Electronic device and method for forming contact on electronic device

Abstract

The invention discloses an electronic device and a method for forming a contact on the electronic device. A specifically disclosed electronic device may include a non-conductive housing assembly, a conductive seed material formed over an outer surface of the non-conductive housing assembly, a body conductive contact material formed over the conductive seed material, and an electronic assembly connected to the body conductive contact material and the conductive seed material. Additional related systems, devices, and methods are also disclosed.

Description

[0001] Cross - reference to related applications

[0002] This disclosure claims the benefit of U.S. Provisional Application No. 63 / 621,931, filed on January 17, 2024, and U.S. Non - Provisional Application No. 19 / 012,580, filed on January 7, 2025, the entire contents of which are incorporated herein by reference. Technical field

[0003] This disclosure generally relates to consumer electronic devices and methods for forming sensor (e.g., EMG) contacts, charging contacts, antennas, and / or other conductive elements on consumer electronic devices (e.g., small consumer electronic devices, wearable devices, etc.). Background art

[0004] Many small consumer electronic devices (e.g., watches, phones, fitness trackers, wireless earbuds, smart glasses, and augmented reality glasses, etc.) include rechargeable batteries. These batteries can be charged using charging contacts exposed on the electronic device. Similarly, some sensing devices (e.g., fitness trackers, electromyography (EMG) sensors, etc.) include external electrodes that can be used to sense electrical signals generated by a user's body. Small consumer electronic devices can also include antennas for wireless transmission of data.

[0005] Charging contacts, electrodes, and antennas can be obtained by performing a process of secondary forming and / or machining (e.g., multi - axis machining) of contact materials on or in the housing material to achieve a small form factor and acceptable quality. Such processes can sometimes be time - consuming, difficult to implement, and costly. Summary of the invention

[0006] One aspect of this disclosure relates to an electronic device, which includes: a non - conductive housing assembly; a conductive seed material formed over an outer surface of the non - conductive housing assembly; a bulk conductive contact material formed over the conductive seed material; and an electronic component connected to the bulk conductive contact material and the conductive seed material.

[0007] On the other hand, the present disclosure relates to an electronic device including: a non-conductive housing assembly; a conductive seed material formed over an outer surface of the non-conductive housing assembly; a body conductive contact material formed over the conductive seed material; a conductive coating material located over at least a portion of the body conductive contact material; and an electronic component connected to the body conductive contact material and the conductive seed material by a conductive via passing through at least a portion of the non-conductive housing assembly.

[0008] In yet another aspect, the present disclosure relates to a method of forming a contact for an electronic device, the method including: forming a conductive seed material over a non-conductive housing assembly of the electronic device; forming a body conductive contact material over the conductive seed material; and connecting the body conductive contact material and the conductive seed material to an electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings illustrate multiple example embodiments and are part of the specification. Together with the following description, these drawings illustrate and explain various principles of the present disclosure.

[0010] Figure 1 is a side cross-sectional view of an electronic device in accordance with at least one embodiment of the present disclosure.

[0011] Figure 2 is a side cross-sectional view of an electronic device in accordance with at least one additional embodiment of the present disclosure.

[0012] Figure 3 is a detailed cross-sectional view of a contact of an electronic device in accordance with at least one embodiment of the present disclosure.

[0013] Figure 4 is a flow chart illustrating a method of forming a contact for an electronic device in accordance with at least one embodiment of the present disclosure.

[0014] Figure 5 is an illustration of an example augmented reality glasses that can be used in conjunction with embodiments of the present disclosure.

[0015] Figure 6 is an illustration of an example virtual-reality headset that can be used in conjunction with embodiments of the present disclosure.

[0016] Figure 7A and Figure 7B is an illustration of an example human-machine interface configured to be worn on a user's lower arm or wrist.

[0017] Figure 8A and8B It is a diagrammatic illustration of an example schematic diagram of internal components of a wearable system.

[0018] Throughout the drawings, like reference numerals and descriptions indicate like but not necessarily identical elements. While the example embodiments described herein are susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in detail herein. However, the example embodiments described herein are not intended to be limited to the particular forms disclosed. On the contrary, this disclosure covers all modifications, equivalents, and alternatives falling within the scope of this disclosure. Detailed Description

[0019] Many small consumer electronic devices (e.g., watches, phones, fitness trackers, wireless earbuds, smart glasses, and augmented reality glasses, etc.) include rechargeable batteries. These batteries can be charged using charging contacts exposed on the electronic device. Similarly, some sensing devices (e.g., fitness trackers, electromyography (EMG) sensors, etc.) include external electrodes capable of being used to sense electrical signals generated by a user's body. Small consumer electronic devices can also include antennas for wireless transmission of data.

[0020] Charging contacts, electrodes, and antennas can be obtained with a small form factor and acceptable quality by a process of performing secondary molding and / or machining (e.g., multi-axis machining) of contact materials on or in the housing material. Such a process can sometimes be time-consuming, difficult to implement, and costly.

[0021] This disclosure generally relates to forming sensors (e.g., EMG) contacts, charging contacts, antennas, and / or other conductive elements on consumer electronic devices (e.g., small consumer electronic devices, wearable devices, etc.). For simplicity, such contacts or antennas are generally referred to herein as "contacts". The contacts can be formed by directly plating or depositing a conductive material on an underlying non-conductive housing or other substrate material (including plastics, ceramics, glass, or other non-conductive substrates that can be part of the device).

[0022] The disclosed process may include etching (e.g., solvent etching, laser etching, plasma etching, etc.) a substrate to create a rough surface for good adhesion. Next, a conductive seed layer may be deposited on the surface, which may be achieved by metal colloid activation plus electroless plating and / or by physical vapor deposition (PVD) coating. The seed layer may be patterned, such as by a mask, using electrophoretic coating and laser engraving the area to be deposited and / or by using direct laser activation. Then, a bulk conductive material (e.g., copper (Cu), nickel (Ni), silver (Ag), chromium (Cr), etc.) may be electroplated or deposited on the patterned seed layer. A conductive protective coating (e.g., palladium (Pd), gold (Au), platinum (Pt), silver (Ag), rhodium (Rh), etc.) may also be coated onto the bulk conductive material. For high wear applications, a conductive nitride or a diamond-like carbon (DLC) coating may also be used. In some examples, the plated / coated contact material may be connected to the underlying electronic device with conductive vias and / or conductive posts or by continuous plating from the front to the back of the housing. Due to the potential thickness of the contacts, some embodiments of the present disclosure are suitable for low current signal transmission, such as for charging and / or sensing of small wearable devices (e.g., watches, exercise sensors, wearable electromyography sensors, etc.).

[0023] In some examples, the term "contact" may refer to any conductive contact, including charging contacts, sensor electrodes, and antennas, etc. The terms "conductive" and "non-conductive" generally may refer to electrically conductive and electrically non-conductive. These terms may be used relative to each other, meaning that a conductive material may be more electrically conductive (e.g., have a lower resistivity) than the corresponding non-conductive material, while the non-conductive material may be less electrically conductive (e.g., have a higher resistivity) than the corresponding conductive material.

[0024] Figure 1 is a side cross-sectional view of an electronic device 100 according to at least one embodiment of the present disclosure. The electronic device 100 may include a non-conductive housing assembly 102, at least one contact 104 formed on an outer surface of the non-conductive housing assembly 102, and an electronic component 106 connected (e.g., electrically connected) to the contact 104. The electronic device 100 is shown in the form of a watch or a wristband, but the present disclosure is not limited thereto. Additional examples of electronic devices according to the present disclosure may include a ring, an armband, earbuds, augmented reality glasses, a fitness tracker, or any other electronic device that may include externally exposed contacts on a non-conductive housing.

[0025] In some examples, the non-conductive housing assembly 102 may be formed of a non-conductive material or may include a non-conductive material, such as a polymeric material, a ceramic material, a glass material, a composite material, etc.

[0026] The contact 104 may be, for example, a charging contact or a sensor electrode. The electronic component 106 may include, for example, a battery, a microcontroller, communication elements (e.g., for wireless communication and / or wired communication), sensing circuitry (e.g., EMG sensing circuitry), a display screen, and / or a touch screen, etc. In an example where the battery is included in the electronic component 106, the contact 104 may be a charging contact. In a case where the electronic component 106 includes sensing circuitry, the contact 104 may be a sensor electrode. The electronic component 106 may be positioned on the outer surface of the non-conductive housing assembly 102 (e.g., as Figure 1 shown), encapsulated within the non-conductive housing assembly 102, and / or partially encapsulated within the non-conductive housing assembly 102.

[0027] In some examples, the contact 104 may include a relatively thin material formed on the surface of the non-conductive housing assembly 102. For example, the contact 104 may have a thickness in the range of 1 μm to 30 μm that covers the non-conductive housing assembly 102. The contact 104 may have a sheet resistance in the range from less than 1 milliohm to about 200 milliohms, which may allow sufficient current to flow for sensing and / or charging.

[0028] The contact 104 may be connected to the electronic component 106 in various ways. For example, a conductive connection 108 (such as a conductive via, a conductive post, and / or a conductive strip) may run along or through the non-conductive housing assembly 102 to connect the contact 104 to the electronic component 106. If the conductive connection 108 includes a conductive via, the via may pass through the non-conductive housing assembly 102 by coating and / or filling the hole through the non-conductive housing assembly with a conductive material. If the conductive connection 108 includes a conductive post or a conductive strip, the post or strip may be formed by shaping the conductive post or strip in or on the non-conductive housing assembly 102. In additional examples, the housing assembly 102 may include more than one component, and a conductive plating may be applied around the edges and back sides of at least one component of the housing assembly 102 to reach the electronic component 106. In further examples, a conductive adhesive material may be used to connect the electronic component 106 to the contact 104.

[0029] Figure 1Shows a contact 104 on an outer surface (e.g., a radially outer surface) of a non-conductive housing assembly 102, and an electronic component 106 on an inner outer surface (e.g., a radially inner surface) of the non-conductive housing assembly 102. However, the present disclosure is not limited thereto, and other configurations are possible. For example, the contact 104 may include one or more contacts on an inner outer surface of the non-conductive housing assembly 102, and the electronic component may be on an outer outer surface of the non-conductive housing assembly or at least partially within an inner compartment of the non-conductive housing assembly.

[0030] For example, Figure 2 is a side cross-sectional view of an electronic device 200 according to at least one additional embodiment of the present disclosure, which may include a non-conductive housing assembly 202, two contacts 204 on an inner (e.g., radially inner) outer surface of the non-conductive housing assembly 202, and an electronic component 206 on an outer outer surface of the non-conductive housing assembly 202. The two contacts 204 may be connected to the electronic component 206 with respective electrical connections 208, such as conductive vias, conductive posts, conductive strips, or combinations thereof.

[0031] In some embodiments, the positioning of the contacts 204 on the inner outer surface of the non-conductive housing assembly 206 may be suitable for using the contacts 204 as sensors (such as EMG sensors, etc.), because when the electronic device 200 is worn by a user, the contacts 204 may rest on the user's skin.

[0032] Figure 3 is a detailed cross-sectional view of a contact 304 of an electronic device 300 according to at least one embodiment of the present disclosure. The electronic device 300 may include a non-conductive housing assembly 302, one or more contacts 304, and an electronic device 306 (such as a battery, a sensing circuit, etc.) connected to the one or more contacts 304 (such as with conductive vias, conductive posts, and / or conductive strips).

[0033] The contact 304 may include a conductive seed material 310 formed on a surface of the non-conductive housing assembly 302. The conductive seed material 310 may be deposited by metal colloid activation plus electroless plating or by physical vapor deposition (PVD) coating. For example, electroless copper may be deposited on a metal colloid active plastic. In another example, a conductive PVD metal (such as chromium, nickel, titanium, copper, gold, etc.) may be deposited on ceramics, glass, or certain plastics.

[0034] The pattern of the conductive seed material 310 can be achieved in various ways, such as through a mask, by using electrophoretic coatings and laser engraving the areas to be deposited, and / or by directly using laser activation. To improve the adhesion between the non-conductive housing assembly 302 and the conductive seed material 310, the surface of the non-conductive housing assembly 302 can be etched to create increased roughness and / or an activated surface. As an example, suitable etching techniques can include solvent etching, laser etching, and / or plasma etching. After depositing the conductive seed material 310, strike plating can be used to improve the uniformity of the contact 304 and increase conductivity, followed by electroplating of the main body conductive contact material 312 (e.g., copper, nickel, silver, etc.) above the non-conductive housing assembly 302 to a predetermined contact thickness T. By way of example and not limitation, in some embodiments, the thickness T of the contact 304 can be between about 1 μm and about 30 μm. A rack plating process can be used to form at least a portion of the contact 304, but for certain form factors, other plating processes are also possible.

[0035] In some examples, a coating material 314 can be deposited above the main body conductive contact material 312. The coating material 314 can include a conductive noble metal material (e.g., palladium, gold, platinum, silver, or rhodium), such as for preventing oxidation and corrosion. In additional examples, the coating material 314 can include a conductive mechanical protection material for preventing scratches and dents, such as conductive nitrides and / or diamond-like carbon (DLC) materials.

[0036] If the contact 304 is used for battery charging, the contact 304 can be configured to conduct current in the milliamp range (e.g., 1 milliamp to several hundred milliamps). If the contact 304 is used as a sensing contact, the contact 304 can be configured to conduct current in the microamp range (e.g., 1 microamp to several hundred microamps).

[0037] Figure 4 is a flowchart showing a method 400 for forming a contact for an electronic device according to at least one embodiment of the present disclosure. At operation 410, a conductive seed material can be formed above the non-conductive housing assembly of the electronic device. Operation 410 can be performed in various ways, such as any of the ways discussed above with reference to Figures 1 to 3 Any of the ways discussed above.

[0038] At operation 420, a main body conductive contact material can be formed above the conductive seed material. Operation 420 can be performed in various ways, such as any of the ways discussed above with reference to Figures 1 to 3 Any of the ways discussed above.

[0039] At operation 430, the bulk conductive contact material and the conductive seed material can be connected to an electronic component (such as, a battery or a sensing circuit). Operation 430 can be performed in various ways, such as any of the ways discussed above with reference to Figures 1 to 3 any of the ways discussed above.

[0040] In some embodiments, method 400 can include additional operations, such as any of the operations discussed above with reference to Figures 1 to 3 any of the operations discussed above. For example, method 400 can include etching a non-conductive housing component prior to forming the conductive seed material, and / or positioning the conductive seed material and the bulk conductive contact material on an inner outer surface or an outer outer surface of the non-conductive housing component, forming a coating material over the bulk conductive contact material, and the like.

[0041] Accordingly, the present disclosure includes electronic devices and methods of forming contacts for electronic devices that can improve machinability, reliability, functionality, and cost as compared to existing known devices and methods.

[0042] Embodiments of the present disclosure can include or be implemented in conjunction with various types of artificial reality systems. Artificial reality is a form of reality that has been adjusted in some manner prior to presentation to a user, and artificial reality can include, for example, virtual reality, augmented reality, mixed reality, or hybrid reality, or some combination and / or derivative thereof. Artificial reality content can include content that is entirely computer-generated or content that is computer-generated in combination with captured (e.g., real-world) content. Artificial reality content can include video, audio, haptic feedback, or some combination thereof, any of which can be presented in a single channel or multiple channels (such as stereoscopic video that produces a three-dimensional (3D) effect for a viewer). Additionally, in some embodiments, artificial reality can also be associated with applications, products, accessories, services, or some combination thereof for creating content in and / or otherwise for use in artificial reality (such as to perform an activity therein).

[0043] Artificial reality systems can be implemented in a variety of different form factors and configurations. Some artificial reality systems can be designed to operate without a near-eye display (NED). Other artificial reality systems can include an NED that also provides visibility of the real world (such as, for example, Figure 5 the augmented reality system 500), or that visually immerses a user in the artificial reality (such as, for example, Figure 6The virtual reality system 600). While some artificial reality devices can be self - contained systems, other artificial reality devices can communicate with and / or coordinate with external devices to provide an artificial reality experience to a user. Examples of such external devices include handheld controllers, mobile devices, desktop computers, devices worn by the user, devices worn by one or more other users, and / or any other suitable external system.

[0044] Turning Figure 5 , the augmented reality system 500 can include a glasses device 502 having a frame 510 configured to hold a left display device 515(A) and a right display device 515(B) in front of the user's eyes. The display devices 515(A) and 515(B) can act together or independently to present an image or a group of images to the user. While the augmented reality system 500 includes two displays, embodiments of the present disclosure can be implemented in augmented reality systems having a single NED or more than two NEDs.

[0045] In some embodiments, the augmented reality system 500 can include one or more sensors (such as, sensor 540). The sensor 540 can generate a measurement signal in response to the movement of the augmented reality system 500 and can be located on substantially any part of the frame 510. The sensor 540 can represent one or more of various different sensing mechanisms, such as a positioning sensor, an inertial measurement unit (IMU), a depth camera assembly, a structured light emitter and / or detector, or any combination thereof. In some embodiments, the augmented reality system 500 can include or can not include the sensor 540 or can include more than one sensor. In embodiments where the sensor 540 includes an IMU, the IMU can generate calibration data based on the measurement signal from the sensor 540. Examples of the sensor 540 can include, but are not limited to, accelerometers, gyroscopes, magnetometers, other suitable types of sensors for detecting motion, sensors for error correction of the IMU, or some combination thereof.

[0046] In some examples, the augmented reality system 500 can also include a microphone array having a plurality of acoustic transducers 520(A) - 520(J), collectively referred to as acoustic transducers 520. The acoustic transducers 520 can represent transducers that detect changes in air pressure caused by sound waves. Each acoustic transducer 520 can be configured to detect sound and convert the detected sound into an electronic format (e.g., analog or digital format). Figure 5The microphone array therein may include, for example, ten acoustic transducers: 520(A) and 520(B), which may be designed to be placed in the respective ears of a user; acoustic transducers 520(C), 520(D), 520(E), 520(F), 520(G) and 520(H), which may be positioned at different locations on the frame 510, and / or acoustic transducers 520(I) and 520(J), which may be positioned on the respective neckbands 505.

[0047] In some embodiments, one or more of the acoustic transducers 520(A)-(J) may be used as output transducers (e.g., speakers). For example, acoustic transducers 520(A) and / or 520(B) may be earbuds or any other suitable type of earbud or speaker.

[0048] The configuration of the acoustic transducers 520 of the microphone array may vary. Although the augmented reality system 500 is shown in Figure 5 as having ten acoustic transducers 520, the number of acoustic transducers 520 may be greater than or less than ten. In some examples, using a greater number of acoustic transducers 520 may increase the amount of audio information collected and / or the sensitivity and accuracy of the audio information. Conversely, using a lower number of acoustic transducers 520 may reduce the computational power required by the associated controller 550 to process the collected audio information. Additionally, the position of each acoustic transducer 520 of the microphone array may vary. For example, the position of the acoustic transducers 520 may include user-defined positions, coordinates defined on the frame 510, the orientation associated with each acoustic transducer 520, or some combination thereof.

[0049] The acoustic transducers 520(A) and 520(B) can be positioned on different parts of the user's ear, such as behind the pinna, behind the tragus, and / or within the auricle or fossa. Alternatively, in addition to the acoustic transducer 520 within the ear canal, additional acoustic transducers 520 can be present on or around the ear. Positioning the acoustic transducer 520 near the user's ear canal enables the microphone array to collect information about how sound reaches the ear canal. By positioning at least two of the acoustic transducers 520 on either side of the user's head (e.g., as a binaural microphone), the augmented reality device 500 can simulate binaural hearing and capture the 3D stereo sound field around the user's head. In some embodiments, the acoustic transducers 520(A) and 520(B) can be connected to the augmented reality system 500 via a wired connection 530, and in other embodiments, the acoustic transducers 520(A) and 520(B) can be connected to the augmented reality system 500 via a wireless connection (e.g., a Bluetooth connection). In other embodiments, the acoustic transducers 520(A) and 520(B) may not be used in conjunction with the augmented reality system 500 at all.

[0050] The acoustic transducers 520 on the frame 510 can be arranged in various different ways, including along the length of the temple, across the bridge, above or below the display devices 515(A) and 515(B), or some combination thereof. The acoustic transducers 520 can be oriented such that the microphone array can detect sound in a wide range of directions around the user wearing the augmented reality system 500. In some embodiments, an optimization process can be performed during the manufacture of the augmented reality system 500 to determine the relative positioning of the individual acoustic transducers 520 in the microphone array.

[0051] In some examples, the augmented reality system 500 can include or be connected to an external device (e.g., a paired device), such as a neckband 505. The neckband 505 generally represents any type or form of paired device. Thus, the following discussion regarding the neckband 505 also applies to various other paired devices, such as a charging case, smartwatch, smartphone, wristband, other wearable devices, handheld controller, tablet computer, laptop computer, other external computing devices, etc.

[0052] As shown, the neckband 505 can be coupled to the glasses device 502 via one or more connectors. The connectors can be wired or wireless and can include electrical and / or non-electrical (e.g., structural) components. In some cases, the glasses device 502 and the neckband 505 can operate independently without any wired or wireless connection between them. While Figure 5Shows components of the eyewear device 502 and the neckband 505 at example locations on the eyewear device 502 and the neckband 505, but these components can be located elsewhere and / or distributed differently on the eyewear device 502 and / or the neckband 505. In some embodiments, the components of the eyewear device 502 and the neckband 505 can be located on one or more additional peripheral devices paired with the eyewear device 502, the neckband 505, or some combination thereof.

[0053] Pairing an external device (such as the neckband 505) with an augmented reality eyewear device can enable the eyewear device to achieve the form factor of a pair of glasses while still providing sufficient battery and computing power for extended capabilities. Some or all of the battery power, computing resources, and / or additional features of the augmented reality system 500 can be provided by or shared between the paired device and the eyewear device, thereby reducing the weight, heat distribution, and form factor of the overall eyewear device while still maintaining the required functionality. For example, the neckband 505 can allow components that would otherwise be included on the eyewear device to be included in the neckband 505, as users can tolerate more weight on their shoulders than on their heads. The neckband 505 can also have a larger surface area through which heat can be diffused and dissipated into the surrounding environment. Thus, the neckband 505 can allow for greater battery power and computing capabilities than may be achievable on a standalone eyewear device. Since the weight carried in the neckband 505 may be less invasive to the user than the weight carried in the eyewear device 502, the user can tolerate wearing a lighter eyewear device and carrying or wearing the paired device for a longer duration than the user can tolerate wearing a heavy standalone eyewear device, enabling the user to more fully integrate the artificial reality environment into their daily activities.

[0054] The neckband 505 can be communicatively coupled to the eyewear device 502 and / or other devices. These other devices can provide certain functions (such as tracking, positioning, depth mapping, processing, storage, etc.) to the augmented reality system 500. In Figure 5 embodiments, the neckband 505 can include two acoustic transducers (such as 520(I) and 520(J)) that are part of a microphone array (or may form their own microphone subarray). The neckband 505 can also include a controller 525 and a power supply 535.

[0055] The acoustic transducers 520(I) and 520(J) of the neckband 505 can be configured to detect sound and convert the detected sound into an electronic format (analog or digital). In Figure 5In an embodiment, the acoustic transducers 520(I) and 520(J) can be positioned on the neckband 505, thereby increasing the distance between the neckband acoustic transducers 520(I) and 520(J) and other acoustic transducers 520 positioned on the eyewear device 502. In some cases, increasing the distance between the acoustic transducers 520 of the microphone array can improve the accuracy of beamforming performed via the microphone array. For example, if acoustic transducers 520(C) and 520(D) detect a sound, and the distance between acoustic transducers 520(C) and 520(D) is greater than, for example, the distance between acoustic transducers 520(D) and 520(E), the determined source location of the detected sound may be more accurate than the sound detected by acoustic transducers 520(D) and 520(E).

[0056] The controller 525 of the neckband 505 can process information generated by sensors on the neckband 505 and / or the augmented reality system 500. For example, the controller 525 can process information from the microphone array that describes the sound detected by the microphone array. For each detected sound, the controller 525 can perform an estimate of the direction-of-arrival (DOA) to estimate the direction in which the detected sound arrives at the microphone array. When the microphone array detects a sound, the controller 525 can populate the audio data set with this information. In embodiments in which the augmented reality system 500 includes an inertial measurement unit, the controller 525 can perform all inertial and spatial calculations based on the IMU located on the eyewear device 502. The connector can transmit information between the augmented reality system 500 and the neckband 505 and between the augmented reality system 500 and the controller 525. The information can be in the form of optical data, electrical data, wireless data, or any other form of transmissible data. Moving the processing of the information generated by the augmented reality system 500 to the neckband 505 can reduce the weight and heat of the eyewear device 502, making it more comfortable for the user.

[0057] The power source 535 in the neckband 505 can supply power to the eyewear device 502 and / or the neckband 505. The power source 535 can include, but is not limited to, lithium-ion batteries, lithium polymer batteries, primary lithium batteries, alkaline batteries, or any other form of electrical storage. In some cases, the power source 535 can be a wired power source. Including the power source 535 on the neckband 505 rather than on the eyewear device 502 can help better distribute the weight and heat generated by the power source 535.

[0058] As described, some artificial reality systems can substantially replace one or more of a user's sensory perceptions of the real world with a virtual experience, rather than mixing artificial reality with actual reality. An example of this type of system is a head-mounted display system (such as,Figure 6 in the virtual reality system 600) that mostly or entirely covers the user's field of view. The virtual reality system 600 may include a front rigid body 602 and a strap 604 shaped to fit around the user's head. The virtual reality system 600 may also include output audio converters 606(A) and 606(B). Additionally, although not shown in Figure 6 , the front rigid body 602 may include one or more electronic components, including one or more electronic displays, one or more inertial measurement units (IMUs), one or more tracking transmitters or detectors, and / or any other suitable devices or systems for creating an artificial reality experience.

[0059] Artificial reality systems may include various types of visual feedback mechanisms. For example, the display devices in the augmented reality system 500 and / or the virtual reality system 600 may include one or more liquid crystal displays (LCDs), light emitting diode (LED) displays, microLED displays, organic LED (OLED) displays, digital light project (DLP) microdisplays, liquid crystal on silicon (LCoS) microdisplays, and / or any other suitable type of display screen. These artificial reality systems may include a single display screen for both eyes or may provide a display screen for each eye, which may allow for additional flexibility for zoom adjustment or for correcting the user's refractive error. Some of these artificial reality systems may also include an optical subsystem having one or more lenses (e.g., concave or convex lenses, Fresnel lenses, adjustable liquid lenses, etc.) through which the user can view the display screen. These optical subsystems may be used for various purposes, including collimation (e.g., making an object appear at a greater distance than its physical distance), magnification (e.g., making an object appear larger than its actual size), and / or transmitting (to, for example, the viewer's eyes) light. These optical subsystems may be used for non-pupil-forming architectures (such as a single-lens configuration that directly collimates light but causes so-called pincushion distortion) and / or pupil-forming architectures (such as a multi-lens configuration that produces so-called barrel distortion to counteract pincushion distortion).

[0060] In addition to, or instead of, using a display screen, some of the artificial reality systems may include one or more projection systems. For example, the display devices in the augmented reality system 500 and / or the virtual reality system 600 may include a micro-LED projector (using, for example, a waveguide) that projects light into the display device, such as a transparent combiner lens that allows ambient light to pass through. The display device may refract the projected light into the user's pupil and may enable the user to view both the artificial reality content and the real world simultaneously. The display device may use any of a variety of different optical components to achieve this, including waveguide components (e.g., holographic, planar, diffractive, polarization, and / or reflective waveguide elements), light manipulation surfaces and elements (such as diffractive, reflective, and refractive elements and gratings), coupling elements, etc. The artificial reality system may also be configured with any other suitable type or form of image projection system, such as a retinal projector for a virtual retinal display.

[0061] The artificial reality systems described herein may also include various types of computer vision components and subsystems. For example, the augmented reality system 500 and / or the virtual reality system 600 may include one or more optical sensors, such as two-dimensional (2D) or 3D cameras, structured light emitters and detectors, time-of-flight depth sensors, single-beam or scanning lidar sensors, 3D LiDAR sensors, and / or any other suitable type or form of optical sensor. The artificial reality system may process data from one or more of these sensors to identify the user's location, thereby mapping the real world, providing context about the real-world environment to the user, and / or performing various other functions.

[0062] The artificial reality system may also include one or more input and / or output audio transducers. The output audio transducer may include a voice coil speaker, a ribbon speaker, an electrostatic speaker, a piezoelectric speaker, a bone conduction transducer, a cartilage conduction transducer, a tragus vibration transducer, and / or any other suitable type or form of audio transducer. Similarly, the input audio transducer may include a capacitive microphone, a dynamic microphone, a ribbon microphone, and / or any other type or form of input transducer. In some embodiments, a single transducer may be used for both audio input and audio output.

[0063] In some embodiments, the artificial reality systems described herein may also include a haptic (i.e., tactile) feedback system that may be incorporated into a headset, gloves, a bodysuit, a handheld controller, environmental devices (e.g., chairs, floor mats, etc.), and / or any other type of device or system. The haptic feedback system may provide various types of cutaneous feedback, including vibration, force, traction, texture, and / or temperature. The haptic feedback system may also provide various types of kinesthetic feedback (such as movement and compliance). Haptic feedback may be implemented using motors, piezoelectric actuators, fluid systems, and / or various other types of feedback mechanisms. The haptic feedback system may be implemented independently of, within, and / or in combination with other artificial reality devices.

[0064] By providing haptic, auditory, and / or visual content, the artificial reality system may create a complete virtual experience or enhance the user's real-world experience in various contexts and environments. For example, the artificial reality system may assist or augment the user's perception, memory, or cognition within a particular environment. Some systems may enhance the user's interaction with others in the real world or may enable a more immersive interaction with others in a virtual world. Artificial reality systems may also be used for educational purposes (e.g., for teaching or training in schools, hospitals, government organizations, military organizations, commercial enterprises, etc.), entertainment purposes (e.g., for playing video games, listening to music, watching video content, etc.), and / or for accessibility purposes (e.g., as a hearing aid, a visual assistive device, etc.). The embodiments disclosed herein may be implemented or enhance the user's artificial reality experience in one or more of these contexts and environments and / or other contexts and environments.

[0065] Figure 7A An example human-machine interface (also referred to herein as an EMG control interface) configured to be worn around a user's lower arm or wrist as a wearable system 700 is shown. In this example, the wearable system 700 may include sixteen neuromuscular sensors 710 (e.g., EMG sensors) circumferentially disposed around an elastic band 720, the inner surface 730 of which is configured to contact the user's skin. However, any suitable number of neuromuscular sensors may be used. The number and arrangement of the neuromuscular sensors may depend on the particular application for which the wearable device is used. For example, a wearable armband or wristband may be used to generate control information for controlling an augmented reality system, a robot, a control vehicle, scrolling text, controlling an avatar, or any other suitable control task. As shown, flexible electronics incorporated into a wireless device may be used to couple the sensors together. Figure 7B Shown by Figure 7ACross-sectional view of one of the sensors of the wearable device shown in the figure. In some embodiments, a hardware signal processing circuit may optionally be used to process the output of one or more of the sensing components (e.g., to perform amplification, filtering, and / or rectification). In other embodiments, at least some signal processing of the output of the sensing components may be performed in software. Thus, signal processing of the signals sampled by the sensors may be performed in hardware, software, or by any suitable combination of hardware and software, as aspects of the techniques described herein are not limited thereto. The following is a reference to Figure 8A and Figure 8B for a more detailed discussion of a non-limiting example of a signal processing chain for processing recorded data from sensor 710.

[0066] Figure 8A and Figure 8B show an example schematic diagram of the internal components of a wearable system with an EMG sensor. As shown, the wearable system may include a wearable portion 810 ( Figure 8A ) and a dongle portion 820 ( Figure 8B ) that communicates with the wearable portion 810 (e.g., via Bluetooth or other suitable wireless communication technology). As Figure 8A shown, the wearable portion 810 may include skin contact electrodes 811, and examples of such skin contact electrodes are described in conjunction with Figure 7A and Figure 7B . The output of the skin contact electrodes 811 may be provided to an analog front end 830, which may be configured to perform analog processing (e.g., amplification, noise reduction, filtering, etc.) on the recorded signals. The processed analog signal may then be provided to an analog-to-digital converter 832, which may convert the analog signal into a digital signal that can be processed by one or more computer processors. An example of a computer processor that can be used in accordance with some embodiments is the Figure 8A microcontroller (MCU) 834 shown in the figure. As shown, the MCU 834 may also include inputs from other sensors (e.g., IMU sensor 840) as well as a power and battery module 842. The output of the processing performed by the MCU 834 may be provided to an antenna 850 for transmission to the Figure 8B dongle portion 820 shown in the figure.

[0067] The dongle portion 820 may include an antenna 852 that may be configured to communicate with an antenna 850 included as part of the wearable portion 810. Communication between the antennas 850 and 852 may be performed using any suitable wireless technology and protocol, non-limiting examples of which include radio frequency signals and Bluetooth. As shown, the signal received by the antenna 852 of the dongle portion 820 may be provided to a host computer for further processing, display, and / or enabling control of a particular physical or virtual object or objects.

[0068] Although the reference Figures 7A to 7B and Figures 8A to 8B The examples provided are discussed in the context of interfaces with EMG sensors, but the techniques described herein for reducing electromagnetic interference can also be implemented in wearable interfaces with other types of sensors, including but not limited to mechanomyography (MMG) sensors, sonomyography (SMG) sensors, and electrical impedance tomography (EIT) sensors. The techniques described herein for reducing electromagnetic interference can also be implemented in wearable interfaces that communicate with a computer host via wires and cables (e.g., USB cables, fiber optic cables, etc.).

[0069] The following example embodiments are also disclosed:

[0070] Example 1. An electronic device, comprising: a non-conductive shell component; a conductive seed material formed above an outer surface of the non-conductive shell component; a main body conductive contact material formed above the conductive seed material; and an electronic component connected to the main body conductive contact material and the conductive seed material.

[0071] Example 2. The electronic device of Example 1 further comprising a conductive via that passes through the non-conductive housing component and connects the body conductive contact material and the conductive seed material to the electronic component.

[0072] Example 3. An electronic device according to Example 1 or Example 2, the electronic device also includes a conductive connection portion, the conductive connection portion includes at least one of the following: a conductive column, which passes through the non-conductive shell component; a conductive plating, which is on the surface of the non-conductive shell component; or a conductive strip, which is formed in the non-conductive shell component, and the conductive connection portion connects the main body conductive contact material and the conductive seed material to the electronic component.

[0073] Example 4. The electronic device according to any one of Examples 1 to 3, wherein the electronic component includes a battery, and the body conductive contact material includes a charging contact for the battery.

[0074] Example 5. The electronic device according to any one of Examples 1 to 4, further comprising at least one conductive coating material over at least a portion of the body conductive contact material, the at least one conductive coating material including at least one of the following: nitride, diamond-like carbon, chromium, palladium, gold, platinum, silver, or rhodium.

[0075] Example 6. The electronic device according to any one of Examples 1 to 5, wherein the electronic component includes a sensing circuit, and the body conductive contact material includes at least one sensor electrode for the sensing circuit.

[0076] Example 7. The electronic device according to Example 6, wherein the sensing circuit includes an electromyogram sensing circuit.

[0077] Example 8. The electronic device according to any one of Examples 1 to 7, wherein the body conductive contact material includes an electrode pair having two electrodes.

[0078] Example 9. An electronic device, comprising: a non-conductive housing assembly; a conductive seed material formed over an outer surface of the non-conductive housing assembly; a body conductive contact material formed over the conductive seed material; a conductive coating material located over at least a portion of the body conductive contact material; and an electronic component connected to the body conductive contact material and the conductive seed material by a conductive via passing through at least a portion of the non-conductive housing assembly.

[0079] Example 10. A method of forming a contact for an electronic device, the method comprising: forming a conductive seed material over a non-conductive housing assembly of the electronic device; forming a body conductive contact material over the conductive seed material; and connecting the body conductive contact material and the conductive seed material to an electronic component.

[0080] Example 11. The method according to Example 10, wherein connecting the body conductive contact material and the conductive seed material to an electronic component includes: forming a conductive via passing through at least a portion of the non-conductive housing assembly; forming a conductive seed material in electrical contact with the conductive via; and electrically connecting the conductive via to the electronic component.

[0081] Example 12. The method according to Example 10 or Example 11, wherein connecting the body conductive contact material and the conductive seed material to the electronic component includes: forming at least one of a conductive post or a conductive strip in the non-conductive housing assembly; forming a conductive seed material in electrical contact with the conductive post or the conductive strip; and connecting the conductive post or the conductive strip to the electronic component.

[0082] Example 13. The method according to any one of Examples 10 to 12, wherein the electronic component includes a battery.

[0083] Example 14. The method according to any one of Examples 10 to 13, wherein the electronic component includes a sensing circuit.

[0084] Example 15. The method according to Example 14, wherein the sensing circuit includes an electromyogram sensing circuit.

[0085] Example 16. The method according to any one of Examples 10 to 15, the method further comprising coating at least a portion of the body conductive contact material with at least one conductive coating material, the at least one conductive coating material including at least one of the following: nitride, diamond-like carbon, chromium, palladium, gold, platinum, silver, or rhodium.

[0086] Example 17. The method according to any one of Examples 10 to 16, wherein forming the conductive seed material above the non-conductive housing assembly includes: forming at least one of the following above the non-conductive housing assembly: copper, nickel, titanium, chromium, or gold.

[0087] Example 18. The method according to any one of Examples 10 to 17, the method further comprising etching the surface of the non-conductive housing assembly, wherein forming the conductive seed material includes forming the conductive seed material on the etched surface of the non-conductive housing assembly.

[0088] Example 19. The method according to any one of Examples 10 to 18, wherein forming the body conductive contact material above the conductive seed material includes forming at least one of the following above the conductive seed material: copper, nickel, or silver.

[0089] Example 20. The method according to any one of Examples 10 to 19, wherein forming the body conductive contact material above the conductive seed material includes forming the body conductive contact material to have a thickness between 1 μm and 30 μm.

[0090] The process parameters and sequence of steps described and / or illustrated herein are given by way of example only and may be varied as desired. For example, although the steps illustrated and / or described herein may be illustrated or discussed in a particular order, these steps need not necessarily be performed in the order illustrated or discussed. The various example methods described and / or illustrated herein may also omit one or more of the steps described or illustrated herein, or may include additional steps in addition to the steps disclosed.

[0091] The foregoing description has been provided to enable other persons skilled in the art to best utilize the various aspects of the example embodiments disclosed herein. The example description is not intended to be exhaustive or to be limited to any precise form. Many modifications and variations are possible without departing from the spirit and scope of the present disclosure. The example embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The scope of the present disclosure should be determined with reference to any appended claims and their equivalents.

[0092] Unless otherwise stated, as used in the specification and claims, the terms "connected to" and "coupled to" (and their derivatives) shall be construed to allow both direct and indirect (i.e., via other elements or components) connection. Further, as used in the specification and claims, the term "a" or "an" shall be construed to mean "at least one." Finally, for convenience of use, the terms "comprising" and "having" (and their derivatives) used in the specification and claims may be interchanged with the word "including" and have the same meaning.

Claims

1. An electronic device, the electronic device comprising: A non-conductive housing assembly; A conductive seed material formed over an outer surface of the non-conductive housing assembly; A body conductive contact material formed over the conductive seed material; And An electronic component connected to the body conductive contact material and the conductive seed material.

2. The electronic device according to claim 1, wherein, The electronic device further includes a conductive via passing through the non-conductive housing assembly and connecting the body conductive contact material and the conductive seed material to the electronic component.

3. The electronic device according to claim 1, wherein, The electronic device further includes a conductive connection portion including at least one of the following: a conductive post passing through the non-conductive housing assembly; a conductive plating on a surface of the non-conductive housing assembly; or, a conductive strip formed in the non-conductive housing assembly, the conductive connection portion connecting the body conductive contact material and the conductive seed material to the electronic component.

4. The electronic device according to claim 1, wherein The electronic component includes a battery, and the body conductive contact material includes a charging contact for the battery.

5. The electronic device according to claim 1, wherein, The electronic device further includes at least one conductive coating material over at least a portion of the body conductive contact material, the at least one conductive coating material including at least one of the following: nitride, diamond-like carbon, chromium, palladium, gold, platinum, silver, or rhodium.

6. The electronic device according to claim 1, wherein, The electronic component includes a sensing circuit, and the body conductive contact material includes at least one sensor electrode for the sensing circuit.

7. The electronic device according to claim 6, wherein, The sensing circuit includes an electromyogram sensing circuit.

8. The electronic device according to claim 1, wherein, The body conductive contact material includes an electrode pair including two electrodes.

9. An electronic device, the electronic device comprising: A non-conductive housing assembly; A conductive seed material formed over an outer surface of the non-conductive housing assembly; A body conductive contact material formed over the conductive seed material; A conductive coating material located over at least a portion of the body conductive contact material; And An electronic component connected to the body conductive contact material and the conductive seed material by a conductive via passing through at least a portion of the non-conductive housing assembly.

10. A method of forming a contact for an electronic device, the method comprising: Forming a conductive seed material over a non-conductive housing assembly of the electronic device; Forming a body conductive contact material over the conductive seed material; And Connecting the body conductive contact material and the conductive seed material to the electronic component.

11. The method according to claim 10, wherein, Connecting the body conductive contact material and the conductive seed material to the electronic component includes: Forming a conductive via passing through at least a portion of the non-conductive housing assembly; Forming the conductive seed material in electrical contact with the conductive via; and Electrically connecting the conductive via to the electronic component.

12. The method according to claim 10, wherein Connecting the body conductive contact material and the conductive seed material to the electronic component includes: Forming at least one of a conductive post or a conductive strip in the non-conductive housing assembly; Forming the conductive seed material in electrical contact with the conductive post or the conductive strip; and Electrically connecting the conductive post or the conductive strip to the electronic component.

13. The method according to claim 10, wherein The electronic component includes a battery.

14. The method according to claim 10, wherein The electronic component includes a sensing circuit.

15. The method according to claim 14, wherein, The sensing circuit includes an electromyogram sensing circuit.

16. The method according to claim 10, wherein, The method further includes coating at least a portion of the body conductive contact material with at least one conductive coating material, the at least one conductive coating material including at least one of the following: nitride, diamond-like carbon, chromium, palladium, gold, platinum, silver, or rhodium.

17. The method according to claim 10, wherein, Forming the conductive seed material over the non-conductive housing assembly includes forming at least one of the following over the non-conductive housing assembly: copper, nickel, titanium, chromium, or gold.

18. The method according to claim 10, wherein, The method further includes etching a surface of the non-conductive housing assembly, wherein forming the conductive seed material includes forming the conductive seed material on the etched surface of the non-conductive housing assembly.

19. The method according to claim 10, wherein Forming the body conductive contact material over the conductive seed material includes forming at least one of the following over the conductive seed material: copper, nickel, or silver.

20. The method according to claim 10, wherein Forming the body conductive contact material over the conductive seed material includes forming the body conductive contact material to have a thickness between 1 μm and 30 μm.

Images