Wireless connection structure based on laminated module

Abstract

The invention relates to the technical field of lamination modules, and discloses a lamination module-based wireless connection structure, which comprises a lamination module body, a sliding plate is connected to the bottom of the lamination module body, a pull groove is formed in the front of the top of the sliding plate, and a mounting plate is slidably connected to the outer wall of the sliding plate. Supporting columns are fixedly connected to the four corners of the bottom of the mounting plate correspondingly, a shell is arranged outside the lamination module body, and the bottom ends of the supporting columns are fixedly connected with the inner wall of the bottom of the shell. Wireless interconnection is achieved through the arranged lamination module body, the lamination module is smaller in size and higher in power density, an electric signal loop of the lamination module is shorter, bonding wires are replaced by signal connecting parts, parasitic inductance of the module becomes smaller, loss is reduced, reliability is improved, and the reliability of the module is improved. The loss of the silicon carbide power module is reduced, and the power density and reliability of the module are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of stacked modules, and particularly to a wireless connection structure based on a stacked module. Background Art

[0002] With the development of electronic industries such as electric vehicles, the third-generation wide bandgap semiconductors represented by silicon carbide have attracted much attention due to their excellent performance. The application requirements of power modules have gradually increased, and power modules are developing towards smaller size and higher power density. At the same time, the high-frequency characteristics and high switching speed of silicon carbide chips pose higher requirements for the packaging form and process of power modules. Traditional power modules usually adopt the wire bonding process. Although it is a mature and low-cost connection method, the size and number of bonding wires affect the current-carrying capacity and parasitic inductance of the module. The bonding wires require a certain wire bonding length and wire arc height, and the reliability of the bonding wires and bonding points under temperature cycling also limits the reliability of the module. Therefore, in silicon carbide power modules, the wire bonding process has become a bottleneck item in the module, so a wireless connection structure based on a stacked module is proposed to solve the above-mentioned problems. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a wireless connection structure based on a stacked module for the deficiencies in the above-mentioned prior art.

[0004] To solve the above technical problem, the technical solution adopted by the present invention is: A wireless connection structure based on a stacked module, including a stacked module body. A sliding plate is connected to the bottom of the stacked module body. A pulling groove is opened in the front of the top of the sliding plate. An installation plate is slidably connected to the outer wall of the sliding plate. Four corners of the bottom of the installation plate are respectively fixedly connected with support columns. An outer shell is arranged outside the stacked module body. The bottom ends of the support columns are fixedly connected with the inner wall of the bottom of the outer shell. An installation opening is opened in the front of the outer shell. The front end of the sliding plate extends to the installation opening. A connection opening is opened in the back of the outer shell. A limiting mechanism is arranged on the sliding plate; The stacked module body includes: an insulating substrate, which is connected to the top of the sliding plate. A third connection layer is connected to the insulating substrate. A signal connection component is connected to the third connection layer. A second connection layer is connected to the signal connection component. A chip is connected to the second connection layer. A first connection layer is connected to the chip. A signal lead-out component is connected to the first connection layer; The limiting mechanism includes: a second installation groove which is opened at the bottom of the sliding plate. The inner wall of the back surface of the second installation groove is fixedly connected with a spring. The front end of the spring is fixedly connected with a connecting block. The front surface of the connecting block is fixedly connected with a pull rod. The front end of the pull rod penetrates through the sliding plate and extends forward. The pull rod is slidably connected with the sliding plate. The inner walls of the top of the second installation groove are relatively fixedly connected with two guide sleeves. The inner wall of each guide sleeve is slidably connected with a plug rod, and the plug rod is inserted into the installation plate. The left and right sides of the connecting block are respectively hinged with hinge arms, and the mutually remote ends of the two hinge arms are respectively hinged with the two plug rods.

[0005] Preferably, a first installation groove is opened at the top of the installation plate. The sliding plate is slidably connected in the first installation groove. The inner walls of the left and right sides of the first installation groove are respectively provided with insertion slots, and the mutually remote ends of the two plug rods are respectively inserted into the two insertion slots.

[0006] Preferably, a heat dissipation mechanism is arranged on the outer shell. The heat dissipation mechanism includes: a heat dissipation fan and heat dissipation holes. The heat dissipation fan is connected to the inner wall of the left side of the outer shell, and the heat dissipation holes are opened on the inner wall of the right side of the outer shell.

[0007] Preferably, the heat dissipation mechanism further includes: a lead screw which is rotatably connected to the inner wall of the front surface of the outer shell through a bearing and is located below the installation plate. A slide bar is threadedly connected to the outer wall of the lead screw. The top of the slide bar is relatively fixedly connected with two blocking plates, and the mutually remote sides of the two blocking plates are respectively in contact with the inner walls of the left and right sides of the outer shell.

[0008] Preferably, a micro motor is connected to the inner wall of the bottom of the outer shell. The rear end of the lead screw is fixedly connected with the output end of the micro motor through a coupling.

[0009] Preferably, limiting grooves are respectively opened on the inner walls of the left and right sides of the outer shell. The left and right sides of the slide bar are respectively slidably connected with the two limiting grooves.

[0010] Preferably, a dust prevention mechanism is arranged on the outer shell. The dust prevention mechanism includes: two slide rods which are respectively slidably connected to the inner walls of the front and rear sides of the heat dissipation holes. The two slide rods are both in an "L" shape and are arranged oppositely. The right ends of the two slide rods are fixedly connected with a frame. The left side of the frame is in contact with the outer wall of the outer shell. A dust prevention net is fixedly connected to the inner wall of the frame. A first pulling plate is fixedly connected to the upper right side of the frame.

[0011] Preferably, sliding grooves are respectively opened on the inner walls of the front and rear sides of the heat dissipation holes. The two sliding grooves are both in an inverted "L" shape. The mutually remote ends of the two slide rods are respectively slidably connected in the two sliding grooves.

[0012] Preferably, an infrared temperature measurement module is connected to the top of the mounting plate, and a single-chip microcomputer is connected to the top of the mounting plate.

[0013] Preferably, a plugging mechanism is provided on the outer shell. The plugging mechanism includes: a sliding frame fixedly connected above the front of the outer shell. The sliding frame is arranged in an inverted "U" shape. A baffle is slidably connected to the inner cavity of the sliding frame. The back of the baffle is attached to the front of the outer shell and is located at the installation opening. A second pull plate is fixedly connected above the front of the baffle. A first magnet block is embedded in the top of the baffle. A second magnet block is embedded in the inner side of the top of the sliding frame. The second magnet block and the first magnet block attract each other with opposite polarities.

[0014] The present invention adopts the above technical solutions and can bring the following beneficial effects: 1. For the wireless connection structure based on the stacked module, wireless interconnection is realized through the provided stacked module body. The stacked module has a smaller size, a higher power density, a shorter electrical signal loop, and signal connection components replace bonding wires, making the parasitic inductance of the module smaller, the loss reduced, and the reliability improved. It reduces the loss of the silicon carbide power module, improves the power density and reliability of the module. By pressing the pull rod to drive the connection block to move and compress the spring, the connection block drives the articulated arm to rotate around the hinge point and drives the insertion rod to slide along the inner wall of the guide sleeve, so that the insertion rod disengages from the insertion slot, thus releasing the limit on the sliding plate. By pulling the sliding plate along the inner wall of the first installation groove through the provided pull groove, the sliding plate and the stacked module body are withdrawn from the installation opening of the outer shell, which is convenient for the maintenance and installation of the stacked module body and improves the convenience.

[0015] 2. For the wireless connection structure based on the stacked module, by starting the cooling fan to blow cold air into the outer shell, the hot air is discharged through the heat dissipation holes, taking away the heat generated when the stacked module body works, ensuring that it works within a suitable temperature range, improving the performance and stability of the module, and extending the service life of the module. By starting the micro motor to drive the screw rod to rotate, the screw rod drives the sliding strip to move horizontally under the restriction of the limit groove, and then the sliding strip drives the plugging plate to move, so as to adjust the sizes of the heat dissipation holes and the air inlet of the cooling fan, and can be timely closed when heat dissipation is not required to prevent excessive dust from entering, realizing the intelligent adjustment of heat dissipation.

[0016] 3. For the wireless connection structure based on the stacked module, the provided dust-proof net prevents dust from entering the outer shell, avoiding the influence of dust accumulation on the stacked module body, such as affecting the heat dissipation effect and causing the decline of electrical performance, etc., improving the reliability and stability of the module. By pulling up the first pull plate to make the sliding rod slide along the inner wall of the sliding groove, the sliding rod drives the frame and the dust-proof net to move and disengage from the outer shell, so that the dust-proof net can be conveniently withdrawn for cleaning or replacement, and the operation is simple and convenient.

[0017] 4. The wireless connection structure based on a stacked module prevents dust, foreign objects, etc. from entering the interior of the housing through the provided baffle plate blocking the installation opening, protecting the stacked module body and the internal structure, improving the protection performance of the device. By pulling the second pull plate to move the baffle plate upward and using the attraction between the first magnet block and the second magnet block to fix the baffle plate, the installation opening is thus opened, facilitating the installation and disassembly of the sliding plate and the stacked module body, and improving the usability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a front structural schematic diagram of the present invention; Figure 2 is a front sectional view of the present invention; Figure 3 is a top sectional view of the present invention; Figure 4 is a right sectional view of the present invention; Figure 5 is a structural schematic diagram of the sliding plate of the present invention; Figure 6 is a bottom view of the limiting mechanism of the present invention; Figure 7 is a left view of the dust-proof mechanism of the present invention; Figure 8 is a structural schematic diagram of the housing of the present invention.

[0019] In the figures: 1. Stacked module body; 101. Signal lead-out component; 102. First connection layer; 103. Chip; 104. Second connection layer; 105. Signal connection component; 106. Third connection layer; 107. Insulating substrate; 2. Sliding plate; 201. Pulling groove; 3. Mounting plate; 301. First mounting groove; 4. Support column; 5. Housing; 6. Limiting mechanism; 601. Second mounting groove; 602. Spring; 603. Connecting block; 604. Pull rod; 605. Guide sleeve; 606. Insert rod; 607. Hinge arm; 7. Heat dissipation mechanism; 701. Heat dissipation fan; 702. Heat dissipation hole; 703. Lead screw; 704. Slide bar; 705. Sealing plate; 706. Micro motor; 707. Limiting groove; 8. Dust-proof mechanism; 801. Slide rod; 802. Frame; 803. Dust-proof net; 804. First pull plate; 805. Chute; 9. Sealing mechanism; 901. Slide frame; 902. Baffle plate; 903. Second pull plate; 10. Infrared temperature measurement module; 11. Single-chip microcomputer. DETAILED DESCRIPTION OF THE INVENTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention.

[0022] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "setting" should be understood in a broad sense. For example, it can be fixedly connected and set, or detachably connected and set, or integrally connected and set. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a number of" means two or more unless otherwise specifically defined.

[0024] Please refer to Figure 1-8, an embodiment of the present invention is: a wireless connection structure based on a stacked module, including a stacked module body 1. A sliding plate 2 is connected to the bottom of the stacked module body 1. A pulling groove 201 is opened in the front of the top of the sliding plate 2. An installation plate 3 is slidably connected to the outer wall of the sliding plate 2. Four corners of the bottom of the installation plate 3 are respectively fixedly connected with support columns 4. An outer shell 5 is arranged outside the stacked module body 1. The bottom ends of the support columns 4 are fixedly connected with the inner wall of the bottom of the outer shell 5. An installation opening is opened on the front of the outer shell 5. The front end of the sliding plate 2 extends to the installation opening. The connection of the sliding plate 2, the stacked module body 1 and the installation plate 3 is facilitated through the provided installation opening. A connection port is opened on the back of the outer shell 5. The signal connection between the stacked module body 1 and external devices is facilitated through the provided connection port. A limiting mechanism 6 is arranged on the sliding plate 2; The stacked module body 1 includes: an insulating substrate 107, the insulating substrate 107 is connected to the top of the sliding plate 2. A third connection layer 106 is connected to the insulating substrate 107. A signal connection component 105 is connected to the third connection layer 106. A second connection layer 104 is connected to the signal connection component 105. A chip 103 is connected to the second connection layer 104. A first connection layer 102 is connected to the chip 103. A signal lead-out component 101 is connected to the first connection layer 102. Wireless interconnection is realized through the provided stacked module body 1. The size of the stacked module is smaller, the power density is higher, the electrical signal loop of the stacked module is shorter, and the signal connection component 105 replaces the bonding wire, making the parasitic inductance of the module smaller, the loss reduced, and the reliability improved, reducing the loss of the silicon carbide power module, improving the power density and reliability of the module;The limiting mechanism 6 includes: a second mounting groove 601 which is opened at the bottom of the sliding plate 2. The inner wall of the back surface of the second mounting groove 601 is fixedly connected with a spring 602. The front end of the spring 602 is fixedly connected with a connecting block 603. The front surface of the connecting block 603 is fixedly connected with a pull rod 604. The front end of the pull rod 604 penetrates through the sliding plate 2 and extends forward. The pull rod 604 is slidably connected with the sliding plate 2. The opposite inner walls of the top of the second mounting groove 601 are fixedly connected with two guide sleeves 605. The inner wall of each guide sleeve 605 is slidably connected with a plug rod 606, and the plug rod 606 is inserted into the mounting plate 3. A first mounting groove 301 is opened at the top of the mounting plate 3. The sliding plate 2 is slidably connected in the first mounting groove 301. Slots are respectively opened on the left and right inner walls of the first mounting groove 301. The opposite ends of the two plug rods 606 are respectively inserted into the two slots. The left and right sides of the connecting block 603 are respectively hinged with hinge arms 607. The opposite ends of the two hinge arms 607 are respectively hinged with the two plug rods 606. By pressing the pull rod 604 to drive the connecting block 603 to move and compress the spring 602, the connecting block 603 drives the hinge arms 607 to rotate around the hinge point and drives the plug rod 606 to slide along the inner wall of the guide sleeve 605, so that the plug rod 606 is disengaged from the slot, thereby releasing the limit on the sliding plate 2. By pulling the sliding plate 2 along the inner wall of the first mounting groove 301 through the provided pulling groove 201, the sliding plate 2 and the stacked module body 1 are withdrawn from the mounting opening of the housing 5, which facilitates the maintenance and installation of the stacked module body 1 and improves the convenience.

[0025] Working principle: Wireless interconnection is realized through the provided stacked module body 1. The stacked module has a smaller size, a higher power density, a shorter electrical signal loop, and the signal connection component 105 replaces the bonding wire, making the parasitic inductance of the module smaller, the loss reduced, and the reliability improved. By pressing the pull rod 604 to drive the connecting block 603 to move and compress the spring 602, the connecting block 603 drives the hinge arms 607 to rotate around the hinge point and drives the plug rod 606 to slide along the inner wall of the guide sleeve 605, so that the plug rod 606 is disengaged from the slot, thereby releasing the limit on the sliding plate 2. Then, by pulling the sliding plate 2 along the inner wall of the first mounting groove 301 through the provided pulling groove 201, the sliding plate 2 and the stacked module body 1 are withdrawn from the mounting opening of the housing 5, which facilitates the maintenance and installation of the stacked module body 1.

[0026] Please refer to Figure 1-8, on the basis of the above embodiments, in another embodiment of the present invention, a heat dissipation mechanism 7 is provided on the outer shell 5. The heat dissipation mechanism 7 includes: a heat dissipation fan 701 and heat dissipation holes 702. The heat dissipation fan 701 is connected to the left inner wall of the outer shell 5, and the heat dissipation holes 702 are opened on the right inner wall of the outer shell 5. By starting the heat dissipation fan 701, cold air is blown into the outer shell 5, and the hot air is discharged through the heat dissipation holes 702, taking away the heat generated when the laminated module body 1 works, ensuring that it works within a suitable temperature range, improving the performance and stability of the module, and extending the service life of the module. The heat dissipation mechanism 7 further includes: a lead screw 703. The lead screw 703 is rotatably connected to the front inner wall of the outer shell 5 through a bearing and is located below the mounting plate 3. A slide bar 704 is threadedly connected to the outer wall of the lead screw 703. Two blocking plates 705 are relatively fixedly connected to the top of the slide bar 704, and the two sides of the two blocking plates 705 away from each other are respectively attached to the left and right inner walls of the outer shell 5. The bottom inner wall of the outer shell 5 is connected with a micro motor 706. The rear end of the lead screw 703 is fixedly connected to the output end of the micro motor 706 through a coupling. Limiting grooves 707 are respectively opened on the left and right inner walls of the outer shell 5. The left and right sides of the slide bar 704 are respectively slidably connected to the two limiting grooves 707. The slide bar 704 is limited by the limiting grooves 707, so that the rotational movement of the slide bar 704 is converted into a horizontal movement. By starting the micro motor 706 to drive the lead screw 703 to rotate, the lead screw 703 drives the slide bar 704 to move horizontally under the restriction of the limiting grooves 707, and then the slide bar 704 drives the blocking plate 705 to move, so as to adjust the sizes of the heat dissipation holes 702 and the air inlet of the heat dissipation fan 701, and it can be closed in time when heat dissipation is not required to prevent excessive dust from entering, realizing the intelligent adjustment of heat dissipation; an infrared temperature measurement module 10 is connected to the top of the mounting plate 3, and a single chip microcomputer 11 is connected to the top of the mounting plate 3. The temperature of the laminated module body 1 can be monitored in real time through the provided infrared temperature measurement module 10, and the temperature data is transmitted to the single chip microcomputer 11. The single chip microcomputer 11 controls the operation of the heat dissipation fan 701 and the micro motor 706 according to the preset temperature threshold, realizing the intelligent control of the heat dissipation mechanism 7;A dust-proof mechanism 8 is provided on the outer shell 5. The dust-proof mechanism 8 includes: two sliding rods 801 which are respectively slidably connected to the front and rear inner walls of the heat dissipation holes 702. The two sliding rods 801 are both in an "L" shape and are arranged oppositely. The right ends of the two sliding rods 801 are fixedly connected to a frame 802. The left side of the frame 802 is in contact with the outer wall of the outer shell 5. A dust-proof net 803 is fixedly connected to the inner wall of the frame 802. A first pulling plate 804 is fixedly connected to the upper right side of the frame 802. Chute grooves 805 are respectively formed in the front and rear inner walls of the heat dissipation holes 702. The two chute grooves 805 are both arranged in an inverted "L" shape. The mutually remote ends of the two sliding rods 801 are respectively slidably connected in the two chute grooves 805. By providing the dust-proof net 803, dust is prevented from entering the outer shell 5, avoiding the influence of dust accumulation on the laminated module body 1, such as affecting the heat dissipation effect and causing a decline in electrical performance, etc., improving the reliability and stability of the module. By pulling up the first pulling plate 804, the sliding rods 801 slide along the inner walls of the chute grooves 805. The movement of the sliding rods 801 drives the frame 802 and the dust-proof net 803 to move and separate from the outer shell 5, so that the dust-proof net 803 can be conveniently pulled out for cleaning or replacement, and the operation is simple and convenient.

[0027] Working principle: The infrared temperature measurement module 10 provided can monitor the temperature of the laminated module body 1 in real time and transmit the temperature data to the single-chip microcomputer 11. The single-chip microcomputer 11 controls the operation of the heat dissipation fan 701 and the micro motor 706 according to the preset temperature threshold, realizing the intelligent control of the heat dissipation mechanism 7. By starting the heat dissipation fan 701, cold air is blown into the outer shell 5, and the hot air is discharged through the heat dissipation holes 702, taking away the heat generated when the laminated module body 1 works, ensuring that it works within a suitable temperature range. By starting the micro motor 706 to drive the lead screw 703 to rotate, the lead screw 703 drives the slider 704 to move horizontally under the restriction of the limit groove 707, and then the slider 704 drives the blocking plate 705 to move, thereby adjusting the sizes of the heat dissipation holes 702 and the air inlet of the heat dissipation fan 701, which can be timely closed when heat dissipation is not required to prevent excessive dust from entering, realizing the intelligent adjustment of heat dissipation. By providing the dust-proof net 803, dust is prevented from entering the outer shell 5, avoiding the influence of dust accumulation on the laminated module body 1, such as affecting the heat dissipation effect and causing a decline in electrical performance, etc. By pulling up the first pulling plate 804, the sliding rods 801 slide along the inner walls of the chute grooves 805. The movement of the sliding rods 801 drives the frame 802 and the dust-proof net 803 to move and separate from the outer shell 5, so that the dust-proof net 803 can be conveniently pulled out for cleaning or replacement.

[0028] Please refer to Figure 1-8, on the basis of the above embodiments, in another embodiment of the present invention, a blocking mechanism 9 is provided on the outer shell 5. The blocking mechanism 9 includes: a carriage 901, which is fixedly connected above the front of the outer shell 5. The carriage 901 is arranged in an inverted "U" shape. A baffle 902 is slidably connected in the inner cavity of the carriage 901. The back of the baffle 902 is attached to the front of the outer shell 5 and is located at the installation opening. A second pulling plate 903 is fixedly connected above the front of the baffle 902. A first magnet block is embedded in the top of the baffle 902, and a second magnet block is embedded in the inner side of the top of the carriage 901. The second magnet block and the first magnet block attract each other with opposite polarities. By providing the baffle 902 to block the installation opening, it prevents dust, foreign objects, etc. from entering the interior of the outer shell 5, protects the laminated module body 1 and the internal structure, and improves the protection performance of the device. By pulling the second pulling plate 903 to move the baffle 902 upward and using the opposite-polarity attraction of the first magnet block and the second magnet block to fix the baffle 902, the installation opening is opened, facilitating the installation and disassembly of the slide plate 2 and the laminated module body 1, and improving the convenience of use.

[0029] Working principle: By providing the baffle 902 to block the installation opening, it prevents dust, foreign objects, etc. from entering the interior of the outer shell 5, protects the laminated module body 1 and the internal structure. By pulling the second pulling plate 903 to move the baffle 902 upward and using the opposite-polarity attraction of the first magnet block and the second magnet block to fix the baffle 902, the installation opening is opened, facilitating the installation and disassembly of the slide plate 2 and the laminated module body 1.

[0030] It should be noted that the above-mentioned heat dissipation fan 701, micro motor 706, infrared temperature measurement module 10, and single-chip microcomputer 11 in the above embodiments are all commonly used devices in the prior art. The models and the like adopted can be customized according to actual usage requirements. Moreover, the power supply interface of the electrical equipment in the present invention is connected to the power supply system through a switch (not shown in the figure) and a wire (not shown in the figure) to achieve its control. The circuits and controls involved are all in the prior art and are well-known to those skilled in the current field, so no detailed description will be given here.

[0031] The present invention provides a wireless connection structure based on a laminated module. There are many methods and ways to specifically implement this technical solution. The above description is only the preferred embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art of this technology, without departing from the principle of the present invention, several improvements and refinements can still be made, and these improvements and refinements should also be regarded as the protection scope of the present invention. Each component not clearly defined in this embodiment can be implemented by the prior art.

Claims

1. A wireless connection structure based on a stacked module, comprising a stacked module body (1), characterized in that: A slide plate (2) is connected to the bottom of the laminated module body (1). A pulling groove (201) is formed in the front of the top of the slide plate (2). An installation plate (3) is slidably connected to the outer wall of the slide plate (2). Four corners of the bottom of the installation plate (3) are respectively fixedly connected with support columns (4). A housing (5) is arranged outside the laminated module body (1). The bottom ends of the support columns (4) are fixedly connected with the bottom inner wall of the housing (5). An installation opening is formed in the front of the housing (5). The front end of the slide plate (2) extends to the installation opening. A connection opening is formed in the back of the housing (5). A limiting mechanism (6) is arranged on the slide plate (2). The laminated module body (1) includes: an insulating substrate (107), the insulating substrate (107) is connected to the top of the slide plate (2), a third connection layer (106) is connected to the insulating substrate (107), a signal connection component (105) is connected to the third connection layer (106), a second connection layer (104) is connected to the signal connection component (105), a chip (103) is connected to the second connection layer (104), a first connection layer (102) is connected to the chip (103), and a signal lead-out component (101) is connected to the first connection layer (102). The limiting mechanism (6) includes: a second installation groove (601), the second installation groove (601) is formed in the bottom of the slide plate (2), a spring (602) is fixedly connected to the back inner wall of the second installation groove (601), a connection block (603) is fixedly connected to the front end of the spring (602), a pull rod (604) is fixedly connected to the front of the connection block (603), the front end of the pull rod (604) penetrates through the slide plate (2) and extends forward, the pull rod (604) is slidably connected to the slide plate (2), two guide sleeves (605) are relatively fixedly connected to the top inner wall of the second installation groove (601), a plug rod (606) is slidably connected to the inner wall of each guide sleeve (605), and the plug rod (606) is inserted into the installation plate (3). Hinge arms (607) are respectively hinged to the left and right sides of the connection block (603). The mutually remote ends of the two hinge arms (607) are respectively hinged to the two plug rods (606).

2. The wireless connection structure based on a stacked module according to claim 1, wherein: A first installation groove (301) is formed in the top of the installation plate (3). The slide plate (2) is slidably connected in the first installation groove (301). Slots are respectively formed in the left and right inner walls of the first installation groove (301). The mutually remote ends of the two plug rods (606) are respectively inserted into the two slots.

3. A wireless connection structure based on a stacked module according to claim 1, characterized in that: A heat dissipation mechanism (7) is arranged on the housing (5). The heat dissipation mechanism (7) includes: a heat dissipation fan (701) and heat dissipation holes (702). The heat dissipation fan (701) is connected to the left inner wall of the housing (5). The heat dissipation holes (702) are formed in the right inner wall of the housing (5).

4. A wireless connection structure based on a stacked module according to claim 3, characterized in that: The heat dissipation mechanism (7) further includes: a lead screw (703) rotatably connected to the front inner wall of the housing (5) through a bearing and located below the mounting plate (3). A slide bar (704) is threadedly connected to the outer wall of the lead screw (703). Two blocking plates (705) are relatively fixedly connected to the top of the slide bar (704), and the outer sides of the two blocking plates (705) away from each other are respectively in contact with the left and right inner walls of the housing (5).

5. A wireless connection structure based on a stacked module according to claim 4, characterized in that: A micro motor (706) is connected to the bottom inner wall of the housing (5), and the rear end of the lead screw (703) is fixedly connected to the output end of the micro motor (706) through a coupling.

6. A wireless connection structure based on a stacked module according to claim 4, characterized in that: Limiting grooves (707) are respectively formed in the left and right inner walls of the housing (5), and the left and right sides of the slide bar (704) are respectively slidably connected to the two limiting grooves (707).

7. A wireless connection structure based on a stacked module according to claim 3, characterized in that: A dust prevention mechanism (8) is arranged on the housing (5). The dust prevention mechanism (8) includes: two slide rods (801) respectively slidably connected to the front and rear inner walls of the heat dissipation holes (702). The two slide rods (801) are both in an "L" shape and are arranged oppositely. A frame (802) is fixedly connected to the right ends of the two slide rods (801). The left side of the frame (802) is in contact with the outer wall of the housing (5). A dustproof net (803) is fixedly connected to the inner wall of the frame (802). A first pull plate (804) is fixedly connected to the upper right side of the frame (802).

8. A wireless connection structure based on a stacked module according to claim 7, characterized in that: Chute grooves (805) are respectively formed in the front and rear inner walls of the heat dissipation holes (702). The two chute grooves (805) are both in an inverted "L" shape. The outer ends of the two slide rods (801) away from each other are respectively slidably connected in the two chute grooves (805).

9. A wireless connection structure based on a stacked module according to claim 1, characterized in that: An infrared temperature measurement module (10) is connected to the top of the mounting plate (3), and a single-chip microcomputer (11) is connected to the top of the mounting plate (3).

10. A wireless connection structure based on a stacked module according to claim 1, characterized in that: A blocking mechanism (9) is arranged on the housing (5). The blocking mechanism (9) includes: a slide frame (901) fixedly connected to the upper front of the housing (5). The slide frame (901) is in an inverted "U" shape. A baffle (902) is slidably connected to the inner cavity of the slide frame (901). The back of the baffle (902) is in contact with the front of the housing (5) and is located at the installation opening. A second pull plate (903) is fixedly connected to the upper front of the baffle (902). A first magnet block is embedded in the top of the baffle (902), and a second magnet block is embedded in the inner side of the top of the slide frame (901). The second magnet block and the first magnet block attract each other with opposite polarities.

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