Chip resistor packaging device and packaging method

Abstract

The invention relates to the technical field of chip resistor packaging, and particularly discloses a chip resistor packaging device and method.The chip resistor packaging device comprises a device body, a conveying belt is installed in the device body, two containing boxes are installed on the outer wall of the conveying belt, and a plurality of moving plates are arranged in the two containing boxes; and two driving plates are mounted in each of the two placement boxes, correction mechanisms are arranged at the tops of the two placement boxes, and a detection mechanism and a machining mechanism are arranged at the top of the device body. According to the device, through mutual cooperation of the correction mechanism arranged at the top of the placement box and the multiple moving plates, the positions of the multiple resistors placed in the placement box can be automatically pushed and corrected, it is ensured that the multiple resistors are located in the middle positions in the multiple placement grooves, and the accuracy of subsequent machining of the resistors by a machining mechanism is improved; and waste materials generated in the resistor packaging process are reduced, so that the production cost of an enterprise is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip resistor packaging, and specifically relates to a packaging device and a packaging method for chip resistors. Background Art

[0002] A chip resistor is a surface-mounted component widely used in modern electronic circuits. It has the characteristics of small size, light weight, high installation density, and high automation production efficiency, and is one of the key components for the miniaturization, light weight, and high performance of electronic devices. When a chip resistor is subjected to packaging processing, a variety of devices and equipment are required, covering the complete process from material preparation to finished product packaging, specifically including: substrate preparation, printing, sintering, laser trimming, end face treatment, testing and sorting, and taping packaging. Through these devices and processes, the chip resistor can achieve high precision, miniaturization, and mass production, meeting the requirements of the electronics industry for miniaturized and high-performance components.

[0003] In the prior art, during the packaging process of chip resistors, a laser cutting device is usually used to perform laser trimming operations on the sintered resistors, especially in the resistor value adjustment and fine-tuning links. However, when using a laser cutting device to cut and process the resistors, no relevant mechanism for correcting the position of the resistors is provided. The resistors to be processed are simply conveyed to the lower part of the laser cutting device by a conveyor belt. Since the conveyor belt will vibrate during operation, the position of the resistors will deviate after being vibrated, which is not conducive to the subsequent accurate laser cutting process of the laser cutting device, resulting in more waste during the packaging process of the resistors and increasing the production cost of the enterprise. Summary of the Invention

[0004] The purpose of the present invention is to solve the disadvantages existing in the prior art, and to propose a packaging device and a packaging method for chip resistors.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions: A packaging device for chip resistors includes a device body. A conveyor belt is rotatably installed inside the device body. Two placement boxes are installed on the outer wall of the conveyor belt. The interiors of the two placement boxes are each divided into a plurality of placement slots by a plurality of moving plates provided therein. Two driving plates for driving the movement and adjustment of the plurality of moving plates are slidably installed at the central positions of the interiors of the two placement boxes. Correction mechanisms for correcting the positions of both ends of the resistors placed in the plurality of placement slots are provided at the tops of the two placement boxes. A detection mechanism for automatically detecting the resistors and a processing mechanism for automatically processing the resistors are respectively provided at the top of the device body.

[0006] Optionally, the detection mechanism includes two first chutes opened at the top of the device body. First sliders are installed inside both of the two first chutes, and a moving frame is jointly installed at the tops of the two first sliders.

[0007] Optionally, a second chute is opened at the bottom of the moving frame. A second slider is installed inside the second chute, and the bottom end of the second slider is connected to a mounting plate through an electric telescopic rod. Multiple industrial cameras and vacuum suction cups are respectively installed at the bottom of the mounting plate.

[0008] Optionally, the processing mechanism includes two telescopic cylinders installed at the top of the device body. The telescopic ends of the two telescopic cylinders are jointly installed with a top plate. A third chute is opened at the bottom of the top plate. A third slider is installed inside the third chute, and the bottom end of the third slider is installed with a cross plate. A fourth chute is opened at the bottom of the cross plate. A fourth slider is installed inside the fourth chute, and a laser head is installed at the bottom end of the fourth slider.

[0009] Optionally, first double-headed screws are rotatably installed on the outer walls of both sides of the placement box. Both ends of the two driving plates are threadedly connected to the first double-headed screws close to them. First electromagnets are installed on the outer walls of the two driving plates away from each other, and both of the two first electromagnets are magnetically fixed to the moving plates close to them.

[0010] Optionally, two mounting seats are arranged between multiple moving plates. Two connecting rods are rotatably installed on the outer walls of the two sides of the ends of multiple moving plates close to each other. The ends of the two connecting rods away from the moving plates are rotatably connected to the mounting seats close to them.

[0011] Optionally, the correction mechanism includes two grooves opened at the top of the placement box. Second double-headed screws are rotatably installed inside both of the two grooves. Moving blocks are threadedly installed on the outer walls of the two second double-headed screws. A rotating plate is jointly rotatably installed between two cooperating moving blocks.

[0012] Optionally, sliding plates with the same number as the placement grooves are slidably installed at the bottoms of both of the two rotating plates. Shells are installed on the outer walls of the two rotating plates away from each other. Winding rollers are rotatably installed inside both of the two shells.

[0013] Optionally, shielding cloths are wound on the outer walls of both of the two winding rollers. Connecting plates are installed at the ends of the two shielding cloths away from the winding rollers. Second electromagnets are preset inside both of the two connecting plates.

[0014] Optionally, a packaging method for chip resistors includes the above packaging device, and this packaging method further includes the following steps: Step 1: Place the resistors to be processed inside the placement box, and automatically identify and detect multiple resistors with the aid of the detection mechanism; Step 2: After the detection of multiple resistors inside the placement box is completed, control the two first double-headed screws to drive the two driving plates to move away from each other, push the three moving plates on the side where the two driving plates move away from each other, so that the multiple moving plates move and adjust inside the placement box together, and then synchronously push the resistors placed inside the placement box to ensure that the positions of the multiple resistors in the multiple placement slots are all horizontal; Step 3: After the multiple moving plates push and correct the two sides of the multiple resistors inside the placement box, control the two second double-headed screws to drive the two moving blocks and the rotating plate to move and adjust towards each other, drive the multiple sliding plates to push and correct the other two sides of the resistors inside the corresponding placement slots together, and ensure that the multiple resistors are in the central positions inside the multiple placement slots; Step 4: After the positions of the multiple resistors inside the placement box are corrected through the above-mentioned Step 2 and Step 3, control the conveyor belt to rotate counterclockwise to drive the placement box to move to directly below the processing mechanism, and use the processing mechanism to perform relevant laser cutting processing on the multiple resistors placed inside the placement box to make the resistors meet the design requirements; Step 5: After the resistors inside the placement box are subjected to relevant laser cutting treatment by the processing mechanism, continue to control the conveyor belt to rotate counterclockwise until the placement box moves to the left end close to the device body, and use the preset blanking manipulator at the left end of the device body to automatically take out and blank the cut and processed resistors. As the conveyor belt continues to rotate counterclockwise, drive the placement box on the top of the conveyor belt to rotate to the bottom, and the placement box at the bottom of the conveyor belt rotates to the top, so that the loading manipulator continues to place the subsequent resistors to be processed inside it for relevant detection and processing.

[0015] The beneficial effects of the present invention are as follows: 1. In this invention, through the mutual cooperation between the correction mechanism arranged on the top of the placement box and the multiple moving plates, the positions of the multiple resistors placed inside the placement box can be automatically pushed and corrected, ensuring that the multiple resistors are in the central positions inside the multiple placement slots, improving the accuracy of the subsequent processing mechanism for resistor processing, reducing the generation of waste materials during the resistor packaging process, and thus reducing the production cost of the enterprise.

[0016] 2. In this invention, during the process of the placement box on the top of the conveyor belt rotating to the bottom, the resistor waste materials remaining inside the placement box can be automatically discharged downward from the inside of the placement box, achieving the effect of automatically cleaning and removing the resistor waste materials, and avoiding the problem that the resistor waste materials remain inside the placement box and cause obstacles to the subsequent resistors to be processed.

[0017] 3. In this invention, by pushing the multiple moving plates with the two driving plates, the resistor waste materials located inside the placement box can be extruded and crushed. After the resistor waste materials are extruded and crushed, it is convenient for subsequent recycling of relevant materials.

[0018] 4. In this invention, during the process of squeezing and crushing the resistive waste inside the placement box, the two shielding cloths are located at the top of the placement box and shield the opening at the top of the placement box, which can prevent the resistive waste from splashing out during the squeezing and crushing process by multiple moving plates. Furthermore, it can improve the safety of squeezing and crushing the resistive waste and avoid the problem that the squeezed and crushed resistive waste splashes out and subsequent workers need to collect it again centrally. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] For the convenience of those skilled in the art to understand, the present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of a packaging device for a chip resistor proposed by the present invention; Figure 2 It is a schematic diagram of the structure of the device body in the present invention; Figure 3 It is a schematic diagram of the structure of the conveyor belt and two placement boxes in the present invention; Figure 4 It is a schematic diagram of the structure of the detection mechanism in the present invention; Figure 5 It is a schematic diagram of the structure of the processing mechanism in the present invention; Figure 6 It is a schematic diagram of the structure of one of the placement boxes in the present invention; Figure 7 is Figure 6 the schematic diagram of the structure excluding the correction mechanism; Figure 8 It is a schematic diagram of the structure of multiple moving plates in the present invention; Figure 9 It is a schematic diagram of the structure of two driving plates in the present invention; Figure 10 It is a schematic diagram of the structure of the correction mechanism in the present invention; Figure 11 It is a schematic diagram of the structure at the bottom of one of the rotating plates in the present invention; Figure 12 It is a schematic diagram of the structure of one of the winding rollers and the shielding cloth in the present invention.

[0021] In the figure: 1. device body; 2. conveyor belt; 3. mobile frame; 4. electric telescopic rod; 5. mounting plate; 6. first slide groove; 7. telescopic cylinder; 8. top plate; 9. cross plate; 10. laser head; 11. placement box; 12. mobile plate; 13. first slider; 14. second slide groove; 15. second slider; 16. industrial camera; 17. vacuum suction cup; 18. third slide groove; 19. fourth slide groove; 20. first double-headed screw; 21. drive plate; 22. groove; 23. moving block; 24. rotating plate; 25. shell; 26. mounting seat; 27. connecting rod; 28. first electromagnet; 29. second double-headed screw; 30. sliding plate; 31. winding roller; 32. shielding cloth; 33. connecting plate. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Reference Figures 1-12 A packaging device for chip resistors includes a device body 1, a conveyor belt 2 is rotatably installed inside the device body 1, two placement boxes 11 are installed on the outer wall of the conveyor belt 2, the interiors of the two placement boxes 11 are divided into multiple placement slots by multiple movable plates 12, two driving plates 21 for driving the multiple movable plates 12 to move and adjust are slidably installed at the center position of the two placement boxes 11, the tops of the two placement boxes 11 are provided with correction mechanisms for correcting the positions of the two ends of the resistors placed in the multiple placement slots, and the top of the device body 1 is respectively provided with a detection mechanism for automatically detecting the resistors and a processing mechanism for automatically processing the resistors.

[0024] As a technical optimization solution of the present invention, the detection mechanism includes two first slide grooves 6 opened at the top of the device body 1, and the first sliders 13 are installed inside the two first slide grooves 6, and the top of the two first sliders 13 is commonly installed with a moving frame 3. The two first slide grooves 6 are preset with first linear motors, and the two first linear motors drive the two first sliders 13 to move back and forth inside the corresponding first slide grooves 6, and drive the moving frame 3 to move and adjust at the top of the device body 1.

[0025] As a technical optimization solution of the present invention, a second chute 14 is provided at the bottom of the moving frame 3. A second slider 15 is installed inside the second chute 14. The bottom end of the second slider 15 is connected to a mounting plate 5 through an electric telescopic rod 4. A plurality of industrial cameras 16 and vacuum suction cups 17 are respectively installed at the bottom of the mounting plate 5. A second linear motor is preset inside the second chute 14. The second linear motor can drive the second slider 15 to move back and forth inside the second chute 14, and then drive the electric telescopic rod 4 and the mounting plate 5 to move synchronously for adjustment. During the telescopic process of the telescopic end of the electric telescopic rod 4, it can drive the mounting plate 5 and a plurality of industrial cameras 16 and vacuum suction cups 17 provided at the bottom thereof to move synchronously for adjustment. A plurality of industrial cameras 16 are all industrial cameras of model BIP2-1300c-dn in the prior art. A plurality of vacuum suction cups 17 are all connected to a preset external vacuum device through hoses, so that the plurality of vacuum suction cups 17 have suction when in use.

[0026] As a technical optimization solution of the present invention, the processing mechanism includes two telescopic cylinders 7 installed on the top of the device body 1. The telescopic ends of the two telescopic cylinders 7 are jointly installed with a top plate 8. A third chute 18 is provided at the bottom of the top plate 8. A third slider is installed inside the third chute 18. The bottom end of the third slider is installed with a cross plate 9. A fourth chute 19 is provided at the bottom of the cross plate 9. A fourth slider is installed inside the fourth chute 19. The bottom end of the fourth slider is installed with a laser head 10. A third linear motor is preset inside the third chute 18. The third linear motor can drive the third slider to move back and forth inside the third chute 18, and then drive the cross plate 9 to move and adjust at the bottom of the top plate 8. A fourth linear motor is preset inside the fourth chute 19. The fourth linear motor can drive the fourth slider to move back and forth inside the fourth chute 19, and then drive the laser head 10 to move and adjust at the bottom of the cross plate 9.

[0027] As a technical optimization solution of the present invention, first double-headed screws 20 are rotatably installed on the outer walls on both sides of the placement box 11. Both ends of the two driving plates 21 are threadedly connected to the first double-headed screws 20 close to them. First electromagnets 28 are installed on the outer walls on the opposite sides of the two driving plates 21. The two first electromagnets 28 are magnetically fixed to the moving plates 12 close to them. Two first driving motors are preset on the outer wall of the placement box 11. The output ends of the two first driving motors are connected to one end of the first double-headed screws 20 close to them, so as to drive the two first double-headed screws 20 to rotate on both sides of the placement box 11, and then drive the two driving plates 21 to move and adjust in the placement box 11 in the direction of approaching or separating from each other. After the two first electromagnets 28 are electrified to generate magnetism, they can be magnetically fixed to the moving plates 12 in contact with them.

[0028] As a technical optimization solution of the present invention, two mounting seats 26 are provided between multiple moving plates 12. On the outer walls of the two ends of multiple moving plates 12 close to each other, two connecting rods 27 are rotatably mounted. The ends of the two connecting rods 27 away from the moving plates 12 are rotatably connected to the adjacent mounting seats 26. After the two first electromagnets 28 are magnetically fixed to the adjacent moving plates 12, with the movement of the two driving plates 21, multiple moving plates 12 can be driven to move and adjust synchronously inside the placement box 11, that is, the two driving plates 21 can push and pull the three moving plates 12 on the side away from them inside the placement box 11. During the movement of the three moving plates 12, with the cooperation of the two mounting seats 26 and the connecting rods 27 provided on the adjacent side, the three moving plates 12 can move and adjust in the same direction inside the placement box 11 together.

[0029] As a technical optimization solution of the present invention, the correction mechanism includes two grooves 22 opened on the top of the placement box 11. In the interiors of the two grooves 22, second double-headed screws 29 are rotatably mounted. Moving blocks 23 are threadedly mounted on the outer walls of the two second double-headed screws 29. A rotating plate 24 is rotatably mounted between two cooperating moving blocks 23. Two second driving motors are preset on the outer wall of one side of the placement box 11. The output ends of the two second driving motors are respectively connected to one end of the two second double-headed screws 29, so as to drive the two second double-headed screws 29 to rotate inside the corresponding grooves 22, and then drive the two moving blocks 23 to move towards each other or away from each other, and further drive the two rotating plates 24 to move and adjust towards each other or away from each other on the top of the placement box 11 together; and third driving motors are preset inside two of the moving blocks 23. The output ends of the two third driving motors are respectively connected to the rotating parts at one end of the two rotating plates 24, so as to drive the two rotating plates 24 to rotate and adjust between the corresponding two moving blocks 23.

[0030] As a technical optimization solution of the present invention, sliding plates 30 with the same number as the placement grooves are slidably mounted at the bottoms of the two rotating plates 24. Shells 25 are mounted on the outer walls of the two rotating plates 24 away from each other. Winding rollers 31 are rotatably mounted inside the two shells 25. Fourth driving motors are preset on the outer wall of one side of the two shells 25. The output ends of the two fourth driving motors are respectively connected to one end of the corresponding winding rollers 31, so as to drive the two winding rollers 31 to rotate and adjust inside the corresponding shells 25.

[0031] As a technical optimization solution of the present invention, the outer walls of the two winding rollers 31 are both rolled up with shielding cloth 32, and the ends of the two shielding cloths 32 away from the winding rollers 31 are both installed with connecting plates 33, and the interiors of the two connecting plates 33 are both preset with second electromagnets. During the rotation of the two winding rollers 31, the shielding cloth 32 rolled up on the outer walls thereof can be driven to unfold or roll up.

[0032] As a technical optimization solution of the present invention, a packaging method of a chip resistor includes the packaging device described above, and the packaging method further includes the following steps: Step 1: placing the resistors to be processed inside the placement box 11, and automatically identifying and detecting the multiple resistors with the help of a detection mechanism; Step 2: After the detection of the multiple resistors inside the placement box 11 is completed, the two first double-headed screws 20 are controlled to drive the two driving plates 21 to move in the direction away from each other, and the three movable plates 12 on the side away from the two driving plates 21 are pushed, so that the multiple movable plates 12 are moved and adjusted together inside the placement box 11, and the resistors placed inside the placement box 11 are synchronously pushed to ensure that the positions of the multiple resistors inside the multiple placement slots are all in a horizontal state; Step 3: After the multiple moving plates 12 push and correct the two sides of the multiple resistors inside the placement box 11, the two second double-headed screws 29 are controlled to drive the two moving blocks 23 and the rotating plate 24 to move and adjust in the direction of approaching each other, and drive the multiple sliding plates 30 to push and correct the other two sides of the resistors inside the corresponding placement slots, ensuring that the multiple resistors are located in the center of the multiple placement slots; Step 4: After the positions of the multiple resistors in the placement box 11 are corrected through the above steps 2 and 3, the conveyor belt 2 is controlled to rotate counterclockwise to drive the placement box 11 to move directly under the processing mechanism, and the multiple resistors placed in the placement box 11 are subjected to relevant laser cutting processing with the help of the processing mechanism, so that the resistors meet the design requirements; Step 5: After the resistors inside the placement box 11 are laser cut by the processing mechanism, continue to control the conveyor belt 2 to rotate counterclockwise until the placement box 11 moves to the left end close to the device body 1, and use the unloading robot preset at the left end of the device body 1 to automatically remove the cut resistors. As the conveyor belt 2 continues to rotate counterclockwise, the placement box 11 at the top of the conveyor belt 2 is driven to rotate to the bottom, and the placement box 11 at the bottom of the conveyor belt 2 rotates to the top, so that the loading robot continues to place the subsequent resistors to be processed inside it for related testing and processing.

[0033] In this embodiment, the width of the strip-shaped resistor is less than the distance between two adjacent moving plates 12, that is, less than the width of the placement groove and greater than the width of the sliding plate 30. When multiple moving plates 12 push on both sides of the resistor, after the two sides of the resistor come into contact with the moving plates 12, the sliding plate 30 will not disengage from the moving plates 12. The sliding plate 30 remains between two adjacent moving plates 12 but does not hinder the movement of the moving plates 12.

[0034] In the present invention, when the user uses the device, as Figure 1 shown, multiple strip-shaped resistors to be processed are sequentially placed inside the placement box 11 by means of a preset loading manipulator, and it is ensured that the multiple resistors are respectively located inside multiple placement grooves. At this time, the telescopic end of the electric telescopic rod 4 is controlled to extend downward, driving the mounting plate 5 and multiple industrial cameras 16 at its bottom to move downward together to a position close to the placement box 11. By means of the reciprocating movement of the second slider 15 inside the second chute 14, the mounting plate 5 and multiple industrial cameras 16 are driven to reciprocate and adjust on the top of the placement box 11, so that the multiple industrial cameras 16 can automatically identify and detect the resistors placed inside the multiple placement grooves. If it is detected that the resistor to be processed has a quality problem, the telescopic end of the electric telescopic rod 4 can be controlled to continue to move downward, driving the multiple vacuum suction cups 17 to abut against the top of the resistor and adsorb and fix it. As the telescopic end of the electric telescopic rod 4 retracts upward to its original position, the resistor can be driven to move upward out of the placement box 11, and the taken-out resistor can be transported from the bottom of the multiple vacuum suction cups 17 by means of a preset transfer manipulator, so as to achieve the effect of pre-detecting the resistor to be processed and automatically removing the resistor with unqualified quality, and avoiding the processing mechanism from continuing to process the resistor with unqualified quality.

[0035] After the detection of the multiple resistors inside the placement box 11 is completed, the two first double-headed screws 20 can be controlled to rotate together, driving the two driving plates 21 to move in opposite directions, and then pushing the three moving plates 12 on the opposite sides of the two driving plates 21, so that the three moving plates 12 move toward both sides inside the placement box 11 together. During the process of the multiple moving plates 12 moving and adjusting inside the placement box 11 together, the resistors placed inside the placement box 11 can be pushed synchronously, ensuring that the positions of the multiple resistors inside the multiple placement grooves are all in a horizontal state, which is convenient for the subsequent processing mechanism to accurately process the resistors; Meanwhile, after multiple moving plates 12 push and correct the two sides of multiple resistors inside the placement box 11, it is possible to control the two second double-headed screws 29 to rotate together inside the corresponding grooves 22, thereby driving the two moving blocks 23 and the rotating plate 24 to move and adjust in the approaching direction, driving multiple sliding plates 30 at the bottoms of the two rotating plates 24 to push and correct the other two sides of the resistors inside the corresponding placement grooves, ensuring that multiple resistors are located at the central positions inside the multiple placement grooves, and further improving the accuracy of subsequent processing mechanisms for resistor processing.

[0036] After the positions of multiple resistors inside the placement box 11 are corrected by means of multiple moving plates 12 and the two rotating plates 24 of the correction mechanism, at this time, the two driving plates 21 maintain the above-mentioned adjusted state, so that they continue to have a pushing and limiting effect on multiple moving plates 12, so that multiple moving plates 12 maintain the pushing and limiting of the two sides of multiple resistors, and control the correction mechanism to also maintain the pushing and limiting of the other two ends of multiple resistors, ensuring that the positions of multiple resistors to be cut inside the placement box 11 are stable. Control the conveyor belt 2 to rotate counterclockwise inside the device body 1, and the placement box 11 can be driven to move to directly below the processing mechanism. With the downward contraction of the telescopic ends of the two telescopic cylinders 7, the laser head 10 is driven to perform relevant laser cutting processing on multiple resistors placed and limited inside the placement box 11, quickly cutting and removing the redundant parts at both ends or edges of the strip-shaped resistors, or performing laser trimming processing on the strip-shaped resistors, directly cutting the strip-shaped resistors into multiple block-shaped resistors of the same size, so as to accurately trim the resistance value to achieve the effect of meeting the design requirements.

[0037] After the resistors inside the placement box 11 are subjected to relevant laser cutting treatment by the laser head 10 of the processing mechanism, continue to control the conveyor belt 2 to rotate counterclockwise until the placement box 11 moves to the left end close to the device body 1, control the two driving plates 21 to move back to their original positions, drive multiple moving plates 12 to release the pushing and limiting of the two sides of multiple resistors, and at the same time, the correction mechanism can be controlled to move back to its original position on the top of the placement box 11, driving multiple sliding plates 30 to also release the pushing and limiting of the other two sides of multiple resistors. The cut and processed resistors are automatically taken out and unloaded by the feeding manipulator preset at the left end of the device body 1. After the resistors inside the placement box 11 are taken out, with the continuous counterclockwise rotation of the conveyor belt 2, the placement box 11 located at the top of the conveyor belt 2 at this time can be driven to rotate to the bottom, and the placement box 11 located at the bottom of the conveyor belt 2 rotates to the top, and another placement box 11 rotated to the top of the conveyor belt 2 is located at the right end of the device body 1 at this time, so that the feeding manipulator can continue to place the subsequent resistors to be processed inside it for relevant detection and processing, realizing the effect of continuously processing a large number of resistors.

[0038] During the process of the placing box 11 located at the top of the conveyor belt 2 rotating its bottom, the resistor waste remaining inside the placing box 11 can automatically discharge downward from the inside of the placing box 11, achieving the effect of automatically cleaning and removing the resistor waste, and avoiding the problem that the resistor waste remains inside the placing box 11 and hinders the subsequent processing of the resistors.

[0039] Meanwhile, since the chip resistor usually consists of a ceramic substrate, metal electrodes, and resistor materials, after laser cutting and fine-tuning, the waste still contains a certain proportion of metal materials and other recyclable components. These metal materials have high recycling value and can be extracted and reused through professional recycling processes. To facilitate the subsequent recycling of some of the resistor waste, after the processed resistors are taken out and discharged from the inside of the placing box 11 by means of the blanking manipulator, the two rotating plates 24 can be controlled to rotate and adjust together between the corresponding two moving blocks 23, driving the two shells 25 to rotate to a closer position, and controlling the two second double-headed screws 29 to rotate to drive the two rotating plates 24 to move towards each other. Until the connecting plates 33 on the outer walls of one side of the two shells 25 move to a state of abutment, control the second electromagnets inside the two connecting plates 33 to be energized to generate magnetism, so that they are magnetically attracted and fixed to each other. After the two connecting plates 33 are magnetically attracted, control the two winding rollers 31 to rotate inside the corresponding shells 25, so that the two shielding cloths 32 rotate and unfold together inside the shells 25, and as the two rotating plates 24 move and reset towards the far away direction, the two shielding cloths 32 are driven to horizontally unfold on the top of the placing box 11, thus covering and shielding the top of the placing box 11. And because the two rotating plates 24 perform relevant rotation adjustments as described above, driving the multiple sliding plates 30 at their bottoms to rotate to the top of the rotating plates 24 together, there is no obstruction between the multiple moving plates 12. As the two driving plates 21 continue to move and adjust towards the far away direction, the multiple moving plates 12 can be further pushed, so that when the multiple moving plates 12 move towards the closer direction, they can automatically squeeze and crush the resistor waste remaining in the placement grooves. After the resistor waste is squeezed and crushed, it is convenient for subsequent recycling of related materials. Moreover, since the two shielding cloths 32 are located on the top of the placing box 11 and shield the opening on the top of the placing box 11, it can avoid the phenomenon that the resistor waste splashes outwards during the process of being squeezed and crushed by the multiple moving plates 12. Furthermore, it can improve the safety of squeezing and crushing the resistor waste, and also avoid the problem that the squeezed and crushed resistor waste splashes outwards and subsequent workers need to collect it again centrally.

[0040] After the top openings of the placement box 11 are blocked by the two shielding cloths 32, when the placement box 11 rotates downward to the bottom of the device body 1, the resistance waste can smoothly drain downward and accumulate on the tops of the two shielding cloths 32. After the conveyor belt 2 drives the placement box 11 to move to a specified position at the bottom of the device body 1, then control the second electromagnets inside the two connecting plates 33 to cut off the power, so that the resistance waste accumulated on the tops of the two shielding cloths 32 can accurately drain downward into the preset collection container, avoiding the problem that the resistance waste cannot be accurately collected; Meanwhile, if the resistors inside the placement box 11 are processed into multiple blocks of the same size and no relevant resistance waste is generated, the feeding manipulator preset at the left end of the device body 1 is not convenient for automatically taking out and feeding the relatively small block-shaped resistors. At this time, the above steps can also be repeated to drive the two shielding cloths 32 to unfold on the top of the placement box 11. After the placement box 11 rotates to the bottom of the device body 1, the resistors processed into multiple blocks inside it can be automatically discharged to the tops of the two shielding cloths 32 for temporary storage, and then the multiple block-shaped resistors can be collected centrally, achieving the effect of facilitating the feeding and collection of the resistors processed into multiple blocks.

[0041] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, according to the content of this specification, many modifications and changes can be made. This specification selects and specifically describes these embodiments to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A packaging device for a chip resistor, comprising a device body (1), characterized in that, Inside the device body (1), a conveyor belt (2) is rotatably installed. On the outer wall of the conveyor belt (2), two placement boxes (11) are installed. The interiors of the two placement boxes (11) are each divided into a plurality of placement slots by a plurality of moving plates (12) provided therein. At the central positions inside the two placement boxes (11), two driving plates (21) for driving the movement and adjustment of the plurality of moving plates (12) are slidably installed. On the tops of the two placement boxes (11), a correction mechanism for correcting the positions of both ends of the resistors placed in the plurality of placement slots is provided. On the top of the device body (1), a detection mechanism for automatically detecting the resistors and a processing mechanism for automatically processing the resistors are respectively provided.

2. The packaging device for a chip resistor according to claim 1, wherein The detection mechanism includes two first chutes (6) opened on the top of the device body (1). Inside the two first chutes (6), first sliders (13) are installed. The tops of the two first sliders (13) are jointly installed with a moving frame (3).

3. The packaging device for a chip resistor according to claim 2, characterized in that, On the bottom of the moving frame (3), a second chute (14) is opened. Inside the second chute (14), a second slider (15) is installed. The bottom end of the second slider (15) is connected to a mounting plate (5) through an electric telescopic rod (4). On the bottom of the mounting plate (5), a plurality of industrial cameras (16) and vacuum suction cups (17) are respectively installed.

4. The encapsulation device of a chip resistor according to claim 3, characterized in that, The processing mechanism includes two telescopic cylinders (7) installed on the top of the device body (1). The telescopic ends of the two telescopic cylinders (7) are jointly installed with a top plate (8). On the bottom of the top plate (8), a third chute (18) is opened. Inside the third chute (18), a third slider is installed. The bottom end of the third slider is installed with a cross plate (9). On the bottom of the cross plate (9), a fourth chute (19) is opened. Inside the fourth chute (19), a fourth slider is installed. The bottom end of the fourth slider is installed with a laser head (10).

5. The packaging device for a chip resistor according to claim 4, wherein, On the outer walls on both sides of the placement box (11), first double-headed screws (20) are rotatably installed. The two ends of the two driving plates (21) are threadedly connected to the first double-headed screws (20) close to them. On the outer walls on the sides away from each other of the two driving plates (21), first electromagnets (28) are installed. The two first electromagnets (28) are magnetically fixed to the moving plates (12) close to them.

6. The packaging device for a chip resistor according to claim 5, characterized in that, Between the plurality of moving plates (12), two mounting seats (26) are provided. On the outer walls on the sides close to each other at both ends of the plurality of moving plates (12), two connecting rods (27) are rotatably installed. The ends of the two connecting rods (27) away from the moving plates (12) are rotatably connected to the mounting seats (26) close to them.

7. The encapsulation device of a chip resistor according to claim 6, characterized in that, The correction mechanism includes two grooves (22) opened on the top of the placement box (11). Inside the two grooves (22), second double-headed screws (29) are rotatably installed. On the outer walls of the two second double-headed screws (29), moving blocks (23) are threadedly installed. Between the two cooperating moving blocks (23), a rotating plate (24) is rotatably installed.

8. The encapsulation device of a chip resistor according to claim 7, characterized in that, The bottoms of the two rotating plates (24) are slidably mounted with sliding plates (30) having the same number as the placement slots, the outer walls of the two rotating plates (24) on the sides away from each other are mounted with shells (25), and winding rollers (31) are rotatably mounted inside the two shells (25).

9. The packaging device for a chip resistor according to claim 8, characterized in that, The outer walls of the two winding rollers (31) are both rolled up with shielding cloths (32), and the ends of the two shielding cloths (32) away from the winding rollers (31) are both installed with connecting plates (33), and the interiors of the two connecting plates (33) are both preset with second electromagnets.

10. A packaging method for a chip resistor, characterized in that, The packaging device according to claim 9 is included, and the packaging method further comprises the following steps: Step 1: placing the resistors to be processed inside the placement box (11), and automatically identifying and detecting the multiple resistors with the aid of a detection mechanism; Step 2: After the detection of the multiple resistors inside the placement box (11) is completed, the two first double-headed screws (20) are controlled to drive the two drive plates (21) to move in directions away from each other, and the three movable plates (12) on the side away from the two drive plates (21) are pushed, so that the multiple movable plates (12) are moved and adjusted together inside the placement box (11), and the resistors placed inside the placement box (11) are synchronously pushed to ensure that the positions of the multiple resistors inside the multiple placement slots are all in a horizontal state; Step 3: After the multiple moving plates (12) push and correct the two sides of the multiple resistors inside the placement box (11), the two second double-headed screws (29) are controlled to drive the two moving blocks (23) and the rotating plate (24) to move and adjust in a direction close to each other, and drive the multiple sliding plates (30) to push and correct the other two sides of the resistors inside the corresponding placement slots, so as to ensure that the multiple resistors are located in the center of the multiple placement slots; Step 4: After the positions of the multiple resistors in the placement box (11) are corrected through the above steps 2 and 3, the conveyor belt (2) is controlled to rotate counterclockwise to drive the placement box (11) to move to the bottom of the processing mechanism, and the multiple resistors placed in the placement box (11) are subjected to relevant laser cutting processing with the help of the processing mechanism, so that the resistors meet the design requirements; Step 5: After the resistors inside the placement box (11) are laser cut by the processing mechanism, the conveyor belt (2) is controlled to rotate counterclockwise until the placement box (11) moves to the left end close to the device body (1), and the resistors after cutting are automatically removed and unloaded with the help of a preset unloading robot at the left end of the device body (1). As the conveyor belt (2) continues to rotate counterclockwise, the placement box (11) at the top of the conveyor belt (2) rotates to the bottom, and the placement box (11) at the bottom of the conveyor belt (2) rotates to the top, so that the loading robot continues to place the resistors to be processed inside it for related testing and processing.

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