Semiconductor chip packaging equipment facilitating feeding

Abstract

The invention discloses a semiconductor chip packaging device facilitating feeding, and relates to the technical field of semiconductor chip packaging, the semiconductor chip packaging device facilitating feeding comprises a supporting seat and a conveying device, the conveying device is arranged on the inner side of the supporting seat, and the conveying device comprises a servo motor and a conveying belt. According to the semiconductor chip packaging equipment facilitating feeding, in order to enable the center position of a semiconductor chip to be accurately located at the bottom of a dispensing nozzle of dispensing equipment, an air cylinder is started, a positioning plate drives rolling wheels to be close to each other, the semiconductor chip can be clamped and positioned, after the semiconductor chip is clamped, the positioning plate is made to be close to a connecting plate under extrusion force, and then the semiconductor chip is clamped. Therefore, the extrusion rod extrudes the rotating block, the positioning block rotates, the positioning block rotates to extrude the semiconductor chip which is not in the center, the center position of the semiconductor chip is right aligned with a dispensing nozzle of dispensing equipment, accurate dispensing is facilitated, and the packaging quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and particularly to a semiconductor chip packaging device convenient for feeding. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Most electronic products, such as the core chips in computers, mobile phones or digital recorders, are extremely closely related to semiconductors. After etching and wiring on semiconductor wafers, semiconductor chips capable of realizing certain functions are made. After the chips are manufactured, they need to be packaged.

[0003] The patent with the patent announcement number CN220420538U relates to a dispensing device for semiconductor chip packaging, including a device main body. An operation terminal is fixedly connected to the side of the device main body. An installation bracket is fixedly connected to the outer side wall of the upper end of the device main body. A moving slide rail is provided on the installation bracket. A dispensing pen is slidably connected to the moving slide rail. An installation tube is installed at the upper end of the dispensing pen. Through the setting of the stirring tank, when in use, the colloid can be first injected into the stirring tank and pretreated by the stirring blades. In this way, the colloid is defoamed by the uniform stirring of the stirring blades, avoiding the phenomenon of holes when the colloid is injected. At the same time, when the stirring blades stir the colloid in the stirring tank, the conditioning member on the stirring blades will automatically release a diluent to condition the colloid, avoiding the colloid from being too viscous and causing phenomena such as wire drawing during subsequent dispensing.

[0004] In the above patent, during the dispensing operation, when the semiconductor chip is transported to the dispensing device for dispensing, the semiconductor chip cannot be accurately positioned, so that the center position of the semiconductor chip is not aligned with the dispensing position of the dispensing device. Therefore, when dispensing the semiconductor chip, the glue may drip on the edge of the semiconductor, which will affect the packaging effect and reduce the product quality. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor chip packaging device convenient for feeding, which solves the problems raised in the above background art.

[0006] To achieve the above object, the present invention is implemented through the following technical solutions: A semiconductor chip packaging device convenient for feeding, including a support base and a conveying device. The conveying device is arranged inside the support base. The conveying device includes a servo motor and a conveyor belt. The conveyor belt is rotatably installed on the inner wall of the support base. The servo motor is fixedly penetrated through one side of the support base away from the conveyor belt. The output end of the servo motor is fixedly connected to the drive shaft of the conveyor belt. When it is necessary to perform dispensing and packaging operations on semiconductor chips, by starting the servo motor, the conveyor belt can be rotated. By placing the semiconductor chips on the conveyor belt, the conveyor belt transports the semiconductor chips to the dispensing device for dispensing and packaging operations. A fixed frame is fixed on the top of the support base, and a dispensing device is arranged on the fixed frame. A positioning component for positioning semiconductor chips is arranged on the support base, and an intermittent feeding component and a collection component are also included; Among them, the positioning component includes a cylinder, a connecting plate, a connecting column, a positioning plate, a stopper, a compression spring, a roller, a rotating rod, a rotating block, a positioning block, an inclined block, an extrusion rod, and a torsion spring; The cylinder is fixed on the fixed frame. The output end of the cylinder is fixed with a connecting plate. A connecting column penetrates through the connecting plate. One end of the connecting column is fixed with a positioning plate, and the other end of the connecting column is fixed with a stopper. A compression spring is fixed on the side of the stopper close to the connecting plate, and the side of the compression spring away from the stopper is fixed on the side wall of the connecting plate. A plurality of groups of rollers arranged in a linear array are rotatably installed inside the positioning plate. When the semiconductor chips are transported to the dispensing device, by starting the cylinder, the connecting plate and the positioning plate can be driven to move, so that the positioning plate contacts the semiconductor chips to perform clamping and positioning. An extrusion rod is fixed on the side wall of the connecting plate. A rotating rod penetrates through the positioning plate, and the penetrating part of the rotating rod and the positioning plate is rotatably connected. A rotating block is fixed on the top of the rotating rod, and a positioning block is fixed on the bottom of the rotating rod. There are four positioning blocks, and two positioning blocks are in a group, and the two groups of positioning blocks are symmetrically arranged with the center line in the vertical direction of the conveyor belt as the axis of symmetry. When the positioning plate clamps the semiconductor chips, the positioning plate will be subjected to a squeezing force, causing the positioning plate to move towards the connecting plate, so that the compression spring is stretched. And when the positioning plate moves to contact the rotating block and the extrusion rod, the extrusion rod will squeeze the rotating block, causing the rotating block to rotate, so that the four positioning blocks rotate simultaneously to center the semiconductor chips.

[0007] According to the above technical solution, a torsion spring is fixed on the top of the positioning block, and the top of the torsion spring is fixed on the inner side of the bottom of the positioning plate. An inclined block is fixed on the side wall of the positioning block. When the positioning block rotates, the bottommost part of the inclined block will lift the semiconductor chip.

[0008] According to the above technical solution, the intermittent feeding assembly includes a sliding rod, a sleeve, a sleeve rod, a long plate, a chute, a baffle, a vacuum cleaner, a dust suction hood, a fixing plate, a dust collection box, a spring switch, a transmission rod, a return spring, a transmission block, a hinged rod and an L-shaped extrusion block; the sliding rod is fixed on the side wall of the connecting plate, the top of the support seat is fixed with a sleeve, the inner wall of the sleeve is slidably installed with a sleeve rod, the top of the sleeve rod is fixed with a long plate, a chute is formed on the long plate, the sliding rod penetrates through the chute and fits at the penetration point, the bottom of the long plate is fixed with a baffle, when the connecting plate moves, the sliding rod can move in the chute, so that the sliding rod can squeeze the long plate to move downward, thereby driving the baffle to move downward.

[0009] According to the above technical solution, a fixing plate is fixed on the side wall of the long plate, a vacuum cleaner is fixed on the top of the fixing plate, a spring switch is installed on the vacuum cleaner, a dust suction hood is fixedly connected to the left side of the vacuum cleaner through a dust suction pipe, and a dust collection box is fixedly connected to the right side of the vacuum cleaner through a discharge pipe, and the dust collection box is fixed on the side wall of the long plate.

[0010] According to the above technical solution, a transmission rod penetrates through the baffle, a transmission block is fixed on the top of the transmission rod, an L-shaped extrusion block penetrates through the fixing plate, a hinged rod is hinged on the L-shaped extrusion block, and one end of the hinged rod away from the L-shaped extrusion block is hinged on the top of the transmission block. When the baffle moves downward, the transmission rod will contact the conveyor belt, and the transmission rod will move upward in the baffle under the extrusion force, so that the transmission block squeezes the hinged rod, and the hinged rod squeezes the L-shaped extrusion block to squeeze the spring switch, starting the vacuum cleaner.

[0011] According to the above technical solution, a return spring is fixed to the bottom of the transmission block, and the bottom of the return spring is fixed to the top of the baffle.

[0012] According to the above technical solution, the collection assembly includes a fixed rod, a movable rod, a connecting block, a collection box, a guide rod, a connecting spring, a push rod, a push block, an inclined rod and a sealing plate; the fixed rod is fixed on the top of the dust collection box, the inner bottom of the fixed frame is slidably installed with a connecting block, a movable rod is hinged on the connecting block, one end of the movable rod away from the connecting block is hinged on the top of the fixed rod, a collection box is fixed on the side of the connecting block away from the movable rod, and a sealing plate is slidably installed on the top of the collection box. When the baffle drives the dust collection box to move downward, the fixed rod will move downward, so that the fixed rod pulls the movable rod, the movable rod rotates at the hinge, and the movable rod pulls the connecting block to move, so that the collection box is removed from the bottom of the dispensing device.

[0013] According to the above technical solution, a guide rod passes through the connection block. A push block is fixed at the end point of the guide rod. A connection spring is fixed on the side wall of the push block. The side away from the push block of the connection spring is fixed on the side wall of the connection block. A push rod is fixed on the side wall of the push block. One end of the push rod away from the push block is hinged with an inclined rod. One end of the inclined rod away from the push rod is hinged on the sealing plate. When the connection block moves, the push block will contact the fixed rod, and the push block will be subjected to a squeezing force, so that the push rod squeezes the inclined rod, and the two sealing plates can approach each other.

[0014] The present invention provides a semiconductor chip packaging device convenient for feeding. It has the following beneficial effects:

[0015] 1. For the semiconductor chip packaging device convenient for feeding, in order to make the center position of the semiconductor chip accurately at the bottom of the dispensing nozzle of the dispensing device, start the air cylinder to make the positioning plate drive the rollers to approach each other, which can clamp and position the semiconductor chip. And when the semiconductor chip is clamped well, the positioning plate will be subjected to a squeezing force and approach the connecting plate, so that the extrusion rod squeezes the rotating block, making the positioning block rotate, and the positioning block rotates to squeeze the non-centered semiconductor chip, so that the center position of the semiconductor chip is exactly aligned with the dispensing nozzle of the dispensing device, facilitating accurate dispensing and improving the packaging quality.

[0016] 2. For the semiconductor chip packaging device convenient for feeding, and when the connecting plate drives the positioning plate to clamp and position the semiconductor chip, the sliding rod will move in the sliding groove, so that the long plate drives the baffle to move downward to block the next semiconductor chip to be dispensed, so as to perform intermittent feeding and prevent the occurrence of material collision. And when the baffle moves downward, the transmission rod can contact the conveyor belt, and the transmission rod is subjected to a squeezing force and moves upward. Through the cooperation of the transmission block, the hinged rod and the L-shaped extrusion block, the L-shaped extrusion block squeezes the spring switch, starting the vacuum cleaner to perform dust removal operations on the semiconductor chip to be dispensed.

[0017] 3. For the semiconductor chip packaging device convenient for feeding, and when the dispensing device does not perform dispensing operations, the collection box will be at the bottom of the dispensing nozzle on the dispensing device, so that glue can be collected, preventing glue from remaining on the dispensing nozzle and dripping onto the conveyor belt, resulting in inconvenient cleaning operations. And when dispensing operations are performed, because the baffle will descend, the fixed rod will descend to pull the movable rod, so that the connection block drives the collection box to move away from the bottom of the dispensing device for dispensing operations. And when the connection block moves, the push block will contact the fixed rod, and the push block will be subjected to a squeezing force and approach the collection box. Through the cooperation of the push rod and the inclined rod, the sealing plate will block the top of the collection box, preventing dust from entering. Description of the Drawings

[0018] Figure 1Schematic diagram of the overall structure of the present invention;

[0019] Figure 2 Schematic diagram of the overall structure of the present invention;

[0020] Figure 3 Schematic diagram of the sectional structure of the present invention;

[0021] Figure 4 Schematic diagram of the positioning component, intermittent feeding component and collection component of the present invention;

[0022] Figure 5 Partial schematic diagram of the positioning component of the present invention;

[0023] Figure 6 Partial schematic diagram of the intermittent feeding component and collection component of the present invention;

[0024] Figure 7 For the present invention Figure 6 Enlarged schematic diagram of Structure A;

[0025] Figure 8 Schematic diagram of the collection component of the present invention.

[0026] In the figure: 1, support base; 2, conveying equipment; 3, fixed frame; 4, dispensing equipment; 5, cylinder; 6, connecting plate; 7, connecting column; 8, positioning plate; 9, stop block; 10, compression spring; 11, roller; 12, rotating rod; 13, rotating block; 14, extrusion rod; 15, positioning block; 16, torsion spring; 17, inclined block; 1801, sliding rod; 1802, sleeve; 1803, sleeve rod; 1804, long plate; 1805, baffle; 1806, chute; 1807, vacuum cleaner; 1808, dust suction hood; 1809, dust collection box; 1810, fixing plate; 1811, transmission rod; 1812, transmission block; 1813, return spring; 1814, articulated rod; 1815, L-shaped extrusion block; 1816, spring switch; 1901, fixed rod; 1902, movable rod; 1903, connecting block; 1904, collection box; 1905, guide rod; 1906, connecting spring; 1907, pushing block; 1908, push rod; 1909, inclined rod; 1910, sealing plate. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer toFigures 1-5 An embodiment of the present invention is: a semiconductor chip packaging device convenient for feeding, including a support base 1 and a conveying device 2. The conveying device 2 is arranged inside the support base 1. The conveying device 2 includes a servo motor and a conveyor belt. The conveyor belt is rotatably installed on the inner wall of the support base 1. The servo motor is fixedly penetrated through one side of the support base 1 away from the conveyor belt. The output end of the servo motor is fixedly connected to the drive shaft of the conveyor belt. A fixed frame 3 is fixed on the top of the support base 1. A dispensing device 4 is arranged on the fixed frame 3. A positioning component for positioning the semiconductor chip is arranged on the support base 1. Among them, the positioning component includes a cylinder 5, a connecting plate 6, a connecting column 7, a positioning plate 8, a stopper 9, a compression spring 10, a roller 11, a rotating rod 12, a rotating block 13, a positioning block 15, an inclined block 17, a pressing rod 14 and a torsion spring 16. The cylinder 5 is fixed on the fixed frame 3. The output end of the cylinder 5 is fixed with a connecting plate 6. A connecting column 7 is penetrated through the connecting plate 6, and the connecting column 7 is rotatably connected to the penetration of the connecting plate 6. One end of the connecting column 7 is fixed with a positioning plate 8. The other end of the connecting column 7 is fixed with a stopper 9. A compression spring 10 is fixed on the side of the stopper 9 close to the connecting plate 6. The side of the compression spring 10 away from the stopper 9 is fixed on the side wall of the connecting plate 6. A plurality of groups of rollers 11 arranged in a linear array are rotatably installed inside the positioning plate 8. A pressing rod 14 is fixed on the side wall of the connecting plate 6. A rotating rod 12 is penetrated through the positioning plate 8, and the rotating rod 12 is rotatably connected to the penetration of the positioning plate 8. The top of the rotating rod 12 is fixed with a rotating block 13. The bottom of the rotating rod 12 is fixed with a positioning block 15. There are four positioning blocks 15, and two positioning blocks 15 are in a group. The two groups of positioning blocks 15 are symmetrically arranged with the center line in the vertical direction of the conveyor belt as the axis of symmetry. A torsion spring 16 is fixed on the top of the positioning block 15. The top of the torsion spring 16 is fixed on the inner side of the bottom of the positioning plate 8. An inclined block 17 is fixed on the side wall of the positioning block 15. The bottom of the inclined block 17 is in contact with the top of the conveyor belt.

[0029] And after the semiconductor chip is clamped by the rollers 11, through the rotation of the positioning block 15, the positioning block 15 can squeeze the semiconductor chip to move, so as to center and position the semiconductor chip, align the center position of the semiconductor chip with the dispensing nozzle of the dispensing device 4, and perform precise dispensing, preventing the glue from dripping on the edge of the semiconductor chip, affecting the packaging effect and reducing the product quality.

[0030] And through the arrangement of the rollers 11, when the positioning block 15 squeezes the semiconductor chip to center, the semiconductor chip will move on the rollers 11, which is convenient for the semiconductor to move on the positioning plate 8, preventing direct contact between the positioning plate 8 and the semiconductor chip, so that the friction force is too large and may cause damage to the semiconductor chip.

[0031] During the operation of this embodiment: When dispensing and encapsulating a semiconductor chip is required, start the servo motor to rotate the conveyor belt. Place the semiconductor chip to be encapsulated on the conveyor belt. Through the conveyor belt, transport the semiconductor chip in the direction of the dispensing device 4 to facilitate the feeding operation of the semiconductor chip. When the semiconductor chip is transported to the dispensing device 4, start the cylinder 5, which can drive the connecting plate 6 to move. The connecting plate 6 drives the connecting column 7 and the positioning plate 8 to move, making the two positioning plates 8 approach each other. The rollers 11 on the positioning plate 8 can clamp and position the semiconductor chip on the conveyor belt, and make the semiconductor chip in the middle position of the conveyor belt. After the rollers 11 press and position the semiconductor body, the positioning plate 8 will approach the connecting plate 6 under the extrusion force, stretching and deforming the compression spring 10. When the positioning plate 8 approaches the connecting plate 6, the extrusion rod 14 will contact the rotating block 13. When the extrusion rod 14 squeezes the rotating block 13, the rotating block 13 will rotate, causing the rotating rod 12 to drive the four positioning blocks 15 to rotate relative to each other, compressing and deforming the torsion spring 16, enabling the positioning blocks 15 to squeeze the non-centered semiconductor chip and adjust the position of the semiconductor chip on the positioning plate 8. When the rotating block 13 is squeezed and rotated 90° by the extrusion rod 14, the positioning block 15 rotates 90°, exactly making the side wall of the positioning block 15 fit the outer wall of the semiconductor chip, accurately positioning the position of the semiconductor chip, aligning the center position of the semiconductor chip with the dispensing nozzle of the dispensing device 4, and thus performing accurate dispensing, improving the quality of product encapsulation. When the positioning block 15 rotates, the inclined block 17 moves along the conveyor belt on the side away from the positioning block 15. The inclined block 17 can lift the semiconductor chip from the bottom of the semiconductor chip, making the bottom of the semiconductor chip not contact the conveyor belt, thereby reducing the friction between the semiconductor chip and the conveyor belt and reducing the risk of damage to the semiconductor chip. After positioning the semiconductor chip, start the dispensing device 4 for dispensing operation. After dispensing, start the cylinder 5 to move the two positioning plates 8 away from each other, thereby releasing the clamping and positioning of the semiconductor chip. When the positioning plate 8 is not under extrusion, since the compression spring 10 is in a stretched and deformed state, the compression spring 10 will drive the stopper 9 and the connecting column 7 to reset, causing the positioning plate 8 to move away from the connecting plate 6 and reset, so that the extrusion rod 14 does not squeeze the rotating block 13. Since the torsion spring 16 is in a contracted and deformed state, the torsion spring 16 will drive the positioning block 15 to rotate, making the positioning block 15 rotate to the bottom of the positioning plate 8 for the next positioning operation.

[0032] Please refer to Figures 1-8, on the basis of the above embodiments, in another embodiment of the present invention, it further includes an intermittent feeding assembly and a collection assembly. The intermittent feeding assembly includes a sliding rod 1801, a sleeve 1802, a sleeve rod 1803, a long plate 1804, a chute 1806, a baffle 1805, a vacuum cleaner 1807, a dust suction hood 1808, a fixing plate 1810, a dust collection box 1809, a spring switch 1816, a transmission rod 1811, a return spring 1813, a transmission block 1812, a hinge rod 1814 and an L-shaped extrusion block 1815; the sliding rod 1801 is fixed on the side wall of the connecting plate 6, the top of the support seat 1 is fixed with a sleeve 1802, the inner wall of the sleeve 1802 is slidably installed with a sleeve rod 1803, the top of the sleeve rod 1803 is fixed with a long plate 1804, a chute 1806 is opened on the long plate 1804, the sliding rod 1801 passes through the chute 1806, and the passing part is in contact, the bottom of the long plate 1804 is fixed with a baffle 1805, the material of the baffle 1805 is rubber material, the side wall of the long plate 1804 is fixed with a fixing plate 1810, the top of the fixing plate 1810 is fixed with a vacuum cleaner 1807, a spring switch 1816 is installed on the vacuum cleaner 1807, the left side of the vacuum cleaner 1807 is fixedly connected with a dust suction hood 1808 through a dust suction pipe, the right side of the vacuum cleaner 1807 is fixedly connected with a dust collection box 1809 through a discharge pipe, the dust collection box 1809 is fixed on the side wall of the long plate 1804, a transmission rod 1811 passes through the baffle 1805, the transmission rod 1811 is slidably connected with the passing part of the baffle 1805, the top of the transmission rod 1811 is fixed with a transmission block 1812, an L-shaped extrusion block 1815 passes through the fixing plate 1810, and the L-shaped extrusion block 1815 is slidably connected with the passing part of the fixing plate 1810, and the L-shaped extrusion block 1815 can move in the fixing plate 1810, an hinge rod 1814 is hinged on the L-shaped extrusion block 1815, one end of the hinge rod 1814 away from the L-shaped extrusion block 1815 is hinged on the top of the transmission block 1812, the bottom of the transmission block 1812 is fixed with a return spring 1813, and the bottom of the return spring 1813 is fixed on the top of the baffle 1805.

[0033] And by moving the baffle 1805 downward to fit with the conveyor belt, it can block the next semiconductor chip to be dispensed and encapsulated, perform intermittent feeding, prevent the occurrence of material collision, and prevent the two groups of semiconductor chips from colliding, which is likely to cause damage.

[0034] And by starting the vacuum cleaner 1807, the dust suction operation can be carried out on the next semiconductor chip to be dispensed through the dust suction hood 1808, preventing dust and the like from adhering to the semiconductor chip. Dust may contaminate the dispensing material and affect the quality and performance of the encapsulation.

[0035] The collection component includes a fixed rod 1901, a movable rod 1902, a connecting block 1903, a collection box 1904, a guide rod 1905, a connecting spring 1906, a push rod 1908, a push block 1907, an inclined rod 1909 and a sealing plate 1910; the fixed rod 1901 is fixed on the top of the dust collection box 1809, the inner bottom of the fixed frame 3 is slidably installed with a connecting block 1903, the connecting block 1903 is hinged with a movable rod 1902, one end of the movable rod 1902 away from the connecting block 1903 is hinged on the top of the fixed rod 1901, one side of the connecting block 1903 away from the movable rod 1902 is fixed with a collection box 1904, the top of the collection box 1904 is slidably installed with a sealing plate 1910, a guide rod 1905 passes through the connecting block 1903 and is slidably connected at the passing position, the end point of the guide rod 1905 is fixed with a push block 1907, the side wall of the push block 1907 is fixed with a connecting spring 1906, the side of the connecting spring 1906 away from the push block 1907 is fixed on the side wall of the connecting block 1903, the side wall of the push block 1907 is fixed with a push rod 1908, one end of the push rod 1908 away from the push block 1907 is hinged with an inclined rod 1909, one end of the inclined rod 1909 away from the push rod 1908 is hinged on the sealing plate 1910, there are two groups of sealing plates 1910, and the two groups of sealing plates 1910 are symmetrically arranged with the central line in the vertical direction of the collection box 1904 as the axis of symmetry, and the collection box 1904 can collect the excess dripping glue in the dispensing nozzle of the dispensing device 4, preventing the glue from dripping onto the conveyor belt and causing pollution to the conveyor belt, which is inconvenient for subsequent staff to clean up.

[0036] Moreover, through the setting of the two groups of sealing plates 1910, when the collection box 1904 is not performing the glue receiving operation, the sealing plates 1910 will block the top of the collection box 1904, so as to achieve the effect of dust prevention.

[0037] During the operation of this embodiment: when the two connecting plates 6 approach each other, the sliding rod 1801 will move in the inclined groove of the sliding groove 1806, thereby causing the sliding rod 1801 to squeeze the inclined groove of the sliding groove 1806. Due to the extrusion force, the long plate 1804 will move downward, so that the long plate 1804 can drive the baffle 1805 to move downward to block the next semiconductor chip to be dispensed. And when the sliding rod 1801 moves to the straight groove section of the sliding groove 1806, the position of the long plate 1804 will no longer change. And when the dispensing is completed, since the two connecting plates 6 move away from each other to release the clamping and positioning of the dispensed semiconductor chip, it can be transported to the next process through the conveyor belt. And when the two connecting plates 6 are reset, the sliding rod 1801 will be reset in the sliding groove 1806. When moving to the inclined groove section of the sliding groove 1806, it will squeeze the long plate 1804 to move upward, causing the baffle 1805 to move upward and not block the semiconductor chip, and feeding operation can be carried out. Through the setting of the baffle 1805, the effect of intermittent feeding can be achieved, thereby preventing the occurrence of material collision accidents. And when the baffle 1805 moves downward, the transmission rod 1811 will first contact the outer wall of the conveyor belt. Due to the extrusion force, the transmission rod 1811 will move upward in the baffle 1805, causing the transmission rod 1811 to drive the transmission block 1812 to move upward, stretching the return spring 1813. And the transmission block 1812 will squeeze the hinge rod 1814, causing the hinge rod 1814 to rotate at the hinge. Thus, the hinge rod 1814 squeezes the L-shaped extrusion block 1815 to approach the vacuum cleaner 1807, so that the L-shaped extrusion block 1815 squeezes the spring switch 1816 to move the spring switch 1816 to turn on the vacuum cleaner 1807. Thus, through the dust suction cover 1808, the dust suction operation is carried out to suck the dust attached to the top of the semiconductor chip at the baffle 1805, and the adsorbed dust is discharged into the dust collection box 1809. And when the baffle 1805 moves upward, the transmission rod 1811 will not be under extrusion force, and the return spring 1813 is in a stretched state, causing the transmission block 1812 to move downward, causing the transmission block 1812 to pull the hinge rod 1814, causing the hinge rod 1814 to rotate at the hinge. Thus, the hinge rod 1814 pulls the L-shaped extrusion block 1815 away from the spring switch 1816, so that the L-shaped extrusion block 1815 does not contact the spring switch 1816, and the spring switch 1816 is reset, thereby turning off the vacuum cleaner 1807 and stopping the dust suction operation to prevent the continuous on state from easily causing power consumption.

[0038] And when the long board 1804 moves downward, it can drive the dust collection box 1809 to move downward, so that the fixed rod 1901 pulls the movable rod 1902, causing the movable rod 1902 to rotate at the hinge, and the movable rod 1902 pulls the connecting block 1903 to move towards the long board 1804. Thus, the connecting block 1903 drives the collection box 1904 to move towards the long board 1804, so that the collection box 1904 does not block the dispensing nozzle of the dispensing device 4, and thus the dispensing operation can be carried out. And when the connecting block 1903 approaches the long board 1804, the push block 1907 will contact the fixed rod 1901, so that the push block 1907 is subjected to an extrusion force, causing the guide rod 1905 to move in the connecting block 1903 and compressing the connecting spring 1906. When the push block 1907 moves, the push rod 1908 will squeeze the inclined rod 1909, causing the inclined rod 1909 to rotate at the hinge, and the inclined rod 1909 squeezes the two sets of sealing plates 1910 to approach each other. The top of the collection box 1904 can be sealed by the sealing plates 1910, achieving the effect of dust prevention. And when the dispensing operation is not carried out, the long board 1804 will move upward, so that the dust collection box 1809 will move upward, the fixed rod 1901 will move upward, and the fixed rod 1901 will squeeze the movable rod 1902, causing the movable rod 1902 to squeeze the connecting block 1903 away from the long board 1804. And when the connecting block 1903 moves away from the long board 1804, since the push block 1907 does not contact the fixed rod 1901, the push block 1907 will not be subjected to the extrusion force. And because the connecting spring 1906 is in a compressed state, the push block 1907 will be reset, causing the push block 1907 to drive the push rod 1908 to be reset, the push rod 1908 will pull the inclined rod 1909, causing the inclined rod 1909 to rotate at the hinge, and the inclined rod 1909 will pull the two sets of sealing plates 1910 to open. And the connecting block 1903 drives the collection box 1904 to move to the bottom of the dispensing nozzle of the dispensing device 4, so that the glue dripping from the dispensing nozzle can be collected.

[0039] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging device facilitating loading, comprising a support base (1) and a conveying device (2), wherein the conveying device (2) is arranged inside the support base (1), and is characterized in that: The conveying device (2) includes a servo motor and a conveyor belt. The conveyor belt is rotatably installed on the inner wall of the support base (1). The servo motor is fixedly penetrated through one side of the support base (1) away from the conveyor belt. The output end of the servo motor is fixedly connected to the drive shaft of the conveyor belt. A fixed frame (3) is fixed on the top of the support base (1). A dispensing device (4) is arranged on the fixed frame (3). A positioning component for positioning the semiconductor chip is arranged on the support base (1). It also includes an intermittent feeding component and a collection component; Among them, the positioning component includes a cylinder (5), a connecting plate (6), a connecting column (7), a positioning plate (8), a stopper (9), a compression spring (10), a roller (11), a rotating rod (12), a rotating block (13), a positioning block (15), an inclined block (17), an extrusion rod (14) and a torsion spring (16); The cylinder (5) is fixed on the fixed frame (3). The output end of the cylinder (5) is fixed with a connecting plate (6). A connecting column (7) penetrates through the connecting plate (6). One end of the connecting column (7) is fixed with a positioning plate (8). The other end of the connecting column (7) is fixed with a stopper (9). A compression spring (10) is fixed on one side of the stopper (9) close to the connecting plate (6). The side wall of the connecting plate (6) is fixed on the side away from the stopper (9) of the compression spring (10). A plurality of groups of rollers (11) arranged in a linear array are rotatably installed on the inner side of the positioning plate (8). An extrusion rod (14) is fixed on the side wall of the connecting plate (6). A rotating rod (12) penetrates through the positioning plate (8), and the penetrating part of the rotating rod (12) and the positioning plate (8) is rotatably connected. A rotating block (13) is fixed on the top of the rotating rod (12). A positioning block (15) is fixed on the bottom of the rotating rod (12). There are four positioning blocks (15), and two positioning blocks (15) are in a group. The two groups of positioning blocks (15) are symmetrically arranged with the center line in the vertical direction of the conveyor belt as the axis of symmetry; The intermittent feeding component includes a sliding rod (1801), a sleeve (1802), a sleeve rod (1803), a long plate (1804), a chute (1806), a baffle (1805), a vacuum cleaner (1807), a dust suction hood (1808), a fixing plate (1810), a dust collection box (1809), a spring switch (1816), a transmission rod (1811), a return spring (1813), a transmission block (1812), a hinge rod (1814) and an L-shaped extrusion block (1815); The sliding rod (1801) is fixed on the side wall of the connecting plate (6). A sleeve (1802) is fixed on the top of the support base (1). A sleeve rod (1803) is slidably installed on the inner wall of the sleeve (1802). A long plate (1804) is fixed on the top of the sleeve rod (1803). A chute (1806) is opened on the long plate (1804). The sliding rod (1801) penetrates through the chute (1806), and the penetrating part is in contact. A baffle (1805) is fixed on the bottom of the long plate (1804); The collection component includes a fixed rod (1901), a movable rod (1902), a connection block (1903), a collection box (1904), a guide rod (1905), a connection spring (1906), a push rod (1908), a push block (1907), an inclined rod (1909) and a sealing plate (1910); the fixed rod (1901) is fixed to the top of the dust collection box (1809), the connection block (1903) is slidably installed at the inner bottom of the fixed frame (3), the movable rod (1902) is hinged to the connection block (1903), one end of the movable rod (1902) away from the connection block (1903) is hinged to the top of the fixed rod (1901), a collection box (1904) is fixed to one side of the connection block (1903) away from the movable rod (1902), and the sealing plate (1910) is slidably installed on the top of the collection box (1904).

2. The semiconductor chip packaging device convenient for feeding according to claim 1, wherein: A torsion spring (16) is fixed to the top of the positioning block (15), the top of the torsion spring (16) is fixed to the inner bottom of the positioning plate (8), and an inclined block (17) is fixed to the side wall of the positioning block (15).

3. A semiconductor chip packaging device facilitating feeding, characterized in that: A fixed plate (1810) is fixed to the side wall of the long plate (1804), a vacuum cleaner (1807) is fixed to the top of the fixed plate (1810), a spring switch (1816) is installed on the vacuum cleaner (1807), the left side of the vacuum cleaner (1807) is fixedly connected to a dust suction hood (1808) through a dust suction pipe, the right side of the vacuum cleaner (1807) is fixedly connected to a dust collection box (1809) through a discharge pipe, and the dust collection box (1809) is fixed to the side wall of the long plate (1804).

4. The semiconductor chip packaging device for convenient feeding according to claim 3, wherein: A transmission rod (1811) passes through the baffle (1805), a transmission block (1812) is fixed to the top of the transmission rod (1811), an L-shaped extrusion block (1815) passes through the fixed plate (1810), a hinge rod (1814) is hinged to the L-shaped extrusion block (1815), and one end of the hinge rod (1814) away from the L-shaped extrusion block (1815) is hinged to the top of the transmission block (1812).

5. A semiconductor chip packaging device facilitating feeding, characterized in that: A return spring (1813) is fixed to the bottom of the transmission block (1812), and the bottom of the return spring (1813) is fixed to the top of the baffle (1805).

6. A semiconductor chip packaging device facilitating feeding, characterized in that: A guide rod (1905) passes through the connection block (1903), a push block (1907) is fixed to the end point of the guide rod (1905), a connection spring (1906) is fixed to the side wall of the push block (1907), the side of the connection spring (1906) away from the push block (1907) is fixed to the side wall of the connection block (1903), a push rod (1908) is fixed to the side wall of the push block (1907), an inclined rod (1909) is hinged to one end of the push rod (1908) away from the push block (1907), and one end of the inclined rod (1909) away from the push rod (1908) is hinged to the sealing plate (1910).

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