Wiring circuit board

Abstract

The invention provides a wired circuit board. A wired circuit board (1) is provided with: a plurality of wiring sections (3A, 3B); and a first support section (2A) that supports one end of each of the wiring sections (3A, 3B). The wiring sections (3A, 3B) each have a metal support layer (11), a first insulating layer (12), and a wiring (133). The metal support layer (11) of the wiring sections (3A, 3B) has: a first end section (111) connected to the first support section (2A); a main body part (113); and a first tapered section (114) that expands from the main body section (113) toward the first end section (111).

Description

Technical Field

[0001] The present invention relates to a wiring circuit board. Background Art

[0002] Conventionally, a wiring circuit board having a plurality of wiring portions arranged at intervals from each other and a connecting portion connecting the plurality of wiring portions has been known (for example, refer to Patent Document 1 below).

[0003] In this wiring circuit board, the thickness of the wiring portion is relatively large (more than twice) with respect to the width of the wiring portion. Therefore, the wiring portion can move more easily in the width direction than in the thickness direction.

[0004] Prior art documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2019-212656 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In a wiring circuit board as described in Patent Document 1, when the wiring portion moves, there is a possibility that stress concentrates in the vicinity of the end portion (the portion connected to the connecting portion) of the wiring portion. Therefore, there is a possibility that a crack occurs in the wiring in the vicinity of the end portion of the wiring portion.

[0009] The present invention provides a wiring circuit board capable of suppressing the occurrence of cracks in the wiring in the vicinity of the end portion of the wiring portion.

[0010] Means for Solving the Problems

[0011] The present invention [1] includes a wiring circuit board, wherein the wiring circuit board includes: a plurality of wiring portions extending in a first direction and arranged at intervals from each other; and a first support portion supporting one end portion of each of the plurality of wiring portions in the first direction, each of the plurality of wiring portions having: a metal support layer; an insulating layer disposed on the metal support layer; and a wiring disposed on the insulating layer and extending in the first direction, the metal support layer of the wiring portion having: a first end portion connected to the first support portion; a main body portion disposed separately from the first end portion; and a first tapered portion disposed between the first end portion and the main body portion, the width of the first tapered portion increasing as it goes from the main body portion toward the first end portion.

[0012] According to such a structure, the metal support layer of the wiring portion has a first tapered portion that expands as it goes toward the first end portion in the vicinity of the first end portion connected to the first support portion.

[0013] Therefore, the first tapered portion can be used to increase the rigidity near one end of the wiring portion.

[0014] Thus, when the wiring portion moves, stress concentration near one end of the wiring portion on the wiring can be suppressed. In other words, the stress on the wiring disposed near one end of the wiring portion can be alleviated.

[0015] As a result, generation of cracks in the wiring near one end of the wiring portion can be suppressed.

[0016] In the wiring circuit board of the present invention [2] based on the above [1], in the first direction, the length of the first tapered portion is 30% or less of the total length of the wiring portion.

[0017] According to such a structure, reduction in the flexibility of the wiring portion can be suppressed.

[0018] In the wiring circuit board of the present invention [3] based on the above [1] or [2], the length of the first end portion in the first direction is 200 μm or less.

[0019] In the wiring circuit board of the present invention [4] based on any one of the above [1] to [3], the taper of the first tapered portion is 0.0010 or more.

[0020] According to such a structure, the rigidity near one end of the wiring portion can be increased.

[0021] In the wiring circuit board of the present invention [5] based on any one of the above [1] to [4], the edge in the width direction of the first tapered portion includes a curve.

[0022] In the wiring circuit board of the present invention [6] based on any one of the above [1] to [4], the edge in the width direction of the first tapered portion is a straight line.

[0023] In the wiring circuit board of the present invention [7] based on any one of the above [1] to [6], the wiring circuit board further includes a second support portion that supports the other end portions of the plurality of wiring portions in the first direction, and the metal support layer of the wiring portion further has: a second end portion that is disposed separately from the main body portion and is connected to the second support portion; and a second tapered portion that is disposed between the second end portion and the main body portion, and the width of the second tapered portion expands as it goes from the main body portion toward the second end portion.

[0024] According to such a structure, the metal support layer of the wiring portion has a second tapered portion that expands as it goes toward the second end portion near the second end portion connected to the second support portion.

[0025] Therefore, the rigidity near the other end of the wiring portion can be improved by using the second tapered portion.

[0026] Thus, when the wiring portion moves, stress concentration near the other end of the wiring portion on the wiring can be suppressed. In other words, the stress of the wiring disposed near the other end of the wiring portion can be alleviated.

[0027] As a result, generation of cracks in the wiring near the other end of the wiring portion can be suppressed.

[0028] In the wiring circuit board according to the above [7] of the present invention [8], in the first direction, the length of the second tapered portion is 30% or less of the total length of the wiring portion.

[0029] According to such a structure, reduction in the flexibility of the wiring portion can be suppressed.

[0030] In the wiring circuit board according to the above [7] or [8] of the present invention [9], the length of the second end portion in the first direction is 200 μm or less.

[0031] In the wiring circuit board according to any one of the above [7] to [9] of the present invention

[10] , the taper of the second tapered portion is 0.0010 or more.

[0032] According to such a structure, the rigidity near the other end of the wiring portion can be improved.

[0033] In the wiring circuit board according to any one of the above [7] to

[10] of the present invention

[11] , the edge in the width direction of the second tapered portion includes a curve.

[0034] In the wiring circuit board according to any one of the above [7] to

[10] of the present invention

[12] , the edge in the width direction of the second tapered portion is a straight line.

[0035] In the wiring circuit board according to any one of the above [1] to

[12] of the present invention

[13] , each of the plurality of wiring portions has a plurality of wirings.

[0036] According to such a structure, generation of cracks in all the wirings provided in the wiring portion can be suppressed.

[0037] Effects of the Invention

[0038] According to the wiring circuit board of the present invention, generation of cracks in the wiring near the end portion of the wiring portion can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A plan view showing a wiring circuit board as an embodiment of the present invention.

[0040] Figure 2 is Figure 1 A - A cross - sectional view of the wiring circuit board shown in the figure.

[0041] Figure 3 is Figure 1 B - B cross - sectional view of the wiring circuit board shown in the figure.

[0042] Figure 4 is Figure 1 Bottom view of the wiring circuit board shown in the figure.

[0043] Figure 5 is Figure 4 Enlarged view of the first end portion shown in the figure.

[0044] Figure 6 It is an explanatory diagram for explaining the modification example (1).

[0045] Figures 7A - 7B is an explanatory diagram for explaining the modification example (2), Figure 7A indicating the case where the edge of the first tapered portion bends outward in the width direction in an exponential function shape as it approaches the first end portion, Figure 7B indicating the case where the edge of the first tapered portion bulges outward in the width direction in a parabolic shape as it approaches the first end portion.

[0046] Figure 8 is an explanatory diagram for explaining the modification example (3).

[0047] Figure 9 is an explanatory diagram for explaining the modification example (4).

[0048] Figure 10 is an explanatory diagram for explaining the modification example (5).

[0049] Figure 11 is an explanatory diagram for explaining the modification example (6).

[0050] Figure 12 is an explanatory diagram for explaining the modification example (7).

[0051] Explanation of reference numerals

[0052] 1. Wiring circuit board; 2A. First support portion; 2B. Second support portion; 3A. Wiring portion; 3B. Wiring portion; 11. Metal support layer; 12. First insulating layer (an example of an insulating layer); 133A. Wiring; 133B. Wiring; 111. First end portion; 112. Second end portion; 113. Main body portion; 114. First tapered portion; 115. Second tapered portion. Detailed implementation mode

[0053] 1. Wiring circuit board

[0054] As shown in Figure 1 FIG. 1, the wiring circuit board 1 includes a plurality of support portions 2 (a first support portion 2A and a second support portion 2B) and a plurality of wiring portions 3A, 3B.

[0055] The first support portion 2A and the second support portion 2B are arranged at intervals in the first direction. The first direction is the direction in which the wiring 133A described later extends. The first direction is orthogonal to the thickness direction of the wiring circuit board 1. The first support portion 2A and the second support portion 2B each extend in the second direction. The second direction is orthogonal to the thickness direction and intersects the first direction. In the present embodiment, the second direction is orthogonal to both the thickness direction and the first direction. The first support portion 2A supports one end portion of each of the wiring portions 3A, 3B in the first direction. Terminals 131A, 131B of the conductor pattern 13 described later are arranged on the first support portion 2A. The second support portion 2B supports the other end portion of each of the wiring portions 3A, 3B in the first direction. Terminals 132A, 132B of the conductor pattern 13 described later are arranged on the second support portion 2B.

[0056] The wiring portions 3A, 3B are arranged between the first support portion 2A and the second support portion 2B in the first direction. In the present embodiment, the wiring portions 3A, 3B each extend in the first direction. One end portion of each of the wiring portions 3A, 3B in the first direction is connected to the first support portion 2A. The other end portion of each of the wiring portions 3A, 3B in the first direction is connected to the second support portion 2B. In addition, the shape of each of the wiring portions 3A, 3B is not limited. Each of the wiring portions 3A, 3B may be linear or curved. The wiring portions 3A, 3B are arranged in the second direction. In other words, the wiring portions 3A, 3B are arranged in a direction orthogonal to the direction in which the wiring portion 3A extends. The wiring portions 3A, 3B are arranged at intervals in the second direction. In other words, the wiring portions 3A, 3B are arranged at intervals in a direction orthogonal to the direction in which the wiring portion 3A extends. At least a part of the wiring 133A of the conductor pattern 13 described later is arranged on the wiring portion 3A. At least a part of the wiring 133B of the conductor pattern 13 described later is arranged on the wiring portion 3B.

[0057] The interval D between the wiring portion 3A and the wiring portion 3B is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0058] As shown in Figure 2 FIG. 2, the wiring circuit board 1 has a metal support layer 11, a first insulating layer 12 as an example of an insulating layer, a conductor pattern 13, and a second insulating layer 14.

[0059] (1) Metal support layer

[0060] The metal support layer 11 is disposed between the support portions 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A, 3B. That is, each of the wiring portions 3A, 3B has the metal support layer 11. The metal support layer 11 supports the first insulating layer 12, the conductor pattern 13, and the second insulating layer 14. The metal support layer 11 is made of metal. As the material of the metal support layer 11, for example, copper, nickel, cobalt, iron, and their alloys can be cited. As the alloy, for example, a copper alloy can be cited. As the material of the metal support layer 11, a copper alloy is preferably selected.

[0061] (2) The first insulating layer

[0062] The first insulating layer 12 is disposed between the support portions 2 (the first support portion 2A, the second support portion 2B) and the wiring portions 3A, 3B. That is, each of the wiring portions 3A, 3B has the first insulating layer 12. The first insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction of the metal support layer 11. The first insulating layer 12 is disposed on the metal support layer 11. Specifically, the first insulating layer 12 is disposed on the surface on one side in the thickness direction of the metal support layer 11. The first insulating layer 12 is disposed between the metal support layer 11 and the conductor pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the conductor pattern 13. The first insulating layer 12 is made of resin. As the resin, for example, polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester can be cited.

[0063] (3) The conductor pattern

[0064] The conductor pattern 13 is disposed on one side in the thickness direction of the first insulating layer 12. The conductor pattern 13 is disposed on the surface on one side in the thickness direction of the first insulating layer 12. That is, the wirings 133A, 133B are disposed on the first insulating layer 12. The conductor pattern 13 is disposed on the side opposite to the metal support layer 11 with respect to the first insulating layer 12 in the thickness direction. The shape of the conductor pattern 13 is not limited.

[0065] As Figure 1 shown, the conductor pattern 13 has a plurality of terminals 131A, 131B, a plurality of terminals 132A, 132B, and a plurality of wirings 133A, 133B.

[0066] The terminals 131A, 131B are disposed on the first support portion 2A. The terminals 131A, 131B each have a square shape. The terminals 131A, 131B are arranged in the second direction. The terminals 131A, 131B are disposed at intervals in the second direction.

[0067] The terminals 132A and 132B are arranged in the second support portion 2B. The terminals 132A and 132B each have a square shape. The terminals 132A and 132B are arranged in the second direction. The terminals 132A and 132B are arranged at intervals in the second direction.

[0068] The wiring 133A electrically connects the terminal 131A and the terminal 132A. One end portion of the wiring 133A is connected to the terminal 131A. The other end portion of the wiring 133A is connected to the terminal 132A. At least a part of the wiring 133A is arranged in the wiring portion 3A. That is, the wiring portion 3A has the wiring 133A. The wiring 133A extends in the first direction.

[0069] The wiring 133B electrically connects the terminal 131B and the terminal 132B. One end portion of the wiring 133B is connected to the terminal 131B. The other end portion of the wiring 133B is connected to the terminal 132B. At least a part of the wiring 133B is arranged in the wiring portion 3B. That is, the wiring portion 3B has the wiring 133B. The wiring 133B extends in the first direction. The wirings 133A and 133B are arranged in the second direction. The wirings 133A and 133B are arranged at intervals in the second direction.

[0070] (4) Second insulating layer

[0071] As Figure 2 shown, the second insulating layer 14 covers all of the wirings 133A and 133B. The second insulating layer 14 is arranged on the first insulating layer 12 in the thickness direction. In addition, the second insulating layer 14 does not cover the terminals 131A, 131B, 132A, and 132B. The second insulating layer 14 is made of resin. As the resin, for example, polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester can be cited.

[0072] 2. Details of the metal support layer of the wiring portion

[0073] Next, with reference to Figures 3 - 5 , the details of the metal support layer 11 of the wiring portion 3A will be described. In addition, the wiring portion 3B has the same structure as that of the wiring portion 3A. The description of the metal support layer 11 of the wiring portion 3B will be omitted.

[0074] As Figure 3 shown, the thickness T of the metal support layer 11 of the wiring portion 3A is larger than the width W.

[0075] In addition, the "width" refers to the maximum length in the width direction orthogonal to both the extending direction of the wiring portion 3A and the thickness direction. In the present embodiment, the width direction is the same direction as the second direction. The width direction may also be a direction different from the second direction.

[0076] The thickness T of the metal support layer 11 is, for example, 10 μm to 300 μm, preferably 50 μm to 250 μm.

[0077] The metal support layer 11 is thicker than the wiring 133A (see Figure 1 ). The width W of the metal support layer 11 is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0078] In all of the wiring portion 3A, the ratio (T / W) of the thickness T of the metal support layer 11 to the width W of the metal support layer 11 is, for example, 2 or more, preferably 3 or more. Hereinafter, the ratio (T / W) is defined as the aspect ratio of the metal support layer 11.

[0079] If the aspect ratio (T / W) of the metal support layer 11 is equal to or greater than the above lower limit value, the rigidity in the thickness direction of the wiring portion 3A can be ensured.

[0080] The aspect ratio (T / W) of the metal support layer 11 is, for example, 30 or less, preferably 10 or less.

[0081] The aspect ratio (T / W) of the metal support layer 11 may also be 2 to 30, or 3 to 10.

[0082] As Figure 4 shown, the metal support layer 11 of the wiring portion 3A has a first end portion 111, a second end portion 112, a main body portion 113, a first tapered portion 114, and a second tapered portion 115.

[0083] (1) First end portion

[0084] The first end portion 111 is connected to the first support portion 2A. As Figure 5 shown, the first end portion 111 is disposed between the first support portion 2A and the first tapered portion 114 in the first direction. One edge E in the width direction of the first end portion 111 bends toward one side in the width direction as it goes from the first tapered portion 114 toward the first support portion 2A. The other edge (not shown) in the width direction of the first end portion 111 bends toward the other side in the width direction as it goes from the first tapered portion 114 toward the first support portion 2A.

[0085] The length L of the first end portion 111 in the first direction is, for example, 200 μm or less, preferably 100 μm or less.

[0086] (2) Second end portion

[0087] As Figure 4As shown, the second end portion 112 is connected to the second support portion 2B. The second end portion 112 is disposed between the second support portion 2B and the second tapered portion 115 in the first direction. One edge (not shown) in the width direction of the second end portion 112 bends toward one side in the width direction as it goes from the second tapered portion 115 toward the second support portion 2B. The other edge (not shown) in the width direction of the second end portion 112 bends toward the other side in the width direction as it goes from the second tapered portion 115 toward the second support portion 2B.

[0088] The length of the second end portion 112 in the first direction is, for example, 200 μm or less, preferably 100 μm or less.

[0089] (3) Main body portion

[0090] The main body portion 113 is disposed between the first end portion 111 and the second end portion 112 in the first direction. The main body portion 113 is disposed separately from the first end portion 111 and the second end portion 112 in the first direction. The main body portion 113 extends in the first direction. The main body portion 113 does not have a taper. Specifically, one edge E1 in the width direction of the main body portion 113 and the other edge E2 in the width direction of the main body portion 113 extend substantially parallel to each other.

[0091] (4) First tapered portion

[0092] The first tapered portion 114 is disposed between the first end portion 111 and the main body portion 113 in the first direction. The width of the first tapered portion 114 expands as it goes from the main body portion 113 toward the first end portion 111. Specifically, one end portion of the first tapered portion 114 in the first direction is connected to the first end portion 111 (refer to Figure 5 ). The other end portion of the first tapered portion 114 in the first direction is connected to the main body portion 113. The width W11 of one end portion of the first tapered portion 114 in the first direction is wider than the width W12 of the other end portion of the first tapered portion 114 in the first direction. The width W12 is the same as the width W1 of the main body portion 113. One edge E11 in the width direction of the first tapered portion 114 and the other edge E12 in the width direction of the first tapered portion 114 extend away from each other as they go from the main body portion 113 toward the first end portion 11. Both edges E11 and E12 in the width direction of the first tapered portion 114 are straight lines.

[0093] In the first direction, the length L1 of the first tapered portion 114 is, for example, 30% or less, preferably 20% or less, of the total length L0 of the wiring portion 3A. If the length L1 of the first tapered portion 114 is below the above upper limit value, a decrease in the flexibility of the wiring portion 3A can be suppressed. The length L1 of the first tapered portion 114 is, for example, 5% or more, preferably 10% or more, of the total length L0 of the wiring portion 3A. If the length L1 of the first tapered portion 114 is above the above lower limit value, the rigidity near one end portion of the wiring portion 3A in the first direction can be increased.

[0094] The length L1 of the first tapered portion 114 may also be 5% to 30%, or 10% to 20%, of the total length L0 of the wiring portion 3A.

[0095] The taper of the first tapered portion 114 (= (W11 - W12) / L1) is, for example, 0.0010 or more, preferably 0.0050 or more. If the taper of the first tapered portion 114 is above the above lower limit value, the rigidity near one end portion of the wiring portion 3A in the first direction can be increased. The taper of the first tapered portion 114 is, for example, 0.0300 or less, preferably 0.0200 or less. If the taper of the first tapered portion 114 is below the above upper limit value, a decrease in the flexibility of the wiring portion 3A can be suppressed.

[0096] The taper of the first tapered portion 114 may also be 0.0010 to 0.0300, or 0.0050 to 0.0200.

[0097] The ratio (W11 / W0) of the width W11 of one end portion of the first tapered portion 114 in the first direction to the width W0 of the wiring 133A (see Figure 1 ) is, for example, 20 or less, preferably 15 or less. The ratio (W11 / W0) is, for example, 0.1 or more.

[0098] (5) Second tapered portion

[0099] The second tapered portion 115 is disposed between the second end portion 112 and the main body portion 113 in the first direction. The width of the second tapered portion 115 expands as it goes from the main body portion 113 toward the second end portion 112. Specifically, one end portion of the second tapered portion 115 in the first direction is connected to the main body portion 113. The other end portion of the second tapered portion 115 in the first direction is connected to the second end portion 112. The width W21 of the other end portion of the second tapered portion 115 in the first direction is wider than the width W22 of one end portion of the second tapered portion 115 in the first direction. The width W22 is the same as the width W1 of the main body portion 113. One edge E21 in the width direction of the second tapered portion 115 and the other edge E22 in the width direction of the second tapered portion 115 extend away from each other as they go from the main body portion 113 toward the second end portion 112. The edges E21 and E22 in the width direction of the second tapered portion 115 are both straight lines.

[0100] In the first direction, the length L2 of the second tapered portion 115 is, for example, 30% or less, preferably 20% or less, of the total length L0 of the wiring portion 3A. If the length L2 of the second tapered portion 115 is below the above upper limit value, the reduction in the flexibility of the wiring portion 3A can be suppressed. The length L2 of the second tapered portion 115 is, for example, 5% or more, preferably 10% or more, of the total length L0 of the wiring portion 3A. If the length L2 of the second tapered portion 115 is above the above lower limit value, the rigidity near the other end portion of the wiring portion 3A in the first direction can be increased.

[0101] The length L2 of the second tapered portion 115 can also be 5% - 30%, or 10% - 20%, of the total length L0 of the wiring portion 3A.

[0102] The taper (=(W21 - W22) / L2) of the second tapered portion 115 is, for example, 0.0010 or more, preferably 0.0050 or more. If the taper of the second tapered portion 115 is above the above lower limit value, the rigidity near the other end portion of the wiring portion 3A in the first direction can be increased. The taper of the second tapered portion 115 is, for example, 0.0300 or less, preferably 0.0200 or less. If the taper of the second tapered portion 115 is below the above upper limit value, the reduction in the flexibility of the wiring portion 3A can be suppressed.

[0103] The taper of the second tapered portion 115 can also be 0.0010 - 0.0300, or 0.0050 - 0.0200.

[0104] The ratio (W21 / W0) of the width W21 of the other end portion of the second tapered portion 115 in the first direction to the width W0 of the wiring 133A (refer to Figure 1 ) is, for example, 20 or less, preferably 15 or less. The ratio (W21 / W0) is, for example, 0.1 or more.

[0105] 2. Function and Effect

[0106] (1) According to the wiring circuit board 1, as Figure 4 shown, the metal support layer 11 of the wiring portion 3A has a first tapered portion 114 that expands as it approaches the first end portion 111 connected to the first support portion 2A, and a second tapered portion 115 that expands as it approaches the second end portion 112 connected to the second support portion 2B, near the first end portion 111 and the second end portion 112 respectively.

[0107] Therefore, the rigidity near one end of the wiring portion 3A can be improved by using the first tapered portion 114, and the rigidity near the other end of the wiring portion 3A can be improved by using the second tapered portion 115.

[0108] Thus, when the wiring portion 3A moves, stress concentration near the end of the wiring portion 3A on the wiring 133A (refer to Figure 1 ) can be suppressed. In other words, the stress of the wiring 133A disposed near the end of the wiring portion 3A can be alleviated.

[0109] As a result, cracks generated in the wiring 133A near the end of the wiring portion 3A can be suppressed.

[0110] (2) According to the wiring circuit board 1, as Figure 4 shown, in the first direction, the lengths L1 of the first tapered portion 114 and L2 of the second tapered portion 115 are each 30% or less of the total length L0 of the wiring portion 3A.

[0111] Therefore, a decrease in the flexibility of the wiring portion 3A can be suppressed.

[0112] (3) According to the wiring circuit board 1, as Figure 4 shown, the taper of the first tapered portion 114 is 0.0010 or more.

[0113] Therefore, the rigidity near one end of the wiring portion 3A can be improved.

[0114] In addition, the taper of the second tapered portion 115 is 0.0010 or more.

[0115] Therefore, the rigidity near the other end of the wiring portion 3A can be improved.

[0116] 3. Variation Example

[0117] Next, a variation example will be described. In the variation example, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

[0118] (1) As Figure 6As shown, the first end portion 111 may also extend straight in the first direction. The length L of the first end portion 111 may also exceed 100 μm.

[0119] (2) As Figure 7A and Figure 7B shown, the edges E11, E12 in the width direction of the first tapered portion 114 may also include curves.

[0120] For example, as Figure 7A shown, the edges E11, E12 may also bend outward in the width direction in an exponential function shape as they approach the first end portion 111.

[0121] In addition, as Figure 7B shown, the edges E11, E12 may also bulge outward in the width direction in a parabolic shape as they approach the first end portion 111.

[0122] The second tapered portion 115 (see Figure 4 ) is the same. That is, the edges E21, E22 in the width direction of the second tapered portion 115 may also include curves.

[0123] (3) As Figure 8 shown, the wiring portions 3A, 3B may each have a plurality of wirings. Specifically, the wiring circuit board 1 has a conductor pattern 20 instead of the conductor pattern 13. The conductor pattern 20 has a plurality of terminals 201A, 201B, 201C, 201D, a plurality of terminals 202A, 202B, 202C, 202D, and a plurality of wirings 203A, 203B, 203C, 203D.

[0124] The terminals 201A, 201B, 201C, 201D are arranged in the first support portion 2A. The terminals 201A, 201B, 201C, 201D are arranged in the second direction. The terminals 201A, 201B, 201C, 201D are arranged at intervals from each other in the second direction.

[0125] The terminals 202A, 202B, 202C, 202D are arranged in the second support portion 2B. The terminals 202A, 202B, 202C, 202D are arranged in the second direction. The terminals 202A, 202B, 202C, 202D are arranged at intervals from each other in the second direction.

[0126] The wiring 203A electrically connects the terminal 201A and the terminal 202A. The wiring 203B electrically connects the terminal 201B and the terminal 202B. The wirings 203A, 203B are arranged in the second direction. The wirings 203A, 203B are arranged at intervals from each other in the second direction. The wiring 203A and the wiring 203B are arranged in the wiring portion 3A.

[0127] The wiring 203C electrically connects the terminal 201C and the terminal 202C. The wiring 203D electrically connects the terminal 201D and the terminal 202D. The wirings 203C and 203D are arranged in the second direction. The wirings 203C and 203D are arranged at intervals from each other in the second direction. The wirings 203C and 203D are arranged in the wiring portion 3B.

[0128] According to this modification example, it is possible to suppress cracks from occurring in all of the wirings 203A, 203B, 203C, and 203D provided in the wiring portion 3A or the wiring portion 3B.

[0129] (4) The wiring portion 3A may also have a plurality of conductor layers (for example, the first conductor layer 30A and the second conductor layer 30B).

[0130] For example, as Figure 9 shown, the conductor pattern 30 may also have the first conductor layer 30A and the second conductor layer 30B. In other words, the terminals 301A, 302A, and the wiring 303A each have the first conductor layer 30A and the second conductor layer 30B. The first conductor layer 30A is arranged on the first insulating layer 12. The second conductor layer 30B is arranged on the first conductor layer 30A.

[0131] (5) As Figure 10 shown, it may also be that the wiring portion 3A has an intermediate insulating layer 41 between the first conductor layer 30A and the second conductor layer 30B. The intermediate insulating layer 41 is arranged on the first insulating layer 12. The intermediate insulating layer 41 covers the first conductor layer 30A. The second insulating layer 14 is arranged on the intermediate insulating layer 41. The second insulating layer 14 covers the second conductor layer 30B. The second conductor layer 30B is, for example, a signal wiring, and the first conductor layer 30A is, for example, a shielding conductor layer.

[0132] In this modification example, as in the above-described embodiment, the metal support layer 11 of the wiring portion 3A has the first end portion 111, the second end portion 112, the main body portion 113, the first tapered portion 114, and the second tapered portion 115.

[0133] (6) As Figure 11 shown, the wiring 133A may also have the first portion 1331, the second portion 1332, the third portion 1333, the fourth portion 1334, and the fifth portion 1335.

[0134] The first portion 1331, the second portion 1332, and the third portion 1333 are arranged in the wiring portion 3A. The first portion 1331, the second portion 1332, and the third portion 1333 are arranged between the first support portion 2A and the second support portion 2B in the first direction.

[0135] The first part 1331 is disposed at one end portion of the wiring portion 3A and its vicinity in the first direction. The first part 1331 overlaps with the first tapered portion 114 of the metal support layer 11. The first part 1331 is disposed between the first support portion 2A and the third part 1333 in the first direction. The first part 1331 is connected to the first support portion 2A. Specifically, one end portion of the first part 1331 in the first direction is connected to the fourth part 1334 of the wiring 133A. The first part 1331 is thinner than the third part 1333.

[0136] The second part 1332 is disposed at the other end portion of the wiring portion 3A and its vicinity in the first direction. The second part 1332 overlaps with the second tapered portion 115 of the metal support layer 11. The second part 1332 is disposed between the second support portion 2B and the third part 1333 in the first direction. The second part 1332 is connected to the second support portion 2B. Specifically, the other end portion of the second part 1332 in the first direction is connected to the fifth part 1335 of the wiring 133A. The second part 1332 is thinner than the third part 1333. The width of the second part 1332 may also be the same as the width of the first part 1331.

[0137] The third part 1333 is disposed between the first part 1331 and the second part 1332 in the first direction. The third part 1333 overlaps with the main body portion 113 of the metal support layer 11. One end portion of the third part 1333 in the first direction is connected to the first part 1331. The other end portion of the third part 1333 in the first direction is connected to the second part 1332.

[0138] The fourth part 1334 is disposed at the first support portion 2A. One end portion of the fourth part 1334 in the first direction is connected to the terminal 131A. The other end portion of the fourth part 1334 in the first direction is connected to the first part 1331. The width of the fourth part 1334 may also be the same as the width of the third part 1333.

[0139] The fifth part 1335 is disposed at the second support portion 2B. One end portion of the fifth part 1335 in the first direction is connected to the second part 1332. The other end portion of the fifth part 1335 in the first direction is connected to the terminal 132A. The width of the fifth part 1335 may also be the same as the width of the third part 1333.

[0140] In this modification, near one end portion of the wiring portion 3A, the metal support layer 11 has the first tapered portion 114, and the wiring 133A has the first part 1331.

[0141] In addition, near the other end portion of the wiring portion 3A, the metal support layer 11 has the second tapered portion 115, and the wiring 133A has the second part 1332.

[0142] The first part 1331 and the second part 1332 are thinner than the third part 1333.

[0143] Therefore, when the wiring portion 3A is moved, stress concentration near the end of the wiring portion 3A on the first part 1331 and the second part 1332 can be further suppressed.

[0144] As a result, generation of cracks in the wiring 133A near the end of the wiring portion 3A can be further suppressed.

[0145] (7) The wiring circuit board 1 may also have three or more support portions 2. For example, as Figure 12 shown, the wiring circuit board 1 may have, in addition to the above-described first support portion 2A, second support portion 2B, and a plurality of wiring portions 3A, 3B, a third support portion 2C and a plurality of wiring portions 50A, 50B.

[0146] In this case, the terminals 132A, 132B are not arranged on the second support portion 2B but on the third support portion 2C. The wirings 133A, 133B extend from the first support portion 2A via the second support portion 2B to the third support portion 2C. Intermediate portions of the wirings 133A, 133B are arranged on the second support portion 2B.

[0147] The third support portion 2C is arranged on the side opposite to the first support portion 2A with respect to the second support portion 2B in the first direction. In other words, the second support portion 2B is arranged between the first support portion 2A and the third support portion 2C in the first direction. The third support portion 2C extends in the second direction. The third support portion 2C supports the other end portions of the wiring portions 50A, 50B in the first direction. In addition, one end portions of the wiring portions 50A, 50B in the first direction are supported by the second support portion 2B.

[0148] The wiring portion 50A has the same structure as that of the wiring portion 3A. Specifically, the metal support layer 11 of the wiring portion 50A has the first end portion 111, the second end portion 112, the main body portion 113, the first tapered portion 114, and the second tapered portion 115, similarly to the metal support layer 11 of the wiring portion 3A.

[0149] The first end portion 111 of the wiring portion 50A is arranged at one end portion of the wiring portion 50A in the first direction. The first end portion 111 of the wiring portion 50A is connected to the second support portion 2B in the first direction. The first end portion 111 of the wiring portion 50A is arranged between the second support portion 2B and the first tapered portion 114 in the first direction.

[0150] The second end portion 112 of the wiring portion 50A is arranged at the other end portion of the wiring portion 50A in the first direction. The second end portion 112 of the wiring portion 50A is connected to the third support portion 2C in the first direction. The second end portion 112 of the wiring portion 50A is arranged between the third support portion 2C and the second tapered portion 115 in the first direction.

[0151] In this modification example, the intermediate portions of the wirings 133A and 133B can be supported by the second support portion 2B.

[0152] (8) In the above-described embodiment, the wiring circuit board 1 includes the conductor pattern 13 on one side in the thickness direction of the metal support layer 11 and does not include the conductor pattern 13 on the other side in the thickness direction of the metal support layer 11. In this regard, it may also be that the wiring circuit board 1 also includes the conductor pattern 13 on the other side in the thickness direction of the metal support layer 11. That is to say, it may also be that the wiring circuit board 1 includes: a first conductor pattern arranged on one side in the thickness direction of the metal support layer 11; and a second conductor pattern arranged on the other side in the thickness direction of the metal support layer 11.

[0153] (9) In the modification examples (1) to (8), the same effects as those of the above-described embodiment can also be obtained.

[0154] In addition, the above invention is provided as an illustrative embodiment of the present invention, which is merely illustrative and is not to be construed in a limiting sense. Modification examples of the present invention that are obvious to those skilled in the art are included in the foregoing claims.

Claims

1. A wiring circuit board, wherein, The wiring circuit board includes: a plurality of wiring portions that extend in a first direction and are arranged at intervals from each other; and a first support portion that supports one end portion of each of the plurality of wiring portions in the first direction, each of the plurality of wiring portions has: a metal support layer; an insulating layer disposed on the metal support layer; and a wiring disposed on the insulating layer and extending in the first direction, the metal support layer of the wiring portion has: a first end portion connected to the first support portion; a main body portion disposed separately from the first end portion; and a first tapered portion disposed between the first end portion and the main body portion, the width of the first tapered portion expands as it goes from the main body portion toward the first end portion.

2. The wiring circuit board according to claim 1, wherein in the first direction, the length of the first tapered portion is 30% or less of the total length of the wiring portion.

3. The wiring circuit board according to claim 1, wherein the length of the first end portion in the first direction is 200 μm or less.

4. The wiring circuit board according to claim 1, wherein the taper of the first tapered portion is 0.0010 or more.

5. The wiring circuit board according to claim 1, wherein the edge in the width direction of the first tapered portion includes a curve.

6. The wiring circuit board according to claim 1, wherein the edge in the width direction of the first tapered portion is a straight line.

7. The wiring circuit board according to any one of claims 1 to 6, wherein the wiring circuit board further includes a second support portion that supports the other end portion of each of the plurality of wiring portions in the first direction, the metal support layer of the wiring portion further has: a second end portion disposed separately from the main body portion and connected to the second support portion; and a second tapered portion disposed between the second end portion and the main body portion, the width of the second tapered portion expands as it goes from the main body portion toward the second end portion.

8. The wiring circuit board according to claim 7, wherein in the first direction, the length of the second tapered portion is 30% or less of the total length of the wiring portion.

9. The wiring circuit board according to claim 7, wherein the length of the second end portion in the first direction is 200 μm or less.

10. The wiring circuit board according to claim 7, wherein the taper of the second tapered portion is 0.0010 or more.

11. The wiring circuit board according to claim 7, wherein the edge in the width direction of the second tapered portion includes a curve.

12. The wiring circuit board according to claim 7, wherein the edge in the width direction of the second tapered portion is a straight line.

13. The wiring circuit board according to claim 1, wherein each of the plurality of wiring portions has a plurality of wirings.

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