Semiconductor wafer cleaning device

Abstract

The present invention relates to the field of wafer cleaning technology, in particular to a semiconductor wafer cleaning device, comprising an ultrasonic cleaning machine, and also comprising: a mounting plate, the mounting plate being arranged above the ultrasonic cleaning machine, a plurality of arcuate bars, the plurality of arcuate bars being arranged circumferentially on one side of the mounting plate, a gathering component being connected to the arcuate bar, a plurality of limiting rollers being arranged on the concave side of the arcuate bar, and an air jet component, the air jet component being arranged on the concave side of the arcuate bar, the air jet component being used for air jet dust removal at the contact position between the limiting roller and the side edge of the semiconductor wafer; the present invention performs air jet dust removal at the contact position between the limiting roller and the side edge of the semiconductor wafer through the air jet component, so that no pollutants are present between the contact position between the limiting roller and the side edge of the semiconductor wafer, thereby preventing the presence of pollutants from causing scratch damage to the side edge of the semiconductor wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a semiconductor wafer cleaning device. Background Art

[0002] Wafer cleaning refers to the process of removing contaminants and oxides from the wafer surface using chemical or physical methods during the integrated circuit manufacturing process, ensuring that the wafer surface meets cleanliness requirements. The principle of wafer cleaning is to remove all impurities without damaging the wafer. There are four main mechanisms for particle removal: dissolution, oxidative decomposition, electrical repulsion between particles and the silicon wafer surface, and mild corrosion of the silicon wafer surface.

[0003] The patent document with publication number CN118629937B announces a wafer cleaning device for semiconductors, including a cleaning box, a vertical plate fastened with bolts at the lower inner wall near the left side, a rotating structure is provided on the top of the vertical plate, a plurality of inner disks are provided in the rotating structure, a push-pull structure is provided on the inner disk, a clamping structure is provided at one end of the push-pull structure, a placing structure is clamped on the clamping structure, a loading and unloading structure is provided above the right side of the cleaning box, and a spray structure is provided on the front and back sides of the cleaning box.

[0004] During the cleaning process of semiconductor wafers, it is usually necessary to limit the wafers. The existing technology uses a pressing workpiece to clamp the side of the semiconductor wafer. When there are contaminants at the pressing part of the side of the semiconductor wafer, the contaminants will cause the side of the semiconductor wafer to become thicker and uneven. When the pressing workpiece contacts the side of the semiconductor wafer, the contaminants will be embedded in the side of the semiconductor wafer under the squeezing action of the pressing workpiece, which can easily cause scratches on the surface of the semiconductor wafer and affect the connectivity of the wafer circuit. Summary of the Invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a semiconductor wafer cleaning device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor wafer cleaning device, comprising an ultrasonic cleaning machine, and further comprising:

[0007] A mounting plate is provided above the ultrasonic cleaning machine, and a lifting assembly is connected to the mounting plate, which is used to drive the mounting plate to move up and down in a vertical direction;

[0008] Multiple arc-shaped bars are arranged circumferentially on one side of the mounting plate, and a gathering component is connected to the arc-shaped bar. A plurality of limiting rollers are provided on the concave side of the arc-shaped bar, and a rotating component is connected to the limiting roller. When the gathering component drives the arc-shaped bar to converge toward the center of the mounting plate, the limiting roller contacts and limits the side of the semiconductor wafer, and the rotating component is used to drive the plurality of limiting rollers to rotate in the same direction;

[0009] An air jet assembly is arranged on the concave side of the arc strip and is used to spray dust at the contact position between the limiting roller and the side edge of the semiconductor wafer;

[0010] The liquid guiding component is arranged on the mounting plate. When the semiconductor wafer rotates in one direction, the liquid guiding component is used to drain the cleaning liquid in the opposite direction to the side of the semiconductor wafer.

[0011] Preferably, the gathering component includes:

[0012] A plurality of chutes are provided on the mounting plate along the circumferential direction;

[0013] A plurality of sliders are slidably connected to the inside of corresponding slide grooves, and a plurality of arc-shaped bars are respectively fixedly connected to one side of the corresponding slider;

[0014] A plurality of connecting rods, each of which is fixedly connected to the other side of the corresponding slider, and one end of each connecting rod is fixedly connected to a round pin;

[0015] The first drive unit is fixedly mounted on the mounting plate. A guide plate is fixedly connected to the output shaft of the first drive unit. A plurality of inclined grooves are opened in the circumferential direction of the guide plate. One end of the circular pin is located in the corresponding inclined groove.

[0016] Preferably, the rotating assembly comprises:

[0017] Multiple single-pass sleeves, each of which is rotatably connected to the inside of a corresponding limiting roller, and each of which is fixedly connected to a corresponding arc strip;

[0018] A plurality of matching gears, wherein the plurality of matching gears are fixedly connected to one end of the corresponding limiting roller;

[0019] An outer gear ring is rotatably connected to the center of one side of the mounting plate, and when the multiple arc-shaped bars are in a gathered state, the multiple matching gears are all engaged with the outer gear ring;

[0020] The second driving unit is fixedly mounted on the mounting plate. The output shaft of the second driving unit is fixedly connected with a driving gear, and the driving gear and the outer gear ring are always kept in meshing.

[0021] Preferably, the jet assembly comprises:

[0022] Multiple nozzles, each of which is fixedly connected to a corresponding arc strip, and each of which is inclined toward a corresponding limiting roller;

[0023] Multiple connecting pipes, each of which is fixedly inserted on the corresponding arc-shaped strip, one end of the connecting pipe is connected to the corresponding nozzle, and the other end of the connecting pipe is fixedly installed with a one-way valve;

[0024] A first arc-shaped tube, the first arc-shaped tube is fixedly connected to the mounting plate, a plurality of hoses are fixedly connected to the first arc-shaped tube, one end of the hose is fixedly connected to a sealing housing, the sealing housing is fixedly connected to the corresponding arc-shaped bar, and one end of the connecting tube is located inside the corresponding sealing housing;

[0025] The air pump is fixedly mounted on the mounting plate, and the exhaust end of the air pump is fixedly connected to the first arc-shaped tube.

[0026] Preferably, a scraper is provided on one side of the limiting roller, and the top of the scraper is slidably connected to a connecting bar, which is fixedly connected to the corresponding arc bar. A circular rod is fixedly connected to one side of the scraper, and a plurality of guide frames are fixedly connected to the mounting plate. A guide groove is provided on the guide frame, and one end of the circular rod is located inside the corresponding guide groove, and the guide groove includes a vertical section and an inclined section.

[0027] Preferably, the liquid guiding component comprises:

[0028] A second arc-shaped pipe, the second arc-shaped pipe is fixedly connected to the mounting plate, and a plurality of water outlet pipes are fixedly connected to the second arc-shaped pipe;

[0029] The liquid pump is fixedly installed on the mounting plate, and the water outlet end of the liquid pump is fixedly connected to one end of the second arc tube. When the multiple arc bars are in a gathered state, one end of the water outlet pipe is in contact and connected with one end of the corresponding single-way sleeve. A first water outlet groove is provided on the single-way sleeve, and multiple second water outlet grooves are provided along the circumference of the limiting roller.

[0030] Preferably, the lifting assembly includes:

[0031] A fixing frame, the fixing frame is fixedly connected to the top of the ultrasonic cleaning machine;

[0032] The electric cylinder is fixedly mounted on the fixing frame, and the piston shaft of the electric cylinder is fixedly connected to the top of the mounting plate.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] 1. When the limiting roller approaches the side of the semiconductor wafer, the air jet assembly uses air to remove dust from the contact position between the limiting roller and the side of the semiconductor wafer, so that there is no contaminant between the limiting roller and the side of the semiconductor wafer, thereby preventing the presence of contaminants from causing scratches on the side of the semiconductor wafer;

[0035] 2. The cleaning liquid inside the ultrasonic cleaning machine is drained through the action of the liquid guide component, so that part of the cleaning liquid is ejected from the contact position between the limiting roller and the side of the semiconductor wafer, and opposite to the rotation direction of the semiconductor wafer. Under the action of the liquid flow, the side position of the semiconductor wafer is continuously flushed, and the liquid flow continues to impact the pollutants remaining on the side, preventing the pollutants remaining on the side of the semiconductor wafer from entering between the limiting roller and the semiconductor wafer during rotation, further reducing the hidden danger of scratches on the semiconductor wafer caused by pollutants. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the first overall structure of the present invention;

[0037] Figure 2 For the present invention Figure 1 A schematic diagram of the structure enlargement at point A;

[0038] Figure 3 It is a second overall structural schematic diagram of the present invention;

[0039] Figure 4 For the present invention Figure 3 A magnified schematic diagram of the structure at point B in FIG.

[0040] Figure 5 This is a schematic diagram of the matching structure of the mounting plate, the second arc-shaped tube and the liquid pump of the present invention;

[0041] Figure 6 For the present invention Figure 5 A magnified schematic diagram of the structure at position C in FIG;

[0042] Figure 7 This is a schematic diagram of the coordinated structure of the arc strip, the limiting roller and the nozzle of the present invention;

[0043] Figure 8 It is an exploded schematic diagram of the matching structure of the limiting roller and the single-pass sleeve of the present invention;

[0044] Figure 9 is a schematic diagram of a rotating assembly of the present invention;

[0045] Figure 10 Schematic diagram of the structure of the mounting plate, the first arc-shaped tube and the air pump of the present invention (the sealed housing is cut away);

[0046] Figure 11 For the present invention Figure 10 Schematic diagram of the enlarged structure at D in the figure.

[0047] In the figure: 100, ultrasonic cleaning machine; 200, mounting plate; 300, lifting assembly; 310, fixing frame; 320, electric cylinder; 400, arc bar; 500, gathering assembly; 510, slide groove; 520, slider; 530, connecting rod; 531, round pin; 540, first driving unit; 541, guide plate; 542, inclined groove; 600, limiting roller; 610, scraper; 611, connecting bar; 612, round rod; 613, guide frame; 614, guide groove; 6141, vertical section; 614 2. Inclined section; 620. Second water outlet trough; 700. Rotating assembly; 710. One-way sleeve; 711. First water outlet trough; 720. Matching gear; 730. External gear ring; 740. Second drive unit; 741. Active gear; 800. Jet assembly; 810. Nozzle; 820. Connecting pipe; 821. One-way valve; 830. First arc-shaped pipe; 831. Hose; 832. Sealed housing; 840. Air pump; 900. Liquid guide assembly; 910. Second arc-shaped pipe; 911. Water outlet pipe; 920. Liquid pump. DETAILED DESCRIPTION

[0048] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are merely examples, and those skilled in the art may conceive of other obvious variations.

[0049] like Figures 1 to 11 A semiconductor wafer cleaning device shown includes an ultrasonic cleaning machine 100 and further includes:

[0050] The mounting plate 200 is arranged above the ultrasonic cleaning machine 100. The mounting plate 200 is connected to a lifting assembly 300, which is used to drive the mounting plate 200 to move up and down in the vertical direction;

[0051] Multiple curved bars 400 are circumferentially arranged on one side of the mounting plate 200. A gathering assembly 500 is connected to the curved bars 400. A plurality of limiting rollers 600 are provided on the concave side of each curved bar 400. The limiting rollers 600 are connected to a rotating assembly 700. When the gathering assembly 500 drives the curved bars 400 to converge toward the center of the mounting plate 200, the limiting rollers 600 contact and limit the side of the semiconductor wafer. The rotating assembly 700 is used to drive the plurality of limiting rollers 600 to rotate in the same direction.

[0052] The air jet assembly 800 is arranged on the concave side of the arc strip 400 and is used to spray dust at the contact position between the limiting roller 600 and the side edge of the semiconductor wafer;

[0053] The liquid guide assembly 900 is disposed on the mounting plate 200. When the semiconductor wafer rotates in one direction, the liquid guide assembly 900 is used to drain the cleaning liquid in the opposite direction to the side of the semiconductor wafer.

[0054] During the cleaning process of semiconductor wafers, it is usually necessary to limit the position of the wafer. The existing technology uses a clamping workpiece to clamp the side of the semiconductor wafer. When there are contaminants at the clamping area of ​​the side of the semiconductor wafer, the contaminants will cause the side of the semiconductor wafer to become thicker and uneven. When the clamping workpiece contacts the side of the semiconductor wafer, the contaminants will be embedded in the side of the semiconductor wafer under the squeezing effect of the clamping workpiece, which can easily cause scratches on the surface of the semiconductor wafer and affect the connectivity of the wafer circuit.

[0055] Before cleaning the semiconductor wafer, the semiconductor wafer is placed on one side of the mounting plate 200 and located between the multiple arc-shaped bars 400. The multiple arc-shaped bars 400 are synchronously gathered toward the center of one side of the mounting plate 200 by the gathering component 500, and the limiting rollers 600 on the concave surfaces of the arc-shaped bars 400 are driven to move synchronously, so that the limiting rollers 600 contact the side of the semiconductor wafer and circumferentially limit the semiconductor wafer. When the limiting rollers 600 approach the side of the semiconductor wafer, the air jet component 800 performs air jet dust removal on the contact position between the limiting rollers 600 and the side of the semiconductor wafer, so that no contaminants are present between the contact position between the limiting rollers 600 and the side of the semiconductor wafer, thereby preventing the presence of contaminants from causing scratches on the side of the semiconductor wafer.

[0056] After the semiconductor wafer is limited by the plurality of limiting rollers 600, the lifting assembly 300 drives the mounting plate 200 to move vertically downward into the ultrasonic cleaning machine 100, thereby driving the semiconductor wafer to move synchronously and immerse in the cleaning liquid inside the ultrasonic cleaning machine 100. When the ultrasonic cleaning machine 100 is working, the cleaning liquid is driven to vibrate at an overfrequency frequency, thereby ultrasonically cleaning the semiconductor wafer.

[0057] When the limiting roller 600 contacts the side of the semiconductor wafer, it is difficult for the cleaning liquid to enter the contact position between the limiting roller 600 and the side of the semiconductor wafer, which makes it easy to generate a cleaning dead angle at the side of the semiconductor wafer. When the semiconductor wafer is immersed in the cleaning liquid for ultrasonic cleaning, the multiple limiting rollers 600 are driven to rotate in the same direction by the action of the rotating component 700. Since the limiting roller 600 contacts the side of the semiconductor wafer, the semiconductor wafer is driven to rotate unidirectionally between the multiple limiting rollers 600 under the action of the contact friction force, so that the contact position between the semiconductor wafer and the limiting roller 600 is constantly changing, ensuring that the side of the semiconductor wafer can contact the cleaning liquid during the rotation process, preventing the semiconductor wafer from generating a cleaning dead angle when the contact limit is generated, and effectively improving the cleaning effect of the semiconductor wafer.

[0058] After the side contact position of the limiting roller 600 and the semiconductor wafer is subjected to air jet dust removal by the air jet component 800, certain pollutants still exist in other positions of the side. Therefore, when the semiconductor wafer is immersed in the cleaning liquid for cleaning, the semiconductor wafer rotates unidirectionally through the contact rotation of multiple limiting rollers 600, and the cleaning liquid inside the ultrasonic cleaning machine 100 is drained through the action of the liquid guide component 900, so that part of the cleaning liquid is sprayed out from the side contact position of the limiting roller 600 and the semiconductor wafer, and opposite to the rotation direction of the semiconductor wafer, the side position of the semiconductor wafer is continuously flushed under the action of the liquid flow, so that when the side contact position of the limiting roller 600 and the semiconductor wafer rotates and changes, the liquid flow generated by the liquid guide component 900 flushes the pollutants on the side of the semiconductor wafer that are about to approach the limiting roller 600 and separates them from the side of the semiconductor wafer, preventing the pollutants remaining on the side of the semiconductor wafer from entering between the limiting roller 600 and the semiconductor wafer during rotation, further reducing the hidden danger of scratches caused by pollutants on the semiconductor wafer cleaning.

[0059] As a further embodiment of the present invention, the gathering component 500 includes:

[0060] A plurality of slide grooves 510 are provided on the mounting plate 200 along a circumferential direction;

[0061] Multiple sliders 520, the multiple sliders 520 are slidably connected to the corresponding sliding grooves 510, and the multiple arc-shaped bars 400 are respectively fixedly connected to one side of the corresponding sliders 520;

[0062] Multiple connecting rods 530, each of which is fixedly connected to the other side of the corresponding slider 520, and one end of each connecting rod 530 is fixedly connected to a round pin 531;

[0063] A first drive unit 540 is fixedly mounted on the mounting plate 200. A guide plate 541 is fixedly connected to the output shaft of the first drive unit 540. The guide plate 541 has a plurality of inclined grooves 542 formed along the circumference. One end of the circular pin 531 is located in a corresponding inclined groove 542.

[0064] When the semiconductor wafer needs to be contact-limited, the output shaft of the first driving unit 540 rotates unidirectionally, thereby driving the guide plate 541 to rotate synchronously. The guide plate 541 is provided with a plurality of inclined grooves 542. The inclined grooves 542 limit and guide the internal circular pins 531 during the rotation process, and drive the corresponding connecting rods 530 and sliders 520 to move, so that the sliders 520 slide along the corresponding sliding grooves 510 and gather toward the center of the mounting plate 200. The arc strips 4 00 is fixedly connected to one side of the corresponding slider 520, and moves synchronously with the slider 520 to gather and approach the side of the semiconductor wafer, and contacts the side of the semiconductor wafer through the limiting roller 600 on the concave side of the arc bar 400, so that multiple limiting rollers 600 are synchronously gathered toward the center and circumferentially limit the side of the semiconductor wafer. When the output shaft of the first drive unit 540 rotates in the opposite direction, the limiting roller 600 on the concave side of the arc bar 400 moves away from the semiconductor wafer and releases the limit on its side.

[0065] As a further embodiment of the present invention, the rotating assembly 700 includes:

[0066] Multiple single-pass sleeves 710, each of which is rotatably connected to the inside of the corresponding limiting roller 600, and each of which is fixedly connected to the corresponding arc-shaped bar 400;

[0067] A plurality of mating gears 720, wherein the plurality of mating gears 720 are fixedly connected to one end of the corresponding limiting roller 600;

[0068] The outer gear ring 730 is rotatably connected to the center of one side of the mounting plate 200. When the plurality of arc-shaped bars 400 are in a gathered state, the plurality of mating gears 720 are all engaged with the outer gear ring 730.

[0069] The second drive unit 740 is fixedly mounted on the mounting plate 200. A driving gear 741 is fixedly connected to the output shaft of the second drive unit 740. The driving gear 741 and the outer gear ring 730 are always in meshing engagement;

[0070] When the plurality of arc strips 400 gather toward the center of one side of the mounting plate 200, the arc strips 400 drive the corresponding one-way sleeve 710 and the limiting roller 600 to move synchronously, and the matching gear 720 at one end of the limiting roller 600 approaches the outer gear ring 730. When the limiting roller 600 contacts and limits the side of the semiconductor wafer, the matching gear 720 and the outer gear ring 730 are fully meshed, and the output shaft of the second driving unit 740 drives the driving gear 741 to rotate. The driving gear 741 and the outer gear ring 730 always remain meshed, and under the meshing action, the outer gear ring 730 is driven to mesh and rotate, and under the meshing action of the outer gear ring 730 and the matching gear 720, the plurality of matching gears 720 are driven to rotate in the same direction, so that the plurality of limiting rollers 600 rotate in the same direction on the surface of the corresponding one-way sleeve 710, and the semiconductor wafer is caused to rotate in one direction under the contact and limiting action with the limiting roller 600.

[0071] It should be noted that before the limiting roller 600 contacts the side of the semiconductor wafer, the mating gear 720 preferentially approaches the outer gear ring 730 and moves to engage. During the engagement of the mating gear 720 with the outer gear ring 730, the limiting roller 600 is restricted from rotating freely. Therefore, after multiple limiting rollers 600 contact and limit the side of the semiconductor wafer, multiple limiting rollers 600 cannot rotate freely. Therefore, after the limiting rollers 600 contact the side dust removal position of the semiconductor wafer, the semiconductor wafer cannot automatically rotate between the multiple limiting rollers 600, preventing the semiconductor wafer from rotating freely and causing contaminants in the uncontacted area of ​​the side to move toward the contact position between the limiting roller 600 and the side of the semiconductor wafer.

[0072] As a further embodiment of the present invention, the jet assembly 800 includes:

[0073] Multiple nozzles 810, each of which is fixedly connected to a corresponding arc-shaped bar 400, and each of which is inclined toward a corresponding limiting roller 600;

[0074] Multiple connecting pipes 820, each of which is fixedly inserted on the corresponding arc-shaped bar 400, one end of the connecting pipe 820 is connected to the corresponding nozzle 810, and the other end of the connecting pipe 820 is fixedly installed with a one-way valve 821;

[0075] A first curved tube 830 is fixedly connected to the mounting plate 200. A plurality of hoses 831 are fixedly connected to the first curved tube 830. One end of each hose 831 is fixedly connected to a sealed housing 832. The sealed housing 832 is fixedly connected to the corresponding curved bar 400. One end of the connecting tube 820 is located inside the corresponding sealed housing 832.

[0076] An air pump 840 is fixedly mounted on the mounting plate 200 , and an exhaust port of the air pump 840 is fixedly connected to the first arc-shaped tube 830 ;

[0077] When the multiple curved strips 400 gather toward the center of one side of the mounting plate 200, the air pump 840 starts working and continuously pumps gas into the interior of the first curved tube 830. The gas moves along the interior of the first curved tube 830 to the interior of the multiple hoses 831, then enters the corresponding sealed housing 832, and then enters the corresponding connecting tube 820, and finally is discharged from the nozzle 810. The nozzle 810's air jet end is tilted toward the corresponding limiting roller 600, so that the gas discharged from the nozzle 810 continuously approaches the side of the semiconductor wafer as the curved strip 400 moves, and the contact position between the side of the semiconductor wafer and the limiting roller 600 is sprayed with air to remove dust. Before the side of the semiconductor wafer contacts the corresponding limiting roller 600, the gas discharged from the nozzle 810 sprays away the contaminants at the contact position to ensure that the contact position between the limiting roller 600 and the side is clean.

[0078] A one-way valve 821 is installed on the connecting pipe 820 so that the connecting pipe 820 can only carry out one-way gas transmission to prevent liquid backflow when the connecting pipe 820 is located inside the cleaning liquid. The first arc tube 830 and the sealed shell 832 are connected through the hose 831 so that the movement of the sealed shell 832 is not affected.

[0079] As a further embodiment of the present invention, a scraper 610 is provided on one side of each limiting roller 600. A connecting bar 611 is slidably connected to the top of the scraper 610. The connecting bar 611 is fixedly connected to the corresponding arc-shaped bar 400. A round rod 612 is fixedly connected to one side of the scraper 610. A plurality of guide frames 613 are fixedly connected to the mounting plate 200. The guide frames 613 are provided with guide grooves 614. One end of the round rod 612 is located inside the corresponding guide groove 614. The guide groove 614 includes a vertical section 6141 and an inclined section 6142.

[0080] When the plurality of arc strips 400 converge toward the center of one side of the mounting plate 200, the gas discharged from the nozzle 810 is sprayed to remove dust from the contact position between the side edge of the semiconductor wafer and the limiting roller 600, and because the spray end of the nozzle 810 is tilted toward the corresponding limiting roller 600, part of the gas contacts the surface of the limiting roller 600 and sprays dust to remove the surface of the limiting roller 600. When the mating gear 720 and the outer gear ring 730 have not yet engaged, the limiting roller 600 can rotate freely along the rotating connection on the surface of the single-pass sleeve 710. The nozzle 810 thus causes the limiting roller 600 to rotate along the surface of the single-pass sleeve 710 under the action of the airflow, and comprehensively removes dust from the arc surface of the limiting roller 600 during the rotation of the limiting roller 600, thereby preventing the contaminants on the surface of the limiting roller 600 from affecting the contact and clamping of the semiconductor wafer and the limiting roller 600.

[0081] When the limiting roller 600 rotates under the action of the gas from the nozzle 810, the arc strip 400 drives the connecting strip 611 to move together, and the scraper 610 is slidably connected to the connecting strip 611 and limits the circular rod 612 through the guide groove 614. When the circular rod 612 is located inside the vertical section 6141, the scraping end of the scraper 610 is located on one side of the limiting roller 600, and in the process of the limiting roller 600 rotating due to the gas discharged from the nozzle 810, the pollutants on the surface of the limiting roller 600 are scraped off, thereby further improving the smoothness of the surface of the limiting roller 600 and During the process of meshing of the gear 720 and the outer gear ring 730, the circular rod 612 moves from the inside of the vertical section 6141 to the inside of the inclined section 6142, so that the scraper 610 moves along the sliding connection of the connecting strip 611 and away from the corresponding limiting roller 600, ensuring that when the limiting roller 600 drives the semiconductor wafer to rotate in one direction, the scraper 610 no longer acts on the surface of the limiting roller 600, thereby improving the smoothness of the rotation of the limiting roller 600 and preventing the contaminants scraped off from the scraper 610 from returning to the surface of the limiting roller 600 during the continuous contact with the limiting roller 600.

[0082] As a further embodiment of the present invention, the liquid guiding assembly 900 includes:

[0083] A second arc-shaped tube 910 is fixedly connected to the mounting plate 200 and is connected to a plurality of water outlet pipes 911;

[0084] The liquid pump 920 is fixedly mounted on the mounting plate 200. The water outlet of the liquid pump 920 is fixedly connected to one end of the second arc-shaped tube 910. When the multiple arc-shaped bars 400 are in a gathered state, one end of the water outlet tube 911 contacts and communicates with one end of the corresponding single-way sleeve 710. The single-way sleeve 710 is provided with a first water outlet groove 711. The limiting roller 600 is provided with a plurality of second water outlet grooves 620 along the circumference.

[0085] When the multiple arc bars 400 move and gather together, the single-pass sleeve 710 moves synchronously with the arc bars 400. When the multiple arc bars 400 are in a gathered state, the side of the semiconductor wafer is contacted and limited by the multiple limiting rollers 600. When the multiple arc bars 400 are in a gathered state, one end of the single-pass sleeve 710 is in contact and connected with one end of the water outlet pipe 911. The mounting plate 200 moves toward the inside of the ultrasonic cleaning machine 100 under the action of the lifting assembly 300, so that the semiconductor wafer is immersed in the cleaning liquid and rotates unidirectionally with the rotation of the limiting roller 600. The cleaning liquid is pumped into the second arc tube 910 by the liquid pump 920 and is pumped to the multiple water outlet pipes 911. The cleaning liquid moves internally, and enters the single-pass sleeve 710 along the connection between the outlet pipe 911 and the single-pass sleeve 710, and is discharged from the first outlet groove 711. During the rotation of the limiting roller 600, the multiple second outlet grooves 620 on the surface are connected with the first outlet groove 711 in sequence, and the cleaning liquid is discharged from the connection between the first outlet groove 711 and the second outlet groove 620 during the connection process, so that the outflow direction of the cleaning liquid remains unchanged and is opposite to the rotation direction of the semiconductor wafer. Under the action of the hydraulic liquid flow, the side position of the semiconductor wafer is continuously flushed to prevent the pollutants remaining on the side of the semiconductor wafer from entering between the limiting roller 600 and the semiconductor wafer during the rotation.

[0086] As a further embodiment of the present invention, the lifting assembly 300 includes:

[0087] A fixing frame 310 , the fixing frame 310 is fixedly connected to the top of the ultrasonic cleaning machine 100 ;

[0088] The electric cylinder 320 is fixedly mounted on the fixing frame 310, and the piston shaft of the electric cylinder 320 is fixedly connected to the top of the mounting plate 200;

[0089] The output shaft of the electric cylinder 320 moves the mounting plate 200 downward vertically, so that the mounting plate 200 moves into the interior of the ultrasonic cleaning machine 100 and immerses the semiconductor wafer for cleaning. When the output shaft of the electric cylinder 320 moves unidirectionally, the mounting plate 200 moves upward and returns to its initial position, thereby completing the cleaning of the semiconductor wafer.

[0090] The basic principles, main features and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only illustrate the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements fall within the scope of the present invention as claimed, and the scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer cleaning device, comprising an ultrasonic cleaning machine (100), characterized in that: Also includes: A mounting plate (200), the mounting plate (200) being arranged above the ultrasonic cleaning machine (100), a lifting assembly (300) being connected to the mounting plate (200), the lifting assembly (300) being used to drive the mounting plate (200) to move vertically up and down; A plurality of arc-shaped bars (400), the plurality of arc-shaped bars (400) are circumferentially arranged on one side of the mounting plate (200), a gathering component (500) is connected to the arc-shaped bars (400), a plurality of limiting rollers (600) are provided on the concave side of each arc-shaped bar (400), and a rotating component (700) is connected to the limiting rollers (600), when the gathering component (500) drives the arc-shaped bars (400) to gather toward the center of the mounting plate (200), the limiting rollers (600) contact and limit the side of the semiconductor wafer, and the rotating component (700) is used to drive the plurality of limiting rollers (600) to rotate in the same direction; An air jet assembly (800), the air jet assembly (800) being arranged on the concave side of the arc-shaped strip (400), and the air jet assembly (800) being used to spray dust removal at a contact position between the limiting roller (600) and the side edge of the semiconductor wafer; A liquid guiding component (900), the liquid guiding component (900) is arranged on the mounting plate (200), and when the semiconductor wafer rotates in one direction, the liquid guiding component (900) is used to drain the cleaning liquid in the opposite direction to the side of the semiconductor wafer; The rotating assembly (700) includes: A plurality of single-pass sleeves (710), each of the plurality of single-pass sleeves (710) being rotatably connected to the inside of a corresponding limiting roller (600), and each of the single-pass sleeves (710) being fixedly connected to a corresponding arc-shaped bar (400); A scraper (610) is provided on one side of the limiting roller (600), and a connecting bar (611) is slidably connected to the top of the scraper (610), and the connecting bar (611) is fixedly connected to the corresponding arc bar (400). A circular rod (612) is fixedly connected to one side of the scraper (610), and a plurality of guide frames (613) are fixedly connected to the mounting plate (200). A guide groove (614) is provided on the guide frame (613), and one end of the circular rod (612) is located inside the corresponding guide groove (614). The guide groove (614) includes a vertical section (6141) and an inclined section (6142). When the circular rod (612) is located inside the vertical section (6141), the scraping end of the scraper (610) is located on one side of the limiting roller (600); The fluid guide assembly (900) includes: A second arc-shaped tube (910), the second arc-shaped tube (910) is fixedly connected to the mounting plate (200), and a plurality of water outlet pipes (911) are fixedly connected to the second arc-shaped tube (910); A liquid pump (920) is fixedly mounted on the mounting plate (200), and a water outlet end of the liquid pump (920) is fixedly connected to one end of the second arc-shaped tube (910). When the plurality of arc-shaped strips (400) are in a gathered state, one end of the water outlet tube (911) is in contact and communication with one end of the corresponding single-pass sleeve (710). The single-pass sleeve (710) is provided with a first water outlet groove (711), and a plurality of second water outlet grooves (620) are provided on the limiting roller (600) along the circumference.

2. A semiconductor wafer cleaning device according to claim 1, characterized in that: The gathering assembly (500) comprises: A plurality of slide grooves (510), wherein the plurality of slide grooves (510) are circumferentially arranged on the mounting plate (200); A plurality of sliders (520), wherein the plurality of sliders (520) are slidably connected inside corresponding slide grooves (510), and the plurality of arc-shaped bars (400) are respectively fixedly connected to one side of the corresponding sliders (520); A plurality of connecting rods (530), wherein the plurality of connecting rods (530) are respectively fixedly connected to the other side of the corresponding slider (520), and one end of each connecting rod (530) is fixedly connected to a circular pin (531); A first drive unit (540) is fixedly mounted on the mounting plate (200); a guide plate (541) is fixedly connected to the output shaft of the first drive unit (540); a plurality of inclined grooves (542) are formed on the guide plate (541) along the circumferential direction; one end of the circular pin (531) is located inside the corresponding inclined groove (542).

3. The semiconductor wafer cleaning device according to claim 1, characterized in that: The rotating assembly (700) further comprises: A plurality of matching gears (720), wherein the plurality of matching gears (720) are fixedly connected to one end of a corresponding limiting roller (600); An outer gear ring (730), the outer gear ring (730) is rotatably connected to the center of one side of the mounting plate (200), and when the plurality of arc-shaped bars (400) are in a gathered state, the plurality of matching gears (720) are all meshed with the outer gear ring (730); The second drive unit (740) is fixedly mounted on the mounting plate (200), and a driving gear (741) is fixedly connected to the output shaft of the second drive unit (740), and the driving gear (741) and the outer gear ring (730) are always in meshing engagement.

4. A semiconductor wafer cleaning device according to claim 3, characterized in that: The jet assembly (800) includes: A plurality of nozzles (810), each of the plurality of nozzles (810) is fixedly connected to a corresponding arc-shaped bar (400), and each of the nozzles (810) is inclined toward a corresponding limiting roller (600); A plurality of connecting tubes (820), each of the connecting tubes (820) is fixedly inserted on a corresponding arc-shaped bar (400), one end of the connecting tube (820) is connected to a corresponding nozzle (810), and a one-way valve (821) is fixedly installed on the other end of the connecting tube (820); A first arc-shaped tube (830), the first arc-shaped tube (830) is fixedly connected to the mounting plate (200), a plurality of hoses (831) are fixedly connected to the first arc-shaped tube (830), one end of the hose (831) is fixedly connected to a sealing shell (832), the sealing shell (832) is fixedly connected to the corresponding arc-shaped bar (400), and one end of the connecting tube (820) is located inside the corresponding sealing shell (832); The air pump (840) is fixedly mounted on the mounting plate (200), and the exhaust end of the air pump (840) is fixedly connected to the first arc-shaped tube (830).

5. The semiconductor wafer cleaning device according to claim 1, characterized in that: The lifting assembly (300) includes: A fixing frame (310), the fixing frame (310) is fixedly connected to the top of the ultrasonic cleaning machine (100); The electric cylinder (320) is fixedly mounted on the fixing frame (310), and the piston shaft of the electric cylinder (320) is fixedly connected to the top of the mounting plate (200).

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