Silicon carbide diode device

Abstract

The invention discloses a silicon carbide diode device, and particularly relates to the field of diodes, the silicon carbide diode device comprises a diode body and a frame, the diode body comprises a ceramic chip, the upper surface of the ceramic chip is fixedly connected with a tube shell, and the upper surface of the ceramic chip is further fixedly provided with an upper transition sheet and a silicon carbide chip in sequence; one side of the tube shell is fixedly connected with two ceramic rings, outer leads are fixedly connected in the two ceramic rings, one end, located in the tube shell, of each outer lead is connected with the silicon carbide chip through an inner lead, and one end, located outside the tube shell, of each outer lead is fixedly connected with the frame. Compared with the prior art, the silicon carbide diode disclosed by the invention has a relatively high air ionization voltage level in a product and can work in a complex environment.

Description

Technical Field

[0001] The present invention relates to the technical field of diodes, and more specifically, the present invention relates to a silicon carbide diode device. Background Art

[0002] Silicon carbide (SiC) diodes are a new type of semiconductor material. Compared with traditional silicon (Si) materials, silicon carbide diodes have the characteristics of high-temperature stability and relatively low conduction loss. When two chemical energy power supplies jointly supply current to the control system, by using the unidirectional conductivity of the diodes, a current collecting diode is connected to the positive electrode of each chemical power supply output to prevent the current of the other power supply from flowing into the failed power supply when one power supply fails, which may cause the output voltage to be unstable, and can play a role in preventing the current from flowing into the failed power supply.

[0003] In order to facilitate the installation of the silicon carbide diode device, a frame is respectively welded to its two leads. Through the frame, the silicon carbide diode device can be installed on the circuit board by bolts. Currently, the soldering method is used to weld at the insertion position of the lead and the frame. However, during soldering, the soldering iron only solders at one position of the insertion part, and the solder cannot completely cover the insertion position of the outer lead and the frame, resulting in poor electrical conduction performance and unstable operation. Summary of the Invention

[0004] The silicon carbide diode device provided by the present invention aims to solve the problem that during soldering at the insertion position of the lead and the frame, the soldering iron only solders at one position of the insertion part, and the solder cannot completely cover the insertion position of the outer lead and the frame, resulting in poor electrical conduction performance and unstable operation.

[0005] To achieve the above object, the present invention provides the following technical solution: A silicon carbide diode device, the silicon carbide diode includes a diode body, two frames and two outer leads. The frames are fixed to the diode body through the outer leads. The silicon carbide diode is made by the following method: Step 1: Use a conveyor belt to transport the silicon carbide diode to the welding station; Step 2: Two soldering irons arranged opposite to each other on both sides of the welding station are used as a group to simultaneously weld the outer leads and the frames of the silicon carbide diode, and the two groups of soldering irons respectively weld two adjacent silicon carbide diodes; Step 3: The conveyor belt transports the silicon carbide diode forward, so that the first group of soldering irons weld the next silicon carbide diode, and the second group of soldering irons weld the remaining group of outer leads and frames welded by the first group of soldering irons.

[0006] It further includes a frame, on which a conveyor belt is installed for conveying silicon carbide diodes; a welding assembly is installed on the lower side of the conveyor belt. The welding assembly includes a mounting plate fixedly installed on the frame. On both sides of the upper surface of the welding assembly, a first spur gear and a second spur gear are respectively rotatably connected. The first spur gear and the second spur gear are meshed and driven with each other. A second motor is fixedly installed at the bottom of the mounting plate, and the output shaft of the second motor is fixedly installed with the first spur gear. Eccentric wheels are fixedly installed on the upper surfaces of the first spur gear and the second spur gear. Driving frames are rotatably connected to both eccentric wheels. Two soldering guns are installed at the upper ends of both driving frames. The two soldering guns on the two driving frames are arranged in pairs facing each other. The two soldering guns arranged in pairs facing each other are used to weld a frame and an external lead together simultaneously.

[0007] In a preferred embodiment, the welding assembly further includes a guiding component. The guiding component includes two second guiding rods respectively fixedly installed on both sides of the mounting plate. Two third guiding rods are arranged between the two second guiding rods. Both ends of the two third guiding rods are slidably installed on the two second guiding rods. Both driving frames are movably sleeved on the two third guiding rods.

[0008] In a preferred embodiment, a movable component is arranged at the upper end of the driving frame. The movable component includes a moving frame. Guide rods are fixedly connected to both ends of the moving frame. The two guide rods are horizontally movably inserted into the driving frame. A cylinder is installed on the driving frame, and the output end of the cylinder is fixedly installed with the moving frame.

[0009] In a preferred embodiment, the conveyor belt includes a bracket fixedly installed on the frame. Rotating wheels are rotatably connected to both ends of the bracket. A belt is drivingly connected between the two rotating wheels. A first motor is fixedly installed on the bracket, and the output end of the first motor is drivingly connected to one of the rotating wheels.

[0010] In a preferred embodiment, a plurality of grooves are formed on the surface of the belt. The plurality of grooves are grouped in pairs, and the two grooves in the same group are symmetrically arranged. The grooves are used to accommodate the frames.

[0011] In a preferred embodiment, a material trough is arranged at the position in front of the welding assembly at the upper end of the conveyor belt. The material trough is fixedly installed on the conveyor belt. One side of the material trough has a feed inlet, and the lower end of the other side of the material trough has a discharge outlet.

[0012] In a preferred embodiment, a feeding assembly is arranged at the bottom of the second spur gear. The feeding assembly includes a rotating column fixedly connected to the middle of the second spur gear. A slant groove is formed on the outer side wall of the rotating column. A material rod is vertically inserted into the mounting plate, and the bottom end of the material rod is horizontally inserted into the slant groove and can slide inside the slant groove. The upper end of the material rod is vertically inserted at the position of the discharge outlet.

[0013] In a preferred embodiment, a shrapnel is fixedly connected to the side wall of the discharge port. When the diode body is located inside the discharge port, the shrapnel presses the diode body inside the discharge port.

[0014] In a preferred embodiment, a guiding frame is arranged above the conveyor belt. The guiding frame is fixedly installed on the conveyor belt, and a guiding groove is formed on the lower surface of the conveyor belt. When the conveyor belt conveys the silicon carbide diode, the upper end of the diode body slides inside the guiding groove.

[0015] In a preferred embodiment, the diode body includes a ceramic sheet. A tube shell is fixedly connected to the upper surface of the ceramic sheet. An upper transition sheet and a silicon carbide chip are sequentially and fixedly arranged on the upper surface of the ceramic sheet. Two ceramic rings are fixedly connected to one side of the tube shell. One ends of two external leads are respectively fixedly connected to the two ceramic rings. The end of the external lead located inside the tube shell is connected to the silicon carbide chip through an internal lead, and the end of the external lead located outside the tube shell is fixedly connected to the frame.

[0016] The technical effects and advantages of the present invention: Through the arrangement of the welding assembly, the frame is welded by using relatively arranged soldering guns. The movement paths of the two soldering guns are both semi-circular arcs, so that the welding can be carried out from one side of the external lead to the other side, so as to comprehensively weld the circumference of the external lead and enable the solder to wrap the external lead. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall installation structure of the present invention.

[0018] Figure 2 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 3 It is a schematic diagram of the structure of the welding assembly of the present invention.

[0020] Figure 4 It is a schematic diagram of the structure of the conveyor belt of the present invention.

[0021] Figure 5 It is a schematic diagram of the structure of the loading assembly of the present invention.

[0022] Figure 6 It is a schematic diagram when the soldering gun of the present invention is welding.

[0023] Figure 7 It is a schematic diagram of the structure of the silicon carbide diode of the present invention.

[0024] Figure 8 It is a cross-section of the silicon carbide diode of the present invention Figure 1 .

[0025] Figure 9 It is a cross-section of the silicon carbide diode of the present invention Figure 2 .

[0026] The reference numerals are: 1, frame; 2, conveyor belt; 21, bracket; 22, runner; 23, belt; 231, groove; 24, first motor; 3, welding assembly; 31, mounting plate; 32, first spur gear; 33, second spur gear; 34, second motor; 35, eccentric wheel; 36, drive frame; 37, soldering gun; 38, moving part; 381, moving frame; 382, cylinder; 383, first guide rod; 39, guiding part; 391, second guide rod; 392, third guide rod; 4, feeding assembly; 41, rotating column; 411, inclined groove; 42, material rod; 43, material groove; 431, feeding port; 432, discharging port; 433, elastic piece; 5, guiding frame; 51, guiding groove; 6, silicon carbide diode; 61, diode body; 611, ceramic chip; 612, shell; 613, ceramic ring; 614, external lead; 615, internal lead; 616, silicon carbide chip; 617, upper transition piece; 62, frame. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Referring to the attached drawings of the specification Figures 7 - 9 A silicon carbide diode device, the silicon carbide diode 6 includes a diode body 61 and a frame 62. The diode body 61 includes a ceramic chip 611. The upper surface of the ceramic chip 611 is fixedly connected with a shell 612. The upper surface of the ceramic chip 611 is also successively fixedly provided with an upper transition piece 617 and a silicon carbide chip 616. One side of the shell 612 is fixedly connected with two ceramic rings 613. An external lead 614 is fixedly connected inside the two ceramic rings 613. One end of the external lead 614 located inside the shell 612 is connected to the silicon carbide chip 616 through an internal lead 615. One end of the external lead 614 located outside the shell 612 is fixedly connected with the frame 62.

[0029] The coefficient of thermal expansion between the two materials should not be greater than 3×10-6 / °C. The coefficient of thermal expansion of the silicon carbide chip 616 is 4.5×10-6 / °C. The upper transition piece 617 is a molybdenum-copper sheet with a coefficient of thermal expansion of 5×10-6 / °C. The material of the ceramic sheet 611 is BeO (beryllium oxide) with a coefficient of thermal expansion of 7.3×10-6 / °C. Therefore, the silicon carbide chip 616, the upper transition piece 617, and the ceramic sheet 611 are sintered together by solder, so that the coefficient of thermal expansion between the chip and the substrate is the same at different temperatures, and the chip will not be damaged by external stress. The material of the ceramic ring 613 is 95% alumina with a resistivity greater than 1×1017 (μΩ·m). The outer lead 614 is a copper lead and is burned together with the housing through the ceramic ring 613. The material of the package 612 is T2 copper, the material of the inner lead 615 is TU1 oxygen-free copper, and the material of the frame 62 is a ferro-nickel alloy.

[0030] Compared with the current technology, the silicon carbide diode 6 has a higher level of internal air ionization voltage of the product and can work in a complex environment.

[0031] The frame 62 is installed on the two outer leads 614 of the diode body 61, and the connection method is soldering. Threaded holes are opened on the frame 62 so that the silicon carbide diode 6 can be installed on the circuit board through bolts. During soldering, the position to be soldered is the position where the upper end of the frame 62 contacts the outer lead 614, that is, on the upper surface of the frame 62. In the current technology during soldering, the solder cannot completely wrap the outer lead 614. To solve this problem, the following technical solutions are proposed.

[0032] Refer to the attached Figures 1 - 9 description, a silicon carbide diode device is made by the following method: Step 1: Use the conveyor belt 2 to convey the silicon carbide diode 6 to the welding station; Step 2: Two soldering guns 37 arranged oppositely on both sides of the welding station are used as a group to simultaneously weld the outer lead 614 and the frame 62 of the silicon carbide diode 6, and the two groups of soldering guns 37 respectively weld two adjacent silicon carbide diodes 6; Step 3: The conveyor belt 2 conveys the silicon carbide diode 6 forward, so that the first group of soldering guns 37 welds the next silicon carbide diode 6, and the second group of soldering guns 37 welds the remaining group of outer leads 614 and the frame 62 welded by the first group of soldering guns 37; It further includes a frame 1, on which a conveyor belt 2 is installed. The conveyor belt 2 is used to convey silicon carbide diodes 6. A welding assembly 3 is installed at the lower side position of the conveyor belt 2. The welding assembly 3 includes a mounting plate 31 which is fixedly installed on the frame 1. On both sides of the upper surface of the welding assembly 3, a first spur gear 32 and a second spur gear 33 are respectively rotatably connected. The first spur gear 32 and the second spur gear 33 are meshed and driven with each other. A second motor 34 is fixedly installed at the bottom of the mounting plate 31. The output shaft of the second motor 34 is fixedly installed with the first spur gear 32. Eccentric wheels 35 are fixedly installed on the upper surfaces of the first spur gear 32 and the second spur gear 33. Driving frames 36 are rotatably connected to both eccentric wheels 35. Two soldering guns 37 are installed at the upper ends of both driving frames 36. The two soldering guns 37 on the two driving frames 36 are arranged in pairs facing each other. The two soldering guns 37 arranged in pairs facing each other are used to weld a frame 62 and an external lead 614 together simultaneously.

[0033] In the above technical solution, as Figure 2 and Figure 3 shown, the welding assembly 3 further includes a guiding component 39. The guiding component 39 includes two second guiding rods 391 respectively fixedly installed on both sides of the mounting plate 31. Between the two second guiding rods 391, two third guiding rods 392 are arranged. Both ends of the two third guiding rods 392 are slidably installed on the two second guiding rods 391. Both driving frames 36 are movably sleeved on the two third guiding rods 392.

[0034] It should be noted that the two second guiding rods 391 are fixed and immovable. The two third guiding rods 392 can move along the axial direction of the second guiding rods 391, while the two driving frames 36 can move along the axial direction of the two third guiding rods 392. The second guiding rods 391 and the third guiding rods 392 are perpendicularly arranged.

[0035] In the above technical solution, as Figure 2 and Figure 4 shown, the conveyor belt 2 includes a bracket 21 which is fixedly installed on the frame 1. Rotating wheels 22 are rotatably connected to both ends of the bracket 21. A belt 23 is drivingly connected between the two rotating wheels 22. A first motor 24 is fixedly installed on the bracket 21. The output end of the first motor 24 is drivingly connected to one of the rotating wheels 22.

[0036] Further, a plurality of grooves 231 are formed on the surface of the belt 23. The plurality of grooves 231 are grouped in pairs, and the two grooves 231 in the same group are symmetrically arranged. The grooves 231 are used to accommodate the frame 62.

[0037] It should be noted that the inside of the groove 231 is used to place the frame 62. Then, as the motor 1 24 drives the runner 22 to rotate, the belt 23 is driven to convey the frame 62. In addition, the groove 231 is also used to position the frame 62 to prevent the position of the silicon carbide diode 6 from moving during the conveying process.

[0038] It should also be noted that the purpose of symmetrically arranging the two grooves 231 in the same group is that the two frames 62 installed on the diode body 61 are symmetric. Therefore, the two grooves 231 correspond to one diode body 61, that is, correspond to one silicon carbide diode 6.

[0039] In this embodiment, the implementation method is specifically as follows: The conveyor belt 2 conveys the assembled silicon carbide diode 6 forward. Two solder guns 37 arranged opposite to each other form a group. When it is conveyed to the position of the two groups of solder guns 37, it stops. At this time, each group of solder guns 37 corresponds to one silicon carbide diode 6, and as Figure 6 shown, the welding ends of the two solder guns 37 in each group are located on the same side of the outer lead 614. During welding, the motor 2 34 drives the spur gear 1 32 to rotate, the spur gear 1 32 drives the spur gear 2 33 to rotate. The rotation directions of the spur gear 1 32 and the spur gear 2 33 are opposite. The eccentric wheel 35 on the spur gear 1 32 is not collinear with the rotation axis of the spur gear 1 32, and the eccentric wheel 35 on the spur gear 2 33 is not collinear with the rotation axis of the spur gear 2 33. The spur gear 2 33 drives the eccentric wheel 35 to rotate, and the eccentric wheel 35 drives the driving frame 36 to move. Through the guiding actions of the guide rod 2 391 and the guide rod 3 392, the movement trajectory of any point on the driving frame 36 (including the components installed on the driving frame 36) can be a circle. By controlling the rotation angles of the spur gear 1 32 and the spur gear 2 33, the movement trajectories of the two solder guns 37 are as Figure 6 shown by the dotted lines, that is, the movement trajectories are semi-circles. In this way, when the welding ends of the two solder guns 37 move from one side of the outer lead 614 to the other side, the circumferential direction of the outer lead 614 can be fully welded, that is, the solder can wrap the outer lead 614.

[0040] It should be noted that when the two groups of solder guns 37 are welding, the first group welds the frame 62 on the left side of one silicon carbide diode 6, and the second group welds the frame 62 on the right side of the other silicon carbide diode 6. In this way, after the first group finishes welding and then the second group welds, the final welding can be completed.

[0041] It should also be noted that the purpose of setting two sets of soldering guns 37 is that the frames 62 on two silicon carbide diodes 6 can be soldered respectively at the same time, aiming to improve efficiency. In addition, the purpose of not soldering the two frames 62 on one silicon carbide diode 6 by the two sets of soldering guns 37 simultaneously is that the space between the two frames 62 is small, preventing the problem of collision between the soldering guns 37.

[0042] Through the setting of the welding assembly 3, the above technical solution uses the relatively arranged soldering guns 37 to solder the frame 62. The movement paths of the two soldering guns 37 are both semi-circular arcs, so that they can be soldered from one side of the external lead 614 to the other side to comprehensively solder the circumferential direction of the external lead 614, enabling the solder to wrap the external lead 614.

[0043] In this embodiment, as Figures 1 - 3 shown, since the diameter of the external lead 614 is small, the diameter of the movement path of the welding end of the soldering gun 37 is also small. After welding is completed, the conveyor belt 2 needs to continue to move forward, and the welding end is likely to touch the silicon carbide diode 6. Therefore, the following technical solution is further proposed.

[0044] Specifically, a movable component 38 is arranged at the upper end of the driving frame 36. The movable component 38 includes a movable frame 381. Both ends of the movable frame 381 are fixedly connected with a first guide rod 383. The two first guide rods 383 are horizontally movably inserted on the driving frame 36. A cylinder 382 is installed on the driving frame 36, and the output end of the cylinder 382 is fixedly installed with the movable frame 381.

[0045] It should be noted that after one welding is completed, the cylinder 382 drives the movable frame 381 and the first guide rod 383 to move, so that the two sets of soldering guns 37 move away from the conveyor belt 2, so that the welding ends of the soldering guns 37 are farther away from the silicon carbide diode 6, so that the soldering guns 37 will not touch the silicon carbide diode 6 when the conveyor belt 2 conveys the silicon carbide diode 6.

[0046] Referring to the attached Figures 1 - 3 and Figure 4 , a material tank 43 is arranged at the position on the front side of the welding assembly 3 at the upper end of the conveyor belt 2. The material tank 43 is fixedly installed on the conveyor belt 2. One side of the material tank 43 has a feed inlet 431, and the lower end of the other side of the material tank 43 has a discharge outlet 432.

[0047] Further, a feeding component 4 is arranged at the bottom of the second spur gear 33. The feeding component 4 includes a rotating column 41 which is fixedly connected to the middle of the second spur gear 33. An inclined groove 411 is formed on the outer side wall of the rotating column 41. A material rod 42 is vertically inserted into the mounting plate 31. The bottom end of the material rod 42 is horizontally inserted into the inclined groove 411 and can slide inside the inclined groove 411. The upper end of the material rod 42 is vertically inserted at the position of the discharge port 432.

[0048] It should be noted that when the second spur gear 33 rotates, it can drive the rotating column 41 to rotate. When the rotating column 41 rotates, the material rod 42 can slide inside the inclined groove 411. That is to say, by the forward and reverse rotation of the rotating column 41, the material rod 42 can be driven to move up and down reciprocally. When the material rod 42 moves upward, the upper end of the material rod 42 moves upward from the inside of the discharge port 432. When the material rod 42 moves downward, the upper end of the material rod 42 moves downward into the inside of the discharge port 432, and the diode body 61 inside the discharge port 432 is pressed downward out of the discharge port 432.

[0049] Further, an elastic piece 433 is fixedly connected to the side wall of the discharge port 432. When the diode body 61 is located inside the discharge port 432, the elastic piece 433 presses the diode body 61 inside the discharge port 432.

[0050] It should be noted that when the diode body 61 enters the inside of the discharge port 432, the diode body 61 is blocked by the elastic piece 433 to prevent the elastic piece 433 from falling downward without the pressure of the material rod 42.

[0051] Working principle: As shown in Figure 2 and Figure 5 shown, initially, the conveyor belt 2 conveys the silicon carbide diode 6 to the positions of the two soldering guns 37. The upper end of the material rod 42 is inserted into the inside of the discharge port 432. The welding ends of the two soldering guns 37 in each group are located on the same side of the outer lead 614. The working process is as follows: (1) During welding, the second motor 34 drives the first spur gear 32 to rotate forward. The first spur gear 32 drives the second spur gear 33 to rotate. The rotation directions of the first spur gear 32 and the second spur gear 33 are opposite. The second spur gear 33 drives the eccentric wheel 35 to rotate. The eccentric wheel 35 drives the driving frame 36 and the soldering gun 37 to move. As shown in Figure 6 shown, the movement track of the welding end of the soldering gun 37 is an arc. The upper soldering gun 37 rotates counterclockwise, and the lower soldering gun 37 rotates clockwise, so that comprehensive welding can be carried out to make the solder wrap the outer lead 614. During the above process, the second spur gear 33 drives the rotating column 41 to rotate, and the rotating column 41 drives the material rod 42 to move upward, so that the upper end of the material rod 42 moves out of the discharge port 432.

[0052] (2) The air cylinder 382 drives the moving frame 381 and the first guide rod 383 to move, so that the two groups of soldering guns 37 move away from the conveyor belt 2, thereby increasing the distance between the soldering ends of the soldering guns 37 and the silicon carbide diode 6.

[0053] (3) The conveyor belt 2 conveys the silicon carbide diode 6 forward to the soldering positions of the two soldering guns 37.

[0054] (4) The air cylinder 382 drives the soldering guns 37 to move towards the conveyor belt 2.

[0055] (5) The second motor 34 drives the first spur gear 32 to reverse, so that the two soldering guns 37 return to their initial positions. During this process, the second spur gear 33 drives the rotating column 41 to rotate, the rotating column 41 drives the material rod 42 to move downward, and the material rod 42 presses the diode body 61 inside the discharge port 432 downward, so that the two external leads 614 of the diode body 61 are inserted into the holes of the frame 62 inside the two grooves 231 on the belt 23.

[0056] After that, the welding process repeats the process of (1)-(5).

[0057] It should be noted that the frame 62 in the groove 231 can be placed therein by a manipulator or manually.

[0058] It should also be noted that a plurality of diode bodies 61 are arranged inside the material tank 43, and an electric push rod is provided at the position of the feed port 431. When the number of diode bodies 61 in the material tank 43 decreases, the diode body 61 is pushed forward by the electric push rod, so that the diode body 61 enters the inside of the discharge port 432.

[0059] Further, as Figure 4 shown, a guide frame 5 is provided above the conveyor belt 2. The guide frame 5 is fixedly installed on the conveyor belt 2. A guide groove 51 is formed on the lower surface of the conveyor belt 2. When the conveyor belt 2 conveys the silicon carbide diode 6, the upper end of the diode body 61 slides inside the guide groove 51.

[0060] It should be noted that when the conveyor belt 2 conveys the silicon carbide diode 6, the upper end of the diode body 61 is located inside the guide groove 51, which can improve the stability of the silicon carbide diode 6 during conveying and prevent it from tipping over.

[0061] Finally: The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A silicon carbide diode device, the silicon carbide diode (6) includes a diode body (61), two frames (62) and two external leads (614), the frames (62) are fixed to the diode body (61) through the external leads (614), and is characterized in that: The silicon carbide diode (6) is made by the following method: Step 1: Use the conveyor belt (2) to convey the silicon carbide diode (6) to the welding station; Step 2: Two soldering guns (37) arranged oppositely on both sides of the welding station are used as a group to simultaneously weld the outer lead (614) and the frame (62) of the silicon carbide diode (6). Two groups of soldering guns (37) respectively weld two adjacent silicon carbide diodes (6); Step 3: The conveyor belt (2) conveys the silicon carbide diode (6) forward, so that the first group of soldering guns (37) weld the next silicon carbide diode (6), and the second group of soldering guns (37) weld the remaining group of outer leads (614) and the frame (62) welded by the first group of soldering guns (37); It also includes a frame (1). A conveyor belt (2) is installed on the frame (1), and the conveyor belt (2) is used to convey the silicon carbide diode (6); A welding assembly (3) is installed at the lower side position of the conveyor belt (2). The welding assembly (3) includes a mounting plate (31), and the mounting plate (31) is fixedly installed on the frame (1). On both sides of the upper surface of the welding assembly (3), a first spur gear (32) and a second spur gear (33) are respectively rotatably connected. The first spur gear (32) and the second spur gear (33) are meshed and driven with each other. A second motor (34) is fixedly installed at the bottom of the mounting plate (31), and the output shaft of the second motor (34) is fixedly installed with the first spur gear (32). Eccentric wheels (35) are fixedly installed on the upper surfaces of the first spur gear (32) and the second spur gear (33). Two driving frames (36) are rotatably connected to the two eccentric wheels (35). Two soldering guns (37) are installed at the upper ends of the two driving frames (36). The two soldering guns (37) on the two driving frames (36) are arranged in pairs and face each other. The two soldering guns (37) arranged in pairs are used to simultaneously weld a frame (62) and an outer lead (614) together.

2. The silicon carbide diode device according to claim 1, wherein: The welding assembly (3) also includes a guiding component (39). The guiding component (39) includes two second guiding rods (391) respectively fixedly installed on both sides of the mounting plate (31). Two third guiding rods (392) are arranged between the two second guiding rods (391). The two ends of the two third guiding rods (392) are respectively slidably installed on the two second guiding rods (391). The two driving frames (36) are both movably sleeved on the two third guiding rods (392).

3. A silicon carbide diode device according to claim 2, characterized in that: An active component (38) is arranged at the upper end of the driving frame (36). The active component (38) includes a moving frame (381). Guide rods (383) are fixedly connected to both ends of the moving frame (381). The two guide rods (383) are horizontally and movably inserted into the driving frame (36). A cylinder (382) is installed on the driving frame (36), and the output end of the cylinder (382) is fixedly installed with the moving frame (381).

4. A silicon carbide diode device according to claim 1, characterized in that: The conveyor belt (2) includes a bracket (21) fixedly installed on the frame (1). Both ends of the bracket (21) are rotatably connected with a runner (22). A belt (23) is drivingly connected between the two runners (22). A first motor (24) is fixedly installed on the bracket (21), and the output end of the first motor (24) is drivingly connected with one of the runners (22).

5. A silicon carbide diode device according to claim 4, characterized in that: A plurality of grooves (231) are formed on the surface of the belt (23). The plurality of grooves (231) are grouped in pairs, and the two grooves (231) in the same group are symmetrically arranged. The grooves (231) are used for accommodating the frame (62).

6. A silicon carbide diode device according to claim 1, wherein: A material chute (43) is arranged at the position on the front side of the welding assembly (3) at the upper end of the conveyor belt (2). The material chute (43) is fixedly installed on the conveyor belt (2). One side of the material chute (43) has a feed inlet (431), and the lower end of the other side of the material chute (43) has a discharge outlet (432).

7. A silicon carbide diode device according to claim 6, characterized in that: A feeding assembly (4) is arranged at the bottom of the second spur gear (33). The feeding assembly (4) includes a rotating column (41) fixedly connected to the middle of the second spur gear (33). An inclined groove (411) is formed on the outer side wall of the rotating column (41). A material rod (42) is vertically inserted into the mounting plate (31). The bottom end of the material rod (42) is horizontally inserted into the inclined groove (411) and can slide inside the inclined groove (411). The upper end of the material rod (42) is vertically inserted at the position of the discharge outlet (432).

8. The silicon carbide diode device according to claim 7, wherein: A spring piece (433) is fixedly connected to the side wall of the discharge outlet (432). When the diode body (61) is located inside the discharge outlet (432), the spring piece (433) presses the diode body (61) inside the discharge outlet (432).

9. A silicon carbide diode device according to claim 1, wherein: A guide frame (5) is arranged above the conveyor belt (2). The guide frame (5) is fixedly installed on the conveyor belt (2). A guide groove (51) is formed on the lower surface of the conveyor belt (2). When the conveyor belt (2) conveys the silicon carbide diode (6), the upper end of the diode body (61) slides inside the guide groove (51).

10. A silicon carbide diode device according to claim 1, characterized in that: The diode body (61) includes a ceramic sheet (611). A tube shell (612) is fixedly connected to the upper surface of the ceramic sheet (611). An upper transition sheet (617) and a silicon carbide chip (616) are sequentially fixed on the upper surface of the ceramic sheet (611). Two ceramic rings (613) are fixedly connected to one side of the tube shell (612). One end of each of the two external leads (614) is fixedly connected to one of the two ceramic rings (613). The end of the external lead (614) located inside the tube shell (612) is connected to the silicon carbide chip (616) through an internal lead (615). The end of the external lead (614) located outside the tube shell (612) is fixedly connected to the frame (62).

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