Processing equipment for wafer production

Abstract

The invention discloses processing equipment for wafer production, and belongs to the technical field of wafer processing, a third supporting plate and a second supporting plate are provided with driving adjusting assemblies, the upper ends of the driving adjusting assemblies are arranged in a second protective cover, and the lower ends of the driving adjusting assemblies movably penetrate through a fixing plate and then are arranged on the upper wall of a bottom plate; the first supporting plate is installed on the fixing plate and arranged in the first protective cover, a transmission assembly is installed on the side wall of the first supporting plate, the transmission assembly is movably connected with the driving adjusting assembly, the transmission assembly is arranged in the second protective cover, and the lower end of the transmission assembly movably penetrates through the fixing plate and then is arranged in the first protective cover. An etching assembly, a cleaning assembly and a drying assembly are further installed on the upper wall of the bottom plate, and the etching assembly, the cleaning assembly and the drying assembly are all arranged at the lower end of the transmission assembly and arranged in the first protective cover. The wafer polishing device can polish a wafer, and can etch, clean and dry the wafer at the same time.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing, and particularly relates to a processing device for wafer production. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Various circuit element structures can be processed and fabricated on the silicon wafer to form an IC product with specific electrical functions. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed. The edge of the wafer needs to be ground to avoid chipping at the corners. The ground wafer also needs to be etched to selectively remove unnecessary materials from the wafer surface to form specific patterns and structures on the wafer. During the etching process, etching agents are usually used, and these etching agents will chemically react with specific materials on the wafer surface. However, the fluidity of the etching solution in the existing etching tank is relatively weak, resulting in a gradual weakening of the corrosion ability of the etching solution around the wafer. After etching, it is also necessary to perform cleaning, drying, and then storage. This process requires different devices to cooperate in sequence, with cumbersome operations and low efficiency. Summary of the Invention

[0003] In view of the above situation, to overcome the defects of the prior art, the present invention provides a processing device for wafer production, which at least partially solves the technical problems raised in the above technical background.

[0004] The technical solution adopted by the present invention is as follows: A processing device for wafer production includes a bottom plate for support and fixation. A first support plate is installed on the upper wall of the bottom plate. A second support plate is installed on the upper wall of the first support plate. A third support plate is installed on the upper wall of the second support plate. A fixing plate is installed on the side wall of the first support plate. A first protective cover is installed between the fixing plate and the bottom plate. The upper end of the first protective cover is installed with a second protective cover. A drive adjustment component is installed on the third support plate and the second support plate. The upper end of the drive adjustment component is disposed inside the second protective cover. The lower end of the drive adjustment component movably penetrates through the fixing plate and is disposed on the upper wall of the bottom plate and inside the first protective cover. A transmission component is installed on the side wall of the first support plate. The transmission component is movably connected to the drive adjustment component. The transmission component is disposed inside the second protective cover. The second protective cover is a prior art and is not drawn for the convenience of observing the devices inside the second protective cover. The drive adjustment component provides driving force for the transmission component. The lower end of the transmission component movably penetrates through the fixing plate and is disposed inside the first protective cover. An etching component, a cleaning component, and a drying component are also installed on the upper wall of the bottom plate. The etching component, the cleaning component, and the drying component are all disposed at the lower end of the transmission component and inside the first protective cover. The drive adjustment component works to drive the transmission component, the cleaning component, and the etching component to move, facilitating the processing of the wafer.

[0005] Preferably, the drive adjustment assembly includes a drive shaft and a grinding frame, the upper end of the drive shaft is movably arranged on the bottom wall of the second support plate, the lower end of the drive shaft is movably passed through the fixed plate and then arranged on the bottom plate, the second support plate and the fixed plate support the drive shaft, the drive shaft is installed with a drive plate 1, a drive plate 2 and a limit frame, the drive plate 1 is arranged at the upper end of the drive plate 2, the drive plate 2 is arranged at the upper end of the limit frame, the drive plate 1, the drive plate 2 and the limit frame are all arranged at the upper end of the fixed plate and are all arranged in the protective cover 2, the limit frame is provided with a slot, the grinding frame is arranged on the first support plate and in the protective cover 2, the first support plate supports and fixes the grinding frame, the drive plate 1 is installed with a clamping and grinding assembly, the drive plate 2 is installed with a rotating toggle assembly, and the clamping and grinding assembly is arranged in the grinding frame.

[0006] Furthermore, a plurality of grinding cavities for grinding are evenly and evenly arranged on the inner side wall of the grinding frame, a ring-shaped gear 1 is arranged on the bottom wall of the grinding frame, and gear teeth are arranged on the inner side wall of the gear 1.

[0007] As a preferred embodiment of the present invention, the rotating toggle assembly includes gear 2 and a toggle rod, gear 2 is movably provided on the upper wall of drive plate 2, gear 2 is meshingly connected with gear 1, one end of the toggle rod is movably provided at the lower end of drive plate 2, and one end of the toggle rod is connected to gear 2, the other end of the toggle rod is equipped with an insertion rod, and a sleeve is movably installed on the insertion rod.

[0008] Among them, the clamping and polishing assembly includes a telescopic rod, the upper end of the telescopic rod is connected to the bottom wall of the driving plate, and a lower pressure plate is installed at the lower end of the telescopic rod, and a spring is installed between the lower pressure plate and the driving plate, and the spring is sleeved on the outside of the telescopic rod, and the bottom wall of the lower pressure plate and the upper wall of the gear two are both installed with pads, the pad on the bottom wall of the lower pressure plate is movably connected to the lower pressure plate, the pad on the upper wall of the gear two is fixedly connected to the gear two, and the two groups of pads are placed opposite to each other, the wafer to be polished is placed between the two groups of pads, and a pad is also placed between the wafers, the outer wall of the wafer is movably clamped in the polishing cavity, and the spring clamps the wafer between the lower pressure plate and the upper wall of the gear two.

[0009] Furthermore, a connecting plate is installed on the outer side wall of the first support plate. A connecting rod is installed on the bottom wall of the connecting plate. The lower end of the connecting rod is movably installed with a rotating plate. An arc-shaped groove is provided on the side wall of the rotating plate. There are four groups of arc-shaped grooves, and the four groups of arc-shaped grooves are evenly arranged at equal intervals on the side wall of the rotating plate. The limiting frame is movably clamped in the arc-shaped groove. The rotating plate between two adjacent arc-shaped grooves can be clamped into the slot of the limiting frame. A limiting member is installed on the upper wall of the rotating plate. There are four groups of limiting members, and the four groups of limiting members are evenly arranged at equal intervals on the upper wall of the rotating plate. The limiting members and the arc-shaped grooves are staggered. A limiting groove is provided on any one of the limiting members. The sleeve is movably clamped in the limiting groove.

[0010] Wherein, a hydraulic rod is installed at the center of the bottom wall of the rotating plate. The hydraulic rod movably penetrates through the fixed plate. The movable end of the hydraulic rod is installed with a lifting plate. The lifting plate is arranged inside the first protective cover. Four fixing rings are evenly installed at equal intervals in a ring shape on the bottom wall of the lifting plate. A hook is movably clamped on the fixing ring. A fixing member for placing the wafer is installed on the hook.

[0011] Furthermore, a third gear is installed at the lower end of the driving shaft. The third gear is movably installed on the upper wall of the bottom plate and is arranged inside the first protective cover. The etching assembly includes an etching barrel and a fourth gear. The fourth gear is movably installed on the upper wall of the bottom plate. The etching barrel is arranged on the upper wall of the fourth gear. An etching solution for etching is provided inside the etching barrel. The cleaning assembly includes a cleaning barrel and a fifth gear. The fifth gear is movably installed on the upper wall of the bottom plate. The cleaning barrel is arranged on the upper wall of the fifth gear. A cleaning solution for cleaning is provided inside the cleaning barrel. Both the fourth gear and the fifth gear are meshed with the third gear.

[0012] Preferably, the drying assembly includes a drying barrel and an air pump. Both the drying barrel and the air pump are arranged on the upper wall of the bottom plate. The drying barrel and the air pump are connected by an air pipe. An air vent cavity is provided inside the bottom wall of the drying barrel. The air vent cavity is communicated with the air pipe. A plurality of air vent holes for gas circulation are provided on the bottom wall of the drying barrel. The air vent holes are communicated with the air vent cavity.

[0013] Wherein, a motor is installed on the upper wall of the third support plate. The output shaft end of the motor is connected to the driving shaft. The motor drives the driving shaft to rotate when working. Opening and closing doors are provided on both the first protective cover and the second protective cover.

[0014] After adopting the above structure, the beneficial effects of the present invention are as follows:

[0015] (1) The second gear rotates itself to drive the wafer and the backing plate thereon to rotate. The outer side wall of the wafer is movably clamped inside the grinding cavity. The second gear rotates to drive the wafer to rotate. When the wafer rotates, it passes through the grinding cavity for grinding treatment.

[0016] (2) The rotating plate drives the wafer to be etched to rotate 90 degrees and is located at the upper end of the etching barrel. The hydraulic rod drives the wafer down into the etching liquid. At the same time, the drive shaft rotates to drive gear three to rotate. Gear three drives gear four and gear five to rotate. Gear four drives the etching barrel on it to rotate. The etching barrel drives the etching liquid inside to rotate, which facilitates etching of the wafer.

[0017] (3) After the rotating plate rotates 90 degrees again, the wafer moves to the top of the cleaning bucket. The hydraulic rod drives the wafer down into the cleaning liquid. Gear 5 drives the cleaning bucket on it to rotate, and the cleaning bucket drives the internal cleaning fluid to rotate as well, making it easier to clean the wafer.

[0018] (4) After the rotating plate rotates another 90 degrees, the wafer moves to the upper end of the drying barrel. The hydraulic rod drives the wafer down into the drying barrel. The air pump works to transport the gas to the ventilation cavity through the air pipe. The gas in the ventilation cavity is discharged through the vent hole to dry the wafer in the drying barrel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0020] Figure 1 A schematic diagram of the structure of a wafer production processing equipment proposed by the present invention;

[0021] Figure 2 Schematic diagram of the internal structure of a wafer production processing equipment proposed by the present invention Figure 1 ;

[0022] Figure 3 A cross-sectional view of a wafer production processing equipment proposed by the present invention Figure 1 ;

[0023] Figure 4 for Figure 3 A local enlarged view of point A;

[0024] Figure 5 Schematic diagram of the internal structure of a wafer production processing equipment proposed by the present invention Figure 2 ;

[0025] Figure 6 A diagram showing the positional relationship between the clamping and polishing assembly and the polishing frame proposed by the present invention;

[0026] Figure 7 It is a structural schematic diagram of the rotary dial assembly proposed by the present invention;

[0027] Figure 8 for Figure 7 A local enlarged view of point B;

[0028] Figure 9 The cross-section of a processing device for wafer production proposed by the present invention Figure 2 ;

[0029] Figure 10 is Figure 9 a partially enlarged view of the C position of;

[0030] Figure 11 The cross-section of a processing device for wafer production proposed by the present invention Figure 3 .

[0031] In the drawings: 1, bottom plate; 2, first support plate; 3, second support plate; 4, third support plate; 5, first protective cover; 6, drive adjustment assembly; 7, transmission assembly; 8, drive shaft; 9, grinding frame; 10, first drive plate; 11, second drive plate; 12, limiting frame; 13, slot; 14, grinding chamber; 15, first gear; 16, second gear; 17, toggle rod; 18, insertion rod; 19, sleeve; 20, telescopic rod; 21, lower pressing plate; 22, spring; 23, backing plate; 24, connecting plate; 25, connecting rod; 26, rotating plate; 27, arc-shaped groove; 28, limiting member; 29, limiting groove; 30, hydraulic rod; 31, lifting plate; 32, fixing ring; 33, hook; 34, fixing member; 35, third gear; 36, etching barrel; 37, fourth gear; 38, cleaning barrel; 39, fifth gear; 40, drying barrel; 41, air pump; 42, ventilation chamber; 43, air pipe; 44, ventilation hole; 45, motor; 46, fixing plate. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0034] Such as Figures 1 - 11As shown, a processing equipment for wafer production includes a base plate 1 for supporting and fixing, a first supporting plate 2 is installed on the upper wall of the base plate 1, a second supporting plate 3 is installed on the upper wall of the first supporting plate 2, a third supporting plate 4 is installed on the upper wall of the second supporting plate 3, a fixing plate 46 is installed on the side wall of the first supporting plate 2, a protective cover 5 is installed between the fixing plate 46 and the base plate 1, a protective cover 2 is installed on the upper end of the protective cover 1 5, a driving adjustment component 6 is installed on the third supporting plate 4 and the second supporting plate 3, the upper end of the driving adjustment component 6 is arranged in the protective cover 2, the lower end of the driving adjustment component 6 movably passes through the fixing plate 46 and is arranged on the upper wall of the base plate 1, and is arranged in the protective cover 1 5, the first supporting plate 46 is installed on the side wall of the first supporting plate 2, A transmission assembly 7 is installed on the side wall of the support plate 2, and the transmission assembly 7 is movably connected with the drive adjustment assembly 6. The transmission assembly 7 is arranged in the protective cover 2. The protective cover 2 is the existing technology. In order to facilitate the observation of the device in the protective cover 2, the protective cover 2 is not drawn. The drive adjustment assembly 6 provides driving force for the transmission assembly 7. The lower end of the transmission assembly 7 movably passes through the fixed plate 46 and is arranged in the protective cover 1 5. The upper wall of the base plate 1 is also installed with an etching assembly, a cleaning assembly and a drying assembly. The etching assembly, the cleaning assembly and the drying assembly are all arranged at the lower end of the transmission assembly 7 and in the protective cover 1 5; the drive adjustment assembly 6 drives the transmission assembly 7, the cleaning assembly and the etching assembly to move, which is convenient for processing the wafer.

[0035] The driving and adjusting assembly 6 comprises a driving shaft 8 and a grinding frame 9, the upper end of the driving shaft 8 is movably arranged on the bottom wall of the second supporting plate 3, the lower end of the driving shaft 8 is movably penetrated through the fixing plate 46 and then arranged on the bottom plate 1, the second supporting plate 3 and the fixing plate 46 support the driving shaft 8, a driving plate 10, a driving plate 2 11 and a limiting frame 12 are installed on the driving shaft 8, the driving plate 10 is arranged at the upper end of the driving plate 2 11, the driving plate 2 11 is arranged at the upper end of the limiting frame 12, the driving plate 10, the driving plate 2 11 and the limiting frame 12 are all arranged at the upper end of the fixing plate 46, the limiting frame 12 is provided with a slot 13, the grinding frame 9 is arranged on the first supporting plate 2, the first supporting plate 2 supports and fixes the grinding frame 9, a clamping and grinding assembly is installed on the driving plate 10, a rotating toggle assembly is installed on the driving plate 2 11, and the clamping and grinding assembly is arranged in the grinding frame 9.

[0036] The inner wall of the grinding frame 9 is evenly and evenly provided with a plurality of grinding cavities 14 for grinding. The bottom wall of the grinding frame 9 is provided with an annular gear 15, and the inner wall of the gear 15 is provided with gear teeth.

[0037] The rotary toggle assembly includes a gear 2 16 and a toggle rod 17, wherein the gear 2 16 is movably disposed on the upper wall of the driving plate 2 11, the gear 2 16 is meshingly connected with the gear 1 15, one end of the toggle rod 17 is movably disposed on the lower end of the driving plate 2 11, and one end of the toggle rod 17 is connected to the gear 2 16, and the other end of the toggle rod 17 is installed with an insertion rod 18, and a sleeve 19 is movably installed on the insertion rod 18.

[0038] The clamping and polishing assembly includes a telescopic rod 20, the upper end of the telescopic rod 20 is connected to the bottom wall of the driving plate 10, and a lower pressure plate 21 is installed at the lower end of the telescopic rod 20. A spring 22 is installed between the lower pressure plate 21 and the driving plate 10, and the spring 22 is sleeved on the outer side of the telescopic rod 20. The bottom wall of the lower pressure plate 21 and the upper wall of the gear 16 are both installed with a pad 23. The pad 23 on the bottom wall of the lower pressure plate 21 is movably connected to the lower pressure plate 21, and the pad 23 on the upper wall of the gear 16 is fixedly connected to the gear 16, and two groups of pads 23 are placed opposite to each other, and the wafer to be polished is placed between the two groups of pads 23, and a pad 23 is also placed between the wafers. The outer wall of the wafer is movably clamped in the polishing cavity 14, and the spring 22 clamps the wafer between the lower pressure plate 21 and the upper wall of the gear 16;

[0039] In this embodiment, the rotation of the driving shaft 8 drives the driving plate 10, the driving plate 2 11 and the limit frame 12 to rotate synchronously. The driving plate 2 11 drives the gear 2 16 and the toggle rod 17 thereon to rotate. Since the gear 2 16 and the gear 1 15 are meshed, the gear 15 is fixed by the grinding frame 9. The gear 2 16 rotates along the gear 15 when rotating. When the gear 2 16 rotates, it drives the toggle rod 17 to rotate. Therefore, the toggle rod 17 rotates along the driving shaft 8 and also rotates under the action of the gear 2 16. The toggle rod 17 drives the insertion rod 18 and the sleeve 19 to rotate. The rotation of the gear 2 16 drives the wafer and the pad 23 thereon to rotate. The outer wall of the wafer is movably connected in the grinding chamber 14. The rotation of the gear 2 16 drives the wafer to rotate. When the wafer rotates, it passes through the grinding chamber 14 for grinding. At the same time, a dust removal component is also provided in the protective cover 2 to facilitate cleaning of dust in the grinding frame 9.

[0040] A connecting plate 24 is installed on the outer side wall of the first supporting plate 2, and a connecting rod 25 is installed on the bottom wall of the connecting plate 24. A rotating plate 26 is movably installed on the lower end of the connecting rod 25. An arc groove 27 is provided on the side wall of the rotating plate 26. The arc groove 27 is provided in four groups. The four groups of arc grooves 27 are evenly arranged on the side wall of the rotating plate 26 at equal intervals. The limit frame 12 is movably clamped in the arc groove 27. The rotating plate 26 between two adjacent groups of arc grooves 27 can be clamped into the slot 13 of the limit frame 12. A limiting member 28 is installed on the upper wall of the rotating plate 26. The limiting member 28 is provided in four groups. The four groups of limiting members 28 are evenly arranged on the upper wall of the rotating plate 26 at equal intervals. The limiting member 28 and the arc groove 27 are staggered. A limiting groove 29 is provided on any group of the limiting members 28. The sleeve 19 is movably clamped in the limiting groove 29.

[0041] It should be noted that if, initially, the limit frame 12 is movably arranged in one of the groups of arc grooves 27, the outer wall of the limit frame 12 contacts the inner wall of the arc groove 27, which is convenient for limiting the rotating plate 26, the driving shaft 8 continues to rotate, driving the limit frame 12 and the driving plate 2 11 to rotate, and the slot hole 13 of the limit frame 12 rotates to a position close to the rotating plate 26 until it enters the arc groove 27. At this time, the toggle rod 17 on the driving plate 2 11 rotates under the action of the driving shaft 8 and the gear 2 16, and the toggle rod 17 drives the sleeve 19 to be arranged in the limit groove 29 of the limit member 28. As the driving shaft 8 continues to rotate, the toggle rod 17 drives the rotating plate 26 to rotate 90 degrees through the sleeve 19 and the limit member 28. During the rotation process, the rotating plate 26 is inserted into the slot hole 13 of the limit frame 12 and then discharged, and then the limit frame 12 is movably connected to another group of arc grooves 27.

[0042] A hydraulic rod 30 is installed at the center of the bottom wall of the rotating plate 26. The hydraulic rod 30 is movably arranged to penetrate the fixed plate 46. A lifting plate 31 is installed at the movable end of the hydraulic rod 30. The lifting plate 31 is arranged in a protective cover 5. Four groups of fixing rings 32 are evenly installed on the bottom wall of the lifting plate 31 in a ring shape at equal intervals. A hook 33 is movably connected to the fixing ring 32. A fixing part 34 for placing a wafer is installed on the hook 33. When the rotating plate 26 rotates, it drives the hydraulic rod 30 and the lifting plate 31 to rotate, and the lifting plate 31 drives the fixing part 34 to move to adjust the position of the wafer.

[0043] It should be noted that a third gear 35 is installed at the lower end of the drive shaft 8. The third gear 35 is movably installed on the upper wall of the base plate 1 and is arranged inside the first protective cover 5. The etching assembly includes an etching barrel 36 and a fourth gear 37. The fourth gear 37 is movably installed on the upper wall of the base plate 1. The etching barrel 36 is arranged on the upper wall of the fourth gear 37. An etching solution for etching is provided inside the etching barrel 36. The cleaning assembly includes a cleaning barrel 38 and a fifth gear 39. The fifth gear 39 is movably installed on the upper wall of the base plate 1. The cleaning barrel 38 is arranged on the upper wall of the fifth gear 39. A cleaning solution for cleaning is provided inside the cleaning barrel 38. Both the fourth gear 37 and the fifth gear 39 are meshed and connected with the third gear 35. When the drive shaft 8 rotates, it drives the third gear 35 to rotate. The third gear 35 drives the fourth gear 37 and the fifth gear 39 to rotate. The fourth gear 37 drives the etching barrel 36 thereon to rotate, and the etching barrel 36 drives the internal etching solution to rotate, facilitating the etching of the wafer. The fifth gear 39 drives the cleaning barrel 38 thereon to rotate, and the cleaning barrel 38 drives the internal cleaning solution to rotate, facilitating the cleaning of the wafer.

[0044] The drying assembly includes a drying barrel 40 and an air pump 41. Both the drying barrel 40 and the air pump 41 are arranged on the upper wall of the base plate 1. The drying barrel 40 and the air pump 41 are connected by an air pipe 43. An air vent cavity 42 is provided inside the bottom wall of the drying barrel 40. The air vent cavity 42 is in through connection with the air pipe 43. A plurality of air vent holes 44 for gas circulation are provided on the bottom wall of the drying barrel 40. The air vent holes 44 are in through connection with the air vent cavity 42. When the air pump 41 works, it transports gas through the air pipe 43 into the air vent cavity 42, and the gas in the air vent cavity 42 is discharged through the air vent holes 44 to perform drying treatment on the wafer inside the drying barrel 40.

[0045] A motor 45 is installed on the upper wall of the third support plate 4. The output shaft end of the motor 45 is connected to the drive shaft 8. When the motor 45 works, it drives the drive shaft 8 to rotate. An opening and closing door is provided inside the first protective cover 5, facilitating the removal or insertion of the wafer.

[0046] The specific use is as follows:

[0047] Open the second protective cover, place the wafer to be polished between the two sets of backing plates 23, and backing plates 23 are also placed between the wafers. The outer side wall of the wafer is movably clamped and arranged inside the grinding cavity 14. The spring 22 clamps the wafer between the upper wall of the lower pressing plate 21 and the second gear 16, and then close the second protective cover;

[0048] Place the wafer to be etched in the fixing member 34. Open the opening and closing door of the first protective cover 5, then hang the hook 33 on the fixing member 34 on the fixing ring 32. At this time, the movable end of the hydraulic rod 30 is in a shortened state, and then close the opening and closing door;

[0049] The motor 45 drives the driving shaft 8 to rotate, and the rotation of the driving shaft 8 drives the driving plate 10, the driving plate 2 11 and the limit frame 12 to rotate synchronously. The driving plate 2 11 drives the gear 2 16 and the toggle rod 17 thereon to rotate. Since the gear 2 16 is meshed with the gear 15, the gear 15 is fixed by the grinding frame 9. The gear 2 16 rotates along the gear 15 when rotating, and the gear 2 16 drives the toggle rod 17 to rotate when rotating. Therefore, the toggle rod 17 rotates along the driving shaft 8 and also rotates under the action of the gear 2 16. The toggle rod 17 drives the insertion rod 18 and the sleeve 19 to rotate. The rotation of the gear 2 16 drives the wafer and the pad 23 thereon to rotate. The outer wall of the wafer is movably connected in the grinding chamber 14. The rotation of the gear 2 16 drives the wafer to rotate. When the wafer rotates, it passes through the grinding chamber 14 for grinding. At the same time, a dust removal component is also provided in the protective cover 2 to facilitate cleaning of dust in the grinding frame 9.

[0050] If at the beginning, the limit frame 12 is movably arranged in one group of arc grooves 27, the outer wall of the limit frame 12 contacts the inner wall of the arc groove 27, which is convenient for limiting the rotating plate 26, and the driving shaft 8 continues to rotate, driving the limit frame 12 and the driving plate 2 11 to rotate, and the slot hole 13 of the limit frame 12 rotates to a position close to the rotating plate 26 until it enters the arc groove 27. At this time, the toggle rod 17 on the driving plate 2 11 rotates under the action of the driving shaft 8 and the gear 2 16, and the toggle rod 17 drives the sleeve 19 to be arranged in the limit groove 29 of the limit member 28. As the driving shaft 8 continues to rotate, the toggle rod 17 passes through the sleeve 19 and the limit The position piece 28 drives the rotating plate 26 to rotate 90 degrees. During the rotation process, the rotating plate 26 is inserted into the slot 13 of the limit frame 12 and then discharged. Then the limit frame 12 is movably connected to another set of arc grooves 27. At this time, the rotating plate 26 drives the wafer to be etched to rotate 90 degrees and is located at the upper end of the etching barrel 36. The hydraulic rod 30 drives the wafer to move down into the etching liquid. At the same time, the driving shaft 8 rotates to drive the gear three 35 to rotate, and the gear three 35 drives the gear four 37 and the gear five 39 to rotate. The gear four 37 drives the etching barrel 36 thereon to rotate, and the etching barrel 36 drives the etching liquid inside to rotate, so as to facilitate etching of the wafer.

[0051] After etching is completed, the hydraulic rod 30 drives the wafer to lift up, and after the rotating plate 26 rotates 90 degrees again, the wafer moves to the upper end of the cleaning bucket 38, and the hydraulic rod 30 drives the wafer to move down into the cleaning liquid, and the gear 5 39 drives the cleaning bucket 38 on it to rotate, and the cleaning bucket 38 drives the internal cleaning to rotate, so as to facilitate the cleaning of the wafer;

[0052] After the cleaning is completed, the hydraulic rod 30 drives the wafer to rise. After the rotating plate 26 rotates 90 degrees again, the wafer moves to the directly upper end of the drying barrel 40. The hydraulic rod 30 operates to drive the wafer to move down into the drying barrel 40. The air pump 41 operates to deliver gas through the air pipe 43 into the ventilation cavity 42, and the gas in the ventilation cavity 42 is discharged through the ventilation holes 44 to dry the wafer in the drying barrel 40.

[0053] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents. Generally speaking, if those of ordinary skill in the art are inspired by it and, without departing from the purpose of the present invention, design similar structural methods and embodiments to this technical solution without creative efforts, they should all fall within the protection scope of the present invention.

Claims

1. A processing device for wafer production, including a bottom plate for support and fixation, a first support plate is installed on the upper wall of the bottom plate, a second support plate is installed on the upper wall of the first support plate, a third support plate is installed on the upper wall of the second support plate, a fixing plate is installed on the side wall of the first support plate, a first protective cover is installed between the fixing plate and the bottom plate, and a second protective cover is installed at the upper end of the first protective cover, characterized in that, A driving and adjusting assembly is installed on the third support plate and the second support plate, the upper end of the driving and adjusting assembly is arranged in the second protective cover, the lower end of the driving and adjusting assembly movably passes through the fixed plate and is arranged on the upper wall of the bottom plate, and is arranged in the first protective cover, a transmission assembly is installed on the side wall of the first support plate, the transmission assembly is movably connected with the driving and adjusting assembly, the transmission assembly is arranged in the second protective cover, the lower end of the transmission assembly movably passes through the fixed plate and is arranged in the first protective cover, an etching assembly, a cleaning assembly and a drying assembly are also installed on the upper wall of the bottom plate, the etching assembly, the cleaning assembly and the drying assembly are all arranged at the lower end of the transmission assembly and are arranged in the first protective cover.

2. The processing equipment for wafer production according to claim 1, characterized in that, The driving and adjusting assembly comprises a driving shaft and a grinding frame, the upper end of the driving shaft is movably arranged on the bottom wall of the second supporting plate, the lower end of the driving shaft is movably penetrated through the fixed plate and then arranged on the bottom plate, the driving shaft is provided with driving plate 1, driving plate 2 and a limit frame, the driving plate 1 is arranged at the upper end of the driving plate 2, the driving plate 2 is arranged at the upper end of the limit frame, the driving plate 1, driving plate 2 and the limit frame are all arranged at the upper end of the fixed plate, the limit frame is provided with a slot, the grinding frame is arranged on the first supporting plate, the driving plate 1 is provided with a clamping and grinding assembly, the driving plate 2 is provided with a rotating toggle assembly, and the clamping and grinding assembly is arranged in the grinding frame.

3. The processing equipment for wafer production according to claim 2, characterized in that, The inner side wall of the grinding frame is evenly and evenly provided with a plurality of grinding cavities for grinding, the bottom wall of the grinding frame is provided with an annular gear 1, and the inner side wall of the gear 1 is provided with gear teeth.

4. A processing device for wafer production according to claim 3, wherein, The rotary toggle assembly includes gear 2 and a toggle rod, wherein gear 2 is movably disposed on the upper wall of drive plate 2, gear 2 is meshingly connected with gear 1, one end of the toggle rod is movably disposed on the lower end of drive plate 2, and one end of the toggle rod is connected to gear 2, an insertion rod is installed at the other end of the toggle rod, and a sleeve is movably installed on the insertion rod.

5. A processing device for wafer production according to claim 4, characterized in that, The clamping and polishing assembly includes a telescopic rod, the upper end of the telescopic rod is connected to the bottom wall of a driving plate, a lower pressure plate is installed at the lower end of the telescopic rod, a spring is installed between the lower pressure plate and the driving plate, the spring is sleeved on the outside of the telescopic rod, the bottom wall of the lower pressure plate and the upper wall of the second gear are both installed with pads, the pad on the bottom wall of the lower pressure plate is movably connected to the lower pressure plate, the pad on the upper wall of the second gear is fixedly connected to the second gear, and the two groups of pads are placed opposite to each other, the wafer to be polished is placed between the two groups of pads, and a pad is also placed between the wafers, and the outer wall of the wafer is movably clamped in the polishing cavity.

6. A processing device for wafer production according to claim 5, characterized in that, A connecting plate is installed on the outer side wall of the first support plate. A connecting rod is installed on the bottom wall of the connecting plate. The lower end of the connecting rod is movably installed with a rotating plate. An arc-shaped groove is provided on the side wall of the rotating plate. There are four groups of the arc-shaped grooves, and the four groups of arc-shaped grooves are evenly arranged at equal intervals on the side wall of the rotating plate. The limiting frame is movably clamped in the arc-shaped groove. The rotating plate between two adjacent arc-shaped grooves can be clamped into the slot hole of the limiting frame. A limiting member is installed on the upper wall of the rotating plate. There are four groups of the limiting members, and the four groups of limiting members are evenly arranged at equal intervals on the upper wall of the rotating plate. The limiting members and the arc-shaped grooves are staggered. A limiting slot is provided on any one of the limiting members. The sleeve is movably clamped in the limiting slot.

7. A processing device for wafer production according to claim 6, characterized in that, A hydraulic rod is installed at the center of the bottom wall of the rotating plate. The hydraulic rod movably penetrates through the fixed plate. A lifting plate is installed at the movable end of the hydraulic rod. The lifting plate is arranged in the first protective cover. Four fixing rings are evenly installed at equal intervals in a ring shape on the bottom wall of the lifting plate. A hook is movably clamped on the fixing ring. A fixing member for placing a wafer is installed on the hook.

8. A processing device for wafer production according to claim 7, characterized in that, A gear three is installed at the lower end of the driving shaft. The gear three is movably installed on the upper wall of the bottom plate and is arranged in the first protective cover. The etching assembly includes an etching barrel and a gear four. The gear four is movably installed on the upper wall of the bottom plate. The etching barrel is arranged on the upper wall of the gear four. The cleaning assembly includes a cleaning barrel and a gear five. The gear five is movably installed on the upper wall of the bottom plate. The cleaning barrel is arranged on the upper wall of the gear five. Both the gear four and the gear five are meshed and connected with the gear three.

9. The processing equipment for wafer production according to claim 8, characterized in that, The drying assembly includes a drying barrel and an air pump. Both the drying barrel and the air pump are arranged on the upper wall of the bottom plate. The drying barrel and the air pump are connected through an air pipe. An air vent cavity is arranged inside the bottom wall of the drying barrel. The air vent cavity is communicated with the air pipe. A plurality of air vent holes for gas circulation are arranged on the bottom wall of the drying barrel. The air vent holes are communicated with the air vent cavity.

10. A processing device for wafer production according to claim 9, characterized in that, A motor is installed on the upper wall of the third support plate. The output shaft end of the motor is connected to the driving shaft. Opening and closing doors are provided on both the first protective cover and the second protective cover.

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