A packaging device for a circuit substrate production with a guide mechanism

By combining the vacuum adsorption plate and magnet of the guiding mechanism, the problem of electromagnetic flipping being affected by current fluctuations is solved, realizing the automated flipping and stable transportation of circuit boards, and improving packaging efficiency and quality.

CN120379145BActive Publication Date: 2026-04-07CHENLONG GROUP +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-22
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

In the current circuit board manufacturing process, the electromagnetic flipping method is affected by current fluctuations, resulting in low circuit board flipping efficiency. In addition, manual flipping is inefficient, which affects packaging efficiency.

Method used

A guiding mechanism is adopted, including a vacuum adsorption plate, magnets and a flipping auxiliary mechanism. Through the combination of vacuum adsorption and magnetic adsorption, the circuit board flipping is automatically controlled, and a vibration generator and a limiting auxiliary plate are used to ensure stable transport and positioning of the circuit board.

Benefits of technology

It improves the packaging efficiency of circuit boards, avoids the impact of current fluctuations on electromagnetic flipping, realizes automated flipping and stable transportation, reduces manual intervention, and improves mechanical efficiency and packaging quality.

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Abstract

The application discloses a packaging device with a guide mechanism for circuit board production, and relates to the technical field of circuit board production packaging devices. The packaging device with the guide mechanism for the circuit board production comprises a base, a first supporting plate and a second supporting plate are fixedly connected to the top of the base through supporting rods, a guide mechanism is fixedly connected to the surface of the first supporting plate, a third supporting plate is also fixedly connected to the top of the base, and the inside of the third supporting plate is fixedly connected to. The packaging device with the guide mechanism for the circuit board production is provided with a vibration generator, and when the vibration generator reaches a turning position of a third conveying belt, the vibration generator is started to make the circuit board that has just been packaged in a limiting bearing box separate from the surface of the limiting bearing box, so that the circuit board is prevented from adhering to the surface of the limiting bearing box and affecting the subsequent transportation, and the efficiency of processing the circuit board is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board production packaging devices, in particular to a packaging device with a guide mechanism for circuit board production. BACKGROUND

[0002] Circuit board is an important component in electronic equipment, which plays a supporting, connecting and conducting role for electronic components. When the circuit board needs to shield external electromagnetic interference, ferrite material is often added in the form of a film or a patch on one side of the insulating material of the single-sided circuit board.

[0003] Refer to the invention patent with Chinese publication number "CN118434012A", the transmission mechanism further includes a fixed base, the present application utilizes one side of the single-sided board as a copper foil conductive layer and the other side as insulating material, when the two sides contact the transmission belt two, different phenomena will occur, one, the copper foil conductive layer faces the transmission belt two, at this time the transmission belt two generates a weak electromagnetic adsorption force through the electromagnetic ring, adsorbs the metal inside the copper foil conductive layer and carries the single-sided board for transmission, when the single-sided board reaches the transmission pipe, due to the influence of electromagnetic adsorption force, it will not immediately fall into the inside of the transmission pipe, but continue to move forward, and one end of the bottom of the single-sided board contacts the top of the rotating body.

[0004] However, the biggest problem facing the single-sided board before processing is that the staff needs to change the facing of the single-sided board to ensure that the copper foil conductive layer always faces the packaging device, while the side with added ferrite material is often away from the packaging device, manual turning over is low in efficiency, and the adsorption force of the electromagnetic ring on the opposite side assisted by the electrified electromagnetic ring will be affected by current fluctuations, affecting the efficiency of packaging. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides a packaging device with a guide mechanism for circuit board production to solve the problems raised in the background art.

[0006] To achieve the above purpose, the present application is implemented by the following technical scheme: a packaging device with a guide mechanism for circuit board production, comprising a base, the top of the base is fixedly connected with a first support plate and a second support plate through a support rod, the surface of the first support plate is fixedly connected with a guide mechanism, the top of the base is also fixedly connected with a third support plate, the inside of the third support plate is fixedly connected with a transportation mechanism, the surface of the third support plate is fixedly connected with a packaging mechanism, the surface of the second support plate is fixedly connected with a turnover auxiliary mechanism;

[0007] The guide mechanism comprises:

[0008] A first motor is fixedly connected to the surface of the first support plate.

[0009] The first conveying belt is rotationally connected to the surface of the output shaft rotationally connected inside the first motor, and a magnet is fixedly connected inside the first conveying belt.

[0010] Preferably, a second blocking scraper is fixedly connected to the surface of the first supporting plate, a first blocking scraper is fixedly connected inside the second supporting plate, a second motor is fixedly connected to the surface of the second supporting plate, a second conveying belt is rotationally connected inside the second motor through an output shaft, and a through hole is formed in the surface of the second conveying belt to form negative pressure when the circuit board is adsorbed.

[0011] Preferably, the guide mechanism further comprises vacuum adsorption plates, the vacuum adsorption plates are fixedly connected inside the second supporting plate, the number of the vacuum adsorption plates is five, a rectangular groove is formed in the bottom of each vacuum adsorption plate, and a through hole is formed in the inner wall of the rectangular groove.

[0012] Preferably, a branch pipe is fixedly connected to the top of each vacuum adsorption plate, a five-way electromagnetic valve is also fixedly connected to the top of each vacuum adsorption plate, a vacuum distributor is fixedly connected to the surface of the branch pipe, a main pipe is fixedly connected to the surface of the vacuum distributor, a vacuum pump is fixedly connected to the surface of the main pipe, the vacuum pump is arranged on the inner wall of the second supporting plate, and a photoelectric sensor is fixedly connected to the bottom of the second supporting plate.

[0013] Preferably, the transportation mechanism comprises a third motor, the third motor is fixedly connected to the surface of a third supporting plate, a third conveying belt is rotationally connected inside the third motor through an output shaft, a connecting block is fixedly connected to the surface of the third conveying belt, a limit bearing box is movably connected to the bottom of the connecting block, and a first spring is fixedly connected to the surface of the limit bearing box.

[0014] Preferably, a vibration generator is fixedly connected to the bottom of the limit bearing box, a supporting elastic plate is also fixedly connected to the bottom of the limit bearing box, a second spring is fixedly connected to the bottom of the supporting elastic plate, and the second spring is arranged between the third conveying belt and the limit bearing box.

[0015] Preferably, the packaging mechanism comprises an adjusting supporting beam, the adjusting supporting beam is fixedly connected to the surface of the third supporting plate, a fourth motor is fixedly connected to the top of the adjusting supporting beam, a sliding supporting plate is slidingly connected inside the fourth motor through an output shaft, the sliding supporting plate is slidingly connected inside the adjusting supporting beam, a telescopic machine is fixedly connected to the top of the sliding supporting plate, and a sealer is fixedly connected inside the telescopic machine.

[0016] Preferably, the turnover auxiliary mechanism comprises a fifth motor fixedly connected to the surface of the second support plate, an connecting rod fixedly connected to the inside of the fifth motor through an output shaft, a sliding block fixedly connected to the surface of the connecting rod and slidingly connected to the inside of the second support plate, and a limiting auxiliary plate fixedly connected to the surface of the sliding block.

[0017] The application provides a packaging device with a guiding mechanism for circuit board production.

[0018] 1. The packaging device with a guiding mechanism for circuit board production, by setting a plurality of vacuum adsorption plates, and by vacuum distributor and photoelectric sensor cooperation can control the vacuum adsorption, so that the vacuum adsorption plate in the circuit board through the adsorption, avoid the vacuum adsorption at the same time increase the burden of the second conveying belt rotation, improve the subsequent packaging efficiency, by setting a magnet on the surface of the first conveying belt, one side with ferrite material has strong magnetic attraction, and the other side has small magnetic adsorption force, and the vacuum pump cooperates to adsorb the circuit board on the surface of the second conveying belt, so as to facilitate the automatic turnover of the subsequent circuit board, compared with the traditional electromagnetic turnover mode, the problem of the electromagnetic ring adsorption force affected by current fluctuation leading to the circuit board can not be turned over is solved, and the subsequent packaging efficiency is improved.

[0019] 2. The packaging device with a guiding mechanism for circuit board production, by setting a limiting auxiliary plate, starting the fifth motor to drive the connecting rod and the sliding block to rotate, so as to drive the limiting auxiliary plate to rotate, avoid the problem of insufficient adsorption force of the circuit board when reaching the second conveying belt turning place, and the circuit board falls off, high mechanical efficiency and no manual intervention, and the turnover of the circuit board is guaranteed.

[0020] 3. The packaging device with a guiding mechanism for circuit board production, by setting a limiting bearing box, when the circuit board is conveyed to the surface of the limiting bearing box, the vibration generator is started, the starting of the vibration generator drives the limiting bearing box to vibrate at high frequency and low amplitude, so that the circuit board is not damaged and at the same time the circuit board is completely positioned in the groove opened on the surface of the limiting bearing box, facilitating subsequent packaging, and supporting the limiting bearing box, the circuit board in the limiting bearing box is more stable when vibrating, and the circuit board is buffered when sliding down from the second blocking scraper and the first blocking scraper, so as to avoid damage to the circuit board, thereby improving the subsequent packaging efficiency.

[0021] 4. The packaging device with a guiding mechanism for circuit board production, by setting a vibration generator, when the vibration generator reaches the turning point of the third conveyor belt, the vibration generator is activated to cause the circuit board that is just packaged inside the limiting carrier box to detach from the surface of the limiting carrier box, so as to avoid the circuit board adhering to the surface of the limiting carrier box and affecting the subsequent transportation, thereby improving the efficiency of processing circuit boards. Attached Figure Description

[0022] Figure 1 This is a front-view stereoscopic structural diagram of the present invention;

[0023] Figure 2 This is a cross-sectional view of the second conveyor belt of the present invention;

[0024] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle;

[0025] Figure 4 This is a schematic diagram of the flipping auxiliary mechanism of the present invention;

[0026] Figure 5 This is a schematic diagram of the guiding mechanism of the present invention;

[0027] Figure 6 This is a bottom view of the guiding mechanism of the present invention;

[0028] Figure 7 This is a schematic diagram of the transportation mechanism of the present invention;

[0029] Figure 8 For the present invention Figure 7 Enlarged view of point B in the middle;

[0030] Figure 9 This is a schematic diagram of the packaging mechanism of the present invention.

[0031] In the diagram: 1. Base; 2. First support plate; 3. Second support plate; 4. Third support plate; 5. Guide mechanism; 51. First motor; 52. First conveyor belt; 53. Magnet; 54. Second motor; 55. Second conveyor belt; 56. First blocking scraper; 57. Second blocking scraper; 58. Vacuum pump; 59. Main pipe; 510. Vacuum distributor; 511. Branch pipe; 512. Five-way solenoid valve; 513. Vacuum adsorption plate; 514. Rectangular groove; 515. Light 6. Electrical sensor; 61. Transport mechanism; 62. Third conveyor belt; 63. Third motor; 64. Limiting bearing box; 65. Connecting block; 66. First spring; 67. Second spring; 68. Vibration generator; 79. Support spring plate; 70. Packaging mechanism; 71. Adjustable support beam; 72. Fourth motor; 73. Telescopic mechanism; 74. Sliding support plate; 75. Sealer; 80. Tilting auxiliary mechanism; 81. Fifth motor; 82. Connecting rod; 83. Slider; 84. Limiting auxiliary plate. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0033] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0034] Example 1: Please refer to Figures 1-6 The present invention provides a technical solution: a packaging device with a guiding mechanism for circuit board production, including a base 1, a first support plate 2 and a second support plate 3 fixedly connected to the top of the base 1 by a support rod, a guiding mechanism 5 fixedly connected to the surface of the first support plate 2, a third support plate 4 fixedly connected to the top of the base 1, a transport mechanism 6 fixedly connected inside the third support plate 4, a packaging mechanism 7 fixedly connected to the surface of the third support plate 4, and a flipping auxiliary mechanism 8 fixedly connected to the surface of the second support plate 3.

[0035] Guiding mechanism 5 includes:

[0036] The first motor 51 is fixedly connected to the surface of the first support plate 2;

[0037] The first conveyor belt 52 is rotatably connected to the surface of the output shaft inside the first motor 51, and a magnet 53 is fixedly connected inside the first conveyor belt 52.

[0038] A second blocking scraper 57 is fixedly connected to the surface of the first support plate 2, a first blocking scraper 56 is fixedly connected to the inside of the second support plate 3, a second motor 54 is fixedly connected to the surface of the second support plate 3, and a second conveyor belt 55 is rotatably connected to the inside of the second motor 54 through an output shaft. The surface of the second conveyor belt 55 is provided with through holes to form a negative pressure when adsorbing the circuit board.

[0039] The guide mechanism 5 also includes a vacuum adsorption plate 513, which is fixedly connected inside the second support plate 3. There are five vacuum adsorption plates 513. A rectangular groove 514 is provided at the bottom of the vacuum adsorption plate 513, and a through hole is provided on the inner wall of the rectangular groove 514.

[0040] A branch pipe 511 is fixedly connected to the top of the vacuum adsorption plate 513. A five-way solenoid valve 512 is also fixedly connected to the top of the vacuum adsorption plate 513. A vacuum distributor 510 is fixedly connected to the surface of the branch pipe 511. A main pipe 59 is fixedly connected to the surface of the vacuum distributor 510. A vacuum pump 58 is fixedly connected to the surface of the main pipe 59. The vacuum pump 58 is located on the inner wall of the second support plate 3. A photoelectric sensor 515 is fixedly connected to the bottom of the second support plate 3.

[0041] In use, the first motor 51 is started first. The start of the first motor 51 drives the first conveyor belt 52 to rotate through the output shaft. The circuit board transported to the surface of the first conveyor belt 52 moves in the direction of the second motor 54 under the start of the first motor 51. At the same time, the vacuum pump 58 is started. The start of the vacuum pump 58 is connected to the photoelectric sensor 515 and the five-way solenoid valve 512 through the pipeline to make one of the vacuum adsorption plates 513 have vacuum adsorption force. When a circuit board is transported to the photoelectric sensor 515 that is furthest away from the second blocking scraper 57, the vacuum adsorption plate 513 that is furthest away from the second blocking scraper 57 has suction force. The other photoelectric sensors 515 and the five-way solenoid valve 512 cooperate in the same way. The second motor 54 is started, which drives the second conveyor belt 55 to rotate. At this time, the circuit board with ferrite material added has a strong magnetic attraction to the magnet 53. Although the photoelectric sensor 515 detects the presence of the circuit board, it is not strong enough to lift it. In this case, the circuit board continues to be transported with the rotation of the first conveyor belt 52. When it reaches the turning point of the first conveyor belt 52, the circuit board is lifted up, making it easier for the second blocking scraper 57 to carry it to the next step. The circuit board without ferrite material added has a weak magnetic attraction to the magnet 53. After the photoelectric sensor 515 detects it, it controls the five-way solenoid valve 512, which is sufficient to lift the circuit board. As the second conveyor belt 55 rotates, the circuit board moves in the opposite direction to the circuit board on the surface of the first conveyor belt 52, and moves in the direction of the flipping auxiliary mechanism 8. When it reaches the position of the limiting auxiliary plate 84, the fifth motor 81 is started to drive the connecting rod 82 to rotate together with the limiting auxiliary plate 84, so that the limiting auxiliary plate 84 supports the circuit board, making it easier for the circuit board to be transported to the top of the second conveyor belt 55. Then the circuit board moves in the direction of the first blocking scraper 56. When it reaches the turning point of the second conveyor belt 55, it slides down the surface of the second blocking scraper 57 and the first blocking scraper 56 to the surface of the limiting carrier box 63 in the same way as when the circuit board reaches the turning point of the first conveyor belt 52.

[0042] By setting multiple vacuum adsorption plates 513, and cooperating with a vacuum distributor 510 and a photoelectric sensor 515, vacuum adsorption can be controlled separately. This allows the vacuum adsorption plates 513 to adsorb the circuit board as it passes by, avoiding the burden on the rotation of the second conveyor belt 55 caused by simultaneous vacuum adsorption, thus improving the subsequent packaging efficiency. By setting a magnet 53 on the surface of the first conveyor belt 52, the side with added ferrite material has a strong magnetic attraction to the magnet 53, while the other side has a weaker magnetic attraction. In cooperation with the vacuum pump 58, it is easy to adsorb the circuit board on the side with the weaker magnetic attraction onto the surface of the second conveyor belt 55, thereby facilitating the automatic flipping of the circuit board. Compared with the traditional electromagnetic flipping method, this solves the problem that the adsorption force of the electromagnetic ring is affected by current fluctuations, which prevents the circuit board from flipping, thus improving the subsequent packaging efficiency.

[0043] Example 2: Please refer to Figures 1-9 Based on Embodiment 1, the present invention provides a technical solution:

[0044] The transport mechanism 6 includes a third motor 62, which is fixedly connected to the surface of the third support plate 4. The third motor 62 is rotatably connected to a third conveyor belt 61 through an output shaft. A connecting block 64 is fixedly connected to the surface of the third conveyor belt 61. A limiting bearing box 63 is movably connected to the bottom of the connecting block 64. A first spring 65 is fixedly connected to the surface of the limiting bearing box 63.

[0045] A vibration generator 67 is fixedly connected to the bottom of the limiting bearing box 63. A support spring plate 68 is also fixedly connected to the bottom of the limiting bearing box 63. A second spring 66 is fixedly connected to the bottom of the support spring plate 68, and the second spring 66 is located between the third conveyor belt 61 and the limiting bearing box 63.

[0046] The encapsulation mechanism 7 includes an adjusting support beam 71, which is fixedly connected to the surface of the third support plate 4. A fourth motor 72 is fixedly connected to the top of the adjusting support beam 71. A sliding support plate 74 is slidably connected inside the fourth motor 72 via an output shaft. The sliding support plate 74 is slidably connected inside the adjusting support beam 71. A telescopic mechanism 73 is fixedly connected to the top of the sliding support plate 74. A sealer 75 is fixedly connected inside the telescopic mechanism 73 via an output shaft.

[0047] The flipping auxiliary mechanism 8 includes a fifth motor 81, which is fixedly connected to the surface of the second support plate 3. A connecting rod 82 is fixedly connected to the inside of the fifth motor 81 through an output shaft. A slider 83 is fixedly connected to the surface of the connecting rod 82, and the slider 83 is slidably connected to the inside of the second support plate 3. A limit auxiliary plate 84 is fixedly connected to the surface of the slider 83.

[0048] In use, after the circuit board slides onto the surface of the limiting support box 63, the vibration generator 67 is activated. The vibration of the vibration generator 67 causes the limiting support box 63 to vibrate at a high frequency and low amplitude, so that the circuit board falls completely into the groove opened on the surface of the limiting support box 63 to complete the positioning. Then, the third motor 62 is activated. The activation of the third motor 62 drives the third conveyor belt 61 to rotate through the output shaft, thereby transporting the circuit board to the bottom of the sealer 75. After reaching the bottom of the sealer 75, the fourth motor 72 is activated. The activation of the fourth motor 72 drives the sliding support plate 74 to move to the bottom. Then, the telescopic machine 73 is activated. The activation of the telescopic machine 73 drives the sealer 75 to move to the bottom surface of the circuit board to complete the sealing. After the sealing is completed, the circuit board continues to be transported to the turning point of the third conveyor belt 61. At the same time, the vibration generator 67 is activated again to vibrate, so as to facilitate the detachment of the circuit board for collection.

[0049] By setting a limit auxiliary plate 84, the fifth motor 81 is started and drives the connecting rod 82 and the slider 83 to rotate through the output shaft, thereby driving the limit auxiliary plate 84 to rotate. This avoids the problem of the circuit board slipping due to insufficient adsorption force when it reaches the turning point of the second conveyor belt 55. The mechanical efficiency is high and no manual intervention is required, ensuring the rotation of the circuit board.

[0050] When the circuit board is transported to the surface of the limiting carrier box 63, the vibration generator 67 is activated. The activation of the vibration generator 67 causes the limiting carrier box 63 to vibrate at a high frequency and low amplitude. This ensures that the circuit board is completely positioned in the groove opened on the surface of the limiting carrier box 63 without damaging it, which facilitates subsequent packaging. Furthermore, a support spring plate 68 is set at the bottom of the limiting carrier box 63. This supports the limiting carrier box 63 and makes the circuit board inside the limiting carrier box 63 more stable during vibration. It also buffers the circuit board when it slides down from the second blocking scraper 57 and the first blocking scraper 56, preventing damage to the circuit board and improving the subsequent packaging efficiency.

[0051] By setting up a vibration generator 67, when the vibration generator 67 reaches the turning point of the third conveyor belt 61, the vibration generator 67 is activated to cause the circuit board that is just encapsulated inside the limiting carrier box 63 to detach from the surface of the limiting carrier box 63, thereby preventing the circuit board from adhering to the surface of the limiting carrier box 63 and affecting the subsequent transportation, thus improving the efficiency of processing the circuit board.

[0052] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A packaging device with a guiding mechanism for circuit board manufacturing, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a first support plate (2) and a second support plate (3) via a support rod. A guide mechanism (5) is fixedly connected to the surface of the first support plate (2). A third support plate (4) is also fixedly connected to the top of the base (1). A transport mechanism (6) is fixedly connected inside the third support plate (4). A sealing mechanism (7) is fixedly connected to the surface of the third support plate (4). A flipping auxiliary mechanism (8) is fixedly connected to the surface of the second support plate (3). The guiding mechanism (5) includes: The first motor (51) is fixedly connected to the surface of the first support plate (2); The first conveyor belt (52) is rotatably connected to the surface of the output shaft inside the first motor (51), and a magnet (53) is fixedly connected inside the first conveyor belt (52). A second blocking scraper (57) is fixedly connected to the surface of the first support plate (2), a first blocking scraper (56) is fixedly connected to the inside of the second support plate (3), a second motor (54) is fixedly connected to the surface of the second support plate (3), a second conveyor belt (55) is rotatably connected to the inside of the second motor (54) through the output shaft, and a through hole is opened on the surface of the second conveyor belt (55) to form a negative pressure when adsorbing the circuit board. The guiding mechanism (5) also includes a vacuum adsorption plate (513), which is fixedly connected to the inside of the second support plate (3). There are five vacuum adsorption plates (513). A rectangular groove (514) is opened at the bottom of the vacuum adsorption plate (513), and a through hole is opened on the inner wall of the rectangular groove (514). A branch pipe (511) is fixedly connected to the top of the vacuum adsorption plate (513), and a five-way solenoid valve (512) is also fixedly connected to the top of the vacuum adsorption plate (513). A vacuum distributor (510) is fixedly connected to the surface of the branch pipe (511), and a main pipe (59) is fixedly connected to the surface of the vacuum distributor (510). A vacuum pump (58) is fixedly connected to the surface of the main pipe (59), and the vacuum pump (58) is located on the inner wall of the second support plate (3). A photoelectric sensor (515) is fixedly connected to the bottom of the second support plate (3).

2. The packaging apparatus with a guiding mechanism for circuit board production according to claim 1, characterized in that: The transport mechanism (6) includes a third motor (62), which is fixedly connected to the surface of the third support plate (4). The interior of the third motor (62) is rotatably connected to a third conveyor belt (61) via an output shaft. A connecting block (64) is fixedly connected to the surface of the third conveyor belt (61). A limiting bearing box (63) is movably connected to the bottom of the connecting block (64). A first spring (65) is fixedly connected to the surface of the limiting bearing box (63).

3. A packaging device with a guiding mechanism for circuit board production according to claim 2, characterized in that: A vibration generator (67) is fixedly connected to the bottom of the limiting bearing box (63), and a support spring plate (68) is also fixedly connected to the bottom of the limiting bearing box (63). A second spring (66) is fixedly connected to the bottom of the support spring plate (68), and the second spring (66) is located between the third conveyor belt (61) and the limiting bearing box (63).

4. A packaging apparatus with a guiding mechanism for circuit board production according to claim 1, characterized in that: The encapsulation mechanism (7) includes an adjusting support beam (71), which is fixedly connected to the surface of the third support plate (4). A fourth motor (72) is fixedly connected to the top of the adjusting support beam (71). A sliding support plate (74) is slidably connected inside the fourth motor (72) through its output shaft. The sliding support plate (74) is slidably connected inside the adjusting support beam (71). A telescopic mechanism (73) is fixedly connected to the top of the sliding support plate (74). A sealer (75) is fixedly connected inside the telescopic mechanism (73) through its output shaft.

5. A packaging apparatus with a guiding mechanism for circuit board production according to claim 1, characterized in that: The flipping auxiliary mechanism (8) includes a fifth motor (81), which is fixedly connected to the surface of the second support plate (3). A connecting rod (82) is fixedly connected inside the fifth motor (81) through an output shaft. A slider (83) is fixedly connected to the surface of the connecting rod (82), and the slider (83) is slidably connected inside the second support plate (3). A limit auxiliary plate (84) is fixedly connected to the surface of the slider (83).

Citation Information

Patent Citations

  • Packaging device for production of high-thermal-conductivity metal substrate

    CN113594083A

  • Packaging device with guide mechanism for circuit substrate production

    CN118434012A