Intelligent detection system for semiconductor integrated circuit shell

Abstract

The invention relates to the technical field of semiconductor chip packaging shell intelligent detection equipment, in particular to an intelligent detection system for a semiconductor integrated circuit shell, which comprises an automatic loading and unloading device, a positioning camera, a material taking device, a manipulator, an appearance detection camera, a conveyor belt, a shell, a cross-shaped sliding table and a controller, according to the automatic feeding and discharging device, the clip bin in the automatic feeding and discharging device is improved, after chips are loaded into the clip bin, the chips can be immediately matched with the upper clamping head and the lower clamping head to be fixedly supported, so that the chips are loaded in the clip bin in a suspended mode, the chips do not make contact with a material carrying plate, and even in the input and output process, the chips cannot be damaged. When the chip is input and output, the chip does not have any friction process, so that a packaging shell of the chip is always in an optimal state, and in each chip input and output process, the chip is subjected to one-time air sweeping treatment through the work of the dust removal air bag, so that the chip is prevented from being positioned in the clip stock bin for a long time, and impurity adhesion on the surface layer of the chip is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent detection equipment for semiconductor chip packaging housings, and particularly to an intelligent detection system for semiconductor integrated circuit housings. Background Art

[0002] A chip packaging housing is a housing used to protect and package integrated circuit chips. It can provide functions such as mechanical protection, thermal management, and electromagnetic shielding, and can also provide leads or pads for connection with other electronic components.

[0003] After the chip is encapsulated in the housing, it is necessary to detect the encapsulated chip housing. Among them, the detection contents include pin connectivity detection, packaging housing integrity detection, size and geometric shape detection, welding quality detection, temperature cycle test, electromagnetic shielding performance test of the packaging housing, etc. The main reason is to ensure the quality and reliability of the encapsulation.

[0004] When performing packaging housing integrity detection and size and geometric shape detection, at first, workers manually detected each chip housing through detection equipment one by one. In recent years, automatic detection equipment has also been developed. The principle of the automatic detection equipment is to achieve machine vision replacing manual vision detection through visual detection combined with intelligent control. Since the consistency of machine vision is much higher than that of manual vision detection, the automatic detection equipment has also developed rapidly in the semiconductor industry.

[0005] The applicant previously applied for a patent for invention with the application number 2023104511452 on April 25, 2023. This patent specifically discloses an AI detection system for packaging housings, including an automatic loading and unloading device, a positioning camera, a pick-up device, a manipulator, an appearance detection camera, a conveyor belt, a chassis, a cross slide, and a controller. The conveyor belt is horizontally arranged, and automatic loading and unloading devices capable of transferring the chip magazine to the upper in-place position A and the upper in-place position B are respectively provided near the feeding end and the discharging end. The positioning camera takes real-time pictures of the upper in-place position A. Appearance detection cameras are respectively provided between the conveyor belt and the upper in-place position A and above the middle part of the conveyor belt, and the shooting directions are opposite up and down. The appearance detection camera located above the middle part of the conveyor belt can be driven by the cross slide to move vertically to adjust the height or move perpendicular to the conveying direction of the conveyor belt. Manipulators equipped with pick-up devices are respectively provided in cooperation between the conveyor belt and the two groups of automatic loading and unloading devices. The overall operation is in a flow-through manner, which can effectively improve work efficiency and is not easy to pollute or damage the chips.

[0006] However, according to the applicant's description, when using an automatic loading and unloading device to automatically output and input and load the packaged chips, due to the need for repeated input and output, and for the appearance inspection of the chip housing, the chips are repeatedly transferred and grasped, which is bound to cause friction between the chips and the magazine bin, resulting in inevitable wear and scratches on the packaging housing, and will also cause the chip packaging housing to be contaminated with dust in the air. Summary of the Invention

[0007] In view of the above problems, the present invention provides an intelligent detection system for semiconductor integrated circuit housings. By improving the magazine bin in the automatic loading and unloading device, after the chips are loaded into the magazine bin, they will immediately be fixed and supported by the cooperation of the upper clamping head and the lower clamping head, so that the chips are suspended and loaded in the magazine bin, and there is no contact between the chips and the loading plate. Even during the input and output process, the chips will not experience any friction process, so that the packaging housing of the chips is always in the best state. And during each input and output of the chips, a gas sweeping process will be performed on the chips through the operation of the dust removal airbag, avoiding the adhesion of impurities on the surface layer of the chips due to the long-term placement of the chips in the magazine bin.

[0008] To achieve the above object, the present invention provides the following technical solutions: An intelligent detection system for semiconductor integrated circuit housings, including an automatic loading and unloading device, a positioning camera, a pick-up device, a manipulator, an appearance inspection camera, a conveyor belt, a machine shell, a cross slide, and a controller. A fresh air blower is installed in the machine shell, and it is characterized in that: The automatic loading and unloading device includes a storage mechanism and a feeding mechanism. The storage mechanism includes a support base and a magazine bin. The magazine bin is provided with an opening on the side facing the feeding mechanism, and a number of horizontally arranged loading units are arranged in the magazine bin from top to bottom. The loading unit includes a loading plate, an upper clamping head, and a lower clamping head. A number of notches for the lower clamping head to pass through are opened on the loading plate. The upper clamping head and the lower clamping head are respectively arranged above and below the loading plate, and the upper clamping head and the lower clamping head cooperate to clamp and fix the semiconductor chips loaded on the loading plate; The clamping ends of the upper clamping head and the lower clamping head are both flexibly arranged. A dust removal airbag is arranged between the upper clamping head and the lower clamping head in adjacent loading units. The dust removal airbag expands and contracts under the drive of the upper clamping head and the lower clamping head to perform dust removal on the housing of the semiconductor chips. As an improvement, the clamping ends are both arranged in a clamping airbag structure.

[0009] As an improvement, the airbag at the clamping end is communicated with the dust removal airbag, and a one-way valve is directly arranged between the clamping end and the dust removal airbag.

[0010] As an improvement, a plurality of air jet holes are formed in the side wall of the dust removal air bag facing the semiconductor chip.

[0011] As an improvement, a set of upper clamping heads and lower clamping heads are arranged opposite to each other, and both the upper clamping heads and the lower clamping heads are located at the midline position driven by the semiconductor chip.

[0012] As an improvement, two sets of upper clamping heads and lower clamping heads are arranged opposite to each other, and both the upper clamping heads and the lower clamping heads are symmetrically arranged at both ends of the semiconductor chip.

[0013] As an improvement, the upper clamping heads and the lower clamping heads are evenly installed on corresponding clamping head mounting plates, and the clamping head mounting plates are driven to move up and down by corresponding electric push rods, and the electric push rods are installed at the bottom of the cartridge magazine.

[0014] As an improvement, vertical sealing plates are arranged at the parts of the clamping head mounting plates located at the openings of the cartridge magazines.

[0015] As an improvement, sliding grooves are arranged on both side walls of the cartridge magazine, and the loading plates are inserted and installed in the sliding grooves.

[0016] As an improvement, the feeding mechanism includes a transverse driving module, a module support frame, a longitudinal driving module and a tray, and a strip-shaped opening corresponding to the notch is formed in the tray.

[0017] The beneficial effects of the present invention are as follows: (1) By improving the cartridge magazine in the automatic loading and unloading device, after the chip is loaded into the cartridge magazine, it will be immediately fixed and supported by the cooperation of the upper clamping head and the lower clamping head, so that the chip is suspended and loaded in the cartridge magazine, and the chip does not contact the loading plate. Even during the input and output processes, the chip will not experience any friction, so that the encapsulation shell of the chip is always in the best state. (2) In the present invention, during each process of inputting and outputting the chip, the dust removal air bag will be driven to work through the cooperation of the upper clamping head and the lower clamping head, and the air will be blown out by the expansion and contraction of the dust removal air bag to perform air sweeping treatment on the chip again and again, so as to avoid impurities adhering to the surface layer of the chip located in the cartridge magazine. (3) By arranging the clamping head mounting plates in the present invention, vertical sealing plates are arranged at the parts of the clamping head mounting plates located at the openings of the cartridge magazines. When the upper clamping head and the lower clamping head cooperate to clamp the chip, the sealing plates will close, and together with the clamping head mounting plates and the side walls of the cartridge magazine, a set of storage spaces will be formed around the chip to protect the chip.

[0018] In summary, the present invention has the advantages of automatic detection, stable structure, good protection for the chip, and wear avoidance, and is particularly suitable for the technical field of chip packaging shell detection structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structure schematic diagram of the first embodiment of the present invention; Figure 2 It is a three-dimensional structure schematic diagram of the automatic loading and unloading device of the first embodiment of the present invention; Figure 3 It is a three-dimensional structure schematic diagram of the feeding mechanism of the first embodiment of the present invention; Figure 4 It is a three-dimensional structure schematic diagram of the tray of the first embodiment of the present invention; Figure 5 It is a three-dimensional structure schematic diagram of the magazine bin of the first embodiment of the present invention Figure 1 ; Figure 6 It is a three-dimensional structure schematic diagram of the loading unit of the first embodiment of the present invention Figure 1 ; Figure 7 It is a three-dimensional structure schematic diagram of the magazine bin of the first embodiment of the present invention Figure 2 ; Figure 8 It is a three-dimensional structure schematic diagram of the magazine bin of the first embodiment of the present invention Figure 3 ; Figure 9 It is a three-dimensional structure schematic diagram of the upper clamping head of the first embodiment of the present invention; Figure 10 It is a three-dimensional structure schematic diagram of the loading plate of the first embodiment of the present invention; Figure 11 It is a three-dimensional structure schematic diagram of the loading unit of the first embodiment of the present invention Figure 2 ; Figure 12 It is a schematic diagram of the clamping end structure of the second embodiment of the present invention; Figure 13 It is a side view structure schematic diagram of the loading unit of the third embodiment of the present invention; Figure 14 It is a side view structure schematic diagram of the loading unit of the fourth embodiment of the present invention; Figure 15 It is a three-dimensional structure schematic diagram of the loading plate of the fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0022] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0023] Embodiment 1: As Figures 1 to 11 shown, an intelligent detection system for a semiconductor integrated circuit housing includes an automatic loading and unloading device 1, a positioning camera 2, a pick-up device 3, a manipulator 4, an appearance detection camera 5, a conveyor belt 6, a housing 7, a cross slide 8, and a controller. A fresh air blower 9 is installed in the housing 7. Among them, the specific structures, installation methods, and functional uses of the automatic loading and unloading device 1, the positioning camera 2, the pick-up device 3, the manipulator 4, the appearance detection camera 5, the conveyor belt 6, the housing 7, the cross slide 8, the controller, and the fresh air blower 9 have been described in detail and clearly in the patent application with the application number 2023104511452 of the invention previously applied by the applicant, and will not be elaborated here. This application mainly focuses on the differences between the automatic loading and unloading device 1 and the previously applied patent. The automatic loading and unloading device 1 of the present application includes a storage mechanism 11 and a feeding mechanism 12. The storage mechanism 11 includes a support base 111 and a magazine bin 112. The side of the magazine bin 112 facing the feeding mechanism 12 is provided with an opening. A number of horizontally arranged loading units 113 are arranged in the magazine bin 112 from top to bottom. The loading unit 113 includes a loading plate 1331, an upper clamping head 1132 and a lower clamping head 1133. A number of notches 1134 for the lower clamping head 1133 to pass through are formed on the loading plate 1331. The upper clamping head 1132 and the lower clamping head 1133 are respectively arranged above and below the loading plate 1331. The upper clamping head 1132 and the lower clamping head 1133 are evenly installed on the corresponding clamping mounting plates 1137. The clamping mounting plates 1137 are driven to move up and down by the corresponding electric push rods 1138, and the clamping mounting plates 1137 are guided and supported by guide rods. The electric push rods 1138 are all installed at the bottom of the magazine bin 112. The electric push rods 1138 are powered by a battery pack, and a control switch is also provided. The control switch can control the independent movement of the upper clamping head 1132 and the lower clamping head 1133, or can control the simultaneous movement. The upper clamping head 1132 and the lower clamping head 1133 cooperate to clamp and fix the semiconductor chip 10 loaded on the loading plate 1331; Wherein, sliding grooves 1121 are provided on both side walls of the magazine bin 112 for inserting and installing the loading plate 1331. When there is a misoperation, the lower clamping head 1133 descends, and the loading plate 1131 is used to support the semiconductor chip 10; The clamping ends 1135 of the upper clamping head 1132 and the lower clamping head 1133 are both flexibly arranged. A dust removal airbag 1130 is arranged between the upper clamping head 1132 and the lower clamping head 1133 in adjacent loading units 113. In addition, dust removal airbags 1130 are also arranged between the top plate of the magazine bin and the upper clamping head 1132, and between the bottom plate of the magazine bin and the lower clamping head 1133. A number of air injection holes 1136 are formed on the side wall of the dust removal airbag 1130 facing the semiconductor chip 10. The dust removal airbag 1130 is driven by the upper clamping head 1132 and the lower clamping head 1133 to expand and contract, so as to perform dust removal on the outer shell of the semiconductor chip 10. The above-mentioned electric push rod 1138 is purchased from Thomson, preferably a DC electric push rod. The battery pack is a lithium battery pack, purchased from EVE Energy Co., Ltd. The control switch is purchased from CHINT Electric Co., Ltd.

[0024] Among them, the clamping ends 1135 are all arranged as clamping airbag structures. When the upper clamping head 1132 and the lower clamping head 1133 clamp the chip to form a suspended setting, due to extrusion, the clamping ends 1135 will deform by themselves, ensuring that while the clamping ends 1135 clamp the chip, they will not rigidly squeeze and damage the packaging shell of the chip.

[0025] It should be noted that the difference between this application and the prior invention patent is that this application has made an innovative improvement in the magazine 112, ensuring that the packaging shell of the chip will not have friction scratches and wear whether it is input again, output, or during transportation after being input into the magazine 112.

[0026] Specifically, the existing packaging shell materials of chips are mostly plastic materials, ceramic materials, metal materials, glass materials, and composite materials formed by the first four materials, such as plastic / metal composite materials, ceramic / metal composite materials, etc. No matter which of the above packaging materials, after repeated grasping and transferring, scratches will be formed on the surface of the packaging shell, and even breakage will occur. Especially when the chip is stored in the magazine and transferred with the magazine or output from the magazine, scratches will be caused on the packaging shell of the chip. For the packaging shells of some ceramic materials, shell breakage will also occur due to collision factors.

[0027] In this application, after the chip is input into the magazine, the lower clamping head 1133 below the chip lifts to carry the chip, so that the chip does not contact the carrier plate 1331. And the clamping end 1135 of the carrier plate 1331 is arranged as a flexible airbag structure, which will not cause any scratches on the chip surface at all. Then the upper clamping head 1132 above the new product descends and cooperates with the lower clamping head 1133 to just clamp and fix the chip, and the structure of the clamping end will not cause any extrusion damage to the chip, that is, it ensures the clamping and storage of the chip and also ensures the protection of the chip shell.

[0028] In addition, during the chip production process, although it is in a dust-free processing environment, the hair, dust, etc. of the processing personnel will still enter the processing environment with the air. Even through various dust removal methods, there will still be some impurities and dust attached to the packaging shell of the chip, resulting in a reduction in the yield rate of the chip. Therefore, in order to ensure the cleanliness of the chip, in this application, every time the chip is input into and taken out of the magazine, the dust removal airbag 1130 will be inflated or compressed to form an air flow on the chip to perform gas cleaning on the chip.

[0029] Correspondingly, the feeding mechanism 12 includes a lateral driving module 121, a module support frame 122, a longitudinal driving module 123, and a tray 124. A strip-shaped opening 1241 corresponding to the notch 1134 is formed on the tray 124.

[0030] It should be noted that when the tray 124 drives the semiconductor chip 10 to move above the loading plate 1331, the upper clamping head 1132 will lift, and the semiconductor chip 10 will pass through the strip-shaped opening 1241 and be lifted away from the tray 124. Then the tray 124 is output from the magazine 112.

[0031] Embodiment 2: Referring to Embodiment 1, the difference between this embodiment and Embodiment 1 is as follows: As Figure 12 shown, the airbag at the clamping end 1135 is communicated with the dust removal airbag 1130, and a one-way valve is directly arranged between the clamping end 1135 and the dust removal airbag 1130.

[0032] Here, it should be noted that the clamping end 1135 is arranged in an airbag structure. During the repeated use process, the gas in the airbag will gradually leak, causing the clamping end 1135 to lose its flexible function. During the process of the airbag expanding and contracting and discharging gas each time, a part of the gas in the airbag will enter the dust removal airbag 1130 through the one-way valve, ensuring the gas fullness of the clamping end 1135 and enabling the clamping end 1135 to maintain a long working state.

[0033] Embodiment 3: Referring to Embodiment 1, the difference between this embodiment and Embodiment 1 is as follows: As Figure 13 shown, a group of the upper clamping head 1132 and the lower clamping head 1133 are arranged opposite to each other, and both the upper clamping head 1132 and the lower clamping head 1133 are located at the center line position driven by the semiconductor chip 10.

[0034] It should be noted that only one group of the upper clamping head 1132 and the lower clamping head 1133 is provided, just clamping the center line position of the semiconductor chip 10, so that the semiconductor chip 10 is just in a clamped state.

[0035] Embodiment 4: Referring to Embodiment 3, the difference between this embodiment and Embodiment 3 is as follows: As Figure 14 shown, two groups of the upper clamping head 1132 and the lower clamping head 1133 are arranged opposite to each other, and both the upper clamping head 1132 and the lower clamping head 1133 are symmetrically arranged at both ends of the semiconductor chip 10.

[0036] It should be noted that when two sets of the upper material clamping head 1132 and the lower material clamping head 1133 are provided, one set just clamps one end of the semiconductor chip 10, and the other set clamps the other end of the semiconductor chip 10. The two ends of the semiconductor chip 10 are clamped, which just ensures the stability of the semiconductor chip 10. Moreover, since the two ends of the semiconductor chip 10 are clamped, it can be ensured that the semiconductor chip 10 will not move wrongly.

[0037] Embodiment 5: Referring to Embodiment 1, the difference between this embodiment and Embodiment 1 is as follows: As Figure 15 shown, vertical sealing plates 1139 are provided at the parts of the material clamping mounting plate 1137 located at the opening of the magazine 112.

[0038] It should be noted that when the upper material clamping head 1132 and the lower material clamping head 1133 just complete the clamping of the semiconductor chip 10, the sealing plates 1139 on the material clamping mounting plate 1137 also just close. Moreover, the sealing plates 1139 cooperate with the material clamping mounting plate 1137 and the side walls of the magazine 112 to complete the sealing of the semiconductor chip 10, forming a sealed storage space, effectively ensuring the cleanliness of the semiconductor chip 10 and improving the yield rate of the semiconductor chip 10.

[0039] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An intelligent detection system for a semiconductor integrated circuit housing, comprising an automatic loading and unloading device (1), a positioning camera (2), a pick-up device (3), a manipulator (4), an appearance detection camera (5), a conveyor belt (6), a housing (7), a cross slide (8) and a controller. A fresh air blower (9) is installed in the housing (7). It is characterized in that: The automatic loading and unloading device (1) includes a storage mechanism (11) and a feeding mechanism (12). The storage mechanism (11) includes a support base (111) and a magazine bin (112). The magazine bin (112) is provided with an opening on the side facing the feeding mechanism (12). A number of horizontally arranged loading units (113) are arranged in the magazine bin (112) from top to bottom. The loading unit (113) includes a loading plate (1331), an upper clamping head (1132) and a lower clamping head (1133). A number of notches (1134) for the lower clamping head (1133) to pass through are formed on the loading plate (1331). The upper clamping head (1132) and the lower clamping head (1133) are respectively arranged above and below the loading plate (1331). The upper clamping head (1132) and the lower clamping head (1133) cooperate to clamp and fix the semiconductor chip (10) loaded on the loading plate (1331); The clamping ends (1135) of the upper clamping head (1132) and the lower clamping head (1133) are both flexibly arranged. A dust removal air bag (1130) is arranged between the upper clamping head (1132) and the lower clamping head (1133) in adjacent loading units (113). The dust removal air bag (1130) is driven by the upper clamping head (1132) and the lower clamping head (1133) to expand and contract, so as to perform dust removal on the housing of the semiconductor chip (10).

2. The intelligent detection system for a semiconductor integrated circuit housing according to claim 1, characterized in that: The clamping ends (1135) are both arranged in a clamping air bag structure.

3. The intelligent detection system for a semiconductor integrated circuit housing according to claim 2, characterized in that: The air bag of the clamping end (1135) is communicated with the dust removal air bag (1130), and a one-way valve is directly arranged between the clamping end (1135) and the dust removal air bag (1130).

4. The intelligent detection system for a semiconductor integrated circuit housing according to claim 1, characterized in that: A number of air injection holes (1136) are formed on the side wall of the dust removal air bag (1130) facing the semiconductor chip (10).

5. The intelligent detection system for a semiconductor integrated circuit housing according to claim 1, characterized in that: A set of the upper clamping head (1132) and the lower clamping head (1133) are both arranged in a facing arrangement, and the upper clamping head (1132) and the lower clamping head (1133) are both located at the midline position driven by the semiconductor chip (10).

6. The intelligent detection system for a semiconductor integrated circuit housing according to claim 1, wherein: Two groups of the upper clamping heads (1132) and the lower clamping heads (1133) are arranged opposite to each other, and the upper clamping heads (1132) and the lower clamping heads (1133) are symmetrically arranged at both ends of the semiconductor chip (10).

7. The intelligent detection system for a semiconductor integrated circuit housing according to claim 5 or 6, wherein: The upper clamping heads (1132) and the lower clamping heads (1133) are evenly installed on the corresponding clamping mounting plates (1137), and the clamping mounting plates (1137) are driven to move up and down by the corresponding electric push rods (1138), and the electric push rods (1138) are installed at the bottom of the magazine (112).

8. The intelligent detection system for a semiconductor integrated circuit housing according to claim 7, wherein: Vertical sealing plates (1139) are provided at the parts of the clamping mounting plates (1137) located at the opening of the magazine (112).

9. The intelligent detection system for a semiconductor integrated circuit housing according to claim 1, wherein: Sliding grooves (1121) are provided on both side walls of the magazine (112), and the sliding grooves (1121) are used for inserting and installing the loading plate (1331).

10. The intelligent detection system for a semiconductor integrated circuit housing according to claim 1, wherein: The feeding mechanism (12) includes a transverse driving module (121), a module support frame (122), a longitudinal driving module (123) and a tray (124), and a strip-shaped opening (1241) corresponding to the notch (1134) is formed in the tray (124).

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