Inductor component

Abstract

The present invention relates to an inductor component that increases a region in which inductor wiring can be arranged. The inductor component includes a body having a first main surface, a first interlayer insulating layer, an inter-wiring insulating layer, and an inductor wiring. The first interlayer insulating layer extends parallel to the first main surface within the green body. The inter-wiring insulating layer extends from the first interlayer insulating layer in a first positive direction orthogonal to the first main surface. The inductor wiring extends within a region divided by the inter-wiring insulating layer. In a specific cross-section orthogonal to a center line of the inductor wiring, the inter-wiring insulating layer is provided with a plurality of portions non-continuously in a direction along the first main surface. The surface of the outer surface of the first interlayer insulating layer facing the direction parallel to the first main surface is defined as an end surface, and the portion of the inter-wiring insulating layer where the surface of the inter-wiring insulating layer facing the direction parallel to the first main surface is in contact with the green body is defined as an outer insulating layer. At this time, the outer insulating layer is in contact with an end surface of the first interlayer insulating layer.

Description

Technical Field

[0001] The present invention relates to an inductor component. Background Art

[0002] The inductor component described in Patent Document 1 includes a green body, a substrate, resin walls, and a coil. The green body has a rectangular parallelepiped shape. The green body contains a magnetic material. The substrate is plate-shaped. The substrate is located inside the green body. The resin walls are located on the main surface of the substrate. The resin walls extend in the normal direction of the main surface. When observed in a cross-section along the normal of the main surface of the substrate, a plurality of resin walls are arranged at intervals. Here, in this cross-sectional observation, the dimension of the resin wall in the arrangement direction of the resin walls is defined as the thickness dimension. At this time, in this cross-sectional observation, the thickness dimension of the resin wall located on the outermost side in the arrangement direction of the resin walls is larger than the thickness dimension of the resin walls located on the inner side. The coil is located on the main surface of the substrate. The coil is filled between adjacent resin walls.

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2016-225463

[0004] In the invention described in Patent Document 1, corresponding to the larger thickness dimension of the resin wall located on the outermost side, the volume ratio of the resin wall in the green body is larger. Therefore, it is not easy to increase the volume ratio of the coil in the green body. Summary of the Invention

[0005] In order to solve the above problems, the inductor component of the present invention includes: a green body having a main surface; an interlayer insulating layer extending parallel to the main surface in the green body; a wiring insulating layer extending from the interlayer insulating layer in a first positive direction orthogonal to the main surface; and an inductor wiring extending in contact with the surface on the first positive direction side of the interlayer insulating layer in a region divided by the wiring insulating layer. In a specific cross-section orthogonal to the center line of the inductor wiring, the wiring insulating layer has a plurality of non-continuous portions in the direction along the main surface. When the surface of the interlayer insulating layer facing the direction parallel to the main surface is defined as an end surface, and the portion of each of the above portions of the wiring insulating layer in contact with the green body with the surface facing the direction parallel to the main surface is defined as an outer insulating layer, the outer insulating layer is in contact with the end surface of the interlayer insulating layer.

[0006] According to the above structure, it is possible to increase the area where the inductor wiring can be arranged. Brief Description of the Drawings

[0007] Figure 1 is a perspective view of the inductor component.

[0008] Figure 2 is a perspective side view of the inductor component.

[0009] Figure 3 is a perspective top view of an inductor component.

[0010] Figure 4 is a cross-sectional view of the inductor component along the Figure 3 4-4 line in

[0011] Figure 5 is a diagram that magnifies a part of Figure 4 in

[0012] Figure 6 is an explanatory diagram of a manufacturing method of an inductor component.

[0013] Figure 7 is an explanatory diagram of a manufacturing method of an inductor component.

[0014] Figure 8 is an explanatory diagram of a manufacturing method of an inductor component.

[0015] Figure 9 is an explanatory diagram of a manufacturing method of an inductor component.

[0016] Figure 10 is an explanatory diagram of a manufacturing method of an inductor component.

[0017] Figure 11 is an explanatory diagram of a manufacturing method of an inductor component.

[0018] Figure 12 is an explanatory diagram of a manufacturing method of an inductor component.

[0019] Figure 13 is an explanatory diagram of a manufacturing method of an inductor component.

[0020] Figure 14 is an explanatory diagram of a manufacturing method of an inductor component.

[0021] Figure 15 is an explanatory diagram of a manufacturing method of an inductor component.

[0022] Figure 16 is an explanatory diagram of a manufacturing method of an inductor component.

[0023] Figure 17 is an explanatory diagram of a manufacturing method of an inductor component.

[0024] Figure 18 is an explanatory diagram of a manufacturing method of an inductor component.

[0025] Figure 19 is an explanatory diagram of a manufacturing method of an inductor component.

[0026] Figure 20 is an explanatory diagram of a manufacturing method of an inductor component.

[0027] Figure 21 It is an explanatory diagram of a method for manufacturing an inductor component.

[0028] Figure 22 It is an explanatory diagram of a method for manufacturing an inductor component.

[0029] Figure 23 It is a cross-sectional view of an inductor component of a modified example.

[0030] Explanation of reference numerals: BP... contact end portion; EF... end face; SF... inclined surface; V1... interval; V2... interval; X1... first positive direction; X2... first negative direction; 10... inductor component; 11... green body; 11A... first main surface; 31... first interlayer insulating layer; 32... insulating layer between wirings; 32A... outer insulating layer; 32B... inner insulating layer; 40... columnar wiring; 50... inductor wiring; 51A... seed layer. Detailed Description of the Invention

[0031] Hereinafter, an embodiment of an inductor component will be described with reference to the drawings. In addition, the drawings sometimes magnify the constituent elements for easy understanding. The dimensional ratios of the constituent elements may be different from the actual dimensional ratios or the dimensional ratios in other drawings.

[0032] <Regarding the overall structure>

[0033] As Figure 1 shown, the inductor component 10 as a whole is substantially rectangular parallelepiped-shaped. As Figure 2 shown, the inductor component 10 includes a green body 11 and an inductor wiring 50.

[0034] As Figure 1 shown, the green body 11 has six planar outer surfaces. One specific surface among these six outer surfaces is defined as the first main surface 11A. In addition, the surface located on the opposite side of the first main surface 11A and parallel to the first main surface 11A is defined as the second main surface 11B. The outer shape of the first main surface 11A and the outer shape of the second main surface 11B are both rectangular. In addition, in the present embodiment, the first main surface 11A is the mounting surface that faces the substrate when the inductor component 10 is mounted on the substrate.

[0035] Here, the axis orthogonal to the first major surface 11A is defined as the first axis X. Further, the axis orthogonal to the first axis X and parallel to a specific side of the first major surface 11A, which is the long side of the first major surface 11A in the present embodiment, is defined as the second axis Y. And the axis orthogonal to the first axis X and the second axis Y is defined as the third axis Z. Further, the direction along the first axis X in which the first major surface 11A faces is defined as the first positive direction X1, and the direction opposite to the first positive direction X1 is defined as the first negative direction X2. Further, a specific one of the directions along the second axis Y is defined as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is defined as the second negative direction Y2. And a specific one of the directions along the third axis Z is defined as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is defined as the third negative direction Z2.

[0036] As Figure 4 shown, the green body 11 has, in order from the first negative direction X2 side, a first magnetic layer 21, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25 as the magnetic layer 20. Further, in Figure 4 it, the boundaries of the respective magnetic layers 20 are virtually shown by two-dot chain lines, but clear boundaries may not be observable between these respective magnetic layers 20. The material of these magnetic layers 20 is an organic resin containing metal magnetic powder. That is, the green body 11 contains a magnetic material. In this embodiment, the metal magnetic powder is a metal magnetic powder composed of an Fe-based alloy or an amorphous alloy. More specifically, the metal magnetic powder is an FeSiCr-based metal powder containing iron. Further, the metal magnetic powder is not limited to, for example, an FeSiCr-based magnetic powder, and may also be an FeCo-based, FeSiAr-based, iron oxide-based, or a combination thereof. Also, the organic resin may be an epoxy-based, imide-based, liquid crystal polymer-based, acrylic-based, phenol-based, or a combination thereof. Also, in the organic resin, inorganic fillers may be mixed in addition to the above materials.

[0037] As Figure 2 shown, the inductor wiring 50 is located inside the green body 11. As Figure 4 shown, the inductor wiring 50 is located at the same position as the second magnetic layer 23 in the first positive direction X1. The material of the inductor wiring 50 is a conductive material. In the present embodiment, in the composition of the inductor wiring 50, for example, the ratio of copper is 99 wt% or more, and the ratio of sulfur is 0.1 wt% or more and 1.0 wt% or less. Further, the inductor wiring 50 is not limited to a conductor having copper as a main component, and may also be a conductor having Ag, Al, or Au as a main component.

[0038] As Figure 3 shown, the inductor wiring 50 is parallel to the first major surface 11A and extends in a spiral shape.Figure 4 As shown, the inductor wiring 50 includes a seed layer 51A. The seed layer 51A forms a part of the surface on the first negative direction X2 side in the inductor wiring 50. The material of the seed layer 51A is copper. Further, by performing electrolytic copper plating on the seed layer 51A, copper grows on the seed layer 51A to form the whole of the inductor wiring 50.

[0039] As Figure 3 shown, the inductor wiring 50 has a pair of pad portions 51P and a wiring main body 51L. The pair of pad portions 51P are located at both ends of the inductor wiring 50. One of the pair of pad portions 51P is set as the inner pad portion 51PA. The remaining one of the pair of pad portions 51P is set as the outer pad portion 51PB. When viewed in perspective in the first negative direction X2, the inner pad portion 51PA is located on the second positive direction Y1 side with respect to the geometric center of the green body 11. When viewed in perspective in the first negative direction X2, the inner pad portion 51PA is substantially circular in shape. The outer pad portion 51PB is located on the second negative direction Y2 side with respect to the geometric center of the green body 11. When viewed in perspective in the first negative direction X2, the outer pad portion 51PB is substantially quadrilateral in shape.

[0040] The wiring main body 51L connects the pair of pad portions 51P. Specifically, when the green body 11 is viewed in perspective in the first negative direction X2, the wiring main body 51L extends counterclockwise from the inner pad portion 51PA toward the outer pad portion 51PB such that the diameter becomes larger as the number of turns increases. The number of turns of the inductor wiring 50 is 2.5 turns.

[0041] Further, the number of turns of the inductor wiring 50 is determined based on a virtual vector. The starting point of the virtual vector is arranged on the center line of the inductor wiring 50. Moreover, when the virtual vector moves the starting point from the state of the first end arranged on the center line to the second end when viewed in the first negative direction X2, and the angle of rotation in the direction of the virtual vector is 360 degrees, the number of turns is determined to be 1.0 turn. However, in the case where the virtual vector winds multiple times and in the case of continuous winding in the same direction, it is assumed that the number of turns increases.

[0042] In addition, the center line of the inductor wiring 50 is determined as follows. When viewed in perspective in the first negative direction X2, the shortest line segment among the line segments drawn from an arbitrary point on the edge of the inductor wiring 50 to the opposite edge is determined. The line connecting the points passing through the center of the determined line segment is set as the center line of the inductor wiring 50 when viewed in perspective in the first negative direction X2.

[0043] As Figure 4As shown, the inductor component 10 includes a first interlayer insulating layer 31, an inter-wiring insulating layer 32, and a second interlayer insulating layer 33 as the insulating layer 30. The material of these insulating layers 30 is an insulating resin. In this embodiment, for example, it is a polyimide-based resin.

[0044] As Figure 4 shown, the first interlayer insulating layer 31 extends parallel to the first main surface 11A within the green body 11. The first interlayer insulating layer 31 is in contact with the surface on the first positive direction X1 side of the first magnetic layer 21. In addition, the first interlayer insulating layer 31 is in contact with the surface on the first negative direction X2 side of the inductor wiring 50. In other words, the inductor wiring 50 extends on the first interlayer insulating layer 31. Therefore, the first interlayer insulating layer 31 is located at the same position as the first interlayer magnetic layer 22 in the first positive direction X1.

[0045] The second interlayer insulating layer 33 extends parallel to the first main surface 11A within the green body 11. In addition, the second interlayer insulating layer 33 is in contact with the surface on the first positive direction X1 side of the inductor wiring 50. In addition, the second interlayer insulating layer 33 is in contact with the surface on the first negative direction X2 side of the third magnetic layer 25. Therefore, the second interlayer insulating layer 33 is located at the same position as the second interlayer magnetic layer 24 in the first positive direction X1.

[0046] When the surface of the inductor wiring 50 in the direction parallel to the first main surface 11A is defined as the side surface, the inter-wiring insulating layer 32 covers the side surface of the inductor wiring 50. Therefore, the inter-wiring insulating layer 32 has a portion located at the same position as the inductor wiring 50 in the first positive direction X1. In addition, in a specific cross-section orthogonal to the center line of the inductor wiring 50, the inter-wiring insulating layer 32 exists discontinuously at multiple positions in the direction along the first main surface 11A. For example, in Figure 4 the case of the shown specific cross-section, the inter-wiring insulating layer 32 exists discontinuously at seven positions in the direction along the first main surface 11A.

[0047] Here, in the specific cross-section, the portion of each part of the inter-wiring insulating layer 32 where the surface facing the direction parallel to the first main surface 11A is in contact with the green body 11 is defined as the outer insulating layer 32A. In addition, the portion of each part of the inter-wiring insulating layer 32 in the specific cross-section where the surface facing the direction parallel to the first main surface 11A is not in contact with the green body 11 is defined as the inner insulating layer 32B. For example, in Figure 4In the specific cross-section shown, there are four outer insulating layers 32A. Additionally, in the specific cross-section, there are three inner insulating layers 32B. Specifically, in the specific cross-section, two outer insulating layers 32A are located on the third positive direction Z1 side with respect to the geometric center of the green body 11, and two inner insulating layers 32B are located between these outer insulating layers 32A. The inductor wiring 50 is located between these inter-wiring insulating layers 32. Additionally, two outer insulating layers 32A are located on the third negative direction Z2 side with respect to the geometric center of the green body 11, and one inner insulating layer 32B is located between these outer insulating layers 32A. Moreover, the inductor wiring 50 is located between these inter-wiring insulating layers 32. That is, the inductor wiring 50 extends on the first positive direction X1 side with respect to the first interlayer insulating layer 31 within the region divided by the inter-wiring insulating layers 32.

[0048] In addition, as Figure 5 shown, the surface of the outer surface of the first interlayer insulating layer 31 that faces the direction parallel to the first main surface 11A is defined as the end face EF. In addition, the "surface facing the direction parallel to the first main surface 11A" refers to the surface that can be visually confirmed when observing the first interlayer insulating layer 31 along the direction parallel to the first main surface 11A. At this time, the outer insulating layer 32A can be roughly divided into a contact end portion BP located at the same position as the first interlayer insulating layer 31 in the first positive direction X1, and a main body portion AP located on the first positive direction X1 side with respect to the contact end portion BP. The details of the contact end portion BP and the main body portion AP will be described later.

[0049] As Figure 2 shown, the inductor component 10 includes two columnar wirings 40 and two external electrodes 60. Each columnar wiring 40 extends in a direction intersecting with the first main surface 11A. In the present embodiment, each columnar wiring 40 extends in a direction orthogonal to the first main surface 11A. Each columnar wiring 40 is located on the first positive direction X1 side with respect to the inductor wiring 50. Each columnar wiring 40 is electrically connected to the inductor wiring 50.

[0050] Specifically, one of the two columnar wirings 40, that is, the first columnar wiring 41, is composed of a first via hole 41A and a first lead-out wiring 41B. The material of the first columnar wiring 41 is the same as that of the inductor wiring 50. The first via hole 41A is substantially cylindrical. As Figure 4 shown, the first via hole 41A penetrates the second interlayer insulating layer 33. Therefore, the first via hole 41A is located at the same position as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24 in the first positive direction X1. The surface of the first via hole 41A facing the first negative direction X2 side is connected to the inner pad portion 51PA of the inductor wiring 50.

[0051] As Figure 3 shown, the first lead-out wiring 41B is substantially cylindrical. AsFigure 2 As shown, the diameter of the first lead-out wiring 41B is slightly larger than the diameter of the first via hole 41A. The surface of the first lead-out wiring 41B facing the first negative direction X2 side is connected to the first via hole 41A. Therefore, the first lead-out wiring 41B is located at the same position as the third magnetic layer 25 in the first positive direction X1. The surface of the first lead-out wiring 41B on the first positive direction X1 side is exposed from the first main surface 11A.

[0052] As Figure 2 shown, the other of the two columnar wirings 40, that is, the second columnar wiring 42, is composed of a second via hole 42A and a second lead-out wiring 42B. The material of the second columnar wiring 42 is the same as that of the inductor wiring 50. The second columnar wiring 42 is located on the second negative direction Y2 side with respect to the first columnar wiring 41. The second via hole 42A is substantially quadrangular prism-shaped. The second via hole 42A penetrates the second interlayer insulating layer 33. Therefore, the second via hole 42A is located at the same position as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24 in the first positive direction X1. The surface of the second via hole 42A facing the first negative direction X2 side is connected to the outer pad portion 51PB of the inductor wiring 50.

[0053] As Figure 3 shown, the second lead-out wiring 42B is substantially quadrangular prism-shaped. As Figure 2 shown, the size of each side of the second lead-out wiring 42B is slightly larger than the size of each side of the second via hole 42A. The surface of the second lead-out wiring 42B facing the first negative direction X2 side is connected to the second via hole 42A. Therefore, the second lead-out wiring 42B is located at the same position as the third magnetic layer 25 in the first positive direction X1.

[0054] The surface of the second lead-out wiring 42B on the first positive direction X1 side is exposed from the first main surface 11A.

[0055] As Figure 1 shown, each external electrode 60 is exposed from the green body 11. Specifically, each external electrode 60 is located on the first main surface 11A of the green body 11. That is, each external electrode 60 covers a part of the outer surface of the green body 11.

[0056] As Figure 2 shown, one of the two external electrodes 60, that is, the first external electrode 61, is located on the second positive direction Y1 side with respect to the geometric center of the first main surface 11A on the first main surface 11A. The first external electrode 61 is in contact with the surface of the first lead-out wiring 41B facing the first positive direction X1. The other of the two external electrodes 60, that is, the second external electrode 62, is located on the second negative direction Y2 side with respect to the geometric center of the first main surface 11A on the first main surface 11A. The second external electrode 62 is in contact with the surface of the second lead-out wiring 42B facing the first positive direction X1.

[0057] The inductor component 10 includes a solder resist layer 70. The solder resist layer 70 covers the portion of the surface of the green body 11 facing the first positive direction X1 except for the two external electrodes 60. That is, the first main surface 11A of the green body 11 is covered by the external electrodes 60 and the solder resist layer 70 and is not exposed. The insulation property of the solder resist layer 70 is higher than that of the green body 11.

[0058] <Regarding the inter-wiring insulating layer>

[0059] As described above, the outer insulating layer 32A in the inter-wiring insulating layer 32 can be roughly divided into a contact end portion BP located at the same position as the first inter-layer insulating layer 31 in the first positive direction X1, and a main body portion AP located on the first positive direction X1 side with respect to the contact end portion BP. In addition, the main body portion AP is located at the same part as the inductor wiring 50 in the first positive direction X1.

[0060] As Figure 5 shown, the contact end portion BP contacts the end face EF of the first inter-layer insulating layer 31. In a specific cross-section, the outer surface of the contact end portion BP on the side opposite to the first inter-layer insulating layer 31 becomes an inclined surface SF that approaches the first inter-layer insulating layer 31 more as it faces the first negative direction X2. That is, the contact end portion BP has a substantially triangular shape in a specific cross-section.

[0061] The main body portion AP contacts the surface of the first inter-layer insulating layer 31 on the first positive direction X1 side. As a result, the dimension in the direction along the third axis Z at the end portion of the main body portion AP on the first negative direction X2 side is larger than the dimension in the direction along the third axis Z at the end portion of the contact end portion BP on the first positive direction X1 side. That is, when observing the first inter-layer insulating layer 31 in the first positive direction X1, a part of the main body portion AP protrudes from the contact end portion BP toward the inductor wiring 50 side. Moreover, the portion of the main body portion AP that protrudes from the contact end portion BP contacts the surface of the first inter-layer insulating layer 31 facing the first positive direction X1. In this way, the outer insulating layer 32A contacts not only the end face EF of the first inter-layer insulating layer 31 but also the surface of the first inter-layer insulating layer 31 facing the first positive direction X1.

[0062] In addition, in a specific cross-section, the dimension of the main body portion AP in the outer insulating layer 32A in the direction along the third axis Z is the same as the dimension of the inner insulating layer 32B in the direction along the third axis Z. That is, except for the contact end portion BP of the first inter-layer insulating layer 31, the outer insulating layer 32A and the inner insulating layer 32B have substantially the same shape.

[0063] In addition, the interval V1 between the outer insulating layer 32A and the inner insulating layer 32B opposite thereto is larger than the interval V2 between the inner insulating layers 32B facing each other. That is, the interval V1 between the outer insulating layer 32A and the inner insulating layer 32B in the direction parallel to the first main surface 11A is larger than the interval V2 between the inner insulating layers 32B in the direction parallel to the first main surface 11A. As a result, the wiring width of the inductor wiring 50 located between the outer insulating layer 32A and the inner insulating layer 32B is larger than the wiring width of the inductor wiring 50 located between the inner insulating layers 32B.

[0064] <Regarding the manufacturing method>

[0065] Next, the manufacturing method of the inductor component 10 will be described.

[0066] As Figure 6 shown, first, a base preparation process is performed. Specifically, a plate-shaped base member 101 is prepared. The material of the base member 101 is ceramic. When observing in the first negative direction X2, the base member 101 has a quadrilateral shape. The size of each side of the base member 101 is the size for accommodating a plurality of inductor components 10. Next, a dummy insulating layer 102 is coated over the entire upper surface of the base member 101. In addition, in Figure 6 , the dummy insulating layer 102 is illustrated with a thick line.

[0067] Next, as Figure 7 shown, a first insulating layer processing process for forming the first interlayer insulating layer 31 is performed. The first interlayer insulating layer 31 is formed on the surface of the base member 101 on the first positive direction X1 side. Specifically, the first interlayer insulating layer 31 is patterned. The patterning is performed in a range slightly wider than the range where the inductor wiring 50 is disposed. Specifically, the first interlayer insulating layer 31 is formed by photolithography.

[0068] Next, as Figure 8 shown, a seed forming process for forming the seed layer 51A is performed. Specifically, a copper seed portion 103 is formed on the surface of the first interlayer insulating layer 31 and the dummy insulating layer 102 on the first positive direction X1 side by sputtering.

[0069] Next, as Figure 9 shown, a photosensitive resist 104 is laminated on the upper surface of the seed portion 103. Then, only the range of the upper surface of the seed portion 103 where the seed layer 51A in the inductor wiring 50 is formed is exposed. The exposed portion in the resist 104 is cured. The cured portion is formed as a covering portion 105. Then, the uncured portion in the resist 104, that is, the portion other than the covering portion 105, is removed.

[0070] Next, asFigure 10 As shown, the seed portion 103 is etched. Thereby, the seed portion 103 exposed from the covering portion 105 is removed.

[0071] Then, as Figure 11 shown, the covering portion 105 is wet-etched using a chemical solution. Thereby, the covering portion 105 is peeled off. As a result, the seed layer 51A is formed.

[0072] Then, as Figure 12 shown, a second insulating layer processing step for forming the inter-wiring insulating layer 32 is performed. Specifically, first, a photosensitive permanent resist 106 is laminated on the surfaces of the dummy insulating layer 102, the seed layer 51A, and the first inter-layer insulating layer 31 on the first positive direction X1 side. Next, the regions for forming the inter-wiring insulating layer 32, that is, the portions on both sides of the seed layer 51A, are exposed. Specifically, a portion of the surface of the first inter-layer insulating layer 31 on the first positive direction X1 side, including the region located on the first positive direction X1 side with respect to the end face EF of the first inter-layer insulating layer 31, is exposed. At this time, the exposure amount of the region including the position on the first positive direction X1 side with respect to the end face EF of the first inter-layer insulating layer 31 is made less than the exposure amount of other portions. By controlling the exposure amount in this way, as Figure 13 shown, in the region on the first positive direction X1 side including the end face EF of the first inter-layer insulating layer 31, a part of the first negative direction X2 side of the permanent resist 106 is not cured, and an inclined surface SF of the contact end portion BP is formed.

[0073] Next, as Figure 13 shown, the uncured portion in the permanent resist 106 is removed by stripping with a chemical solution. Thereby, the inter-wiring insulating layer 32 is formed.

[0074] Next, as Figure 14 shown, a first wiring formation step for forming the inductor wiring 50 is performed. Specifically, electrolytic copper plating is performed, and copper is grown on the surface of the first inter-layer insulating layer 31 on the first positive direction X1 side at the portion where the seed layer 51A is exposed. Thereby, the inductor wiring 50 is formed. In addition, during the formation of the inductor wiring 50, since the seed layer 51A is located between the inter-wiring insulating layers 32, the copper plating grows along the inter-wiring insulating layer 32. As a result, the cross-section of the inductor wiring 50 is substantially rectangular. Further, during the process of promoting the growth of the copper plating on the seed layer 51A, the surface of the first positive direction X1 side of the inductor wiring 50 may become a curved surface protruding toward the first positive direction X1 side.

[0075] Next, as Figure 15As shown, a third insulating layer processing step for forming the second interlayer insulating layer 33 is performed. The range for forming the second interlayer insulating layer 33 is the range in the plane on the first positive direction X1 side of the inductor wiring 50 and the inter-wiring insulating layer 32, excluding the portions where the first vias 41A and the second vias 42A are formed. In this range, the second interlayer insulating layer 33 is formed by lithography in the same manner as the method for forming the first interlayer insulating layer 31. In addition, the dimension of the second interlayer insulating layer 33 in the direction along the first axis X is the same as the dimension of the first interlayer insulating layer 31 in the direction along the first axis X. Further, when viewed in the first negative direction X2, the outer shape of the second interlayer insulating layer 33 coincides with the outer shape of the first interlayer insulating layer 31.

[0076] Next, as Figure 16 shown, a second wiring formation step for forming the columnar wiring 40 is performed. The range for forming the columnar wiring 40 is the portion including the range where the inductor wiring 50 is exposed from the second interlayer insulating layer 33. First, in the same manner as the above-described seed formation step, a columnar seed layer 107 is formed in the above range. In addition, the columnar seed layer 107 is not shown in Figures 2 - 5 . Then, by lithography in the same manner as the first insulating layer processing step, the resist is exposed in the portion other than the above range. Then, the same steps as the first wiring formation step are performed, and the columnar wiring 40 is formed by copper plating. Then, the resist is removed. As a result, the first columnar wiring 41 and the second columnar wiring 42 are formed.

[0077] Next, as Figure 17 shown, a first magnetic body formation step for forming the magnetic layer 20 other than the first magnetic layer 21 is performed. First, a resin containing magnetic powder, which is the material of the magnetic layer 20, is coated on the first positive direction X1 side of the dummy insulating layer 102. At this time, the resin containing magnetic powder is coated so as to also cover the surfaces on the first positive direction X1 side of the respective columnar wirings 40. Next, stamping is performed to harden the resin containing magnetic powder, thereby forming the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 on the surface side of the first positive direction X1 of the dummy insulating layer 102.

[0078] Then, the portion on the first positive direction X1 side of the third magnetic layer 25 is ground until the surfaces on the first positive direction X1 side of the respective columnar wirings 40 are exposed. In addition, in Figure 17 , the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are not distinguished and are shown as the magnetic layer 20.

[0079] Next, as Figure 18As shown, the cutting process of the base member is performed. Specifically, the base member 101 and the dummy insulating layer 102 are entirely cut and removed. In addition, as a result of entirely cutting the base member 101 and the dummy insulating layer 102, sometimes a part of the first negative direction X2 side of the first interlayer insulating layer 31 is removed, but the inductor wiring 50 is not removed.

[0080] Next, as Figure 19 shown, the second magnetic body forming process for forming the first magnetic layer 21 is performed. Specifically, first, a resin containing magnetic powder, which is the material of the first magnetic layer 21, is coated on the surfaces of the first interlayer insulating layer 31 and the first negative direction X2 side of the first interlayer magnetic layer 22. Then, the resin containing magnetic powder is hardened by performing stamping. Then, the part on the first negative direction X2 side of the resin is ground. For example, the part on the first negative direction X2 side of the resin is ground so that the dimension of the inductor component 10 in the direction along the first axis X becomes a desired value. Thereby, the first magnetic layer 21 is formed on the surfaces of the first interlayer insulating layer 31 and the first negative direction X2 side of the first interlayer magnetic layer 22. In addition, in Figure 19 this figure, the first magnetic layer 21, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are not distinguished and are shown as the magnetic layer 20.

[0081] Next, as Figure 20 shown, the main surface processing process for forming the solder resist layer 70 is performed. Specifically, in the parts of the surfaces of the third magnetic layer 25 on the first positive direction X1 side and the surfaces of the respective columnar wirings 40 on the first positive direction X1 side where the respective external electrodes 60 are not formed, an insulator is patterned by photolithography. Thereby, the solder resist layer 70 is formed.

[0082] Next, as Figure 21 shown, the electrode processing process for forming the external electrodes 60 is performed. The range for forming the external electrodes 60 is the range not covered by the solder resist layer 70 on the surfaces of the third magnetic layer 25 on the first positive direction X1 side and the surfaces of the respective columnar wirings 40 on the first positive direction X1 side. In this range, copper, nickel, and gold are respectively electroless plated. As a result, the first external electrode 61 and the second external electrode 62 are formed. In addition, in Figure 21 this figure, the respective layers of copper, nickel, and gold are shown without distinction. Additionally, as Figure 21 shown, a part of the external electrode 60 covers a part of the surface of the solder resist layer 70 on the first positive direction X1 side. Next, as Figure 22 shown, the singulation process is performed. Specifically, singulation is performed by cutting at the break line DL. Thereby, the inductor component 10 can be obtained.

[0083] <Effect of this Embodiment>

[0084] (1) According to the above-described embodiment, the end face EF of the wiring space insulating layer 32 contacts the end face EF of the first interlayer insulating layer 31. That is, when viewed in the first positive direction X1, at least a part of the wiring space insulating layer 32 protrudes outward on the first positive direction X1 side with respect to the first interlayer insulating layer 31. Therefore, compared with a structure in which the entire wiring space insulating layer 32 is within the range of the surface on the first positive direction X1 side of the first interlayer insulating layer 31, the area partitioned by the wiring space insulating layer 32, that is, the area where the inductor wiring 50 can be arranged, can be increased.

[0085] (2) Assume a case where the outer insulating layer 32A contacts the first interlayer insulating layer 31 only on one surface. If an external force in a direction parallel to the contact surface between the outer insulating layer 32A and the first interlayer insulating layer 31 acts on the outer insulating layer 32A, it is likely to peel off from the first interlayer insulating layer 31. On the other hand, in the above-described embodiment, in addition to contacting the end face EF of the first interlayer insulating layer 31, the outer insulating layer 32A also contacts the surface of the first interlayer insulating layer 31 facing the first positive direction X1. That is, in the above-described embodiment, the outer insulating layer 32A contacts the first interlayer insulating layer 31 on two surfaces. Therefore, when an external force acts on the outer insulating layer 32A, the external force can be dispersed on the two surfaces in contact with the first interlayer insulating layer 31. Therefore, according to the above structure, peeling of the outer insulating layer 32A from the first interlayer insulating layer 31 can be suppressed.

[0086] (3) In the above-described embodiment, in a specific cross section, the interval V1 between the outer insulating layer 32A and the inner insulating layer 32B in a direction parallel to the first main surface 11A is larger than the interval V2 between the inner insulating layers 32B in a direction parallel to the first main surface 11A. As described above, the outer insulating layer 32A protrudes outward on the first positive direction X1 side with respect to the first interlayer insulating layer 31. Therefore, the interval V1 between the outer insulating layer 32A and the inner insulating layer 32B can be ensured to be large. As a result, the DC resistance in the inductor wiring 50 can be reduced.

[0087] (4) In the above-described embodiment, the columnar wiring 40 is located on the first positive direction X1 side with respect to the inductor wiring 50. That is, in the above-described embodiment, the outer insulating layer 32A in the wiring space insulating layer 32 contacts the end face EF of the first interlayer insulating layer 31 on the side away from the external electrode 60. Therefore, even if the inductor wiring 50 accidentally protrudes from between the outer insulating layer 32A and the first interlayer insulating layer 31, the possibility of the protruding inductor wiring 50 short-circuiting with the external electrode 60 is small.

[0088] (5)In the above-described embodiment, the inductor wiring 50 has a seed layer 51A that contacts the first interlayer insulating layer 31 on the first positive direction X1 side. That is, in the above-described embodiment, the outer insulating layer 32A in the wiring insulating layer 32 contacts the end face EF of the first interlayer insulating layer 31 at a position close to the seed layer 51A. Therefore, during the manufacturing process, even when the position of the seed layer 51A is displaced from the designed position, the possibility that the inductor wiring 50 protrudes between the outer insulating layer 32A and the first interlayer insulating layer 31 is small.

[0089] (6)In the above-described embodiment, the outer surface of the contact end portion BP on the side opposite to the first interlayer insulating layer 31 is an inclined surface SF that gets closer to the first interlayer insulating layer 31 as it goes toward the first negative direction X2. According to this structure, compared with a structure that does not have the inclined surface SF and the dimension of the outer insulating layer 32A in the direction along the third axis Z is constant, the volume of the first interlayer magnetic layer 22 can be increased.

[0090] <Change Example>

[0091] The above-described embodiment and the following change examples can be implemented in combination with each other within a range where there is no technical contradiction.

[0092] ·In the above-described embodiment, the inductor component 10 may not have the external electrode 60. In this case, the portion of the columnar wiring 40 exposed from the first main surface 11A can be used as an electrode.

[0093] ·In the above-described embodiment, each columnar wiring 40 is not limited to extending in a direction orthogonal to the first main surface 11A, and may extend in a direction intersecting the first main surface 11A.

[0094] ·In the above-described embodiment, the shape of each columnar wiring 40 when viewed in perspective along the direction orthogonal to the first main surface 11A is not limited to the example of the above-described embodiment. For example, the shapes of all the columnar wirings 40 when viewed in perspective along the direction orthogonal to the first main surface 11A may be the same.

[0095] ·In the above-described embodiment, the material of the insulating layer 30 is not limited to the example of the above-described embodiment. For example, the material of the insulating layer 30 may be epoxy resin or the like.

[0096] ·In the above-described embodiment, the number of turns and the shape of the inductor wiring 50 are not limited to the example of the above-described embodiment. For example, the inductor wiring 50 may be a straight line with zero turns.

[0097] · In the above-described embodiment, a part of the inductor wiring 50 may not be covered by the insulating layer 30 and may be in contact with the magnetic layer 20. For example, in the above-described embodiment, the second interlayer insulating layer 33 can be omitted. In addition, "the surface of each part of the inter-wiring insulating layer 32 that faces the direction parallel to the first main surface 11A is in contact with the green body 11" means a case where 90% or more of the surface of the inter-wiring insulating layer 32 that faces the direction parallel to the first main surface 11A is in contact with the green body 11. In a structure without the second interlayer insulating layer 33, sometimes due to manufacturing errors or the like, a part of the surface of the inner insulating layer 32B that faces the direction parallel to the first main surface 11A may be in contact with the green body 11. Also in this case, as long as the ratio of the surface of the inter-wiring insulating layer 32 that faces the direction parallel to the first main surface 11A and is in contact with the green body 11 is less than 90%, this part does not correspond to the outer insulating layer 32A.

[0098] · In the above-described embodiment, the inductor component 10 may also include a plurality of inductor wirings 50. For example, the inductor wiring 50 in the above-described embodiment is designated as the first inductor wiring 50, the inter-wiring insulating layer 32 is designated as the first inter-wiring insulating layer 32, and the outer insulating layer 32A is designated as the first outer insulating layer 32A. In Figure 23 the example shown, the entire first outer insulating layer 32A of the first inter-wiring insulating layer 32 extends from the surface of the first interlayer insulating layer 31 on the first positive direction X1 side. Additionally, in Figure 23 the example shown, the inductor component 10 further includes a second inductor wiring 52, a second inter-wiring insulating layer 34, and a third interlayer insulating layer 35. In Figure 23 the example shown, the second inter-wiring insulating layer 34 extends from the second interlayer insulating layer 33 along the first positive direction X1. The second inductor wiring 52 extends on the first positive direction X1 side with respect to the second interlayer insulating layer 33 within the region partitioned by the second inter-wiring insulating layer 34. The third interlayer insulating layer 35 extends on the surface of the second inductor wiring 52 and the second inter-wiring insulating layer 34 on the first positive direction X1 side. Additionally, in Figure 23 the example shown, the columnar wiring 40 is connected to the second inductor wiring 52.

[0099] In Figure 23 the example shown, similar to the first inter-wiring insulating layer 32, in a specific cross-section, the second inter-wiring insulating layer 34 discontinuously exists at seven positions in the direction along the first main surface 11A. Additionally, in Figure 23 the second inter-wiring insulating layer 34 at four of the seven positions is illustrated.

[0100] Here, the surface of the second interlayer insulating layer 33 facing the direction parallel to the first main surface 11A is defined as the end surface EF, and the portion of each part of the second inter-wiring insulating layer 34 in a specific cross-section where the surface facing the direction parallel to the first main surface 11A contacts the green body 11 is defined as the second outer insulating layer 34A. In the specific cross-section, the second outer insulating layer 34A located closest to the third positive direction Z1 side contacts the end surface EF of the second interlayer insulating layer 33 and the surface of the first outer insulating layer 32A facing the green body 11 side. According to this structure, compared with the structure in which the second outer insulating layer 34A only contacts the second interlayer insulating layer 33, the contact surface in the second outer insulating layer 34A can be increased. That is, the close contact property of this second outer insulating layer 34A is improved.

[0101] In addition, in Figure 23 the example shown, further, the first outer insulating layer 32A of the first inter-wiring insulating layer 32 may contact the end surface EF of the first interlayer insulating layer 31. In addition, in Figure 23 the example shown, it may be that the first outer insulating layer 32A of the first inter-wiring insulating layer 32 contacts the end surface EF of the first interlayer insulating layer 31, while on the other hand, the second outer insulating layer 34A of the second inter-wiring insulating layer 34 does not contact the end surface EF of the second interlayer insulating layer 33.

[0102] · In the above-described embodiment, at least one of the outer insulating layers 32A in which multiple outer insulating layers 32A contact the end surface EF of the first interlayer insulating layer 31 is sufficient.

[0103] · In the above-described embodiment, it is sufficient that the outer insulating layer 32A contacts the end surface EF of the first interlayer insulating layer 31 or the second interlayer insulating layer 33. That is, the outer insulating layer 32A may not contact the surface of the first interlayer insulating layer 31 facing the first positive direction X1.

[0104] · In the above-described embodiment, the columnar wiring 40 may also be located on the first negative direction X2 side with respect to the inductor wiring 50. Similarly, the external electrode 60 may also be exposed from the second main surface 11B. In other words, the mounting surface of the inductor component 10 may also be the second main surface 11B.

[0105] · In the above-described embodiment, the interval V1 between the outer insulating layer 32A and the inner insulating layer 32B in the specific cross-section may be the same as or smaller than the interval V2 between the inner insulating layers 32B.

[0106] · In the above-described embodiment, the outer surface of the contact end portion BP on the side opposite to the first interlayer insulating layer 31 may not be the inclined surface SF. For example, in the specific cross-section, the dimension of the contact end portion BP in the direction along the third axis Z may also be constant.

[0107] ·In the above-described embodiment, the material of the base member 101 is not limited to the examples of the above-described embodiment. For example, the material of the base member 101 may also be glass epoxy resin, glass, etc.

[0108] ·In the wiring formation process of the above-described embodiment, dummy wiring connected to the inductor wiring 50 may sometimes be formed. For example, the dummy wiring can be used as wiring for power supply when forming copper plating.

[0109] <Supplementary Note>

[0110] The following describes the technical ideas derived from the above-described embodiment and the modification examples.

[0111] [1] An inductor component, comprising: a green body having a main surface; an interlayer insulating layer extending in parallel with the main surface in the green body; a wiring-interlayer insulating layer extending from the interlayer insulating layer in a first positive direction orthogonal to the main surface; and an inductor wiring extending on the first positive direction side with respect to the interlayer insulating layer in a region divided by the wiring-interlayer insulating layer. In a specific cross-section orthogonal to the center line of the inductor wiring, the wiring-interlayer insulating layer has a plurality of portions discontinuously present in a direction along the main surface. When the surface of the interlayer insulating layer facing a direction parallel to the main surface is defined as an end face, and the portions of each of the above-described portions of the wiring-interlayer insulating layer where the surface facing a direction parallel to the main surface is in contact with the green body are defined as outer insulating layers, the outer insulating layer is in contact with the end face of the interlayer insulating layer.

[0112] [2] The inductor component according to [1], wherein, in addition to being in contact with the end face of the interlayer insulating layer, the outer insulating layer is also in contact with the surface of the interlayer insulating layer facing the first positive direction.

[0113] [3] The inductor component according to [1] or [2], wherein when the portions of each of the above-described portions of the wiring-interlayer insulating layer where the surface facing a direction parallel to the main surface is not in contact with the green body are defined as inner insulating layers, in the specific cross-section, the interval in the direction parallel to the main surface between the outer insulating layer and the inner insulating layer is larger than the interval in the direction parallel to the main surface between the inner insulating layers.

[0114] [4] The inductor component according to any one of [1] to [3], comprising a columnar wiring, the columnar wiring being electrically connected to the inductor wiring and extending in a direction intersecting the main surface, and the columnar wiring being located on the first positive direction side with respect to the inductor wiring.

[0115] [5]The inductor component according to any one of [1] to [4], wherein the inductor wiring has a seed layer that contacts the interlayer insulating layer on the first positive direction side.

[0116] [6]The inductor component according to any one of [1] to [5], wherein when the direction opposite to the first positive direction is set as the first negative direction, and a portion of the outer insulating layer that is located at the same position as the interlayer insulating layer in the first positive direction is set as the contact end portion, an outer surface of the contact end portion on the side opposite to the interlayer insulating layer becomes an inclined surface that approaches the interlayer insulating layer more as it faces the first negative direction.

[0117] [7]The inductor component according to any one of [1] to [6], wherein when the inductor wiring is set as the first inductor wiring, the interlayer insulating layer is set as the first interlayer insulating layer, the inter-wiring insulating layer is set as the first inter-wiring insulating layer, and the outer insulating layer is set as the first outer insulating layer, the inductor component includes: a second interlayer insulating layer that extends on a surface on the first positive direction side of the first inductor wiring and the first inter-wiring insulating layer; a second inter-wiring insulating layer that extends along the first positive direction from the second interlayer insulating layer; and a second inductor wiring that extends on the first positive direction side with respect to the second interlayer insulating layer within a region partitioned by the second inter-wiring insulating layer. In the specific cross-section, the second inter-wiring insulating layer discontinuously exists at a plurality of portions in a direction along the main surface. When a surface of the second interlayer insulating layer that faces a direction parallel to the main surface is set as an end surface, and a portion of each of the portions of the second inter-wiring insulating layer that contacts the green body with a surface facing a direction parallel to the main surface is set as a second outer insulating layer, the second outer insulating layer contacts the end surface of the second interlayer insulating layer and a surface of the first outer insulating layer that faces the green body side.

Claims

1. An inductor component, wherein, Comprising: A green body having a main surface; An interlayer insulating layer extending parallel to the main surface within the green body; An inter-wiring insulating layer extending from the interlayer insulating layer in a first positive direction orthogonal to the main surface; And An inductor wiring extending on the first positive direction side with respect to the interlayer insulating layer within the region partitioned by the inter-wiring insulating layer, In a specific cross-section orthogonal to the center line of the inductor wiring, the inter-wiring insulating layer discontinuously exists at a plurality of portions in a direction along the main surface, When the surface of the outer surface of the interlayer insulating layer facing a direction parallel to the main surface is defined as an end surface, And when a portion of each of the portions of the inter-wiring insulating layer where the surface facing a direction parallel to the main surface contacts the green body is defined as an outer insulating layer, The outer insulating layer contacts the end surface of the interlayer insulating layer.

2. The inductor component according to claim 1, wherein The outer insulating layer contacts not only the end surface of the interlayer insulating layer but also the surface of the interlayer insulating layer facing the first positive direction.

3. The inductor component according to claim 1 or 2, wherein When a portion of each of the portions of the inter-wiring insulating layer where the surface facing a direction parallel to the main surface does not contact the green body is defined as an inner insulating layer, In the specific cross-section, the interval in the direction parallel to the main surface between the outer insulating layer and the inner insulating layer is larger than the interval in the direction parallel to the main surface between the inner insulating layers.

4. The inductor component according to any one of claims 1 to 3, wherein A columnar wiring is provided, which is electrically connected to the inductor wiring and extends in a direction intersecting the main surface, The columnar wiring is located on the first positive direction side with respect to the inductor wiring.

5. The inductor component according to any one of claims 1 to 4, wherein The inductor wiring has a seed layer contacting the interlayer insulating layer on the first positive direction side.

6. The inductor component according to any one of claims 1 to 5, wherein When the direction opposite to the first positive direction is defined as a first negative direction, And when a portion of the outer insulating layer located at the same position as the interlayer insulating layer in the first positive direction is defined as a contact end portion, The outer surface of the contact end portion on the side opposite to the interlayer insulating layer becomes an inclined surface that approaches the interlayer insulating layer more as it faces the first negative direction.

7. The inductor component according to any one of claims 1 to 6, wherein When the inductor wiring is defined as a first inductor wiring, the interlayer insulating layer is defined as a first interlayer insulating layer, the inter-wiring insulating layer is defined as a first inter-wiring insulating layer, and the outer insulating layer is defined as a first outer insulating layer, The inductor component comprises: A second interlayer insulating layer extending on the surface on the first positive direction side of the first inductor wiring and the first inter-wiring insulating layer; A second inter-wiring insulating layer extending from the second interlayer insulating layer in the first positive direction; And The second inductor wiring extends in a first positive direction side with respect to the second interlayer insulating layer within a region divided by the second inter-wiring insulating layer. In the specific cross-section, the second inter-wiring insulating layer has a plurality of portions discontinuously present in a direction along the main surface. When a surface of the second interlayer insulating layer facing a direction parallel to the main surface is defined as an end surface, and a portion of each of the portions of the second inter-wiring insulating layer in contact with the green body, where the surface facing a direction parallel to the main surface is defined as a second outer insulating layer, the second outer insulating layer contacts the end surface of the second interlayer insulating layer and the surface of the first outer insulating layer facing the green body side.

Images