Ultra-short pulse laser high-frequency circuit board cutting device and cutting method thereof

Abstract

The invention belongs to the technical field of cutting devices, and discloses an ultrashort pulse laser high-frequency circuit board cutting device and a cutting method thereof.The ultrashort pulse laser high-frequency circuit board cutting device comprises a workbench, a transmission structure and a cutting structure, the transmission structure and the cutting structure are both installed in the workbench, and the cutting structure is arranged above the transmission structure; a fixing assembly is arranged in the workbench and comprises a fixing bottom plate and fixing top plates which are arranged in the workbench, the number of the fixing top plates is two, one sides of the two fixing top plates are fixedly connected with moving plates, and the two moving plates are slidably installed in the workbench. Firstly, a circuit board is placed at the top end of the conveying structure, the circuit board is conveyed to the position below the cutting structure through the conveying structure, then a motor is controlled to be started through a PLC, a fixing top plate moves downwards to fix the circuit board, finally, the circuit board is cut through the cutting structure, and deviation and vibration of the circuit board in the cutting process are prevented; and the cutting quality can be guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of cutting devices, and specifically relates to an ultra-short pulse laser high-frequency circuit board cutting device and a cutting method thereof. Background Art

[0002] A circuit board cutting device is a key equipment in the field of electronic manufacturing for cutting printed circuit boards (PCBs) into required sizes and shapes. Its technological development directly affects production efficiency and product quality. Especially in the process of ultra-short pulse laser high-frequency circuit board processing, its technological development not only profoundly affects production efficiency and product quality, but also plays a crucial role in this cutting-edge field of ultra-short pulse laser high-frequency circuit board processing; After retrieval, for example, in the patent: CN113910346B, a cutting device for circuit board sub-board design, which includes a workbench and a cutting machine, and further includes: a fixing plate fixedly connected to the workbench, wherein a rotating shaft is rotatably connected to the fixing plate, and a conveyor belt is rotatably connected to the rotating shaft; a gantry fixedly connected to the workbench, wherein the gantry is located on both sides of the fixing plate, and the cutting machine is arranged on the gantry; a fixing frame fixedly connected to the workbench, a groove is opened on the fixing frame, a first rotating rod is rotatably connected to the groove, and a grinding wheel is fixedly connected to the first rotating rod; this invention is simple to use and convenient to operate. It cuts through feeding with a conveyor belt, reducing the labor intensity of manual cutting, improving the convenience and efficiency of cutting. At the same time, by grinding and anti-oxidation treatment of the cutting area, the protection of the cut area of the circuit board is improved, and the quality of the circuit board is increased; When the current device cuts a circuit board, the two sides of the circuit board are positioned by the fixing plate. However, since the circuit board will vibrate during the cutting process, only positioning the two sides easily causes the circuit board to shift due to vibration or external force, resulting in inaccurate cutting positions, such as skewed cutting lines and dimensional deviations. Summary of the Invention

[0003] The purpose of the present invention is to provide an ultra-short pulse laser high-frequency circuit board cutting device and a cutting method thereof to solve the problems raised in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solution: An ultra-short pulse laser high-frequency circuit board cutting device, including a workbench, a transmission structure, and a cutting structure. Both the transmission structure and the cutting structure are installed inside the workbench. The cutting structure is arranged above the transmission structure, and a fixing component is arranged inside the workbench; Among them, the fixed component includes a fixed bottom plate and a fixed top plate arranged inside the workbench. The fixed bottom plate is fixedly connected to the workbench. The fixed top plate is arranged above the fixed bottom plate. There are two fixed top plates. One side of each of the two fixed top plates is fixedly connected to a moving plate. Both moving plates are slidably installed inside the workbench. The inner walls of both moving plates are threadedly connected to threaded rods. The bottom ends of both threaded rods are installed with motors.

[0005] As a further technical solution of the present invention, a buffer pad is fixedly installed at the bottom end of the fixed top plate.

[0006] As a further technical solution of the present invention, a groove is formed inside the fixed bottom plate. The groove is arranged below the cutting structure.

[0007] As a further technical solution of the present invention, dust suction pipes are uniformly installed inside the fixed bottom plate. Each dust suction pipe is fixedly connected through a first connecting pipe. The bottom end of the first connecting pipe is fixedly connected to a second connecting pipe. A dust suction pump is installed at the bottom end of the second connecting pipe.

[0008] As a further technical solution of the present invention, first dust suction holes are uniformly formed inside the fixed top plate. Each first dust suction hole is communicated. One end of one of the first dust suction holes is installed with a third connecting pipe. The third connecting pipe passes through the inner walls of the fixed top plate and the moving plate and extends downward into the inside of the fixed bottom plate and is connected to the first connecting pipe.

[0009] As a further technical solution of the present invention, second dust suction holes are uniformly formed inside the fixed top plate. The second dust suction holes are communicated with the inner cavities of the first dust suction holes.

[0010] As a further technical solution of the present invention, first ball valves and second ball valves are respectively arranged on the inner walls of the first dust suction holes and the second dust suction holes. The first ball valves and the second ball valves are rotatably installed inside the fixed top plate through rotating shafts. Gears are fixedly installed on the outer walls of both rotating shafts. Rack plates are meshed and connected to the bottom ends of both gears. The two rack plates are fixedly connected through a connecting plate. One end of the connecting plate is provided with a fixing plate. One side of the bottom end of the fixing plate is fixedly installed with a guiding block.

[0011] As a further technical solution of the present invention, a torsion spring is installed on the outer wall of the rotating shaft.

[0012] As a further technical solution of the present invention, the fixing plate is fixedly installed inside the workbench. The moving plate is slidably installed outside the fixing plate.

[0013] A cutting method for an ultra-short pulse laser high-frequency circuit board cutting device includes the following steps: S1: During operation, first place the circuit board on the top of the transmission structure. Convey the circuit board to the lower part of the cutting structure through the transmission structure. Then, start the motor through PLC control. When the motor starts, control the rotation of the threaded rod. The rotation of the threaded rod drives the moving plate to move downward. The movement of the moving plate drives the movement of the fixed top plate, causing the fixed top plate to move downward and cooperate with the fixed bottom plate to fix the circuit board. Then, cut the circuit board through the cutting structure; S2: When the fixed top plate moves downward, the movement of the fixed top plate drives the movement of the connecting plate. When one end of the connecting plate moves down to the top of the guiding block, due to the inclined guiding of the guiding block, the connecting plate moves into the fixed top plate. The movement of the connecting plate drives the movement of the rack plate. The movement of the rack plate drives the rotation of the gear. The rotation of the gear drives the rotation of the rotating shaft. The rotation of the rotating shaft drives the rotation of the second ball valve and the first ball valve, opening the first dust suction hole and closing the second dust suction hole; S3: During cutting, start the dust suction pump, connect it with the first connecting pipe through the second connecting pipe, so that the dust suction pipe generates negative pressure to suck away the waste chips generated during the cutting process from below the cutting structure; S4: After cutting, start the motor again through PLC control. Similarly, make the fixed top plate move upward to release the circuit board. When the connecting plate separates from the guiding block after the fixed top plate moves upward, the elastic potential energy is released by the coil spring to reverse and reset the rotating shaft. The second dust suction hole is opened and the first dust suction hole is closed. Dust is sucked from the top of the cut of the circuit board through the threaded rod, switching different dust suction states; S5: Finally, convey the cut circuit board away through the transmission structure to complete the cutting.

[0014] The beneficial effects of the present invention are as follows: Through the setting of the fixing component in the present invention, during operation, first place the circuit board on the top of the transmission structure. Convey the circuit board to the lower part of the cutting structure through the transmission structure. Then, start the motor through PLC control. When the motor starts, control the rotation of the threaded rod. The rotation of the threaded rod drives the moving plate to move downward. The movement of the moving plate drives the movement of the fixed top plate, causing the fixed top plate to move downward to fix the circuit board. Finally, cut the circuit board through the cutting structure. This device fixes the circuit board during cutting through the cooperation of the fixed bottom plate and the fixed top plate, preventing the circuit board from shifting and vibrating during the cutting process, which helps to ensure the cutting quality.

[0015] Through the setting of dust suction by the dust suction pipe during the cutting process in the present invention, during operation, start the dust suction pump, connect it with the first connecting pipe through the second connecting pipe, so that the dust suction pipe generates negative pressure to suck away the waste chips generated during the cutting process, preventing the dust generated during the cutting process from adhering to the surface of the circuit board or the cutting tool, increasing the friction force, resulting in problems such as inconsistent cutting depth or tool breakage, which helps to improve the cutting quality.

[0016] The present invention controls the internal dust suction of the first dust suction hole and the second dust suction hole through the first ball valve and the second ball valve. When the fixed top plate moves downward to fix the circuit board, the movement of the fixed top plate drives the movement of the connecting plate. When one end of the connecting plate moves downward to the top of the guiding block, the connecting plate moves into the fixed top plate under the inclined guiding of the guiding block. The movement of the connecting plate drives the movement of the rack plate, the movement of the rack plate drives the rotation of the gear, the rotation of the gear drives the rotation of the rotating shaft, and the rotation of the rotating shaft drives the rotation of the second ball valve and the first ball valve, so that the first dust suction hole is opened and the second dust suction hole is closed. When cutting the circuit board, dust is sucked on both sides of the cutting knife through the first dust suction hole. Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic sectional view of the overall structure of the present invention; Figure 3 For the present invention Figure 2 It is an enlarged schematic view of the structure at A in Figure 4 It is a schematic diagram of the structure at the fixed bottom plate and the fixed top plate of the present invention; Figure 5 It is a schematic sectional view of the structure at the fixed top plate of the present invention; Figure 6 For the present invention Figure 5 It is an enlarged schematic view of the structure at B in Figure 7 It is a schematic sectional view of the structure at the fixed bottom plate of the present invention.

[0018] In the figure: 1, workbench; 2, transmission structure; 3, cutting structure; 4, fixed bottom plate; 5, fixed top plate; 6, moving plate; 7, threaded rod; 8, motor; 9, buffer pad; 10, groove; 11, dust suction pipe; 12, first connecting pipe; 13, second connecting pipe; 14, dust suction pump; 15, third connecting pipe; 16, first dust suction hole; 17, second dust suction hole; 18, first ball valve; 19, second ball valve; 20, rotating shaft; 21, gear; 22, rack plate; 23, coil spring; 24, connecting plate; 25, fixing plate; 26, guiding block. Detailed Embodiment

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] Such as Figures 1 to 7As shown in the figure, in an embodiment of the present invention, an ultra-short pulse laser high-frequency circuit board cutting device includes a workbench 1, a transmission structure 2, and a cutting structure 3. The transmission structure 2 and the cutting structure 3 are both installed inside the workbench 1. The cutting structure 3 is arranged above the transmission structure 2, and a fixing component is arranged inside the workbench 1; Among them, the fixing component includes a fixing bottom plate 4 and a fixing top plate 5 arranged inside the workbench 1. The fixing bottom plate 4 is fixedly connected to the workbench 1. The fixing top plate 5 is arranged above the fixing bottom plate 4. There are two fixing top plates 5. One side of each of the two fixing top plates 5 is fixedly connected to a moving plate 6. The two moving plates 6 are both slidably installed inside the workbench 1. The inner walls of the two moving plates 6 are both threadedly connected to a threaded rod 7. The bottom ends of the two threaded rods 7 are both installed with a motor 8.

[0021] Existing: CN113910346B discloses a cutting device for circuit board sub-board design. The workbench 1, the transmission structure 2, and the cutting structure 3 proposed in this application document are disclosed in this patent. These technical means will not be elaborated one by one here; A certain gap is left between the two fixing top plates 5 for the cutting structure 3 to cut; During operation, first place the circuit board on the top of the transmission structure 2. The transmission structure 2 conveys the circuit board to the lower part of the cutting structure 3. Then, start the motor 8 through PLC control. When the motor 8 starts, it controls the threaded rod 7 to rotate. The rotation of the threaded rod 7 drives the moving plate 6 to move downward. The movement of the moving plate 6 drives the movement of the fixing top plate 5, so that the fixing top plate 5 moves downward to fix the circuit board. Finally, cut the circuit board through the cutting structure 3. The fixing bottom plate 4 and the fixing top plate 5 cooperate to fix the circuit board during cutting, preventing the circuit board from shifting and vibrating during the cutting process, which helps to ensure the cutting quality; After cutting, start the motor 8 again through PLC control. Similarly, move the fixing top plate 5 upward to release the circuit board. Finally, convey it away through the transmission structure 2 to complete the cutting.

[0022] As Figure 4 and Figure 5 shown, a buffer pad 9 is fixedly installed at the bottom end of the fixing top plate 5.

[0023] When the buffer pad 9 contacts the surface of the circuit board during fixing, it can not only prevent indentation or damage, but also absorb the vibration of the equipment, reducing the risk of the circuit board shifting or breaking due to vibration.

[0024] As Figure 4 and Figure 7 shown, a groove 10 is opened inside the fixing bottom plate 4. The groove 10 is arranged below the cutting structure 3.

[0025] The cutting tool in the cutting structure 3 is accommodated through the groove 10 to prevent the cutting structure 3 from coming into hard contact with the fixed structure during the cutting process.

[0026] As Figure 7 shown, dust suction pipes 11 are evenly installed inside the fixed bottom plate 4. Each dust suction pipe 11 is fixedly connected through a first connecting pipe 12. The bottom end of the first connecting pipe 12 is fixedly connected with a second connecting pipe 13, and a dust suction pump 14 is installed at the bottom end of the second connecting pipe 13.

[0027] During operation, the dust suction pump 14 is started. It is connected through the second connecting pipe 13 and the first connecting pipe 12, so that the dust suction pipes 11 generate negative pressure to suck away the waste chips generated during the cutting process, preventing the dust generated during the cutting process from adhering to the surface of the circuit board or the cutting tool, increasing the friction force, resulting in problems such as inconsistent cutting depth or tool breakage, and helping to improve the cutting quality.

[0028] As Figure 5 and Figure 6 shown, first dust suction holes 16 are evenly opened inside the fixed top plate 5. Each first dust suction hole 16 is communicated. One end of one of the first dust suction holes 16 is provided with a third connecting pipe 15. The third connecting pipe 15 passes through the inner walls of the fixed top plate 5 and the moving plate 6 and extends downward into the inside of the fixed bottom plate 4 and is connected with the first connecting pipe 12.

[0029] The inner cavities among the second connecting pipe 13, the third connecting pipe 15 and the first dust suction holes 16 are communicated; During operation, negative pressure is generated in the first dust suction holes 16 through the connection of the third connecting pipe 15 to suck away the dust generated during the cutting process from both sides of the cutting tool, preventing the dust from not only being generated from the bottom of the tool during cutting, but also splashing at high speed from both sides due to the rotation of the tool and the separation of the material. Suction from both sides can intercept the escape path of the dust and form a "surrounding" collection, reducing the dust diffusion range.

[0030] As Figure 5 and Figure 6 shown, second dust suction holes 17 are evenly opened inside the fixed top plate 5. The second dust suction holes 17 are communicated with the inner cavities of the first dust suction holes 16.

[0031] After cutting, when the fixed top plate 5 moves upward to release the circuit board, negative pressure is applied through the second dust suction holes 17 to suck the dust, debris and burrs remaining at the top of the cut of the circuit board, which helps with the subsequent processing of the circuit board.

[0032] The third connecting pipe 15 between the moving plate 6 and the fixed bottom plate 4 is flexibly arranged, so that the third connecting pipe 15 can deform when the fixed top plate 5 moves up and down to ensure stable connection.

[0033] As Figure 5 and Figure 6As shown, a first ball valve 18 and a second ball valve 19 are respectively arranged on the inner walls of the first dust suction hole 16 and the second dust suction hole 17. The first ball valve 18 and the second ball valve 19 are both rotatably installed inside the fixed top plate 5 through a rotating shaft 20. Gear 21 is fixedly installed on the outer wall of both rotating shafts 20. The bottom ends of both gears 21 are meshed with a rack plate 22. The two rack plates 22 are fixedly connected through a connecting plate 24. One end of the connecting plate 24 is provided with a fixing plate 25, and a guide block 26 is fixedly installed on one side of the bottom end of the fixing plate 25.

[0034] A second ball valve 19 is installed inside each second dust suction hole 17 in the fixed top plate 5, and each second ball valve 19 is fixedly connected through a rotating shaft 20; A first ball valve 18 is installed inside each first dust suction hole 16 in the fixed top plate 5, and each first ball valve 18 is also fixedly connected through a rotating shaft 20; The first dust suction hole 16 and the second dust suction hole 17 are controlled for dust suction through the first ball valve 18 and the second ball valve 19. When the fixed top plate 5 moves downward to fix the circuit board, the movement of the fixed top plate 5 drives the movement of the connecting plate 24. When one end of the connecting plate 24 moves downward to the top of the guide block 26, the connecting plate 24 moves into the fixed top plate 5 under the inclined guidance of the guide block 26. The movement of the connecting plate 24 drives the movement of the rack plate 22. The movement of the rack plate 22 drives the rotation of the gear 21. The rotation of the gear 21 drives the rotation of the rotating shaft 20. The rotation of the rotating shaft 20 drives the rotation of the second ball valve 19 and the first ball valve 18, so that the first dust suction hole 16 is opened and the second dust suction hole 17 is closed. During the cutting of the circuit board, dust is sucked on both sides of the cutting tool through the first dust suction hole 16.

[0035] As Figure 5 and Figure 6 shown, a torsion spring 23 is installed on the outer wall of the rotating shaft 20.

[0036] During cutting, the rotating shaft 20 rotates and the torsion spring 23 deforms to store elastic potential energy; After cutting, when the fixed top plate 5 moves upward and the connecting plate 24 is separated from the guide block 26, the elastic potential energy is released through the torsion spring 23 to make the rotating shaft 20 reverse and reset. The second dust suction hole 17 is opened and the first dust suction hole 16 is closed. Dust is sucked at the top of the cut of the circuit board through the threaded rod 7 to switch different dust suction states.

[0037] As Figure 2 and Figure 3 shown, the fixing plate 25 is fixedly installed inside the workbench 1, and the moving plate 6 is slidably installed outside the fixing plate 25.

[0038] A cutting method for an ultra-short pulse laser high-frequency circuit board cutting device includes the following steps: S1: During operation, first place the circuit board on the top of the transmission structure 2. The circuit board is conveyed by the transmission structure 2 to the lower part of the cutting structure 3. Then, start the motor 8 through PLC control. When the motor 8 starts, it controls the rotation of the threaded rod 7. The rotation of the threaded rod 7 drives the moving plate 6 to move downward. The movement of the moving plate 6 drives the movement of the fixed top plate 5, causing the fixed top plate 5 to move downward and cooperate with the fixed bottom plate 4 to fix the circuit board. Then, cut the circuit board through the cutting structure 3; S2: When the fixed top plate 5 moves downward, the movement of the fixed top plate 5 drives the movement of the connecting plate 24. When one end of the connecting plate 24 moves down to the top of the guiding block 26, under the inclined guiding of the guiding block 26, the connecting plate 24 moves into the fixed top plate 5. The movement of the connecting plate 24 drives the movement of the rack plate 22. The movement of the rack plate 22 drives the rotation of the gear 21. The rotation of the gear 21 drives the rotation of the rotating shaft 20. The rotation of the rotating shaft 20 drives the rotation of the second ball valve 19 and the first ball valve 18, opening the first dust suction hole 16 and closing the second dust suction hole 17; S3: During cutting, start the dust suction pump 14, connect it with the first connecting pipe 12 through the second connecting pipe 13, so that the dust suction pipe 11 generates negative pressure to suck away the waste chips generated during cutting from the lower part of the cutting structure 3; S4: After cutting, start the motor 8 again through PLC control. Similarly, move the fixed top plate 5 upward to release the circuit board. When the fixed top plate 5 moves upward and the connecting plate 24 separates from the guiding block 26, the elastic potential energy is released by the coil spring 23 to reverse and reset the rotating shaft 20, opening the second dust suction hole 17 and closing the first dust suction hole 16, and sucking dust at the top of the cut of the circuit board through the threaded rod 7, switching different dust suction states; S5: Finally, convey the cut circuit board away through the transmission structure 2 to complete the cutting.

[0039] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ultra-short pulse laser high-frequency circuit board cutting device, comprising a workbench (1), a transmission structure (2) and a cutting structure (3), characterized in that: The transmission structure (2) and the cutting structure (3) are both installed inside the workbench (1). The cutting structure (3) is arranged above the transmission structure (2). A fixing component is arranged inside the workbench (1). Among them, the fixing component includes a fixing bottom plate (4) and a fixing top plate (5) arranged inside the workbench (1). The fixing bottom plate (4) is fixedly connected to the workbench (1). The fixing top plate (5) is arranged above the fixing bottom plate (4). There are two fixing top plates (5). One side of each of the two fixing top plates (5) is fixedly connected to a moving plate (6). The two moving plates (6) are both slidably installed inside the workbench (1). The inner walls of the two moving plates (6) are both threadedly connected to threaded rods (7). The bottom ends of the two threaded rods (7) are both installed with motors (8).

2. The ultra-short pulse laser high-frequency circuit board cutting device according to claim 1, characterized in that: A buffer pad (9) is fixedly installed at the bottom end of the fixing top plate (5).

3. The ultra-short pulse laser high-frequency circuit board cutting device according to claim 1, characterized in that: A groove (10) is formed inside the fixing bottom plate (4). The groove (10) is arranged below the cutting structure (3).

4. A high-frequency circuit board cutting device for ultra-short pulse lasers according to claim 1, characterized in that: Dust suction pipes (11) are evenly installed inside the fixing bottom plate (4). Each of the dust suction pipes (11) is fixedly connected through a first connecting pipe (12). The bottom end of the first connecting pipe (12) is fixedly connected to a second connecting pipe (13). A dust suction pump (14) is installed at the bottom end of the second connecting pipe (13).

5. The ultra-short pulse laser high-frequency circuit board cutting device according to claim 1, characterized in that: First dust suction holes (16) are evenly formed inside the fixing top plate (5). Each of the first dust suction holes (16) is communicated with each other. One end of one of the first dust suction holes (16) is installed with a third connecting pipe (15). The third connecting pipe (15) passes through the inner walls of the fixing top plate (5) and the moving plate (6) and extends downward into the inside of the fixing bottom plate (4) and is connected to the first connecting pipe (12).

6. The ultra-short pulse laser high-frequency circuit board cutting device according to claim 5, wherein: Second dust suction holes (17) are evenly formed inside the fixing top plate (5). The second dust suction holes (17) are communicated with the inner cavities of the first dust suction holes (16).

7. A high-frequency circuit board cutting device for ultra-short pulse lasers according to claim 5, characterized in that: First ball valves (18) and second ball valves (19) are respectively arranged on the inner walls of the first dust suction holes (16) and the second dust suction holes (17). The first ball valves (18) and the second ball valves (19) are both rotatably installed inside the fixing top plate (5) through rotating shafts (20). Gear (21) is fixedly installed on the outer walls of the two rotating shafts (20). The bottom ends of the two gears (21) are both meshed with a rack plate (22). The two rack plates (22) are fixedly connected through a connecting plate (24). One end of the connecting plate (24) is provided with a fixing plate (25). A guiding block (26) is fixedly installed on one side of the bottom end of the fixing plate (25).

8. An ultra-short pulse laser high-frequency circuit board cutting device according to claim 7, characterized in that: A coil spring (23) is installed on the outer wall of the rotating shaft (20).

9. The ultra-short pulse laser high-frequency circuit board cutting device according to claim 7, wherein: The fixing plate (25) is fixedly installed inside the workbench (1). The moving plate (6) is slidably installed outside the fixing plate (25).

10. A cutting method for a cutting device of an ultra-short pulse laser high-frequency circuit board, which is applicable to the ultra-short pulse laser high-frequency circuit board cutting device described in the above claims 1-9, characterized in that, Including the following steps: S1: During operation, first place the circuit board on the top of the transmission structure (2). The circuit board is conveyed by the transmission structure (2) to the lower part of the cutting structure (3). Then, start the motor (8) through PLC control. When the motor (8) starts, it controls the rotation of the threaded rod (7). The rotation of the threaded rod (7) drives the moving plate (6) to move downward. The movement of the moving plate (6) drives the movement of the fixed top plate (5), so that the fixed top plate (5) moves downward to cooperate with the fixed bottom plate (4) to fix the circuit board. Then, cut the circuit board through the cutting structure (3). S2: When the fixed top plate (5) moves downward, the movement of the fixed top plate (5) drives the movement of the connecting plate (24). When one end of the connecting plate (24) moves downward to the top of the guiding block (26), the connecting plate (24) moves into the fixed top plate (5) under the inclined guiding of the guiding block (26). The movement of the connecting plate (24) drives the movement of the rack plate (22). The movement of the rack plate (22) drives the rotation of the gear (21). The rotation of the gear (21) drives the rotation of the rotating shaft (20). The rotation of the rotating shaft (20) drives the rotation of the second ball valve (19) and the first ball valve (18), so that the first dust suction hole (16) is opened and the second dust suction hole (17) is closed. S3: During cutting, start the dust suction pump (14). Connect it to the first connecting pipe (12) through the second connecting pipe (13), so that the dust suction pipe (11) generates negative pressure to suck away the waste chips generated during the cutting process from below the cutting structure (3). S4: After cutting, start the motor (8) again through PLC control. Similarly, move the fixed top plate (5) upward to loosen the circuit board. When the connecting plate (24) separates from the guiding block (26) after the fixed top plate (5) moves upward, the elastic potential energy is released by the coil spring (23) to reverse and reset the rotating shaft (20). The second dust suction hole (17) is opened and the first dust suction hole (16) is closed. The dust at the top of the cut of the circuit board is sucked through the threaded rod (7), and different dust suction states are switched. S5: Finally, convey the cut circuit board away through the transmission structure (2) to complete the cutting.

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