Wiring circuit board

Abstract

The invention provides a printed circuit board. A wired circuit board (1) is provided with: a plurality of wiring sections (3A, 3B); a first support section (2A) that supports one end of each of the wiring sections (3A, 3B); and a second support section (2B) that supports the other end of each of the wiring sections (3A, 3B). The wiring sections (3A, 3B) each have a wiring (133). The wiring (133) has: a first portion (1331) connected to the first support section (2A); a second portion (1332) connected to the second support portion (2B); and a main body portion (1333) disposed between the first portion (1331) and the second portion (1332). The first portion (1331) and the second portion (1332) are thinner than the main body portion (1333).

Description

Technical Field

[0001] The present invention relates to a wiring circuit board. Background Art

[0002] Conventionally, a wiring circuit board having a plurality of wiring portions arranged at intervals from each other and a connecting portion connecting the plurality of wiring portions has been known (for example, refer to Patent Document 1 below).

[0003] In this wiring circuit board, the thickness of the wiring portion is relatively large (more than twice) with respect to the width of the wiring portion. Therefore, the wiring portion can move more easily in the width direction than in the thickness direction.

[0004] Prior art documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2019-212656 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In a wiring circuit board as described in Patent Document 1, when the wiring portion moves, there is a possibility that stress concentrates near the end portion (the portion connected to the connecting portion) of the wiring portion. Therefore, there is a possibility that cracks are generated in the wiring near the end portion of the wiring portion.

[0009] The present invention provides a wiring circuit board capable of suppressing the generation of cracks in the wiring near the end portion of the wiring portion.

[0010] Means for Solving the Problems

[0011] The present invention [1] includes a wiring circuit board, wherein the wiring circuit board includes: a plurality of wiring portions extending in a first direction and arranged at intervals from each other; and a first support portion supporting one end portion of each of the plurality of wiring portions in the first direction, each of the plurality of wiring portions having a wiring extending in the first direction, the wiring having: a main body portion disposed apart from the first support portion in the first direction; and a first portion disposed between the first support portion and the main body portion in the first direction and connected to the first support portion, the first portion being thinner than the main body portion.

[0012] According to such a structure, the first portion of the wiring of the wiring portion connected to the first support portion is thinner than the main body portion.

[0013] Therefore, when the wiring portion moves, stress concentration near one end portion of the wiring portion can be suppressed from occurring in the wiring. In other words, the stress of the wiring disposed near one end portion of the wiring portion can be alleviated.

[0014] As a result, generation of cracks in the wiring near one end portion of the wiring portion can be suppressed.

[0015] In the wiring circuit board of the present invention [2] based on the above [1], each of the plurality of the wiring portions has a plurality of the wirings, and in all of the wirings, the first portion is thinner than the main body portion.

[0016] According to such a structure, generation of cracks in the first portion can be suppressed in all of the wirings.

[0017] In the wiring circuit board of the present invention [3] based on the above [1] or [2], the wiring has: a first conductor layer; and a second conductor layer disposed on the first conductor layer, and the first conductor layer of the first portion is thinner than the first conductor layer of the main body portion.

[0018] According to such a structure, generation of cracks in the first conductor layer of the first portion can be suppressed.

[0019] In the wiring circuit board of the present invention [4] based on the above [1] or [2], the wiring has: a first conductor layer; and a second conductor layer disposed on the first conductor layer, and the second conductor layer of the first portion is thinner than the second conductor layer of the main body portion.

[0020] According to such a structure, generation of cracks in the second conductor layer of the first portion can be suppressed.

[0021] In the wiring circuit board of the present invention [5] based on the above [1] or [2], the wiring has: a first conductor layer; and a second conductor layer disposed on the first conductor layer, the first conductor layer of the first portion is thinner than the first conductor layer of the main body portion, and the second conductor layer of the first portion is thinner than the second conductor layer of the main body portion.

[0022] According to such a structure, generation of cracks in the first conductor layer of the first portion can be suppressed, and generation of cracks in the second conductor layer of the first portion can also be suppressed.

[0023] In the wiring circuit board of the present invention [6] based on any one of the above [1] to [5], in the first direction, the length of the first portion is 0.1% to 25% of the total length of the wiring disposed in the wiring portion.

[0024] According to such a structure, the stress of the wiring disposed near one end of the wiring portion can be further alleviated.

[0025] As a result, the generation of cracks in the wiring near one end of the wiring portion can be further suppressed.

[0026] In the present invention [7], based on any of the wiring circuit boards in the above [1] to [6], the width of the first portion is 50% or more and less than 100% of the width of the main body portion.

[0027] According to such a structure, the stress of the wiring disposed near one end of the wiring portion can be further alleviated.

[0028] As a result, the generation of cracks in the wiring near one end of the wiring portion can be further suppressed.

[0029] In the present invention [8], based on any of the wiring circuit boards in the above [1] to [7], the wiring circuit board has: a metal support layer; an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern disposed on one side of the insulating layer in the thickness direction and having the wiring, and the metal support layer is disposed in the first support portion and the wiring portion.

[0030] In the present invention [9], based on any of the wiring circuit boards in the above [1] to [7], the wiring circuit board has: a metal support layer; an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern disposed on one side of the insulating layer in the thickness direction and having the wiring, and the metal support layer is not disposed in the wiring portion but in the first support portion.

[0031] In the present invention

[10] , based on any of the wiring circuit boards in the above [1] to [9], the wiring circuit board further includes a second support portion that supports the other ends of the plurality of wiring portions in the first direction, and the wiring further has a second portion disposed between the second support portion and the main body portion in the first direction and connected to the second support portion, and the second portion is thinner than the main body portion.

[0032] According to such a structure, the second portion of the wiring disposed in the wiring portion and connected to the second support portion is thinner than the main body portion.

[0033] Therefore, when the wiring portion moves, the stress concentration in the wiring near the other end of the wiring portion can be suppressed. In other words, the stress of the wiring disposed near the other end of the wiring portion can be alleviated.

[0034] As a result, it is possible to suppress the generation of cracks in the wiring near the other end of the wiring portion.

[0035] In the wiring circuit board of the above

[10] , according to the present invention

[11] , each of the plurality of wiring portions has a plurality of wirings, and in all of the wirings, the second portion is thinner than the main body portion.

[0036] According to such a structure, it is possible to suppress the generation of cracks in the second portion in all of the wirings.

[0037] In the wiring circuit board of the above

[10] or

[11] , according to the present invention

[12] , the wiring has: a first conductor layer; and a second conductor layer disposed on the first conductor layer, and the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion.

[0038] According to such a structure, it is possible to suppress the generation of cracks in the first conductor layer of the second portion.

[0039] In the wiring circuit board of the above

[10] or

[11] , according to the present invention

[13] , the wiring has: a first conductor layer; and a second conductor layer disposed on the first conductor layer, and the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

[0040] According to such a structure, it is possible to suppress the generation of cracks in the second conductor layer of the second portion.

[0041] In the wiring circuit board of the above

[10] or

[11] , according to the present invention

[14] , the wiring has: a first conductor layer; and a second conductor layer disposed on the first conductor layer, the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion, and the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

[0042] According to such a structure, it is possible to suppress the generation of cracks in the first conductor layer of the second portion, and it is also possible to suppress the generation of cracks in the second conductor layer of the second portion.

[0043] In the wiring circuit board of any one of the above

[10] to

[14] , according to the present invention

[15] , in the first direction, the length of the second portion is 0.1% to 25% of the total length of the wiring disposed in the wiring portion.

[0044] According to such a structure, it is possible to further relieve the stress of the wiring disposed near the other end of the wiring portion.

[0045] As a result, it is possible to further suppress the generation of cracks in the wiring near the other end of the wiring portion.

[0046] Based on any of the wiring circuit boards in the above

[10] to

[15] , in the present invention

[16] , the width of the second part is 50% or more and less than 100% of the width of the main body part.

[0047] According to such a structure, it is possible to further relieve the stress of the wiring disposed near the other end of the wiring portion.

[0048] As a result, it is possible to further suppress the generation of cracks in the wiring near the other end of the wiring portion.

[0049] Based on any of the wiring circuit boards in the above

[10] to

[16] , in the present invention

[17] , the wiring circuit board has: a metal support layer; an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern disposed on one side of the insulating layer in the thickness direction and having the wiring; the metal support layer is disposed in the first support portion, the second support portion, and the wiring portion.

[0050] Based on any of the wiring circuit boards in the above

[10] to

[16] , in the present invention

[18] , the wiring circuit board has: a metal support layer; an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern disposed on one side of the insulating layer in the thickness direction and having the wiring, the metal support layer is not disposed in the wiring portion but is disposed in the first support portion and the second support portion.

[0051] Effects of the Invention

[0052] According to the wiring circuit board of the present invention, it is possible to suppress the generation of cracks in the wiring near the end of the wiring portion. Description of the Drawings

[0053] Figure 1 A top view showing a wiring circuit board as an embodiment of the present invention.

[0054] Figure 2 is Figure 1 The A-A cross-sectional view of the shown wiring circuit board.

[0055] Figure 3 is Figure 1 The B-B cross-sectional view of the shown wiring circuit board.

[0056] Figure 4 An explanatory diagram for explaining the modification example (1).

[0057] Figure 5It is an explanatory diagram for explaining Modification Example (2), showing an example in which the first conductor layer is thinned in the first part and the second part of the wiring.

[0058] Figure 6 It is an explanatory diagram for explaining Modification Example (2), showing an example in which the second conductor layer is thinned in the first part and the second part of the wiring.

[0059] Figure 7 It is an explanatory diagram for explaining Modification Example (2), showing an example in which both the first conductor layer and the second conductor layer are thinned in the first part and the second part of the wiring.

[0060] Figure 8 It is an explanatory diagram for explaining Modification Example (3).

[0061] Figure 9 It is an explanatory diagram for explaining Modification Example (4).

[0062] Figure 10 It is an explanatory diagram for explaining Modification Example (5).

[0063] Figure 11 It is an explanatory diagram for explaining Modification Example (6).

[0064] Figure 12 is Figure 11 a C - C cross - sectional view of the wiring circuit board shown.

[0065] Figure 13 It is an explanatory diagram for explaining Modification Example (7).

[0066] Figure 14 It is an explanatory diagram for explaining Modification Example (8).

[0067] Figure 15 It is an explanatory diagram for explaining Modification Example (9).

[0068] Figure 16A and Figure 16B It is an explanatory diagram for explaining Modification Example (10).

[0069] Figure 17 It is an explanatory diagram for explaining Modification Example (11).

[0070] Explanation of Reference Numerals

[0071] 1. Wiring circuit board; 2A. First support portion; 2B. Second support portion; 3A. Wiring portion; 3B. Wiring portion; 133A. Wiring; 133B. Wiring; 1331. First part; 1332. Second part; 1333. Main body part. Detailed Implementation Manner

[0072] 1. Wiring circuit board

[0073] As shown Figure 1 in FIG. Figure 1 , the wiring circuit board 1 includes a plurality of support portions 2 (a first support portion 2A and a second support portion 2B) and a plurality of wiring portions 3A, 3B.

[0074] The first support portion 2A and the second support portion 2B are arranged at intervals in the first direction. The first direction is the direction in which the wiring 133A described later extends. The first direction is orthogonal to the thickness direction of the wiring circuit board 1. The first support portion 2A and the second support portion 2B each extend in the second direction. The second direction is orthogonal to both the first direction and the thickness direction. The first support portion 2A supports one end portion of each of the wiring portions 3A, 3B in the first direction. Terminals 131A, 131B of the conductor pattern 13 described later are arranged on the first support portion 2A. The second support portion 2B supports the other end portion of each of the wiring portions 3A, 3B in the first direction. Terminals 132A, 132B of the conductor pattern 13 described later are arranged on the second support portion 2B.

[0075] The wiring portions 3A, 3B are arranged between the first support portion 2A and the second support portion 2B in the first direction. In the present embodiment, the wiring portions 3A, 3B each extend in the first direction. One end portion of each of the wiring portions 3A, 3B in the first direction is connected to the first support portion 2A. The other end portion of each of the wiring portions 3A, 3B in the first direction is connected to the second support portion 2B. In addition, the shapes of the wiring portions 3A, 3B are not limited. The wiring portions 3A, 3B may each be a straight shape or may be bent. The wiring portions 3A, 3B are arranged in the second direction. In other words, the wiring portions 3A, 3B are arranged in a direction orthogonal to the direction in which the wiring portion 3A extends. The wiring portions 3A, 3B are arranged at intervals in the second direction. In other words, the wiring portions 3A, 3B are arranged at intervals in a direction orthogonal to the direction in which the wiring portion 3A extends. At least a part of the wiring 133A of the conductor pattern 13 described later is arranged on the wiring portion 3A. At least a part of the wiring 133B of the conductor pattern 13 described later is arranged on the wiring portion 3B.

[0076] The width W0 of the wiring portion 3A is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0077] In addition, the "width" refers to the length in a direction orthogonal to both the direction in which the wiring portion extends and the thickness direction. For example, the "width" of the wiring portion 3A refers to the length in a direction orthogonal to both the direction in which the wiring portion 3A extends and the thickness direction. In the present embodiment, the "width" refers to the length in the second direction.

[0078] The interval D1 between the wiring portion 3A and the wiring portion 3B is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0079] As shown Figure 2 in the figure, the wiring circuit board has a metal support layer 11, a first insulating layer 12, a conductor pattern 13, and a second insulating layer 14.

[0080] (1) Metal support layer

[0081] The metal support layer 11 is disposed on the support portion 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A, 3B. That is, the support portion 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A, 3B have the metal support layer 11. The metal support layer 11 supports the first insulating layer 12, the conductor pattern 13, and the second insulating layer 14. The metal support layer 11 is made of metal. As the material of the metal support layer 11, for example, copper, nickel, cobalt, iron, and their alloys can be cited. As the alloy, for example, copper alloy can be cited. As the material of the metal support layer 11, copper alloy is preferably selected.

[0082] The thickness T1 of the metal support layer 11 is, for example, 10 μm to 300 μm, preferably 50 μm to 250 μm.

[0083] As shown Figure 3 in the figure, the width W1 of the metal support layer 11 of the wiring portion 3A is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0084] The width W1 of the metal support layer 11 of the wiring portion 3A and the width W0 of the wiring portion 3A (refer to Figure 1 ) may be the same or different. Specifically, the width W1 of the metal support layer 11 of the wiring portion 3A and the width of the first insulating layer of the wiring portion 3A may be the same or different.

[0085] For example, when the width W1 of the metal support layer 11 of the wiring portion 3A is wider than the width of the first insulating layer of the wiring portion 3A and is the widest among the layers constituting the wiring portion 3A, the width W1 of the metal support layer 11 of the wiring portion 3A becomes the width W0 of the wiring portion 3A. That is, in this case, the width W1 of the metal support layer 11 of the wiring portion 3A is the same as the width W0 of the wiring portion 3A.

[0086] In addition, for example, when the width of the first insulating layer of the wiring portion 3A is wider than the width W1 of the metal support layer 11 of the wiring portion 3A and is the widest among the layers constituting the wiring portion 3A, the width of the first insulating layer 12 of the wiring portion 3A becomes the width W0 of the wiring portion 3A. In this case, the width W1 of the metal support layer 11 of the wiring portion 3A is narrower than the width W0 of the wiring portion 3A.

[0087] The ratio (T1 / W1) of the thickness T1 of the metal support layer 11 of the wiring portion 3A to the width W1 of the metal support layer 11 of the wiring portion 3A is 2 or more, preferably 3 or more. Hereinafter, the ratio (T1 / W1) is defined as the aspect ratio of the metal support layer 11 of the wiring portion 3A.

[0088] If the aspect ratio (T1 / W1) of the metal support layer 11 of the wiring portion 3A is equal to or greater than the above lower limit value, the rigidity in the thickness direction of the wiring portion 3A can be ensured.

[0089] The aspect ratio (T1 / W1) of the metal support layer 11 of the wiring portion 3A is, for example, 30 or less, preferably 10 or less.

[0090] The aspect ratio (T1 / W1) of the metal support layer 11 of the wiring portion 3A may also be 2 to 30 or 3 to 10.

[0091] The interval D2 between the metal support layer 11 of the wiring portion 3A and the metal support layer 11 of the wiring portion 3B is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm. The interval D2 may be the same as or different from the interval D1.

[0092] (2) The first insulating layer

[0093] As Figure 2 shown, the first insulating layer 12 is disposed on the support portion 2 (the first support portion 2A, the second support portion 2B) and the wiring portions 3A, 3B. That is, the support portion 2 (the first support portion 2A, the second support portion 2B) and the wiring portions 3A, 3B have the first insulating layer 12. The first insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction. The first insulating layer 12 is disposed on the surface on one side in the thickness direction of the metal support layer 11. The first insulating layer 12 is disposed between the metal support layer 11 and the conductor pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the conductor pattern 13. The first insulating layer 12 is made of resin. As the resin, for example, polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester can be cited.

[0094] (3) Conductor pattern

[0095] The conductor pattern 13 is disposed on one side in the thickness direction of the first insulating layer 12. The conductor pattern 13 is disposed on the surface on one side in the thickness direction of the first insulating layer 12. That is, the wirings 133A, 133B are disposed on the first insulating layer 12. The conductor pattern 13 is disposed on the side opposite to the metal support layer 11 with respect to the first insulating layer 12 in the thickness direction. The shape of the conductor pattern 13 is not limited.

[0096] As Figure 1As shown, the conductor pattern 13 has a plurality of terminals 131A, 131B, a plurality of terminals 132A, 132B, and a plurality of wirings 133A, 133B.

[0097] The terminals 131A and 131B are disposed in the first support portion 2A. The terminals 131A and 131B each have a square shape. The terminals 131A and 131B are arranged in the second direction. The terminals 131A and 131B are disposed at intervals in the second direction.

[0098] The terminals 132A and 132B are disposed in the second support portion 2B. The terminals 132A and 132B each have a square shape. The terminals 132A and 132B are arranged in the second direction. The terminals 132A and 132B are disposed at intervals in the second direction.

[0099] The wiring 133A electrically connects the terminal 131A and the terminal 132A. One end portion of the wiring 133A is connected to the terminal 131A. The other end portion of the wiring 133A is connected to the terminal 132A. At least a part of the wiring 133A is disposed in the wiring portion 3A. That is, the wiring portion 3A has the wiring 133A. The wiring 133A extends in the first direction.

[0100] The wiring 133B electrically connects the terminal 131B and the terminal 132B. One end portion of the wiring 133B is connected to the terminal 131B. The other end portion of the wiring 133B is connected to the terminal 132B. At least a part of the wiring 133B is disposed in the wiring portion 3B. That is, the wiring portion 3B has the wiring 133B. The wiring 133B extends in the first direction. The wirings 133A and 133B are arranged in the second direction. The wirings 133A and 133B are disposed at intervals in the second direction.

[0101] (4) Second insulating layer

[0102] As Figure 2 shown, the second insulating layer 14 covers all of the wirings 133A and 133B. The second insulating layer 14 is disposed on the first insulating layer 12 in the thickness direction. In addition, the second insulating layer 14 does not cover the terminals 131A, 131B, 132A, and 132B. The second insulating layer 14 is made of resin. As the resin, for example, polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester can be cited.

[0103] 2. Details of the wiring

[0104] Next, with reference to Figure 1 , the details of the wiring 133A will be described. In addition, the wiring 133B has the same structure as that of the wiring 133A. The description of the wiring 133B is omitted.

[0105] AsFigure 1 As shown, the wiring 133A has a first part 1331, a second part 1332, a main body part 1333 (third part), a fourth part 1334, and a fifth part 1335. The wiring 133A may not have the fourth part 1334 and the fifth part 1335.

[0106] The first part 1331, the second part 1332, and the main body part 1333 are arranged in the wiring part 3A. The first part 1331, the second part 1332, and the main body part 1333 are arranged between the first support part 2A and the second support part 2B in the first direction.

[0107] The first part 1331 is arranged at one end and its vicinity in the first direction of the wiring part 3A. The first part 1331 is arranged between the first support part 2A and the main body part 1333 in the first direction. The first part 1331 is connected to the first support part 2A. Specifically, one end of the first part 1331 in the first direction is connected to the fourth part 1334 of the wiring 133A. When the wiring 133A does not have the fourth part 1334, one end of the first part 1331 in the first direction may also be connected to the terminal 131A. The first part 1331 is thinner than the main body part 1333.

[0108] In the first direction, the length L1 of the first part 1331 is, for example, 0.1% to 25% of the total length L0 of the wiring 133A arranged in the wiring part 3A, preferably 5% to 25%, more preferably 10% to 25%, and still more preferably 10% to 21%.

[0109] If the length L1 of the first part 1331 is within the above range, an increase in the impedance of the wiring 133A can be suppressed, and the stress on the first part 1331 can be further alleviated.

[0110] The width W11 of the first part 1331 is, for example, 50% or more and less than 100% of the width W13 of the main body part 1333, preferably 60% to 80%.

[0111] If the width W11 of the first part 1331 is within the above range, the stress on the first part 1331 can be further alleviated.

[0112] The ratio (W11 / W1) of the width W11 of the first part 1331 to the width W1 of the metal support layer 11 of the wiring part 3A is, for example, 200% or less, preferably 120% or less. The ratio (W11 / W1) is, for example, 50% or more.

[0113] If the ratio (W11 / W1) is within the above range, the stress on the first part 1331 can be further alleviated.

[0114] The ratio (W11 / W0) of the width W11 of the first part 1331 to the width W0 of the wiring part 3A is, for example, less than 100%, preferably 70% or less. The ratio (W11 / W0) is, for example, 50% or more.

[0115] If the ratio (W11 / W0) is within the above range, the stress of the first part 1331 can be further alleviated.

[0116] The second part 1332 is disposed at the other end and its vicinity in the first direction of the wiring part 3A. The second part 1332 is disposed between the second support part 2B and the main body part 1333 in the first direction. The second part 1332 is connected to the second support part 2B. Specifically, the other end of the second part 1332 in the first direction is connected to the fifth part 1335 of the wiring 133A. In the case where the wiring 133A does not have the fifth part 1335, the other end of the second part 1332 in the first direction may also be connected to the terminal 132A. The second part 1332 is thinner than the main body part 1333. The width of the second part 1332 may be the same as the width of the first part 1331.

[0117] In the first direction, the length L2 of the second part 1332 is, for example, 0.1% to 25% of the total length L0 of the wiring 133A disposed in the wiring part 3A, preferably 5% to 25%, more preferably 10% to 25%, and even more preferably 10% to 21%.

[0118] If the length L2 of the second part 1332 is within the above range, the stress of the second part 1332 can be further alleviated.

[0119] The width W12 of the second part 1332 is, for example, 50% or more and less than 100% of the width W13 of the main body part 1333, preferably 60% to 80%.

[0120] If the width W12 of the second part 1332 is within the above range, the stress of the second part 1332 can be further alleviated.

[0121] The ratio (W12 / W1) of the width W12 of the second part 1332 to the width W1 of the metal support layer 11 of the wiring part 3A is, for example, 200% or less, preferably 120% or less. The ratio (W12 / W1) is, for example, 50% or more.

[0122] If the ratio (W12 / W1) is within the above range, the stress of the second part 1332 can be further alleviated.

[0123] The ratio (W12 / W0) of the width W12 of the second part 1332 to the width W0 of the wiring part 3A is, for example, less than 100%, preferably 70% or less. The ratio (W12 / W0) is, for example, 50% or more.

[0124] If the ratio (W12 / W0) is within the above range, the stress of the second part 1332 can be further alleviated.

[0125] The main body part 1333 is arranged between the first support part 2A and the second support part 2B in the first direction. The main body part 1333 is arranged separately from the first support part 2A and the second support part 2B in the first direction. The main body part 1333 is arranged between the first part 1331 and the second part 1332 in the first direction. One end of the main body part 1333 in the first direction is connected to the first part 1331. The other end of the main body part 1333 in the first direction is connected to the second part 1332.

[0126] The fourth part 1334 is arranged on the first support part 2A. One end of the fourth part 1334 in the first direction is connected to the terminal 131A. The other end of the fourth part 1334 in the first direction is connected to the first part 1331. The width of the fourth part 1334 may be the same as the width of the main body part 1333.

[0127] The fifth part 1335 is arranged on the second support part 2B. One end of the fifth part 1335 in the first direction is connected to the second part 1332. The other end of the fifth part 1335 in the first direction is connected to the terminal 132A. The width of the fifth part 1335 may be the same as the width of the main body part 1333.

[0128] 2. Effects

[0129] (1) According to the wiring circuit board 1, as Figure 1 shown, for the wiring 133A arranged in the wiring part 3A, the first part 1331 connected to the first support part 2A and the second part 1332 connected to the second support part 2B are thinner than the main body part 1333 arranged between the first part 1331 and the second part 1332.

[0130] Therefore, when the wiring part 3A moves, it is possible to suppress the stress concentration at the ends of the wiring part 3A from concentrating on the first part 1331 and the second part 1332. In other words, the stress of the wiring 133A arranged near the ends of the wiring part 3A can be alleviated.

[0131] As a result, it is possible to suppress cracks from occurring in the wiring 133A near the ends of the wiring part 3A.

[0132] (2) According to the wiring circuit board 1, as Figure 1As shown, the length L1 of the first portion 1331 and the length L2 of the second portion 1332 are 0.1% to 25% of the total length L0 of the wiring 133A disposed in the wiring portion 3A.

[0133] Therefore, the stress of the first portion 1331 and the second portion 1332 can be further alleviated.

[0134] As a result, the generation of cracks in the wiring 133A near the end of the wiring portion 3A can be further suppressed.

[0135] (3) According to the wiring circuit board 1, as Figure 1 shown, the width W11 of the first portion 1331 and the width W12 of the second portion 1332 are 50% or more and less than 100% of the width W13 of the main body portion 1333.

[0136] Therefore, the stress of the first portion 1331 and the second portion 1332 can be further alleviated.

[0137] As a result, the generation of cracks in the wiring 133A near the end of the wiring portion 3A can be further suppressed.

[0138] 3. Modification

[0139] Next, the modification will be described. In the modification, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

[0140] (1) As Figure 4 shown, the wiring portions 3A and 3B may each have a plurality of wirings 201. Specifically, the wiring circuit board 1 has a conductor pattern 20 instead of the conductor pattern 13. The conductor pattern 20 has a plurality of terminals 201A, 201B, 201C, 201D, a plurality of terminals 202A, 202B, 202C, 202D, and a plurality of wirings 203A, 203B, 203C, 203D.

[0141] The terminals 201A, 201B, 201C, 201D are disposed in the first support portion 2A. The terminals 201A, 201B, 201C, 201D are arranged in the second direction. The terminals 201A, 201B, 201C, 201D are arranged at intervals in the second direction.

[0142] The terminals 202A, 202B, 202C, 202D are disposed in the second support portion 2B. The terminals 202A, 202B, 202C, 202D are arranged in the second direction. The terminals 202A, 202B, 202C, 202D are arranged at intervals in the second direction.

[0143] The wiring 203A electrically connects the terminal 201A and the terminal 202A. The wiring 203B electrically connects the terminal 201B and the terminal 202B. The wirings 203A and 203B are arranged in the second direction. The wirings 203A and 203B are arranged at intervals from each other in the second direction. The wirings 203A and 203B are arranged in the wiring portion 3A.

[0144] The wiring 203C electrically connects the terminal 201C and the terminal 202C. The wiring 203D electrically connects the terminal 201D and the terminal 202D. The wirings 203C and 203D are arranged in the second direction. The wirings 203C and 203D are arranged at intervals from each other in the second direction. The wirings 203C and 203D are arranged in the wiring portion 3B.

[0145] In all of the wirings 203A, 203B, 203C, and 203D, the first part 2031 and the second part 2032 are thinner than the main body part 2033.

[0146] According to this modification example, it is possible to suppress the generation of cracks in all of the wirings 203A, 203B, 203C, and 203D.

[0147] (2) The wiring portion 3A may also have a plurality of conductor layers (for example, the first conductor layer 30A and the second conductor layer 30B).

[0148] For example, as Figure 5 shown, the conductor pattern 30 may also have the first conductor layer 30A and the second conductor layer 30B. In other words, the wiring 303A has the first conductor layer 30A and the second conductor layer 30B. The first conductor layer 30A is arranged on the first insulating layer 12. The second conductor layer 30B is arranged on the first conductor layer 30A.

[0149] It may also be that the first conductor layer 30A of the first part 3031 and the second part 3032 is thinner than the first conductor layer 30A of the main body part 3033. If the first conductor layer 30A of the first part 3031 and the second part 3032 is thinner than the first conductor layer 30A of the main body part 3033, it is possible to suppress the generation of cracks in the first conductor layer 30A of the first part 3031 and the second part 3032.

[0150] In addition, as Figure 6 shown, it may also be that the second conductor layer 30B of the first part 3031 and the second part 3032 is thinner than the second conductor layer 30B of the main body part 3033. If the second conductor layer 30B of the first part 3031 and the second part 3032 is thinner than the second conductor layer 30B of the main body part 3033, it is possible to suppress the generation of cracks in the second conductor layer 30B of the first part 3031 and the second part 3032.

[0151] In addition, asFigure 7 As shown, it can also be that the first conductor layer 30A of the first part 3031 and the second part 3032 is thinner than the first conductor layer 30A of the main body part 3033, and the second conductor layer 30B of the first part 3031 and the second part 3032 is thinner than the second conductor layer 30B of the main body part 3033. In this case, in the first part 3031 and the second part 3032, it is possible to suppress the generation of cracks in the first conductor layer 30A, and it is also possible to suppress the generation of cracks in the second conductor layer 30B.

[0152] (3) As Figure 8 As shown, the wiring part 3A can also have an intermediate insulating layer 41 between the first conductor layer 30A and the second conductor layer 30B. The intermediate insulating layer 41 is disposed on the first insulating layer 12. The intermediate insulating layer 41 covers the first conductor layer 30A. The second insulating layer 14 is disposed on the intermediate insulating layer 41. The second insulating layer 14 covers the second conductor layer 30B. The first conductor layer 30A is, for example, a signal wiring, and the second conductor layer 30B is, for example, a shielding conductor layer.

[0153] In this modification, it can also be like the above modification (2), where the first conductor layer 30A of the first part 3031 and the second part 3032 is thinner than the first conductor layer 30A of the main body part 3033. In addition, the second conductor layer 30B of the first part 3031 and the second part 3032 can also be thinner than the second conductor layer 30B of the main body part 3033.

[0154] In this modification, it is also possible to obtain the same effect as that of the above modification (2).

[0155] (4) The wiring circuit board 1 can also have three or more supporting parts 2. For example, as Figure 9 shown, the wiring circuit board 1 can also have a third supporting part 2C and a plurality of wiring parts 50A, 50B in addition to the above-mentioned first supporting part 2A, second supporting part 2B, and a plurality of wiring parts 3A, 3B.

[0156] In this case, the terminals 132A, 132B are not disposed on the second supporting part 2B, but are disposed on the third supporting part 2C. The wirings 133A, 133B respectively extend from the first supporting part 2A through the second supporting part 2B to the third supporting part 2C. Intermediate parts (the sixth part 1336) of the wirings 133A, 133B are disposed on the second supporting part 2B.

[0157] The third support portion 2C is disposed on the side opposite to the first support portion 2A with respect to the second support portion 2B in the first direction. In other words, the second support portion 2B is disposed between the first support portion 2A and the third support portion 2C in the first direction. The third support portion 2C extends in the second direction. The third support portion 2C supports the other ends of the wiring portions 50A and 50B in the first direction. In addition, one ends of the wiring portions 50A and 50B in the first direction are supported by the second support portion 2B.

[0158] The wiring portion 50A has the same structure as the wiring portion 3A. Specifically, the wiring 133A disposed in the wiring portion 50A has the first portion 1331, the second portion 1332, and the main body portion 1333, similar to the wiring 133A disposed in the wiring portion 3A. In the wiring portion 50A, the first portion 1331 and the second portion 1332 are also thinner than the main body portion 1333.

[0159] In the wiring portion 50A, the first portion 1331 is disposed at one end of the wiring portion 50A in the first direction. The first portion 1331 in the wiring portion 50A is disposed between the second support portion 2B and the main body portion 1333 in the first direction and is connected to the second support portion 2B. Specifically, the first portion 1331 in the wiring portion 50A is connected to the sixth portion 1336.

[0160] In the wiring portion 50A, the second portion 1332 is disposed at the other end of the wiring portion 50A in the first direction. The second portion 1332 in the wiring portion 50A is disposed between the main body portion 1333 and the third support portion 2C in the first direction and is connected to the third support portion 2C. Specifically, the second portion 1332 in the wiring portion 50A is connected to the fifth portion 1335.

[0161] In this modification, the same effects as those of the above-described embodiment can also be obtained.

[0162] In addition, in this modification, the middle portions (the sixth portions 1336) of the wirings 133A and 133B can be supported by the second support portion 2B.

[0163] (5) As Figure 10 shown, the first portion 1331 may also be a tapered shape in which the width W11 becomes narrower as it approaches the first support portion 2A from the main body portion 1333. The second portion 1332 may also be a tapered shape in which the width W12 becomes narrower as it approaches the second support portion 2B from the main body portion 1333.

[0164] In this modification, the same effects as those of the above-described embodiment can also be obtained.

[0165] (6) As Figure 11As shown, it is also possible that the metal support layer 11 is not disposed in the wiring portion 3A, but is disposed in the first support portion 2A and the second support portion 2B. In this case, as Figure 12 shown, the wiring portion 3A does not have the metal support layer 11, but has the first insulating layer 12, the wiring 133A, and the second insulating layer 14.

[0166] In this modification, the same effects as those of the above-described embodiment can also be obtained.

[0167] (7) As Figure 13 shown, the wiring circuit board 1 may not include the metal support layer 11. In other words, the support portion 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A and 3B may not have the metal support layer 11.

[0168] In this modification, the same effects as those of the above-described embodiment can also be obtained.

[0169] (8) As Figure 14 shown, it is also possible that, when the conductor pattern 30 has a plurality of conductor layers (for example, the first conductor layer 30A and the second conductor layer 30B) and the intermediate insulating layer 41 disposed between the first conductor layer 30A and the second conductor layer 30B, the wiring portion 3A does not have the metal support layer 11.

[0170] (9) As Figure 15 shown, the wiring circuit board 1 may include the second conductor pattern 61 and the third insulating layer 62.

[0171] The second conductor pattern 61 is disposed on the other side of the first insulating layer 12 in the thickness direction. The second conductor pattern 61 is disposed on the surface on the other side of the first insulating layer 12 in the thickness direction. The second conductor pattern 61 is disposed on the side opposite to the conductor pattern 30 with respect to the first insulating layer 12 in the thickness direction.

[0172] The third insulating layer 62 covers the second conductor pattern 61. The third insulating layer 62 is disposed on the other side of the first insulating layer 12 in the thickness direction. The third insulating layer 62 is disposed on the surface on the other side of the first insulating layer 12 in the thickness direction.

[0173] In this modification, the same effects as those of the above-described embodiment can also be obtained. Further, in this modification, it is also possible that the wiring portion 3A does not include the metal support layer 11.

[0174] (10) As Figure 16A and Figure 16B shown, when the wiring circuit board 1 includes the second conductor pattern 61, the wiring circuit board 1 may have the terminal 131C electrically connected to the second conductor pattern 61.

[0175] Specifically, as Figure 16A shown, the wiring circuit board 1 may also include a terminal 131C and a wiring 133C.

[0176] The terminal 131C is disposed on the first support portion 2A. The terminal 131C is disposed on the first insulating layer 12. The terminal 131C is disposed on one surface in the thickness direction of the first insulating layer 12.

[0177] The wiring 133C is disposed on the first support portion 2A. The wiring 133C is disposed separately from the wiring 133A. The wiring 133C is disposed on the first insulating layer 12. The wiring 133C is disposed on one surface in the thickness direction of the first insulating layer 12. One end portion of the wiring 133C is connected to the terminal 131C. The other end portion of the wiring 133C is connected to the second conductor pattern 61 via a through hole 120 (via hole) of the first insulating layer 12. Thus, the terminal 131C is electrically connected to the second conductor pattern 61 via the wiring 133C.

[0178] In addition, as Figure 16B shown, the terminal 131C may also be directly connected to the second conductor pattern 61 via a through hole 120 (via hole) of the first insulating layer 12. In this case, the wiring circuit board 1 does not include the wiring 133C.

[0179] (11) As Figure 17 shown, the second insulating layer 14 may also be bonded to one surface in the thickness direction of the first insulating layer 12 and the conductor pattern 13 by an adhesive 63.

[0180] In addition, when the wiring circuit board 1 includes the second conductor pattern 61 and the third insulating layer 62, the third insulating layer 62 may also be bonded to the other surface in the thickness direction of the first insulating layer 12 and the second conductor pattern 61 by an adhesive 63.

[0181] In addition, when the wiring circuit board 1 includes the second conductor pattern 61 and the third insulating layer 62, the wiring circuit board 1 may also have a metal support layer 11. The metal support layer 11 may not be disposed in the wiring portion 3A, but may be disposed in the first support portion 2A and the second support portion 2B. The metal support layer 11 may also be bonded to the third insulating layer 62 by an adhesive 64. The adhesive 64 is a conductive adhesive and may also be in contact with the second conductor pattern 61 via a through hole 62A of the third insulating layer 62. The second conductor pattern 61 may also be electrically connected to the metal support layer 11 via the adhesive 64 (conductive adhesive).

[0182] In this modified example, the same operational effects as those of the above-described embodiment can also be obtained.

[0183]

Example

[0184] Next, the present invention will be described based on the examples and comparative examples. The present invention is not limited by the following examples. In addition, the specific numerical values such as physical property values and parameters used in the following description can be replaced with the upper limit values (defined as "below", "less than") or lower limit values (defined as "above", "greater than") of the corresponding physical property values and parameters described in the above "Detailed Description".

[0185] The maximum stress of the simulation models of the wiring portions of the following examples and comparative examples was calculated using Ansys Mechanical (finite element method analysis software, manufactured by Ansys Inc.).

[0186] (1) Example

[0187] As Figure 1 shown, a simulation model was made in which the widths of the two end portions (the first portion and the second portion) of the wiring arranged in the wiring portion were set to be narrower than the width of the portion (the main body portion) between the first portion and the second portion (the width W0 of the wiring portion: 100 μm, the width W1 of the metal support layer: 40 μm, the width W11 of the first portion: 40 μm, the width W12 of the second portion: 40 μm, the width W13 of the main body portion: 55 μm, the length L0 of the wiring portion: 500 μm, the length L1 of the first portion: 100 μm, the length L2 of the second portion: 100 μm, the length L3 of the main body portion: 300 μm). The maximum stress of the first portion and the second portion of the wiring was 75 MPa. The material of the wiring was set to copper, and the elastic modulus of the wiring was set to 100 GPa.

[0188] (2) Comparative Example

[0189] Except for changing the widths of the first portion and the second portion, a simulation model of the wiring in which the first portion, the second portion, and the main body portion had the same width was made in the same manner as in the example (the width W0 of the wiring portion: 100 μm, the width W1 of the metal support layer: 40 μm, the width of the wiring: 55 μm). The maximum stress of the first portion and the second portion of the wiring was 100 MPa.

[0190] In addition, the above invention is provided as an exemplary embodiment of the present invention, which is merely an example and is not to be construed in a limiting sense. Variations of the present invention that are obvious to those skilled in the art are included in the foregoing claims.

Claims

1. A wiring circuit board, wherein, The wiring circuit board includes: a plurality of wiring portions that extend in a first direction and are arranged at intervals from each other; and a first support portion that supports one end portion of each of the plurality of wiring portions in the first direction, each of the plurality of wiring portions has a wiring that extends in the first direction, the wiring has: a main body portion that is arranged apart from the first support portion in the first direction; and a first portion that is arranged between the first support portion and the main body portion in the first direction and is connected to the first support portion, the first portion is thinner than the main body portion.

2. The wiring circuit board according to claim 1, wherein each of the plurality of wiring portions has a plurality of the wirings, in all of the wirings, the first portion is thinner than the main body portion.

3. The wiring circuit board according to claim 1, wherein the wiring has: a first conductor layer; and a second conductor layer that is arranged on the first conductor layer, the first conductor layer of the first portion is thinner than the first conductor layer of the main body portion.

4. The wiring circuit board according to claim 1, wherein the wiring has: a first conductor layer; and a second conductor layer that is arranged on the first conductor layer, the second conductor layer of the first portion is thinner than the second conductor layer of the main body portion.

5. The wiring circuit board according to claim 1, wherein the wiring has: a first conductor layer; and a second conductor layer that is arranged on the first conductor layer, the first conductor layer of the first portion is thinner than the first conductor layer of the main body portion, and the second conductor layer of the first portion is thinner than the second conductor layer of the main body portion.

6. The wiring circuit board according to claim 1, wherein in the first direction, the length of the first portion is 0.1% to 25% of the total length of the wiring arranged in the wiring portion.

7. The wiring circuit board according to claim 1, wherein the width of the first portion is 50% or more and less than 100% of the width of the main body portion.

8. The wiring circuit board according to claim 1, wherein the wiring circuit board has: a metal support layer; an insulating layer that is arranged on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern that is arranged on one side of the insulating layer in the thickness direction and has the wiring, the metal support layer is arranged at the first support portion and the wiring portion.

9. The wiring circuit board according to claim 1, wherein the wiring circuit board has: a metal support layer; an insulating layer that is arranged on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern that is arranged on one side of the insulating layer in the thickness direction and has the wiring, the metal support layer is not arranged at the wiring portion but is arranged at the first support portion.

10. The wiring circuit board according to claim 1, wherein The wiring circuit board further includes a second support portion that supports the other end portions of the plurality of wiring portions in the first direction. The wiring further has a second portion that is disposed between the second support portion and the main body portion in the first direction and is connected to the second support portion. The second portion is thinner than the main body portion.

11. The wiring circuit board according to claim 10, wherein each of the plurality of wiring portions has a plurality of the wirings, in all of the wirings, the second portion is thinner than the main body portion.

12. The wiring circuit board according to claim 10, wherein the wiring has: a first conductor layer; and a second conductor layer that is disposed on the first conductor layer, the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion.

13. The wiring circuit board according to claim 10, wherein the wiring has: a first conductor layer; and a second conductor layer that is disposed on the first conductor layer, the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

14. The wiring circuit board according to claim 10, wherein the wiring has: a first conductor layer; and a second conductor layer that is disposed on the first conductor layer, the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion, and the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

15. The wiring circuit board according to claim 10, wherein in the first direction, the length of the second portion is 0.1% to 25% of the total length of the wiring disposed in the wiring portion.

16. The wiring circuit board according to claim 10, wherein the width of the second portion is 50% or more and less than 100% of the width of the main body portion.

17. The wiring circuit board according to claim 10, wherein the wiring circuit board has: a metal support layer; an insulating layer that is disposed on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern that is disposed on one side of the insulating layer in the thickness direction and has the wiring, the metal support layer is disposed on the first support portion, the second support portion, and the wiring portion.

18. The wiring circuit board according to claim 10, wherein the wiring circuit board has: a metal support layer; an insulating layer that is disposed on one side of the metal support layer in the thickness direction of the metal support layer; and a conductor pattern that is disposed on one side of the insulating layer in the thickness direction and has the wiring, the metal support layer is not disposed on the wiring portion, but is disposed on the first support portion and the second support portion.

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