A three-dimensional optical waveguide manufacturing apparatus

Abstract

The application belongs to the technical field of optical waveguide manufacturing, and particularly relates to a three-dimensional optical waveguide manufacturing device, which comprises a furnace body, a quartz support, a heat preservation cylinder and a wafer clamp. The quartz support spans the opening of the furnace body, and the wafer clamp is hung in the heat preservation cylinder in the furnace body through the quartz support. The wafer clamp further comprises a main clamp body and a secondary clamp body which are detachably spliced, the secondary clamp body is sealed by being bonded to the sealing plate of the main clamp body, the inner wall of the main clamp body and the secondary clamp body is provided with a matrix positive electrode, a wafer and a copper negative electrode, and the copper negative electrode and the second end surface of the main clamp body and the secondary clamp body form a gap for the molten salt to enter the inside of the main clamp body and the secondary clamp body. The device can realize the three-dimensional structure of the buried manufacturing optical waveguide, is simple and convenient to assemble, is not easy to damage the wafer, is suitable for stable batch manufacturing of three-dimensional optical waveguides, is not easy to cause circuit short circuit, and can ensure that the temperature of the molten salt is uniform and the cooling is gentle.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of optical waveguide manufacturing, and particularly relates to a three-dimensional optical waveguide manufacturing device. BACKGROUND

[0002] The electric field assisted ion exchange is a common method for manufacturing an optical waveguide chip, and the working principle is that a wafer is contacted with molten salt to perform ion exchange, so that sodium ions in the wafer are exchanged into ions such as silver and potassium with a larger size, local modification of the wafer material is realized, the refractive index is changed to form an optical waveguide, and the ion exchange rate is accelerated under the action of an electric field formed between a positive electrode and a negative electrode. By adjusting the size of the electric field, the ions such as silver and potassium with a larger size obtained by the wafer exchange can be enriched at different depth positions of the wafer material, and different depth burying of the optical waveguide is realized. Main process steps for manufacturing the optical waveguide include wafer cleaning, sputtering of an Al film on the wafer surface, spin coating of a photoresist on the Al film, design of a photoetching pattern on the surface of the photoresist and photoetching, etching of the wafer, electric field assisted ion exchange, and burying to obtain the optical waveguide.

[0003] In the electric field assisted buried manufacturing of the optical waveguide, the surface waveguide surface of the wafer needs to be contacted with the molten salt, so that the ions such as silver and potassium in the molten salt can enter the wafer to realize ion exchange, and at the same time, the positive electrode with voltage cannot be connected with the molten salt or the negative electrode, otherwise a short circuit will be caused.

[0004] To address this problem, those skilled in the art have designed related devices. For example, Zeng Ling, in his article "Research on Electric Field-Assisted Ion Exchange Waveguides," proposed setting a ring-shaped container on the front side of the wafer, adding molten salt to the ring-shaped container, and placing a block or planar positive electrode on it. A negative electrode is then connected to the back side of the wafer using methods such as film deposition. While this structure can achieve electric field-assisted ion exchange and burial fabrication of optical waveguides, molten salt needs to be added back to the ring-shaped container for each optical waveguide chip fabricated, making it unsuitable for mass production and only suitable for single experiments. Furthermore, while the wafer is in a uniform electric field, achieving the effect of burying the optical waveguide, it cannot achieve three-dimensional structural burial of the optical waveguide. For example, in the existing patent scheme with authorization announcement number CN101907739B, the molten salt used for exchange is placed in an outer ceramic container, and the inner ceramic, ceramic sheet, and exchange K9 glass sheet are sequentially fixed and stacked together. The inner ceramic is fixedly connected to a ceramic rod, which suspends the inner ceramic inside the outer ceramic. A through hole is provided at the bottom of the inner ceramic and on the ceramic sheet to fix the negative electrode. The negative electrode is in close contact with the nickel-plated film on one side of the exchange K9 glass through the through hole of the ceramic sheet. Although this structure can achieve electric field-assisted ion exchange and burial to obtain an optical waveguide, the exchange K9 glass sheet is exposed at the bottom of the ceramic sheet, and the inner ceramic, ceramic sheet, and exchange K9 glass sheet are sequentially glued and stacked together. During the assembly process, the exchange K9 glass sheet is easily damaged or falls off due to bumps. Moreover, there is no limit to the assembly position of the ceramic sheet, making it difficult to control the positional accuracy during assembly, which is not suitable for mass production. In addition, the exchange K9 glass sheet is also in a uniform electric field. Although it achieves the effect of burying the optical waveguide, it cannot achieve the three-dimensional structure burial of the optical waveguide. Summary of the Invention

[0005] This invention provides a three-dimensional optical waveguide manufacturing apparatus, aiming to solve the problems existing in the prior art. The apparatus includes:

[0006] A furnace body with an opening at the top, and a furnace cover is provided at the opening at the top, and a first wire harness through hole is provided on the furnace cover;

[0007] A quartz support is attached to the inner wall of the furnace body and spans the opening of the furnace body;

[0008] An insulation cylinder, located inside the furnace body and below the quartz support, is used to hold molten salt.

[0009] The wafer clamp is hung on the quartz support and located inside the heat preservation cylinder; the wafer clamp further comprises a main clamp body and a secondary clamp body which are detachably spliced, a sealing plate is arranged on the first end surface of the main clamp body, the first end surface of the main clamp body and the first end surface of the secondary clamp body are sealingly connected through the sealing plate, and the sealing plate is provided with a second wire harness through hole; the inner walls of the main clamp body and the secondary clamp body from the first end surface to the second end surface are sequentially provided with a first electrode groove for fixing a matrix positive electrode, a wafer groove for fixing a wafer and a second electrode groove for fixing a copper negative electrode, the electrical connection wire of the matrix positive electrode sequentially passes through the second wire harness through hole and a first wire harness through hole to be connected with an external power supply, the electrical connection wire of the copper negative electrode directly passes through the first wire harness through hole to be connected with the external power supply, and the electrical connection wire of the matrix positive electrode and the electrical connection wire of the copper negative electrode are both mica tape insulated cables; the second end surfaces of the main clamp body and the secondary clamp body are both provided with a protruding part, the second electrode groove is arranged on the inner wall of the protruding part, and a gap is formed between the copper negative electrode and the second end surfaces of the main clamp body and the secondary clamp body for the molten salt to enter the inside of the main clamp body and the secondary clamp body.

[0010] In a specific embodiment, the furnace cover is hinged at the opening of the furnace body, the inner wall of the furnace wall of the furnace body is embedded with an electric heating wire and a first temperature sensor, the wafer clamp is embedded with a second temperature sensor, the signal connection wire of the second temperature sensor is a mica tape insulated signal wire, the signal connection wire of the second temperature sensor passes through the first wire harness through hole to be connected with an external controller, and the electric heating wire and the first temperature sensor are also connected with the external controller, so as to control the heating power of the electric heating wire according to the temperatures detected by the first temperature sensor and the second temperature sensor; the inner wall material of the furnace body is high alumina brick, which is used for conducting the heat of the electric heating wire.

[0011] In a specific embodiment, the inner wall of the furnace body is provided with at least one pair of limiting square grooves, the two ends of the quartz support are respectively placed in a pair of the limiting square grooves, and the quartz support and the wafer clamp are one-to-one correspondingly arranged, and at least one is arranged.

[0012] In a specific embodiment, the heat preservation cylinder comprises an inner cylinder and an outer cylinder, the molten salt is contained in the inside of the inner cylinder, the outer wall of the inner cylinder and the inner wall of the outer cylinder are spaced apart to form a filling cavity, and a heat preservation medium is arranged in the filling cavity.

[0013] In a specific embodiment, a support ring is fixed in the inside of the outer cylinder, the inner cylinder is fixed on the support ring, the outer cylinder is made of aluminum alloy or stainless steel, the inner cylinder is made of quartz, the support ring is made of quartz or ceramic, and the heat preservation medium is molten salt.

[0014] In a specific embodiment, the main clamp body is provided with an ear, and the ear is provided with a glass fiber rope ring, which is hung on the quartz support.

[0015] In a specific embodiment, the main clamp body and the auxiliary clamp body are both semi-circular or semi-square structures, and are both made of quartz, the splicing surface of the main clamp body is provided with a positioning groove, the splicing surface of the auxiliary clamp body is provided with a positioning pin for inserting into the positioning groove, and the splicing surfaces of the main clamp body and the auxiliary clamp body are fixed by insulating glue.

[0016] In a specific embodiment, a first chamfer surface is arranged between the splicing surface of the main clamp body and the outer wall thereof, a second chamfer surface is arranged between the splicing surface of the auxiliary clamp body and the outer wall thereof, and the first chamfer surface and the second chamfer surface are fixed by insulating glue.

[0017] In a specific embodiment, the sealing plate is integrally formed with the main clamp body, and the sealing plate and the first end surface of the auxiliary clamp body are fixed by insulating glue.

[0018] In a specific embodiment, the matrix positive electrode and the first electrode groove, the wafer and the wafer groove, the copper negative electrode and the second electrode groove, and the inner wall between the electric connection line of the matrix positive electrode and the second wire harness via hole are fixed by insulating glue.

[0019] The present application has at least the following beneficial effects:

[0020] 1. By replacing the traditional positive electrode with the matrix positive electrode, the voltage between each positive electrode block of the matrix positive electrode and the copper negative electrode can be adjusted as needed, thereby realizing the three-dimensional structure of the buried manufacturing optical waveguide.

[0021] 2. By adopting the spliced wafer clamp structure, fixing the matrix positive electrode with the first electrode groove, fixing the wafer with the wafer groove, fixing the copper negative electrode with the second electrode groove, and designing the wafer into a hidden structure, the assembly of the wafer and the positive and negative electrodes is very simple and convenient and the wafer is not easy to be damaged, which is suitable for stable batch manufacturing of three-dimensional optical waveguide.

[0022] 3. The first end surface of the main clamp body and the first end surface of the auxiliary clamp body are sealed and connected by the sealing plate, so that the matrix positive electrode is located in the closed and insulated space of the wafer clamp, which can effectively prevent the matrix positive electrode from being connected with the molten salt or the copper negative electrode to cause short circuit.

[0023] 4. The double insulation structure of the heat preservation cylinder and the furnace body can ensure the uniform temperature and slow cooling of the molten salt in the heat preservation cylinder.

[0024] 5. The quartz support suspends the wafer clamp, so that the fixing structure of the wafer clamp is simple and convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a perspective view of the embodiment of the present application.

[0026] Figure 2 It is a structure view of the quartz support in the embodiment of the present application.

[0027] Figure 3 It is a perspective sectional view of the heat preservation cylinder in the embodiment of the present application.

[0028] Figure 4 It is a structure view of the wafer clamp in the embodiment of the present application.

[0029] Figure 5 It is a perspective view of the main clamp body in the embodiment of the present application.

[0030] Figure 6 It is a perspective view of the auxiliary clamp body in the embodiment of the present application.

[0031] Figure 7 It is a sectional structure view of the wafer clamp in the embodiment of the present application.

[0032] The furnace body 1, the furnace cover 11, the first wire harness through hole 111, the limiting square groove 12, the quartz support 2, the rotation stopping surface 21, the heat preservation cylinder 3, the inner cylinder 31, the outer cylinder 32, the filling cavity 33, the supporting ring 34, the wafer clamp 4, the main clamp body 41, the positioning groove 411, the first chamfer surface 412, the sealing plate 413, the second wire harness through hole 414, the lug 415, the auxiliary clamp body 42, the positioning pin 421, the second chamfer surface 422, the convex part 43, the gap 44, the matrix positive electrode 5, the wafer 6, the copper negative electrode 7, the glass fiber rope ring 8. DETAILED DESCRIPTION

[0033] Please refer to Figure 1 and Figure 2 The present application provides a three-dimensional optical waveguide manufacturing device, which comprises a top opening furnace body 1, a quartz support 2, a heat preservation cylinder 3 and a wafer clamp 4.

[0034] The furnace cover 11 is hinged at the opening of the top of the furnace body 1, and is used to open or close the opening of the furnace body 1. The first wire harness through hole 111 is arranged on the furnace cover 11, and is used for the wire cable to pass through.

[0035] The inner wall of the furnace body 1 is provided with at least one pair of limiting square grooves 12, and the two ends of the quartz support 2 are respectively placed in the pair of limiting square grooves 12 and span the opening of the furnace body 1. The quartz support 2 is a cylindrical structure, and the two ends are provided with rotation stopping surfaces 21 matched with the inner walls of the limiting square grooves 12, so that the quartz support 2 cannot rotate freely after being assembled into the limiting square grooves 12.

[0036] Please refer to Figure 1 and Figure 3 The heat preservation cylinder 3 is arranged in the interior of the furnace body 1 and below the quartz support 2, and is used for containing the molten salt. The heat preservation cylinder 3 comprises an inner cylinder 31 and an outer cylinder 32, the molten salt is contained in the interior of the inner cylinder 31, the outer wall of the inner cylinder 31 and the inner wall of the outer cylinder 32 are spaced to form a filling cavity 33, and a heat preservation medium is arranged in the filling cavity 33. A supporting ring 34 is fixed in the interior of the outer cylinder 32, and the inner cylinder 31 is fixed on the supporting ring 34. The outer cylinder 32 is made of aluminum alloy or stainless steel, the inner cylinder 31 is made of quartz, and the supporting ring 34 is made of quartz or ceramic. The thermal conductivity and the thermal expansion coefficient of the quartz or ceramic supporting ring 34 are similar to those of the quartz inner cylinder 31, so that the problems of uneven heat transfer or poor thermal matching leading to the explosion of the inner cylinder 31 do not occur. The heat preservation medium is molten salt, so that the heat preservation medium has the same characteristics as the molten salt contained in the inner cylinder 31, and the temperature uniformity and the gentle cooling of the molten salt are ensured. The heat preservation cylinder 3 adopts the double-layer heat preservation structure of the inner cylinder 31 and the outer cylinder 32, so that the temperature uniformity and the gentle cooling of the molten salt are further ensured. Moreover, the heat preservation cylinder 3 and the furnace body 1 form a double heat preservation structure, so that the temperature uniformity and the gentle cooling of the molten salt are further ensured.

[0037] Please refer to Figures 4-7 The wafer clamp 4 comprises a main clamp body 41 and a secondary clamp body 42, both of which are semi-ring structures. The main clamp body 41 and the secondary clamp body 42 are made of quartz, are spliced and installed together, the splicing surface of the main clamp body 41 is provided with a positioning groove 411, the splicing surface of the secondary clamp body 42 is provided with a positioning pin 421 inserted into the positioning groove 411, and the splicing surfaces of the main clamp body 41 and the secondary clamp body 42 are fixed by adhesive. The splicing surface of the main clamp body 41 and the outer wall thereof are provided with a first chamfer surface 412, the splicing surface of the secondary clamp body 42 and the outer wall thereof are provided with a second chamfer surface 422, and the first chamfer surface 412 and the second chamfer surface 422 are also fixed by adhesive, so that the firmness of the splicing structure is further improved.

[0038] The first end surface of the main clamping body 41 is provided with a sealing plate 413, which is also made of quartz and is integrally formed with the main clamping body 41 to improve the sealing performance. When spliced, the first end surface of the main clamping body 41 and the first end surface of the auxiliary clamping body 42 are sealingly connected through the sealing plate 413, and the sealing plate 413 and the first end surface of the auxiliary clamping body 42 are fixedly connected through the insulating glue, so that the main clamping body 41 and the auxiliary clamping body 42 are spliced into a cup-shaped wafer clamp 4 structure. Of course, in other embodiments, the main clamping body 41 and the auxiliary clamping body 42 can also be half-square structures, as long as they can be spliced into a cup-shaped wafer clamp 4 structure to realize the scheme of the present application.

[0039] The inner walls of the main clamping body 41 and the auxiliary clamping body 42 from the first end surface to the second end surface are sequentially provided with a first electrode groove for fixing the matrix positive electrode 5, a wafer groove for fixing the wafer 6, and a second electrode groove for fixing the copper negative electrode 7. The sealing plate 413 is provided with a second wire harness through hole 414, the electrical connection line of the matrix positive electrode 5 sequentially passes through the second wire harness through hole 414 and the first wire harness through hole 111 to be connected with the external power supply, and the electrical connection line of the copper negative electrode 7 directly passes through the first wire harness through hole 111 to be connected with the external power supply. The matrix positive electrode 5 and the first electrode groove, the wafer 6 and the wafer groove, the copper negative electrode 7 and the second electrode groove, and the electrical connection line of the matrix positive electrode 5 and the inner wall of the second wire harness through hole 414 are fixedly connected through the insulating glue, so that the matrix positive electrode 5 is installed in the closed and insulated space formed by the main clamping body 41, the auxiliary clamping body 42, the wafer 6 and the sealing plate 413, which can effectively prevent the matrix positive electrode 5 from being connected with the molten salt or the copper negative electrode to cause short circuit. The electrical connection line of the matrix positive electrode 5 and the electrical connection line of the copper negative electrode 7 are both mica tape insulated cables, which can withstand the high temperature of the molten salt environment and be insulated from the molten salt.

[0040] The second end surface of the main clamping body 41 and the auxiliary clamping body 42 is provided with a protruding part 43, and the second electrode groove is arranged in the inner wall of the protruding part 43. The copper negative electrode 7 and the second end surface of the main clamping body 41 and the auxiliary clamping body 42 form a gap 44 for the molten salt to enter the inside of the main clamping body 41 and the auxiliary clamping body 42.

[0041] Please refer to Figure 1 and Figure 4The side wall of the main clamp body 41 is provided with an eye 415, the eye 415 is provided with a glass fiber rope ring 8, the glass fiber rope ring 8 is hung on the quartz support 2, so that the whole wafer clamp 4 is hung on the quartz support 2, and the wafer clamp 4 is immersed in the molten salt in the heat preservation cylinder 3. It should be noted that the main clamp body 41 and the auxiliary clamp body 42 are both quartz materials, and the adhesion between the main clamp body 41 and the auxiliary clamp body 42 can completely ensure that they will not be separated during use.

[0042] The furnace wall of the furnace body 1 is further embedded with an electric heating wire (not shown in the figure) and a first temperature sensor (not shown in the figure), and the wafer clamp 4 is embedded with a second temperature sensor (not shown in the figure), the second temperature sensor is a thermocouple sensor, the signal connection line of the second temperature sensor is a mica tape insulation signal line, the signal connection line of the second temperature sensor passes through the first wire harness via hole 111 and is connected with the external controller, the electric heating wire and the first temperature sensor are also connected with the external controller, which is used to control the heating power of the electric heating wire according to the temperature detected by the first temperature sensor and the second temperature sensor, so as to realize active heat preservation. It should be noted that the control principle is prior art, and will not be described here. The inner wall material of the furnace body 1 is high alumina brick, which is used to improve the heat conduction efficiency of the electric heating wire.

[0043] The working principle of the present application is as follows: firstly, the matrix positive electrode 5, the wafer 6 and the copper negative electrode 7 are respectively fixed in the first electrode slot, the wafer slot and the second electrode slot of the main clamping body 41 through the adhesive fixing of the insulating glue, and after curing, the auxiliary clamping body 42 is spliced with the main clamping body 41, so that the matrix positive electrode 5, the wafer 6 and the copper negative electrode 7 are respectively inserted into the first electrode slot, the wafer slot and the second electrode slot of the auxiliary clamping body 42 and fixed through the adhesive fixing of the insulating glue. At the same time, the electrical connection line of the matrix positive electrode 5 is passed out of the sealing plate 413 from the second wire harness via hole 414, and the sealing plate 413 and the first end surface of the auxiliary clamping body 42, the first chamfer surface 412 and the second chamfer surface 422, and the electrical connection line of the matrix positive electrode 5 and the second wire harness via hole 414 are also fixed through the adhesive fixing of the insulating glue. Then, the molten salt is contained in the inner cylinder 31 of the heat preservation cylinder 3 in the furnace body 1, the wafer clamp 4 is suspended on the quartz support 2 through the glass fiber rope ring 8, and the two ends of the quartz support 2 are respectively placed in a pair of limiting square grooves 12 of the furnace body 1, so that the wafer clamp 4 is immersed in the molten salt. Finally, the electrical connection line of the matrix positive electrode 5 is passed through the first wire harness via hole 111 to be connected with the external power supply, the electrical connection line of the copper negative electrode 7 is passed through the first wire harness via hole 111 to be connected with the external power supply, an electric circuit is formed, and the opening of the furnace body 1 is closed through the furnace cover 11 to form a closed heat preservation environment. The molten salt enters the wafer clamp 4 through the gap 44 between the copper negative electrode 7 and the second end surface of the main clamping body 41 and the auxiliary clamping body 42 to contact the wafer 6, ion exchange is realized, and the three-dimensional structure of the buried optical waveguide is realized under the action of different size electric fields formed between the matrix positive electrode 5 and the copper negative electrode 7. After the three-dimensional optical waveguide is made, the wafer clamp 4 is taken out of the furnace body 1, cooled and cleaned, the insulating glue is dropped into the colloid softener on the contact surface of the main clamping body 41 and the auxiliary clamping body 42, the insulating glue is softened, so that the main clamping body 41 and the auxiliary clamping body 42 can be opened, and then the insulating glue is dropped into the colloid softener between the matrix positive electrode 5 and the first electrode slot, the wafer 6 and the wafer slot, and the copper negative electrode 7 and the second electrode slot, so that the matrix positive electrode 5, the wafer 6 and the copper negative electrode 7 can be taken out.

[0044] It should be noted that in other embodiments of the present application, the quartz support 2 and the wafer clamp 4 are one-to-one corresponding and multiple are provided, so that multiple wafers 6 can be processed at a time and the batch generation efficiency is improved.

[0045] It should be noted that the circuit structure of the matrix positive electrode 5 and its working principle are prior art, and the specific structure and working principle of the matrix positive electrode 5 will not be described in the present application.

[0046] It should be noted that the technical solution of the present application can also be used to manufacture a two-dimensional optical waveguide structure, only the matrix positive electrode and the copper negative electrode are removed, that is, the electric field is removed, the wafer is directly contacted with the molten salt, ion exchange is realized, only the ion exchange rate is relatively slow, and a three-dimensional optical waveguide structure is not formed.

[0047] The above is a further detailed description of the present application in combination with specific preferred embodiments, and cannot be regarded as limitation of the specific implementation of the present application to these descriptions. For ordinary skilled persons in the technical field to which the present application belongs, a number of simple deductions and replacements can be made without departing from the concept of the present application, and all of them should be regarded as falling within the protection scope of the present application.

Claims

1. A three-dimensional optical waveguide manufacturing apparatus characterized by comprising: The utility model relates to a kind of furnace for producing copper indium gallium selenide solar cell, including: Top open furnace body (1), the top of which is provided with furnace cover (11), and the first wire harness through hole (111) is arranged on the furnace cover (11); Quartz support (2) is connected to the inner wall of the furnace body (1), and spans the opening of the furnace body (1); Heat preservation cylinder (3) is arranged in the inside of the furnace body (1), and is located below the quartz support (2), for holding molten salt; Wafer clamp (4) is hung on the quartz support (2), and is located in the inside of the heat preservation cylinder (3);The wafer clamp (4) further includes detachable splicing main clamp body (41) and auxiliary clamp body (42), the first end surface of the main clamp body (41) is provided with sealing plate (413), the first end surface of the main clamp body (41) and the first end surface of the auxiliary clamp body (42) are sealedly connected by the sealing plate (413), and the sealing plate (413) is provided with second wire harness through hole (414);The inner wall of the main clamp body (41) and the auxiliary clamp body (42) from first end surface to second end surface is sequentially provided with first electrode slot for fixing matrix positive electrode (5), wafer slot for fixing wafer (6) and second electrode slot for fixing copper negative electrode (7), the electrical connection line of the matrix positive electrode (5) sequentially passes through the second wire harness through hole (414) and first wire harness through hole (111) and is connected with external power supply, the electrical connection line of the copper negative electrode (7) directly passes through the first wire harness through hole (111) and is connected with external power supply, and the electrical connection line of the matrix positive electrode (5) and the electrical connection line of the copper negative electrode (7) are mica tape insulated cables;The second end surface of the main clamp body (41) and the auxiliary clamp body (42) is provided with protruding portion (43), and the second electrode slot is arranged in the inner wall of the protruding portion (43), and the copper negative electrode (7) and the second end surface of the main clamp body (41) and the auxiliary clamp body (42) form gap (44) for the molten salt to enter the inside of the main clamp body (41) and the auxiliary clamp body (42).

2. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein The furnace cover (11) is hinged at the opening of the furnace body (1), the furnace wall of the furnace body (1) is embedded with electric heating wire and first temperature sensor, the wafer clamp (4) is embedded with second temperature sensor, the signal connection line of the second temperature sensor is mica tape insulated signal line, the signal connection line of the second temperature sensor passes through the first wire harness through hole (111) and is connected with external controller, and the electric heating wire and the first temperature sensor are also connected with external controller, for controlling the heating power of electric heating wire according to the temperature detected by the first temperature sensor and the second temperature sensor;The inner wall material of the furnace body (1) is high alumina brick, for conducting the heat of electric heating wire.

3. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein The inner wall of the furnace body (1) is provided with at least one pair of limiting square grooves (12), both ends of the quartz support (2) are respectively placed in a pair of the limiting square grooves (12), the quartz support (2) and the wafer clamp (4) are one-to-one correspondingly arranged, and at least one is arranged.

4. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein The heat preservation cylinder (3) comprises an inner cylinder (31) and an outer cylinder (32), the molten salt is contained in the inner cylinder (31), and a filling cavity (33) is formed between the outer wall of the inner cylinder (31) and the inner wall of the outer cylinder (32).

5. The three-dimensional optical waveguide manufacturing apparatus according to claim 4, wherein The inner wall of the furnace body (1) is provided with at least one pair of limiting square grooves (12), both ends of the quartz support (2) are respectively placed in a pair of the limiting square grooves (12), the quartz support (2) and the wafer clamp (4) are one-to-one correspondingly arranged, and at least one is arranged.

6. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein The outer wall of the main clamping body (41) is provided with an ear (415), the ear (415) is provided with a glass fiber rope ring (8), and the glass fiber rope ring (8) is hung on the quartz support (2).

7. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein The main clamping body (41) and the auxiliary clamping body (42) are both semi-annular structures or semi-square structures, the main clamping body (41) and the auxiliary clamping body (42) are both made of quartz, the splicing surface of the main clamping body (41) is provided with a positioning groove (411), the splicing surface of the auxiliary clamping body (42) is provided with a positioning pin (421) inserted into the positioning groove (411), and the splicing surfaces of the main clamping body (41) and the auxiliary clamping body (42) are fixed by adhesive.

8. The three-dimensional optical waveguide manufacturing apparatus according to claim 7, wherein The splicing surface of the main clamping body (41) and the outer wall thereof are provided with a first chamfer surface (412), the splicing surface of the auxiliary clamping body (42) and the outer wall thereof are provided with a second chamfer surface (422), and the first chamfer surface (412) and the second chamfer surface (422) are fixed by adhesive.

9. The three-dimensional optical waveguide manufacturing apparatus according to claim 1, wherein The sealing plate (413) is integrally formed with the main clamping body (41), and the sealing plate (413) and the first end surface of the auxiliary clamping body (42) are fixed by adhesive.

10. The three-dimensional optical waveguide manufacturing apparatus according to claim 2, wherein The matrix positive electrode (5) and the first electrode groove, the wafer (6) and the wafer groove, the copper negative electrode (7) and the second electrode groove, and the inner wall between the electric connection line of the matrix positive electrode (5) and the second wire harness via hole (414) are fixed by adhesive.

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