High-luminous-efficiency laminated packaging COB light source and manufacturing method thereof

Abstract

The invention discloses a high-luminous-efficiency laminated packaging COB light source and a manufacturing method thereof. Belongs to the technical field of COB light sources, and particularly relates to the technical field of high-luminous-efficiency COB light sources and manufacturing thereof. The technical problem that the 200lm / W lighting effect breakthrough of a 150W inverted COB light source cannot be realized by the existing traditional packaging process is solved. The high-luminous-efficiency laminated packaging COB light source comprises a PCB substrate, an LED light-emitting chip, a first packaging layer and a second packaging layer. The LED light-emitting chip is welded on the surface of the PCB substrate, the first packaging layer packages the LED light-emitting chip on the surface of the PCB substrate, and the second packaging layer is attached to the surface of the first packaging layer.

Description

Technical Field

[0001] The present invention belongs to the technical field of COB light sources, and particularly relates to the technical field of high luminous efficiency COB light sources and their manufacturing techniques. Background Art

[0002] Due to the problems of low yield and luminous efficiency of high-power flip-chip COB light sources, the large-scale application of flip-chip COB light sources in high-power lamps is restricted, becoming a technical bottleneck that urgently needs to be broken through at home and abroad. At present, the traditional packaging process cannot achieve a luminous efficiency breakthrough of 200 lm / W for 150W flip-chip COB light sources. The Chinese utility model patent application "Flip-chip COB Light Source Structure and Lamp", publication number: CN214890558U, improves the light-emitting effect by increasing the reflective structure of the LED unit. However, since the size of the flip-chip COB light source is in the millimeter range, the processing difficulty of the reflective structure is extremely high and the cost is extremely high, which cannot meet the market application. Summary of the Invention

[0003] In order to solve the technical problem that the existing traditional packaging process cannot achieve a luminous efficiency breakthrough of 200 lm / W for 150W flip-chip COB light sources, the present invention creatively proposes a high luminous efficiency laminated packaging COB light source based on the traditional process and its manufacturing method, which improves the light extraction efficiency on the premise of ensuring cost advantages.

[0004] The high luminous efficiency laminated packaging COB light source includes a PCB substrate, an LED light-emitting chip, a first packaging layer, and a second packaging layer; The LED light-emitting chip is welded to the surface of the PCB substrate. The first packaging layer encapsulates the LED light-emitting chip on the surface of the PCB substrate, and the second packaging layer is attached to the surface of the first packaging layer.

[0005] Further, the PCB substrate is made of aluminum material, coated with 85-93% high-reflection white oil, the thickness of the high-reflection white oil is greater than 25um, and the thermal conductivity of the high-reflection white oil is 2-8w.

[0006] Further, the LED light-emitting chip is a mini-LED flip-chip.

[0007] Further, the first packaging layer uses silicone rubber or epoxy resin as the packaging glue, and high refractive index doped nanoparticles and YAG phosphor are filled in the packaging glue. The doping concentration of the high refractive index doped nanoparticles is 0.3%-2.2% based on the mass of the packaging glue.

[0008] Further, the second packaging layer uses silicone rubber or epoxy resin as the packaging glue, and high refractive index doped nanoparticles and YAG phosphor are filled in the packaging glue. The doping concentration of the high refractive index doped nanoparticles is 0%-0.1% based on the mass of the packaging glue.

[0009] Further, the high refractive index doped nanoparticles include TiO2, SiO2, ZnO and silane.

[0010] Further, the number of the LED light emitting chips is determined according to specific requirements, and a plurality of LED light emitting chips are spliced into a specific shape according to the requirements.

[0011] The manufacturing method of the high luminous efficiency laminated package COB light source includes the following steps: S71. Fabricate an aluminum PCB substrate (1) coated with high-reflection white oil; S72. Print solder paste at the pad positions on the substrate surface, transfer the LED light emitting chips (2) to the solder paste surface by the chip transfer method, splice a plurality of LED light emitting chips (2) into a specific shape according to the requirements to form a light emitting area; bond the LED light emitting chips (2) to the pad surface by the nitrogen reflow method; S73. Mix silicone rubber or epoxy resin with YAG phosphor, after vacuum degassing, mix with high refractive index doped nanoparticles, stir and vacuum degas; according to this method, prepare the adhesives required for the first encapsulation layer (3) and the second encapsulation layer (4); S74. Coat a circle of sealing adhesive around the light emitting area at a fixed height, and the fixed height is the sum of the thicknesses of the first encapsulation layer (3) and the second encapsulation layer (4); S75. After the sealing adhesive is cured, pour the adhesive of the first encapsulation layer (3) into the cured area of the sealing adhesive, cure the adhesive of the first encapsulation layer (3) by heating, continue to pour the adhesive of the second encapsulation layer (4) into the remaining cured area of the sealing adhesive, and cure the adhesive of the second encapsulation layer (4) by heating.

[0012] The beneficial effects of the present invention are as follows: By designing the gradient refractive index fluorescent material lamination method and structure, total reflection at the interfaces between the LED chip layer, the fluorescent layer and the air layer is suppressed, so that more photons escape from the device, improving the light extraction efficiency and thermal reliability performance of the device. The gradient refractive index gradient encapsulation laminated structure is adopted, with the first layer using high refractive index doped nanoparticles with a doping concentration of 0.3% - 2.2%, and the second layer with a doping concentration of 0% - 0.1%. Through this structural design, the maximum luminous efficiency of the device can reach 200 lm / W, achieving a breakthrough in the prior art. Description of the Drawings

[0013] Figure 1 It is a structural diagram of the high luminous efficiency laminated package COB light source in an embodiment of the present invention. Detailed Embodiments

[0014] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the protection scope of the present invention.

[0015] Embodiment 1, The present invention provides a high luminous efficiency laminated packaged COB light source, as Figure 1 shown, the high luminous efficiency laminated packaged COB light source includes a PCB substrate 1, an LED light emitting chip 2, a first encapsulation layer 3 and a second encapsulation layer 4; The LED light emitting chip 2 is soldered on the surface of the PCB substrate 1. The first encapsulation layer 3 encapsulates the LED light emitting chip 2 on the surface of the PCB substrate 1, and the second encapsulation layer 4 adheres to the surface of the first encapsulation layer 3.

[0016] The PCB substrate 1 is made of aluminum material with a thermal conductivity of 1.0 - 4.0, and the dimensions are 48mm * 38mm, 42mm * 30mm, 40mm * 46mm, 28mm * 23mm. The light emitting surface is circular, square or irregular; it is coated with 85 - 93% high reflection white oil, the thickness of the high reflection white oil is greater than 25um, and the thermal conductivity of the high reflection white oil is 2 - 8w.

[0017] The LED light emitting chip 2 is a mini-LED flip chip with dimensions of (0.1mm - 2.0mm) * (0.1mm - 2.0mm), the light source color temperature is 2200K - 6500K, the color rendering index Ra is greater than 70, and the color tolerance SDCM ≤ 7.

[0018] The first encapsulation layer 3 uses silicone rubber or epoxy resin as the encapsulation glue, the thickness of the encapsulation layer is 0.1mm - 4.0mm, and high refractive index doped nanoparticles and YAG phosphor are filled in the encapsulation glue. The doping concentration of the high refractive index doped nanoparticles is 0.3% - 2.2% based on the mass of the encapsulation glue.

[0019] The second encapsulation layer 4 uses silicone rubber or epoxy resin as the encapsulation glue, the thickness of the encapsulation layer is 0.1mm - 4.0mm, and high refractive index doped nanoparticles and YAG phosphor are filled in the encapsulation glue. The doping concentration of the high refractive index doped nanoparticles is 0% - 0.1% based on the mass of the encapsulation glue.

[0020] The high refractive index doped nanoparticles include TiO2, SiO2, ZnO and silane. The number of the LED light emitting chips 2 is determined according to specific requirements, and several LED light emitting chips 2 are spliced into a specific shape according to the requirements.

[0021] Embodiment 2, This embodiment further limits Embodiment 1 and provides a high-light-efficiency laminated packaged COB light source with specific parameters. When the maximum light efficiency of the high-light-efficiency laminated packaged COB light source reaches 200 lm / W, the parameters of each component are as follows: The PCB substrate 1 is made of aluminum material with a thermal conductivity of 2.0, a size of 48*38 mm, and a circular light-emitting surface; 92% high-reflection white oil is coated, the thickness of the high-reflection white oil is 30 um, and the thermal conductivity of the high-reflection white oil is 5 w.

[0022] The LED light-emitting chip 2 is a mini-LED flip-chip with a size of 13*30 mil. The light source color temperature of the LED light-emitting chip 2 is 4000K, the color rendering index Ra is 71, and the color tolerance SDCM ≤ 7.

[0023] The first encapsulation layer 3 uses silicone rubber as the encapsulation glue. The refractive index of the silicone rubber is 1.41, and the mixed viscosity is 3800 CP. High-refractive-index doped nanoparticles TiO2 and YAG phosphor are filled in the encapsulation glue. The doping concentration of the high-refractive-index doped nanoparticles is 0.45%. Based on the mass of the encapsulation glue, the thickness of the first encapsulation layer 3 is 0.75 mm.

[0024] The second encapsulation layer 4 uses silicone rubber as the encapsulation glue. The refractive index of the silicone rubber is 1.41, and the mixed viscosity is 4300 CP. High-refractive-index doped nanoparticles TiO2 and YAG phosphor are filled in the encapsulation glue. The doping concentration of the high-refractive-index doped nanoparticles is 0.05%. Based on the mass of the encapsulation glue, the thickness of the second encapsulation layer 4 is 1.0 mm.

Claims

1. A high luminous efficiency laminated package COB light source, characterized in that, The high luminous efficiency laminated package COB light source includes a PCB substrate (1), an LED light-emitting chip (2), a first package layer (3), and a second package layer (4). The LED light-emitting chip (2) is soldered on the surface of the PCB substrate (1). The first package layer (3) packages the LED light-emitting chip (2) on the surface of the PCB substrate (1), and the second package layer (4) adheres to the surface of the first package layer (3).

2. The high luminous efficiency laminated package COB light source according to claim 1, characterized in that The PCB substrate (1) is made of aluminum material, coated with 85 - 93% high-reflection white oil. The thickness of the high-reflection white oil is greater than 25um, and the thermal conductivity of the high-reflection white oil is 2 - 8w.

3. The high-light-efficiency laminated packaged COB light source according to claim 2, wherein The LED light-emitting chip (2) is a mini-LED flip chip.

4. The high luminous efficiency laminated packaged COB light source according to claim 3, characterized in that The first package layer (3) uses silicone rubber or epoxy resin as the encapsulation glue. High refractive index doped nanoparticles and YAG phosphor are filled in the encapsulation glue. The doping concentration of the high refractive index doped nanoparticles is 0.3% - 2.2% based on the mass of the encapsulation glue.

5. The high luminous efficiency laminated packaged COB light source according to claim 4, characterized in that, The second package layer (4) uses silicone rubber or epoxy resin as the encapsulation glue. High refractive index doped nanoparticles and YAG phosphor are filled in the encapsulation glue. The doping concentration of the high refractive index doped nanoparticles is 0% - 0.1% based on the mass of the encapsulation glue.

6. The high-light-efficiency laminated packaged COB light source according to claim 5, characterized in that, The high refractive index doped nanoparticles include TiO2, SiO2, ZnO, and silane.

7. The high-light-efficiency laminated packaged COB light source according to claim 6, characterized in that, The number of the LED light-emitting chips (2) is determined according to specific requirements, and several LED light-emitting chips (2) are spliced into a specific shape according to the requirements.

8. A method for preparing a high - light - efficiency laminated packaged COB light source as described in any one of claims 1 - 7, characterized in that, The method includes the following steps: S71. Make an aluminum PCB substrate (1) coated with high-reflection white oil. S72. Print solder paste at the pad position on the surface of the substrate. Transfer the LED light-emitting chip (2) to the surface of the solder paste by the chip transfer method. Splice several LED light-emitting chips (2) into a specific shape according to the requirements to form a light-emitting area. Bond the LED light-emitting chip (2) to the surface of the pad by the nitrogen reflow method. S73. Mix silicone rubber or epoxy resin with YAG phosphor, vacuum degas, then mix with high refractive index doped nanoparticles, stir and vacuum degas. Make the glue required for the first package layer (3) and the second package layer (4) according to this method. S74. Coat a circle of sealing glue around the light-emitting area at a fixed height, and the fixed height is the sum of the thicknesses of the first package layer (3) and the second package layer (4). S75. After the sealing glue is cured, pour the glue of the first package layer (3) into the cured area of the sealing glue, cure the glue of the first package layer (3) by heating. Then continue to pour the glue of the second package layer (4) into the remaining cured area of the sealing glue, and cure the glue of the second package layer (4) by heating.

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