be further specifically elaborated.

[0053] For those skilled in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for applying a pressure sintering device, characterized in that, It includes the following steps: Step S1: Preheat. Place the ceramic copper clad laminate carrying the sintering material and electronic components in the preheating chamber and preheat it through the heating system. Step S2: Sinter. Transfer the preheated ceramic copper clad laminate from the preheating chamber to the sintering chamber and sinter it through the heating system and the pressure system to form a dense bonding surface between the electronic components, the sintering material and the ceramic copper clad laminate. Step S3: Cool. Cool the sintered ceramic copper clad laminate through the cooling system. After cooling is completed, the cooling system stops working, the pressure system releases the pressure, and the carrier transports the completed ceramic copper clad laminate out of the chamber through the conveyor belt.

2. The application method of a pressure sintering device according to claim 1, characterized in that Regarding Step S1: Place the ceramic copper clad laminate carrying the sintering material and electronic components in the carrier. The carrier enters the preheating chamber through the conveyor belt. The sensor in the preheating chamber senses the entry of the material into the preheating chamber. First, start to evacuate the air. After evacuating the air, then fill it with nitrogen. After filling with nitrogen, the heating system raises the temperature to the preheating temperature. The heating-up and preheating processes last for the preheating time, thus avoiding cracking of the material caused by too rapid heating and facilitating the volatilization of the organic matter in the welding material.

3. The application method of a pressure sintering device according to claim 2, characterized in that, Regarding Step S2: After the preheating time ends, the carrier automatically enters the sintering chamber through the conveyor belt. The sensor in the sintering chamber senses the entry of the material into the sintering chamber. First, start to evacuate the air. After evacuating the air, then fill it with nitrogen. After filling with nitrogen, the heating system raises the temperature to the sintering temperature. The heating-up process lasts for the first time. Finally, the pressure system applies a preset pressure to the ceramic copper clad laminate, and this process lasts for the second time, thereby promoting the diffusion between the sintering material and the substrate and forming a dense bonding surface between the electronic components, the sintering material and the ceramic copper clad laminate.

4. The application method of a pressure sintering device according to claim 3, characterized in that, Regarding Step S3: After the sintering pressure is continuously applied for the third time, the heating system stops working and the cooling system starts to work. Inject cooling circulating water to cool the ceramic copper clad laminate to room temperature. The cooling time lasts for the fourth time, thereby preventing the ceramic copper clad laminate from warping due to the release of thermal stress and uneven material shrinkage.

5. The application method of a pressure sintering device according to claim 4, characterized in that, Control the parameters including the preheating temperature of the preheating chamber and the concentration of relevant gases, the concentration of relevant gases in the sintering chamber, the heating and cooling temperatures in the sintering chamber, the sintering pressure and the working time through the control system to ensure the stability and consistency of the whole process.

6. The application method of a pressure sintering device according to claim 5, characterized in that, Regarding Step S1, the evacuation rate is 50 mbar / s, and the nitrogen filling rate is 50 mbar / s. Regarding Step S2, the material is automatically transferred to the sintering chamber, the transfer rate is 5 cm / s, and the transfer time is 20 seconds. Regarding Step S3: the evacuation rate is 50 mbar / s, and the nitrogen filling rate is 50 mbar / s. Regarding Step S4: the carrier is automatically transferred to the blanking platform, the transfer rate is 5 cm / s, and the transfer time is 15 seconds.

7. A pressure sintering device, which is applied to the application method of a pressure sintering device according to any one of claims 1-6, is characterized in that, It includes a heating system, a pressure system, a cooling system and a control system.

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