Display module, preparation method thereof, back film and display device

Abstract

The invention provides a display module and a preparation method thereof, a back film and a display device, relates to the technical field of display, and aims to improve the waterproof and anti-corrosion performance of the display module. The display module comprises a display panel, a flexible circuit board, a protective film and a protective layer. The display panel comprises a first part provided with a display area and a second part provided with a binding area, the first part comprises a display surface and a non-display surface which are opposite to each other, and the second part is bent to the side close to the non-display surface. The flexible circuit board is arranged on the side, away from the first part, of the second part and connected with the binding area of the second part. The protective film is arranged on the side, close to the first part, of the second part, and the orthographic projection of the protective film on the second part is located in the binding area. The protective layer covers the side, close to the first part, of the flexible circuit board, covers the joint of the flexible circuit board and the second part, and covers the side, close to the first part, of the protective film.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display module, a preparation method thereof, a back film, and a display device. Background Art

[0002] In an organic light-emitting diode (OLED) folding screen, the position (gold finger) where the flexible printed circuit board is bonded to the back of the display panel is prone to water vapor intrusion, resulting in corrosion problems inside the display module. Summary of the Invention

[0003] This application provides a display module, a preparation method thereof, a back film, and a display device, aiming to improve the waterproof and anti-corrosion performance of the display module.

[0004] To achieve the above object, the embodiments of this application provide the following technical solutions:

[0005] On the one hand, a display module is provided. The display module includes a display panel, a flexible printed circuit board, a protective film, and a protective layer. The display panel includes a first part provided with a display area and a second part provided with a bonding area. The first part includes an opposite display surface and a non-display surface, and the second part is bent to the side close to the non-display surface. The flexible printed circuit board is disposed on the side of the second part away from the first part and is connected to the bonding area of the second part. The protective film is disposed on the side of the second part close to the first part, and the orthographic projection of the protective film on the second part is located within the bonding area. The protective layer covers the side of the flexible printed circuit board close to the first part, covers the connection between the flexible printed circuit board and the second part, and covers the side of the protective film close to the first part.

[0006] The display module provided by this application includes a display panel, a flexible printed circuit board, a protective film, and a protective layer. The display panel includes a first part provided with a display area and a second part provided with a bonding area. The flexible printed circuit board is connected to the bonding area of the second part of the display panel, and the connection part is the "gold finger", which is used to realize the electrical connection between the flexible printed circuit board and the display panel. A protective film and a protective layer are provided on the side of the second part close to the first part. The protective layer not only covers the side of the flexible printed circuit board close to the first part and the connection between the flexible printed circuit board and the second part, but also covers the side of the protective film close to the first part, that is, the protective layer covers the periphery of the gold finger, thereby improving the waterproof and anti-corrosion performance at the gold finger.

[0007] Moreover, compared with the case where the protective layer only covers the flexible printed circuit board and the connection between the flexible printed circuit board and the second part, by setting the protective layer to also cover the protective film, the protection path of the protective layer can be extended, thereby extending the paths of water vapor and salt spray erosion, reducing the possibility of corrosion of the internal structure of the display module, and thus improving the waterproof and anti-corrosion performance of the display module.

[0008] In some embodiments, the second part includes a first boundary and a second boundary which are oppositely arranged, and the first boundary is connected to the first part. The display module further includes a spacer block, and the spacer block is arranged on a side of the second part close to the first part. Along the direction in which the first boundary is opposite to the second boundary, the boundary of the spacer block is located inside the second boundary.

[0009] In some embodiments, the spacer block includes a first side surface on a side close to the second boundary, and the protective film includes a second side surface on a side close to the first boundary, and the second side surface is in contact with the first side surface.

[0010] In some embodiments, the protective film includes a third boundary far from the first boundary, and along the direction in which the first boundary is opposite to the second boundary, the third boundary is flush with the second boundary.

[0011] On the other hand, a back film is further provided. The back film includes a first protective film, a first adhesive layer and a second adhesive layer, a first support layer and a second support layer, and a second protective film. The first adhesive layer and the second adhesive layer are arranged on one side of the first protective film. The first support layer is arranged on a side of the first adhesive layer far from the first protective film, and the second support layer is arranged on a side of the second adhesive layer far from the first protective film. The second protective film is semi-die cut to form a first sub-protective film and a second sub-protective film. The first sub-protective film covers the first support layer and a part of the surface of the second support layer, and the second sub-protective film covers another part of the surface of the second support layer.

[0012] The back film provided by the present application includes a first protective film, a first adhesive layer and a second adhesive layer, a first support layer and a second support layer, and a second protective film. The stacked structure of the first protective film and the first adhesive layer, and the stacked structure of the second adhesive layer and the second support layer are arranged side by side between the first protective film and the second protective film. The second protective film is semi-die cut to form a first sub-protective film and a second sub-protective film, that is, there is a semi-cut trace between the first sub-protective film and the second sub-protective film. During the process of tearing off the second protective film, the second sub-protective film is retained due to the existence of the semi-cut trace. Since the first sub-protective film covers the first support layer and a part of the surface of the second support layer, and the second sub-protective film covers another part of the surface of the second support layer, the retained second sub-protective film can protect a part of the surface of the second support layer.

[0013] On the other hand, a method for manufacturing a display module is also provided. The manufacturing method includes: providing a display panel, the display panel includes an opposite front surface and a back surface, and the display panel further includes a first portion provided with a display area and a second portion provided with a bonding area. Paste a protective film onto the back surface, and the protective film is semi-punched to form a first sub-protective film and a second sub-protective film. The orthographic projection of the second sub-protective film on the display panel is located within the bonding area. Connect a flexible printed circuit board to the bonding area of the second portion. Form a protective layer, the protective layer covers the side of the flexible printed circuit board close to the display panel, the protective layer covers the connection between the flexible printed circuit board and the display panel, and covers the side of the second sub-protective film away from the display panel. Remove the first sub-protective film and retain the second sub-protective film. Bend the second portion to a side close to the back surface of the first portion.

[0014] In the manufacturing method provided by the present application, a display panel is provided, and a protective film is pasted onto the back surface of the display panel. The protective film is semi-punched to form a first sub-protective film and a second sub-protective film. The first sub-protective film and the second sub-protective film can be separated along the semi-punching trace. The orthographic projection of the second sub-protective film on the display panel is located within the bonding area of the second portion of the display panel. Connect the flexible printed circuit board to the bonding area of the second portion through a gold finger to achieve electrical connection between the flexible printed circuit board and the display panel. Form a protective layer covering the periphery of the gold finger on the back side of the flexible printed circuit board. Moreover, the protective layer covers the connection between the flexible printed circuit board and the second portion, and covers the side of the second sub-protective film away from the back surface, thereby improving the waterproof and anti-corrosion properties at the back gold finger.

[0015] Remove the first sub-protective film along the semi-punching trace and retain the second sub-protective film. The second sub-protective film covered by the protective layer will not be subjected to a peeling force and thus will not be peeled off. Bend the second portion to a side close to the back surface of the first portion to form a display module. By setting the protective layer to cover the second sub-protective film, the erosion path of water vapor and salt spray of the protective layer can be extended, thereby reducing the possibility of corrosion of the internal structure of the display module, and thus improving the waterproof and anti-corrosion performance of the display module.

[0016] In some embodiments, pasting the protective film onto the back surface includes: providing a back film, the back film includes a first protective film, a first adhesive layer, a second adhesive layer, a first support layer, a second support layer, and a second protective film. Remove the first protective film and paste the remaining part onto the back surface, and the second protective film is the protective film.

[0017] In some embodiments, after removing the first sub-protective film and before bending the second portion to a side close to the back surface of the first portion, the above manufacturing method further includes: setting a spacer block on the back surface of the second portion. Wherein, the second portion includes a first boundary and a second boundary arranged oppositely, and the first boundary is connected to the first portion. Along the direction opposite to the first boundary and the second boundary, the boundary of the spacer block is located inside the second boundary, and the spacer block does not overlap with the second sub-protective film.

[0018] In some embodiments, after the protective film is pasted onto the back surface, the above preparation method further includes: cutting the display panel, the first sub-protective film, and the second sub-protective film. Among them, the second part includes a first boundary and a second boundary that are oppositely arranged, and the first boundary is connected to the first part. The second sub-protective film includes a third boundary away from the first boundary, and along the direction opposite to the first boundary and the second boundary, the third boundary is flush with the second boundary.

[0019] On the other hand, a display device is provided, which includes the display module in the above embodiments and a controller electrically connected to the display module.

[0020] The above display device has the same structure and beneficial technical effects as the display module provided in the above some embodiments, and will not be elaborated here. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the present application, the drawings required for some embodiments of the present application will be briefly introduced below. Obviously, the drawings in the following description are only the drawings of some embodiments of the present application, and those of ordinary skill in the art can also obtain other drawings according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual size of the products and the actual processes of the methods involved in the embodiments of the present application.

[0022] Figure 1 Structural diagram of the display device provided by the embodiment of the present application;

[0023] Figure 2 For Figure 1 Partial cross-sectional view of the display device in along the section line A-A';

[0024] Figure 3 Structural diagram of the back film provided by the embodiment of the present application;

[0025] Figure 4 For Figure 3 Top view of the second protective film in the back film in ;

[0026] Figure 5 Flow chart of the method for preparing the display module provided by the embodiment of the present application;

[0027] Figures 6 to 13 Diagrams of the steps for preparing the display module provided by the embodiment of the present application. Detailed Embodiments

[0028] Next, in conjunction with the accompanying drawings, the technical solutions in some embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0029] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, i.e., "including, but not limited to".

[0030] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0031] When describing some embodiments, the expression "connected" and its derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connected" may be a fixed connection, a detachable connection, or integrated; it may be directly connected or indirectly connected through an intermediate medium. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components have direct physical contact or electrical contact with each other.

[0032] In addition, the use of "based on" means open and inclusive, because a process, step, calculation, or other action "based on" one or more of the stated conditions or values may in practice be based on additional conditions or values beyond those stated.

[0033] It should be understood that when a layer or element is referred to as being on another layer or substrate, it may be that the layer or element is directly on the other layer or substrate, or there may be an intermediate layer between the layer or element and the other layer or substrate.

[0034] Exemplary embodiments are described herein with reference to cross-sectional views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of regions are exaggerated for clarity. Accordingly, variations in the shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as rectangular will generally have curved features. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0035] An embodiment of the present application provides a display device 100. Figure 1 It is a structural diagram of the display device provided by the embodiment of the present application.

[0036] Referring to Figure 1 , the display device 100 includes a display module 10 and a controller 200 electrically connected to the display module. The controller 200 can be disposed on the non-display side of the display module 10 and is used to control the display panel in the display module 10 to perform screen display.

[0037] The above display device can be any device that displays whether it is moving (e.g., video) or stationary (e.g., still image) and whether it is text or an image. More specifically, it is expected that the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal digital assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rear view cameras in vehicles), electronic photos, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0038] An embodiment of the present application also provides a display module. Figure 2 It is Figure 1 a partial cross-sectional view of the display device in

[0039] Referring to Figure 2 , the display module 10 includes a display panel 1, a flexible printed circuit board 2, a protective film 3, and a protective layer 4.

[0040] The display panel 1 includes a first part 11 provided with a display area (Active Area, AA) 110 and a second part 12 provided with a bonding area 120. Among them, gold fingers are provided in the bonding area 120, and the circuit board is electrically connected to the display panel 1 through the gold fingers. The first part 11 includes opposite display surfaces 101 and non-display surfaces 102, and the second part 12 is bent to the side close to the non-display surface 102. Exemplarily, the second part 12 further includes a fanout area 121, and multiple signal lines are provided in the fanout area 121, such as data fanout lines, digital control traces, and power lines, etc., and the fanout area 121 is a bending area of the display panel 1, which is beneficial to realizing a narrow bezel design of the display panel 1 and improving the packaging density of the display module 10.

[0041] The flexible printed circuit board (PCB) 2 is disposed on the side of the second portion 12 away from the first portion 11, and the flexible printed circuit board 2 is connected to the bonding area 120 of the second portion 12 to achieve electrical connection between the flexible printed circuit board 2 and the display panel 1. The connection between the flexible printed circuit board 2 and the bonding area 120 is a "gold finger".

[0042] The protective film 3 is disposed on the side of the second portion 12 close to the first portion 11. The orthographic projection of the protective film 3 on the second portion 12 is located within the bonding area 120. An upper protective layer 40 and a lower protective layer 4 are provided at the gold finger to protect the gold finger and prevent the gold finger from being eroded by water vapor. Moreover, the lower protective layer 4 covers the connection between the flexible printed circuit board 2 and the second portion 12 and covers the side of the protective film 3 close to the first portion 11. Exemplarily, the material of the upper protective layer 40 and the material of the lower protective layer 4 can be ultraviolet curable glue (UV glue). The upper protective layer 40 can be called "positive glue", and the lower protective layer 4 can be called "back glue".

[0043] The display module 10 provided in this application includes a display panel 1, a flexible printed circuit board 2, a protective film 3, and a protective layer 4. The display panel 1 includes a first portion 11 provided with a display area 110 and a second portion 12 provided with a bonding area 120. The flexible printed circuit board 2 is connected to the bonding area 120 of the second portion 12 of the display panel 1, and the connection is a "gold finger", which is used to achieve electrical connection between the flexible printed circuit board 2 and the display panel 1. A protective film 3 and a protective layer 4 are provided on the side of the second portion 12 close to the first portion 11. The protective layer 4 not only covers the side of the flexible printed circuit board 2 close to the first portion 11 and covers the connection between the flexible printed circuit board 2 and the second portion 12, but also covers the side of the protective film 3 close to the first portion 12, that is, the protective layer 4 covers the periphery of the gold finger, thereby improving the waterproof and anti-corrosion properties at the gold finger.

[0044] Moreover, compared with the case where the protective layer 4 only covers the flexible printed circuit board 2 and the connection between the flexible printed circuit board 2 and the second portion 12, by providing that the protective layer 4 also covers the protective film 3, the protection path of the protective layer 4 can be extended, thereby extending the paths of water vapor and salt spray erosion and reducing the possibility of corrosion of the internal structure of the display module 10, thereby improving the waterproof and anti-corrosion performance of the display module 10.

[0045] In some embodiments, refer to Figure 2, the second part 12 includes a first boundary M and a second boundary N which are oppositely arranged, and the first boundary M is connected to the first part 11. The display module 10 further includes a spacer 5 which is arranged on the side of the second part 12 close to the first part 11. Along the direction (direction Y) opposite to the first boundary M and the second boundary N, the boundary 50 of the spacer 5 is located inside the second boundary N, that is, the spacer 5 is designed to be retracted relative to the second part 12, so as to leave a space for arranging the protective film 3 and the protective layer 4, so as to extend the path of water vapor and salt spray erosion of the protective layer 4, thereby being beneficial to improving the waterproof and anti-corrosion performance of the display module 10.

[0046] Exemplarily, continue to refer to Figure 2 , the display module 10 further includes a back film 6, a support plate 7 and an adhesive protection layer 8. The back film 6 is arranged on the back surface of the display panel 1 and contacts the back surface of the display panel 1. Exemplarily, the back film 6 is respectively arranged on the non-display surface 102 of the first part 11 and the back surface of the second part 21. Exemplarily, along the direction close to the display panel 1, the back film 6 includes a stacked adhesive layer and a support layer. The back film 6 is used to support the display panel 1.

[0047] The support plate 7 is arranged on the side of the spacer 5 far from the second part 12. Exemplarily, the material of the support plate 7 may include super clean foam (SCF), and the support plate 7 is a high-strength support, buffer, and heat dissipation absorption structure. The adhesive protection layer 8 is arranged in the bending area of the first part 11. Exemplarily, the material of the adhesive protection layer 8 may be a micro coating layer (MCL), and the adhesive protection layer 8 is coated on the bent part of the display panel 1, so as to prevent the bending area from being corroded by oxidizing gases such as water vapor, thereby improving the durability of the display panel 1.

[0048] In some embodiments, refer to Figure 2 , the spacer 5 includes a first side surface 51 on the side close to the second boundary N, and the protective film 3 includes a second side surface 32 on the side close to the first boundary M, and the second side surface 32 contacts the first side surface 51. Exemplarily, along the direction Y, the sum of the length of the spacer 5 and the length of the protective film 3 is equal to the length of the second part 12. The second side surface 32 contacts the first side surface 51, that is, there is no gap between the spacer 5 and the protective film 3, that is, the spacer 5 and the protective film 3 cover the back film 6 in contact with the second part 12, thereby improving the supportability of the back film layer of the second part 12.

[0049] In some embodiments, refer to Figure 2, the protective film 3 includes a third boundary 33 away from the first boundary M. Along the direction Y in which the first boundary M is opposite to the second boundary N, the third boundary 33 is flush with the second boundary N. Since the lower protective layer 4 covers the connection between the flexible circuit board 2 and the second part 12, and covers the side of the protective film 3 close to the first part 11, that is, the side of the lower protective layer 4 that covers the second boundary N and the third boundary 33. During the formation of the lower protective layer (UV glue) 4 (dot-back glue process), since the third boundary 33 is flush with the second boundary N, the UV glue is more likely to cover the second boundary N and the third boundary 33 under capillary action, so that there is no gap between the lower protective layer 4 and the second part 12 and the protective film 3, preventing the entry of water vapor and salt spray, thereby improving the waterproof and anti-corrosion performance at the gold finger.

[0050] On the other hand, a back film is also provided. Figure 3 It is a structural diagram of the back film provided by the embodiment of the present application; Figure 4 For Figure 3 the top view of the second protective film in the back film in

[0051] See Figure 3 , the back film 6 includes a first protective film 61, a first adhesive layer 63 and a second adhesive layer 64, a first support layer 65 and a second support layer 66, and a second protective film 62. The first adhesive layer 63 and the second adhesive layer 64 are disposed on one side of the first protective film 61. Exemplarily, the materials of the first adhesive layer 63 and the second adhesive layer 64 can be pressure-sensitive adhesive (PSA). The first support layer 65 is disposed on the side of the first adhesive layer 63 away from the first protective film 61, and the second support layer 66 is disposed on the side of the second adhesive layer 64 away from the first protective film 61. Exemplarily, the materials of the first support layer 65 and the second support layer 66 can be polyimide (PI). Exemplarily, after tearing off the first protective film 61 and the second protective film 62, the remaining film layers of the back film 6 can be pasted to the back of the display panel through the first adhesive layer 63 and the second adhesive layer 64 as the support structure of the display panel.

[0052] See Figure 3 and Figure 4 , the second protective film 62 is semi-punched to form a first sub-protective film 30 and a second sub-protective film 3. The first sub-protective film 30 covers the first support layer 65 and a part of the surface of the second support layer 66, and the second sub-protective film 3 covers the other part of the surface of the second support layer 66. It can be understood that L1 and L are the cutting traces formed by the semi-punching process on the second protective film 62, where L1 is the completely cut trace and L is the semi-cut trace. During the process of tearing off the second protective film 62, the first sub-protective film 30 and the second sub-protective film 3 can be separated along the trace L, so that the second sub-protective film 3 is retained.

[0053] Exemplarily, refer to Figure 4 , along the direction Y, the width d of the second sub-protective film 3 can be 1 mm. The present application does not limit the shape of the full-cut trace L1. Exemplarily, the protective film with the L1 shape shown in the embodiments of the present application can be applied to the display module of a watch.

[0054] The back film 6 provided by the present application includes a first protective film 61, a first adhesive layer 63, a second adhesive layer 64, a first support layer 65, a second support layer 66, and a second protective film 62. The stacked structure of the first protective film 61 and the first adhesive layer 63, and the stacked structure of the second adhesive layer 64 and the second support layer 66 are arranged side by side between the first protective film 61 and the second protective film 62. The second protective film 62 is semi-punched to form a first sub-protective film 30 and a second sub-protective film 3, that is, there is a semi-cut trace between the first sub-protective film 30 and the second sub-protective film 3. During the process of tearing off the second protective film 62, the second sub-protective film 3 is retained due to the existence of the semi-cut trace. Since the first sub-protective film 30 covers a part of the surface of the first support layer 65 and the second support layer 66, and the second sub-protective film 3 covers another part of the surface of the second support layer 66, the retained second sub-protective film 3 can protect a part of the surface of the second support layer 66.

[0055] On the other hand, a method for manufacturing a display module is also provided. Figure 5 It is a flowchart of the method for manufacturing a display module provided by the embodiments of the present application; Figures 6 to 13 It is a diagram of each step of the method for manufacturing a display module provided by the embodiments of the present application.

[0056] Refer to Figure 6 , the manufacturing method includes the following steps S1 to step S6:

[0057] Step S1: Refer to Figure 6 , provide a display panel 1. The display panel 1 includes an opposite front surface 101 and a back surface 102. The display panel 1 further includes a first part 11 provided with a display area (AA area) 110, and a second part 12 provided with a bonding area 120 (Bonding area). Among them, gold fingers are arranged in the bonding area 120, and the circuit board is electrically connected to the display panel 1 through the gold fingers. The first part 11 includes an opposite display surface and a non-display surface, and the non-display surface is a part of the back surface 102. Exemplarily, the second part 12 further includes a fanout area 121. A plurality of signal lines, such as data fanout lines, numerical control traces, and power lines, are arranged in the fanout area 121, and the fanout area 121 is a bent area of the display panel 1, which is beneficial to realizing the narrow bezel design of the display panel 1.

[0058] Step S2: Refer to Figure 7, the second protective film 62 is pasted onto the back surface 102. The second protective film 62 is semi-die cut to form a first sub-protective film 30 and a second sub-protective film 3. The orthographic projection of the second sub-protective film 3 on the display panel 1 is located within the bonding area 120. By providing the second sub-protective film 3.

[0059] Exemplarily, pasting the second protective film 3 onto the back surface 102 in step S2 includes the following steps S201 to S202:

[0060] Step S201: Refer to Figure 3 and Figure 4 , provide a back film 6. The back film 6 includes a first protective film 61, a first adhesive layer 63, a second adhesive layer 64, a first support layer 65, a second support layer 66, and a second protective film 62. The back film 6 is used to support the back surface 102 of the display panel 1. Among them, the second protective film 62 is semi-die cut to form a first sub-protective film 30 and a second sub-protective film 3. The first sub-protective film 30 covers the first support layer 65 and a part of the surface of the second support layer 66. The second sub-protective film 3 covers another part of the surface of the second support layer 66. It can be understood that L1 and L are the cutting traces formed by the semi-die cutting process on the second protective film 62. Among them, L1 is a completely cut trace, and L is a semi-cut trace. During the process of tearing off the second protective film 62, the first sub-protective film 30 and the second sub-protective film 3 can be separated along the trace L, so as to retain the second sub-protective film 3.

[0061] Step S202: Refer to Figure 7 , remove the first protective film 61, and paste the first support layer 65, the second support layer 66, and the second protective film 62 onto the back surface 102 through the first adhesive layer 63 and the second adhesive layer 64.

[0062] In some embodiments, refer to Figure 8 , after pasting the second protective film 3 onto the back surface 102, the above preparation method further includes cutting the display panel 1, the first sub-protective film 30, and the second sub-protective film 3. Exemplarily, the first support layer 65, the second support layer 66, the first adhesive layer 63, and the second adhesive layer 64 are also cut. Among them, the second part 12 includes a first boundary M and a second boundary N arranged oppositely, and the first boundary M is connected to the first part 11. The second sub-protective film 3 includes a third boundary 33 away from the first boundary M. Along the direction Y in which the first boundary M and the second boundary N are opposite to each other, the third boundary 33 is flush with the second boundary N.

[0063] Since the lower protective layer 4 covers the connection between the flexible printed circuit board 2 and the second part 12, and covers the side of the protective film 3 close to the first part 11, that is, the side where the lower protective layer 4 covers the second boundary N and the third boundary 33. During the process of forming the lower protective layer (UV glue) 4 (dispensing process), since the third boundary 33 is flush with the second boundary N, the UV glue is more likely to cover the second boundary N and the third boundary 33 under capillary action, so that there is no gap between the lower protective layer 4 and the second part 12 and the protective film 3, preventing the entry of water vapor and salt mist, thereby improving the waterproof and anti-corrosion performance at the gold finger.

[0064] Step S3: Refer to Figure 9 , connect the binding area 120 of the flexible printed circuit board (PCB) 2 to the second part 12 to realize the electrical connection between the flexible printed circuit board 2 and the display panel 1. Exemplarily, the flexible printed circuit board 2 and the binding area 120 are welded by metal, and the metal welding part is the "gold finger".

[0065] Step S4: Refer to Figure 10 , form the upper protective layer 40 and the lower protective layer 4. The upper protective layer 40 and the lower protective layer 4 are used to protect the gold finger and prevent the gold finger from being eroded by water vapor. Among them, the lower protective layer 4 covers the connection between the flexible printed circuit board 2 and the second part 12, and covers the side of the second sub-protective film 3 away from the back surface 102.

[0066] Exemplarily, the material of the upper protective layer 40 and the material of the lower protective layer 4 can be ultraviolet curable glue (UV glue). The process of forming the upper protective layer 40 and the lower protective layer 4 is the "dispensing process". The upper protective layer 40 can be called the "positive glue", and the lower protective layer 4 can be called the "back glue".

[0067] Step S5: Refer to Figure 11 , remove the first sub-protective film 30 and retain the second sub-protective film 3. Exemplarily, during the process of removing the second protective film 62, the first sub-protective film 30 and the second sub-protective film 3 can be separated along the semi-cut trace, and the second sub-protective film 3 covered by the lower protective layer 4 will not be subjected to the peeling force and thus cause peeling. And by setting the lower protective layer 4 to cover the second sub-protective film 3, the erosion path of water vapor and salt mist of the lower protective layer 4 can be extended, realizing the anti-corrosion protection at the gold finger of the back surface 102.

[0068] In some embodiments, refer to Figure 12 , after removing the first sub-protective film 30, the above preparation method further includes setting a spacer 5 on the back surface 102 of the second part 12.

[0069] Among them, the second part 12 includes a first boundary M and a second boundary N which are oppositely arranged, and the first boundary M is connected to the first part 11. Along the direction (direction Y) in which the first boundary M is opposite to the second boundary N, the boundary 50 of the spacer block 5 is located inside the second boundary N, and the spacer block 5 does not overlap with the second sub-protective film 3, that is, the spacer block 5 is designed to be retracted relative to the second part 12 to leave space for the protective film 3.

[0070] Exemplarily, referring to Figure 13 , after the spacer block 5 is provided, a support plate 7 is provided on the side of the spacer block 5 away from the second part 12. The material of the support plate 7 may include SCF, and the support plate 7 is a high-strength structure for support, buffering, and heat dissipation absorption.

[0071] Step S6: Referring to Figure 2 , the second part 12 is bent to the side close to the back surface 102 of the first part 11 to form the display module 10.

[0072] Exemplarily, referring to Figure 2 , after the second part 12 is bent to the side close to the back surface 102 of the first part 11, a protective adhesive layer 8 is provided in the bending area of the first part 11. Exemplarily, the material of the protective adhesive layer 8 may be MCL, and the protective adhesive layer 8 is coated on the bent part of the display panel 1, so as to prevent the bending area from being corroded by oxidizing gases such as water vapor, thereby improving the durability of the display panel 1.

[0073] In the manufacturing method provided by the present application, a display panel 1 is provided, and the second protective film 62 is pasted on the back surface 102 of the display panel 1. The second protective film 62 is semi-punched to form a first sub-protective film 30 and a second sub-protective film 3. The first sub-protective film 30 and the second sub-protective film 3 can be separated along the semi-punching trace. The orthographic projection of the second sub-protective film 3 on the display panel 1 is located in the bonding area 120 of the second part 12 of the display panel 1. The flexible printed circuit board 2 is connected to the bonding area 120 of the second part 12 through a gold finger to realize the electrical connection between the flexible printed circuit board 2 and the display panel 1. A lower protective layer 4 is formed to cover the periphery of the gold finger of the flexible printed circuit board 2 close to the back surface 102, and moreover, the lower protective layer 4 covers the connection part between the flexible printed circuit board 2 and the second part 12, and covers the side of the second sub-protective film 3 away from the back surface 102, thereby improving the waterproof and anti-corrosion performance at the back gold finger.

[0074] Remove the first sub-protective film 30 along the semi-punching trace, and retain the second sub-protective film 3. The second sub-protective film 3 covered by the lower protective layer 4 will not be subjected to the peeling force and thus will not peel. Bend the second part 12 to the side close to the back surface 102 of the first part 11 to form the display module 10. By setting the lower protective layer 4 to cover the second sub-protective film 3, the erosion path of water vapor and salt spray of the lower protective layer 4 can be extended, thereby reducing the possibility of corrosion of the internal structure of the display module 10, and thus improving the waterproof and anti-corrosion performance of the display module 10.

[0075] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present application, thinking of changes or substitutions, should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claimed rights.

Claims

1. A display module, characterized in that, Comprising: A display panel, including a first part provided with a display area and a second part provided with a bonding area, the first part including an opposite display surface and a non-display surface, and the second part being bent to a side close to the non-display surface; A flexible printed circuit board, disposed on a side of the second part away from the first part and connected to the bonding area of the second part; A protective film, disposed on a side of the second part close to the first part, and a positive projection of the protective film on the second part is located within the bonding area; A protective layer, covering a side of the flexible printed circuit board close to the first part, covering a connection portion between the flexible printed circuit board and the second part, and covering a side of the protective film close to the first part.

2. The display module according to claim 1, wherein The second part includes a first boundary and a second boundary disposed opposite to each other, and the first boundary is connected to the first part; The display module further includes a spacer block, and the spacer block is disposed on a side of the second part close to the first part; along a direction opposite to the first boundary and the second boundary, a boundary of the spacer block is located inside the second boundary.

3. The display module according to claim 2, wherein The spacer block includes a first side surface close to the second boundary, and the protective film includes a second side surface close to the first boundary; The second side surface is in contact with the first side surface.

4. The display module according to claim 2 or 3, wherein The protective film includes a third boundary away from the first boundary, and along a direction opposite to the first boundary and the second boundary, the third boundary is flush with the second boundary.

5. A back film, characterized in that, Comprising: A first protective film; A first adhesive layer and a second adhesive layer, disposed on one side of the first protective film; A first support layer and a second support layer, the first support layer is disposed on a side of the first adhesive layer away from the first protective film, and the second support layer is disposed on a side of the second adhesive layer away from the first protective film; A second protective film, and the second protective film is semi-punched to form a first sub-protective film and a second sub-protective film, the first sub-protective film covering the first support layer and a part of the surface of the second support layer, and the second sub-protective film covering another part of the surface of the second support layer.

6. A method for preparing a display module, characterized in that, Comprising: Providing a display panel, the display panel including an opposite front surface and a back surface; the display panel further includes a first part provided with a display area and a second part provided with a bonding area; Pasting a protective film onto the back surface, the protective film being semi-punched to form a first sub-protective film and a second sub-protective film, and a positive projection of the second sub-protective film on the display panel is located within the bonding area; Connecting a flexible printed circuit board to the bonding area of the second part; Forming a protective layer, the protective layer covering a side of the flexible printed circuit board close to the display panel, covering a connection portion between the flexible printed circuit board and the display panel, and covering a side of the second sub-protective film away from the display panel; Removing the first sub-protective film and retaining the second sub-protective film; Bending the second part to a side close to the back surface of the first part.

7. The preparation method according to claim 6, characterized in that, Pasting the protective film onto the back surface, including: Providing a back film, the back film including a first protective film, a first adhesive layer, a second adhesive layer, a first support layer, a second support layer, and a second protective film; Remove the first protective film and paste the remaining part onto the back surface, where the second protective film is the protective film.

8. The preparation method according to claim 7, wherein, Before bending the second part to the side close to the back surface of the first part after removing the first sub-protective film, the manufacturing method further includes: Providing a heightening block on the back surface of the second part; Wherein, the second part includes a first boundary and a second boundary which are oppositely arranged, and the first boundary is connected to the first part; Along the direction in which the first boundary is opposite to the second boundary, the boundary of the heightening block is located inside the second boundary, and the heightening block does not overlap with the second sub-protective film.

9. The preparation method according to claim 6, characterized in that, After pasting the protective film onto the back surface, the manufacturing method further includes: Cutting the display panel, the first sub-protective film and the second sub-protective film; Wherein, the second part includes a first boundary and a second boundary which are oppositely arranged, and the first boundary is connected to the first part; The second sub-protective film includes a third boundary far from the first boundary, and along the direction in which the first boundary is opposite to the second boundary, the third boundary is flush with the second boundary.

10. A display device, characterized in that, Comprising: The display module according to any one of claims 1 to 4; A controller electrically connected to the display module.

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