Double-sided visual positioning device, wafer aging test device and visual positioning method

Abstract

The invention provides a double-sided visual positioning device, a wafer aging test device and a visual positioning method, which are applied to semiconductor test equipment, the double-sided visual positioning device is arranged between a wafer to be tested and a probe plate, the double-sided visual positioning device comprises a visual system, and the visual system comprises a camera and a light path conversion structure, the light path conversion structure comprises a first light incident port, a second light incident port and a light emergent port, the light emergent port faces the incident direction of the camera, the first light incident port faces the probe plate, and the second light incident port faces the wafer to be detected; and the light path conversion structure is used for transmitting an image formed by the wafer to be detected or the probe plate to the camera. According to the invention, the complexity and cost of the system are reduced, and meanwhile, the alignment precision is remarkably improved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer testing, and particularly to a double-sided vision positioning device, a wafer aging test device, and a vision positioning method. Background Art

[0002] In the semiconductor manufacturing process, testing is a crucial link, which is directly related to the quality and performance of chips. Among them, wafer testing, as one of the key steps in the semiconductor manufacturing process, requires high-precision alignment and contact between the pads on the wafer and the probes on the probe board. This precise alignment is of great significance for ensuring the accuracy of test data, reducing the mismeasurement rate, and improving production efficiency.

[0003] In the prior art, the vision system used to achieve this alignment process usually adopts a scheme of two sets of cameras, upper and lower. Among them, the upper camera is responsible for photographing the positions of the pads on the wafer, and the lower camera is used to capture the positions of the probes on the probe board. By calibrating these two sets of cameras together, the relative position relationship between the pads and the probes can be calculated, so as to guide the precision mechanical system to adjust the positions of the probes and the pads to make them accurately aligned and contacted. Although this method can meet the alignment requirements to a certain extent, it relies on two independent imaging units, which not only increases the complexity and cost of the system, but also limits the final alignment accuracy due to factors such as optical distortion and mechanical installation errors. Summary of the Invention

[0004] In order to solve at least one of the above-mentioned disadvantages of the prior art, the present application provides a double-sided vision positioning device applied to semiconductor test equipment. The double-sided vision positioning device is arranged between the wafer to be tested and the probe board. The double-sided vision positioning device includes a vision system, and the vision system includes:

[0005] A camera;

[0006] An optical path conversion structure, the optical path conversion structure includes a first light incident port, a second light incident port, and a light exit port, and the light exit port faces the incident direction of the camera; the first light incident port faces the probe board, and the second light incident port faces the wafer to be tested; the optical path conversion structure is used to emit the image formed by the wafer to be tested or the probe board to the camera.

[0007] Optionally, the orientation of the first light incident port is perpendicular to the exit direction of the light exit port, and the orientation of the second light incident port is perpendicular to the exit direction of the light exit port; light sources are respectively arranged on two surfaces of the optical path conversion structure facing the wafer to be tested and the probe board.

[0008] Optionally, the vision system further includes a slide table, the camera is connected to the slide table, and the slide table is used to adjust the distance between the camera and the optical path conversion structure in the incident direction of the camera.

[0009] Optionally, the double-sided vision positioning device further includes a driving mechanism, and the driving mechanism is used to drive the vision system to move in a first plane; the wafer to be tested and the probe board are distributed relatively along a first direction, and the first direction is perpendicular to the first plane.

[0010] Optionally, the driving mechanism includes a first driving module arranged oppositely, and a second driving module slidably connected to the oppositely arranged first driving module. The oppositely arranged first driving module is used to drive the second driving module to move along a second direction; the vision system is slidably connected to the second driving module, and the second driving module is used to drive the vision system to move along a third direction, and the second direction and the third direction are perpendicular to each other in the first plane.

[0011] Optionally, the travel range of the second driving module in the second direction matches the size of the wafer to be tested; the travel range of the vision system in the third direction matches the size of the wafer to be tested.

[0012] Optionally, the second driving module includes a guiding component, and the second driving module includes a matching sliding member and guiding member; the guiding member is arranged along the third direction, and both ends of the guiding member are slidably connected to the oppositely arranged first driving module; the vision system is fixedly connected to the guiding member, and the sliding member is slidably connected to the guiding member for driving the vision system to slide along the guiding member, and the travel range of the sliding member matches the size of the wafer to be tested.

[0013] Optionally, the second driving module further includes a second module drag chain and a drag chain support plate arranged along the third direction; the second module drag chain is installed in the drag chain support plate; the sliding member is fixedly connected to the second module drag chain, and the drag chain support plate is fixedly connected to the guiding member.

[0014] Optionally, the first driving module includes a guide rail arranged along the second direction, and a pair of limiting portions connected to the guide rail, and the distance between the pair of limiting portions matches the size of the wafer to be tested.

[0015] On the other hand, the present application provides a wafer aging test device, including:

[0016] A frame, on which a probe board is arranged, and the probe board is parallel to the first plane;

[0017] A heat sink assembly that carries the wafer under test. When the heat sink assembly is clamped with the probe board, a test cavity is formed.

[0018] An alignment mechanism that is used to carry the heat sink assembly so that the wafer under test and the probe board are distributed relative to each other in a first direction; the first direction is perpendicular to the first plane.

[0019] An optional double-sided vision positioning device as described above, located between the probe board and the alignment mechanism and connected to the frame; the vision positioning device is used to obtain the position information of the wafer under test and the probe board, and the alignment mechanism is used to adjust the position of the wafer under test according to the position information of the wafer under test and the probe board obtained by the vision positioning device.

[0020] Optionally, a vision positioning space is formed between the probe board and the alignment mechanism. The double-sided vision positioning device is slidably connected to the frame, and the double-sided vision positioning device is controlled to slide between a first position and a second position. The first position is within the vision positioning space, and the second position is outside the vision positioning space.

[0021] The double-sided vision positioning device is configured to obtain the position information of the wafer under test and the probe board at the first position, and slide to the second position after the alignment mechanism completes the position adjustment of the wafer under test; the alignment mechanism is configured to control the heat sink assembly carrying the wafer under test to move in the first direction to approach the probe board and form a test cavity by clamping with the probe board after the double-sided vision positioning device slides to the second position.

[0022] On the other hand, the present application provides a vision positioning method applied to the wafer aging test device as described above. The method includes:

[0023] Controlling the vision positioning device to obtain the position information of at least two first preset marking points on the probe board and the position information of second preset marking points corresponding to each of the first preset marking points on the wafer under test.

[0024] Based on the position information of the at least two first preset marking points and the corresponding position information of the second preset marking points, controlling the alignment mechanism to adjust the position of the wafer under test.

[0025] Optionally, the controlling the vision positioning device to obtain the position information of at least two first preset marking points on the probe board and the position information of second preset marking points corresponding to each of the first preset marking points on the wafer under test includes:

[0026] Turn on the light source on the side of the optical path conversion structure facing the probe board so that the image formed by the probe board is emitted to the camera;

[0027] For each of the first preset marking points, control the vision system to move in the first plane so that the image formed by at least the first preset marking point on the probe board is emitted to the camera, and obtain the position information of the first preset marking point;

[0028] Turn off the light source on the side of the optical path conversion structure facing the probe board;

[0029] Turn on the light source on the side of the optical path conversion structure facing the wafer to be measured so that the image formed by the wafer to be measured is emitted to the camera;

[0030] For each of the second preset marking points, control the vision system to move in the first plane so that the image formed by at least the second preset marking point on the wafer to be measured is emitted to the camera, and obtain the position information of the second preset marking point.

[0031] Optionally, when the light source on the side of the optical path conversion structure facing the probe board is turned on, after controlling the vision system to move in the first plane, the method further includes:

[0032] Control the camera to move in the incident direction of the camera so that the optical distance between the camera and the first preset marking point matches the focal length of the camera;

[0033] Correspondingly, when the light source on the side of the optical path conversion structure facing the wafer to be measured is turned on, after controlling the vision system to move in the first plane, the method further includes:

[0034] Control the camera to move in the incident direction of the camera so that the optical distance between the camera and the second preset marking point matches the focal length of the camera.

[0035] Adopting the above technical solutions, the present application has the following beneficial effects:

[0036] The present application provides a double-sided vision positioning device, which is applied to semiconductor testing equipment. The double-sided vision positioning device is arranged between a wafer to be tested and a probe board. The double-sided vision positioning device includes a vision system, and the vision system includes a camera and an optical path conversion structure. The optical path conversion structure includes a first light incident port, a second light incident port, and a light exit port. The light exit port faces the incident direction of the camera, the first light incident port faces the probe board, and the second light incident port faces the wafer to be tested; the optical path conversion structure is used to emit the image formed by the wafer to be tested or the probe board to the camera; it is realized that one camera can capture the image information of the wafer to be tested and the probe board, which not only reduces the need for using two independent cameras in the traditional solution, reduces the complexity and cost of the system, but also significantly improves the alignment accuracy and avoids the accuracy loss caused by the calibration error between multiple imaging units.

[0037] Other features and advantages of the present application will be described in detail in the following specific implementation part. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. Among them, the same reference numerals generally represent the same components. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0039] Figure 1 is a schematic structural diagram of a vision system provided by an embodiment of the present application;

[0040] Figure 2 is a schematic structural diagram of the optical path conversion structure provided by an embodiment of the present application;

[0041] Figure 3 is a schematic principle diagram of the optical path conversion structure provided by an embodiment of the present application;

[0042] Figure 4 is a schematic structural diagram of another vision system provided by an embodiment of the present application;

[0043] Figure 5 is a schematic structural diagram of a double-sided vision positioning device provided by an embodiment of the present application;

[0044] Figure 6 is a top view of a double-sided vision positioning device provided by an embodiment of the present application;

[0045] Figure 7 is a schematic diagram of an extreme position of a vision system provided by an embodiment of the present application;

[0046] Figure 8It is a schematic diagram of another extreme position of the vision system provided by the embodiments of the present application;

[0047] Figure 9 It is a schematic structural diagram of the second driving module provided by the embodiments of the present application;

[0048] Figure 10 It is a schematic structural diagram of the first driving module provided by the embodiments of the present application;

[0049] Figure 11 It is a schematic structural diagram of the connecting piece and the sliding piece provided by the embodiments of the present application;

[0050] Figure 12 It is a schematic structural diagram of a wafer aging test device provided by the embodiments of the present application;

[0051] Figure 13 It is a front view of a wafer aging test device provided by the embodiments of the present application;

[0052] Figure 14 It is a schematic flow diagram of a vision positioning method provided by the embodiments of the present application;

[0053] Figure 15 It is a schematic flow diagram of a control method for a vision positioning device provided by the embodiments of the present application;

[0054] Figure 16 It is a schematic diagram of a preset marking point provided by the embodiments of the present application;

[0055] Figure 17 It is a schematic diagram of a heat sink assembly for carrying a wafer to be tested provided by the embodiments of the present application.

[0056] The following is a supplementary description of the drawings:

[0057] 100 - Double-sided vision positioning device, 110 - Camera, 120 - Optical path conversion structure, 121 - First light incident port, 122 - Second light incident port, 123 - Light exit port, 124 - Light source, 125 - Prism, 130 - Slide table, 140 - First driving module, 141 - Guide rail, 142 - Sliding piece, 143 - First module drag chain, 150 - Second driving module, 151 - Sliding member, 152 - Guide member, 153 - Second module drag chain, 154 - Drag chain support plate, 155 - Connecting piece, 200 - Frame, 210 - Probe board, 300 - Alignment mechanism, 400 - Wafer to be tested. Detailed implementation manners

[0058] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0059] As used herein, the term "one embodiment" or "embodiment" refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present application. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. Moreover, the terms "first", "second", etc. are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here.

[0060] The present application provides a double-sided vision positioning device 100 applied to a semiconductor test device. The double-sided vision positioning device 100 is disposed between a wafer 400 to be tested and a probe card 210. The double-sided vision positioning device 100 includes a vision system. Refer to Figure 1 , the vision system includes a camera 110, an optical path conversion structure 120, and a stage 130. Among them, the camera 110 is responsible for capturing images, usually composed of a lens, an image sensor, a processing chip, etc., and is used to convert optical signals into electrical signals, thereby generating digital images.

[0061] Refer to Figure 2, the optical path conversion structure 120 includes a first light incident port 121, a second light incident port 122, and a light exit port 123. The light exit port 123 faces the incident direction of the camera 110; the orientation of the first light incident port 121 is perpendicular to the exit direction of the light exit port 123 and is set to face the probe board 210, and the orientation of the second light incident port 122 is perpendicular to the exit direction of the light exit port 123 and is set to face the wafer under test 400; light sources 124 are respectively arranged on two surfaces of the optical path conversion structure 120 facing the wafer under test 400 and the probe board 210; the optical path conversion structure 120 is used to emit the image formed by the wafer under test 400 or the probe board 210 to the camera 110. Specifically, the function of the optical path conversion structure 120 is to convert the light from the wafer under test 400 or the probe board 210 so that it can be captured by the camera 110.

[0062] The light sources 124 are arranged as an annular light source around the first light incident port 121 and an annular light source around the second light incident port 122. The light sources 124 generally use light sources with high brightness and good uniformity, such as LED lights, etc. When imaging the probe board 210, the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 is turned on to provide sufficient illumination for the probe board 210 so that the reflected light can be captured by the optical path conversion structure 120 and transmitted to the camera 110. Similarly, when imaging the wafer under test 400, the light source 124 on the side of the optical path conversion structure 120 facing the wafer under test 400 is turned on to illuminate the wafer under test 400 so that the reflected light can be captured by the camera 110. Specifically, when it is necessary to image the probe board 210, the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 is turned on. The optical path conversion structure 120 will introduce the light reflected by the probe board 210 through the first light incident port 121, and after the internal optical path conversion, it will be emitted from the light exit port 123 and enter the camera 110. Similarly, when it is necessary to image the wafer under test 400, the light source 124 on the side of the optical path conversion structure 120 facing the wafer under test 400 is turned on. The optical path conversion structure 120 will introduce the light reflected by the wafer under test 400 through the second light incident port 122, and then emit it from the light exit port 123 and enter the camera 110. The setting of the light sources 124 ensures sufficient light during the imaging process, improves the clarity and quality of the image, thereby helping to more accurately obtain the position information of the wafer under test 400 and the probe board 210, and further improving the alignment accuracy.

[0063] When imaging the probe board 210, only the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 is turned on; when imaging the wafer under test 400, only the light source 124 on the side facing the wafer under test 400 is turned on. This can avoid interference caused by the simultaneous activation of the light sources on both sides. If the light sources on both sides are turned on simultaneously, the light from the wafer under test 400 and the probe board 210 may scatter or reflect inside the optical path conversion structure 120, resulting in interference phenomena such as ghosting and halos in the image captured by the camera 110, thus affecting the imaging quality. By only turning on the corresponding side light source, the light path can be ensured to be more single and stable, reducing optical interference and providing purer light for the camera 110, enabling the camera 110 to capture the image of the wafer under test 400 or the probe board 210 more clearly. This helps improve the accuracy of obtaining position information, thereby enhancing the alignment accuracy of the entire vision positioning system.

[0064] Reference Figure 3 , the optical path conversion structure 120 includes a prism 125, and the prism 125 is used to reflect and refract light, thereby realizing the conversion of the optical path. The prism 125 is installed inside the optical path conversion structure 120, on the optical path between the first light incident port 121 and the light exit port 123, and is used to receive the light from the first light incident port 121 and turn it towards the light exit port 123 when the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 is turned on; and the prism 125 is also on the optical path between the second light incident port 122 and the light exit port 123, and is used to receive the light from the second light incident port 122 and turn it towards the light exit port 123. Specifically, when imaging the probe board 210, the light source 124 on the side facing the probe board 210 is turned on, and the light G1 reflected by the probe board 210 enters the optical path conversion structure 120 through the first light incident port 121. The prism 125 reflects the light G1, changing its direction to form the light G2, and the light G2 exits from the light exit port 123 and enters the camera 110. The light G1 and the light G2 together form a complete optical path from the probe board 210 to the camera 110. When imaging the wafer under test 400, the light source 124 on the side facing the wafer under test 400 is turned on, and the light G3 reflected by the wafer under test 400 enters the optical path conversion structure 120 through the second light incident port 122. Part of the light will directly transmit through the prism 125 to form the light G4, and finally exit from the light exit port 123 and enter the camera 110. The light G3 and the light G4 together form a complete optical path from the wafer under test 400 to the camera 110.

[0065] Reference Figure 4, the camera 110 is connected to the sliding table 130. The sliding table 130 is used to adjust the distance between the camera 110 and the optical path conversion structure 120 in the incident direction of the camera 110 to meet different focal length requirements. Specifically, the sliding table 130 is usually composed of a guide rail, a slider, a driving motor, etc. and is used to move smoothly in the incident direction of the camera 110, driving the camera 110 mounted on it to move together. The sliding table 130 is mounted on the driving mechanism, and the camera 110 is fixed on the sliding table 130. By controlling the movement of the sliding table 130, the distance between the camera 110 and the optical path conversion structure 120 in the incident direction of the camera is adjusted. Specifically, there is a gap between the camera 110 and the optical path conversion structure 120 for this distance adjustment. The movement of the sliding table is controlled according to different test requirements and focal length requirements to ensure that the camera 110 can obtain clear images. Specifically, when imaging objects at different distances are required, for example, the distances between different marking points on the probe board 210 and the vision system in the vertical direction are different, and the distances between the marking points on the wafer 400 to be measured and the vision system in the vertical direction are different from the distances between the probe board 210 and the vision system in the vertical direction, the sliding table 130 can drive the camera 110 to move along its incident direction, so that the optical distance between the camera 110 and the imaging object matches the focal length of the camera 110, thereby obtaining clear images.

[0066] A brush is provided on one side of the optical path conversion structure 120, and a brush guide rail, a slider and a cylinder are also provided in cooperation. Specifically, the brush is usually made of soft and elastic bristles and is used to clean the surface of the wafer as the vision system moves. The brush is fixedly connected to the slider, and the slider is slidably connected to the brush guide rail. The slider is driven by the cylinder to move along the vertical direction on the brush guide rail so that the brush contacts the surface of the wafer to clean the surface of the wafer.

[0067] Specifically, in the embodiment of the present application, the setting of the optical path conversion structure 120 enables one camera to simultaneously meet the imaging requirements for the wafer 400 to be measured and the probe board 210. This not only reduces the need to use two independent cameras in the traditional solution, reduces the complexity and cost of the system, but also avoids the accuracy loss caused by the calibration error between multiple imaging units, significantly improves the alignment accuracy, can better meet the requirements of high-precision alignment for semiconductor test equipment, and reduces the space occupied by the vision positioning device between the wafer 400 to be measured and the probe card 210. The setting of the sliding table 130 enables the camera 110 to flexibly adapt to wafers and probe boards of different specifications, enhancing the versatility of the equipment.

[0068] Reference Figure 5 、 7, in a possible implementation, the double-sided vision positioning device 100 further includes a driving mechanism for driving the vision system to move within a first plane; the wafer 400 to be measured and the probe board 210 are distributed relatively along a first direction, and the first direction is perpendicular to the first plane. Specifically, the driving mechanism is used to control the movement of the vision system within the first plane, so as to realize imaging of different positions of the wafer 400 to be measured and the probe board 210. In a specific implementation, the first plane is usually a horizontal plane, the probe board 210 and the wafer 200 to be measured are both placed horizontally, and they are opposite in the vertical direction.

[0069] Specifically, the driving mechanism includes a first driving module 140 arranged oppositely, and a second driving module 150 slidably connected to the oppositely arranged first driving module 140. The oppositely arranged first driving module 140 is used to drive the second driving module 150 to move along a second direction, so as to drive the vision system to adjust its position in the second direction; the vision system is slidably connected to the second driving module 150, and the second driving module 150 is used to drive the vision system to move along a third direction. The second direction and the third direction are perpendicular to each other within the first plane, forming a rectangular coordinate system, so that the vision system can perform two-dimensional movement within the first plane, so that the vision system can perform precise imaging at any position within the first plane, meeting the alignment requirements of wafers 400 to be measured and probe boards 210 of different sizes.

[0070] Specifically, in the embodiment of the present application, the vision system is connected to the driving mechanism. Through the coordinated work of the first driving module 140 and the second driving module 150, the accuracy of a pair of first driving modules 140 is higher than that of a conventional single-drive mechanism or cantilever mechanism, so that the vision system can move flexibly within the first plane, ensuring that the vision system can accurately reach the position where imaging is required and perform imaging at any position within the first plane, meeting the test requirements of wafers 400 to be measured of different sizes. Combining with the adjustment function of the sliding table 130, precise imaging of wafers 400 to be measured and probe boards 210 at different positions and of different specifications is realized.

[0071] Reference Figure 7 、 9 , in a possible implementation, the stroke range of the second driving module 150 in the second direction matches the size of the wafer 400 to be measured. The stroke range of the second driving module 150 in the second direction is from Figure 7 the first extreme position shown in Figure 8 to Figure 7 the second extreme position shown in Figure 8The fourth limit position shown covers the entire dimensional range of the wafer 400 to be measured in the third direction, ensuring that the vision system can reach any position where imaging is required.

[0072] Specifically, referring to Figure 9 , the second driving module 150 includes a matching slider 151 and a guide 152; the guide 152 is arranged in the third direction, and both ends of the guide 152 are slidably connected to the relatively arranged first driving module 140; the vision system is fixedly connected to the guide 152, and the slider 151 is slidably connected to the guide 152 for driving the vision system to slide along the guide 152, and the stroke range of the slider 151 matches the size of the wafer 400 to be measured. Specifically, the slider 151 is usually a component with a slide rail or rollers, and the guide 152 is a long strip-shaped track arranged in the third direction. The slider 151 and the guide 152 are closely matched to achieve smooth sliding. Both ends of the guide 152 are slidably connected to the relatively arranged first driving module 140 to achieve the stability and movement of the second driving module 150 in the second direction. The vision system is fixed on the guide 152, while the slider 151 is slidably connected to the guide 152, and the movement of the slider 151 drives the vision system to slide along the guide 152. The cooperation between the slider 151 and the guide 152 ensures the precise movement of the vision system in the third direction, and its stroke range matches the size of the wafer 400 to be measured, capable of covering the entire area to be measured and ensuring the comprehensiveness and accuracy of imaging.

[0073] Furthermore, continuing to refer to Figure 9 , the second driving module 150 further includes a second module drag chain 153 and a drag chain support plate 154 arranged in the third direction. The second module drag chain 153 is installed in the drag chain support plate 154; the slider 151 is fixedly connected to the second module drag chain 153, and the drag chain support plate 154 is fixedly connected to the guide 152. Specifically, the second module drag chain 153 is a component for protecting and managing cables and air pipes, usually composed of a series of bendable links, and can expand and contract with the movement of the slider 151; the drag chain support plate 154 is a fixed base for installing and supporting the second module drag chain 153, fixed on the guide 152. The second module drag chain 153 is installed in the drag chain support plate 154 and fixedly connected to the slider 151. When the slider 151 moves along the guide 152, the second module drag chain 153 expands and contracts accordingly, ensuring that the cables and air pipes will not be damaged due to pulling, while maintaining the stability of the power and signal connections of the vision system. The setting of the second module drag chain 153 and the drag chain support plate 154 effectively protects the cables and air pipes, extends their service life, and at the same time ensures the stable operation of the vision system during movement, avoiding imaging errors caused by signal interruption or power shortage.

[0074] Specifically, referring toFigure 10 , the first driving module 140 includes a guide rail 141 arranged along the second direction and a pair of limiting parts connected to the guide rail 141. The distance between the pair of limiting parts matches the size of the wafer 400 to be measured. Specifically, the guide rail 141 is a long strip-shaped track arranged along the second direction, providing a stable linear motion path for the second driving module 150. Both ends of the guiding member 152 are respectively slidably connected to the relatively arranged first driving modules 140 through connecting members 155. Sliding pieces 142 are arranged on the connecting members 155. The pair of limiting parts can be set as a first sensor and a second sensor, usually an optoelectronic sensor or a proximity sensor, which are installed at both ends of the guide rail 141. The first sensor and the second sensor are used to detect the position of the sliding piece 142. When the sliding piece 142 enters the detection range of the sensor, the sensor emits a signal indicating that the second driving module 150 has reached the limit position. In a specific implementation, by adjusting the distance between the pair of limiting parts, it can be ensured that the moving range of the second driving module 150 in the second direction precisely matches the size of the wafer 400 to be measured, so as to adapt to wafers to be measured of different sizes.

[0075] Reference Figure 11 , one end of the connecting member 155 is fixedly connected to the guiding member 152, and the other end of the connecting member 155 is slidably connected to the guide rail 141, which is used to drive the guiding member 152 to move along the guide rail 141. The sliding piece 142 is arranged on the connecting member 155 and is used to cooperate with the limiting part during the process of the guiding member 152 moving along the guide rail 141. As Figure 10 shown, the connecting member 155 is also connected to the first module drag chain 143. The first module drag chain 143 is a component used to protect and manage cables and air pipes. It is usually composed of a series of bendable links and can stretch and contract as the connecting member 155 moves, ensuring that the cables and air pipes will not be damaged due to pulling, effectively protecting the cables and air pipes, extending their service life, and at the same time ensuring the stable operation of the second driving module 150 during movement, avoiding imaging errors caused by signal interruption or power shortage.

[0076] Specifically, in the embodiment of the present application, the stroke range of the second driving module 150 in the second direction matches the size of the wafer 400 to be measured, and the stroke range of the vision system in the third direction also matches the size of the wafer 400 to be measured, ensuring that the vision system can fully cover the surface of the wafer 400 to be measured, realizing high-precision imaging and alignment. At the same time, it improves the versatility and flexibility of the equipment, enabling it to adapt to wafers 400 to be measured of different sizes without frequently replacing hardware or carrying out large-scale transformation. In addition, it also enhances the adaptability and reliability of the equipment, reduces the production interruption time caused by equipment incompatibility, improves the efficiency and stability of the entire production line, and thus improves the test efficiency and product quality in the semiconductor manufacturing process.

[0077] On the other hand, referring to Figure 12 , 14 , the present application further provides a wafer aging test device, including a frame 200, a heat sink assembly, an alignment mechanism 300, and the dual-sided vision positioning device 100 provided in any of the above embodiments. Among them, a probe board 210 is provided on the frame 200, and the probe board 210 is parallel to the first plane; the heat sink assembly is used to carry the wafer 400 to be tested, and when the heat sink assembly is clamped with the probe board to form a test cavity; the alignment mechanism 300 is used to carry the heat sink assembly so that the wafer 400 to be tested and the probe board 210 are distributed relatively along the first direction; the first direction is perpendicular to the first plane. In a specific implementation, the first plane is usually a horizontal plane, the probe board 210 and the wafer 200 to be tested are both placed horizontally, and they are opposite in the vertical direction. The alignment mechanism usually has a high-precision adjustment mechanism and can realize multi-degree-of-freedom position adjustment.

[0078] The dual-sided vision positioning device 100 is located between the probe board 210 and the alignment mechanism 300 and is connected to the frame 200; the vision positioning device is used to obtain the position information of the wafer 400 to be tested and the probe board 210, and the alignment mechanism 300 is used to adjust the position of the wafer 400 to be tested according to the position information of the wafer 400 to be tested and the probe board 210 obtained by the vision positioning device. The adjustment mechanism can accurately control the displacement of the wafer in multiple directions to ensure high-precision alignment between the wafer and the probe board 210.

[0079] Further, a vision positioning space is formed between the probe board 210 and the alignment mechanism 300. The dual-sided vision positioning device 100 is slidably connected to the frame 200, for example, connected by a slide rail. The dual-sided vision positioning device 100 is controlled to slide between a first position and a second position. The first position is within the vision positioning space, and the second position is outside the vision positioning space. The dual-sided vision positioning device 100 is configured to obtain the position information of the wafer 400 to be tested and the probe board 210 at the first position, and slide to the second position after the alignment mechanism 300 completes the position adjustment of the wafer 400 to be tested; the alignment mechanism 300 is configured to control the heat sink assembly carrying the wafer 400 to be tested to move along the first direction to approach the probe board 210 and clamp with the probe board 210 to form a test cavity after the dual-sided vision positioning device 100 slides to the second position, so as to avoid interference of the dual-sided vision positioning device 100 during the clamping process.

[0080] Specifically, in the embodiments of the present application, the wafer aging test device realizes high-precision testing of semiconductor wafers through the collaborative work of the frame 200, the probe board 210, the alignment mechanism 300, and the double-sided vision positioning device 100. Among them, the setting of the double-sided vision positioning device 100 significantly improves the alignment accuracy and avoids the calibration errors in the traditional multi-camera scheme. At the same time, its flexible slider adjustment and two-dimensional movement capabilities enable it to adapt to wafers and probe boards of different specifications, enhancing the versatility and flexibility of the device and providing efficient and accurate imaging and alignment functions.

[0081] On the other hand, as Figure 14 shown, the present application also provides a vision positioning method applied to the wafer aging test device provided in the above embodiments. The method includes:

[0082] S1401, controlling the double-sided vision positioning device 100 to obtain the position information of at least two first preset marking points on the probe board 210 and the position information of the second preset marking points corresponding to each first preset marking point on the wafer 400 to be tested.

[0083] Among them, the first preset marking points are the marking points preset on the probe board 210, and the second preset marking points are the marking points preset on the wafer to be tested for alignment. The position information usually includes parameters such as coordinates.

[0084] Specifically, in the semiconductor manufacturing process, wafer testing is a key link to ensure the quality and performance of chips. To achieve high-precision testing, the pads on the wafer must be accurately aligned and contacted with the probes on the probe board 210. The double-sided vision positioning device 100 provides an adjustment basis for the alignment mechanism 300 by obtaining the position information of the preset marking points on the probe board 210 and the wafer to be tested, thereby achieving high-precision alignment.

[0085] In specific implementation, multiple preset marking points can be set at different positions on the wafer and the probe board 210 to achieve more comprehensive alignment.

[0086] In an exemplary implementation manner, as Figure 15 shown, the above step S1401 may include:

[0087] S1501, controlling the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 to be turned on so that the image formed by the probe board 210 is emitted to the camera 110.

[0088] Specifically, when imaging the probe board 210, the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 is turned on. The optical path conversion structure 120 introduces the light reflected by the probe board 210 through the first light incident port 121. After internal optical path conversion, it exits from the light exit port 123 and enters the camera 110.

[0089] S1503. For each first preset marking point, control the vision system to move within the first plane so that the image of at least the first preset marking point on the probe board 210 is emitted to the camera 110, and obtain the position information of the first preset marking point.

[0090] Specifically, control the vision system to move within the first plane through the driving mechanism to ensure that the first preset marking point on the probe board 210 can be captured by the camera 110. After the light source 124 on the side facing the probe board 210 is turned on and the vision system moves to a suitable position, the camera 110 captures the image of the first preset marking point on the probe board 210 and obtains its position information.

[0091] Optionally, when the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 is turned on, after controlling the driving mechanism to drive the vision system to move within the first plane, control the slide 130 to drive the camera 110 to move in the incident direction of the camera 110 so that the optical distance between the camera 110 and the first preset marking point matches the focal length of the camera 110.

[0092] S1505. Control the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 to turn off.

[0093] Specifically, when imaging the probe board 210, only the light source 124 on the side of the optical path conversion structure 120 facing the probe board 210 is turned on; when imaging the wafer 400 to be measured, only the light source 124 on the side facing the wafer 400 to be measured is turned on. This can avoid interference caused by the simultaneous turning on of the light sources on both sides. If the light sources on both sides are turned on simultaneously, the light from the wafer 400 to be measured and the probe board 210 may scatter or reflect inside the optical path conversion structure 120, resulting in interference phenomena such as ghost images and halos in the image captured by the camera 110, thereby affecting the imaging quality. By only turning on the corresponding side light source, it can ensure that the light path is more single and stable, reduce optical interference, provide purer light for the camera 110, and enable the camera 110 to capture the image of the wafer 400 to be measured or the probe board 210 more clearly. This helps to improve the accuracy of position information acquisition and thus improve the alignment accuracy of the entire vision positioning system.

[0094] S1507, turn on the light source 124 on the side of the optical path conversion structure 120 facing the wafer 400 to be measured, so that the image formed by the wafer 400 to be measured is emitted to the camera 110.

[0095] Specifically, when imaging the wafer 400 to be measured, the light source 124 on the side of the optical path conversion structure 120 facing the wafer 400 to be measured is turned on. The optical path conversion structure 120 introduces the light reflected by the wafer 400 to be measured through the second light incident port 122. After internal optical path conversion, it is emitted from the light exit port 123 and enters the camera 110.

[0096] S1509, for each second preset marking point, control the vision system to move in the first plane so that the image formed by at least the second preset marking point on the wafer 400 to be measured is emitted to the camera 110, and obtain the position information of the second preset marking point.

[0097] Specifically, control the vision system to move in the first plane through the driving mechanism to ensure that the second preset marking point on the wafer 400 to be measured can be captured by the camera 110. After the light source 124 on the side facing the wafer 400 to be measured is turned on and the vision system moves to a suitable position, the camera 110 captures the image of the second preset marking point on the wafer 400 to be measured and obtains its position information.

[0098] Optionally, when the light source 124 on the side of the optical path conversion structure 120 facing the wafer 400 to be measured is turned on, after controlling the driving mechanism to drive the vision system to move in the first plane, control the slide 130 to drive the camera 110 to move in the incident direction of the camera 110 so that the optical distance between the camera 110 and the second preset marking point matches the focal length of the camera 110.

[0099] Specifically, in the embodiments of the present application, by controlling the opening and closing of the light source 124 of the optical path conversion structure 120, the movement of the driving mechanism, and the adjustment of the slide, a single camera can achieve high-precision imaging and position information acquisition of the marking points on the probe board 210 and the wafer 400 to be measured, significantly improving the alignment accuracy, avoiding accuracy loss caused by calibration errors between multiple imaging units, adapting to wafers and probe boards of different specifications, improving the positioning accuracy, and further improving the test accuracy.

[0100] S1403, based on the position information of at least two first preset marking points and the position information of the corresponding second preset marking points, control the alignment mechanism 300 to adjust the position of the wafer 400 to be measured.

[0101] Exemplarily, such as Figure 16 、 17As shown, the field of view of the camera 110 of the double-sided vision positioning device 100 faces the probe board 210. Four marking points A1, B1, C1, and D1 are selected on the probe board 210. The lower field of view of the camera 110 faces the wafer 400 to be measured. Four corresponding marking points A2, B2, C2, and D2 are selected on the wafer 400 to be measured. The position information of these marking points is obtained through the double-sided vision positioning device 100. The alignment mechanism 300 adjusts the position of the wafer 400 to be measured according to the position information of these marking points, so that A1 coincides with A2, B1 coincides with B2, C1 coincides with C2, and D1 coincides with D2. Then, the position information of these marking points is obtained again through the double-sided vision positioning device 100 for verification, that is, the precise alignment between the probe board 210 and the wafer 400 to be measured is achieved.

[0102] In a specific implementation, the first straight line can also be determined by the camera 110 photographing two marking points on the probe board 210, and the second straight line can be determined by the camera 110 photographing two corresponding marking points on the wafer 400 to be measured, so that the two straight lines are parallel and the upper and lower groups of marking points are in the same position, realizing the precise alignment between the probe board 210 and the wafer 400 to be measured.

[0103] Specifically, in the embodiment of the present application, by controlling the double-sided vision positioning device 100 to obtain the position information of the preset marking points on the probe board and the wafer to be measured, high-precision alignment can be achieved. Among them, the double-sided vision positioning device 100 captures the image information of the wafer 400 to be measured and the probe board 210 through one camera, significantly improving the alignment accuracy and avoiding the accuracy loss caused by the calibration error between multiple imaging units. The camera 110 of the double-sided vision positioning device 100 is connected to the slide table 130, and the shooting and positioning of marking points at different heights are realized through the horizontal movement of the slide table 130, adapting to wafers and probe boards of different specifications, improving the positioning accuracy, thereby improving the test accuracy, and also reducing the test error and equipment wear caused by inaccurate alignment.

[0104] In summary, the dual-sided vision positioning device 100 of the present application is applied to semiconductor testing equipment. The dual-sided vision positioning device 100 is disposed between the wafer 400 to be tested and the probe board 210. The dual-sided vision positioning device 100 includes a vision system. The vision system includes a camera 110 and an optical path conversion structure 120. The optical path conversion structure 120 includes a first light incident port 121, a second light incident port 122, and a light exit port 123. The light exit port 123 faces the incident direction of the camera 110. The first light incident port 121 faces the probe board 210, and the second light incident port 122 faces the wafer to be tested. Light sources 124 are provided on both surfaces of the optical path conversion structure 120 facing the wafer 400 to be tested and the probe board 210. The optical path conversion structure 120 is configured to emit the image formed by the wafer 400 to be tested or the probe board 210 to the camera 110. It is possible to capture the image information of the wafer 400 to be tested and the probe board 210 with one camera, which not only reduces the need for using two independent cameras in the traditional solution, reduces the complexity and cost of the system, but also significantly improves the alignment accuracy and avoids the accuracy loss caused by the calibration error between multiple imaging units. The vision system further includes a stage 130. The camera 110 is connected to the stage 130. The stage 130 is configured to adjust the distance between the camera 110 and the optical path conversion structure 120 in the incident direction of the camera 110, so that the focal length can be flexibly adjusted according to different test requirements to adapt to wafers and probe boards of different specifications, enhancing the versatility of the equipment.

[0105] In the present application, unless otherwise clearly defined and limited, terms such as "connected" and "coupled" shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the connection inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0106] It should be noted that: the above sequence of the embodiments of the present application is only for description and does not represent the superiority or inferiority of the embodiments. The above description of specific embodiments is provided, and other embodiments are also within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be executed in the order of different embodiments and can achieve the expected results. Additionally, the processes depicted in the drawings do not necessarily require a specific order or connection order to achieve the desired results. In certain embodiments, multi-task parallel processing is also possible or may be advantageous.

[0107] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other, and the differences between each embodiment and other embodiments are emphasized.

[0108] The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims

1. A double-sided vision positioning device applied to semiconductor testing equipment, characterized in that, The double-sided vision positioning device is arranged between the wafer to be measured and the probe board. The double-sided vision positioning device includes a vision system, and the vision system includes: A camera; An optical path conversion structure, which includes a first light incident port, a second light incident port, and a light exit port. The light exit port faces the incident direction of the camera. The first light incident port faces the probe board, and the second light incident port faces the wafer to be measured. The optical path conversion structure is used to emit the image formed by the wafer to be measured or the probe board to the camera.

2. The double-sided vision positioning device according to claim 1, wherein, The orientation of the first light incident port is perpendicular to the exit direction of the light exit port, and the orientation of the second light incident port is perpendicular to the exit direction of the light exit port. Light sources are respectively arranged on two surfaces of the optical path conversion structure facing the wafer to be measured and the probe board.

3. The double-sided vision positioning device according to claim 1, wherein, The vision system further includes a slide table. The camera is connected to the slide table, and the slide table is used to adjust the distance between the camera and the optical path conversion structure in the incident direction of the camera.

4. The double-sided vision positioning device according to claim 3, characterized in that, The double-sided vision positioning device further includes a driving mechanism, which is used to drive the vision system to move in a first plane. The wafer to be measured and the probe board are distributed relatively along a first direction, and the first direction is perpendicular to the first plane.

5. The double-sided vision positioning device according to claim 4, wherein The driving mechanism includes relatively arranged first driving modules, and a second driving module slidably connected to the relatively arranged first driving modules. The relatively arranged first driving modules are used to drive the second driving module to move along a second direction; The vision system is slidably connected to the second driving module. The second driving module is used to drive the vision system to move along a third direction, and the second direction and the third direction are perpendicular to each other in the first plane.

6. The double-sided vision positioning device according to claim 5, wherein The travel range of the second driving module in the second direction matches the size of the wafer to be measured; the travel range of the vision system in the third direction matches the size of the wafer to be measured.

7. The double-sided vision positioning device according to claim 6, wherein The second driving module includes a matching sliding member and a guiding member. The guiding member is arranged along the third direction, and both ends of the guiding member are slidably connected to the relatively arranged first driving modules. The vision system is fixedly connected to the guiding member, and the sliding member is slidably connected to the guiding member to drive the vision system to slide along the guiding member. The travel range of the sliding member matches the size of the wafer to be measured.

8. The double-sided vision positioning device according to claim 6, wherein The first driving module includes a guide rail arranged along the second direction, and a pair of limiting parts connected to the guide rail. The distance between the pair of limiting parts matches the size of the wafer to be measured.

9. A wafer aging test device, characterized in that, Including: A frame, on which a probe board is arranged, and the probe board is parallel to the first plane; A heat sink assembly, which carries the wafer to be measured. When the heat sink assembly and the probe board are closed to form a test cavity; An alignment mechanism, which is used to carry the heat sink assembly so that the wafer to be measured and the probe board are distributed relatively along the first direction. The first direction is perpendicular to the first plane; The double-sided vision positioning device as described in any one of claims 1 to 8 is located between the probe board and the alignment mechanism and is connected to the frame; the vision positioning device is used to obtain the position information of the wafer to be tested and the probe board, and the alignment mechanism is used to adjust the position of the wafer to be tested according to the position information of the wafer to be tested and the probe board obtained by the vision positioning device.

10. The wafer aging test device according to claim 9, characterized in that, A vision positioning space is formed between the probe board and the alignment mechanism. The double-sided vision positioning device is slidably connected to the frame. The double-sided vision positioning device is controlled to slide between a first position and a second position. The first position is within the vision positioning space, and the second position is outside the vision positioning space. The double-sided vision positioning device is configured to obtain the position information of the wafer to be tested and the probe board at the first position, and slide to the second position after the alignment mechanism completes the position adjustment of the wafer to be tested; the alignment mechanism is configured to control the heat sink assembly carrying the wafer to be tested to move along the first direction to approach the probe board and form a test cavity by closing the mold with the probe board after the double-sided vision positioning device slides to the second position.

11. A visual positioning method, characterized in that, Applied to the wafer aging test device as described in claim 9, the method includes: Controlling the vision positioning device to obtain the position information of at least two first preset marking points on the probe board and the position information of second preset marking points corresponding to each of the first preset marking points on the wafer to be tested. Based on the position information of the at least two first preset marking points and the corresponding position information of the second preset marking points, controlling the alignment mechanism to adjust the position of the wafer to be tested.

12. The visual positioning method according to claim 11, wherein, The controlling the vision positioning device to obtain the position information of at least two first preset marking points on the probe board and the position information of second preset marking points corresponding to each of the first preset marking points on the wafer to be tested includes: Controlling the light path conversion structure to turn on the light source on the side facing the probe board so that the image of the probe board is emitted to the camera. For each of the first preset marking points, controlling the vision system to move in the first plane so that the image of at least the first preset marking point on the probe board is emitted to the camera to obtain the position information of the first preset marking point. Controlling the light path conversion structure to turn off the light source on the side facing the probe board. Controlling the light path conversion structure to turn on the light source on the side facing the wafer to be tested so that the image of the wafer to be tested is emitted to the camera. For each of the second preset marking points, controlling the vision system to move in the first plane so that the image of at least the second preset marking point on the wafer to be tested is emitted to the camera to obtain the position information of the second preset marking point.

13. The visual positioning method according to claim 12, wherein In the case where the light source on the side of the light path conversion structure facing the probe board is turned on, after the controlling the vision system to move in the first plane, the method further includes: Control the camera to move in the incident direction of the camera so that the optical distance between the camera and the first preset marking point matches the focal length of the camera; Correspondingly, when the light source on the side of the optical path conversion structure facing the wafer to be measured is turned on, after controlling the vision system to move in the first plane, the method further includes: Control the camera to move in the incident direction of the camera so that the optical distance between the camera and the second preset marking point matches the focal length of the camera.

Images