Full-automatic chip detection sorting machine

Abstract

The invention provides a full-automatic chip detection sorting machine which comprises a base, a material storage mechanism, a carrying mechanism, a material taking mechanism, an ejector pin mechanism and a sorting carrying table, the sorting carrying table is arranged at one end of the base, and the material storage mechanism opposite to the sorting carrying table penetrates through the other end of the base. The material taking mechanism is arranged on the sorting carrying table and located between the sorting carrying table and the material storage mechanism, the bottom of the carrying mechanism arranged above the sorting carrying table is connected with the base, the ejector pin mechanism penetrates through the base from the lower portion of the sorting carrying table and then is embedded into a through hole in the sorting carrying table, and after the height of the material storage mechanism is adjusted in the vertical direction, the ejector pin mechanism is fixed to the base. Materials in the material storage mechanism are grabbed by the material taking mechanism and moved to the sorting platform deck, after the positions of the materials are adjusted through the sorting platform deck, the materials on the sorting platform deck are jacked up through the ejector pin mechanism, the jacked-up materials are adsorbed by the carrying mechanism and carried to the detection equipment, and then the chips are subjected to all-directional detection through the detection equipment. And labeling, packaging and blanking are carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and particularly to a full-automatic chip detection and sorting machine. Background Art

[0002] During the semiconductor testing process, the sorting machine works in cooperation with equipment such as a probe station and a tester, and is used in the inspection stage of chip design and the final test link of finished products, enabling the whole process detection of chips from design to finished products, ensuring the quality and performance of semiconductor products, and improving the automation level of semiconductor manufacturing in an environment with high cleanliness.

[0003] For example, in a document with a Chinese patent application number of 202510112737.0, a classification number of H01L21 / 67, and a publication date of March 4, 2025, it discloses a chip detection and sorting device and method. The frame is provided with a loading and unloading gripper module, a detection module, a transfer module, and a taping module; the transfer module includes a first conveyor line, a second conveyor line, a third conveyor line, and a tray transfer mechanism; the detection module includes a first detection device and a second detection device. The first detection device is used to detect the side and bottom surfaces of the chip, and the second detection device is used to detect the front surface of the chip; the taping module includes a taping mechanism for taping and packaging the chip; the loading and unloading gripper module includes a loading mechanism and an unloading mechanism. The loading mechanism is used to transfer the chip between the first conveyor line and the first detection device; the unloading mechanism is used to transfer the chip between the second conveyor line, the third conveyor line, and the taping mechanism.

[0004] The above-mentioned document realizes the transfer of the chip between the conveyor line, the first detection device, and the taping mechanism through the loading mechanism and the unloading mechanism, and then detects the front surface of the chip on different conveyor lines through the second detection device, so as to complete various visual inspections of multiple surfaces of the chip, and classify and package them; however, it only detects a single chip and cannot realize the transportation and detection of different types of chips, resulting in low working efficiency. Summary of the Invention

[0005] The purpose of the present invention is to provide a full-automatic chip detection and sorting machine, which can transport different types of crystal chips, thereby realizing alternative sorting, and then conduct a comprehensive inspection of the sorted crystal chips, and label and package the inspected crystal chips, so as to improve the working efficiency of the crystal chip transportation and detection process.

[0006] To achieve the above object, the present invention provides a fully automatic chip detection and sorting machine, which includes a base, a material storage mechanism, a handling mechanism, a material picking mechanism, a thimble mechanism and a sorting stage. The sorting stage is arranged at one end of the base, and the material storage mechanism arranged opposite to the sorting stage penetrates through the other end of the base. The material picking mechanism is arranged on the sorting stage and between the sorting stage and the material storage mechanism. The bottom of the handling mechanism arranged above the sorting stage is connected to the base. The thimble mechanism penetrates through the base from below the sorting stage and is embedded in the through hole inside the sorting stage. After the height of the material storage mechanism is adjusted vertically, the material in the material storage mechanism is grabbed by the material picking mechanism and moved to the sorting stage. After the position of the material is adjusted by the sorting stage, the material on the sorting stage is lifted by the thimble mechanism, so that the handling mechanism adsorbs the lifted material and transports it to the detection device. The detection device includes a first working platform and a second working platform. A receiving mechanism, a first conveying mechanism and a first detection mechanism are arranged on the first working platform. A second conveying mechanism, a second detection mechanism, a second sorting mechanism and a fourth conveying mechanism are arranged on the second working platform. A third conveying mechanism is arranged between the first working platform and the second working platform.

[0007] The above structure can grab different-sized iron rings in the material storage mechanism through the material picking mechanism, and then alternately transfer them to the sorting stage. After the position of the material is adjusted by the sorting stage, the thimble mechanism can lift the chip on the iron ring on the sorting stage. At the same time, the handling mechanism adsorbs the lifted chip on the sorting stage, and then transfers it to the detection device through the handling mechanism. Since the material picking mechanism can alternately transfer iron rings of different sizes to the sorting stage, the sorting stage can alternately sort different types of crystal chips on iron rings of different sizes, and transport the sorted crystal chips to the detection device, thereby improving the efficiency of the production process of different types of crystal chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram of the overall structure of the sorting stage in the present invention.

[0009] Figure 2 It is an exploded view of the overall structure of the sorting stage in the present invention.

[0010] Figure 3 It is a partial exploded view of the clamping ring assembly in the present invention.

[0011] Figure 4 It is a schematic diagram of the structures of the lifting outer ring, driving component one and driving component two in the present invention.

[0012] Figure 5 It is a top view of the lifting outer ring, driving component one and driving component two in the present invention.

[0013] Figure 6 Schematic structural diagram of the lifting outer ring, driving component 1, and driving component 2 from another perspective in the present invention.

[0014] Figure 7 Partial exploded view of clamping ring component 1 in the present invention.

[0015] Figure 8 Schematic structural diagram of the lifting outer ring, driving component 1, and driving component 2 from yet another perspective in the present invention.

[0016] Figure 9 Overall schematic structural diagram of the present invention.

[0017] Figure 10 Schematic structural diagram of the material taking mechanism and sorting stage in the present invention.

[0018] Figure 11 Schematic structural diagram of the ejector pin mechanism in the present invention.

[0019] Figure 12 Side view of the storage mechanism in the present invention.

[0020] Figure 13 Schematic structural diagram of the storage mechanism in the present invention.

[0021] Figure 14 Schematic structural diagram of the handling mechanism in the present invention.

[0022] Figure 15 Schematic structural diagram of the handling mechanism from another perspective in the present invention.

[0023] Figure 16 is Figure 11 Enlarged view at A1 in

[0024] Figure 17 is Figure 15 Enlarged view at B1 in

[0025] Figure 18 Top view of the detection device in the present invention.

[0026] Figure 19 Front view of the first workbench in the present invention Figure 1 .

[0027] Figure 20 is Figure 19 Enlarged view at A in

[0028] Figure 21 Partial exploded view of the first detection mechanism in the present invention.

[0029] Figure 22 is Figure 21 Enlarged view at B in

[0030] Figure 23 This is the front view of the first and second workbenches in the present invention.

[0031] Figure 24 It is Figure 23 the enlarged view at position C in

[0032] Figure 25 It is Figure 23 the enlarged view at position D in

[0033] Figure 26 This is the partial front view of the first and second workbenches in the present invention.

[0034] Figure 27 This is the top view of the present invention. Detailed implementation manners

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0036] As Figures 1 to 27 shown, a fully automatic chip detection and sorting machine includes a base, a material storage mechanism, a handling mechanism, a material taking mechanism, a thimble mechanism, and a sorting stage. The sorting stage is arranged at one end of the base. The sorting stage is as Figures 1 to 8 shown, a multi-turn sorting stage that accommodates different types of crystal chips, including a support plate 1, a rotating module bottom plate 2, a lifting outer ring 3, a rotating ring 4, a clamping ring assembly, a driving component one, a driving component two, a transverse transmission component, and a longitudinal transmission component. The support plate 1 is connected to the transverse transmission component. The transverse transmission component includes a transverse bottom plate 5, a transverse driving member, more than two transverse slide rails 6, and transverse sliders 7. The lower end of the transverse bottom plate 5 is connected to the longitudinal moving component. The transverse slide rails 6 are relatively parallelly arranged on the upper end of the transverse bottom plate 5. The transverse sliders 7 connected to the support plate 1 are slidably connected to the transverse slide rails 6. The transverse driving member is arranged on one side of the transverse slide rails 6. The transverse driving member includes a transverse driving motor 8, a transverse lead screw 9 arranged along the direction of the transverse slide rails 6, a transverse lead screw nut (not marked in the figure), and a transverse support 10. The transverse driving motor 8 is arranged on the transverse bottom plate 5. The output end of the transverse driving motor 8 is connected to one end of the transverse lead screw 9. The other end of the transverse lead screw 9 is connected to the transverse support 10. The transverse lead screw nut connected to the support plate 1 is sleeved on the transverse lead screw 9. Under the action of the transverse driving motor 8, the screw connection between the transverse lead screw 9 and the transverse lead screw nut can be made to cooperate, thereby driving the support plate 1 to move along the transverse slide rails 6 in the X-axis direction, so as to adjust the transverse movement distance of the sorting stage.

[0037] As Figure 2As shown in the figure, the transverse transmission assembly is arranged above the longitudinal transmission assembly. The longitudinal transmission assembly includes a longitudinal bottom plate 11, a longitudinal driving member, more than two longitudinal sliding rails 12 and longitudinal sliders 13. The lower end of the longitudinal bottom plate 11 is connected to the base z1. The longitudinal sliding rails 12 are arranged relatively parallel to the upper end of the longitudinal bottom plate 11. The longitudinal sliders 13 connected to the transverse bottom plate 5 are slidably connected to the longitudinal sliding rails 12. The longitudinal driving member is arranged on one side of the longitudinal sliding rails 12. The longitudinal driving member includes a longitudinal driving motor 14, a longitudinal lead screw 15 arranged along the direction of the longitudinal sliding rails 12, a longitudinal lead screw nut (not marked in the figure) and a longitudinal support 16. The longitudinal driving motor 14 is arranged on the longitudinal bottom plate 11. The output end of the longitudinal driving motor 14 is connected to one end of the longitudinal lead screw 15. The other end of the longitudinal lead screw 15 is rotatably connected to the longitudinal support 16. The longitudinal lead screw nut connected to the transverse bottom plate 5 is sleeved on the longitudinal lead screw 15. Under the action of the longitudinal driving motor 14, the spiral connection and cooperation between the longitudinal lead screw 15 and the longitudinal lead screw nut can be realized, so as to drive the support plate 1 to move along the longitudinal sliding rails 12 in the Y-axis direction, thereby adjusting the longitudinal movement distance of the sorting platform.

[0038] As Figures 3 - 4 shown in the figure, the first driving assembly arranged on the rotating module bottom plate 2 is connected to the lifting outer ring 3 arranged outside the rotating ring 4 and drives the lifting outer ring 3 to move relative to the rotating module bottom plate 2 in the vertical direction. The first driving assembly includes a first driving motor 17, a first motor frame 18, a first transmission belt 19 and more than two pulley groups distributed in a circular pattern on the rotating module bottom plate 2. The first motor frame 17 is connected to the rotating module bottom plate 2. The first driving motor 17 is connected to the first motor frame 18. The pulley group includes a belt pulley 20, a belt pulley seat 21 and two pulleys 22, a pulley seat (not marked in the figure). A first lead screw 23 is arranged on the belt pulley seat 21 arranged on the rotating module bottom plate 2. The belt pulley 20 arranged on the belt pulley seat 21 is sleeved on the first lead screw 23 and is in spiral connection with the first lead screw 23. The first lead screw 23 is connected to the bottom end of the lifting outer ring 3 through a first connecting part (not marked in the figure). The pulley 22 is arranged on the pulley seat. The first transmission belt 19 is sequentially wound around the first driving wheel 24 at the output end of the first driving motor, the first guiding wheel 25 arranged on the first motor frame, the pulley 22 and the belt pulley 20, so that the first driving assembly can drive the first driving wheel 24 to rotate in different directions. The first driving wheel 24 drives the guiding wheel 25, the pulley 20 and the belt pulley 20 to rotate. The pulley 22 is rotatably connected to the lead screw 23. When the pulley 22 rotates, it drives the lifting outer ring 3 on the lead screw to move up and down, so as to realize the lifting of the lifting outer ring 3 and control the lifting height of the lifting outer ring 3; As Figures 4 - 5As shown in the figure, there are more than two clamping and limiting components provided on the lifting outer ring 3. The clamping and limiting components include two first fixed shafts 26 and two first rollers 27. One end of the first fixed shaft 26 is connected to the lifting outer ring 3, and the other end of the first fixed shaft 26 is arranged radially from the outside to the inside of the lifting outer ring 3. The first roller 27 is connected to the other end of the first fixed shaft 26. In this way, during the lifting process of the lifting outer ring 3, the rotating support component can be clamped by the clamping and limiting components and lifted synchronously with the lifting outer ring 3.

[0039] As Figure 1 , 4 shown in the figure, the rotating module bottom plate 2 is connected to the support plate 1. The second driving component arranged on the support plate 1 is connected to the rotating ring 4 arranged in the middle of the support plate 1. The rotating ring 4 is connected to the rotating support component through the lifting bottom plate 28. The clamping ring component arranged above the rotating ring 4 is connected to the lifting outer ring 3 through the rotating support component. The rotating support component includes a rotating support disk 29 and jacking support columns 30 distributed circumferentially on the rotating support disk 29. The thickness of the rotating support disk 29 matches the distance between the first rollers 27. The rotating support disk 29 is provided with a second connecting part 31 matching the jacking support columns 30. The second connecting part 31 protrudes inward in the radial direction. One end of the jacking support column 30 is connected to the second connecting part 31. Thus, the rotating support disk 29 can be limited by the clamping and limiting components, and then the rotating support disk 29 is driven to lift. Since the clamping ring component is connected to the rotating support disk 29 through the jacking support columns 30, the clamping ring component is driven to lift synchronously; As Figures 4 - 6 shown in the figure, the second driving component includes a second driving motor 32, a second motor frame 33, a second transmission belt 34 and a second guide wheel 35 arranged on the second motor frame 33. The second motor frame 33 is connected to the support plate 1. The second driving motor 32 is connected to the second motor frame 33. A second driving wheel 36 is provided at the output end of the second driving motor 32. The second transmission belt 34 is sequentially wound around the second driving wheel 36, the second guide wheel 35 and the lower end of the rotating ring 4. The upper end of the rotating ring 4 is connected to the lower end of the lifting bottom plate 28. A second groove (not marked in the figure) matching the second connecting part 31 is provided on the outside of the lifting bottom plate 28. During the lifting process of the rotating support disk 29, the connecting part 31 is located in the second groove. The upper end of the lifting bottom plate 28 is connected to a first tensioning ring 37 and a second tensioning ring 38. The second tensioning ring 38 is located outside the first tensioning ring 37. In this way, the rotating ring 4 can be driven to rotate by the second driving component, and then the lifting bottom plate 28 is driven to rotate. Since the second groove of the lifting bottom plate 28 is clamped with the second connecting part 31 of the rotating support disk 29, the rotating support disk 29 is driven to rotate, and finally the clamping ring component is driven to rotate.

[0040] As Figures 3 - 4As shown, notches are provided on opposite sides of the clamping ring assembly, and the notches communicate with the partition layer provided inside the clamping ring assembly. In this embodiment, a limiting post is provided at one notch of the clamping ring assembly. After the iron ring enters the partition layer of the clamping ring assembly, the iron ring can be limited by both sides of the partition layer and the limiting post at one notch of the clamping ring assembly, so as to ensure that the iron ring is coaxially arranged with the tensioning ring after entering the partition layer of the clamping ring assembly; the lower end of the bottom ring 39 is connected to the other end of the lifting support column 30, and the upper end of the bottom ring 39 is connected to the clamping ring assembly. The clamping ring assembly includes a clamping ring assembly one and a clamping ring assembly two. The notches include a notch one and a notch two, and the partition layer includes a partition layer one and a partition layer two. In one embodiment, the clamping ring assembly two is detachably arranged above the bottom ring 39. In another embodiment, the clamping ring assembly one is detachably arranged above the bottom ring 39. In still another embodiment, the clamping ring assembly one is detachably arranged above the clamping ring assembly two, as Figure 3 shown, the clamping ring assembly two includes two clamping rings two 40 and a pressing ring two 41. The clamping rings two 40 are oppositely arranged at the upper end of the bottom ring 39. The upper end surface of the clamping ring two 40 protrudes upward to form a step portion two 401. The pressing ring two 41 is detachably arranged at the upper end of the clamping ring two 40 and abuts against the step portion two 401. A notch two is formed between the two clamping rings two 40. A partition layer two is formed between the clamping ring two 40, the pressing ring two 41, the step portion two 401 and the bottom ring 39. The diameter of the tensioning ring two 38 is smaller than the diameter of the partition layer two. The diameter of the tensioning ring two 38 matches the diameter of the bottom ring 39; as Figure 7 、 8As shown in the figure, the first clamping ring assembly includes two first clamping rings 42 and a first pressing ring 43. The first clamping rings 42 are oppositely arranged at the upper end of the bottom ring 39. The upper end surface of the first clamping ring 42 is convexly provided to form a first step portion 421. The first pressing ring 43 is detachably arranged at the upper end of the first clamping ring 42 and abuts against the first step portion 421. A first notch is formed between the two first clamping rings 42. A first interlayer is formed among the first clamping ring 42, the first pressing ring 43, the first step portion 421 and the bottom ring 39. The diameter of the first tensioning ring 37 is smaller than that of the first interlayer. In one embodiment, the second clamping ring assembly can be detachably installed on the bottom ring 39, so that the 12-inch iron ring can be transferred to the second clamping ring assembly, and then the chips on the 12-inch iron ring can be sorted. When it is necessary to sort different types of chips, the second clamping ring assembly can be disassembled, and then the first clamping ring assembly can be installed on the bottom ring 39, so that iron rings of other different sizes (such as 8 inches) can be transferred to the first clamping ring assembly to realize other different types of chips. The bottom ring is provided with guide posts 44 that match the first clamping ring assembly and the second clamping ring assembly. The first clamping ring assembly and the second clamping ring assembly are respectively provided with guide holes that match the guide posts, so as to play a guiding role in the installation of the first clamping ring assembly and the second clamping ring assembly. And a swing block (not marked in the figure) is provided on the guide post, which is convenient to press the first clamping ring assembly or the second clamping ring assembly during the descending process through the swing block. The alternating disassembly and assembly process of the first clamping ring assembly and the second clamping ring assembly can be realized by the mechanical arm grasping. The mechanical arm is a prior art and will not be elaborated here. In this way, when transferring iron rings of different sizes, the first clamping ring assembly or the second clamping ring assembly can be installed on the bottom ring according to the iron rings of different sizes, so that the iron rings of different sizes enter the interlayers of different clamping ring assemblies from the notch. During this process, the first tensioning ring or the second tensioning ring is flush with the upper end surface of the bottom ring, so that when the first clamping ring assembly or the second clamping ring assembly descends, the iron ring can be driven to descend synchronously, and the blue film on the iron ring abuts against the first tensioning ring or the second tensioning ring, so that a height difference is formed between the first clamping ring assembly and the first tensioning ring or between the second clamping ring assembly and the second tensioning ring, and then the blue film is tensioned by the first tensioning ring or the second tensioning ring, so as to facilitate the adsorption of the chips on the blue film.

[0041] In this embodiment, through holes are provided on the transverse bottom plate 5, the longitudinal bottom plate 11, the support plate 1, the rotating module bottom plate 2 and the lifting bottom plate 28.

[0042] Such as Figure 11As shown in the figure, the storage mechanism z2 disposed opposite to the sorting stage z5 penetrates through the other end of the base z1. The storage mechanism z2 includes a third driving device, a base z1, and two or more storage bins arranged side by side on the base z1. The third driving device penetrating through the base z1 is connected to the base z1, and one side of the third driving device is connected to the base z1. The third driving device includes a driving motor z6 mounted on a motor frame three, a third transmission device, a T-shaped bracket z7, and a third connecting plate z9. The motor frame three is connected to the T-shaped bracket z7. The output end of the driving motor z6 is connected to the third transmission device disposed on one side of the T-shaped bracket z7. The other side of the T-shaped bracket z7 is connected to the base z1. The third transmission device is connected to the third connecting plate z9. Sliders three z8 are provided on both sides of the third transmission device on the T-shaped bracket z7. The sliders three z8 are slidably connected in a matching manner with the third slide rails z10 provided on both sides of the third connecting plate z9. The third connecting plate z9 is connected to the base z1. In this embodiment, the third transmission device is a transmission connection between a lead screw and a lead screw nut, which is a prior art and will not be elaborated here. Thus, the third transmission device can be driven by the motor frame three, and further, the third slide rails z10 provided on the third connecting plate z9 can slide up and down relative to the sliders three z8, thereby driving the storage bins provided on the base z1 to perform a lifting action to adjust the height. The storage bin includes a bin body z11. The bin body z11 and the base z1 form a third storage cavity. An outlet three is formed on one side of the third storage cavity. Two or more convex parts three are provided on the inner side wall of the bin body z11 adjacent to the outlet three. A placement layer matching the iron ring z12 is formed between the convex parts three. A handle is provided on the top of the bin body z11. In this way, iron rings z12 of the same size can be stacked and placed in the same bin body z11, while iron rings z12 of different sizes can be placed in different bin bodies z11, thereby meeting the requirements of chip sorting operations.

[0043] The material taking mechanism is arranged on the sorting platform z5 and located between the sorting platform z5 and the storage mechanism z2. The material taking mechanism includes a driving module five, a connecting rod five z13, a connecting seat five z15, a driving device five and a gripper z14. The driving module five is connected to the support plate 11 of the sorting platform z5. One end of the connecting rod five z13 perpendicular to the driving module five is connected to the output end of the driving module five, and the other end of the connecting rod five z13 is connected to the connecting seat five z15. The driving device five includes a slider five and a driving cylinder five. The slider five arranged on one side of the driving cylinder five is slidably connected with a slide rail five arranged on the connecting seat five z15 in the vertical direction. The output end of the driving cylinder five is connected to one end of the connecting seat five z15, and the bottom end of the driving cylinder five is connected to the gripper z14 arranged perpendicular to the connecting rod five z13. A magnetic suction head capable of adsorbing iron rings is arranged inside the gripper z14, so as to adsorb the iron rings. In this embodiment, the driving module five is a motor driving the slider on the sliding module, and the output end of the driving module five is the movable slider on the sliding module. In this way, the connecting rod five z13 can be driven by the driving module five to move along the X-axis direction, and then the gripper z14 can be driven by the driving device five to move up and down in the Z-axis direction, so as to adjust the position of the gripper z14, so that the gripper z14 can accurately pick up the iron rings z12 in the storage bin.

[0044] Such as Figures 12 - 13As shown in the figure, the bottom of the handling mechanism z3 arranged above the sorting stage z5 is connected to the base z1. The handling mechanism z3 includes a crossbeam frame four z16 located above the sorting stage, a handling device, and two detection devices four. The crossbeam frame four z16 is connected to one end of the base far from the storage mechanism. The handling device is arranged in the middle of the crossbeam frame four z16. The detection devices four are symmetrically arranged on both sides of the crossbeam frame four z16 with respect to the crossbeam frame four z16. The handling device includes a rotating arm z17, a connecting ring four, a motor frame four, and a driving motor four. The motor frame four is connected to the bottom of the crossbeam frame four z16. The driving motor four is connected to the motor frame four. The output end of the driving motor four is connected to the middle of the rotating arm z17 through the connecting ring four. Removably connected connecting arms z18 are respectively arranged at both ends of the rotating arm z17. Suction nozzles are arranged on the connecting arms z18. The detection device includes a driving module four, a fixed seat four, a connecting seat four z19, and a camera. The fixed seat four is connected to the top of the crossbeam frame four z16. The driving module four is connected to the fixed seat four. The output end of the driving module four is connected to the connecting seat four z19. The camera is connected to the connecting seat four z19. In this embodiment, the driving module four is a sliding module in which a motor drives a slider to slide in the vertical direction, that is, the connecting seat four z19 is connected to the slider. A secondary pressing device z06 is arranged below the detection device. The secondary pressing device includes a motor frame five z21, a driving motor five z20, and a transmission device five. The motor frame five z21 is connected to the side of the crossbeam frame four z16. The output end of the driving motor five z20 connected to the motor frame five z21 is connected to the transmission device five and drives the output end of the transmission device five to move in the vertical direction and then abut against the connecting arm z18. In this embodiment, the transmission device five is a linkage mechanism of a motor driving a cam and a sliding rod and a slider, that is, after the output end of the transmission device five is the cam abutting against the sliding rod, the slider connected to the sliding rod linearly moves on the corresponding slide rail, so as to abut against the connecting arm z18. In this way, after driving the camera to move in the vertical direction through the driving module four and detecting the chips on the sorting stage, the driving motor four in the handling device drives the rotating arm z17 to rotate, so that the suction nozzles on the connecting arms z18 are matched with the positions of the chips. Then, the transmission device five in the secondary pressing device abuts against the connecting arm z18. In this embodiment, after the output end of the transmission device five abuts against the connecting arm z18, the connecting arm z18 is pressed down by a small distance such as 1 - 2 mm, and further the suction nozzles are pressed down to abut against the chips on the sorting stage, thereby realizing the adsorption of the chips.

[0045] As Figure 9 and 14As shown, the ejector mechanism z4 penetrates through the base z1 from below the sorting carrier z5 and is embedded in the through-hole inside the sorting carrier z5. After adjusting the height in the vertical direction, the storage mechanism z2 grabs the material in the storage mechanism z2 through the picking mechanism and moves it onto the sorting carrier z5. After adjusting the position of the material through the sorting carrier z5, the ejector mechanism z4 jacks up the material on the sorting carrier z5, so that the handling mechanism z3 adsorbs the jacked-up material and transports it to the detection equipment. The ejector mechanism z4 is arranged below the sorting carrier z5, as Figure 9As shown, the ejector mechanism z4 includes a fixed frame six z22, a connecting plate six z23, a secondary driving device, and an ejector part. The upper end of the fixed frame six z22 is inserted into the through hole and fixedly connected to the base z1. Two sliding rails six z25 are arranged on both sides of the lower end of the fixed frame six z22 and are slidably connected to the corresponding sliders six arranged on both sides of the lower end of the connecting plate six z23. The ejector part and the secondary driving device are arranged on the upper end of the connecting plate six z23. A driving cylinder six z24 is arranged on one side of the sliding rail six z25 at the lower end of the fixed frame six z22. One end of the driving cylinder six z24 is connected to the fixed frame six z22, and the output end of the driving cylinder six z24 is connected to the connecting plate six z23. Thus, through the driving cylinder six z24, the connecting plate six z23 and the fixed frame six z22 are slidably connected through the slider six and the sliding rail six z25. And since the fixed frame six z22 is fixed on the base z1, it can drive the ejector part arranged on the secondary driving device to realize preliminary lifting and height adjustment in the direction perpendicular to the base z1. In this embodiment, there are two sets of secondary driving devices. A sliding rail seven is arranged on the upper end of the connecting plate six z23. The sliding rail seven is provided with more than two slider groups matching the sliding rail seven. Different sliders in the slider group are respectively connected with a connecting rod seven z26 and a connecting block seven z28. The secondary driving devices are arranged side by side on one side of the upper end of the connecting plate six z23. The secondary driving device includes a driving motor seven z29 and a cam seven z27. The output end of the driving motor seven z29 is connected to the cam seven z27. The cam seven z27 respectively abuts against the runners seven arranged on the connecting rod seven z26 and the connecting block seven z28. One end of the connecting rod seven z26 away from the slider group is connected to the ejector part. The ejector part includes an ejector seat z30, an ejector push rod, an ejector cap, an ejector cap seat z31, and an ejector cylinder. One end of the ejector cylinder is connected to the connecting rod seven z26. The ejector cap seat z31 is connected to the other end of the ejector cylinder. One end of the ejector push rod is connected to the output end of the ejector cylinder passing through the ejector cap seat z31. The other end of the ejector push rod is connected to the ejector seat z30. The ejector seat z30 is provided with ejectors z32 arranged side by side. An air vent z33 is arranged on one side of the ejector. The air vent z33 runs through the inside of the ejector cap seat z31. The air vent z33 is connected to an external vacuum pumping device. The ejector cap wraps the ejector seat z30 and is connected to the ejector cap seat z31. An adsorption cavity is formed between the ejector cap and the ejector seat z30. The ejector cap is provided with adsorption holes and through holes matching the ejectors z32. In this way, the connecting rod seven z26 can be driven to move through the secondary driving device, and then the distance between the ejector part and the sorting stage z5 can be adjusted again. Thus, the ejector cylinder drives the ejector push rod, and then drives the ejector cap to abut against the blue film on the sorting stage z5, and realizes adsorption through the adsorption holes. Then, the ejectors on the ejector seat z30 pass through the through holes to lift the chips on the blue film.

[0046] As Figures 18 - 27As shown, the detection device includes a first working platform 1A and a second working platform. A receiving mechanism 10A, a first conveying mechanism 11A, and a first detection mechanism 12A are provided on the first working platform 1A. A second conveying mechanism 21A, a second detection mechanism 22A, a second sorting mechanism, a packing mechanism 25A, a labeling mechanism 23A, and a fourth conveying mechanism 24A are provided on the second working platform. A third conveying mechanism 13A is provided between the first working platform 1A and the second working platform. The method corresponding to the sorting machine of the present invention specifically includes: S01 Move up and down from the storage mechanism z2 to clamp the iron rings in the storage mechanism z2 through the material taking mechanism. S02 Place the clamped iron rings on the rotating table of the sorting table, and alternately place iron rings of different sizes through different notches on the rotating table. S03 The ejecting mechanism z4 moves to the corresponding position of the chip on the blue film and ejects the chip through the ejector pin. S04 The handling mechanism z3 drives the rotating arm z17 to rotate and drives the suction nozzle of the connecting arm z18 to rotate to the corresponding position of the chip. Then, it abuts against the connecting arm z18 through the transmission device in the auxiliary pressing device, so as to realize the downward pressure of the suction nozzle against the chip on the sorting table to adsorb the chip. Then, rotate the rotating arm z17 to rotate the adsorbed chip to the sorted carrier. The working principle of the present invention: The material taking mechanism grabs iron rings of different sizes in the storage mechanism, and then alternately transfers them to the sorting carrier table. After the position of the material is adjusted by the sorting carrier table, the ejector pin mechanism z4 jacks up the chip on the iron ring on the sorting carrier table z5. At the same time, the handling mechanism adsorbs the jacked-up chip on the sorting carrier table, and then transfers it to the detection device through the handling mechanism. Since the material taking mechanism can alternately transfer iron rings of different sizes to the sorting carrier table, the sorting carrier table can alternately sort different types of crystal chips on iron rings of different sizes, and transport the sorted crystal chips to the detection device, thereby improving the efficiency of the production process of different types of crystal chips. S1 Place the chip on the receiving mechanism 10A. S2 The third conveying mechanism 13A places the chip on the receiving mechanism 10A on the first conveying mechanism 11A. S3 The first conveying mechanism 11A moves the chip to the area of the first detection mechanism 12A. S4 The first detection mechanism 12A detects the bottom surface and side surface of the chip. S5 After the detection, the first detection mechanism 12A places the chip on the first conveying mechanism 11A, and the first conveying mechanism 11A moves the chip to the corresponding position of the third conveying mechanism 13A. The S6 first-third conveying mechanism 13A moves the chip to the first-second conveying mechanism 21A on the first-second platform; The S7 first-second conveying mechanism 21A moves the chip to the first-second detection mechanism 22A; The S8 first-second detection mechanism 22A detects the top surface of the chip; After the detection is completed, the first-second detection mechanism 22A places the chip on the first-second conveying mechanism 21A, and the first-second conveying mechanism 21A sorts the chip; After the chip is sorted into good products and defective products, the good products enter the packing mechanism 25A and the labeling mechanism 23A through the first-fourth conveying mechanism 24A.

[0047] With the above settings, a first-third conveying mechanism is provided between the first-first working platform and the first-second working platform. The chip can be moved from the first-first working platform to the first-second conveying platform through the first-third conveying mechanism, placed on the receiving mechanism, and wait for the first-third conveying mechanism to grab it. The first-third conveying mechanism places the chip on the first-first conveying mechanism, and the first-first conveying mechanism moves the chip to the area of the first-first detection mechanism. The bottom and side surfaces of the chip are detected by the first-first detection mechanism. After detecting one opposite side surface of the chip, the other two side surfaces are detected, and the five-sided detection of the chip is completed. Then the first-first conveying mechanism moves the chip to be detected to the corresponding position of the first-third conveying mechanism, waits for the first-third conveying mechanism to grab it, and then moves the chip to the first-second conveying mechanism. The first-second conveying mechanism moves the chip to the first-second detection mechanism, and the first-second detection mechanism detects the top surface of the chip. At this time, the six-sided detection of the chip is completed. After the six-sided detection of the chip is completed, the other two side surfaces can be detected by rotating after detecting one opposite side surface, so that the detection of five surfaces can be realized, and finally the top surface is detected, so that the detection of two side surfaces can be realized at one time, thereby improving the detection efficiency, and the detection of the six surfaces of the chip can improve the detection accuracy.

[0048] Such as Figures 18 - 19As shown in the figure, in step S2, the first three conveying mechanism 13A is provided with a first three-dimensional moving module. On both sides of the first three conveying mechanism 13A, there are respectively a first one conveying mechanism 11A. The first one conveying mechanism 11A includes a first one conveying module 111A and a first two conveying module 112A. When the first three conveying mechanism 13A places a chip on the first one conveying module, when the first one conveying module 111A moves to the first one detection mechanism 12A, the first three conveying mechanism 13A places another chip on the receiving mechanism 10A on the first two conveying module 112A and waits for the detection of the first one conveying module to be completed. Then, the first two conveying module conveys the chip to the first one detection mechanism 12A, and so on in a cycle. Define the length direction of the first one working platform 1A as the X-axis direction, the direction perpendicular to the X-axis direction on the horizontal plane as the Y-axis direction, and the direction perpendicular to the plane where the XY axes are located as the Z-axis direction. The first three conveying mechanism 13A is provided with a first three-dimensional moving module, and the first three-dimensional moving module drives the first three conveying mechanism 13A to move along the XYZ axes, so as to realize the clamping of the chip by the first three conveying mechanism 13A and be able to move from the first one working platform 1A to the second one working platform; The first one conveying mechanism 11A includes a first one conveying module 111A and a first two conveying module 112A. Chips of different sizes can be placed on the first one conveying module 111A and the first two conveying module 112A. When the first three conveying mechanism 13A places a chip on the first one conveying module 111A, when the first one conveying module 111A moves to the first one detection mechanism 12A and waits for detection, the first three conveying mechanism 13A can place another chip on the first two conveying module 112A. When it has been placed on the first two conveying module 112A, since there are first one conveying mechanisms 11A on both sides of the first three conveying mechanism 13A, the first three conveying mechanism 13A can place chips on another first one conveying mechanism 11A; And when the first one conveying module 111A finishes detection, the first one conveying module 111A moves to the corresponding position of the first three conveying mechanism 13A, and the first two conveying module 112A is conveyed to the corresponding position of the first one detection mechanism 12A and waits for detection, and so on in a cycle; The first one conveying module 111A includes a first one conveying track. On the first one conveying track, there are a first one conveying motor and a first one conveying slider. The first one conveying motor drives the first one conveying slider to move along the first one conveying track. The first one conveying track is arranged along the length direction of the first one working platform 1A. The first one conveying motor drives the first one conveying slider to move along the first one conveying track, so that the chip on the first one conveying module 111A can move from the corresponding position of the first three conveying mechanism 13A to the corresponding position of the first one detection mechanism 12A. The same applies to the first two conveying module 112A.

[0049] As shown Figures 20 - 21 in FIG. Figures 20 - 21 , in step S4, the first detection mechanism 12A includes a first detection gripper, a bottom surface detection mechanism 121A, a first side surface detection mechanism 122A, and a second side surface detection mechanism 123A. The first detection gripper is provided with a driving motor and a second three-dimensional movement module. Step S4 specifically includes steps S41 - S43. In step S41, the first detection gripper grabs the chip on the first conveyor mechanism 11A, and then moves to the bottom surface detection mechanism 121A first to detect the bottom surface of the chip; in S42, then the first detection adsorption device continues to move to the first side surface detection mechanism 122A to detect the two side surfaces of the chip; in S43, the first detection gripper rotates the chip 180 degrees and moves to the second side surface detection mechanism 123A to detect the other two side surfaces of the chip. The first detection gripper is provided with a driving motor and a second three-dimensional movement module. The second three-dimensional movement module drives the first detection adsorption device to move along the XYZ axes. The driving motor can drive the first detection adsorption device to rotate along the horizontal plane. Thus, after the first detection gripper grabs the chip on the first conveyor mechanism 11A, it moves to the bottom surface detection mechanism 121A first to detect the bottom surface of the chip. Then the first detection adsorption device continues to move to the first side surface detection mechanism 122A to detect the two side surfaces of the chip. The first detection adsorption device rotates the chip 180 degrees and moves to the second side surface detection mechanism 123A to detect the other two side surfaces of the chip.

[0050] The bottom surface detection mechanism and the first side surface detection mechanism are respectively arranged on the rack in a lifting manner through a first lifting mechanism 1210A and a second transverse movement mechanism 1220A. The first lifting mechanism realizes the lifting operation by the setting mode of a driving motor, a slide rail, and a slider. The second transverse movement mechanism realizes the transverse movement along the extending direction of the two first side surface detection mechanisms by the setting mode of a driving motor, a slide rail, and a slider. The bottom surface detection mechanism 121A is located on one side of the first side surface detection mechanism 122A. The first side surface detection mechanism 122A includes two first side surface detection components 1221A which are arranged oppositely. On the other side of the first side surface detection mechanism 122A, there is a second side surface detection mechanism 123A which includes two second side surface detection components 1231A arranged oppositely. The bottom surface detection mechanism 121A, the first side surface detection mechanism 122A, and the second side surface detection mechanism 123A are arranged in adjacent positions in sequence, and the components of the side surface detection mechanism are arranged oppositely, making the layout of the entire detection device more compact. After the first detection gripper grabs the chip, the movement path is optimized, and only short-distance movement between adjacent detection mechanisms is required.

[0051] As Figures 22 - 26As shown, the first and second conveying mechanism 21A includes a first and third conveying module and a first and fourth conveying module. When the first and third conveying mechanism 13A places a chip on the first and third conveying module, when the first and third conveying module moves to the first and second detection mechanism 22A, the first and third conveying mechanism 13A places another chip from the first and first conveying mechanism 11A on the first and fourth conveying module, waits for the detection of the first and third conveying module to be completed, and then the first and third conveying module conveys the chip to the first and second detection mechanism 22A, and so on in a cycle. When the first and third conveying mechanism 13A places a chip on the first and third conveying module, when the first and third conveying module moves to the first and second detection mechanism 22A and waits for detection, the first and third conveying mechanism 13A can place another chip on the first and fourth conveying module. The two conveying modules can process different chips simultaneously. One module is in the detection state, and the other module is in the state of waiting for detection or receiving a new chip. This parallel processing method greatly improves the detection efficiency and reduces the idle time of the equipment.

[0052] The first and third conveying module includes a first and third conveying track. A first and third conveying motor and a first and third conveying slider are arranged on the first and third conveying track. The first and third conveying motor drives the first and third conveying slider to move along the first and third conveying track. The first and third conveying track is arranged along the length direction of the first and second working platform. The first and third conveying motor drives the first and third conveying slider to move along the first and third conveying track, so that the chip on the first and third conveying module can move from the corresponding position of the first and third conveying mechanism 13A to the corresponding position of the first and second detection mechanism 22A. The first and fourth conveying module is the same.

[0053] In step S8, the first and second detection mechanism 22A is provided with a third three-dimensional moving module and a top surface detection mechanism 221A. In step S81, the top surface detection mechanism 221A detects the chip on the first and second conveying mechanism 21A. The third three-dimensional moving module drives the top surface detection mechanism 221A to move along the XYZ axes, so that the first and second detection mechanism 22A can detect the chip on the first conveying mechanism.

[0054] In step S9, the first and second conveying mechanism 21A further includes a first and second conveying gripper 212A. The first and second conveying gripper 212A is provided with a fourth three-dimensional movement module. On one side of the first and second conveying gripper 212A, a first and third detection mechanism 211A is further provided. Step S9 includes steps S91-S92; in step S91, the first and third detection mechanism 211A first marks and identifies the chips on the first and third conveying modules as good products and defective products according to the detection results in steps S4 and S8; in step S92, a sorting tray 26A is provided on the first and second workbench. The sorting tray 26A is provided with a good product area and a defective product area. The first and second conveying gripper 212A places the chips on the sorting tray 26A according to good products and defective products. The fourth three-dimensional movement module drives the first and second conveying gripper 212A to move along the XYZ axes, so that the first and third detection mechanism 211A can move along the XYZ axes. When the first and second detection mechanism 22A finishes detecting the top surface of the chip, the first and second conveying mechanism 21A moves the chip to the corresponding area of the first and third detection mechanism 211A. The first and third detection mechanism 211A first marks and identifies the chips on the first and third conveying modules as good products and defective products according to the detection results in steps S4 and S8; then a sorting tray 26A is provided on the first and second workbench. The sorting tray 26A is provided with a good product area and a defective product area. The first and second conveying gripper 212A places the chips on the sorting tray 26A according to good products and defective products.

[0055] In step S10, the first and fourth conveying mechanism 24A is provided with a fifth three-dimensional movement module. The first and fourth conveying mechanism 24A includes two first and fourth conveying grippers. The first and fourth conveying grippers can clamp the chips, so that the chips enter the packing mechanism 25A. Then the chips pass through the labeling mechanism 23A. The fifth three-dimensional movement module drives the first and fourth conveying mechanism 24A to move along the XYZ axes, so that the two first and fourth conveying grippers can move along the XYZ axes, enabling the chips to enter the labeling mechanism 23A and the packing mechanism 25A.

[0056] In this embodiment, three-dimensional movement modules such as the first three-dimensional movement module, the second three-dimensional movement module, the third three-dimensional movement module, the fourth three-dimensional movement module, and the fifth three-dimensional movement module all achieve movement on the XYZ axes by means of a driving motor and a slide rail and a slider. Then the bottom surface detection mechanism, the first side surface detection mechanism, the top surface detection mechanism, and the first and second detection mechanisms are cameras. After the cameras obtain the actual pictures of the chips, the actual pictures are compared with the preset standard pictures to determine whether they are within the preset similarity range, so as to determine whether they meet the requirements. If they meet the requirements, they are qualified products; otherwise, they are unqualified products.

Claims

1. An automatic chip detection and sorting machine, characterized in that: It includes a base, a material storage mechanism, a handling mechanism, a material picking mechanism, a thimble mechanism and a sorting stage. The sorting stage is arranged at one end of the base. The material storage mechanism arranged opposite to the sorting stage penetrates through the other end of the base. The material picking mechanism is arranged on the sorting stage and located between the sorting stage and the material storage mechanism. The bottom of the handling mechanism arranged above the sorting stage is connected to the base. The thimble mechanism penetrates through the base from below the sorting stage and is embedded in the through hole inside the sorting stage. After the height of the material storage mechanism is adjusted in the vertical direction, the material in the material storage mechanism is grabbed by the material picking mechanism and moved to the sorting stage. After the position of the material is adjusted by the sorting stage, the material on the sorting stage is lifted by the thimble mechanism, so that the handling mechanism adsorbs the lifted material and transports it to the detection device. The detection device includes a first working platform and a second working platform. A receiving mechanism, a first conveying mechanism and a first detection mechanism are arranged on the first working platform. A second conveying mechanism, a second detection mechanism, a second sorting mechanism and a fourth conveying mechanism are arranged on the second working platform. A third conveying mechanism is arranged between the first working platform and the second working platform.

2. The fully automatic chip detection and sorting machine according to claim 1, characterized in that: The material storage mechanism includes a third driving device, a base and two or more material storage bins arranged side by side on the base. The third driving device penetrating through the base is connected to the base and one side of the third driving device is connected to the base. The third driving device includes a driving motor three installed on a motor frame three, a transmission device three, a T-shaped bracket and a connecting plate three. The motor frame three is connected to the T-shaped bracket. The output end of the driving motor three is connected to the transmission device three arranged on one side of the T-shaped bracket. The other side of the T-shaped bracket is connected to the base. The transmission device three is connected to the connecting plate three. Sliders three are arranged on both sides of the transmission device three on the T-shaped bracket. The sliders three are slidably connected in a matching manner with the slide rails three arranged on both sides of the connecting plate three. The connecting plate three is connected to the base. The material storage bin includes a bin body. The bin body and the base form a third material storage cavity. An outlet three is formed on one side of the third material storage cavity. Two or more convex parts three are arranged on the inner side wall of the bin body adjacent to the outlet three. A placing layer matching the iron ring is formed between the convex parts three. A handle is arranged on the top of the bin body.

3. The fully automatic chip detection and sorting machine according to claim 1, characterized in that: The material storage bin includes a bin body. The bin body and the base form a third material storage cavity. An outlet three is formed on one side of the third material storage cavity. Two or more convex parts three are arranged on the inner side wall of the bin body adjacent to the outlet three. A placing layer matching the iron ring is formed between the convex parts three. A handle is arranged on the top of the bin body.

4. The fully automatic chip detection and sorting machine according to claim 1, wherein: The handling mechanism includes a cross beam frame four located above the sorting stage, a handling device and two detection devices four. The cross beam frame four is connected to the end of the base far from the material storage mechanism. The handling device is arranged in the middle of the cross beam frame four. The detection devices four are symmetrically arranged on both sides of the cross beam frame four with respect to the cross beam frame four. The handling device includes a rotating arm, a connecting ring four, a motor frame four and a driving motor four. The motor frame four is connected to the bottom of the cross beam frame four. The driving motor four is connected to the motor frame four. The output end of the driving motor four is connected to the middle of the rotating arm through the connecting ring four. Detachable connecting arms are respectively arranged at both ends of the rotating arm. Suction nozzles are arranged on the connecting arms. The detection device includes a fourth driving module, a fourth fixing seat, a fourth connecting seat, and a camera. The fourth fixing seat is connected to the top end of the fourth crossbeam frame. The fourth driving module is connected to the fourth fixing seat. The output end of the fourth driving module is connected to the fourth connecting seat, and the camera is connected to the fourth connecting seat. A secondary pressing device is provided below the detection device. The secondary pressing device includes a fifth motor frame, a fifth driving motor, and a fifth transmission device. The fifth motor frame is connected to the side of the fourth crossbeam frame. The output end of the fifth driving motor connected to the fifth motor frame is connected to the fifth transmission device and drives the output end of the fifth transmission device to move in the vertical direction and abut against the connecting arm.

5. The fully automatic chip detection and sorting machine according to claim 1, wherein: The material taking mechanism includes a fifth driving module, a fifth connecting rod, a fifth connecting seat, a fifth driving device, and a gripper. The fifth driving module is connected to the bottom plate of the sorting stage. One end of the fifth connecting rod perpendicular to the fifth driving module is connected to the output end of the fifth driving module, and the other end of the fifth connecting rod is connected to the fifth connecting seat. The fifth driving device includes a fifth slider and a fifth driving cylinder. The fifth slider arranged on one side of the fifth driving cylinder is slidably connected in a matching manner with a fifth slide rail arranged on the fifth connecting seat in the vertical direction. The output end of the fifth driving cylinder is connected to one end of the fifth connecting seat, and the bottom end of the fifth driving cylinder is connected to the gripper arranged perpendicular to the fifth connecting rod.

6. The fully automatic chip detection and sorting machine according to claim 1, characterized in that: The thimble mechanism is arranged below the sorting stage. The thimble mechanism includes a sixth fixing frame, a sixth connecting plate, a secondary driving device, and a thimble part. The upper end of the sixth fixing frame is connected to the base. Two relatively arranged sixth slide rails on one side of the lower end of the sixth fixing frame are slidably connected with corresponding sixth sliders arranged on one side of the lower end of the sixth connecting plate. The thimble part and the secondary driving device are arranged on the upper end of the sixth connecting plate. A sixth driving cylinder is arranged on one side of the sixth slide rail at the lower end of the sixth fixing frame. One end of the sixth driving cylinder is connected to the sixth fixing frame, and the output end of the sixth driving cylinder is connected to the sixth connecting plate. The sorting stage includes a support plate, a rotating module bottom plate, a lifting outer ring, a rotating ring, a clamping ring assembly, a first driving component, a second driving component, a transverse transmission component, and a longitudinal transmission component. The transverse transmission component is arranged above the longitudinal transmission component. The support plate is connected to the transverse transmission component. The rotating module bottom plate is connected to the support plate. The second driving component arranged on the support plate is connected to the rotating ring arranged in the middle of the support plate. The rotating ring is connected to the rotating support component through a lifting bottom plate. The clamping ring assembly arranged above the rotating ring is connected to the lifting outer ring through the rotating support component. The first driving component arranged on the rotating module bottom plate is connected to the lifting outer ring arranged outside the rotating ring and drives the lifting outer ring to move relative to the rotating module bottom plate in the vertical direction. Notches are provided on opposite sides of the clamping ring assembly, and the notches communicate with a partition layer arranged inside the clamping ring assembly.

7. The fully automatic chip detection and sorting machine according to claim 1, wherein: The first three conveying mechanism is provided with a first three-dimensional moving module, and first conveying mechanisms are respectively arranged on both sides of the first three conveying mechanism. The first conveying mechanism includes a first conveying module and a second conveying module. When the first three conveying mechanism places the chip on the first conveying module, when the first conveying module moves to the first detection mechanism, the first three conveying mechanism places another chip on the receiving mechanism on the second conveying module, waits for the detection of the first conveying module to be completed, and then the second conveying module conveys the chip to the first detection mechanism, and so on in a cycle.

8. The fully automatic chip detection and sorting machine according to claim 1, wherein: The first conveying module includes a first conveying track, on which a first conveying motor and a first conveying slider are arranged, and the first conveying motor drives the first conveying slider to move along the first conveying track.

9. The fully automatic chip detection and sorting machine according to claim 1, characterized in that: The first detection mechanism includes a first detection adsorption device, a bottom surface detection mechanism, a first side surface detection mechanism and a second side surface detection mechanism. The first detection adsorption device is provided with a driving motor, a second three-dimensional moving module and a first detection suction nozzle. The first detection suction nozzle is arranged on the bracket of the first detection mechanism through the second three moving module, and the first detection suction nozzle rotates in the plane where the first detection suction nozzle is located through the driving motor.

10. A fully automatic chip detection and sorting machine according to claim 1, characterized in that: The bottom surface detection mechanism and the first side surface detection mechanism are respectively arranged on the frame in a lifting manner through a first lifting mechanism and a second lifting mechanism. The bottom surface detection mechanism is located on one side of the first side surface detection mechanism. The first side surface detection mechanism includes two first side surface detection components which are arranged oppositely. A second side surface detection mechanism is arranged on the other side of the first side surface detection mechanism. The second side surface detection mechanism includes two second side surface detection components which are arranged oppositely.

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