Method and system for mass transfer of electronic components

Abstract

A mass transfer method of electronic components comprises the steps that an annular array terminal is driven to rotate step by step at a preset angle to periodically provide a transfer period, the annular array terminal is provided with a plurality of array areas distributed on the periphery of the annular array terminal, each array area is provided with a plurality of material containing holes, and in the transfer period, the material containing holes are distributed in the array areas; the array areas located right above serve as an assembly input area, and the array areas located right below serve as an assembly output area; a feeding head is driven to move downwards to the assembly input area in the transferring period so that the multiple electronic assemblies can be correspondingly filled into the multiple material containing holes; and driving the annular array wharf to downwards release the plurality of electronic components in the plurality of material accommodating holes of the component output area, so that the plurality of electronic components correspondingly abut against a welding flux on a plurality of welding pads of a corresponding substrate.

Description

Technical Field

[0001] The present invention relates to a method for transferring electronic components, and more particularly to a method and system for massively transferring electronic components. Background Art

[0002] As the functions of electronic products continue to improve, the component bonding of many circuit boards involves transferring a large number of electronic components onto the circuit boards.

[0003] In general, in the process of transferring electronic components, solders such as solder balls are disposed on the connection pads of the circuit board as the transfer target, and then the electronic components are disposed on the solders and soldered, so that the electronic components are transferred onto the transfer target and fixedly combined with the transfer target.

[0004] However, since traditional electronic component transfer usually uses the pick and place method, the transfer efficiency is poor, and thus it is gradually unable to meet the requirements of transferring a large number of electronic components involved in today's semiconductor advanced packaging processes.

[0005] To solve the above problems, there is an urgent need in the art for a novel technical solution to quickly and accurately transfer a large number of electronic components onto a substrate. Summary of the Invention

[0006] One object of the present invention is to provide a method for massively transferring electronic components, which can periodically and simultaneously perform an electronic component alignment operation and an electronic component batch implantation operation through a stepping vertical rotation mechanism of an annular alignment device, so as to efficiently and successively bond a plurality of electronic components to corresponding pads of a substrate.

[0007] Another object of the present invention is to provide a method for massively transferring electronic components, which can accelerate the alignment process of the plurality of electronic components through a pneumatic operation.

[0008] Another object of the present invention is to provide a method for massively transferring electronic components, which can accelerate the alignment process of the plurality of electronic components through a vibration operation.

[0009] Another object of the present invention is to provide a method for massively transferring electronic components, which can automatically ensure the completion degree of the electronic component alignment operation through a photography device and a pneumatic mechanism and can send the redundant electronic components back to the material storage cavity.

[0010] Another object of the present invention is to provide a system for massively transferring electronic components, which can greatly improve the transfer efficiency and the required accuracy through the above method.

[0011] To achieve the above object, a method for massively transferring electronic components is proposed, which is implemented by a control circuit and includes:

[0012] Drive an annular alignment dock to gradually rotate at a predetermined angle to periodically provide a transfer period, wherein the annular alignment dock has a plurality of alignment areas distributed on its periphery, each of the alignment areas has a plurality of material receiving holes, and during the transfer period, the alignment area located directly above among the plurality of alignment areas serves as a component input area, and the alignment area located directly below serves as a component output area;

[0013] Perform an alignment operation, which includes: driving a feeding head to move downward to the component input area during the transfer period to correspondingly fill a plurality of electronic components into the plurality of material receiving holes; and

[0014] Perform an implantation operation, which includes: driving the annular alignment dock to release downward the plurality of electronic components in the plurality of material receiving holes of the component output area, so that the plurality of electronic components correspondingly abut against a solder on a plurality of pads of a corresponding substrate;

[0015] Wherein, the feeding head has at least one feeding port, at least one material receiving cavity, a discharging port and a cover body that can move up and down. The at least one feeding port is used to input a plurality of the electronic components. The at least one material receiving cavity is used to accommodate the plurality of electronic components. The discharging port is used to provide a downward outlet for the plurality of electronic components when the cover body moves upward and away. Each of the material receiving cavities has an air groove to provide an air flow during the alignment operation to blow the electronic components accommodated therein towards the discharging port; and a air knife device is provided on each side of the annular alignment dock to blow the redundant electronic components in the component input area back into the at least one material receiving cavity.

[0016] In one embodiment, the plurality of material receiving holes in each of the alignment areas have a distribution pattern, and the plurality of pads of the corresponding substrate also have the distribution pattern.

[0017] In one embodiment, during the alignment operation, each of the alignment areas abuts against a vibration device to accelerate each of the electronic components into the corresponding material receiving holes through vibration.

[0018] In one embodiment, each of the plurality of material receiving holes in each of the alignment areas has an opening for performing a negative pressure operation on each of the material receiving holes to ensure that the plurality of electronic components accommodated therein do not fall off during the rotation of the annular alignment dock.

[0019] In one embodiment, a photographic device is disposed below the cover to capture an image of the component input area, and the aligning operation includes: performing an image recognition program on the image to determine the distribution state of the electronic components in the component input area, and performing a subsequent operation according to the distribution state. The subsequent operation includes: if at least one of the material receiving holes does not contain one of the electronic components, using the air grooves of at least one of the material receiving cavities to provide the airflow to blow at least one of the electronic components towards the discharge port; and if all of the plurality of material receiving holes contain one of the electronic components and there are redundant electronic components on the surface of the component input area, driving at least one of the air knife devices to provide at least one air curtain to blow the plurality of electronic components back into at least one of the material receiving cavities.

[0020] In one embodiment, the method for mass transfer of the electronic components further includes a solder cleaning program, which includes: using a cleaning device located on one side of the annular aligning dock to remove the residual solder on one of the aligning areas facing it.

[0021] In one embodiment, an arc concave surface is disposed around the lower part of the discharge port of the feeding head, and an arc convex surface matching the arc concave surface is disposed around each of the aligning areas of the annular aligning dock.

[0022] To achieve the above object, the present invention further provides a system for mass transfer of electronic components, which has a control circuit and a feeding head, an annular aligning dock and a pair of air knife devices electrically coupled to the control circuit to implement a method for mass transfer. The method for mass transfer includes:

[0023] Driving the annular aligning dock to rotate step by step at a predetermined angle to periodically provide a transfer period. The annular aligning dock has a plurality of aligning areas distributed on its periphery, and each of the aligning areas has a plurality of material receiving holes. During the transfer period, the aligning area located directly above among the plurality of aligning areas serves as a component input area, and the aligning area located directly below serves as a component output area;

[0024] Performing an aligning operation, which includes: driving the feeding head to move down to the component input area during the transfer period to correspondingly fill a plurality of electronic components into the plurality of material receiving holes; and

[0025] Performing an implantation operation, which includes: driving the annular aligning dock to release the plurality of electronic components in the plurality of material receiving holes of the component output area downward, so that the plurality of electronic components correspondingly abut against solder on a plurality of solder pads of a corresponding substrate;

[0026] Wherein, the feeding head has at least one feeding port, at least one material accommodating cavity, a discharging port, and a cover body that can move up and down. The at least one feeding port is used to input a plurality of the electronic components. The at least one material accommodating cavity is used to accommodate the plurality of electronic components. The discharging port is used to provide a downward outlet for the plurality of electronic components when the cover body moves upward and away. Each of the material accommodating cavities has an air groove to provide an air flow during the aligning operation to blow the electronic components it accommodates towards the discharging port. And on both sides of the annular aligning dock, there is a jet knife device respectively to blow the redundant electronic components in the component input area back into the at least one material accommodating cavity.

[0027] In one embodiment, the plurality of material accommodating holes in each aligning area have a distribution pattern, and the plurality of solder pads on the corresponding substrate also have the distribution pattern.

[0028] In one embodiment, the mass transfer system further has a vibration device. Wherein, during the aligning operation, each aligning area is in contact with the vibration device to accelerate each of the electronic components into the corresponding material accommodating hole through vibration.

[0029] In one embodiment, each of the plurality of material accommodating holes in each aligning area has an opening for performing a negative pressure operation on each material accommodating hole to ensure that the plurality of electronic components it accommodates do not fall off during the rotation of the annular aligning dock.

[0030] In one embodiment, the mass transfer system of the electronic components further has a photographing device. Wherein, the photographing device is located below the cover body to capture an image of the component input area, and the aligning operation includes: performing an image recognition program on the image to judge the distribution state of the electronic components in the component input area, and performing a subsequent operation according to the distribution state. The subsequent operation includes: if at least one of the material accommodating holes does not accommodate an electronic component, using the air groove of at least one of the material accommodating cavities to provide the air flow to blow at least one electronic component towards the discharging port; and if each of the plurality of material accommodating holes accommodates an electronic component and there are redundant electronic components on the surface of the component input area, driving at least one of the pair of jet knife devices to provide at least one air curtain to blow the plurality of electronic components back into at least one of the material accommodating cavities.

[0031] In one embodiment, the mass transfer system of the electronic components further has a cleaning device located on one side of the annular aligning dock, and the mass transfer method includes a solder removing program, which includes: using the cleaning device to remove the residual solder on one of the aligning areas it faces.

[0032] In one embodiment, the periphery below the discharging port of the feeding head has an arc concave surface, and the periphery of each aligning area of the annular aligning dock has an arc convex surface matching the arc concave surface.

[0033] To further understand the structure, features and purposes of the present invention, schematic diagrams and detailed descriptions of preferred specific embodiments are attached below. Description of the Drawings

[0034] Figure 1 A block diagram showing an embodiment of a mass transfer system for electronic components of the present invention;

[0035] Figure 2 For Figure 1 A schematic diagram showing an embodiment of a feeding head of a mass transfer system for electronic components of

[0036] Figure 3 For Figure 1 A schematic diagram showing an embodiment of an annular alignment dock of a mass transfer system for electronic components of

[0037] Figure 4 For Figure 3 A schematic diagram showing an embodiment of an alignment area of the annular alignment dock of

[0038] Figure 5 A schematic diagram showing another embodiment of a feeding head and an annular alignment dock of a mass transfer system for electronic components of the present invention; and

[0039] Figure 6 A flowchart showing an embodiment of a mass transfer method for electronic components of the present invention. Detailed Description of the Invention

[0040] Please refer to Figure 1 , which shows a block diagram of an embodiment of a mass transfer system for electronic components of the present invention. As Figure 1 shown, a mass transfer system 100 for electronic components is used to execute a mass transfer process to transfer electronic components to a substrate 10, and the mass transfer system 100 has a control circuit 110 and a feeding head 120, a photography device 121, an annular alignment dock 130, a vibration device 140, a first air knife device 151, a second air knife device 152 and a cleaning device 160 that are electrically coupled to the control circuit 110, and the control circuit 110 is used to execute a program to implement the mass transfer process, wherein the electronic components can be copper pillars or passive components.

[0041] Please refer to Figure 2 , which is Figure 1 A schematic diagram showing an embodiment of the feeding head 120 of the mass transfer system 100 for Figure 2 shown. As

[0042] The at least one feed inlet 122 is used to input a plurality of the electronic components, the at least one component accommodating cavity 123 is used to accommodate a plurality of the electronic components, and the discharge outlet 124 is used to provide a downward outlet for the electronic components when the cover body 125 is moved upward; each component accommodating cavity 123 has an air groove 123a for introducing an air flow to blow the electronic components accommodated therein toward the discharge outlet 124.

[0043] Please refer to Figure 3 , which is Figure 1 a schematic diagram of an embodiment of the annular alignment dock 130 of the high-volume transfer system 100 for electronic components. As Figure 3 shown, the annular alignment dock 130 has a plurality of alignment areas 131 distributed on its periphery and rotates step by step at a predetermined angle to periodically provide a transfer period. Among them, each alignment area 131 has a plurality of component accommodating holes, and during the transfer period, the one located directly above among the plurality of alignment areas 131 serves as a component input area, and the one located directly below serves as a component output area. In addition, a pair of air knife devices (the first air knife device 151, the second air knife device 152) are arranged on both sides of the annular alignment dock 130 to blow the redundant electronic components in the component input area back into the at least one component accommodating cavity 123.

[0044] In addition, please refer to Figure 4 , which is Figure 3 a schematic diagram of an embodiment of the alignment area 131 of the annular alignment dock 130. As Figure 4 shown, the alignment area 131 has a tooling plate 131a, and the tooling plate 131a has a plurality of component accommodating holes 131b. In addition, the vibration device 140 abuts against the tooling plate 131a to accelerate the process of the electronic components 20 entering the component accommodating holes 131b; and each component accommodating hole 131b has an opening 131c for performing a negative pressure operation on each component accommodating hole 131b to adsorb the electronic components 20.

[0045] Specifically, the high-volume transfer program includes:

[0046] (1) The control circuit 110 drives the annular alignment dock 130 to rotate step by step at a predetermined angle to periodically provide a transfer period. During the transfer period, the one located directly above among the plurality of alignment areas 131 serves as a component input area, and the one located directly below serves as a component output area;

[0047] (2) The control circuit 110 performs an alignment operation, which includes: driving the feeding head 120 to move downward to the component input area during the transfer period to correspondingly fill a plurality of electronic components 20 into the plurality of component accommodating holes 131b; and

[0048] (3) The control circuit 110 performs an implant operation, which includes: driving the annular alignment dock 130 downward to release the multiple electronic components 20 in the multiple material-receiving holes 131b of the component output area, so that the multiple electronic components 20 correspondingly abut against a solder on multiple pads of a corresponding substrate 10.

[0049] During the alignment operation, the control circuit 110 can drive a pneumatic device (not shown in the figure) to output an air flow to the air grooves 123a of each material-receiving cavity 123 to blow the electronic components 20 accommodated in each material-receiving cavity 123 towards the discharge port 124.

[0050] In addition, the imaging device 121 can be arranged below the cover 125 to capture an image of the component input area during the alignment operation, and the control circuit 110 can execute an image recognition program according to the image to judge the distribution state of the electronic components 20 in the component input area, and execute a subsequent operation according to the distribution state. Specifically, the subsequent operation can include: if at least one material-receiving hole 131b does not accommodate an electronic component 20, driving the pneumatic device to output an air flow to the air grooves 123a of at least one material-receiving cavity 123 to blow at least one electronic component 20 towards the discharge port 124; and if the multiple material-receiving holes 131b are all accommodated with electronic components 20 and there are redundant electronic components 20 on the surface of the component input area, driving the pair of air knife devices (the first air knife device 151 and the second air knife device 152) to output at least one air curtain to blow the multiple redundant electronic components 20 back into at least one material-receiving cavity 123.

[0051] In addition, during the alignment operation in the alignment area 131, the control circuit 110 can cause the vibration device 140 to vibrate the component input area, so that each electronic component 20 accelerates into the corresponding material-receiving hole 131b.

[0052] In addition, after the alignment operation is completed in each alignment area 131, to ensure that the multiple electronic components 20 accommodated therein do not fall off during the rotation of the annular alignment dock 130, the control circuit 110 can drive the pneumatic device to perform a negative pressure operation on the openings 131c of the multiple material-receiving holes 131b in each alignment area 131, so as to ensure that the multiple electronic components 20 are sucked and held upright in the multiple material-receiving holes 131b.

[0053] In addition, the multiple material-receiving holes 131b in each alignment area 131 have a distribution pattern, and the multiple pads of the corresponding substrate 10 also have the distribution pattern, so that the electronic components 20 can be accurately mounted on the multiple pads of each substrate 10.

[0054] In addition, the mass transfer program can further include a solder cleaning program, which includes: the control circuit 110 driving the cleaning device 160 to remove the residual solder on an alignment area 131 facing it.

[0055] In addition, an arc concave surface can be formed around the lower part of the discharge port 124 of the feeding head 120, and an arc convex surface matching the arc concave surface can be formed around each alignment area 131 of the annular alignment dock 130. When the feeding head 120 moves down to the component input area to perform the alignment operation, the arc concave surface and the arc convex surface are hermetically attached, which is beneficial to the air control operation during the alignment operation. Please refer to Figure 5 , which is a schematic diagram of another embodiment of the feeding head 120 and the annular alignment dock 130 of the mass transfer system of the electronic components of the present invention. As Figure 5 shown, an arc concave surface 124a is provided around the lower part of the discharge port 124 of the feeding head 120, and an arc convex surface 131a matching the arc concave surface 124a is provided around each alignment area 131 of the annular alignment dock 130, and the arc concave surface 124a and the arc convex surface 131a are attached to provide an airtight effect for the material accommodating cavity 123 of the feeding head 120.

[0056] As can be seen from the above description, the present invention discloses a mass transfer method for electronic components. Please refer to Figure 6 , which shows a flowchart of an embodiment of the mass transfer method for the electronic components of the present invention, which is implemented by a control circuit executing a program and includes the following steps: driving an annular alignment dock to rotate step by step at a predetermined angle to periodically provide a transfer period, wherein the annular alignment dock has a plurality of alignment areas distributed on its periphery, each of the alignment areas has a plurality of material accommodating holes, and during the transfer period, the alignment area located directly above among the plurality of alignment areas serves as a component input area, and the alignment area located directly below serves as a component output area (step a); performing an alignment operation, which includes: driving a feeding head to move down to the component input area during the transfer period to correspondingly fill a plurality of electronic components into the plurality of material accommodating holes (step b); and performing an implantation operation, which includes: driving the annular alignment dock to release the plurality of electronic components in the plurality of material accommodating holes in the component output area downward, so that the plurality of electronic components correspondingly abut against a solder on a plurality of solder pads of a corresponding substrate (step c).

[0057] In the above steps, the feeding head has at least one feeding port, at least one material accommodating cavity, a discharge port and a cover body that can move up and down. The at least one feeding port is used to input the plurality of electronic components, the at least one material accommodating cavity is used to accommodate the plurality of electronic components, and the discharge port is used to provide a downward outlet for the plurality of electronic components when the cover body moves upward; each of the material accommodating cavities has an air groove to provide an air flow during the alignment operation to blow the electronic components accommodated therein toward the discharge port; and a air knife device is provided on each side of the annular alignment dock to blow the redundant electronic components in the component input area back into the at least one material accommodating cavity.

[0058] In addition, during the entire column operation, each of the entire column areas is in contact with a vibration device to accelerate the entry of each of the electronic components into the corresponding material receiving holes through vibration.

[0059] In addition, each of the multiple material receiving holes in each of the entire column areas has an opening for performing a negative pressure operation on each of the material receiving holes to ensure that the multiple electronic components accommodated therein do not fall off during the rotation of the annular entire column dock.

[0060] In addition, a photographing device may be provided below the cover to capture an image of the component input area, and the entire column operation includes: performing an image recognition program on the image to determine the distribution state of the electronic components in the component input area, and performing a subsequent operation according to the distribution state. The subsequent operation includes: if at least one of the material receiving holes does not accommodate an electronic component, using the air grooves of at least one of the material receiving cavities to provide the air flow to blow at least one of the electronic components towards the discharge port; and if each of the multiple material receiving holes accommodates an electronic component and there are excess electronic components on the surface of the component input area, driving at least one of the air knife devices to provide at least one air curtain to blow the multiple electronic components back into at least one of the material receiving cavities.

[0061] In addition, the multiple material receiving holes in each of the entire column areas have a distribution pattern, and the multiple solder pads of the corresponding substrate also have the distribution pattern.

[0062] In addition, the method for mass transfer of the electronic components may further include a solder cleaning program, which includes: using a cleaning device located on one side of the annular entire column dock to remove the residual solder on one of the entire column areas facing it.

[0063] From the above description, the present invention can provide the following advantages:

[0064] (1) The method for mass transfer of electronic components can simultaneously perform an electronic component entire column operation and an electronic component batch implantation operation periodically through a stepwise vertical rotation mechanism of an annular entire column device, so as to efficiently and successively bond multiple electronic components corresponding to multiple solder pads on a substrate.

[0065] (2) The method for mass transfer of the electronic components of the present invention can accelerate the entire column process of the multiple electronic components through a pneumatic operation.

[0066] (3) The method for mass transfer of the electronic components of the present invention can accelerate the entire column process of the multiple electronic components through a vibration operation.

[0067] (4) The method for mass transfer of the electronic components of the present invention can automatically ensure the completion degree of the electronic component entire column operation through a photographing device and a pneumatic mechanism and can send the excess electronic components back to the material receiving cavity; and

[0068] (5) The mass transfer system of the electronic component of the present invention can significantly improve the transfer efficiency and the required accuracy of transfer through the above method.

[0069] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for massive transfer of electronic components, implemented by a control circuit, characterized in that, Including: Driving an annular alignment dock to rotate step by step at a predetermined angle to periodically provide a transfer period. The annular alignment dock has a plurality of alignment areas distributed on its periphery. Each alignment area has a plurality of material receiving holes. During the transfer period, the alignment area located directly above among the plurality of alignment areas serves as a component input area, and the one located directly below serves as a component output area; Performing an alignment operation, which includes: driving a feeding head to move downward to the component input area during the transfer period to correspondingly fill a plurality of electronic components into the plurality of material receiving holes; and Performing an implantation operation, which includes: driving the annular alignment dock to release downward the plurality of electronic components in the plurality of material receiving holes of the component output area so that the plurality of electronic components correspondingly abut against a solder on a plurality of solder pads of a corresponding substrate; Wherein, the feeding head has at least one material inlet, at least one material receiving cavity, a material outlet and a cover body that can move up and down. The at least one material inlet is used to input a plurality of the electronic components. The at least one material receiving cavity is used to accommodate the plurality of electronic components. The material outlet is used to provide a downward outlet for the plurality of electronic components when the cover body moves upward. Each material receiving cavity has an air groove to provide an air flow during the alignment operation to blow the electronic components it accommodates towards the material outlet. And on both sides of the annular alignment dock, there is a blower device respectively to blow the redundant electronic components in the component input area back into the at least one material receiving cavity.

2. The method for massive transfer of the electronic component according to claim 1, wherein, The plurality of material receiving holes of each alignment area have a distribution pattern, and the plurality of solder pads of the corresponding substrate also have the distribution pattern.

3. The method for massive transfer of the electronic component as claimed in claim 1, wherein During the alignment operation, each alignment area abuts against a vibration device to accelerate each of the electronic components into the corresponding material receiving hole through vibration.

4. The method for mass transfer of the electronic component according to claim 1, characterized in that, Each of the plurality of material receiving holes of each alignment area has an opening for performing a negative pressure operation on each material receiving hole to ensure that the plurality of electronic components it accommodates do not fall off during the rotation of the annular alignment dock.

5. The method for mass transfer of the electronic component according to claim 1, wherein Below the cover body, there is a photography device to capture an image of the component input area. And the alignment operation includes: performing an image recognition program on the image to judge the distribution state of the electronic components in the component input area, and performing a subsequent operation according to the distribution state. The subsequent operation includes: if at least one of the material receiving holes does not accommodate an electronic component, using the air groove of at least one of the material receiving cavities to provide the air flow to blow at least one of the electronic components towards the material outlet; and if the plurality of material receiving holes all accommodate an electronic component and there are redundant electronic components on the surface of the component input area, driving at least one of the blower devices to provide at least one air curtain to blow the plurality of electronic components back into at least one of the material receiving cavities.

6. The method for massive transfer of the electronic component according to claim 1, wherein Further including a solder cleaning program, which includes: using a cleaning device located on one side of the annular alignment dock to remove the residual solder of an alignment area it faces.

7. The method for massive transfer of electronic components as claimed in claim 1, wherein, Around the lower part of the material outlet of the feeding head, there is an arc concave surface, and around each alignment area of the annular alignment dock, there is an arc convex surface matching the arc concave surface.

8. A mass transfer system for an electronic component, characterized in that, There is a control circuit and a feeding head, an annular alignment dock, and a pair of air knife devices electrically coupled to the control circuit to implement a mass transfer method. The mass transfer method includes: Driving the annular alignment dock to rotate step by step at a predetermined angle to periodically provide a transfer period. The annular alignment dock has a plurality of alignment areas distributed on its periphery, each alignment area has a plurality of component receiving holes, and during the transfer period, the alignment area located directly above among the plurality of alignment areas serves as a component input area, and the one located directly below serves as a component output area; Performing an alignment operation, which includes: driving the feeding head to move down to the component input area during the transfer period to correspondingly fill a plurality of electronic components into the plurality of component receiving holes; and Performing an implantation operation, which includes: driving the annular alignment dock to release the plurality of electronic components in the plurality of component receiving holes in the component output area downward, so that the plurality of electronic components correspondingly abut against a solder on a plurality of solder pads of a corresponding substrate; Wherein, the feeding head has at least one feeding port, at least one component receiving cavity, a discharging port, and a cover that can move up and down. The at least one feeding port is used to input a plurality of the electronic components, the at least one component receiving cavity is used to accommodate the plurality of electronic components, and the discharging port is used to provide a downward outlet for the plurality of electronic components when the cover moves upward; each component receiving cavity has an air groove to provide an air flow during the alignment operation to blow the electronic components it accommodates toward the discharging port; and a pair of air knife devices are respectively arranged on both sides of the annular alignment dock to blow the redundant electronic components in the component input area back into the at least one component receiving cavity.

9. The mass transfer system for an electronic component according to claim 8, wherein, The plurality of component receiving holes in each alignment area have a distribution pattern, and the plurality of solder pads of the corresponding substrate also have the distribution pattern.

10. The mass transfer system of the electronic component as described in claim 8, characterized in that, There is further a vibration device. During the alignment operation, each alignment area abuts against the vibration device to accelerate each of the electronic components into the corresponding component receiving hole through vibration.

11. The mass transfer system of the electronic component according to claim 8, characterized in that, Each of the plurality of component receiving holes in each alignment area has an opening for performing a negative pressure operation on each component receiving hole to ensure that the plurality of electronic components it accommodates do not fall off during the rotation of the annular alignment dock.

12. The mass transfer system of the electronic component according to claim 8, characterized in that, There is further a photography device. The photography device is located below the cover to capture an image of the component input area, and the alignment operation includes: performing an image recognition program on the image to judge the distribution state of the electronic components in the component input area, and performing a subsequent operation according to the distribution state. The subsequent operation includes: if at least one of the component receiving holes does not accommodate an electronic component, using the air groove of at least one of the component receiving cavities to provide the air flow to blow at least one of the electronic components toward the discharging port; and if the plurality of component receiving holes all accommodate an electronic component and there are redundant electronic components on the surface of the component input area, driving at least one of the pair of air knife devices to provide at least one air curtain to blow the plurality of electronic components back into at least one of the component receiving cavities.

13. The massive transfer system of the electronic component as described in claim 8, characterized in that, Further, there is a cleaning device located on one side of the annular alignment dock, and the mass transfer method includes a solder removal procedure, which includes: using the cleaning device to remove the residual solder in the alignment area facing it.

14. The mass transfer system of the electronic component according to claim 8, characterized in that, There is an arc concave surface around the lower part of the discharge port of the feeder head, and there is an arc convex surface matching the arc concave surface around each alignment area of the annular alignment dock.

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