Wiring board with built-in component and method for manufacturing wiring board with built-in component

Abstract

The invention provides a wiring board with a built-in component and a method for manufacturing the wiring board with the built-in component, and productivity of the wiring board with the built-in component is improved. This wiring board with a built-in component is provided with: a core substrate having an opening; a plurality of electronic components which are inserted into the inner side of the opening part in a mutually separated state; a laminated portion disposed on the core substrate and on the electronic component; and a first resin portion that fills the opening portion, in which the plurality of electronic components are connected by a second resin portion such that the heights of the plurality of electronic components are different from each other and the terminal surfaces of the plurality of electronic components are on the same plane.

Description

Technical Field

[0001] The present invention relates to a component-embedded wiring board and a method for manufacturing the component-embedded wiring board. Background Art

[0002] In Patent Document 1, there is disclosed a wiring board having: a core substrate having an opening; a plurality of electronic components disposed in the opening with a gap therebetween in a separated state; and a laminated portion disposed on the core substrate and on the electronic components, wherein the gap is filled with resin.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-147049

[0004] In a structure in which a plurality of electronic components are inserted into the opening, a relatively large amount of first resin for filling the opening is required. Summary of the Invention

[0005] The component-embedded wiring board of the present invention has: a core substrate having an opening; a plurality of electronic components inserted into the inside of the opening in a separated state; a laminated portion disposed on the core substrate and on the electronic components; and a first resin portion filling the opening, wherein the plurality of electronic components are connected by a second resin portion in such a manner that their heights are different from each other and their terminal surfaces are in the same plane.

[0006] In addition, the method for manufacturing the component-embedded wiring board of the present invention includes the steps of: preparing a plurality of electronic components having different heights; inserting the plurality of electronic components into the opening of the core substrate from the terminal surface side of each electronic component; filling the opening with a first resin portion; and laminating a laminated portion on the core substrate, wherein the step of preparing the plurality of electronic components includes the step of connecting the electronic components to each other by a second resin portion so that their terminal surfaces are in the same plane.

[0007] According to the component-embedded wiring board and the method for manufacturing the component-embedded wiring board of the present invention, since the space in the opening is occupied by the second resin portion that connects the electronic components to each other, the amount of the first resin for filling the opening can be reduced as compared with a structure in which a plurality of electronic components are individually inserted into the opening and the space between the electronic components is filled with the first resin portion. Brief Description of the Drawings

[0008] Figure 1 It is a cross-sectional view showing a part of the component-embedded wiring board according to an embodiment of the present invention cut out.

[0009] Figure 2 It is a cross-sectional view showing a core insulating layer according to an embodiment of the present invention.

[0010] Figure 3It is a cross-sectional view of a state where the manufacturing of the core substrate is started by providing an opening in the core insulating layer of an embodiment of the present invention.

[0011] Figure 4 It is a cross-sectional view showing a state where a connected first component and a second component are arranged in the opening of an embodiment of the present invention.

[0012] Figure 5 It is a cross-sectional view of a state where an embedding resin is embedded in the gap between the connected first component and second component and the core insulating layer in the opening of an embodiment of the present invention.

[0013] Figure 6 It is a cross-sectional view of a state where an interlayer insulating layer is laminated as a laminated portion on the structure after inverting the core substrate of an embodiment of the present invention upside down.

[0014] Figure 7 (a) of is a front view showing a state where multiple electronic components of an embodiment of the present invention are arranged in multiple sets on a chip component, Figure 7 (b) of is a front view showing a state where multiple electronic components are connected by a molded resin portion, Figure 7 (c) of is a front view showing a state where the connected multiple electronic components are divided into second manufacturing units.

[0015] Reference Numeral Explanation

[0016] 10: Component-embedded wiring board; 20: Core substrate; 21, 22: Laminated portions; 27: Opening; 30: Insulating substrate; 41, 42: Resin layers; 44: Molded resin portion (an example of a second resin portion); 46: Embedded resin portion (an example of a first resin portion); 50: Interlayer insulating layer (an example of an insulating layer); 60: Via conductor; 70: Core insulating layer; 90: Multiple electronic components (connected components); 92: First component; 92B: Bottom surface; 92F: Top surface; 94: Terminal; 96: Second component; 96B: Bottom surface; 96F: Top surface; 98, 99: Terminals; DL: Cutting position; S: Chip component; U1: First manufacturing unit (an example of a first unit); U2: Second manufacturing unit (an example of a second unit). Detailed Description of the Embodiment

[0017] Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0018] Figure 1 It is a cross-sectional view showing a part of the component-embedded wiring board 10 of an embodiment of the present invention (hereinafter referred to as "this embodiment") cut out.

[0019] As Figure 1As shown, the component-integrated wiring board 10 of the present embodiment has: a core substrate 20 having a first surface (upper surface or front side) 20F and a second surface (lower surface or back side) 20B on the side opposite to the first surface; a stacked portion 22 formed on the first surface side of the core substrate 20; and a stacked portion 21 formed on the second surface side of the core substrate 20.

[0020] Here, the upper surface or front side refers to the upper side surface in the figure among the two surfaces constituting the core substrate 20, and the lower surface or back side refers to the lower side surface in the figure among the two surfaces constituting the core substrate 20. And in the following description, in the thickness direction of the component-integrated wiring board 10, for convenience, the side far from the core insulating layer 70 is referred to as the upper side, upper direction or up, and the side close to the core insulating layer 70 is referred to as the lower side, lower direction or down for explanation.

[0021] Moreover, the stacked portions 21 and 22 each have a plurality of stacked interlayer insulating layers 50, a plurality of conductor patterns (i.e., pads) 81 and 82 formed between the plurality of interlayer insulating layers 50, and a plurality of via conductors 60 formed so as to penetrate the interlayer insulating layers 50. The interlayer insulating layer 50 is an example of an insulating layer.

[0022] Moreover, the core substrate 20 has a structure in which via conductors 60, through-hole conductors 36, conductor patterns 81 and 82, and an opening 27 are formed in the core insulating layer 70. That is, the core substrate 20 has an opening 27. As Figure 2 shown, the core insulating layer 70 is composed of an insulating substrate 30 and resin layers 41 and 42 formed on the first surface and the second surface on the side opposite to the first surface of the insulating substrate 30, respectively. The resin layers 41 and 42 are formed using thermosetting resin sheets, such as prepregs. In the present embodiment, a reinforcing material 25 is included inside the insulating substrate 30 to ensure the strength of the entire core substrate 20, but the reinforcing material 25 may not be included inside the insulating substrate 30.

[0023] As Figure 1 shown, the through-hole conductor 36 is formed by forming a metal coating such as copper plating on the inner wall of the through-hole of the insulating substrate 30, filling the inside with resin, and then performing cover plating on the end face.

[0024] And a plurality of conductor patterns 81 and 82 as conductor layers are respectively formed on the resin layers 41 and 42. These plurality of conductor patterns 81 and 82 are respectively formed by plating on the resin layer 42 formed on the first surface of the insulating substrate 30 and the resin layer 41 formed on the second surface.

[0025] Via conductors 60 are formed on the upper surface side and the back surface side of the through-hole conductor 36, respectively. These via conductors 60 are formed by filling plating in through-holes formed in the resin layers 41 and 42, respectively.

[0026] Moreover, a part of the conductor pattern 81 and a part of the conductor pattern 82 are configured to be electrically connected via the via conductor 60, the through-hole conductor 36, and conductor patterns on both sides of an insulating substrate 30 (not shown).

[0027] As Figure 1 and Figure 3 shown, the opening 27 penetrates the core substrate 20 from the first surface (the surface on the upper surface side of the resin layer 42) 20F to the second surface (the surface on the lower surface side of the resin layer 41) 20B by an amount equal to the height H of the core substrate 20. A plurality of electronic components 90 are inserted inside the opening 27. The opening 27 is filled with a molding resin and a buried resin in a state where a plurality of electronic components 90 are inserted, and the molding resin portion 44 and the buried resin portion 46 are formed by solidifying each resin. The buried resin portion 46 and the molding resin portion 44 are examples of a first resin portion and a second resin portion, respectively. The buried resin portion 46 is formed of, for example, an epoxy resin as the buried resin. The upper and lower surfaces (the first surface 20F and the second surface 20B) of the core substrate 20 are in contact with the interlayer insulating layer 50, respectively. The buried resin portion 46 is the same resin as the interlayer insulating layer 50 of the stacked portions 21 and 22.

[0028] The plurality of electronic components 90 include at least a first component 92 and a second component 96. The plurality of electronic components 90 are, for example, passive components such as capacitors and inductors, or semiconductor elements.

[0029] As Figure 4 shown, the first component 92 is a box shape having a rectangular cross-section, having a bottom surface 92B and a top surface 92F. The top surface 92F is located at a first height H1 from the bottom surface 92B and is formed along the bottom surface 92B. In addition, the top surface 92F is the opposite surface of the bottom surface 92B. A pair of terminals 94 protruding downward are disposed on the bottom surface 92B of the first component 92, but no terminals are disposed on the top surface 92F. The terminals 94 are disposed in the same plane as the first surface 20F, and the terminals 94 are electrically connected to the via conductor 60.

[0030] The second component 96 is a box-shaped one having a rectangular cross-section, with a bottom surface 96B and a top surface 96F. The top surface 96F is at a second height H2 from the bottom surface 96B and is formed along the bottom surface 96B. In the present embodiment, the height of the second height H2 is higher than the first height, that is, the heights of the first component 92 and the second component 96 are different from each other. Further, the height of the second height H2 is lower than the height (thickness) H of the core substrate, that is, it is a height that is housed inside the core substrate. In addition, the second component 96 is provided with a pair of terminals 98 protruding downward from the bottom surface 96B and a pair of terminals 99 protruding upward from the top surface 96F. In the present embodiment, the terminal surface 98A of the terminal 98 is arranged in the same plane as the first surface 20F, and the terminal 98 is electrically connected to the via conductor 60. Further, the terminal 99 is electrically connected to the via conductor 60 on the second surface 20B. In the present embodiment, the terminal surface 99A of the terminal 99 is arranged in the same plane as the second surface 20B, but the terminal surface 99A may not be in the same plane as the second surface 20B. However, even when the terminal surface 99A is not in the same plane as the second surface 20B, the case where the second height H2 is greater than the height H of the core substrate 20 is not included.

[0031] As Figure 4 shown, the first component 92 and the second component 96 are inserted into the opening 27 with a gap D therebetween in the left-right direction in the figure and in a state of being connected by the box-shaped molding resin portion 44. In the left-right direction in the figure, the molding resin portions 44 are respectively arranged on the left side of the first component 92 (the side opposite to the gap D with respect to the first component 92) and on the right side of the second component 96 (the side opposite to the gap D with respect to the second component 96). That is, the left side of the first component 92 and the right side of the second component 96 are respectively covered by the molding resin portions 44. Although not shown in the figure, when viewed from the up-down direction, the molding resin portion 44 is formed so as to surround the peripheries of the first component 92 and the second component 96. The first component 92 and the second component 96 connected by the molding resin portion 44 are an example of connecting electronic components. Hereinafter, a plurality of electronic components 90 connected by the molding resin portion 44 will also be simply referred to as "connected components 90".

[0032] Next, a method for manufacturing the component-embedded wiring board 10 of the present embodiment will be described.

[0033] (Preparation of a plurality of electronic components)

[0034] First, prepare a plurality of electronic components 90 with different heights. The step of preparing the plurality of electronic components 90 includes the following steps: connecting the electronic components 90 to each other by molding the resin part 44 so that their terminal surfaces are in the same plane. Specifically, prepare a plurality of electronic components 90 in a state where the terminal surface 94A of the first component 92 and the terminal surface 98A of the second component 96 are in the same plane and connected by the molding resin part 44.

[0035] (Cavity formation)

[0036] As Figure 3 shown, an opening 27 is formed in the core substrate 20.

[0037] Next, as Figure 4 shown, a bonding tape T is pasted on the end surface of the conductor pattern 82 of the core substrate 20 with the bonding surface facing the conductor pattern 82. In addition, the connecting component 90 is inserted into the inside of the opening 27 from the side of the terminal surface 94A and the side of the terminal surface 98A so as to be separated by a predetermined gap GP on both sides in the left - right direction in the figure. When inserting into the opening 27, the connecting component 90 is inserted in a plane parallel to the bonding surface of the bonding tape T.

[0038] As Figure 5 shown, the embedding resin is embedded in the gap GP. By solidifying the embedding resin, an embedding resin part 46 is formed, thereby fixing the connecting component 90 inside the opening 27. In the present embodiment, after forming the embedding resin part 46 at a position above the second surface 20B of the core substrate 20, the embedding resin part 46 is polished to the second surface 20B (not shown).

[0039] (Stacking the laminate parts 21, 20 on the core substrate 20)

[0040] Next, the bonding tape T is peeled off from the core substrate 20 where the connecting component 90 is fixed, and a substrate with the core substrate 20 turned upside down is prepared. In addition, Figure 6 Unlike Figures 2 to 5 , the vertical positions of the first surface 20F and the second surface 20B are reversed. As Figure 6 shown, an interlayer insulating layer 50 is stacked on the first surface 20F, the second surface 20B of the core substrate 20, and the second component 96. After stacking, the terminal surface 94A of the first component 92, the terminal surfaces 98A, 99A of the second component 96 are respectively electrically connected to the via conductor 60. In addition, the via conductor 60 and the conductor patterns 81, 82 are integrally formed.

[0041] Above, according to the product specifications, a plurality of interlayer insulating layers 50 are stacked. Finally, as the laminate parts 21, 22, together with the core substrate 20, a component - embedded wiring board 10 is manufactured.

[0042] (Offline operation of multiple electronic components 90)

[0043] As shown in Figure 7 , at the stage before being inserted into the core substrate 20, multiple electronic components 90 are connected. In the present embodiment, they are connected by a manufacturing line different from the manufacturing line of the core substrate 20 (offline), but these manufacturing lines may also be the same.

[0044] As shown in Figure 7 (a), a plurality of first components 92 and a plurality of second components 96 included in the multiple electronic components 90 are arranged on the upper surface SA of a sheet-like component S (substrate, double-sided tape pasted on a wafer) formed in a sheet shape such that the respective terminal surfaces 94A, 98A are in the same plane. In the present embodiment, one first component 92 and one second component 96 are arranged with a gap D therebetween (refer to Figure 4 ) and the one second component 96 has a predetermined gap from other first components 92. That is, the first components 92 and the second components 96 are arranged offset from each other.

[0045] As shown in Figure 7 (b), the multiple electronic components 90 arranged on the sheet-like component S are sealed with a molding resin portion 44 as a first manufacturing unit U1. The first manufacturing unit U1 is an example of a first unit. The first manufacturing unit U1 is determined by a cutting (singulation) position DL. In the sealing of the multiple electronic components 90, a mold frame (not shown) is provided outside the multiple electronic components 90, and the liquid molding resin is caused to flow into the inside of the mold frame to form the molding resin portion 44. The amount of the molding resin flowing into the mold frame (not shown) is set to a level that connects the first component 92 and the second component 96. In the present embodiment, the molding resin flows into the mold frame (not shown) until it is above the first height H1 of the first component 92 and below the second height H2 of the second component 96.

[0046] As shown in Figure 7 (c), the first manufacturing unit U1 is cut at the cutting position DL into a manufacturing unit smaller than the first manufacturing unit U1, that is, a second manufacturing unit U2. The second manufacturing unit U2 is an example of a second unit. By inserting the cut connecting component 90 into the opening 27 of the core substrate 20, the connecting component 90 is used for the manufacture of the component-embedded wiring board 10. In the present embodiment, the sheet-like component S is peeled off from the connecting component 90, and the connecting component 90 is inserted into the opening 27, thereby being used for the manufacture of the component-embedded wiring board 10.

[0047] (Function and effect)

[0048] The component-embedded wiring board 10 of the present embodiment includes: a core substrate 20 having an opening 27; a plurality of electronic components 90 inserted into the inside of the opening 27 in a separated state; lamination portions 21 and 22 disposed on the core substrate 20 and the electronic components 90; and an embedded resin portion 46 filling the opening 27. The plurality of electronic components 90 are connected by a molding resin portion 44 such that their heights are different from each other and their terminal surfaces 94A and 98A are in the same plane. According to this structure, since the space in the opening 27 is occupied by the molding resin portion 44 that connects the electronic components 90 to each other, the amount of the embedded resin filling the opening 27 is reduced compared to the structure in which the plurality of electronic components 90 are individually inserted into the opening 27 and the space between the electronic components 90 is filled with the embedded resin portion 46.

[0049] Next, in the component-embedded wiring board 10 of the present embodiment, the plurality of electronic components 90 include a first component 92 having a first height H1 and a second component having a second height H2 higher than the first height H1. Terminals are not disposed on the top surface 92F, and terminals 99 are disposed on the top surface 96F. That is, the plurality of electronic components 90 include: a first component 92 having a first height H1 from the bottom surface 92B to the top surface 92F, and no terminals are disposed on the top surface 92F; and a second component 96 having a second height H2 from the bottom surface 96B to the top surface 96F, higher than the first height H1, and terminals 99 are disposed on the top surface 96F. According to this structure, poor connection with the core substrate 20 in the first component 92 having a height lower than that of the second component 96 can be avoided.

[0050] Moreover, in the component-embedded wiring board 10 of the present embodiment, the lamination portions 21 and 22 have an interlayer insulating layer 50 on the core substrate 20 side, and the embedded resin portion 46 is the same resin as the interlayer insulating layer 50. Therefore, the interlayer insulation property is improved compared to the structure in which the resin of the embedded resin portion 46 is different from the resin of the interlayer insulating layer 50 in the lamination portions 21 and 22.

[0051] In addition, in the manufacturing method of the component-embedded wiring board 10 of the present embodiment, the manufacturing method of the component-embedded wiring board 10 includes the following steps: preparing a plurality of electronic components 90 with different heights; inserting the plurality of electronic components 90 from the terminal surfaces 94A of the first components 92 and the terminal surfaces 98A of the second components 96 of each electronic component into the openings 27 of the core substrate 20; filling the embedding resin portion 46 in the openings 27; and laminating the lamination portions 21 and 22 on the resin layers 41 and 42 of the core substrate 20. Among them, the step of preparing a plurality of electronic components 90 includes the following steps: connecting the first component 92 and the second component 96 by the molding resin portion 44 so that the terminal surfaces 94A and 98A of each other are in the same plane. That is, as the plurality of electronic components 90, connecting components 90 are prepared which are connected to each other by the molding resin portion 44 in such a manner that the heights in the insertion direction are different and the terminal surfaces 94A and 98A of each other are in the same plane. According to this manufacturing method, since the space in the opening 27 is occupied by the molding resin portion 44 that connects the electronic components 90 to each other, the amount of the embedding resin for filling the opening 27 is reduced as compared with the structure in which the plurality of electronic components 90 are individually inserted into the opening 27 and the space between the electronic components 90 is filled with the embedding resin portion 46.

[0052] In addition, in the manufacturing method of the component-embedded wiring board 10 of the present embodiment, the following steps are included: making the lamination portions 21 and 22 have an interlayer insulating layer 50 on the core substrate 20 side; and forming the embedding resin portion 46 from the same resin as the interlayer insulating layer 50. According to this structure, the interlayer insulation property is improved as compared with the structure in which the resin of the embedding resin portion 46 is different from the resin of the interlayer insulating layer 50 in the lamination portions 21 and 22.

[0053] Moreover, in the manufacturing method of the component-embedded wiring board 10 of the present embodiment, a plurality of electronic components 90 are connected by the molding resin portion 44 in a first manufacturing unit U1, and the plurality of electronic components 90 connected by the molding resin portion 44 are cut in a second manufacturing unit U2 smaller than the first manufacturing unit U1. According to this manufacturing method, a plurality of electronic components 90 connected by the molding resin portion 44 are manufactured at one time in the manufacturing unit 1.

[0054] As described above, the present invention has been described in detail with respect to specific embodiments, but the present invention is not limited to the embodiments involved. Those skilled in the art can understand that the present invention can adopt various other embodiments within the scope of the present invention. For example, there are the following modification examples, but not limited thereto.

[0055] (Modification example)

[0056] (Presence or absence of terminals in a plurality of electronic components)

[0057] In the first component 92, it is configured such that no terminals are arranged on the top surface 92F, but it is not limited to this. Terminals may also be arranged on the top surface 92F of the first component 92. In the second component 96, it is configured such that a terminal 99 is arranged on the top surface 96F, but it is not limited to this. It may also be a structure in which no terminals are arranged on the top surface 96F of the second component 96.

[0058] (Resin of the stacked portions 21, 22)

[0059] The embedded resin portion 46 is the same resin as the interlayer insulating layer 50 of the stacked portions 21, 22, but it is not limited to this. The embedded resin portion 46 may also be a resin different from the interlayer insulating layer 50 of the stacked portions 21, 22.

[0060] (First manufacturing unit U1)

[0061] A plurality of electronic components 90 are cut after being sealed as the first manufacturing unit U1 by the molding resin portion 44, but it is not limited to this. The first manufacturing unit U1 may also be directly inserted into the core substrate 20.

[0062] (Embedding based on the molding resin)

[0063] The molding resin portion 44 flows into a mold frame (not shown) until it is above the first height H1 of the first component 92 and below the second height H2 of the second component 96, but it is not limited to this. The molding resin portion 44 may also flow into the mold frame (not shown) until it is below the first height H1 or above the second height H2. Additionally, the molding resin portion 44 flows into the mold frame (not shown), but it is not limited to this. Solid resin may also be arranged around the plurality of electronic components 90, and the first component 92 and the second component 96 may be connected by heating. Moreover, both the first component 92 and the second component 96 are box-shaped with a rectangular cross-section, but it is not limited to this. The sizes and shapes of the first component 92 and the second component 96 may also be different, and they are both connected by the molding resin portion 44.

Claims

1. A component-embedded wiring board, comprising: A core substrate having an opening; A plurality of electronic components inserted into the inside of the opening in a separated state from each other; A stacked portion disposed on the core substrate and on the electronic components; and A first resin portion filling the opening, wherein The plurality of electronic components are connected by a second resin portion such that their heights are different from each other and their terminal surfaces are in the same plane.

2. The component-embedded wiring board according to claim 1, wherein The plurality of electronic components include a first component having a first height and a second component having a second height higher than the first height, No terminals are disposed on the surface of the first component opposite to the terminal surface, Terminals are disposed on the surface of the second component opposite to the terminal surface.

3. The component-embedded wiring board according to claim 1, wherein The stacked portion has an insulating layer on the side where the core substrate is located, The first resin portion is formed of the same resin as the insulating layer.

4. A method for manufacturing a component-embedded wiring board, the method for manufacturing a component-embedded wiring board comprising the following steps: Preparing a plurality of electronic components having different heights from each other; Inserting the plurality of electronic components into the opening of the core substrate from the terminal surface side of each electronic component; Filling the opening with a first resin portion; and Stacking a stacked portion on the core substrate, wherein The step of preparing the plurality of electronic components includes the step of connecting the electronic components to each other by a second resin portion so that their terminal surfaces are in the same plane.

5. The method for manufacturing a component-embedded wiring board according to claim 4, wherein The method for manufacturing a component-embedded wiring board includes the following steps: Making the stacked portion have an insulating layer on the side where the core substrate is located; And Forming the first resin portion of the same resin as the insulating layer.

6. The method for manufacturing a component-embedded wiring board according to claim 4, wherein The method for manufacturing a component-embedded wiring board includes the following steps: Connecting a plurality of electronic components by a second resin portion in a first unit; And Cutting the plurality of electronic components connected by the second resin portion into a second unit smaller than the first unit to form connected electronic components.

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