Micro-hole groove laser processing device and method for circuit board

Abstract

The invention provides a circuit board micropore groove laser processing device and method, and relates to the field of laser processing, the circuit board micropore groove laser processing device comprises a machine body, a moving mechanism arranged on the machine body, a moving block arranged on the moving mechanism, and a laser device arranged on the machine body, in order to solve the problems that in the production of circuit board micropore groove laser machining in the prior art, the operation of fixing and releasing a circuit board needs to be carried out in each machining process, the fixing and releasing operation is tedious, and the overall machining efficiency can be remarkably reduced due to the additional operation time, the limiting mechanism is arranged, so that the whole machining efficiency is greatly improved. Automatic limiting and quick release of the positioning plate are realized, and the processing efficiency of circuit board micropores is improved; by arranging the limiting mechanism, the problem that dust and impurities on the surface of a circuit board affect the machining precision in the prior art is solved; through the arrangement of the limiting mechanism, the problem that the quality of the surface of the circuit board is reduced due to the fact that the temperature of the circuit board micropores is high in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the field of laser processing, and more specifically, to a laser processing device and method for micro-holes and micro-grooves on a circuit board. Background Art

[0002] The laser processing device for micro-holes and micro-grooves on a circuit board is mainly used to fabricate micro-holes and micro-grooves on the circuit board to meet the requirements of high-density interconnection and microfabrication in modern electronic devices.

[0003] For example: "A micro-hole processing device" disclosed in the Chinese Utility Model Patent (Application No.: 202420687062.3), the specification of which discloses: including a processing table and a laser fixed on the processing table, a sliding mechanism is arranged on the upper part of the processing table, a mold for fixing the circuit board is arranged on the sliding mechanism, a mold groove for placing the circuit board is opened on the mold, a fitting groove is opened at the upper port of the mold groove, an auxiliary positioning plate is embedded in the fitting groove, a plurality of through holes are opened on the surface of the auxiliary positioning plate, infrared emitters are arranged at positions close to the through holes on the surface of the auxiliary positioning plate, and two infrared receivers matching the infrared emitters are symmetrically arranged on the laser, two locking bolts are symmetrically arranged on the auxiliary positioning plate, and the locking bolts are in threaded connection with the inner wall of the fitting groove; However, there are still some deficiencies in the above-mentioned micro-hole processing device during actual use: in the above-mentioned prior art, the circuit board is first placed in the mold groove, and the auxiliary positioning plate is placed on the circuit board, and the circuit board is fixed by the cooperation of the locking bolts and the auxiliary positioning plate. After the micro-holes of the circuit board are processed, the limit of the auxiliary positioning plate by the locking bolts is released, and then the limit of the circuit board is released. In mass production, the fixing and releasing operations need to be performed for each processing. The fixing and releasing operations are relatively cumbersome, and these additional operation times will significantly reduce the overall processing efficiency. The above patent can prove the defects existing in the prior art.

[0004] Therefore, we make improvements and propose a laser processing device and method for micro-holes and micro-grooves on a circuit board. Summary of the Invention

[0005] The purpose of the present invention is to address the problem that in the production of laser processing of micro-holes and micro-grooves on a circuit board, the operation of fixing and releasing the circuit board needs to be performed for each processing. The fixing and releasing operations are relatively cumbersome, and these additional operation times will significantly reduce the overall processing efficiency.

[0006] In order to achieve the above-mentioned invention purpose, the present invention provides a laser processing device and method for micro-holes and micro-grooves on a circuit board to improve the above problems.

[0007] Specifically, this application is as follows: It includes a machine body, a moving mechanism arranged on the machine body, a moving block arranged on the moving mechanism, a laser arranged on the machine body, a positioning plate arranged on the moving block, an infrared receiver arranged on the laser, and an infrared emitter arranged on the positioning plate. It is characterized in that it further includes a limiting mechanism arranged on the moving block; The limiting mechanism includes a slider slidably arranged on the moving block, a first cavity arranged in the slider, a guiding block slidably arranged on the first cavity, a limiting groove arranged on the guiding block, a rotating shaft rotatably arranged on the moving block, an L-shaped rod arranged on the positioning plate, and a first spring arranged on the guiding block.

[0008] As a preferred technical solution of the present application, the positioning plate is arranged on the rotating shaft, the L-shaped rod and the limiting groove are mutually adapted, and two ends of the first spring are respectively connected to corresponding surfaces of the first cavity and the guiding block.

[0009] As a preferred technical solution of the present application, a pushing column is slidably arranged on the slider, the pushing column is arranged on the guiding block, and a pressing block is arranged at an end of the pushing column.

[0010] As a preferred technical solution of the present application, a first bevel gear is arranged on the rotating shaft, a lead screw is rotatably arranged on the moving block, a second bevel gear is arranged on the lead screw, the first bevel gear and the second bevel gear are mutually adapted, and the slider is in threaded connection with the lead screw.

[0011] As a preferred technical solution of the present application, an end of the slider is wedge-shaped, a torsion spring is arranged outside the rotating shaft, and two ends of the torsion spring are respectively connected to the rotating shaft and the moving block.

[0012] As a preferred technical solution of the present application, an extrusion groove is arranged in the moving block, a fitting plate is slidably arranged on the extrusion groove, and a second spring is arranged on corresponding surfaces of the fitting plate and the extrusion groove.

[0013] As a preferred technical solution of the present application, a telescopic tube is arranged on the moving block, an end of the telescopic tube away from the moving block is arranged on the slider, a second cavity is arranged on the slider, the telescopic tube is communicated with the second cavity, a hose is fixedly penetrated through a bottom of the extrusion groove and the second cavity, and a plurality of inlet and outlet holes are arranged on the fitting plate.

[0014] As a preferred technical solution of the present application, an adjustment groove is arranged on the moving block, and the hose is slidably arranged on the adjustment groove.

[0015] As a preferred technical solution of the present application, a one-way valve is arranged on the slider, and the one-way valve is communicated with the second cavity.

[0016] A method for laser processing of micro-hole grooves on a circuit board, the method is as follows: Step S1, place the circuit board in the extrusion groove; Step S2, rotate the closing positioning plate. The rotating shaft rotates synchronously. The rotating shaft drives the first bevel gear to rotate synchronously. The first bevel gear drives the second bevel gear to rotate. The second bevel gear drives the lead screw to rotate synchronously. The lead screw drives the slider to slide from one end of the circuit board to the other end. By sliding the slider along the surface of the circuit board, the dust and impurities on the surface of the circuit board are cleaned. At the same time, when the L-shaped rod on the positioning plate passes through the cavity and presses the limiting groove together, since the contact end of the limiting groove and the L-shaped rod is wedge-shaped, the guiding block is pressed by the L-shaped rod and slides to the right along the cavity one, and the elastic force of the first spring drives the guiding block to reset, so that the L-shaped rod and the limiting groove are engaged, realizing the rapid fixation of the positioning plate. Then, the micro-holes of the circuit board are processed through the cooperation of the infrared receiver, infrared transmitter and laser; Step S3, when the micro-holes of the circuit board are processed, push the pressing block. The pressing block drives the ejecting post to slide. The guiding block and the ejecting post slide synchronously. At this time, the limiting of the L-shaped rod by the limiting groove is released, and then the limiting of the positioning plate is released. Rotate and unfold the positioning plate, and replace the processed circuit board with an unprocessed circuit board, and then repeat the work, realizing the rapid fixation and release of the positioning plate. At the same time, the rotating shaft drives the first bevel gear to rotate synchronously. The first bevel gear drives the second bevel gear to rotate. The second bevel gear drives the lead screw to rotate synchronously. The lead screw drives the slider to displace towards the direction of the rotating shaft, and the telescopic tube contracts. The air inside the telescopic tube is compressed, so that the air in the telescopic tube is compressed into the cavity two. It enters the hose through the cavity two, and finally the air enters the extrusion groove through the hose. The air in the extrusion groove is discharged from the inlet and outlet holes and the processed micro-holes of the circuit board, realizing the targeted heat dissipation of the micro-holes of the circuit board.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: In the solution of the present application: 1. In order to solve the problem that in the production of laser processing of micro-hole grooves on circuit boards in the prior art, the operation of fixing and releasing the circuit board is required for each processing, and this fixing and releasing operation is relatively cumbersome, and these additional operation times will significantly reduce the overall processing efficiency. In the present application, through the provided limiting mechanism, the automatic limiting and rapid release of the positioning plate are realized, improving the processing efficiency of the micro-holes of the circuit board; 2. Through the provided limiting mechanism, by rotating the closing positioning plate, the slider pre-cleans the surface of the circuit board, solving the problem that the dust and impurities on the surface of the circuit board in the prior art affect the processing accuracy; 3. Through the provided limiting mechanism, by rotating and unfolding the positioning plate, the targeted heat dissipation of the processed micro-holes of the circuit board is realized, solving the problem that the high temperature of the micro-holes of the circuit board in the prior art will reduce the quality of the surface of the circuit board. Description of the Drawings

[0018] Figure 1 Schematic structural diagram of the micro-hole groove laser processing device for the circuit board provided by this application; Figure 2 Overall structural diagram of the moving block of the micro-hole groove laser processing device for the circuit board provided by this application; Figure 3 Partial sectional structural diagram of the adjustment groove of the micro-hole groove laser processing device for the circuit board provided by this application; Figure 4 For the micro-hole groove laser processing device for the circuit board provided by this application Figure 3 Enlarged structural diagram of area A in; Figure 5 Partial sectional structural diagram of the moving block of the micro-hole groove laser processing device for the circuit board provided by this application; Figure 6 Internal two-dimensional structural diagram of the moving block of the micro-hole groove laser processing device for the circuit board provided by this application; Figure 7 Internal structural diagram of the extrusion groove of the micro-hole groove laser processing device for the circuit board provided by this application.

[0019] Labels in the figure: 1, machine body; 101, moving mechanism; 102, moving block; 103, laser; 104, positioning plate; 105, infrared receiver; 106, infrared emitter; 2, limiting mechanism; 201, slider; 202, cavity one; 203, guiding block; 204, limiting groove; 205, rotating shaft; 206, L-shaped rod; 207, spring one; 208, pushing column; 209, pressing block; 210, bevel gear one; 211, lead screw; 212, bevel gear two; 213, torsion spring; 214, extrusion groove; 215, fitting plate; 216, spring two; 217, telescopic tube; 218, cavity two; 219, hose; 220, inlet and outlet hole; 221, adjustment groove; 222, one-way valve. Specific implementation manners

[0020] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] As described in the background art, in the production of laser processing of micro-via grooves on a circuit board, the operation of fixing and releasing the circuit board is required for each processing. This fixing and releasing operation is relatively cumbersome, and these additional operation times will significantly reduce the overall processing efficiency.

[0022] To solve this technical problem, the present invention provides a laser processing device and method for micro-via grooves of a circuit board, which are applied to laser processing.

[0023] Specifically, please refer to Figures 1 - 7 As shown, the laser processing device for micro-via grooves of the circuit board specifically includes: a machine body 1, a moving mechanism 101 provided on the machine body 1, a moving block 102 provided on the moving mechanism 101, a laser 103 provided on the machine body 1, a positioning plate 104 provided on the moving block 102, an infrared receiver 105 provided on the laser 103, and an infrared transmitter 106 provided on the positioning plate 104. It is characterized in that it further includes a limiting mechanism 2 provided on the moving block 102. In the prior art, the moving mechanism 101 is used to adjust the displacement of the moving block 102 on the machine body 1 so that the laser 103 is aligned with the pre-processed micro-via on the circuit board. A processing micro-via is provided on the positioning plate 104. The laser 103 is used to emit laser light through the processing micro-via on the positioning plate 104 and act on the circuit board, so that the same micro-via as on the positioning plate 104 is generated on the circuit board. The infrared receiver 105 and the infrared transmitter 106 determine whether the laser 103 is aligned with the micro-via by whether a communication signal can be generated after the positioning plate 104 moves to a specified position; The limiting mechanism 2 includes a slider 201 slidably provided on the moving block 102, a first cavity 202 provided in the slider 201, a guiding block 203 slidably provided on the first cavity 202, a limiting groove 204 provided on the guiding block 203, a rotating shaft 205 rotatably provided on the moving block 102, an L-shaped rod 206 provided on the positioning plate 104, and a first spring 207 provided on the guiding block 203.

[0024] The laser processing device and method for micro-via grooves of the circuit board provided by the present invention are used to solve the problem that in the production of laser processing of micro-via grooves on a circuit board in the prior art, the operation of fixing and releasing the circuit board is required for each processing. This fixing and releasing operation is relatively cumbersome, and these additional operation times will significantly reduce the overall processing efficiency. Through the provided limiting mechanism 2, automatic limiting and rapid release of the positioning plate 104 are achieved, improving the processing efficiency of the micro-via on the circuit board; Through the provided limiting mechanism 2, by rotating and closing the positioning plate 104, the slider 201 pre-cleans the surface of the circuit board, solving the problem that dust and impurities on the surface of the circuit board in the prior art affect the processing accuracy; Through the provided limiting mechanism 2, by rotating and unfolding the positioning plate 104, targeted heat dissipation for the micro-holes of the processed circuit board is achieved, solving the problem in the prior art that the high temperature of the micro-holes of the circuit board can lead to a reduction in the quality of the circuit board surface.

[0025] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0026] It should be noted that, without conflict, the embodiments in the present invention and the features and technical solutions in the embodiments can be combined with each other.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0028] Embodiment 1, please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, for the laser processing device for the micro-hole grooves of the circuit board, its positioning plate 104 is arranged on the rotating shaft 205, the L-shaped rod 206 and the limiting groove 204 are mutually adapted, and both ends of the first spring 207 are respectively connected to the corresponding surfaces of the first cavity 202 and the guide block 203. During use, the circuit board is placed on the machine body 1, and by rotating the positioning plate 104, the positioning plate 104 is made to fit with the circuit board. When the L-shaped rod 206 on the positioning plate 104 passes through the first cavity 202 and presses the limiting groove 204, since the contact end of the limiting groove 204 and the L-shaped rod 206 is wedge-shaped, as Figure 4 shown, therefore the guide block 203 is pressed by the L-shaped rod 206 and slides to the right along the first cavity 202, and the elastic force of the first spring 207 drives the guide block 203 to reset, enabling the L-shaped rod 206 and the limiting groove 204 to be engaged, achieving rapid fixation of the positioning plate 104. Then, the micro-holes of the circuit board are processed through the cooperation of the infrared receiver 105, the infrared emitter 106 and the laser 103. Among them, the positioning plate 104 is detachable, and by replacing the positioning plate 104 with different micro-holes, processing of circuit boards with different specifications can be achieved; Furthermore, a jacking column 208 is slidably arranged on the slider 201. The jacking column 208 is arranged on the guide block 203, and a pressing block 209 is arranged at the end of the jacking column 208. When the micro-hole processing of the circuit board is completed, as Figure 4As shown, by pushing the pressing block 209, the pressing block 209 drives the pushing column 208 to slide, and the guiding block 203 and the pushing column 208 slide synchronously. At this time, the limiting of the L-shaped rod 206 by the limiting groove 204 is released, and then the limiting of the positioning plate 104 is released. Rotate and unfold the positioning plate 104, and replace the circuit board with processed micro-holes with an unprocessed circuit board, and then repeat the work, realizing the rapid fixing and releasing of the positioning plate 104, and improving the processing efficiency of the micro-holes; Further, a first bevel gear 210 is arranged on the rotating shaft 205, a lead screw 211 is rotatably arranged on the moving block 102, a second bevel gear 212 is arranged on the lead screw 211, the first bevel gear 210 and the second bevel gear 212 are mutually adapted, and the slider 201 and the lead screw 211 are connected by threads. When the positioning plate 104 rotates and fits with the slider 201, as Figure 5 shown, the rotating shaft 205 rotates synchronously, the rotating shaft 205 drives the first bevel gear 210 to rotate synchronously, the first bevel gear 210 drives the second bevel gear 212 to rotate, the second bevel gear 212 drives the lead screw 211 to rotate synchronously, and the lead screw 211 drives the slider 201 to slide from one end of the circuit board to the other end along the surface of the circuit board. By sliding the slider 201 along the surface of the circuit board, the dust and impurities on the surface of the circuit board are cleaned, realizing the pre-cleaning of the surface of the circuit board before processing, and preventing the dust and impurities on the surface of the circuit board from interfering with the focusing and energy transfer of the laser beam during the laser processing, resulting in a decrease in processing accuracy or an unsatisfactory processing effect; Further, the end of the slider 201 is wedge-shaped, a torsion spring 213 is arranged outside the rotating shaft 205, and the two ends of the torsion spring 213 are respectively connected to the rotating shaft 205 and the moving block 102. The end of the slider 201 is wedge-shaped to prevent the slider 201 from ejecting the circuit board when pre-cleaning the circuit board. When the limiting of the L-shaped rod 206 by the limiting groove 204 is released, the positioning plate 104 is released and unfolded, and the elastic force of the torsion spring 213 drives the positioning plate 104 to unfold quickly, reducing the working steps of manually rotating and unfolding the positioning plate 104 and improving the working efficiency; Further, an extrusion groove 214 is arranged in the moving block 102, a fitting plate 215 is slidably arranged on the extrusion groove 214, and a second spring 216 is arranged on the corresponding surfaces of the fitting plate 215 and the extrusion groove 214. During use, as Figure 6 shown, the circuit board is placed in the extrusion groove 214, with the circuit board directly above the fitting plate 215. The elastic force of the second spring 216 causes the fitting plate 215 to press the circuit board, making the circuit board fit the positioning plate 104. The second spring 216 can provide a uniform clamping force within its elastic range, ensuring that the circuit board is under uniform pressure during processing, avoiding deformation or damage of the circuit board caused by excessive local pressure, and maintaining a stable fixing effect even if the thickness of the circuit board changes; The quick fixation and release of the positioning plate 104 are realized through the limiting mechanism 2, which improves the processing efficiency of the micro-holes on the circuit board. At the same time, by rotating and closing the positioning plate 104, the slider 201 pre-cleans the surface of the circuit board, preventing dust and impurities on the surface of the circuit board from interfering with the focusing and energy transfer of the laser beam during the laser processing, resulting in a decrease in processing accuracy or an unsatisfactory processing effect.

[0029] Embodiment 2 further optimizes the laser processing device for the micro-hole grooves of the circuit board provided in Embodiment 1. Specifically, as Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7 shown, a telescopic tube 217 is arranged on the moving block 102. One end of the telescopic tube 217 away from the moving block 102 is arranged on the slider 201. A second cavity 218 is arranged on the slider 201. The telescopic tube 217 communicates with the second cavity 218. A hose 219 is fixedly penetrated through the bottom of the extrusion groove 214 and the second cavity 218. A plurality of inlet and outlet holes 220 are arranged on the attaching plate 215. When the positioning plate 104 is released from the limit and rotates and unfolds, the rotating shaft 205 drives the first bevel gear 210 to rotate synchronously. The first bevel gear 210 drives the second bevel gear 212 to rotate. The second bevel gear 212 drives the lead screw 211 to rotate synchronously. The lead screw 211 drives the slider 201 to displace towards the direction of the rotating shaft 205, and the telescopic tube 217 contracts. The air inside the telescopic tube 217 is compressed, so that the air in the telescopic tube 217 is compressed into the second cavity 218, enters the hose 219 through the second cavity 218, and finally the air enters the extrusion groove 214 through the hose 219. The air in the extrusion groove 214 is discharged from the inlet and outlet holes 220 and the processed micro-holes of the circuit board, realizing targeted heat dissipation for the micro-holes of the circuit board. Through targeted heat dissipation, the temperature of the micro-holes of the circuit board can be effectively reduced, the thermal damage of the circuit board can be reduced, and the quality of the surface of the processed circuit board can be improved; Furthermore, an adjustment groove 221 is arranged on the moving block 102. The hose 219 is slidably arranged in the adjustment groove 221. When the slider 201 slides, the hose 219 slides in the adjustment groove 221, preventing the hose 219 from being staggered and knotted, thereby reducing the heat dissipation efficiency for the micro-holes of the circuit board; Furthermore, a one-way valve 222 is arranged on the slider 201. The one-way valve 222 communicates with the second cavity 218. When the positioning plate 104 rotates and closes, the telescopic tube 217 unfolds. The outside air enters the second cavity 218 through the one-way valve 222, and one-way conduction is realized through the one-way valve 222; Targeted heat dissipation is carried out on the processed micro-holes of the circuit board through the limiting mechanism 2. Through targeted heat dissipation, the temperature of the micro-holes of the circuit board can be effectively reduced, the thermal damage of the circuit board can be reduced, and the quality of the surface of the processed circuit board can be improved.

[0030] Embodiment 3, a method for laser processing of micro-via grooves on a circuit board, comprising the following steps: Step S1, place the circuit board in the extrusion groove 214; Step S2, rotate the closing positioning plate 104, the rotating shaft 205 rotates synchronously, the rotating shaft 205 drives the first bevel gear 210 to rotate synchronously, the first bevel gear 210 drives the second bevel gear 212 to rotate, the second bevel gear 212 drives the lead screw 211 to rotate synchronously, the lead screw 211 drives the slider 201 to slide from one end of the circuit board to the other end along the surface of the circuit board. By sliding the slider 201 along the surface of the circuit board, dust and impurities on the surface of the circuit board are cleaned. At the same time, when the L-shaped rod 206 on the positioning plate 104 passes through the first cavity 202 and presses against the limiting groove 204, since the contact end of the limiting groove 204 and the L-shaped rod 206 is wedge-shaped, the guiding block 203 is pressed by the L-shaped rod 206 to slide to the right along the first cavity 202, and the elastic force of the first spring 207 drives the guiding block 203 to reset, so that the L-shaped rod 206 and the limiting groove 204 are engaged, realizing the rapid fixation of the positioning plate 104. Then, the micro-via holes of the circuit board are processed through the cooperation of the infrared receiver 105, the infrared transmitter 106 and the laser 103; Step S3, when the micro-via hole processing of the circuit board is completed, push the pressing block 209, the pressing block 209 drives the ejecting column 208 to slide, the guiding block 203 and the ejecting column 208 slide synchronously. At this time, the limiting of the L-shaped rod 206 by the limiting groove 204 is released, and then the limiting of the positioning plate 104 is released. Rotate and unfold the positioning plate 104, and replace the circuit board with processed micro-via holes with an unprocessed circuit board, and then repeat the operation, realizing the rapid fixation and release of the positioning plate 104. At the same time, the rotating shaft 205 drives the first bevel gear 210 to rotate synchronously, the first bevel gear 210 drives the second bevel gear 212 to rotate, the second bevel gear 212 drives the lead screw 211 to rotate synchronously, the lead screw 211 drives the slider 201 to displace towards the direction of the rotating shaft 205, and the telescopic tube 217 contracts. The air inside the telescopic tube 217 is compressed, so that the air in the telescopic tube 217 is compressed into the second cavity 218, enters the hose 219 through the second cavity 218, and finally the air enters the extrusion groove 214 through the hose 219, and the air in the extrusion groove 214 is discharged from the inlet and outlet holes 220 and the processed micro-via holes of the circuit board, realizing the targeted heat dissipation of the micro-via holes of the circuit board.

[0031] In the present invention, unless otherwise clearly specified or limited, the terms "installed", "connected", "joined", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or in communication with each other; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Obviously, the embodiments described above are only a part of the embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are shown in the drawings, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present invention in other related technical fields shall be within the scope of the patent protection of the present invention by the same token.

Claims

1. Laser processing device for micro via holes of circuit board, comprising a body, a moving mechanism arranged on the body, a moving block arranged on the moving mechanism, a laser arranged on the body, a positioning plate arranged on the moving block, an infrared receiver arranged on the laser and an infrared emitter arranged on the positioning plate, characterized in that, It further includes a limiting mechanism arranged on the moving block; The limiting mechanism includes a slider slidably arranged on the moving block, a first cavity arranged in the slider, a guiding block slidably arranged on the first cavity, a limiting groove arranged on the guiding block, a rotating shaft rotatably arranged on the moving block, an L-shaped rod arranged on the positioning plate, and a first spring arranged on the guiding block.

2. The laser processing device for micro via grooves of a circuit board according to claim 1, characterized in that, The positioning plate is arranged on the rotating shaft, the L-shaped rod and the limiting groove are mutually adapted, and the two ends of the first spring are respectively connected to the corresponding surfaces of the first cavity and the guiding block.

3. The laser processing device for micro-hole grooves of a circuit board according to claim 2, characterized in that, A pushing column is slidably arranged on the slider, the pushing column is arranged on the guiding block, and a pressing block is arranged at the end of the pushing column.

4. The laser processing device for micro via holes of the circuit board according to claim 3, wherein, A first bevel gear is arranged on the rotating shaft, a lead screw is rotatably arranged on the moving block, a second bevel gear is arranged on the lead screw, the first bevel gear and the second bevel gear are mutually adapted, and the slider is in threaded connection with the lead screw.

5. The laser processing device for micro via holes of the circuit board according to claim 4, characterized in that, The end of the slider is wedge-shaped, a torsion spring is arranged outside the rotating shaft, and the two ends of the torsion spring are respectively connected to the rotating shaft and the moving block.

6. The laser processing device for micro-via grooves of a circuit board according to claim 5, characterized in that, An extrusion groove is arranged in the moving block, a fitting plate is slidably arranged on the extrusion groove, and a second spring is arranged on the corresponding surfaces of the fitting plate and the extrusion groove.

7. The laser processing device for micro via holes of a circuit board according to claim 5, characterized in that, An expansion tube is arranged on the moving block, one end of the expansion tube away from the moving block is arranged on the slider, a second cavity is arranged on the slider, the expansion tube is communicated with the second cavity, a flexible tube is fixedly penetrated through the bottom of the extrusion groove and the second cavity, and a plurality of inlet and outlet holes are arranged on the fitting plate.

8. The laser processing device for micro via holes of a circuit board according to claim 7, characterized in that, An adjustment groove is arranged on the moving block, and the flexible tube is slidably arranged on the adjustment groove.

9. The laser processing device for micro-via grooves of a circuit board according to claim 8, wherein, A one-way valve is arranged on the slider, and the one-way valve is communicated with the second cavity.

10. A method for laser processing of micro-via grooves on a circuit board, using the laser processing device for micro-via grooves on a circuit board as described in claim 9, characterized in that, It includes the following steps: Step S: Place the circuit board in the extrusion groove; Step S: Rotate and close the positioning plate, the rotating shaft rotates synchronously, the rotating shaft drives the first bevel gear to rotate synchronously, the first bevel gear drives the second bevel gear to rotate, the second bevel gear drives the lead screw to rotate synchronously, the lead screw drives the slider to slide from one end of the circuit board to the other end along the circuit board, and the dust and impurities on the surface of the circuit board are cleaned by the slider sliding along the surface of the circuit board. At the same time, when the L-shaped rod on the positioning plate passes through the first cavity and presses the limiting groove, since the contact end of the limiting groove and the L-shaped rod is wedge-shaped, the guiding block is pressed by the L-shaped rod and slides rightward along the first cavity, and the elastic force of the first spring drives the guiding block to reset, so that the L-shaped rod and the limiting groove are engaged, realizing the rapid fixation of the positioning plate, and then the micropores of the circuit board are processed through the cooperation of the infrared receiver, the infrared emitter and the laser; Step S, when the micro-holes of the circuit board are processed, push the pressing block. The pressing block drives the pushing column to slide, and the guiding block and the pushing column slide synchronously. At this time, the limit of the L-shaped rod by the limiting groove is released, and then the limit of the positioning plate is released. Rotate and unfold the positioning plate, and replace the circuit board with processed micro-holes with an unprocessed circuit board, and then repeat the operation, realizing the rapid fixing and release of the positioning plate. At the same time, the rotating shaft drives the first bevel gear to rotate synchronously, the first bevel gear drives the second bevel gear to rotate, the second bevel gear drives the lead screw to rotate synchronously, the lead screw drives the slider to displace towards the direction of the rotating shaft, and the telescopic tube contracts. The air inside the telescopic tube is compressed, so that the air in the telescopic tube is compressed into the second cavity, enters the hose through the second cavity, and finally the air enters the extrusion groove through the hose. The air in the extrusion groove is discharged from the inlet and outlet holes and the processed micro-holes of the circuit board, realizing the targeted heat dissipation of the micro-holes of the circuit board.

Images