Multifunctional integrated array plane frame for air-cooling heat dissipation

Abstract

The invention provides a multifunctional integrated array plane frame for air cooling heat dissipation, which comprises a soaking cold plate, a plurality of partition plates and loop heat pipes, the plurality of partition plates are arranged on the soaking cold plate at intervals, a plurality of cavities are defined by the plurality of partition plates and comprise a plurality of mounting cavities and a plurality of air duct cavities, and the mounting cavities and the air duct cavities are arranged in a staggered manner; the loop heat pipe is arranged on the partition plate, one end of the loop heat pipe is provided with pipeline cooling fins extending into the air duct cavity, and the other end of the loop heat pipe is located in the installation cavity and attached to the device unit in the installation cavity. According to the integrated array plane frame, the integration degree and the space utilization rate of an antenna array plane can be improved, the weight and the size are reduced, the heat dissipation capacity of the antenna array plane can be improved, the temperature difference loss caused by conduction thermal resistance can be reduced, and the air channel space for air cooling heat exchange can be efficiently utilized; according to the invention, precise and intelligent heat dissipation can be carried out on the antenna sub-array units and the functional module units, and the temperature consistency of the antenna sub-array units can be well ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly to a multi-functional integrated array frame for air-cooled heat dissipation. Background Art

[0002] With the increasing development and application of phased array radar technology, the design requirements for the antenna array, which is the core component of the phased array radar, are also getting higher and higher. The large components of the antenna array can be divided into antenna sub-array units, functional module units, heat dissipation units, and structural units. Generally, the requirement for the heat dissipation unit is to ensure that the antenna sub-array unit and the functional module unit can work normally under certain ambient temperature conditions, that is, the component temperatures of the antenna sub-array unit and the functional module unit do not exceed the rated operating temperature, and the component temperatures of the transmitting part of the antenna sub-array unit have good temperature consistency. The structural unit provides a good installation space, support rigidity, and protection conditions for other units. The structural unit is often designed simultaneously with the heat dissipation unit, and the core body of its design is the array frame. Currently, the design requirements for the array frame are getting higher and higher, so more and more difficulties are faced.

[0003] 1) Since the types of installation platforms for antenna arrays are increasing, the requirements for the weight and size of the array are becoming more and more stringent. However, the sizes and weights of the antenna sub-array units and functional module units are basically determined. Only by optimizing the heat dissipation unit and the structural unit can the design requirements of light weight and miniaturization of the antenna array be achieved.

[0004] 2) The performance of the antenna array is getting stronger and the heat generated is also getting larger. Traditional air-cooled heat dissipation can no longer meet its heat dissipation requirements, and liquid-cooled heat dissipation needs to be adopted. However, some installation platforms of antenna arrays cannot provide liquid-cooled liquid supply, and only air-cooled heat dissipation can be used. Therefore, new enhanced air-cooled heat dissipation technologies need to be adopted to improve the heat dissipation capacity of the heat dissipation unit.

[0005] 3) Some radars have high requirements for reliability and strict cost control, and often hope that the heat dissipation unit is as simple as possible. If air-cooled heat dissipation can be used, liquid-cooled heat dissipation should not be used. This also puts higher demands on air-cooled heat dissipation.

[0006] 4) The maintainability requirements of the antenna array often bring higher requirements for the design of the heat dissipation unit and the structural unit. An antenna cover is generally installed at the front of the antenna array, and a support mechanism is often installed at the bottom or side. The rear part is the maintenance window for the antenna sub-array unit and the functional module unit, leaving little space for the heat dissipation unit. This also brings great limitations to improving the air-cooled heat dissipation capacity.

[0007] 5) The antenna array surface has relatively high requirements for protection. The antenna sub - array units and functional module units often need to work in a sealed environment, and the cold air in the environment cannot directly dissipate heat for them. When designing the structural unit and the heat - dissipation unit, it is necessary to first conduct the heat out and then concentrate on heat dissipation. The resulting conduction thermal resistance makes it more difficult to dissipate heat from the antenna array surface.

[0008] Therefore, in order to further improve the equipment performance and meet the growing design requirements of the antenna array surface, these problems and difficulties need to be solved urgently. Summary of the Invention

[0009] The technical problem to be solved by the present invention is how to improve the heat dissipation and integration of the antenna true array surface. The present invention provides a multi - functional integrated array frame for air - cooled heat dissipation.

[0010] The multi - functional integrated array frame for air - cooled heat dissipation according to an embodiment of the present invention includes: A heat - pipe cold plate; A plurality of partitions are spacedly arranged on the heat - pipe cold plate. The plurality of partitions define a plurality of chambers, including a plurality of installation chambers and a plurality of air - duct chambers, and the installation chambers and the air - duct chambers are arranged in an alternating manner. A loop heat pipe is arranged on the partition. One end of the loop heat pipe is a pipeline heat - dissipation fin extending into the air - duct chamber, and the other end of the loop heat pipe is located in the installation chamber and is attached to the device unit in the installation chamber.

[0011] The multi - functional integrated array frame for air - cooled heat dissipation according to an embodiment of the present invention can improve the integration degree and space utilization rate of the antenna array surface, reduce the weight and size, improve the heat - dissipation ability of the antenna array surface, reduce the temperature difference loss caused by the conduction thermal resistance, efficiently utilize the air - duct space available for air - cooled heat exchange, accurately and intelligently dissipate heat from the antenna sub - array units and functional module units, and preferably ensure the temperature consistency of the antenna sub - array units.

[0012] According to some embodiments of the present invention, the position of the heat - pipe cold plate opposite to the air - duct chamber is configured as a cold - plate heat - dissipation fin.

[0013] In some embodiments of the present invention, a side - mounted functional module unit is installed on the side of the partition facing the installation chamber, and a functional - unit heat - dissipation fin is provided on the side of the partition facing the air - duct chamber. The functional - unit heat - dissipation fin is connected to at least part of the side - mounted functional module units.

[0014] According to some embodiments of the present invention, a flat - mounted functional module unit is provided on the bottom wall of the installation chamber.

[0015] In some embodiments of the present invention, the partition includes a longitudinal partition and a transverse partition. The longitudinal partition is located between the installation cavity and the air duct cavity, and the transverse partition is located between two adjacent installation cavities.

[0016] According to some embodiments of the present invention, the transverse partition is provided with installation holes penetrating through two adjacent installation cavities, and a turbulent flow fan is provided at the installation holes.

[0017] In some embodiments of the present invention, the longitudinal partition is provided with an installation opening, and an external fan is provided at the installation opening.

[0018] According to some embodiments of the present invention, at least part of the air duct cavity is provided with a flow guiding frame, and a flow ventilation duct is defined between the flow guiding frame and the partition.

[0019] In some embodiments of the present invention, at least part of the air duct cavity is provided with a flow guiding block protruding from the bottom wall of the air duct cavity, and an internal wire trough communicating with the two adjacent installation cavities is provided in the flow guiding block.

[0020] According to some embodiments of the present invention, the multifunctional integrated array frame is used for an antenna array, and an antenna element unit is installed on a side of the heat sink cold plate facing away from the installation cavity. Description of the Drawings

[0021] Figure 1 Schematic structural diagram of a multifunctional integrated array frame for air-cooled heat dissipation according to an embodiment of the present invention; Figure 2 Schematic diagram of the multifunctional integrated array frame for air-cooled heat dissipation after installing functional modules according to an embodiment of the present invention; Figure 3 For Figure 2 Cross-sectional view of the multifunctional integrated array frame for air-cooled heat dissipation shown.

[0022] Reference Numerals: Array frame 100, external installation interface 101, Heat sink cold plate 10, cold plate heat dissipation fins 110, external frame 120, Partition 20, longitudinal partition 210, installation opening 211, external fan 212, heat dissipation fin interface 213, transverse partition 220, installation hole 221, turbulent flow fan 222, installation cavity V1, air duct cavity V2, air outlet A1, filter net 230, Loop heat pipe 30, pipeline heat dissipation fins 301, Side-mounted functional module unit 40, functional unit heat dissipation fins 410, flat-mounted functional module unit 50, Flow guiding frame 60, flow guiding block 70, internal wire trough 710, Air duct cover 810, sealing cover 820, Radome 910, antenna element unit 920. Specific implementation mode

[0023] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined purpose, the present invention will be described in detail as follows in combination with the accompanying drawings and preferred embodiments.

[0024] In the present invention, the description of the method flow in the specification and the steps in the flowchart in the accompanying drawings of the present invention do not necessarily have to be strictly executed according to the step numbers. The method steps can change the execution order. Moreover, some steps can be omitted, multiple steps can be combined into one step for execution, and / or one step can be decomposed into multiple steps for execution.

[0025] As Figure 1 and Figure 2 shown, the multi-functional integrated array frame 100 for air-cooled heat dissipation according to an embodiment of the present invention includes: a heat sink cold plate 10, a plurality of partitions 20, and a loop heat pipe 30. The plurality of partitions 20 are spaced apart on the heat sink cold plate 10. The plurality of partitions 20 define a plurality of chambers, including a plurality of installation chambers V1 and a plurality of air duct chambers V2. The installation chambers V1 and the air duct chambers V2 are arranged in an alternating manner. The loop heat pipe 30 is arranged on the partition 20. One end of the loop heat pipe 30 is a pipe heat dissipation fin 301 extending into the air duct chamber V2, and the other end of the loop heat pipe 30 is located in the installation chamber V1 and is attached to the device unit in the installation chamber V1.

[0026] It should be noted that, as Figure 1 shown, the heat sink cold plate 10, the plurality of partitions 20, and the outer external frame 120 of the array frame 100 adopt an integrated structure design to improve the integration of the array frame 100. As Figure 2 shown, the heat dissipation fins of the loop heat pipe 30 protrude into the heat dissipation air duct, and the other end can be attached to some antenna sub-array units and flat-mounted function module units 50 with relatively high temperatures to establish a fast heat dissipation path, which can significantly reduce the maximum temperature.

[0027] The multi-functional integrated array frame 100 for air-cooled heat dissipation according to an embodiment of the present invention can improve the integration and space utilization rate of the antenna array, reduce the weight and size, can improve the heat dissipation capacity of the antenna array, can reduce the temperature difference loss caused by the conduction thermal resistance, can efficiently utilize the air duct space available for air-cooled heat exchange, can accurately and intelligently dissipate heat from the antenna sub-array units and function module units, and can preferably ensure the temperature consistency of the antenna sub-array units.

[0028] As Figure 1As shown, according to some embodiments of the present invention, the position of the soaking cold plate 10 opposite to the air duct cavity V2 is configured as a cold plate heat dissipation fin 110. Thus, there is no need to set up an additional heat dissipation structure, and the front array frame 100 is integrally integrated.

[0029] In some embodiments of the present invention, as Figure 1 and Figure 2 shown, on the side of the partition plate 20 facing the installation cavity V1, a side-mounted functional module unit 40 is installed, and on the side of the partition plate 20 facing the air duct cavity V2, there are functional unit heat dissipation fins 410, and the functional unit heat dissipation fins 410 are connected to at least part of the side-mounted functional module unit 40.

[0030] It should be noted that, as Figure 2 shown, on the side of the partition plate 20 facing the installation cavity V1, a plurality of side-mounted functional module units 40 are installed. Among them, for the side-mounted functional module unit 40 with higher heat dissipation requirements, functional unit heat dissipation fins 410 extending into the air duct cavity V2 can be connected (such as Figure 2 the side-mounted functional module unit 40 located at the lower part in

[0031] According to some embodiments of the present invention, in combination with Figure 1 and Figure 2 shown, on the bottom wall of the installation cavity V1, a flat-mounted functional module unit 50 is provided. It should be noted that for the front array frame 100 of the present invention, a flat-mounted functional module unit 50 can be provided on the bottom wall, and side-mounted functional module units can also be provided on the partition plates 20 on the side walls. Thus, the spatial structure of the front array frame 100 can be fully utilized, and the front array frame 100 can be made more integrated.

[0032] As Figure 2 shown, the installation cavity V1 is sealed by a corresponding sealing cover plate 820, and the air duct cavity V2 is sealed by a corresponding air duct cover plate 810.

[0033] In some embodiments of the present invention, as Figure 1 shown, the partition plate 20 includes a longitudinal partition plate 210 and a transverse partition plate 220. The longitudinal partition plate 210 is located between the installation cavity V1 and the air duct cavity V2, and the transverse partition plate 220 is located between two adjacent installation cavities V1. Thus, a plurality of different functional partitions can be formed by dividing through a plurality of longitudinal partition plates 210 and a plurality of transverse partition plates 220.

[0034] According to some embodiments of the present invention, the transverse partition plate 220 is provided with an installation hole 221 penetrating through two adjacent installation cavities V1, and a flow disturbance fan 222 is provided at the installation hole 221. It can be understood that by arranging the flow disturbance fan 222 between the installation cavities V1, the flow of the cooling air in the adjacent installation cavities V1 can be realized, and moreover, the circulation of the cooling air can be accelerated, thereby improving the heat dissipation effect.

[0035] In some embodiments of the present invention, as Figure 1 and Figure 2 shown, the longitudinal partition 210 is provided with an installation opening 211, and an external fan 212 is provided at the installation opening 211. It can be understood that by providing the external fan 212, efficient circulation of the cooling air can be achieved, providing sufficient air volume for the heat dissipation of the entire antenna array surface. As Figure 1 and Figure 2 shown, the external fan 212 can be arranged at the middle position of the air duct cavity V2. Thus, the cooling air can flow evenly to the two sides of the air duct cavity V2, thereby improving the uniformity of heat dissipation.

[0036] According to some embodiments of the present invention, as Figure 2 shown, a flow guiding frame 60 is provided in at least part of the air duct cavity V2, and a flow through ventilation duct is defined between the flow guiding frame 60 and the partition 20. It should be noted that by providing the flow guiding frame 60, the flow through ventilation duct can be defined, enabling the cooling air to flow in the flow through ventilation duct. Thereby, the cross-section of the cooling air flow can be reduced, the flow rate of the cooling air can be increased, and the cooling effect can be improved. Moreover, the flow guiding frame 60 with corresponding shapes and positions can be set according to the requirements of the actual heat dissipation components to improve the heat dissipation effect.

[0037] As Figure 2 shown, the integrated array frame 100 directly forms the main body of the heat dissipation air duct. By adding the air duct cover plate 810, the flow guiding frame 60, and the external fan 212, a U-shaped closed flow through ventilation duct is formed, which makes efficient and reasonable use of the structures of the external frame 120 of the array and the internal partition 20 of the array, reducing the structural components. The integrated cold plate heat dissipation fins 110 directly processed on the heat dissipation cold plate 10 are the main heat exchange structures for the heat dissipation of the antenna array surface, occupying most of the space of the heat dissipation air duct. In the area of the heat dissipation air duct close to the internal partition 20 of the array, spaces are reserved for installing the heat dissipation fin ends of the loop heat pipe 30 and the heat dissipation fins of the side-mounted functional module unit 40 with heat dissipation fins. The sizes and arrangement densities of the heat dissipation fins should first meet the requirements of the heat dissipation for the heat exchange area, and also meet the requirements of a lower air resistance coefficient. At the same time, the heat dissipation differences of the heat dissipation fins arranged front and back in the air duct need to be considered.

[0038] As Figure 3 shown, the filter net 230 can be installed at the air outlet A1 at the rear and bottom of the integrated array frame 100(1) to prevent foreign objects from entering the inside of the air duct. The air duct is open directly below, which is easy to maintain and clean.

[0039] In some embodiments of the present invention, as Figure 1As shown, a flow guide block 70 protruding from the bottom wall of the air duct cavity V2 is provided in at least a part of the air duct cavity V2. An internal wire slot 710 communicating with the installation cavity V1 on both sides is provided in the flow guide block 70, and it is conformal to the flow guide structure, one is inside the array surface frame 100 and the other is outside the array surface frame 100. By providing the flow guide block 70, the cooling air can be guided and disturbed, which is beneficial to improving the heat dissipation effect. Moreover, an internal wire slot 710 can be provided in the flow guide block 70 to connect the independent sealed cavities at the rear of the array surface frame 100, realizing the internal electrical connection of the antenna array surface and the external electrical connection. The external cables need to pass through the internal wire slot 710 and the external installation interface 101 at the same time.

[0040] According to some embodiments of the present invention, as Figure 2 and Figure 3 shown, the multifunctional integrated array surface frame 100 is used for the antenna array surface and is connected to the installation platform applied by the antenna array surface through the external installation interface 101. An antenna element unit 920 is installed on the side of the heat sink cold plate 10 facing away from the installation cavity V1. Applying this array surface frame 100 to the antenna array surface can effectively improve the integration and heat dissipation effect of the antenna array surface.

[0041] As Figure 2 and Figure 3 shown, an antenna cover 910 is installed at the front end of the external frame 120 of the array surface of the integrated array surface frame 100, and an antenna sub-array unit is installed at the front end of the heat sink cold plate 10. The rear end of the antenna sub-array unit passes through the avoidance opening of the heat sink cold plate 10 and is connected to the functional module. The flat-mounted functional module unit 50 is installed at the rear end of the heat sink cold plate 10, the side-mounted functional module unit 40 is directly mounted on the internal partition 20 of the array surface, and the functional module unit with heat dissipation fins needs to pass its heat dissipation fins through the avoidance opening of the internal partition 20 of the array surface and be hermetically installed at the heat dissipation fin installation interface.

[0042] In summary, the present invention proposes a multifunctional integrated array surface frame 100 for high-power air-cooled heat dissipation, which integrates the heat dissipation unit and the structural unit, and reasonably arranges the space at the rear of the antenna array surface. It can improve the integration and space utilization rate of the antenna array surface, reduce the weight and size, improve the heat dissipation ability of the antenna array surface, reduce the temperature difference loss caused by the conduction thermal resistance, efficiently utilize the air duct space available for air-cooled heat exchange, accurately and intelligently dissipate heat from the antenna sub-array unit and the functional module unit, and preferably ensure the temperature consistency of the antenna sub-array unit. The specific features are as follows: One is to improve the integration and space utilization rate of the antenna array surface, reduce the weight and size. The measures taken include: 1) Partition the space at the rear of the antenna array surface through the partition plates 20 on the integrated array surface frame 100. Each partition is independently protected. Without affecting the installation and interconnection of the antenna sub-array units and functional module units, multiple spaced-apart exclusive air ducts for heat dissipation are divided. 2) The functional module units generally have a small thickness dimension. Mounting them on the side of the partition plate 20 of the array surface frame 100 can save the front-row layout space. 3) Integrate the design of the array surface frame 100 and the cold plate for mounting the antenna sub-array units, reducing the local structural bodies and weight required for installation and sealing. 4) Directly process the cold plate heat dissipation fins 110 on the array surface frame 100 to form an air duct, reducing the structure of the heat dissipation unit.

[0043] The other is to improve the heat dissipation capacity of the antenna array surface. The measures taken include: 1) Design the cold plate of the array surface frame 100 as a heat pipe cold plate 10. Utilize the high heat conduction capacity of phase change heat transfer to quickly conduct the heat dissipation of the antenna sub-array units to the heat dissipation fins, reducing the temperature rise of heat conduction on the cold plate and improving the temperature consistency of the antenna sub-array units. 2) The cold plate heat dissipation fins 110 integrally processed with the cold plate of the array surface frame 100 reduce some heat conduction links and enhance the heat conduction and heat exchange capacity. 3) A loop heat pipe 30 is installed on the partition plate 20 of the array surface frame 100. One end of the loop heat pipe 30 is a plate structure with pipeline heat dissipation fins 301. The pipeline heat dissipation fins 301 pass through the openings on the partition plates 20 on both sides of the heat dissipation air duct and protrude into the air duct cavity V2 for heat dissipation. A gasket is installed between the plate structure and the partition plate 20. The other end of the loop heat pipe 30 is surface-mounted on some antenna sub-array units and functional module units with higher temperatures, adding a new heat dissipation path to improve the heat dissipation capacity. 4) For the functional module units with large heat dissipation mounted on the side of the partition plate 20, functional unit heat dissipation fins 410 can be designed on their module cold plates. The functional unit heat dissipation fins 410 pass through the openings on the partition plates 20 on both sides of the air duct cavity V2 and protrude into the air duct cavity V2 to directly dissipate heat from the functional module units. 5) Install a turbulator fan 222 inside the sealed cavity. The turbulator fan 222 accelerates the internal circulation air volume of the sealed cavity, which can improve the temperature uniformity of the antenna array surface and reduce the maximum temperature of the antenna array surface, that is, improve the heat dissipation capacity of the antenna array surface.

[0044] Thirdly, it can reduce the temperature difference loss caused by the conduction thermal resistance and efficiently utilize the duct space available for air-cooled heat dissipation. The measures taken include: 1) Increasing the heat conduction efficiency. Through the heat spreader and the loop heat pipe 30, the heat dissipation of the antenna subarray unit and some functional module units can be conducted to the heat dissipation fins in the duct space with a small temperature difference. Some functional module units can be directly air-cooled. 2) Increasing the heat conduction paths. The heat dissipation of the antenna subarray unit and the functional module units can be conducted to the duct cavity V2 through the heat spreader cold plate 10 and the loop heat pipe 30. At the same time, the turbulent flow fan 222 also takes away a small part of the heat dissipation to the partition plate 20 and the rear cover plate. 3) There are heat dissipation fins 110 of the cold plate, heat dissipation fins 301 of the pipeline and heat dissipation fins 410 of the functional unit in the duct cavity V2 at the same time, which can greatly improve the utilization efficiency of the duct cavity V2.

[0045] Fourthly, it can accurately and intelligently dissipate heat from the antenna subarray unit and the functional module units and better ensure the temperature consistency of the antenna subarray unit. The measures taken include: 1) Through simulation and testing means, accurately locate the antenna subarray units and functional module units that need to be strengthened in heat dissipation by the loop heat pipe 30, and the heat dissipation fin density on the loop heat pipe 30. 2) Reasonably arrange the functional module units and the loop heat pipe 30, and the temperature of the antenna subarray unit and the functional module units can be finely adjusted. 3) By monitoring the temperature difference of the antenna subarray unit, the rotational speeds of the turbulent flow fan 222 and the external fan 212 can be controlled to reduce the temperature difference, so as to achieve the ability of accurate temperature control. The hardware required for the realization of the fan speed control function is integrated into the functional module unit. 4) Analyze and decouple the measured temperature and fan control data through an intelligent optimization algorithm to obtain the priority control method for accurate and intelligent heat dissipation.

[0046] Through the description of the specific implementation manners, it should be possible to understand more deeply and specifically the technical means and effects adopted by the present invention to achieve the predetermined purpose. However, the attached drawings are only for reference and illustration, and are not used to limit the present invention.

Claims

1. A multi-functional integrated array frame for air-cooled heat dissipation, characterized in that, Comprising: A soaking cold plate; A plurality of partition plates, spaced apart and provided on the soaking cold plate, the plurality of partition plates defining a plurality of chambers, including a plurality of installation chambers and a plurality of air duct chambers, the installation chambers and the air duct chambers being arranged in an alternating pattern; A loop heat pipe, provided on the partition plate, one end of the loop heat pipe being a pipeline heat dissipation fin extending into the air duct chamber, the other end of the loop heat pipe being located in the installation chamber and being attached to the device unit in the installation chamber.

2. A plurality of partition plates, spaced apart and provided on the soaking cold plate, the plurality of partition plates defining a plurality of chambers, including a plurality of installation chambers and a plurality of air duct chambers, the installation chambers and the air duct chambers being arranged in an alternating pattern; A loop heat pipe, provided on the partition plate, one end of the loop heat pipe being a pipeline heat dissipation fin extending into the air duct chamber, the other end of the loop heat pipe being located in the installation chamber and being attached to the device unit in the installation chamber.

3. The multi-functional integrated front frame for air-cooled heat dissipation according to claim 1, characterized in that The position of the soaking cold plate opposite to the air duct chamber is configured as a cold plate heat dissipation fin.

4. The multi-functional integrated front array frame for air-cooled heat dissipation according to claim 1, characterized in that, On one side of the partition plate facing the installation chamber, a side-mounted functional module unit is installed, and on one side of the partition plate facing the air duct chamber, a functional unit heat dissipation fin is provided, and the functional unit heat dissipation fin is connected to at least part of the side-mounted functional module unit.

5. The multi-functional integrated array frame for air-cooled heat dissipation according to claim 1, characterized in that The bottom wall of the installation chamber is provided with a flat-mounted functional module unit.

6. The multifunctional integrated array frame for air-cooled heat dissipation according to claim 1, wherein The partition plate includes a longitudinal partition plate and a transverse partition plate, the longitudinal partition plate being located between the installation chamber and the air duct chamber, and the transverse partition plate being located between two adjacent installation chambers.

7. The multi-functional integrated front frame for air-cooled heat dissipation according to claim 5, characterized in that The transverse partition plate is provided with an installation hole penetrating through two adjacent installation chambers, and a turbulent flow fan is provided at the installation hole.

8. The multifunctional integrated array frame for air-cooled heat dissipation according to claim 5, characterized in that The longitudinal partition plate is provided with an installation opening, and an external fan is provided at the installation opening.

9. The multifunctional integrated front frame for air-cooled heat dissipation according to claim 1, characterized in that, At least part of the air duct chamber is provided with a diversion frame, and a flow ventilation duct is defined between the diversion frame and the partition plate.

10. The multi-functional integrated array frame for air-cooled heat dissipation according to claim 1, characterized in that At least part of the air duct chamber is provided with a diversion block protruding from the bottom wall of the air duct chamber, and an internal wire slot communicating with the two sides of the installation chamber is provided in the diversion block.

11. The multi-functional integrated array frame for air-cooled heat dissipation according to any one of claims 1-9, characterized in that, The multi-functional integrated array frame is used for an antenna array, and an antenna element unit is installed on the side of the soaking cold plate facing away from the installation chamber.

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