Composite process of flexible circuit board and flexible circuit board with multi-layer structure

Abstract

The present invention relates to the technical field of flexible circuit boards, and more specifically to a composite process for flexible circuit boards and a flexible circuit board with a multi-layer structure, comprising the following steps: providing a linear guide wire; transmitting a predetermined length of the linear guide wire to a bending device via a feeding mechanism; performing a bending process via the bending device; cutting the linear guide wire via a cutting mechanism; performing a calendering process via a calendering mechanism to form a flat conductor layer; providing a lower PI layer and an upper PI layer; laminating the conductor layer between an upper adhesive layer and a lower adhesive layer; performing a hot pressing process via a hot pressing roller; and performing a die-cutting process via a die-cutting roller to form a flexible circuit board with a multi-layer structure. The present invention forms a flat conductor layer by bending the linear guide wire and then calendering the flat conductor layer, and then compositing the conductor layer between an upper PI layer and a lower PI layer to form a flexible circuit board. This method of preparing the conductor layer does not generate waste, greatly improving material utilization and reducing production costs.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit boards, and in particular to a composite process for flexible circuit boards and a flexible circuit board with a multi-layer structure. Background Art

[0002] As electronic devices develop towards miniaturization, lightweight and flexibility, flexible circuit boards are widely used in consumer electronics, automotive electronics and other fields due to their bendability, lightness and thinness.

[0003] At present, the manufacturing process of the inner conductor of the flexible circuit board mainly adopts the die-cutting process and the etching process.

[0004] The die-cutting process uses a die to stamp and cut the entire copper foil, while the etching process uses a chemical etching solution to remove unwanted portions of the copper foil. Both processes remove material to create a fixed-shaped conductor. However, during these processes, a large amount of copper foil is discarded as waste, resulting in low material utilization. This not only results in a significant waste of resources but also significantly increases production costs, hindering companies from effectively controlling costs in the competitive market. Summary of the Invention

[0005] The purpose of the present invention is to address the above-mentioned deficiencies in the prior art and to provide a composite process for a flexible circuit board and a flexible circuit board with a multi-layer structure.

[0006] The purpose of the present invention is achieved through the following technical solution: A composite process for a flexible circuit board comprises the following steps:

[0007] S1. Provide a linear guidewire;

[0008] S2, transmitting the linear guide wire to a predetermined length to the bending device through the feeding mechanism;

[0009] S3, a bending device bends the linear guide wire of a predetermined length;

[0010] S4, cutting off the end of the linear guide wire of the predetermined length by a cutting mechanism, thereby forming a guide wire segment;

[0011] S5, calendering the guide wire segment through a calendering mechanism to form a flat conductor layer;

[0012] S6. providing a lower PI layer and an upper PI layer; coating an upper adhesive layer on the bottom surface of the upper PI layer; and coating a lower adhesive layer on the top surface of the lower PI layer;

[0013] S7, laminating the conductor layer between the upper adhesive layer and the lower adhesive layer to form a semi-finished product;

[0014] S8, hot pressing the semi-finished product through a hot pressing roller;

[0015] S9, the semi-finished product after hot pressing is die-cut by a die-cutting roller to form a flexible circuit board with a multi-layer structure.

[0016] The present invention is further configured such that, in step S7, laminating the conductor layer between the upper adhesive layer and the lower adhesive layer to form a semi-finished product comprises the following steps:

[0017] A1. Provide release film;

[0018] A2. Laminating the conductor layer to the bottom surface of the release film through a first pressing roller;

[0019] A3. Lay the bottom surface of the release film on the top surface of the lower adhesive layer, and use a second laminating roller to laminate the conductor layer to the top surface of the lower adhesive layer, and then remove the release film.

[0020] A4. Use a third pressing roller to laminate the bottom surface of the upper adhesive layer to the top surface of the conductor layer to form a semi-finished product.

[0021] The present invention is further configured such that the feeding mechanism includes a feeding seat, an upper feeding roller rotatably arranged at the top of the feeding seat, a lower feeding roller rotatably arranged at the bottom of the feeding seat, and a feeding trough opened in the lower feeding roller; the linear guide wire is arranged between the feeding trough and the upper feeding roller.

[0022] The present invention is further configured such that the bending device includes a first bending mechanism and a second bending mechanism;

[0023] In step S3, the bending process of the linear guide wire of predetermined length includes the following steps:

[0024] B1, bending the rear portion of the linear guide wire of predetermined length by a first bending mechanism;

[0025] B2. Bend the front portion of the linear guide wire of predetermined length by a second bending mechanism.

[0026] The present invention is further configured as follows: the bending device includes a bending seat; a first fan-shaped groove and a second fan-shaped groove are provided on the top of the bending seat; the first bending mechanism includes a first bending axis rotatably provided on the bending seat and a first bending arm connected to the first bending axis; the first bending arm is movably provided in the first fan-shaped groove; a first positioning column for positioning the linear guide wire is provided on the top of the first bending arm; the second bending mechanism includes a second bending axis rotatably provided on the bending seat and a second bending arm connected to the second bending axis; the second bending arm is movably provided in the second fan-shaped groove; the second bending axis is movably provided in the bending seat; a second positioning column for positioning the linear guide wire is provided on the top of the second bending arm.

[0027] The present invention is further configured such that the second bending shaft is rotatably connected to a lifting ring at the bottom of the bending seat; and a reset spring is provided between the lifting ring and the bottom of the bending seat.

[0028] The present invention is further configured such that a driving frame is slidably provided at the bottom of the bending seat; a first driving arm is provided at one end of the driving frame; a second driving arm is provided at the other end of the driving frame; a first slider is provided for the first driving arm to be telescopically movable toward the second driving arm; a second slider is provided for the second driving arm to be telescopically movable toward the first driving arm; a first spring is provided between the first slider and the first driving arm; a second spring is provided between the second slider and the second driving arm; and the stiffness of the second spring is greater than that of the first spring.

[0029] The first slider is connected to the first rack; the second slider is connected to the second rack; the first bending shaft is fixedly connected to the first gear; the first gear is meshed with an intermediate gear that cooperates with the first rack; the second bending shaft is fixedly connected to the second gear for cooperating with the second rack.

[0030] The present invention is further configured such that the second slider is connected to a connecting block; the second rack is provided on the connecting block; the driving frame is connected to a push rod; the lifting ring is provided with a conical surface; the pushing rod is provided with an inclined surface that cooperates with the conical surface; the pushing rod drives the lifting ring through the cooperation between the conical surface and the inclined surface to drive the second bending axis to move upward; the bending seat is provided with an electric push rod; the output end of the electric push rod is connected to the connecting block.

[0031] The present invention is further configured such that a guide groove is provided at the bottom of the bending seat; the driving frame is slidably arranged in the guide groove; the first slider is provided with a first strip-shaped limit groove; the driving frame is provided with a first limit pin; the first limit pin is movably arranged in the first strip-shaped limit groove; the second slider is provided with a second strip-shaped limit groove; the driving frame is provided with a second limit pin; the second limit pin is movably arranged in the second strip-shaped limit groove.

[0032] A flexible circuit board with a multi-layer structure generated based on a composite process for a flexible circuit board comprises an upper PI layer, an upper adhesive layer, a conductor layer, a lower adhesive layer and a lower PI layer arranged in sequence from top to bottom; the conductor layer comprises a front portion, a middle portion and a rear portion connected in sequence; the front portion and the middle portion are bent; and the rear portion and the middle portion are bent.

[0033] Beneficial effects of the present invention: The present invention forms a flat conductor layer by bending a straight guide wire into shape and then rolling it, and then composites the conductor layer between the upper PI layer and the lower PI layer to form a flexible circuit board. This method of preparing the conductor layer does not generate waste, greatly improves material utilization, and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a structural exploded view of a multi-layer flexible circuit board of the present invention;

[0035] Figure 2 This is a flow chart of the composite process of the flexible circuit board of the present invention;

[0036] Figure 3 yes Figure 2 A partial enlarged view of part A in the middle;

[0037] Figure 4 This is a flow chart showing another perspective of the composite process of the flexible circuit board of the present invention;

[0038] Figure 5 It is a schematic structural diagram of the bending device of the present invention;

[0039] Figure 6 This is a structural schematic diagram of the bending device of the present invention from another perspective;

[0040] Figure 7 is a cross-sectional view of the bending device of the present invention;

[0041] Figure 8 This is a schematic diagram of the structure of the bending device of the present invention when the electric push rod is retracted;

[0042] Figure 9 This is a schematic structural diagram of the bending device of the present invention when it is extended for the first time;

[0043] Figure 10 This is a schematic structural diagram of the bending device of the present invention when it is extended for the second time;

[0044] Figure 11 This is a schematic structural diagram of the bending device of the present invention when it is extended for the third time;

[0045] Among them: 11. Upper PI layer; 12. Upper adhesive layer; 13. Conductor layer; 14. Lower adhesive layer; 15. Lower PI layer; 16. Front part; 17. Middle part; 18. Back part; 21. Straight guide wire; 22. Semi-finished product; 23. Flexible circuit board; 30. Die-cutting roller; 31. Cutting mechanism; 32. Calendering mechanism; 33. First glue coating roller; 34. Second glue coating roller; 35. Release film; 36. First pressing roller; 37. Second pressing roller; 38. Third pressing roller; 39. Hot pressing roller; 4. Feeding mechanism; 41. Feeding seat; 42. Upper feed roller; 43. Lower feed roller; 44. Feeding trough; 5. Bending seat; 51. First fan-shaped groove; 52. Second fan-shaped groove; 6. First bending axis ;61. First bending arm;62. First positioning column;63. First rack;64. First gear;65. Intermediate gear;7. Second bending axis;71. Second bending arm;72. Second positioning column;73. Lifting ring;74. Conical surface;75. Return spring;76. Push rod;77. Inclined surface;78. Second rack;79. Second gear;8. ​​Driving frame;81. First driving arm;82. Second driving arm;83. First slider;84. Second slider;85. First spring;86. Second spring;9. Electric push rod;91. Connecting block;92. Guide groove;93. First strip limit groove;94. First limit pin;95. Second strip limit groove;96. Second limit pin. DETAILED DESCRIPTION

[0046] The present invention is further described with reference to the following examples.

[0047] Depend on Figures 1 to 11 It can be seen that the composite process of a flexible circuit board described in this embodiment includes the following steps:

[0048] S1. Provide a linear guide wire 21, wherein the guide wire is a copper wire with a circular cross section;

[0049] S2, the linear guide wire 21 is transferred to the bending device by the feeding mechanism 4 to a predetermined length;

[0050] S3, the bending device bends the linear guide wire 21 of a predetermined length; the predetermined length is the total length of the conductor layer 13 after forming;

[0051] S4, cutting the end of the linear guide wire 21 of the predetermined length by the cutting mechanism 31, thereby forming a guide wire segment;

[0052] S5, the guide wire segment is subjected to a calendering process by the calendering mechanism 32, thereby forming a flat conductor layer 13;

[0053] S6, providing a lower PI layer 15 and an upper PI layer 11; coating an upper adhesive layer 12 on the bottom surface of the upper PI layer 11 by a first glue coating roller 33; coating a lower adhesive layer 14 on the top surface of the lower PI layer 15 by a second glue coating roller 34;

[0054] S7, laminating the conductor layer 13 between the upper adhesive layer 12 and the lower adhesive layer 14 to form a semi-finished product 22;

[0055] S8, the semi-finished product 22 is subjected to hot pressing treatment by the hot pressing roller 39;

[0056] S9. The hot-pressed semi-finished product 22 is die-cut by a die-cutting roller 30 to form a flexible circuit board 23 with a multi-layer structure; during the die-cutting, the lower PI layer 15, the upper PI layer 11, the upper adhesive layer 12 and the lower adhesive layer 14 are cut along the head end of the conductor layer 13, and the lower PI layer 15, the upper PI layer 11, the upper adhesive layer 12 and the lower adhesive layer 14 are cut along the end of the conductor layer 13.

[0057] Specifically, the composite process of the flexible circuit board described in this embodiment is to form a flat conductor layer 13 by bending the straight guide wire 21 into shape and then rolling it, and then composite the conductor layer 13 between the upper PI layer 11 and the lower PI layer 15 to form a flexible circuit board 23. This method of preparing the conductor layer 13 does not generate waste, greatly improves material utilization, and reduces production costs.

[0058] In the composite process of the flexible circuit board described in this embodiment, in step S7, the process of laminating the conductor layer 13 between the upper adhesive layer 12 and the lower adhesive layer 14 to form the semi-finished product 22 includes the following steps:

[0059] A1. Provide a release film 35;

[0060] A2. Lay the conductor layer 13 on the bottom surface of the release film 35 through the first pressing roller 36;

[0061] A3. Lay the bottom surface of the release film 35 on the top surface of the lower adhesive layer 14 , and use the second laminating roller 37 to laminate the conductor layer 13 to the top surface of the lower adhesive layer 14 , then remove the release film 35 .

[0062] A4. The bottom surface of the upper adhesive layer 12 is bonded to the top surface of the conductive layer 13 by the third pressing roller 38 to form a semi-finished product 22 .

[0063] In this embodiment of the present invention, a composite process for a flexible printed circuit board is described. The feed mechanism 4 includes a feed base 41, an upper feed roller 42 rotatably mounted on the top of the feed base 41, a lower feed roller 43 rotatably mounted on the bottom of the feed base 41, and a feed trough 44 defined within the lower feed roller 43. The linear guide wire 21 is disposed between the feed trough 44 and the upper feed roller 42. This arrangement allows the upper and lower feed rollers 42, 43, to rotate, thereby feeding the linear guide wire 21 to the bending device.

[0064] In the composite process of a flexible circuit board described in this embodiment, the bending device includes a first bending mechanism and a second bending mechanism;

[0065] In step S3, the bending process of the linear guide wire 21 of the predetermined length includes the following steps: B1, bending the rear part 18 of the linear guide wire 21 of the predetermined length by a first bending mechanism; B2, bending the front part 16 of the linear guide wire 21 of the predetermined length by a second bending mechanism; through the above settings, two bendings are performed so that the conductor layer 13 can form a predetermined shape.

[0066] The present embodiment describes a composite process for a flexible circuit board, wherein the bending device includes a bending seat 5; a first fan-shaped groove 51 and a second fan-shaped groove 52 are provided on the top of the bending seat 5; the first bending mechanism includes a first bending shaft 6 rotatably provided on the bending seat 5 and a first bending arm 61 connected to the first bending shaft 6; the first bending arm 61 is movably provided on the first fan-shaped groove 51; a first positioning column 62 for positioning the linear guide wire 21 is provided on the top of the first bending arm 61; the second bending mechanism includes a second bending shaft 7 rotatably provided on the bending seat 5 and a second bending arm 71 connected to the second bending shaft 7; the second bending arm 71 is movably provided on the second fan-shaped groove 52; the second bending shaft 7 is movably provided on the bending seat 5; a second positioning column 72 for positioning the linear guide wire 21 is provided on the top of the second bending arm 71.

[0067] Specifically, in the composite process of the flexible circuit board described in this embodiment, the feeding mechanism 4 first transmits the predetermined length of the linear guide wire 21 to the bending device, so that the linear guide wire 21 is stuck in the first positioning column 62. At this time, the second bending shaft 7 is in a descending state, so that the top surface of the second positioning column 72 is lower than the second fan-shaped groove 52. When the rear part 18 of the linear guide wire 21 of the predetermined length moves to the first positioning column 62, the first bending shaft 6 is driven to rotate, so that the first bending arm 61 swings to bend the rear part 18 of the linear guide wire 21 of the predetermined length. At the same time, the front part 16 of the linear guide wire 21 of the predetermined length moves to the top of the second bending arm 71. At this time, the second bending shaft 7 is driven to move upward, so that the front part 16 of the linear guide wire 21 of the predetermined length is stuck in the second positioning column 72 of the second bending arm 71, and then the second bending shaft 7 is driven to rotate, so that the second bending arm 71 swings to bend the front part 16 of the linear guide wire 21 of the predetermined length.

[0068] After the bending is completed, the feeding mechanism 4 continues to feed the bending device, pushing the bent product to move toward the cutting mechanism 31 until the end of the linear guide wire 21 of the predetermined length moves to the cutting mechanism 31. The cutting mechanism 31 cuts off the end of the linear guide wire 21 of the predetermined length to form an independent guide wire segment.

[0069] In the composite process for a flexible printed circuit board described in this embodiment, the second bending shaft 7 is rotatably connected to a lifting ring 73 at the bottom of the bending seat 5. A bearing is provided between the second bending shaft 7 and the lifting ring 73. The lifting ring 73 does not affect the rotation of the second bending shaft 7, and the lifting ring 73 can drive the second bending shaft 7 to rise and fall synchronously. A return spring 75 is provided between the lifting ring 73 and the bottom of the bending seat 5. Specifically, under the action of the lifting ring 73 and the return spring 75, the second bending shaft 7 is in a lowered state in a natural state, so that the top surface of the second positioning post 72 is lower than the second fan-shaped groove 52, preventing the second positioning post 72 from obstructing the swing of the linear guide wire 21 during the first bending.

[0070] The composite process of a flexible circuit board described in this embodiment is that a driving frame 8 is slidingly provided at the bottom of the bending seat 5; a first driving arm 81 is provided at one end of the driving frame 8; a second driving arm 82 is provided at the other end of the driving frame 8; the first driving arm 81 is telescopically movable toward the direction of the second driving arm 82 and is provided with a first slider 83; the second driving arm 82 is telescopically movable toward the direction of the first driving arm 81 and is provided with a second slider 84; a first spring 85 is provided between the first slider 83 and the first driving arm 81; a second spring 86 is provided between the second slider 84 and the second driving arm 82; the stiffness of the second spring 86 is greater than the stiffness of the first spring 85; the first slider 83 is connected to the first rack 63; the second slider 84 is connected to the second rack 78; the first bending shaft 6 is fixedly connected to the first gear 64; the first gear 64 is meshed with an intermediate gear 65 that cooperates with the first rack 63; the second bending shaft 7 is fixedly connected to the second gear 79 for cooperating with the second rack 78. The composite process of a flexible circuit board described in this embodiment, the second slider 84 is connected to the connecting block 91; the second rack 78 is arranged on the connecting block 91; the driving frame 8 is connected to the push rod 76; the lifting ring 73 is provided with a conical surface 74; the pushing rod 76 is provided with an inclined surface 77 cooperating with the conical surface 74; the pushing rod 76 drives the lifting ring 73 to move the second bending shaft 7 upward through the cooperation between the conical surface 74 and the inclined surface 77; the bending seat 5 is provided with an electric push rod 9; the output end of the electric push rod 9 is connected to the connecting block 91; wherein the sliding direction of the first slider 83, the sliding direction of the second slider 84, the sliding direction of the driving frame 8, the length direction of the first rack 63, the length direction of the second rack 78 and the telescopic direction of the electric push rod 9 are all arranged in parallel.

[0071] Specifically, the composite process of the flexible circuit board described in this embodiment is as follows: Figure 8 As shown, the electric push rod 9 is in a retracted state. At this time, the second rack 78 is not in contact with the second gear 79, and the push rod 76 is not in contact with the lifting ring 73. Under the action of the lifting ring 73 and the return spring 75, the second bending shaft 7 is in a descending state, the first rack 63 is engaged with the intermediate gear 65, and the first spring 85 and the second spring 86 are both in a relaxed state.

[0072] The feeding mechanism 4 transmits the predetermined length of the linear guide wire 21 to the bending device, so that the linear guide wire 21 is stuck in the first positioning column 62. At this time, the second bending shaft 7 is in a descending state, so that the top surface of the second positioning column 72 is lower than the second fan-shaped groove 52. When the rear portion 18 of the predetermined length of the linear guide wire 21 moves to the first positioning column 62, the driving electric push rod 9 is extended forward for the first time. Under the connection of the first spring 85 and the second spring 86, the first slider 83, the second slider 84, and the driving frame 8 are driven to move forward synchronously. Figure 9As shown, driven by the first rack 63, the first bending shaft 6 rotates until the first bending arm 61 abuts against the slot arm of the first fan-shaped slot 51 and cannot move, so that the first bending arm 61 swings to bend the rear part 18 of the predetermined length straight guide wire 21, and at the same time, the front part 16 of the predetermined length straight guide wire 21 moves to the top of the second bending arm 71.

[0073] Then, the electric push rod 9 is driven to extend forward for the second time. Since the first bending arm 61 cannot continue to move, the first rack 63 and the first slider 83 cannot continue to move forward. However, since the rigidity of the second spring 86 is greater than that of the first spring 85, the second slider 84 drives the driving frame 8 to move forward, overcoming the effect of the first spring 85. Figure 10 As shown, until the inclined surface 77 of the push rod 76 abuts against the conical surface 74 of the lifting ring 73, the push rod 76 drives the lifting ring 73 to move the second bending shaft 7 upward through the cooperation between the conical surface 74 and the inclined surface 77, so that the front part 16 of the linear guide wire 21 of predetermined length is stuck in the second positioning column 72 of the second bending arm 71. At this time, the push rod 76 cannot move forward, and the second rack 78 begins to engage with the second gear 79.

[0074] Then the electric push rod 9 is driven to extend forward for the third time. Since the first slider 83 and the driving frame 8 cannot move forward, the second slider 84 overcomes the action of the second spring 86 and moves forward. Figure 11 As shown, during the movement of the second rack 78, the second bending shaft 7 is driven to rotate by the second gear 79, so that the second bending arm 71 swings to bend the front portion 16 of the linear guide wire 21 of predetermined length.

[0075] After the bending is completed, the electric push rod 9 is reset, so that the whole is reset to Figure 8 Status shown.

[0076] Through the above arrangement, this embodiment can realize the sequential swinging of the first bending arm 61 and the second bending arm 71 by setting an electric push rod 9, and can prevent the second positioning column 72 from hindering the swinging of the linear guide wire 21.

[0077] In the composite process for a flexible printed circuit board described in this embodiment, the bottom of the bending seat 5 is provided with a guide groove 92; the driving frame 8 is slidably mounted in the guide groove 92; the first slider 83 is provided with a first strip-shaped limiting groove 93; the driving frame 8 is provided with a first limiting pin 94; the first limiting pin 94 is movably mounted in the first strip-shaped limiting groove 93; the second slider 84 is provided with a second strip-shaped limiting groove 95; the driving frame 8 is provided with a second limiting pin 96; the second limiting pin 96 is movably mounted in the second strip-shaped limiting groove 95. This arrangement enables the driving frame 8, the first slider 83, and the second slider 84 to slide stably.

[0078] The flexible circuit board 23 of the multi-layer structure generated by the composite process of the flexible circuit board described in this embodiment includes an upper PI layer 11, an upper adhesive layer 12, a conductor layer 13, a lower adhesive layer 14 and a lower PI layer 15 arranged in sequence from top to bottom; the conductor layer 13 includes a front part 16, a middle part 17 and a rear part 18 connected in sequence; the front part 16 and the middle part 17 are bent; the rear part 18 and the middle part 17 are bent.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A composite process for a flexible circuit board, characterized by: The following steps are involved: S1, providing a linear guide wire (21); S2, transmitting a predetermined length of the linear guide wire (21) to the bending device through the feeding mechanism (4); S3, a bending device bends the linear guide wire (21) of a predetermined length; S4, cutting off the end of the linear guide wire (21) of predetermined length by a cutting mechanism (31), thereby forming a guide wire segment; S5, subjecting the guide wire segment to a calendering process through a calendering mechanism (32), thereby forming a flat conductor layer (13); S6, providing a lower PI layer (15) and an upper PI layer (11); coating an upper adhesive layer (12) on the bottom surface of the upper PI layer (11); coating a lower adhesive layer (14) on the top surface of the lower PI layer (15); S7, laminating the conductor layer (13) between the upper adhesive layer (12) and the lower adhesive layer (14) to form a semi-finished product (22); S8, subjecting the semi-finished product (22) to a hot pressing treatment through a hot pressing roller (39); S9, the semi-finished product (22) after hot pressing is die-cut by a die-cutting roller (30) to form a flexible circuit board (23) with a multi-layer structure.

2. The composite process for a flexible circuit board according to claim 1, characterized in that: In step S7, the process of laminating the conductor layer (13) between the upper adhesive layer (12) and the lower adhesive layer (14) to form a semi-finished product (22) includes the following steps: A1, providing a release film (35); A2, laminating the conductor layer (13) to the bottom surface of the release film (35) through a first laminating roller (36); A3, laminating the bottom surface of the release film (35) to the top surface of the lower adhesive layer (14), laminating the conductor layer (13) to the top surface of the lower adhesive layer (14) by a second laminating roller (37), and then removing the release film (35); A4. The bottom surface of the upper adhesive layer (12) is bonded to the top surface of the conductor layer (13) by a third laminating roller (38) to form a semi-finished product (22).

3. The composite process of a flexible circuit board according to claim 1, characterized in that: The feeding mechanism (4) comprises a feeding seat (41), an upper feeding roller (42) rotatably arranged at the top of the feeding seat (41), a lower feeding roller (43) rotatably arranged at the bottom of the feeding seat (41), and a feeding trough (44) opened on the lower feeding roller (43); the linear guide wire (21) is arranged between the feeding trough (44) and the upper feeding roller (42).

4. The composite process for a flexible circuit board according to claim 1, characterized in that: The bending device includes a first bending mechanism and a second bending mechanism; In step S3, the bending process of the linear guide wire (21) of predetermined length comprises the following steps: B1, bending the rear portion (18) of the linear guide wire (21) of predetermined length by a first bending mechanism; B2. Bend the front portion (16) of the linear guide wire (21) of predetermined length by a second bending mechanism.

5. The composite process of a flexible circuit board according to claim 4, characterized in that: The bending device comprises a bending seat (5); a first fan-shaped groove (51) and a second fan-shaped groove (52) are provided on the top of the bending seat (5); the first bending mechanism comprises a first bending shaft (6) rotatably arranged on the bending seat (5) and a first bending arm (61) connected to the first bending shaft (6); the first bending arm (61) is movably arranged on the first fan-shaped groove (51); a first positioning column (62) for positioning the linear guide wire (21) is provided on the top of the first bending arm (61); the second bending mechanism comprises a second bending shaft (7) rotatably arranged on the bending seat (5) and a second bending arm (71) connected to the second bending shaft (7); the second bending arm (71) is movably arranged on the second fan-shaped groove (52); the second bending shaft (7) is movably arranged on the bending seat (5); and a second positioning column (72) for positioning the linear guide wire (21) is provided on the top of the second bending arm (71).

6. The composite process for a flexible circuit board according to claim 5, characterized in that: The second bending shaft (7) is rotatably connected to a lifting ring (73) at the bottom of the bending seat (5); a return spring (75) is provided between the lifting ring (73) and the bottom of the bending seat (5).

7. The composite process for a flexible circuit board according to claim 6, characterized in that: A driving frame (8) is provided on the bottom of the bending seat (5) for sliding movement; a first driving arm (81) is provided at one end of the driving frame (8); a second driving arm (82) is provided at the other end of the driving frame (8); a first slider (83) is provided for the first driving arm (81) to be telescopically movable in the direction of the second driving arm (82); a second slider (84) is provided for the second driving arm (82) to be telescopically movable in the direction of the first driving arm (81); a first spring (85) is provided between the first slider (83) and the first driving arm (81); a second spring (86) is provided between the second slider (84) and the second driving arm (82); the stiffness of the second spring (86) is greater than the stiffness of the first spring (85); The first slider (83) is connected to a first rack (63); the second slider (84) is connected to a second rack (78); the first bending shaft (6) is fixedly connected to a first gear (64); the first gear (64) is meshed with an intermediate gear (65) that cooperates with the first rack (63); the second bending shaft (7) is fixedly connected to a second gear (79) for cooperating with the second rack (78).

8. The composite process for a flexible circuit board according to claim 7, characterized in that: The second slider (84) is connected to a connecting block (91); the second rack (78) is provided on the connecting block (91); the driving frame (8) is connected to a push rod (76); the lifting ring (73) is provided with a conical surface (74); the pushing rod (76) is provided with an inclined surface (77) that matches the conical surface (74); the pushing rod (76) drives the lifting ring (73) to move the second bending shaft (7) upward through the matching of the conical surface (74) and the inclined surface (77); the bending seat (5) is provided with an electric push rod (9); the output end of the electric push rod (9) is connected to the connecting block (91).

9. The composite process for a flexible circuit board according to claim 7, characterized in that: The bottom of the bending seat (5) is provided with a guide groove (92); the driving frame (8) is slidably arranged in the guide groove (92); the first slider (83) is provided with a first strip-shaped limiting groove (93); the driving frame (8) is provided with a first limiting pin (94); the first limiting pin (94) is movably arranged in the first strip-shaped limiting groove (93); the second slider (84) is provided with a second strip-shaped limiting groove (95); the driving frame (8) is provided with a second limiting pin (96); the second limiting pin (96) is movably arranged in the second strip-shaped limiting groove (95).

10. A flexible circuit board with a multi-layer structure produced by the composite process of the flexible circuit board according to any one of claims 1 to 9, characterized in that: The invention comprises an upper PI layer (11), an upper adhesive layer (12), a conductor layer (13), a lower adhesive layer (14) and a lower PI layer (15) which are arranged in sequence from top to bottom; the conductor layer (13) comprises a front portion (16), a middle portion (17) and a rear portion (18) which are connected in sequence; the front portion (16) and the middle portion (17) are bent; and the rear portion (18) and the middle portion (17) are bent.

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