Machining information display device, laser machining control device, and machining information display program

Abstract

This machining information display device is provided with: a display unit that displays machining information including a machining path and a beam profile when laser machining is performed; an input unit that selects and inputs a specific machining position on the displayed machining path; and a control unit having a function of determining the beam profile at the machining position on the basis of the input machining position. Furthermore, the control unit includes: a processing condition acquisition unit that acquires a laser processing condition for processing on the processing path; a selected processing condition extraction unit that extracts a selected processing condition at the processing position from the laser processing conditions; and a profile determination unit that determines a beam profile at a position corresponding to the processing position on the basis of the selected processing condition.

Description

Technical Field

[0001] The present disclosure relates to a processing information display device, a laser processing control device, and a processing information display program. Background Art

[0002] Laser processing devices such as laser cutting machines and laser welding machines transmit a laser beam output from a laser oscillator and irradiate a workpiece, and move the laser beam relative to the workpiece, thereby enabling predetermined processing. In particular, in order to obtain a good cutting cross-section in laser cutting or a stable weld bead in laser welding, it is preferable to appropriately adjust the irradiation conditions (such as laser output, energy density) per unit processing length (such as beam spot diameter) of the laser beam on the processing path for each processing position.

[0003] In such laser processing, when the processing path for the workpiece consists of a simple straight line, if the processing is performed at a constant processing speed and a constant laser output, it is not necessary to change the irradiation conditions per unit processing length. However, in the case where cutting processing, marking processing, etc. based on a laser beam are mixedly implemented in a series of processing programs, the melting depth and melting width formed by the laser beam vary depending on the required processing, and thus it is necessary to appropriately adjust and control the irradiation conditions on the processing path.

[0004] Thus, when adjusting or controlling the irradiation conditions of the laser beam on the processing path, if there is a display device that displays various processing conditions on the processing path through one screen, it is possible to grasp various processing conditions on the processing path at a glance, and thus it is preferable. As an example of such a display device, for example, Patent Document 1 discloses a processing path display device that displays the processing path of a laser processing machine, which includes: a position information acquisition unit that acquires position information of at least one drive shaft for each predetermined control cycle; a laser processing head coordinate calculation unit that calculates the coordinate value of the laser processing head based on the position information and information on the mechanical structure of the laser processing machine; a first data acquisition unit and a second data acquisition unit that acquire processing data related to laser processing; a display form setting unit that sets a display form based on the acquired processing data; and a display unit that displays the processing path based on the coordinate value of the laser processing head and the set display form.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2018-180780 Summary of the Invention

[0008] Problems to be Solved by the Invention

[0009] Conventionally known machining path display devices display the position information on the machining path in correspondence with the machining data obtained during machining. Therefore, indeed, for the operator, it has the advantage of being easy to grasp whether various conditions of laser machining are appropriate, or the correspondence with the quality of machining. However, such a machining path display device only generates image data displayed based on the results of actual machining according to the machining program. Therefore, so-called "trial machining" is required, and for the operator, there is a problem of a large load for the preparation and construction of this "trial machining".

[0010] In addition, in existing machining path display devices, predetermined machining conditions on the machining path are represented by color differentiation or its shading, and thus the magnitude of such machining conditions can be expressed. However, in this method, only the distribution of machining conditions for the entire machining path is displayed, and the irradiation state (e.g., beam profile) of the laser beam at a predetermined machining position cannot be obtained.

[0011] For such reasons, the following technology is required: without performing actual machining such as trial machining, in laser machining based on a predetermined machining program, it is possible to predict and display the beam profile at a predetermined machining position on the machining path.

[0012] Means for Solving the Problem

[0013] A machining information display device according to a representative embodiment of the present disclosure includes: a display unit that displays machining information including a machining path during laser machining; an input unit that selects and inputs a specific machining position on the displayed machining path; and a control unit that has a function of determining the beam profile at the machining position based on the input machining position. The control unit includes: a machining condition acquisition unit that acquires laser machining conditions for machining on the machining path; a selected machining condition extraction unit that extracts the selected machining conditions at the machining position from the acquired laser machining conditions; and a profile determination unit that determines the beam profile at a position corresponding to the machining position based on the selected machining conditions. Brief Description of the Drawings

[0014] Figure 1 It is a schematic diagram showing an outline of the structure of the machining information display device according to the first embodiment.

[0015] Figure 2 It shows Figure 1 A block diagram showing the specific structure of the control unit shown and the relationship with peripheral devices.

[0016] Figure 3 It is a schematic diagram showing an example of displaying the machining path of the laser machining according to the first embodiment on the display unit.

[0017] Figure 4AIt is a schematic diagram showing an example of a display screen during cutting processing.

[0018] Figure 4B It is a schematic diagram showing an example of a display screen during cutting processing.

[0019] Figure 5A It is a schematic diagram showing an example of a display screen during marking processing.

[0020] Figure 5B It is a schematic diagram showing an example of a display screen during marking processing.

[0021] Figure 6 It is a schematic diagram showing an outline of the structure of the processing information display device according to the second embodiment.

[0022] Figure 7 It is showing Figure 6 a block diagram of the specific structure of the control unit shown and the relationship with peripheral devices.

[0023] Figure 8A It is a schematic diagram showing an example of a display screen for displaying the change operation of the beam profile.

[0024] Figure 8B It is a schematic diagram showing an example of a display screen for displaying the variation operation of the beam profile.

[0025] Figure 9 It is a block diagram showing the specific structure of the control unit in a modified example of the processing information display device according to the second embodiment and the relationship with peripheral devices.

[0026] Figure 10 It is a schematic diagram showing an outline of the structure of the processing information display device according to the third embodiment.

[0027] Figure 11A It is showing specifically the operation of Figure 10 a schematic diagram of an example when operating the processing information display device shown.

[0028] Figure 11B It is showing specifically the operation of Figure 10 a schematic diagram of an example when operating the processing information display device shown.

[0029] Figure 12 It is a schematic diagram of an example of a laser processing device equipped with a laser processing control device, where the laser processing control device includes the processing information display device according to the fourth embodiment.

[0030] Figure 13 It is showing Figure 12 a block diagram of an example of the structure of the laser processing control device shown. Detailed Embodiments

[0031] Hereinafter, an embodiment of a display device having a function of displaying a laser processing state and a processing control device including the display device, which is a representative example of the present disclosure, will be described in conjunction with the accompanying Figure 1 drawings.

[0032] In addition, "based on XX" in the present disclosure means "at least based on XX", and also includes cases based on other elements in addition to XX. In addition, "based on XX" is not limited to directly using XX, and also includes cases based on the result obtained by operating or processing XX. Here, "XX" refers to any element (for example, any information).

[0033] <First Embodiment>

[0034] Figure 1 FIG. is a schematic diagram showing the structure of a processing information display device according to a first embodiment, which is a representative example of the present disclosure. In addition, Figure 2 FIG. is a block diagram showing Figure 1 the specific structure of the control unit shown and the relationship with peripheral devices.

[0035] As shown in Figure 1 FIG., as an example, the processing information display device 100 includes: a display unit 110 that displays processing information including a processing path during laser processing; an input unit 120 that selects and inputs a specific processing position on the displayed processing path; and a control unit 130 that has a function of determining a beam profile at the input processing position.

[0036] The display unit 110 is configured as a unit that receives an instruction signal from a display instruction unit 132 of the control unit 130 described later and displays a processing path, various processing conditions (processing parameters), etc. on a workpiece being laser processed. As such a display unit 110, various display units such as a liquid crystal display, an organic EL display, or a plasma display can be applied.

[0037] For example, as an example, as shown in Figure 1 FIG., the input unit 120 has: a cross key 122 that moves a selection pointer (refer to the label PT in Figure 4A FIG.) within the screen of the display unit 110; and a button unit 124 that includes a determination button 124a and a release button 124b for determining or releasing the position of the selection pointer PT. As such an input unit 120, Figure 1Exemplary controller-type units including the cross keys 122, keyboards including numeric keys, or joystick-type units, etc. In addition, regarding the connection between the input unit 120 and the control unit 130, as long as signal exchange can be performed between them, the connection can be made by either a wired or wireless method.

[0038] As an example, as Figure 2 shown, the control unit 130 includes: a display instruction unit 132 that outputs a display instruction to the display unit 110; a processing condition acquisition unit 133 that acquires laser processing conditions for performing processing on the processing path; a selection processing condition extraction unit 134 that extracts the selection processing conditions at the processing positions selected by the input unit 120 from the acquired laser processing conditions; and a contour determination unit 135 that determines the beam contour at the position corresponding to the above processing position based on the selection processing conditions.

[0039] As an example, the display instruction unit 132 reads information on the processing path and processing conditions included in the processing program from an external storage device 140 such as a database, and receives the beam contour determined by the contour determination unit 135. Then, the display instruction unit 132 generates a display instruction for displaying the determined beam contour together with the processing path and processing conditions, and outputs it to the display unit 110.

[0040] The processing condition acquisition unit 133 reads the data of the processing path and the data of the processing conditions from the external storage device 140, and generates corresponding information representing the processing conditions at each position or each interval on the processing path by correlating the two sets of data. Then, the processing condition acquisition unit sends the generated corresponding information to the selection processing condition extraction unit 134. In addition, as an example, "processing conditions" include information such as the processing speed on the processing path, the power of the laser beam, the focal position, the distance from the workpiece, or the wavelength of the laser beam and the settings of optical systems such as lenses.

[0041] The selection processing condition extraction unit 134 receives the above corresponding information from the processing condition acquisition unit 133, and receives the position information of a specific processing position on the processing path selected and input by the operator from the input unit 120. Then, the selection processing condition extraction unit 134 extracts the processing conditions corresponding to the processing position from the corresponding information based on the position information of the selected processing position to determine the selection processing conditions, and sends the selection processing conditions to the contour determination unit 135.

[0042] Based on the selected machining conditions received from the selected machining condition extraction unit 134, the beam profile determination unit 135 determines the beam profile of the laser beam at the selected machining position. At this time, as an example, the beam profile is determined by the following methods: a method of obtaining it by using a predetermined arithmetic expression with the parameters included in the selected machining conditions; a method of storing in advance in an external storage device 140 or the like a condition table that associates the machining conditions of the laser beam with representative beam profiles, and reading out and selecting from this condition table. Then, the beam profile determination unit 135 sends the determined beam profile together with the position information of the machining position to the display instruction unit 132.

[0043] Next, Figures 3 to 5B a specific operation example of the machining information display device according to the first embodiment will be described.

[0044] Figure 3 FIG. is a schematic diagram showing an example of displaying the machining path of the laser machining according to the first embodiment on the display unit. In addition, Figure 4A and Figure 4B are schematic diagrams showing an example of the display screen when performing cutting machining. And, Figure 5A and Figure 5B are schematic diagrams showing an example of the display screen when performing marking machining.

[0045] As Figure 3 shown, as an example, the machining path according to the first embodiment includes: a first machining path R1 for performing a cutting machining CP on the workpiece W that returns from the machining start point P1 via the intermediate bending points P2 to P4 to the machining start point P1; and a second machining path R2 for performing a marking machining MP by tracing a predetermined character or mark on the surface of the workpiece W.

[0046] First, when wanting to investigate the beam profile when performing the cutting machining CP along the first machining path R1, as Figure 4A shown, the operator selects and displays the machining path R1 of the cutting machining CP on the display unit 110. Next, the operator operates the cross keys 122 of the input unit 120 to move the selection pointer PT displayed on the display screen of the display unit 110 to a specific machining position SP1 on the machining path R1.

[0047] At this position, the operator presses the decision button 124a of the input unit 120, thereby setting the machining position SP1 at which the operator wants to obtain the information of the beam profile. Then, the position information of the machining position SP1 from the input unit 120 is sent to the selected machining condition extraction unit 134 of the control unit 130, and the beam profile determination unit 135 determines the beam profile at the machining position SP1 based on the position information of the machining position SP1.

[0048] Then, asFigure 4B As shown, in the display screen of the display unit 110, a pop-up screen PW1 starting from the machining position SP1 is additionally displayed together with the image BP1 of the beam profile. Here, in Figure 4B , as the image BP1 of the beam profile, an image of a two-dimensional laser power distribution is illustrated, but it may also be configured to display an image of a three-dimensional solid laser power distribution.

[0049] By such an operation, it is possible to display the beam profile at a specific machining position SP1 during the cutting process CP without performing actual machining such as trial machining, so as to predict the machining state. In addition, when it is desired to view the information of the beam profile at other machining positions on the machining path R1, the selection of the selection pointer PT is cancelled by pressing the cancel button 124b of the input unit 120, and the cross keys 122 are operated again to select another machining position SP1.

[0050] On the other hand, when it is desired to investigate the beam profile during the marking process MP along the second machining path R2, as Figure 5A shown, the operator selects and displays the machining path R2 of the marking process MP on the display unit 110. Then, the operator operates the cross keys 122 of the input unit 120 to move the selection pointer PT displayed on the display screen of the display unit 110 to a specific machining position SP2 on the machining path R2.

[0051] At this position, the operator presses the decision button 124a of the input unit 120, thereby setting the machining position SP2 at which the operator desires to obtain the information of the beam profile. Then, the position information of the machining position SP2 from the input unit 120 is sent to the selection machining condition extraction unit 134 of the control unit 130, and the beam profile at the machining position SP2 is determined by the profile determination unit 135 based on the position information of the machining position SP2.

[0052] Then, as Figure 5B shown, in the display screen of the display unit 110, a pop-up screen PW2 starting from the machining position SP2 is additionally displayed together with the image BP2 of the beam profile. Here, in the marking process, different from the cutting process, it is only necessary to machine a fine groove near the surface of the workpiece W, so Figure 5B the beam profile in the shown marking process and Figure 5A the beam profile in the shown cutting process, compared with each other, becomes a distribution with a smaller peak power of the laser beam and a narrower width of the high-output region.

[0053] By such an operation, it is also possible to display the beam profile at a specific machining position SP2 during the marking process MP without performing actual machining such as trial machining, so as to predict the machining state. In addition, in Figure 5A andFigure 5B In the display example shown, a case is illustrated in which the display that selects either the cutting process CP or the marking process MP is used to prompt only the prediction result of the beam profile of one side. However, it may also be configured to simultaneously prompt the beam profiles at a plurality of machining positions corresponding to both the cutting process CP and the marking process MP. In addition, it is also possible to simultaneously prompt the beam profiles at a plurality of machining positions in one machining.

[0054] By having the above-described structure, the machining information display device according to the first embodiment has the following function: extracting the selected machining conditions at a specific machining position on the machining path input from the input unit, and determining and displaying the beam profile at the position corresponding to the machining position based on the selected machining conditions. Thus, without performing actual machining such as trial machining, in laser machining based on a predetermined machining program, it is possible to predict and display the beam profile at a predetermined machining position on the machining path.

[0055] <Second Embodiment>

[0056] Figure 6 is a schematic diagram showing the structure of the machining information display device according to the second embodiment. In addition, Figure 7 is a diagram showing Figure 6 the specific structure of the control unit shown and the relationship with peripheral devices. In the second embodiment, for parts of the structure that can adopt the same or common structure as that in the first embodiment in the schematic diagram and the like shown, the same reference numerals are used to omit their repeated description. Figures 1 to 5B shown in the schematic diagram and the like, the same reference numerals are used to omit their repeated description.

[0057] In the machining information display device 200 according to the second embodiment, the input unit 220 is different from the structure of the machining information display device 100 according to the first embodiment in that a keypad 224 having the functions of the determination button 124a and the cancellation button 124b shown in the first embodiment is provided instead of the button unit 124. That is, the machining information display device 200 according to the second embodiment includes a function of inputting change information for changing the beam profile displayed on the display unit 110.

[0058] As an example, as Figure 6 shown, the machining information display device 200 according to the second embodiment includes: a display unit 110; an input unit 220 having a function of selecting a specific machining position on the displayed machining path and inputting change information by an operator; and a control unit 230 having a function of determining the beam profile at the machining position based on the input machining position and changing the beam profile based on the change information.

[0059] For example, as Figure 6As shown, the input unit 220 includes a cross key 222 and a keypad 224 for inputting characters, numbers, etc., which are change information for changing the beam profile. In addition, for example, as Figure 7 shown, the control unit 230 includes a display instruction unit 232, a processing condition acquisition unit 233, a selected processing condition extraction unit 234, a profile determination unit 235, a profile change unit 236 that changes the beam profile based on the change information input through the input unit 220, and a laser processing condition correction unit 237 that corrects the laser processing conditions by reflecting the changed beam profile. In addition, regarding the connection between the input unit 220 and the control unit 230, as in the case of the first embodiment, as long as signal exchange can be performed between them, the connection can be made by either a wired or wireless method.

[0060] Similar to the case of the first embodiment, the profile determination unit 235 determines the beam profile of the laser beam at the selected processing position based on the selected processing conditions received from the selected processing condition extraction unit 234. Then, the profile determination unit 235 sends the determined beam profile together with the position information of the processing position to the display instruction unit 232 and the profile change unit 236.

[0061] The profile change unit 236 changes and updates the power distribution of the laser beam based on the change information of the beam profile sent from the input unit 220. At this time, the change of the beam profile is performed by directly inputting the power distribution numerically or manually, or by inputting parameters as change conditions and reading the power distribution corresponding to the parameters from the condition table stored in the external storage device 140. Then, the profile change unit 236 sends the changed beam profile together with the position information of the processing position to the display instruction unit 232 and the laser processing condition correction unit 237.

[0062] The laser processing condition correction unit 237 changes the laser processing conditions obtained by the processing condition acquisition unit 233 based on the changed beam profile sent from the profile change unit 236 to generate corrected processing conditions. At this time, regarding the change of the laser processing conditions, only the beam profile at the position corresponding to the processing position selected for the change can be changed, or an arbitrary processing section including the selected processing position can be further selected to change the beam profile of the entire processing section.

[0063] In addition, the laser processing condition correction unit 237 sends the changed corrected processing conditions to the display instruction unit 232. Then, the display instruction unit 232 outputs a display instruction for causing the display unit 110 to display the processing information reflecting the sent corrected processing conditions and beam profile.

[0064] Next, use Figure 8A and Figure 8B, illustrate a specific operation example of the processing information display device according to the second embodiment.

[0065] Figure 8A and Figure 8B is a schematic diagram showing an example of a display screen, in which the display screen displays an operation of changing the beam profile.

[0066] As an operation of changing the beam profile, when changing the beam profile during the cutting process CP along the first processing path R1, as Figure 8A shown, after the operator selects and displays the processing path R1 of the cutting process CP on the display unit 110, the operator selects and inputs the processing position SP1 where the information of the desired beam profile is to be obtained. Then, the position information of the processing position SP1 from the input unit 220 is sent to the selection processing condition extraction unit 234 of the control unit 230. Similarly to the case of the first embodiment, the beam profile at the processing position SP1 is determined by the profile determination unit 235.

[0067] Then, receiving a display instruction from the display instruction unit 232, on the display screen of the display unit 110, a pop-up screen PW1 starting from the processing position SP1 is additionally displayed together with the image BP1 of the beam profile. At this time, in the pop-up screen PW1, in addition to the image BP1 of the beam profile, the position information, the peak power value of the laser beam, etc. can also be displayed together.

[0068] Next, the operator who has viewed Figure 8A the display screen uses the input unit 220 to input change information for changing the beam profile. Here, the power distribution is directly moved manually using the cross keys 222, or a numerical value is directly input to the parameter using the numeric keypad 224, etc. to perform the input of the change information.

[0069] When the change information is input, as described above, the beam profile is changed by the profile change unit 236, and accordingly, the laser processing conditions are changed by the laser processing condition correction unit 237. Then, receiving a display instruction from the display instruction unit 232 that has received information related to these changes, as Figure 8B shown, a pop-up screen PW1 including the image BP1a of the changed beam profile is newly displayed on the display unit 110.

[0070] Through such an operation, it is possible to display the beam profile at a specific processing position SP1 on the processing path R1 without performing actual processing such as trial processing, and it is possible to arbitrarily change the beam profile and the laser processing conditions based on the change information input by the operator.

[0071] Next, use Figure 9 to illustrate a modified example of the processing information display device according to the second embodiment.

[0072] Figure 9 It is a block diagram showing the specific structure of the control unit and the relationship with peripheral devices in a modified example of the processing information display device according to the second embodiment.

[0073] In a modified example of the second embodiment, for example, as Figure 9 shown, the control unit 230 includes a display instruction unit 232, a processing condition acquisition unit 233, a selected processing condition extraction unit 234, a contour determination unit 235, a contour change unit 236, a laser processing condition correction unit 237, and a corrected processing condition output unit 238 that outputs the corrected processing conditions corrected by the laser processing condition correction unit 237 to the outside.

[0074] In this modified example, the laser processing condition correction unit 237 changes the laser processing conditions obtained by the processing condition acquisition unit 233 based on the changed beam contour sent from the contour change unit 236 to generate corrected processing conditions. Then, the laser processing condition correction unit 237 sends the data of the beam contour and position information together with the corrected processing conditions to the display instruction unit 232 and the corrected processing condition output unit 238.

[0075] Next, in the same manner as described in Figure 8A and Figure 8B the display instruction unit 232 outputs a display instruction that causes the display unit 110 to display the processing information reflecting the sent changed laser processing conditions and beam contour. On the other hand, the corrected processing condition output unit 238 outputs and stores the corrected processing conditions, information on the changed beam contour, etc. to an external storage device 140 such as a removable storage device such as a USB memory, Figure 9 shown in the database.

[0076] By having the above-described structure, in addition to the effects described in the first embodiment, the processing information display device according to the second embodiment can arbitrarily change the beam contour by the operator inputting change information to the predicted result of the beam contour displayed on the display unit. In addition, by changing the beam contour at the selected processing position, it is also possible to reflect it in the laser processing conditions to generate corrected processing conditions.

[0077] Furthermore, by adding the function of outputting the corrected processing conditions to the outside, the corrected processing conditions can be saved in the database in an overwriting manner, and by moving the corrected processing conditions to the processing control device of the laser processing device, the processing program of the laser processing device can also be corrected.

[0078] <Third Embodiment>

[0079] Figure 10 It is a schematic diagram showing the structure of the processing information display device according to the third embodiment. In addition,Figure 11A and Figure 11B is a schematic diagram showing an example when indicating a specific operation Figure 10 for the machining information display device shown. In addition, in the third embodiment, for parts that can adopt the same or common structures as those in the first embodiment and the second embodiment in the schematic diagrams and the like shown Figures 1 to 9 the same reference numerals are assigned, and their repeated descriptions are omitted.

[0080] The machining information display device 300 of the third embodiment is configured as a portable terminal 350. This portable terminal 350 has a touch panel type display unit 310 that also serves as a display unit and an input unit, which is different from the structure of the machining information display device 100 of the first embodiment. That is, the machining information display device 300 of the third embodiment is a device that omits the separately configured input unit.

[0081] As an example, as Figure 10 shown, the portable terminal 350 that constitutes the machining information display device 300 of the third embodiment has a display unit 310 and a control unit (not shown). In addition, regarding the control unit not shown, the same structure as the control unit described in the above first embodiment or second embodiment can be applied, so the description here is omitted.

[0082] As a specific example of the operation of the machining information display device 300 of the third embodiment, when the case of performing a cutting process CP is exemplified, as Figure 11A and Figure 11B shown, first, the operator selects and displays the machining path R1 of the cutting process CP on the display unit 310. Then, the operator touches the display screen of the display unit 310 that also serves as an input unit with the hand HD (or finger) to recognize the start of selection from the display unit 310.

[0083] Next, when the operator performs a click action (an action of tapping the screen) at a specific machining position on the machining path R1, the machining position SP1 where the operator wants to obtain the information of the beam profile is set. Then, the position information of the machining position SP1 from the display unit 310 is sent to the control unit, and based on the position information of the machining position SP1, the beam profile at the machining position SP1 is determined in the same manner as in the first embodiment or the second embodiment.

[0084] Then, as Figure 11B shown, in the display screen of the display unit 310, a pop-up screen PW1 starting from the machining position SP1 is additionally displayed together with the image BP1 of the beam profile. In addition, it can also be configured to be the same as Figure 8A and Figure 8BSimilarly to the case shown in [description of the relevant figure], in the pop-up screen PW1, in addition to the image BP1 of the beam profile, position information, the peak power value of the laser beam, etc. are also displayed.

[0085] In addition, when wanting to view the information of the beam profile at other processing positions on the processing path R1, by clicking on other positions on the processing path R1 in the display screen of the display unit 310, other processing positions SP1 can be selected. In addition, similarly to the first embodiment, it is also possible to simultaneously present the beam profiles at a plurality of processing positions corresponding to both the cutting process CP and the marking process MP, or to simultaneously present the beam profiles at a plurality of processing positions in one process, on the display screen of the display unit 310.

[0086] By having the structure as described above, in addition to the effects described in the first embodiment or the second embodiment, the processing information display device of the third embodiment is a portable terminal having a display unit that integrates the functions of a display unit and an input unit, so that the operation of the operator can be made easier while simplifying the overall structure.

[0087] <Fourth Embodiment>

[0088] Figure 12 It is a schematic diagram showing an example of a laser processing apparatus including a laser processing control device, where the laser processing control device includes the processing information display device of the fourth embodiment. Additionally, Figure 13 It shows Figure 12 An example of the structure of the laser processing control device shown. Additionally, in the fourth embodiment, for parts of the structure that can adopt the same or common structure as in the schematic diagram etc. shown in Figures 1 to 11B the first embodiment to the third embodiment, the same reference numerals are assigned and their repeated description is omitted.

[0089] As an example, as shown in Figure 12 the laser processing apparatus 1 to which the laser processing control device 50 of the fourth embodiment is applied includes: a laser oscillator 10 that oscillates a processing laser beam LB; a processing table 20 that holds a workpiece W; a processing head 30 that irradiates the workpiece W with the processing laser beam LB; a transfer mechanism 40 that relatively moves the processing head 30 with respect to the processing table 20; and a laser processing control device 50 that controls a predetermined laser processing operation on the workpiece W. Additionally, the laser processing control device 50 further includes a processing information display device 400.

[0090] The laser oscillator 10 applies a laser source with a wavelength having a high absorption efficiency according to the material of the workpiece W to be processed, and the output processing laser beam LB is transmitted to the processing head 30 via a transmission path 12 such as an optical fiber. Additionally, as an example, the processing table 20 is configured to include a chuck mechanism (not shown) for mounting the workpiece W, which grips and fixes the workpiece W.

[0091] As an example, the processing head 30 introduces the processing laser beam LB from one end (upper end) side, condenses it through a condensing lens (not shown) disposed inside, and then emits it from the nozzle 32 on the other end (lower end) side toward the focal point FP of the workpiece W. Additionally, as the structure of the processing head 30 for irradiating the processing laser beam LB to the focal point FP of the workpiece W, instead of the above structure, a scanning optical unit (not shown) such as a galvanometer mirror may be built inside, and the optical axis of the processing laser beam LB is scanned against the workpiece W using this scanning optical unit.

[0092] As an example, the conveying mechanism 40 is configured as a linear drive body that relatively moves in the XYZ three mutually orthogonal axial directions, and the processing head 30 is mounted at one end thereof. In addition, the conveying mechanism 40 may also be configured as an industrial robot of a six-axis or seven-axis type having a robotic arm with the processing head 30 mounted at one end.

[0093] As an example, as Figure 13 shown, the laser processing control device 50 includes: a main control device 52 that controls the overall operation of the laser processing control device 50; a user interface 54 that is used for an operator to manually input items, numerical values, etc. of various parameters for performing laser processing; an external storage device 140 that records a processing program for performing laser processing, a condition table corresponding to laser processing conditions, etc.; and a processing information display device 400.

[0094] The main control device 52 of the laser processing control device 50 is connected to various sensors and the like provided in each component of the laser processing device 1 to receive detection signals, and outputs control instruction signals based on the processing program to each component. Additionally, the user interface 54 is configured as a keyboard for inputting strings, numbers, etc., and in the fourth embodiment, it is configured to also function as an input unit of the processing information display device 400.

[0095] As an example, the processing information display device 400 includes a display unit 410, a user interface 54 that functions as an input unit, and a control unit 430. And, similar to the first embodiment, the control unit 430 includes a display instruction unit 432, a processing condition acquisition unit 433, a selected processing condition extraction unit 434, and a contour determination unit 435.

[0096] By having the above-described structure, the laser processing control device according to the fourth embodiment includes a processing state display device having a function of extracting selected processing conditions at a specific processing position on a processing path input from a user interface, determining and displaying a beam profile at a position corresponding to the processing position based on the selected processing conditions. Therefore, before actual processing such as trial processing, it is possible to predict and display the beam profile at a predetermined processing position on the processing path.

[0097] In addition, in Figure 13 , as the processing information display device 400, a processing information display device having the same control unit 430 as that of the first embodiment is illustrated. However, for example, it may also be as in the second embodiment Figure 7 , Figure 9 shown, and a structure of a control unit having a function of correcting the beam profile and laser processing conditions based on an input of additional change information from an operator may be applied. Alternatively, the processing information display device 400 may be a mobile terminal shown in the third embodiment Figure 10 shown, and configured to be freely attachable and detachable with respect to the laser processing control device 50.

[0098] <Fifth Embodiment>

[0099] In the first to fourth embodiments, as representative structures of the present disclosure, the processing information display device and the laser processing control device applying the processing information display device have been described. However, as other specific examples of the present disclosure, a processing information display program can be exemplified, which causes a laser processing control device having a normal display device or display unit to execute control actions based on the technical idea of the present disclosure.

[0100] That is, the processing information display program according to the fifth embodiment displays a beam profile together with processing information on a display unit by performing a series of steps on a normal display device having a display unit, an input unit, and a control unit. The processing information display program is, for example, stored in the control unit of the display device. The above series of steps includes: a step of displaying processing information including a processing path during laser processing on the display unit of the display device; a step of selecting and inputting a specific processing position on the displayed processing path; a step of obtaining laser processing conditions for performing processing on the processing path; a step of extracting selected processing conditions at the processing position from the obtained laser processing conditions; and a step of determining a beam profile at a position corresponding to the processing position based on the extracted selected processing conditions.

[0101] In addition, the processing information display program of the fifth embodiment can also be used in the following manner, recorded in various recording media such as USB memories or magnetic disks, or large-scale recording devices such as databases or cloud servers, and installed as software in the display device or laser processing control device used as needed.

[0102] In addition to the above series of steps, the processing information display program of the fifth embodiment may further include: a step of inputting change information for the displayed beam profile; a step of changing the beam profile based on the change information; and a step of correcting the laser processing conditions reflecting the changed beam profile.

[0103] In addition to the above series of steps, the processing information display program of the fifth embodiment may further include: a step of outputting the corrected processing conditions; and a step of correcting the processing program for performing laser processing based on the corrected processing conditions.

[0104] According to the above structure, by storing the processing information display program of the fifth embodiment as a control program in a normal display device or laser processing control device having a display unit, an input unit, and a control unit, it is possible to add a function of predicting and displaying the beam profile at a predetermined processing position on the processing path without performing actual processing such as trial processing.

[0105] The present disclosure has been described in detail above, but the present disclosure is not limited to the above-described embodiments. These embodiments can be variously added, replaced, changed, partially deleted, etc. within the scope not departing from the gist of the present disclosure, or within the scope not departing from the gist of the present disclosure derived from the content described in the patent protection scope and its equivalents. In addition, these embodiments can be combined and implemented. For example, in the above-described embodiments, the order of each action and the order of each process are shown as an example and are not limited thereto. In addition, the same applies to the cases where numerical values or mathematical expressions are used in the description of the above embodiments.

[0106] Regarding the above embodiments and modification examples, the following supplementary notes are also disclosed.

[0107] (Supplementary Note 1)

[0108] A processing information display device having:

[0109] a display unit that displays processing information including a processing path and a beam profile during laser processing;

[0110] an input unit that selects and inputs a specific processing position on the processing path displayed by the display unit; and

[0111] A control unit having a function of determining a beam profile at the machining position based on the machining position input from the input unit.

[0112] The control unit includes:

[0113] A machining condition acquisition unit that acquires laser machining conditions for machining on the machining path;

[0114] A selected machining condition extraction unit that extracts selected machining conditions at the machining position from the laser machining conditions; and

[0115] A profile determination unit that determines the beam profile at a position corresponding to the machining position based on the selected machining conditions.

[0116] (Supplementary Note 2)

[0117] According to the processing information display device described in Supplementary Note 1 above,

[0118] The input unit further has the following function: capable of inputting change information for the beam profile displayed on the display unit.

[0119] The control unit further includes:

[0120] A profile change unit that changes the beam profile based on the change information; and

[0121] A laser machining condition correction unit that corrects the laser machining conditions reflecting the changed beam profile.

[0122] (Supplementary Note 3)

[0123] According to the processing information display device described in Supplementary Note 2 above,

[0124] The control unit further includes a corrected machining condition output unit that outputs the corrected machining conditions corrected by the laser machining condition correction unit.

[0125] (Supplementary Note 4)

[0126] According to the machining information display device described in any one of Supplementary Notes 1 to 3 above,

[0127] The display unit is configured as a touch panel that also has the function of the input unit.

[0128] (Supplementary Note 5)

[0129] A laser processing control device includes: a main control device that controls the operation of laser processing of a laser processing device based on a laser processing program; and a processing information display device including a display unit that displays processing information including a processing path and a beam profile during the laser processing.

[0130] The processing information display device includes:

[0131] an input unit that selects and inputs a specific processing position on the processing path displayed on the display unit; and

[0132] a control unit that has a function of determining the beam profile at the processing position based on the processing position input from the input unit.

[0133] The control unit includes:

[0134] a processing condition acquisition unit that acquires laser processing conditions for processing on the processing path;

[0135] a selection processing condition extraction unit that extracts selection processing conditions at the processing position from the laser processing conditions; and

[0136] a profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selection processing conditions.

[0137] (Supplementary Note 6)

[0138] According to the laser processing control device described in Supplementary Note 5 above,

[0139] The input unit further has the following function: it can input change information for the beam profile displayed on the display unit.

[0140] The control unit further includes:

[0141] a profile change unit that changes the beam profile based on the change information; and

[0142] a laser processing condition correction unit that corrects the laser processing conditions reflecting the changed beam profile.

[0143] (Supplementary Note 7)

[0144] According to the laser processing control device described in Supplementary Note 6 above,

[0145] The control unit further includes a corrected processing condition output unit that outputs the corrected processing conditions corrected by the laser processing condition correction unit.

[0146] The main control device further has the following function: correcting the laser processing program based on the corrected processing conditions from the corrected processing condition output unit.

[0147] (Supplementary Note 8)

[0148] The laser processing control device according to any one of Supplementary Notes 5 to 7 above, wherein

[0149] The display unit is configured as a touch panel that also functions as the input unit.

[0150] (Supplementary Note 9)

[0151] A processing information display program,

[0152] The processing information display program causes a processing information display device to display a beam profile together with processing information by executing a series of steps including the following steps:

[0153] A step of displaying, on the processing information display device, the processing information including a processing path during laser processing;

[0154] A step of selecting and inputting a specific processing position on the processing path displayed on the processing information display device;

[0155] A step of obtaining laser processing conditions for processing on the processing path;

[0156] A step of extracting the selected processing conditions at the processing position from the laser processing conditions; and

[0157] A step of determining the beam profile at the position corresponding to the processing position based on the selected processing conditions.

[0158] (Supplementary Note 10)

[0159] The processing information display program according to Supplementary Note 9 above,

[0160] The processing information display program further includes:

[0161] A step of inputting change information for the beam profile displayed on the processing information display device;

[0162] A step of changing the beam profile based on the change information; and

[0163] A step of correcting the laser processing conditions reflecting the changed beam profile.

[0164] (Supplementary Note 11)

[0165] The processing information display program according to Supplementary Note 10 above,

[0166] The machining information display program further includes:

[0167] a step of outputting the corrected machining conditions; and

[0168] a step of correcting the machining program for performing the laser machining based on the corrected machining conditions.

[0169] Description of Reference Numerals

[0170] 1 Laser machining apparatus

[0171] 10 Laser oscillator

[0172] 12 Transfer path

[0173] 20 Machining table

[0174] 30 Machining head

[0175] 32 Nozzle

[0176] 40 Conveyor mechanism

[0177] 50 Laser machining control device

[0178] 52 Main control device

[0179] 54 User interface

[0180] 100 Machining information display device

[0181] 110 Display unit

[0182] 120 Input unit

[0183] 122 Cross keys

[0184] 124 Button unit

[0185] 124a Decision button

[0186] 124b Release button

[0187] 130 Control unit

[0188] 132 Display instruction unit

[0189] 133 Machining condition acquisition unit

[0190] 134 Selected machining condition extraction unit

[0191] 135 Profile determination unit

[0192] 140 External storage device

[0193] 200 Machining information display device

[0194] 220 Input Unit

[0195] 222 Cross Keys

[0196] 224 Numeric Keypad

[0197] 230 Control Unit

[0198] 232 Display Instruction Unit

[0199] 233 Processing Condition Acquisition Unit

[0200] 234 Selected Processing Condition Extraction Unit

[0201] 235 Profile Determination Unit

[0202] 236 Profile Modification Unit

[0203] 237 Laser Processing Condition Correction Unit

[0204] 238 Corrected Processing Condition Output Unit

[0205] 300 Processing Information Display Device

[0206] 310 Display Unit

[0207] 350 Mobile Terminal

[0208] 400 Processing Information Display Device

[0209] 410 Display Section

[0210] 430 Control Unit

[0211] 432 Display Instruction Unit

[0212] 433 Processing Condition Acquisition Unit

[0213] 434 Selected Processing Condition Extraction Unit

[0214] 435 Profile Determination Unit.

Claims

1. A processing information display device, characterized in that: The processing information display device includes: A display unit that displays processing information including a processing path and a beam profile during laser processing; An input unit that selects and inputs a specific processing position on the processing path displayed by the display unit; and A control unit that has a function of determining the beam profile at the processing position based on the processing position input from the input unit, The control unit includes: A processing condition acquisition unit that acquires laser processing conditions for processing on the processing path; A selection processing condition extraction unit that extracts selection processing conditions at the processing position from the laser processing conditions; and A profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selection processing conditions.

2. The processing information display device according to claim 1, characterized in that: The input unit further has the following function: being able to input change information for the beam profile displayed by the display unit, The control unit further includes: A profile change unit that changes the beam profile based on the change information; and A laser processing condition correction unit that corrects the laser processing conditions reflecting the changed beam profile.

3. The processing information display device according to claim 2, characterized in that: The control unit further includes a corrected processing condition output unit that outputs the corrected processing conditions corrected by the laser processing condition correction unit.

4. The processing information display device according to any one of claims 1 to 3, characterized in that: The display unit is configured as a touch panel that also has the function of the input unit.

5. A laser processing control device, which includes: a main control device that controls the laser processing operation of a laser processing device based on a laser processing program; and a processing information display device including a display unit that displays processing information including a processing path and a beam profile during the laser processing, characterized in that: The processing information display device includes: An input unit that selects and inputs a specific processing position on the processing path displayed by the display unit; and A control unit that has a function of determining the beam profile at the processing position based on the processing position input from the input unit, The control unit includes: A processing condition acquisition unit that acquires laser processing conditions for processing on the processing path; A selection processing condition extraction unit that extracts selection processing conditions at the processing position from the laser processing conditions; and A profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selection processing conditions.

6. The laser processing control device according to claim 5, characterized in that: The input unit further has the following function: being able to input change information for the beam profile displayed by the display unit, The control unit further includes: A profile change unit that changes the beam profile based on the change information; and A laser processing condition correction unit that corrects the laser processing conditions reflecting the changed beam profile.

7. The laser processing control device according to claim 6, wherein: The control unit further includes a corrected processing condition output unit that outputs the corrected processing conditions corrected by the laser processing condition correction unit. The main control device further has a function of correcting the laser processing program based on the corrected processing conditions from the corrected processing condition output unit.

8. The laser processing control device according to any one of claims 5 to 7, wherein: The display unit is configured as a touch panel that also functions as the input unit.

9. A processing information display program, wherein: The processing information display program causes a processing information display device to display a beam profile together with processing information by executing a series of steps including the following steps: A step of displaying, on the processing information display device, the processing information including a processing path during laser processing; A step of selecting and inputting a specific processing position on the processing path displayed on the processing information display device; A step of obtaining laser processing conditions for processing on the processing path; A step of extracting selected processing conditions at the processing position from the laser processing conditions; and A step of determining the beam profile at a position corresponding to the processing position based on the selected processing conditions.

10. The processing information display program according to claim 9, wherein: The processing information display program further includes: A step of inputting change information for the beam profile displayed on the processing information display device; A step of changing the beam profile based on the change information; And A step of correcting the laser processing conditions reflecting the changed beam profile.

11. The processing information display program according to claim 10, wherein: The processing information display program further includes: A step of outputting the corrected processing conditions; and A step of correcting the processing program for executing the laser processing based on the corrected processing conditions.

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