Equipment for automatically laminating double-sided adhesive tape and PCB (Printed Circuit Board)

Abstract

The invention discloses equipment for automatically laminating a double-sided adhesive tape and a PCB (printed circuit board), which comprises a workbench, a plurality of Y-axis linear slide rail modules are erected on the upper surface of the workbench, a PCB positioning module, a PCB turnover module and a lower cavity chamber are slidably erected on the Y-axis linear slide rail modules, a lifting plate a is arranged in the lower cavity chamber, a vacuum chuck b is arranged on the lifting plate a, and the vacuum chuck b is arranged on the upper surface of the workbench. A double-faced adhesive tape feeding frame is further erected on the workbench. According to the technical scheme, in the using process, the PCB and the double-faced adhesive tape are accurately positioned through the equipment, the pasting operation of the double-faced adhesive tape on the small PCB can be conveniently carried out, the operation can be automatically completed through the equipment, manual operation is not needed, the stability of the machining quality is effectively improved, and the machining efficiency is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of double-sided adhesive bonding equipment for PCB boards, and specifically relates to an equipment for automatically bonding double-sided adhesive and PCB boards. Background Art

[0002] During the production and processing of PCB boards (printed circuit boards), double-sided adhesives are widely used to fix components including batteries, sensor modules, etc. By using double-sided adhesives to fix them on the PCB board, the use of screws or buckles can be avoided; when using double-sided adhesives to fix metal shielding covers on the PCB, electromagnetic interference affecting the circuit can be effectively prevented; when using double-sided adhesives between the PCB and the metal housing, insulation and shock protection can be effectively provided, thereby effectively preventing friction or short circuit with the housing; However, in the current PCB processing, due to the small size of the PCB and the small amount of double-sided adhesive used, manual bonding is usually used. When using manual bonding, since both the double-sided adhesive and the PCB board are small in size, it is not easy to accurately fix the double-sided adhesive in the appropriate position on the PCB board, resulting in unsatisfactory adhesion of the double-sided adhesive. Moreover, during the later use of the PCB board, the bonding surface of the double-sided adhesive is likely to separate and fall off, thereby causing the bonded object to fall off and affecting the good operation of the electronic device. In view of the problems exposed in the current PCB board processing, it is necessary to improve and optimize the structure of the equipment for bonding double-sided adhesive and PCB board. Summary of the Invention

[0003] To solve the above technical problems, the present invention provides an equipment for automatically bonding double-sided adhesive and PCB board, which has the characteristics of facilitating the accurate bonding of the double-sided adhesive on the PCB and facilitating the rapid and stable production of PCB boards meeting the specifications.

[0004] To achieve the above object, the present invention provides the following technical solution: An equipment for automatically bonding double-sided adhesive and PCB board, including a workbench, on the upper surface of which several Y-axis linear slide rail modules are erected. On the Y-axis linear slide rail modules, a PCB board positioning module, a PCB board turnover module, and a lower cavity chamber that can slide and displace along the track are slidably erected. A lifting plate a is arranged in the lower cavity chamber, and a vacuum suction cup b is arranged on the lifting plate a. A double-sided adhesive loading rack is also erected on the workbench perpendicular to the setting direction of the Y-axis linear slide rail modules. A Z-axis screw module a is horizontally laid and fixed on the double-sided adhesive loading rack, and a height-adjustable double-sided adhesive rolling assembly is arranged on the Z-axis screw module a. A Y-axis screw module b is horizontally laid and fixed on the surface of the double-sided adhesive loading rack facing away from the Z-axis screw module a, and a material conveying assembly for loading the double-sided adhesive is connected to the Y-axis screw module b, and a material lifting assembly is arranged on the workbench below the material conveying assembly; One side of the double-sided adhesive loading rack is provided with a PCB board pressurized upper cavity rack on the workbench, the inner side of the PCB board pressurized upper cavity rack is connected with a height-adjustable vacuum chamber, one side surface of the PCB board pressurized upper cavity rack is horizontally provided with a Y-axis screw module c, and an auxiliary suction component is connected to the Y-axis screw module c; One side of the Y-axis linear slide rail module is located on the upper surface of the workbench and is also provided with a positioning film-tearing guide rail, on which a film-tearing assembly for tearing off the double-sided adhesive tape is slidably provided; A PCB board turnover guide rail is also arranged on one side of the positioning and tearing film guide rail on the workbench, and a PCB board turnover assembly is arranged on the PCB board turnover guide rail.

[0005] As a preferred technical solution of an apparatus for automatically laminating double-sided adhesive tape and PCB board of the present invention, the PCB board positioning module comprises a sliding seat slidably displaced on the Y-axis linear slide rail module, the top of the sliding seat is connected with a rotating cylinder a, the top of the rotating cylinder a is connected with a supporting plate, the top of the supporting plate is provided with a vacuum suction plate a, and the side of the vacuum suction plate a is also provided with a positioning push block a; The PCB board turnover module is provided with an angle adjustment cylinder, a turning arm is sleeved on the rotating shaft of the angle adjustment cylinder, and a vacuum suction cup h is connected to the rotating arm; A horizontal adjustment guide rail a is arranged at the bottom end of the lower cavity chamber, and the sliding seat is arranged on the Y-axis linear slide rail module to be slidable. The lower cavity chamber can slide and displace on the horizontal adjustment guide rail a and adjust its position.

[0006] As a preferred technical solution for an apparatus for automatically bonding double-sided tape and PCB boards according to the present invention, a double-sided tape rolling assembly includes a connecting frame which is sleeved on a Z-axis screw module a and can slide and displace along a setting direction of the Z-axis screw module a; a vacuum suction cup c for adsorbing the PCB with double-sided tape is provided at the bottom end of the connecting frame; a rolling cylinder is provided at one end of the connecting frame; a rolling roller is connected to the output shaft of the rolling cylinder; and an auxiliary downward-pressing vacuum plate with adjustable height is provided at one end of the vacuum suction cup c.

[0007] As a preferred technical solution of the device for automatically laminating double-sided tape and PCB board of the present invention, the material conveying assembly includes a slider a that is fitted and slidably displaced on the Y-axis lead screw module b. A pressing cylinder a is fixedly connected to the slider a. A slider b is connected to the output shaft of the pressing cylinder a through a connecting block. A loading cylinder is connected to the output shaft of the slider b. A double-sided tape suction block is arranged at the output end of the loading cylinder. The material lifting assembly includes a material rack erected and fixed on the workbench. A lifting motor is arranged below the material rack. A material lifting lead screw is connected to the output shaft of the lifting motor. A lifting table that can slide and adjust its height is fitted inside the material rack. The double-sided tape is placed on the lifting table for lifting. The bottom end of the lifting table is threadedly engaged with the material lifting lead screw through a connecting member. When the lifting motor drives the material lifting lead screw to rotate, the lifting table is driven to adjust its height, so that the double-sided tape on the lifting table contacts the bottom surface of the double-sided tape suction block at the bottom end of the loading cylinder.

[0008] As a preferred technical solution of the device for automatically laminating double-sided tape and PCB board of the present invention, several protective covers are fitted inside the PCB board pressing upper cavity frame. The vacuum chamber is fitted inside the protective cover and can slide up and down. A height adjustment cylinder a is arranged on the protective cover through a bracket. The output shaft of the height adjustment cylinder a penetrates the protective cover and pushes the vacuum chamber to move up and down. An auxiliary suction cylinder is also arranged inside the vacuum chamber. A vacuum suction cup z is connected to the bottom end of the auxiliary suction cylinder. The end of the vacuum chamber can contact the top of the lower cavity chamber to complete cavity sealing.

[0009] As a preferred technical solution of the device for automatically laminating double-sided tape and PCB board of the present invention, the auxiliary suction assembly includes a slider c that can be fitted and slidably displaced on the Y-axis lead screw module c. A Z-axis lead screw module c is vertically connected to the slider c. A height adjustment cylinder c is connected to the slider of the Z-axis lead screw module c. A vacuum suction plate d is connected to the output end of the height adjustment cylinder c.

[0010] As a preferred technical solution of the device for automatically laminating double-sided tape and PCB board of the present invention, the film tearing assembly includes a driven slider that is fitted on the positioning film tearing guide rail and can slide along the positioning film tearing guide rail. A vacuum suction plate f is fixedly arranged on the driven slider. A rotary cylinder b is arranged on the positioning film tearing guide rail on one side of the vacuum suction plate f. A rotary rubber wheel is connected to the output shaft of the rotary cylinder b through a bracket. A pressing cylinder f is also arranged on the bracket. The rotary rubber wheel is connected to the output shaft of the pressing cylinder f. The rotary rubber wheel can change its position under the push of the output shaft of the pressing cylinder f.

[0011] As a preferred technical solution of the device for automatically bonding double-sided tape and PCB board of the present invention, the PCB turnover assembly includes a PCB board lifting frame slidably fitted on the PCB board turnover guide rail. One end of the PCB board turnover guide rail is also provided with a servo motor, which drives the rotation of a lead screw inside the PCB board turnover guide rail. The bottom end of the PCB board lifting frame is sleeved on the lead screw and displaced by the rotation of the lead screw. The PCB board lifting frame is respectively provided with a vacuum suction plate e and a vacuum suction plate g. The PCB board lifting frame is also fitted and penetrated with a plurality of protruding positioning blocks for limiting the vacuum suction plate e and the vacuum suction plate g.

[0012] As a preferred technical solution of the device for automatically bonding double-sided tape and PCB board of the present invention, a plurality of Y-axis linear slide rail modules are arranged on the workbench. A vacuum chamber is arranged above each Y-axis linear slide rail module. A material collection basket is fitted and arranged on one side of each Y-axis linear slide rail module on the workbench. A waste collection basket is fitted and arranged on the upper surface of the workbench on one side of the vacuum suction plate f.

[0013] As a preferred technical solution of the device for automatically bonding double-sided tape and PCB board of the present invention, a mask frame is also arranged on the workbench. A plurality of dust removal fans are fixedly arranged on the mask frame. A guide rail a is also arranged on the mask frame on one side of the dust removal fan. A sliding arm a is slidably arranged on the guide rail a. A central control screen is connected and arranged at the bottom end of the sliding arm a. A material feeding port is also opened on the mask frame. Sealing doors are arranged on the sides of the mask frame.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. During the use of this technical solution, the device accurately positions the PCB board and the double-sided tape, facilitating the bonding operation of the double-sided tape on the small PCB. The operation can be automatically completed by the device without manual operation, effectively improving the stability of the processing quality and effectively improving the processing efficiency.

[0015] 2. In this technical solution, the PCB board is transferred by a vacuum chuck during the transfer process, without damaging the PCB board. During the bonding process of the PCB board and the double-sided tape, a negative pressure vacuum processing environment is set. In addition, a heating component is arranged therein, facilitating the further melting and softening of the contact surface between the double-sided tape and the PCB for bonding. And the vacuum environment effectively reduces the bubbles between the PCB and the double-sided tape, improving the stability of the double-sided tape on the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to make the content of the present invention easier to be clearly understood, the present invention will be further described in detail below according to specific embodiments in conjunction with the drawings.

[0017] Figure 1 is a schematic structural diagram of the present invention; Figure 2 In the present invention Figure 1 is a schematic structural diagram of the structure with a cover body; Figure 3 In the present invention Figure 2 is a schematic top view structural diagram; Figure 4 In the present invention Figure 1 is a schematic diagram of a partial structure therein; Figure 5 In the present invention Figure 4 is a schematic top view structural diagram; Figure 6 is a schematic structural diagram of the double-sided tape loading rack in the present invention; Figure 7 In the present invention Figure 6 is a schematic structural diagram from another perspective; Figure 8 is a schematic structural diagram of the PCB board pressurizing upper cavity rack in the present invention; Figure 9 In the present invention Figure 8 is a schematic structural diagram from another perspective; Figure 10 In the present invention Figure 4 is a schematic diagram of a partial structure therein; Figure 11 In the present invention Figure 10 is an enlarged schematic structural diagram at position A therein; Figure 12 In the present invention Figure 10 is an enlarged schematic structural diagram at position B therein; In the figure: 1, workbench; 11, material collection basket; 2, mask rack; 21, dust removal fan; 22, guide rail a; 23, sliding arm a; 24, central control screen; 25, material feeding port; 26, sealing door; 3, Y-axis linear slide rail module; 31, PCB board positioning module; 311, sliding seat; 312, rotary cylinder a; 313, support tray; 314, vacuum suction plate a; 315, positioning push block a; 32, PCB board turnover module; 33, lower cavity chamber; 331, horizontal adjustment guide rail a; 332, lifting plate a; 333, vacuum suction cup b; 4. Double-sided tape loading rack; 41. Z-axis lead screw module a; 411. Connecting frame; 412. Vacuum chuck c; 413. Rolling cylinder; 414. Rolling roller; 415. Auxiliary pressing vacuum plate; 42. Y-axis lead screw module b; 421. Slide block a; 422. Pressing cylinder a; 423. Slide block b; 424. Loading cylinder; 425. Material rack; 426. Lifting platform; 427. Material lifting lead screw; 428. Lifting motor; 5. PCB board pressing upper cavity rack; 51. Height adjusting cylinder a; 52. Protective cover; 53. Vacuum chamber; 54. Y-axis lead screw module c; 55. Slide block c; 56. Z-axis lead screw module c; 57. Height adjusting cylinder c; 58. Vacuum suction plate d; 6. Positioning film tearing guide rail; 61. Driven slider; 62. Vacuum suction plate f; 63. Positioning push block f; 64. Rotary cylinder b; 65. Rotary rubber wheel; 66. Pressing cylinder f; 67. Scrap collection basket; 7. PCB board turnover guide rail; 71. PCB board lifting bracket; 72. Servo motor; 73. Vacuum suction plate e; 74. Vacuum suction plate g; 75. Positioning block. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiment As Figure 1-12 shown, an automatic double-sided tape and PCB board laminating device disclosed by the present invention includes a workbench 1. A plurality of Y-axis linear slide rail modules 3 are installed on the upper surface of the workbench 1. In the actual solution provided in this embodiment, two Y-axis linear slide rail modules 3 are laid. The Y-axis linear slide rail modules 3 are all driven by electricity. A PCB board positioning module 31, a PCB board turnover module 32, and a lower cavity chamber 33 that can slide and displace along the track are slidably installed on the Y-axis linear slide rail modules 3; A lifting plate a 332 is arranged in the lower cavity chamber 33, and a vacuum chuck b 333 is arranged on the lifting plate a 332. In this technical solution, each vacuum suction plate and / or vacuum chuck is connected to a vacuum negative pressure device through a pipeline, and a plurality of vacuum negative pressure suction holes are evenly opened on the surface of the vacuum suction plate and / or vacuum chuck; A double-sided tape loading rack 4 is also set on the workbench 1 and is arranged perpendicular to the setting direction of the Y-axis linear slide module 3, which is used to load the double-sided tape. The double-sided tape used in this technical solution is a strip-shaped sheet structure, and the specific size is adjusted according to the needs of the on-site PCB.

[0020] A Z-axis screw module a41 is horizontally laid and fixed on the double-sided adhesive loading rack 4, and a height-adjustable double-sided adhesive rolling assembly is arranged on the Z-axis screw module a41. A Y-axis screw module b42 is horizontally laid and fixed on the surface of the double-sided adhesive loading rack 4 on one side away from the Z-axis screw module a41, and a material conveying assembly for loading the double-sided adhesive is connected to the Y-axis screw module b42, and a material lifting assembly is arranged on the workbench 1 below the material conveying assembly; One side of the double-sided adhesive loading rack 4 is provided with a PCB board pressurized upper cavity rack 5 on the workbench 1, and a height-adjustable vacuum chamber 53 is connected to the inner side of the PCB board pressurized upper cavity rack 5. The vacuum chamber 53 is connected to the external vacuum negative pressure equipment through a pipeline, and a Y-axis screw rod module c54 is horizontally provided on the surface of one side of the PCB board pressurized upper cavity rack 5, and an auxiliary suction component is connected to the Y-axis screw rod module c54, and the auxiliary suction component is used to transfer the workpiece; One side of the Y-axis linear slide rail module 3 is located on the upper surface of the workbench 1 and is also provided with a positioning film-tearing guide rail 6, on which a film-tearing assembly for tearing off the double-sided adhesive film is slidably provided; A PCB board turnover guide rail 7 is also provided on the workbench 1 on one side of the positioning and tearing film guide rail 6, and a PCB board turnover assembly is provided on the PCB board turnover guide rail 7. Through the operation of the above components, the PCB board can be accurately positioned and transported, which is convenient for the double-sided tape bonding operation on the PCB board.

[0021] Specifically, the PCB board positioning module 31 includes a sliding seat 311 which is slidably disposed on the Y-axis linear slide module 3, the top of the sliding seat 311 is connected to a rotating cylinder a312, the top of the rotating cylinder a312 is connected to a supporting plate 313, the top of the supporting plate 313 is provided with a vacuum suction plate a314, and the side of the vacuum suction plate a314 is also provided with a positioning push block a315.

[0022] An angle adjustment cylinder is provided on the PCB board turnover module 32, and a flip arm is sleeved on the rotating shaft of the angle adjustment cylinder. A vacuum suction cup h is connected to the rotating arm. In this embodiment, a film tearing clip can also be connected to the rotating arm. The film tearing clip is driven to rotate by the rotating cylinder installed on the rotating arm. When the film tearing clip is rotated to one side of the vacuum suction cup h, the film tearing clip runs and tears off the protective film on the bottom surface of the PCB board on the vacuum suction cup h.

[0023] At the bottom end of the lower cavity chamber 33, a horizontal adjustment guide rail a331 is provided. The sliding seat 311 is arranged on the Y-axis linear slide rail module 3 and can slide. The lower cavity chamber 33 can slide and displace on the horizontal adjustment guide rail a331 to adjust its position. In this embodiment, the horizontal adjustment guide rail a331 at the bottom end of the lower cavity chamber 33 is more convenient for adjusting the position of the lower cavity chamber 33 and facilitating the precise positioning of the lower cavity chamber 33.

[0024] Specifically, the double-sided tape rolling component includes a connecting frame 411 sleeved on the Z-axis lead screw module a41 and capable of sliding and displacing along the direction set by the Z-axis lead screw module a41. At the bottom end of the connecting frame 411, a vacuum chuck c412 for adsorbing the PCB with double-sided tape is provided. At one end of the connecting frame 411, a rolling cylinder 413 is erected. A rolling roller 414 is connected and arranged on the output shaft of the rolling cylinder 413. At one end of the vacuum chuck c412, an auxiliary pressing vacuum plate 415 with adjustable height is also provided. In this embodiment, the rolling roller 414 adjusts its height under the push of the rolling cylinder 413 and rolls the PCB with double-sided tape, so that the double-sided tape strip and the PCB are preliminarily bonded and fused.

[0025] Specifically, the material conveying component includes a slider a421 fitted and slidingly displaced on the Y-axis lead screw module b42. A pressing cylinder a422 is fixedly connected to the slider a421. A slider b423 is connected and arranged on the output shaft of the pressing cylinder a422 through a connecting block. A feeding cylinder 424 is connected and arranged on the output shaft of the slider b423. A double-sided tape suction block is arranged at the output end of the feeding cylinder 424.

[0026] The material lifting component includes a material rack 425 erected and fixed on the workbench 1. A lifting motor 428 is arranged below the material rack 425. A material lifting lead screw 427 is connected and arranged on the output shaft of the lifting motor 428. A lifting table 426 that can slide and adjust its height is fitted and arranged inside the material rack 425. The double-sided tape is placed on the lifting table 426 for lifting. The bottom end of the lifting table 426 is threadedly engaged with the material lifting lead screw 427 through a connecting member. When the lifting motor 428 drives the material lifting lead screw 427 to rotate, the lifting table 426 is driven to adjust its height, so that the double-sided tape on the lifting table 426 contacts the bottom surface of the double-sided tape suction block at the bottom end of the feeding cylinder 424. In this embodiment, during the operation of the material lifting component, the double-sided tape to be processed is lifted in height, thereby completing material feeding. The double-sided tape sucked by negative pressure is transferred to the PCB through the material conveying component.

[0027] Specifically, several protective covers 52 are fitted and arranged on the inner side of the upper cavity frame 5 for the PCB board. The vacuum chamber 53 is fitted and arranged inside the protective cover 52 and can slide up and down. A height-adjusting cylinder a51 is arranged on the protective cover 52 through a bracket. The output shaft of the height-adjusting cylinder a51 penetrates through the protective cover 52 and pushes the vacuum chamber 53 to move up and down. An auxiliary material suction cylinder is also arranged inside the vacuum chamber 53. The bottom end of the auxiliary material suction cylinder is connected with a vacuum suction cup z. The end of the vacuum chamber 53 can contact the top of the lower cavity chamber 33 to complete cavity sealing. In this embodiment, in order to avoid air bubbles remaining between the bonding contact surfaces of the double-sided tape and the PCB board and further improve the bonding stability, a cavity that can be sealed and evacuated is provided in this technical solution, so that the gas between the bubbles can be effectively discharged when the double-sided tape is bonded to the PCB board.

[0028] Specifically, the auxiliary suction component includes a slider c55 that can be fitted and slide on the Y-axis lead screw module c54. A Z-axis lead screw module c56 is vertically connected to the slider c55. A height-adjusting cylinder c57 is connected to the slider of the Z-axis lead screw module c56. A vacuum suction plate d58 is connected to the output end of the height-adjusting cylinder c57. In this embodiment, the auxiliary suction component can transfer and transport the bonded PCB board.

[0029] Specifically, the film tearing component includes a driven slider 61 that is fitted on the positioning film tearing guide rail 6 and can slide along the positioning film tearing guide rail 6. A vacuum suction plate f62 is fixedly arranged on the driven slider 61. A rotary cylinder b64 is arranged on the positioning film tearing guide rail 6 on one side of the vacuum suction plate f62. A rotary rubber wheel 65 is connected to the output shaft of the rotary cylinder b64 through a bracket. A pressing cylinder f66 is also arranged on the bracket. The rotary rubber wheel 65 is connected to the output shaft of the pressing cylinder f66. The rotary rubber wheel 65 can change its position under the push of the output shaft of the pressing cylinder f66 and peel off the covering film on the double-sided tape on the PCB board.

[0030] Specifically, the PCB turnover component includes a PCB board lifting frame 71 that is fitted and slides on the PCB board turnover guide rail 7. A servo motor 72 is also arranged at one end of the PCB board turnover guide rail 7. The servo motor 72 drives the lead screw inside the PCB board turnover guide rail 7 to rotate. The bottom end of the PCB board lifting frame 71 is sleeved on the lead screw and moves through the rotation of the lead screw; Vacuum suction plates e73 and vacuum suction plates g74 are respectively arranged on the PCB board lifting frame 71. A plurality of protruding positioning blocks 75 for limiting the vacuum suction plates e73 and vacuum suction plates g74 are also fitted and penetrated through the PCB board lifting frame 71.

[0031] Specifically, a number of Y-axis linear slide rail modules 3 are arranged on the workbench 1. Above each Y-axis linear slide rail module 3, a vacuum chamber 53 is arranged. On one side of each Y-axis linear slide rail module 3 on the workbench 1, a material collection basket 11 is fitted. On the upper surface of the workbench 1 on one side of the vacuum suction plate f62, a waste collection basket 67 is fitted.

[0032] Specifically, a mask rack 2 is also arranged on the workbench 1. A number of dust removal fans 21 are fixedly arranged on the mask rack 2. On one side of the dust removal fans 21 on the mask rack 2, a guide rail a22 is also arranged. A sliding arm a23 is slidably arranged on the guide rail a22. At the bottom end of the sliding arm a23, a central control screen 24 is connected. A material feeding port 25 is also opened on the mask rack 2. Sealing doors 26 are arranged on the sides of the mask rack 2 to facilitate isolating dust from the outside.

[0033] The working principle and usage process of the present invention: In the actual usage process of the technical solution of the present invention, the mask rack 2 covers the workbench 1 to seal the components above the workbench 1. The sliding arm a23 slides and displaces on the guide rail a22, and synchronously adjusts the position of the central control screen 24. The operator operates the components on the workbench 1 through the central control screen 24 outside the device to process the PCB board.

[0034] During the operation of the device, the staff puts the PCB board to be processed into the PCB board positioning module 31 above the workbench 1 at the material feeding port 25. During the operation of the vacuum suction plate a314, the PCB board is adsorbed. The positioning push block a315 is driven by the driving cylinder below the vacuum suction plate a314 to position and limit the PCB board placed on the vacuum suction plate a314 during operation, so that the PCB board above it maintains accurate and stable positioning. In this technical solution, a rotary cylinder a312 is arranged below the vacuum suction plate a314. During the operation of the rotary cylinder a312, the angle of the vacuum suction plate a314 is adjusted to facilitate the accurate alignment of the PCB board on the vacuum suction plate a314. The sliding seat 311 slides on the Y-axis linear slide rail module 3 to horizontally transport the workpiece to be processed on the vacuum suction plate a314.

[0035] During the displacement of the PCB board positioning module 31, the material conveying component and the material lifting component operate synchronously.

[0036] During the operation of the material lifting assembly, the lifting motor 428 operates and drives the material lifting lead screw 427 to rotate, thereby pushing the lifting platform 426 to rise in height. During the rising process of the lifting platform 426, the double-sided tape placed thereon is pushed to rise. When the bottom surface of the feeding cylinder 424 contacts the double-sided tape, the double-sided tape is adsorbed. The height is lifted by the pressing cylinder a422. Then, the slider a421 slides on the mask frame 2 to displace the bottom end of the feeding cylinder 424 above the PCB board positioning module 31. The double-sided tape to be pasted is placed on the PCB board, and the double-sided tape is initially adhered to the upper surface of the PCB board under the action of the adhesive.

[0037] After that, the PCB board positioning module 31 continues to convey the PCB board with double-sided tape, that is, the workpiece. When the workpiece is conveyed below the vacuum chuck c412, the Z-axis lead screw module a41 operates and adjusts the height of the connecting frame 411, pushing the connecting frame 411 to descend in height and driving the vacuum chuck c412 to descend synchronously in height. The workpiece can be pressurized through the vacuum chuck c412. The rolling cylinder 413 pushes the rolling roller 414 to sink in height, so that the bottom end of the rolling roller 414 contacts the upper surface of the workpiece, and the workpiece is pressurized and rolled through the rolling roller 414, so that the double-sided tape is tightly adhered to the surface of the PCB.

[0038] The PCB board positioning module 31 continues to convey the workpiece and slide on the Y-axis linear slide rail module 3, so that the PCB board positioning module 31 is conveyed to one side of the PCB board turnover module 32. The vacuum chuck h connected to the rotating arm of the PCB board turnover module 32 is flipped above the PCB board positioning module 31 under the action of the rotating arm. At this time, the vacuum of the vacuum suction plate a314 is released, and the workpiece on the PCB board positioning module 31 is adsorbed onto the vacuum chuck h through the vacuum chuck h. A film tearing clip is also connected and arranged at the bottom of the rotating arm through a steering cylinder. The film tearing clip can be flipped to one side of the vacuum chuck h through the steering cylinder, and the film on the bottom surface of the PCB board is torn off by the film tearing clip. When the film tearing clip is flipped again through the steering cylinder, it opens and releases the taken-down film. At this time, the film falls to the material collection basket 11 below it and is collected.

[0039] When the PCB board turnover module 32 is conveyed below the PCB board pressing upper cavity frame 5, the height adjustment cylinder a51 operates and pushes the vacuum chamber 53 to sink. The auxiliary suction cylinder arranged inside the vacuum chamber 53 sinks synchronously, so that the bottom end of the vacuum chuck z connected to its bottom end contacts the upper surface of the workpiece. At this time, the vacuum chuck z sucks the workpiece under negative pressure. Then, the height adjustment cylinder a51 drives the vacuum chamber 53 to rise, and at this time, the bottom surface of the workpiece is separated from the upper surface of the PCB board turnover module 32.

[0040] Afterwards, the PCB board turnover module 32 slides towards the direction of the PCB board positioning module 31, and the lower cavity chamber 33 slides towards the bottom end of the PCB board pressing upper cavity frame 5 through the horizontal adjustment guide rail a331, so that the lower cavity chamber 33 is directly below the PCB board pressing upper cavity frame 5. Then, the height adjustment cylinder a51 continues to drive the vacuum chamber 53 to sink, so that the vacuum chamber 53 is in contact with the lower cavity chamber 33 and is sealed; The lower cavity chamber 33 is connected to an external vacuum negative pressure device through a pipeline. The vacuum negative pressure device evacuates the air between the lower cavity chamber 33 and the vacuum chamber 53, so that there is no air in the gap area between the double-sided tape and the PCB board. When the auxiliary suction cylinder drives the vacuum suction cup z and the workpiece to press down and sink, the workpiece is tightly placed on the lifting plate a332. When the vacuum suction cup b333 operates, the workpiece to be processed can be kept stable above it.

[0041] A heating plate can also be arranged below the lifting plate a332 and above the vacuum suction cup z. A heating resistance wire is arranged inside the heating plate. When the heating resistance wire is energized and operates, the heating plate is heated, and the heat is transferred to the lifting plate a332, the vacuum suction cup b333, and the vacuum suction cup z, and then transferred to the PCB board and the double-sided adhesive tape. A part of the contact surface between the double-sided tape and the PCB board is slightly melted under the action of high temperature, so that the contact surface maintains good adhesion. At the same time, the sealed environment formed by the lower cavity chamber 33 and the vacuum chamber 53 extracts air under the suction of the external vacuum negative pressure device, so that there are no air bubbles on the contact surface between the double-sided tape and the PCB board, further improving the bonding stability between the double-sided tape and the PCB board.

[0042] After the double-sided tape on the PCB board is stably bonded, the vacuum is released, and the vacuum chamber 53 is separated from the lower cavity chamber 33. The workpiece is placed on the upper surface of the vacuum suction cup b333. The slider c55 slides on the Y-axis lead screw module c54 and adjusts its position, so that the vacuum suction plate d58 is conveyed above the vacuum suction cup b333. When the Z-axis lead screw module c56 operates, it adjusts the height of the height adjustment cylinder c57. When the height adjustment cylinder c57 operates, it adjusts the height of the vacuum suction plate d58. When the vacuum suction plate d58 contacts the surface of the workpiece, it is in negative pressure contact with the vacuum suction cup b333, and the workpiece is sucked by negative pressure through the vacuum suction plate d58. The position of the vacuum suction plate d58 with the workpiece is synchronously adjusted by the displacement of the slider c55 on the Y-axis lead screw module c54.

[0043] When the vacuum suction plate d58 is transported above the PCB board lifting frame 71, the Z-axis lead screw module c56 cooperates with the height adjustment cylinder c57 to enable the vacuum suction plate d58 to place the workpiece on the vacuum suction plate e73 and / or the vacuum suction plate g74. The vacuum suction plates e73 and g74 suck the workpiece with vacuum to maintain a stable adsorption of the workpiece. In the design of the drawings of this technical solution, two Y-axis linear slide rail modules 3 are designed and disclosed. Therefore, the vacuum suction plate e73 and the vacuum suction plate g74 will be synchronously designed on the PCB board turnover guide rail 7 for receiving the processed workpieces, that is, the PCB boards with double-sided tape.

[0044] After the processed workpiece is placed above the PCB board lifting frame 71, the servo motor 72 runs and drives the PCB board lifting frame 71 to slide on the PCB board turnover guide rail 7 and transports the PCB board lifting frame 71 to the material feeding port 25, and the staff can take the processed workpiece from the material feeding port 25.

[0045] In this technical solution, a film tearing assembly for tearing the double-sided tape is also slidably provided on the positioning film tearing guide rail 6. When it is necessary to tear off the covering film on the double-sided tape during the processing; that is, after the double-sided tape is pressure-rolled by the rolling roller 414, the vacuum chuck c412 still tightly adsorbs the workpiece. The Z-axis lead screw module a41 drives the connecting frame 411 and the vacuum chuck c412 to displace, so that the vacuum chuck c412 is transported above the positioning film tearing guide rail 6. The driven slider 61 slides on the positioning film tearing guide rail 6 and makes the vacuum suction plate f62 directly above the vacuum chuck c412. The Z-axis lead screw module a41 drives the connecting frame 411 and the vacuum chuck c412 to sink, so that the PCB board with double-sided tape, that is, the workpiece, is placed on the vacuum suction plate f62.

[0046] Positioning push blocks f63 for positioning are also provided on both sides of the vacuum suction plate f62. The workpiece is placed on the vacuum suction plate f62 and fixed by vacuum adsorption. When the rotary cylinder b64 runs, it drives the bracket on the output shaft and the rotary rubber wheel 65 to rotate together, so that the rotary rubber wheel 65 contacts the upper surface of the double-sided tape. During this process, the pressing cylinder f66 can push its telescopic end to extend and simultaneously push the rotary rubber wheel 65 downward, so that the rotary rubber wheel 65 contacts the surface of the double-sided tape. During the operation of the rotary rubber wheel 65, it rotates to peel off the covering film of the double-sided tape, and the peeled-off covering film is blown into the waste collection basket 67 through the air blowing pipe provided inside the workbench 1 for collection.

[0047] After the covering film of the double-sided tape on the workpiece on the upper surface of the vacuum suction plate f62 is peeled off, it is continuously adsorbed by the vacuum chuck c412 and transferred and transported to the upper surface of the vacuum suction plate a314 to continue the above processing operations.

[0048] The above are only the preferred embodiments of the present invention and are not intended to further limit the present invention. All equivalent changes made by using the content of the specification and drawings of the present invention are within the protection scope of the present invention.

Claims

1. An apparatus for automatically attaching a double-sided adhesive tape and a PCB board, characterized in that: It comprises a workbench (1), wherein a plurality of Y-axis linear slide rail modules (3) are mounted on the upper surface of the workbench (1), and a PCB board positioning module (31) that can slide and move along the rails, a PCB board turnover module (32) and a lower cavity chamber (33) are slidably mounted on the Y-axis linear slide rail module (3); A lifting plate a (332) is provided in the lower cavity chamber (33), a vacuum suction cup b (333) is provided on the lifting plate a (332), and a double-sided adhesive loading rack (4) is also provided on the workbench (1) and is arranged perpendicular to the arrangement direction of the Y-axis linear guide rail module (3); A Z-axis screw module a (41) is horizontally laid and fixed on the double-sided adhesive material loading rack (4), and a height-adjustable double-sided adhesive rolling assembly is arranged on the Z-axis screw module a (41). A Y-axis screw module b (42) is horizontally laid and fixed on the surface of the double-sided adhesive material loading rack (4) on the side away from the Z-axis screw module a (41), and a material conveying assembly for loading the double-sided adhesive is connected to the Y-axis screw module b (42), and a material lifting assembly is arranged on the workbench (1) below the material conveying assembly; One side of the double-sided adhesive loading rack (4) is provided with a PCB board pressurized upper cavity rack (5) on the workbench (1), the inner side of the PCB board pressurized upper cavity rack (5) is connected to a height-adjustable vacuum chamber (53), one side of the PCB board pressurized upper cavity rack (5) is provided with a Y-axis screw module c (54) horizontally on the surface, and an auxiliary suction component is connected to the Y-axis screw module c (54); One side of the Y-axis linear slide rail module (3) is located on the upper surface of the workbench (1) and is also provided with a positioning film-tearing guide rail (6), on which a film-tearing assembly for tearing off the double-sided adhesive tape is slidably provided; A PCB board turnover guide rail (7) is also provided on one side of the positioning and film tearing guide rail (6) on the workbench (1), and a PCB board turnover assembly is provided on the PCB board turnover guide rail (7).

2. The device for automatically laminating double-sided tape and PCB board according to claim 1, characterized in that: The PCB board positioning module (31) comprises a sliding seat (311) slidably disposed on the Y-axis linear slide rail module (3); a rotating cylinder a (312) is connected to the top of the sliding seat (311); a supporting plate (313) is connected to the top of the rotating cylinder a (312); a vacuum suction plate a (314) is disposed at the top of the supporting plate (313); and a positioning push block a (315) is further disposed on the side of the vacuum suction plate a (314); The PCB board turnover module (32) is provided with an angle adjustment cylinder, a turning arm is sleeved on the rotating shaft of the angle adjustment cylinder, and a vacuum suction cup h is connected to the rotating arm; A horizontal adjustment guide rail a (331) is provided at the bottom end of the lower cavity chamber (33), and the sliding seat (311) is slidably arranged on the Y-axis linear slide rail module (3), and the lower cavity chamber (33) can slide and displace on the horizontal adjustment guide rail a (331) to adjust its position.

3. An apparatus for automatically bonding a double-sided adhesive tape and a PCB board according to claim 1, characterized in that: The double-sided adhesive tape rolling assembly comprises a connecting frame (411) which is sleeved on a Z-axis screw rod module a (41) and can slide and displace along a setting direction of the Z-axis screw rod module a (41); a vacuum suction cup c (412) for adsorbing a PCB with double-sided adhesive tape is arranged at the bottom end of the connecting frame (411); a rolling cylinder (413) is arranged at one end of the connecting frame (411); a rolling roller (414) is connected to the output shaft of the rolling cylinder (413); and an auxiliary downward-pressing vacuum plate (415) with adjustable height is also arranged at one end of the vacuum suction cup c (412).

4. The device for automatically laminating double-sided tape and PCB board according to claim 1, characterized in that: The material conveying assembly comprises a slider a (421) which is slidably engaged on a Y-axis screw module b (42), the slider a (421) being fixedly connected to a downward pressure cylinder a (422), a slider b (423) being connected to the output shaft of the downward pressure cylinder a (422) via a connecting block, a feeding cylinder (424) being connected to the output shaft of the slider b (423), and a double-sided adhesive suction block being provided on the output end of the feeding cylinder (424); The material lifting assembly comprises a material rack (425) fixed on a workbench (1), a lifting motor (428) is arranged below the material rack (425), a material lifting screw rod (427) is connected to the output shaft of the lifting motor (428), a lifting platform (426) which can slide and adjust the height is embedded on the inner side of the material rack (425), double-sided tape is placed on the lifting platform (426) for lifting, the bottom end of the lifting platform (426) is screwed and connected to the material lifting screw rod (427) through a connecting piece, and when the lifting motor (428) drives the material lifting screw rod (427) to rotate, the lifting platform (426) is driven to adjust the height, thereby making the double-sided tape on the lifting platform (426) contact the bottom surface of the double-sided tape suction block at the bottom end of the feeding cylinder (424).

5. The device for automatically laminating double-sided tape and PCB board according to claim 1, wherein: A plurality of protective covers (52) are embedded on the inner side of the PCB board pressurized upper cavity frame (5); the vacuum chamber (53) is embedded on the inner side of the protective cover (52) and can slide up and down; a height adjustment cylinder a (51) is provided on the protective cover (52) through a bracket; an output shaft of the height adjustment cylinder a (51) passes through the protective cover (52) and pushes the vacuum chamber (53) to move up and down; an auxiliary suction cylinder is also provided inside the vacuum chamber (53); a vacuum suction cup z is connected to the bottom end of the auxiliary suction cylinder; the end of the vacuum chamber (53) can contact the top of the lower cavity chamber (33) and complete the cavity sealing.

6. The device for automatically laminating double-sided tape and PCB board according to claim 1, characterized in that: The auxiliary suction component comprises a slider c (55) which can be slidably engaged on the Y-axis screw module c (54), the slider c (55) being vertically connected to the Z-axis screw module c (56), the slider of the Z-axis screw module c (56) being connected to a height adjustment cylinder c (57), and a vacuum suction plate d (58) being connected to the output end of the height adjustment cylinder c (57).

7. An apparatus for automatically laminating a double-sided adhesive tape and a PCB board according to claim 1, characterized in that: The film tearing assembly includes a driven slider (61) fitted on a positioning film tearing guide rail (6) and capable of sliding displacement along the positioning film tearing guide rail (6). A vacuum suction plate f (62) is fixedly arranged on the driven slider (61). A rotary cylinder b (64) is arranged on one side of the vacuum suction plate f (62) on the positioning film tearing guide rail (6). A rotary rubber wheel (65) is connected and arranged on the output shaft of the rotary cylinder b (64) through a bracket. A pressing cylinder f (66) is also arranged on the bracket. The rotary rubber wheel (65) is connected to the output shaft of the pressing cylinder f (66), and the rotary rubber wheel (65) can change its position under the push of the output shaft of the pressing cylinder f (66).

8. An apparatus for automatically laminating a double-sided adhesive tape and a PCB board according to claim 1, characterized in that: The PCB turnover assembly includes a PCB board lifting frame (71) fitted and arranged to slide on a PCB board turnover guide rail (7). A servo motor (72) is also arranged at one end of the PCB board turnover guide rail (7). The servo motor (72) drives the rotation of a lead screw inside the PCB board turnover guide rail (7). The bottom end of the PCB board lifting frame (71) is sleeved on the lead screw and is displaced by the rotation of the lead screw. Vacuum suction plates e (73) and vacuum suction plates g (74) are respectively arranged on the PCB board lifting frame (71). A number of protruding positioning blocks (75) for limiting the vacuum suction plates e (73) and vacuum suction plates g (74) are also fitted and penetrated through the PCB board lifting frame (71).

9. An apparatus for automatically attaching a double-sided adhesive tape and a PCB board according to claim 7, characterized in that: A number of Y-axis linear slide rail modules (3) are arranged on the workbench (1). A vacuum chamber (53) is arranged above each Y-axis linear slide rail module (3). A material collection basket (11) is fitted and arranged on one side of each Y-axis linear slide rail module (3) on the workbench (1). A waste collection basket (67) is fitted and arranged on the upper surface of the workbench (1) on one side of the vacuum suction plate f (62).

10. The device for automatically laminating double-sided tape and PCB board according to claim 1, characterized in that: A mask frame (2) is also arranged on the workbench (1). A number of dust removal fans (21) are fixedly arranged on the mask frame (2). A guide rail a (22) is also arranged on the mask frame (2) on one side of the dust removal fans (21). A sliding arm a (23) is slidably arranged on the guide rail a (22). A central control screen (24) is connected and arranged at the bottom end of the sliding arm a (23). A material feeding port (25) is also opened on the mask frame (2). Sealing doors (26) are arranged on the sides of the mask frame (2).

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