Shell structure and shell machining method

Abstract

The invention discloses a shell structure and a shell processing method, the shell structure is applied to a camera, and the shell structure comprises a first body and a second body which are oppositely arranged; the edge of the first body is provided with a first flanging structure, and the first flanging structure is bent towards the direction of the second body and extends out; the edge of the second body is provided with a second flanging structure, and the second flanging structure is bent towards the direction of the first body and extends out; the first body is buckled with the second flanging structure of the second body through the first flanging structure to form an overlapping face, and a plurality of electric conduction laser welding points are distributed on at least one overlapping face. According to the shell structure provided by the invention, the first body and the second body are matched and connected with each other, the structural strength of a product is ensured, glue dispensing is not needed in the assembly process, conduction grounding is realized through an electric conduction laser welding point, the shell structure can greatly simplify the assembly process of the product, the use cost of the assembly process is reduced, and the production efficiency is improved. And the structural stability and the electric conduction performance of the product are both considered.

Description

Technical Field

[0001] The present invention relates to the technical field of camera components, and in particular to a shell structure and a shell processing method. Background Art

[0002] With the continuous advancement of technology, the performance of mobile phone cameras has been continuously improved. Nowadays, in order to meet the usage needs of consumers, the lens size of mobile phone cameras has been getting larger and larger, which has put forward more stringent requirements on the function and structural strength of the VCM (or motor) that loads the lens.

[0003] In the design and assembly of camera motors, the camera cover (referred to as the cover, Case) and the motor base plate (referred to as the base, Base) are both preferably made of metal materials with higher strength. When both are made of metal materials, in addition to being assembled and fixed to form a closed protective cover, they also need to be connected and grounded to better prevent interference from external electromagnetic signals. In the existing technology, please refer to Figure 1 , Figure 1 The figure shows a schematic diagram of the shell structure of the prior art, in which the enlarged area of part A shows the schematic diagram of the coating of conductive glue at the gap. The prior art first applies thermosetting / UV glue around or on the bottom of the outer cover or substrate, and then assembles and fixes the outer cover and the substrate. Then, additional conductive glue is added, and after curing, it is conductive and grounded.

[0004] However, conductive glue, used for grounding, results in high and unstable resistance, poor tensile strength and drop resistance, and is prone to mixing with the adhesive used for fixing, leading to a certain degree of functional failure risk. Furthermore, the extensive use of glue is detrimental to the internal quality control requirements of miniaturized products and increases the cost of the entire assembly process. Summary of the Invention

[0005] The present invention provides a shell structure and a shell processing method. The shell structure is designed to be connected by a first body and a second body, thereby ensuring the structural strength of the product. No glue is required during the assembly process, and grounding is achieved through electrically conductive laser welding points. The shell structure can greatly simplify the assembly process of the product, reduce the cost of the assembly process, and take into account the structural stability and electrical conductivity performance of the product.

[0006] In order to solve the above technical problems, an embodiment of the present invention provides a housing structure applied to a camera, comprising:

[0007] A first body and a second body arranged opposite to each other;

[0008] A first flange structure is provided on the edge of the first body, and the first flange structure is bent and extended toward the second body;

[0009] The edge of the second body is provided with a second flanging structure, and the second flanging structure bends and extends towards the direction of the first body;

[0010] The first body and the second flanging structure of the second body are mutually buckled through the first flanging structure to form an overlapping surface, and a plurality of electrically conductive laser welding points are distributed on at least one of the overlapping surfaces.

[0011] As one of the preferred solutions, the first body is a camera outer cover, and the second body is a motor substrate; or,

[0012] The first body is a motor substrate, and the second body is a camera outer cover.

[0013] As one of the preferred solutions, the first body is buckled on the second body so that the first flanging structure covers the second flanging structure.

[0014] As one of the preferred solutions, the end of the first flanging structure is provided with a first chamfer, and the inclined surface of the first chamfer faces the second flanging structure.

[0015] As one of the preferred solutions, the end of the second flanging structure is provided with a first limiting boss, and the first limiting boss faces the non-bending surface of the first body.

[0016] As one of the preferred solutions, the electrically conductive laser welding points are located at positions close to the inner edge of the overlapping surface.

[0017] As one of the preferred solutions, the number of the electrically conductive laser welding points is multiple, and the multiple electrically conductive laser welding points form a welding point array on the overlapping surface.

[0018] As one of the preferred solutions, the welding point array includes a first welding point array and a second welding point array, and the first welding point array and the second welding point array are distributed on both sides of the same overlapping surface.

[0019] As one of the preferred solutions, a plurality of the electrically conductive laser welding points are distributed on one overlapping surface, and glue is coated on at least one of the remaining overlapping surfaces.

[0020] Another embodiment of the present invention provides a method for processing a housing, which is applied to the housing structure as described above, and includes:

[0021] Assemble the first body and the second body;

[0022] Based on the selected laser parameters, perform laser welding on the corresponding overlapping surface to form the electrically conductive laser welding points.

[0023] Compared with the prior art, the beneficial effects of the embodiments of the present invention are at least one of the following:

[0024] (1) Design an outer cover and a substrate with a flanging structure, which are buckled with each other, and the outer cover and the substrate are welded by laser to make them joined, taking into account both the fixing and conduction functions;

[0025] (2) There is no need to use conductive glue, and the conduction to the ground can be achieved by electrically conducting the laser welding points, thus greatly simplifying the assembly process of the housing structure and reducing the use cost of the product assembly process;

[0026] (3) There is no need to use a large amount of glue, providing additional accommodation space for other functional devices inside the housing, thus ensuring the internal quality control requirements of the product while meeting the structural strength of the mobile phone lens;

[0027] (4) The electrically conductive laser welding points have smaller and more stable resistance, better reliability, and higher tensile and drop resistance performance of the product;

[0028] (5) The electrically conductive laser welding points can be arbitrarily arranged and combined to form a solder joint array, and the use of fixing glue can meet different strength requirements in different scenarios, with better universality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of the housing structure of the prior art;

[0030] Figure 2 is an exploded schematic diagram of the housing structure in one embodiment of the present invention;

[0031] Figure 3 is a schematic diagram of the housing structure in one embodiment of the present invention;

[0032] Figure 4 is a schematic diagram of the structure of the first limiting boss of the housing structure in one embodiment of the present invention;

[0033] Figure 5 is a schematic diagram of the structure of the first chamfer of the unassembled housing structure in one embodiment of the present invention;

[0034] Figure 6 is a schematic diagram of the structure of the first chamfer of the assembled housing structure in one embodiment of the present invention;

[0035] Figure 7 is a schematic diagram of the structure of the first form in the embodiment of the present invention;

[0036] Figure 8 is a schematic diagram of the structure of the second form in the embodiment of the present invention;

[0037] Figure 9 Schematic diagram of the position of the inner edge in the first form in the embodiments of the present invention;

[0038] Figure 10 Schematic diagram of the position of the inner edge in the second form in the embodiments of the present invention;

[0039] Figure 11 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0040] Figure 12 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0041] Figure 13 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0042] Figure 14 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0043] Figure 15 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0044] Figure 16 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0045] Figure 17 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0046] Figure 18 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0047] Figure 19 Schematic diagram of a solder joint array in one of the embodiments of the present invention;

[0048] Figure 20 Schematic diagram of a solder joint array near the contour line in one of the embodiments of the present invention;

[0049] Reference numerals:

[0050] Wherein, 1, outer cover; 11, first flanging structure; 12, first chamfer; 2, substrate; 21, second flanging structure; 22, first limiting boss; 3, electrically conductive laser welding point. Detailed implementation manners

[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0052] In the description of the present application, the terms "first", "second", "third", etc. are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0053] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two components. The terms "vertical", "horizontal", "left", "right", "up", "down" and similar expressions used herein are only for the purpose of illustration, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0054] In the description of the present application, it should be noted that, unless otherwise defined, all the technical and scientific terms used in the present invention have the same meanings as those commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0055] An embodiment of the present invention provides a housing structure, which is applied to a camera and specifically includes a first body and a second body, which are arranged relatively parallel to each other. A first flanging structure is provided at the edge of the first body, and the first flanging structure bends and extends towards the second body. A second flanging structure is provided at the edge of the second body, and the second flanging structure bends and extends towards the first body.

[0056] It should be noted that the general camera housing is a box-shaped structure. When the first body and the second body are rectangular in top view, the edges of the first body / second body refer to the four side edges of the rectangle. Of course, non-rectangular shapes such as circular shapes can also be selected according to actual product design requirements, as long as a flanging structure is ensured at the edge position, which will not be elaborated here.

[0057] In the above embodiment, the first body can be the camera case, and the second body can be the motor base. In addition, the first body can also be the motor base, and the second body can be the camera case. That is, the case and the base together form the housing structure, and the specific position is determined by actual product design requirements. Specifically, please refer to Figures 2 - 3 , where Figure 2 shows an exploded schematic view of the housing structure in one embodiment of the present invention. The upper side in the figure is the case 1, and the edge of the case 1 is provided with a first flanging structure 11. The lower side is the base 2, and the edge of the base 2 is provided with a second flanging structure 21. Figure 3 shows a schematic view of the housing structure in one embodiment of the present invention, which shows the schematic view of the assembled housing structure and has an electrically conductive laser welding point 3.

[0058] In this embodiment, the first body and the second body are preferably rectangular structures, that is, the first body has a first flanging structure around it, and the second body has a second flanging structure around it. In order to achieve snap-fit connection, the sizes of the first body and the second body are different to achieve two different snap-fit forms, which will be described in detail below.

[0059] The first form is that the size of the upper case is larger than the size of the lower base. At this time, the upper case can snap-fit the lower base, resulting in the first flanging structure covering the second flanging structure. The second form is that the size of the upper case is smaller than the size of the lower base. At this time, the lower base can snap-fit the upper case, resulting in the second flanging structure covering the first flanging structure. Whether it is the first form or the second form, due to the snap-fit effect, overlapping overlapping surfaces will be formed around. In this embodiment, a plurality of electrically conductive laser welding points are distributed on at least one overlapping surface to achieve conductive grounding.

[0060] It should be noted that, according to actual product design requirements, electrically conductive laser welding points can be designed on one overlapping surface, and the remaining three overlapping surfaces can be used with conductive glue according to actual needs. Or electrically conductive laser welding points can be designed on all overlapping surfaces, and no specific limitation is made here.

[0061] The following will be described in the first form, that is, the upper side is the outer cover, the lower side is the substrate, and the outer cover on the upper side is buckled to the substrate on the lower side. In the above embodiment, preferably four first limiting bosses are provided at the positions of the four R corners (rounded corners) of the substrate and at the ends of the second flanging structure to determine the height of the product. Of course, the first limiting bosses also make the assembly of the product more convenient. During assembly, it can be simply installed in place, increasing the assembly convenience and saving the cost of assembly equipment or fixtures. In addition, the number of the first limiting bosses is determined by the actual product design requirements and will not be elaborated here.

[0062] Specifically, please refer to Figure 4 , Figure 4 which shows a schematic structural diagram of the first limiting boss of the housing structure in one of the embodiments of the present invention. Since it is a cross-sectional view, two first limiting bosses 22 are shown in the figure. Considering that when the outer cover and the substrate are buckled, as long as there is a flanging structure, there will inevitably be a bending angle during stamping. During the processing step of buckling and installing the product, since laser welding is required, the gap needs to be small enough, usually required to be 0 - 0.04 mm. To ensure the installation of the product and prevent the first limiting boss 22 from hitting the position of the bending angle during installation, which may affect the height of the product, in the above embodiment, the first limiting boss 22 faces the non-bending surface of the first body, and the gaps at the four R corners are larger, so that the first limiting boss 22 can avoid the position of the bending angle, and the welding fixture does not need to locate the height simultaneously, reducing the cost.

[0063] To improve the buckling efficiency of the outer cover and the substrate and ensure the buckling effect when the gap is small, further, in the above embodiment, a first chamfer is provided at the end of the first flanging structure of the outer cover. Specifically, please refer to Figures 5 - 6 , Figure 5 which shows a schematic structural diagram of the first chamfer of the unassembled housing structure in one of the embodiments of the present invention. The enlarged schematic diagram at position B shows the first chamfer 12. Figure 6The structural schematic diagram of the first chamfer of the assembled housing structure in one embodiment of the present invention is shown. In the enlarged schematic diagram at position C, the first chamfer 12 is shown. The inclined surface of the first chamfer 12 faces the second flanging structure of the substrate 2. When the outer cover 1 and the substrate 2 first come into contact, the inclined surface of the first chamfer 12 can effectively improve the assembly efficiency, and there is no need to use processed image positioning for installation, greatly reducing the cost. It should be emphasized that since the wall thickness of the flanging structures of the outer cover and the substrate is relatively small (usually 0.1 - 0.15 mm), the chamfer cannot be stably processed on the straight line segments of the four sides and can only maintain a short length. Therefore, except for the chamfer position, other positions of the corresponding component on the side wall of the flanging of the outer cover or the substrate should be cleared to ensure that the chamfer position is the first to be contacted, and the chamfer is usually provided on the corresponding component with a thicker wall thickness.

[0064] The first chamfer of the above-mentioned first flanging structure and the first limiting boss of the second flanging structure are described around the first form, that is, the upper side is the outer cover and the lower side is the substrate, and the upper outer cover is buckled to the lower substrate. When the lower substrate can buckle the upper outer cover, resulting in the second flanging structure covering the first flanging structure, the above content can also be referred to. A second chamfer can be provided at the end of the second flanging structure, and a second limiting boss can be provided at the end of the first flanging structure. Other contents are the same as above and will not be elaborated here.

[0065] For easy understanding, please refer to Figure 7 , Figure 7 The structural schematic diagram of the first form in the embodiment of the present invention is shown. In the first form, the upper side is the outer cover 1 and the lower side is the substrate 2, and the upper outer cover 1 is buckled to the lower substrate 2. Figure 8 The structural schematic diagram of the second form in the embodiment of the present invention is shown. In the second form, the lower substrate 2 can buckle the upper outer cover 1.

[0066] Regardless of the way the outer cover and the substrate are buckled, laser welding needs to be performed on at least one overlapping surface to form an electrically conductive laser welding point to achieve the connection and conduction between the two. Among them, in order to better ensure the effectiveness of welding, preferably, welding needs to be performed near the inner edge position of the overlapping surface. Specifically, please refer to Figure 9 , Figure 9 The schematic diagram of the inner edge position in the first form of the embodiment of the present invention is shown. In the enlarged schematic diagram at position D, the inner edge position is shown. Please refer to Figure 10 , Figure 10A schematic diagram showing the position of the inner edge in the second form in the embodiment of the present invention is shown. Among them, the enlarged schematic diagram of position E shows the position of the inner edge. The reason for such a design is that for the micro flared opening formed by stamping the outer cover and the substrate, the inner edge of the overlapping surface is the minimum of the gap between the two. Welding at this position to form an electrically conductive laser welding point can ensure the effectiveness of welding.

[0067] The number of electrically conductive laser welding points is several dense points, forming a solder joint array on the overlapping surface. The more effective welding points there are, the greater the strength, and the more points there are, the higher the probability of conduction. This is because as long as there is one effective welding point, the conduction purpose can be achieved. In order to reduce the influence of the ineffective welding points (usually manifested as breakdown burns) on the overlapping surface on the inside of the housing, preferably, welding is performed on both sides of the same overlapping surface.

[0068] In the above embodiment, on both sides of the same overlapping surface, there are a first solder joint array and a second solder joint array respectively. The arrangement of the array is arbitrary and adjustable, and it needs to be designed in combination with the side shape and size of the outer cover and the substrate. The trajectories of the solder joint arrays on the same overlapping surface can be different, and the trajectories of the solder joint arrays on different overlapping surfaces can also be different. In addition, the electrically conductive laser welding points can be several independent solder joints or overlapping solder joints (manifested as lines), and can be used only for welding or in combination with dispensing in non-welding areas. Please refer to Figures 11 - 18 , which are schematic diagrams of a solder joint array in one of the embodiments of the present invention respectively. The blue circles in the figure are the electrically conductive laser welding points. Of course, the welding styles include but are not limited to Figures 11 - 18 the styles exemplified in, and those skilled in the art can select according to actual design requirements, which will not be elaborated here.

[0069] Another embodiment of the present invention provides a housing processing method, which is applied to the housing structure as described above, and includes steps S1 to S2, specifically as follows:

[0070] S1. Assemble the first body and the second body;

[0071] S2. Based on the selected laser parameters, perform laser welding on the corresponding overlapping surface to form the electrically conductive laser welding points.

[0072] It should be noted that the electrically conductive laser welding points are formed by the laser welding process. Lasers with wavelengths in the range of 530 - 1070 nm are more suitable for welding thin materials of the outer cover and the substrate in the embodiments of the present invention. The embodiments of the present invention preferably use a fiber laser. The fiber laser uses optical fiber as the gain medium and has a large surface area / volume ratio, which gives it very excellent heat dissipation performance. Even when a high-power fiber laser is selected, the gain medium will not be thermally damaged, thus effectively ensuring the welding quality and precision of small and micro electronic components, circuit boards with complex structures, and PCB boards and other small and complex structural parts.

[0073] For different electrically conductive laser welding points, different laser parameters can be used because the electrically conductive laser welding points can be distributed on one, two, three or even four surfaces, and the assembly gaps around the outer cover and the substrate are not equal. Different laser energies can offset or compensate for part of this influence. Preferably, in the embodiments of the present invention, the first body and the second body are preferably rectangular structures, and the four side surfaces of their edges are provided with flipping structures, and then an overlapping surface is formed when they are buckled with each other. A certain number of the electrically conductive laser welding points are distributed on one overlapping surface, and at least one of the remaining surfaces is coated with glue, including fixing glue for fixing and / or conductive glue for realizing electrical conduction. That is, if welding is only performed on one overlapping surface, it needs to be used in combination with glue. In addition, if electrically conductive laser welding points are welded on two overlapping surfaces, a set of relatively arranged overlapping surfaces is preferably selected.

[0074] Furthermore, only one solder joint array can also be provided on the same overlapping surface, as Figure 19 shown in the schematic diagram of one solder joint array in one embodiment of the present invention. When the assembly gap between the outer cover and the substrate is small, by adjusting the laser parameters, welding can also be performed on the outer overlapping contour line, as Figure 20 shown in the schematic diagram of the solder joint array near the contour line in one embodiment of the present invention. That is, the laser welding points are not all on the overlapping surface between the two but only partially on it. This welding method is more convenient for checking the success of welding.

[0075] A housing structure and a housing processing method provided by the embodiments of the present invention have at least one of the following beneficial effects:

[0076] (1) Design an outer cover and a substrate with a flanging structure. The two are buckled with each other, and the outer cover and the substrate are welded by laser to join the two, taking into account both the fixing and conduction functions;

[0077] (2) There is no need to use conductive glue, and electrical conduction to the ground can be achieved through the electrically conductive laser welding points, thus greatly simplifying the assembly process of the housing structure and reducing the use cost of the product assembly process;

[0078] (3) Without using a large amount of glue, it provides additional accommodation space for other functional devices inside the shell, thus ensuring the internal quality control requirements of the product while meeting the structural strength of the mobile phone lens;

[0079] (4) The resistance of the electrically conductive laser welding point is smaller and more stable, with better reliability, and the tensile and drop resistance performance of the product is higher;

[0080] (5) The electrically conductive laser welding points can be arranged and combined arbitrarily to form a solder joint array. When used in combination with fixed glue, it can meet different strength requirements in different scenarios, with better universality.

[0081] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims

1. A housing structure, applied to a camera, characterized in that, Comprising: A first body and a second body which are oppositely arranged; A first flanging structure is provided at the edge of the first body, and the first flanging structure bends and extends towards the second body; A second flanging structure is provided at the edge of the second body, and the second flanging structure bends and extends towards the first body; The first body and the second flanging structure of the second body are mutually buckled through the first flanging structure to form an overlapping surface, and a plurality of electrically conductive laser welding points are distributed on at least one of the overlapping surfaces.

2. The housing structure according to claim 1, characterized in that, The first body is an outer cover of a camera, and the second body is a motor substrate; or, The first body is a motor substrate, and the second body is an outer cover of a camera.

3. The housing structure according to claim 2, characterized in that, The first body is buckled on the second body so that the first flanging structure covers the second flanging structure.

4. The housing structure according to claim 3, characterized in that, A first chamfer is provided at the end of the first flanging structure, and the inclined surface of the first chamfer faces the second flanging structure.

5. The housing structure according to any one of claims 3 or 4, characterized in that, A first limiting boss is provided at the end of the second flanging structure, and the first limiting boss faces the non-bending surface of the first body.

6. The housing structure according to claim 1, characterized in that, The electrically conductive laser welding points are located at a position close to the inner edge of the overlapping surface.

7. The housing structure according to claim 1, wherein, The number of the electrically conductive laser welding points is multiple, and the multiple electrically conductive laser welding points form a welding point array on the overlapping surface.

8. The housing structure according to claim 7, characterized in that, The welding point array includes a first welding point array and a second welding point array, and the first welding point array and the second welding point array are distributed on both sides of the same overlapping surface.

9. The housing structure according to claim 1, characterized in that, A plurality of the electrically conductive laser welding points are distributed on one overlapping surface, and glue is coated on at least one of the remaining overlapping surfaces.

10. A method for machining a housing, which is applied to the housing structure as described in claim 1, and is characterized in that, Comprising: Assembling the first body and the second body; Based on selected laser parameters, performing laser welding on the corresponding overlapping surface to form the electrically conductive laser welding points.

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