Trapezoidal heat absorption air duct in liquid cooling case of electronic equipment

Abstract

The invention discloses a trapezoidal heat absorption air duct in a liquid cooling case of electronic equipment. The trapezoidal heat absorption air duct comprises a liquid cooling module bracket fixedly connected in the case; the trapezoidal heat absorption air channel is an internal cavity channel of the liquid cooling module support, and the interior of the trapezoidal heat absorption air channel is fixedly connected with a heat conduction part; the powerful fan is mounted at the end part of the trapezoidal heat absorption air duct; the refrigerant connectors are arranged at the two ends of the trapezoidal heat absorption air duct and used for controlling in and out of refrigerants; the heat pipe interface is arranged on the liquid cooling module bracket; the liquid cooling module support made of the high-thermal-conductivity material is installed on the inner side of the case body, the interior of the liquid cooling module is cast into a trapezoidal barrel shape, heat absorption fins are attached to the interior of the liquid cooling module, and powerful fans are installed on one side or two sides of the liquid cooling module. High-power heating components such as a CPU, a GPU and the like in a case are connected with the liquid cooling module bracket through a heat pipe or are directly subjected to liquid cooling to dissipate heat.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic device chassis, and particularly to a trapezoidal hot air suction channel inside a liquid-cooled chassis of an electronic device. Background Art

[0002] At present, with the rise of cloud computing, various scales of data centers have been built one after another. Because of the large number of devices and high heat generation in these data centers, the heat dissipation problem has always troubled the builders and operators of data centers. Especially, the network devices in data centers are distributed densely and generate high heat. Their heat dissipation methods usually set heat dissipation holes or air flow channels on the chassis, and dissipate heat through the exchange of internal and external air of the chassis. To ensure the normal operation of the devices in each data center, basically, a low-temperature cold source is used to cool the air, and then the cold air is introduced into the electronic device chassis through the cabinet to dissipate heat from the devices.

[0003] Common electronic devices in existing data centers, such as network devices like switches and servers, are stacked densely on the rack. These electronic device chassis usually have heat dissipation holes or air flow channels, and the exchange of internal / external air of the chassis is their main heat dissipation means. As is well known, air has a small specific heat capacity and low heat transfer efficiency. Using air exchange as the intermediate medium for heat dissipation, when the device power is large, a lower temperature cold source and a large air flow rate are required. At this time, not only the fan consumes high energy and generates high noise, but the dust in the air flow is also likely to cause dust blockage of the fan, heat dissipation fins, and circuit board. The condensation of the low-temperature cold source surface cooler also increases the energy consumption, resulting in high energy consumption and high failure rate of the entire system; while the heat dissipation method of soaking the circuit board with a special insulating and heat-conducting liquid is still in the experimental stage and has not been applied on a large scale due to its complex technology, high cost, and environmental pollution of the soaking liquid; or the heat dissipation method of using a liquid-cooled chassis to circulate the internal air of the chassis through the internal power fan of the chassis and conduct heat exchange with the liquid-cooled module inside the chassis cannot effectively dissipate heat from the internal environment of the chassis due to the small power of the power fan and the chaotic air flow circulation path; therefore, the present invention proposes a trapezoidal hot air suction channel inside a liquid-cooled chassis of an electronic device. Summary of the Invention

[0004] The purpose of the present invention is to provide a trapezoidal hot air suction channel inside a liquid-cooled chassis of an electronic device to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A trapezoidal hot air suction channel inside a liquid-cooled chassis of an electronic device, comprising: A liquid-cooled module bracket fixedly connected inside the chassis; A trapezoidal hot air suction channel, which is the internal cavity of the liquid-cooled module bracket, and a heat-conducting part is fixedly connected inside the trapezoidal hot air suction channel; A high-strength fan, which is installed at the end of the trapezoidal hot air suction channel; The refrigerant interface is placed at both ends of the trapezoidal hot air intake duct and is used to control the inflow and outflow of refrigerant. The heat pipe interface is placed on the liquid cooling module bracket. The heat pipe interface is connected to a high-power device collector through a heat pipe. When the high-power fan operates, the air inside the chassis circulates through the trapezoidal hot air intake duct and the heat conduction part. The walls of the trapezoidal hot air intake duct and the heat conduction part will absorb the heat in the air flow, so that other electronic components inside the chassis can be cooled.

[0006] Preferably, the refrigerant interface includes a refrigerant outlet and a refrigerant inlet, and the refrigerant outlet and the refrigerant inlet are respectively connected to both ends of the trapezoidal hot air intake duct.

[0007] Preferably, the refrigerant inlet is connected to the high-pressure side of the liquid refrigerant pressure circulation system through a pipeline, and the refrigerant outlet is connected to the low-pressure side of the liquid refrigerant pressure circulation system through a pipeline, so as to form a complete refrigerant circulation path.

[0008] Preferably, the heat conduction part is an endothermic fin, and the endothermic fins are fixedly connected to the inner wall of the trapezoidal hot air intake duct at equal intervals.

[0009] Preferably, the inside of the trapezoidal hot air intake duct is a frustum-shaped structure, and its diameter gradually decreases from top to bottom.

[0010] Preferably, the top of the trapezoidal hot air intake duct is an air inlet, the bottom of the trapezoidal hot air intake duct is an air outlet, and the high-power fan is fixedly connected to the position of the air inlet.

[0011] Preferably, a circuit board is fixedly connected inside the chassis, and the high-power device collector is in contact with the CPU on the circuit board.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: In the present invention, a liquid cooling module bracket made of a material with high thermal conductivity is installed inside the chassis body. The inside of the liquid cooling module is cast into a trapezoidal barrel shape, with heat-absorbing fins attached inside, and powerful fans are installed on one side or both sides. High-power heat-generating components such as CPUs and GPUs inside the chassis are connected to the liquid cooling module bracket in the present invention through heat pipes or directly cooled by liquid to dissipate heat; the heat generated by other heat-generating components is absorbed by the trapezoidal hot air intake channel wall and heat-absorbing fins by the powerful fans inside the chassis to promote air circulation, and the heat-absorbing fins conduct the absorbed heat to the liquid cooling module bracket; the liquid refrigerant enters the refrigerant trapezoidal hot air intake channel through the refrigerant inlet for heat exchange with the liquid cooling module bracket, and then flows out through the refrigerant outlet to take away the heat on the liquid cooling module bracket, thereby achieving efficient heat dissipation of the electronic device. With this design, the heat generated by other heat-generating components inside the liquid cooling chassis can be heat-exchanged with the liquid cooling module through the trapezoidal hot air intake channel, so that the chassis body can be completely enclosed, and thus the chassis body has the functions of dust prevention and spray prevention. For the data center constructed using the present invention, the fans, heat dissipation fins, circuit boards, and components inside the chassis will not be blocked by dust; atomized water droplets will not enter the enclosed chassis, and thus an environmentally friendly spray fire protection system can be adopted.

[0013] The present invention makes full use of the cold source of the liquid cooling module in the liquid cooling chassis, uses powerful fans to circulate the hot air flow inside the chassis, and exchanges the hot air flow with the liquid cooling module through the trapezoidal hot air intake channel and heat-absorbing fins, effectively solving the heat dissipation problem of electronic components that cannot be directly connected to the liquid cooling module in the liquid cooling chassis, saving the cost of introducing additional cold sources, and solving the heat dissipation problem of the internal environment of the liquid cooling chassis. Compared with the heat dissipation technology currently commonly used in data centers, which cools air with a low-temperature surface cooler and then introduces the cooled air into the chassis, it is significantly more environmentally friendly and energy-saving. An environmentally friendly and energy-saving data center can also be established in areas with near-ambient temperature water resources; even in areas with water shortages, the cooling tower can be used to dissipate heat for the equipment in the data center for most of the year. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of the present invention; Figure 2 is a schematic structural diagram of the trapezoidal hot air intake channel of the present invention.

[0015] In the figure: 1. Refrigerant outlet; 2. Refrigerant inlet; 3. Trapezoidal hot air intake channel; 4. Heat-absorbing fins; 5. Liquid cooling module bracket; 7. Powerful fan; 8. Heat pipe interface; 9. High-power device collector; 10. Heat pipe; 11. Circuit main board; 12. Chassis. DETAILED DESCRIPTION OF THE INVENTION

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0017] Please refer to Figure 1 - Figure 2 , the present invention provides a technical solution: a trapezoidal hot air suction duct inside a liquid-cooled chassis of an electronic device, including: a liquid-cooling module bracket 5 fixedly connected inside the chassis 12; the trapezoidal hot air suction duct 3 is the internal cavity of the liquid-cooling module bracket 5, and a heat conduction part is fixedly connected inside the trapezoidal hot air suction duct 3; a powerful fan 7 is installed at the air inlet end of the trapezoidal hot air suction duct 3; refrigerant interfaces are arranged at both ends of the trapezoidal hot air suction duct 3 for controlling the inlet and outlet of the refrigerant; a heat pipe interface 8 is fixedly connected to the liquid-cooling module bracket 5, and the heat pipe interface 8 is connected to a high-power device collector 9 through a heat pipe 10; when the powerful fan 7 operates, the air inside the chassis 12 circulates through the trapezoidal hot air suction duct 3 and the heat conduction part, and the walls of the trapezoidal hot air suction duct 3 and the heat conduction part will absorb the heat in the air flow, so that other electronic components inside the chassis 12 can be cooled.

[0018] It should be noted that in this embodiment, the liquid cooling module bracket is fixed inside the chassis, playing the role of supporting and fixing the liquid cooling system. It provides a stable platform for the entire liquid cooling system and is connected to other heat dissipation components. The trapezoidal hot air intake duct 3 serves as a channel for air flow, guiding the air flow and being able to absorb heat from the air through its surface. The trapezoidal setting of the duct helps to improve the air flow velocity and heat exchange efficiency. The liquid cooling module bracket 5 guides the cold air flow through this duct, enhancing the overall heat dissipation effect. The heat conduction part inside the trapezoidal hot air intake duct plays the role of heat conduction. When the air flow inside the chassis passes through this area, the heat conduction part absorbs the heat therein and guides it to the liquid cooling system or other heat dissipation components. The powerful fan is used to drive the air flow inside the chassis and guide the air flow through the trapezoidal hot air intake duct 3. The fan improves the contact efficiency between the air and heat exchange materials such as the heat conduction part and the refrigerant through a strong air flow, promoting more efficient heat transfer. The refrigerant interfaces are arranged at both ends of the trapezoidal hot air intake duct, used to regulate the inlet and outlet of the refrigerant, ensuring that the liquid cooling system can conduct heat exchange at an appropriate time. The heat pipe interface is connected to the high-power device collector 9 through the heat pipe 10, realizing the heat conduction from high-heat electronic components such as the CPU or GPU to the cooling system. The heat pipe can quickly transfer the heat to the liquid cooling system when a large amount of heat is generated by high-power devices, avoiding local overheating. When the powerful fan 7 operates, the air inside the chassis circulates through the trapezoidal hot air intake duct 3 and the heat conduction part. The wall surface of the duct and the heat conduction part will absorb the heat in the air flow, helping to reduce the temperature of other electronic components inside the chassis. The liquid cooling system further strengthens the heat transfer through the circulation of the refrigerant and the conduction of the heat pipe, stabilizing the temperature inside the chassis and ensuring the normal operation of the electronic equipment. This application does not rely on internal / external air exchange for heat dissipation, so that the chassis can be designed in a closed and spray-proof form, thus avoiding dust blockage of the internal fans, heat dissipation fins, circuit boards and components in the chassis; and for a data center built with such a chassis, since there is no longer a worry about water mist entering the chassis, an environmentally friendly and economical spray fire protection system can be adopted. Such a data center is necessarily energy-saving, environmentally friendly and noiseless.

[0019] In one embodiment, the refrigerant interfaces include a refrigerant outlet 1 and a refrigerant inlet 2. The refrigerant outlet 1 and the refrigerant inlet 2 are respectively connected to both ends of the trapezoidal hot air intake duct 3. The refrigerant inlet 2 is connected to the high-pressure side of the liquid refrigerant pressure circulation system through a pipeline, and the refrigerant outlet 1 is connected to the low-pressure side of the liquid refrigerant pressure circulation system through a pipeline, thus forming a complete refrigerant circulation path.

[0020] It should be noted that in this embodiment, a liquid refrigerant pressure circulation system including a cold source needs to be established. The refrigerant inlet is connected to the high-pressure side of the liquid refrigerant pressure circulation system, and the refrigerant outlet is connected to the low-pressure side of the liquid refrigerant pressure circulation system. An efficient heat conduction path independent of air exchange is established between the main high-power heat-generating components inside the chassis and the cold source outside the chassis. The heat generated by other heat-generating components inside the chassis can be heat-exchanged with the liquid cooling module through the trapezoidal hot air intake duct. Because the liquid cooling efficiency is high, the more equipment there is and the more concentrated it is placed, the lower the system construction and operation costs. The refrigerant interface consists of two parts: refrigerant outlet 1 and refrigerant inlet 2. These two parts are respectively connected to both ends of the trapezoidal hot air intake duct to form the inlet and outlet channels of the liquid cooling system. The setting of the refrigerant interface enables the refrigerant to enter from outside the system, conduct heat exchange inside, and then discharge heat through the refrigerant outlet. The structure of the refrigerant circulation ensures that the refrigerant can flow when the system is working, and the liquid cooling module is used to transfer heat. Refrigerant inlet 2 is connected to the high-pressure side of the liquid refrigerant pressure circulation system through a pipeline. When the liquid refrigerant passes through the high-pressure side, it is compressed and sent into the system. Refrigerant outlet 1 is connected to the low-pressure side of the liquid refrigerant pressure circulation system through a pipeline. When the heat is absorbed by the liquid cooling module, the refrigerant changes from liquid to gas, the temperature rises, and then it is discharged from refrigerant outlet 1 and returns to the low-pressure side. The refrigerant forms a closed cycle in the system. The refrigerant takes away heat from electronic components or other high-temperature areas during the cycle, is cooled by the refrigerant pressure circulation system, and then enters the high-pressure side of the system through refrigerant inlet 2, so that the entire cooling system operates continuously and effectively.

[0021] In one embodiment, the heat-conducting part is the heat-absorbing fin 4, and the heat-absorbing fins 4 are fixedly connected to the inner wall of the trapezoidal hot air intake duct 3 at equal intervals.

[0022] It should be noted that in this embodiment, the heat-absorbing fins are cast inside the trapezoidal hot air intake duct. The trapezoidal hot air intake duct is the internal cavity of the liquid cooling module, which can make the air inside the chassis contact the heat-absorbing fins on a large area, improving the heat exchange efficiency between the air and the liquid cooling module. The liquid cooling module bracket can directly conduct heat through the trapezoidal hot air intake duct and the heat-absorbing fins to reduce the thermal resistance. The air inside the chassis 12 circulates through the trapezoidal hot air intake duct 3 and the internal heat-absorbing fins 4. The wall of the trapezoidal hot air intake duct 3 and the heat-absorbing fins 4 will absorb the heat in the air flow, so that other electronic components inside the chassis 12 can dissipate heat.

[0023] In one embodiment, the inside of the trapezoidal hot air intake duct 3 is in a frustum shape, and its diameter gradually decreases from top to bottom. The top of the trapezoidal hot air intake duct 3 is the air inlet, and the bottom of the trapezoidal hot air intake duct 3 is the air outlet. The powerful fan 7 is fixedly connected to the position of the air inlet.

[0024] It should be noted that, in this embodiment, the air inside the chassis penetrates from the large-diameter side of the trapezoidal air duct to the small-diameter side of the trapezoidal air duct. The air flows into the large-diameter side of the pipe and is pressurized and heated inside the pipe. The hot air flow emitted by the electronic components not directly connected to the liquid cooling module will be pushed by the powerful fan 7 from the large-diameter side of the trapezoidal hot air suction duct 3 to the small-diameter side of the trapezoidal hot air suction duct 3. During the process of the air flow flowing through the trapezoidal hot air suction duct 3 from the large-diameter side to the small-diameter side, the air will be compressed, resulting in an increase in air pressure and temperature. At this time, the inner wall of the trapezoidal hot air suction duct 3 and the internal heat absorption fins 4 will effectively exchange heat with the hot air flow in a timely manner. When the air flow flows out of the trapezoidal hot air suction duct 3, the pressure drops suddenly, and the air temperature also decreases accordingly. Coupled with the heat absorbed by the inner wall of the trapezoidal hot air suction duct 3 and the heat absorption fins 4, the air temperature at the air outlet is lower than the air temperature at the air inlet.

[0025] In one embodiment, a circuit board 11 is fixedly connected inside the chassis 12, and the high-power device collector 9 is in contact with the CPU on the circuit board 11.

[0026] It should be noted that, in this embodiment, in the liquid-cooled chassis of the electronic device, the heat dissipation of the main high-power heat-generating components such as the CPU and GPU is solved by means of heat pipes or direct liquid connection. The heat of the power supply and other heat-generating components will be directly dissipated into the chassis interior. The powerful fans installed on one or both sides of the hot air suction duct can quickly circulate the air inside the liquid-cooled chassis. After the air flow passes through the trapezoidal hot air suction duct and the heat absorption fins, the cooling efficiency of the air inside the chassis will be maximized.

[0027] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention.

[0028] In addition, the terms "first", "second", "third", "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", "fourth" may explicitly or implicitly include at least one of such features.

[0029] In the present invention, unless otherwise clearly specified or limited, terms such as "installation", "setting", "connection", "fixation", "swivel connection" and the like shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. Unless otherwise clearly limited, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A trapezoidal hot air suction duct inside a liquid-cooled chassis of an electronic device, characterized in that: Comprising: A liquid cooling module bracket (5) fixedly connected inside the chassis (12); A trapezoidal hot air suction duct (3), the trapezoidal hot air suction duct (3) being the internal cavity of the liquid cooling module bracket (5), and a heat conducting part being fixedly connected inside the trapezoidal hot air suction duct (3); A high-strength fan (7), the high-strength fan (7) being installed at the end of the trapezoidal hot air suction duct (3); A refrigerant interface, the refrigerant interface being placed at both ends of the trapezoidal hot air suction duct (3) for controlling the inlet and outlet of the refrigerant; A heat pipe interface (8), the heat pipe interface (8) being placed on the liquid cooling module bracket (5), and the heat pipe interface (8) being connected to a high-power device collector (9) through a heat pipe (10).

2. The trapezoidal hot air suction duct inside the liquid-cooled chassis of an electronic device according to claim 1, wherein: The refrigerant interface includes a refrigerant outlet (1) and a refrigerant inlet (2), the refrigerant outlet (1) and the refrigerant inlet (2) being respectively connected to both ends of the trapezoidal hot air suction duct (3).

3. The trapezoidal hot air suction duct inside the liquid-cooled chassis of an electronic device according to claim 2, characterized in that: The refrigerant inlet (2) is connected to the high-pressure side of the liquid refrigerant pressure circulation system through a pipeline, and the refrigerant outlet (1) is connected to the low-pressure side of the liquid refrigerant pressure circulation system through a pipeline, thereby forming a complete refrigerant circulation path.

4. The trapezoidal hot air suction duct inside the liquid-cooled chassis of an electronic device according to claim 1, characterized in that: The heat conducting part is a heat absorption fin (4), and the heat absorption fin (4) is fixedly connected to the inner wall of the trapezoidal hot air suction duct (3) at equal intervals.

5. The trapezoidal hot air suction duct inside the liquid-cooled chassis of an electronic device according to claim 1, wherein: The inside of the trapezoidal hot air suction duct (3) is a frustum-shaped structure, and its diameter gradually decreases from top to bottom.

6. The trapezoidal hot air suction duct inside the liquid-cooled chassis of an electronic device according to claim 5, characterized in that: The top of the trapezoidal hot air suction duct (3) is an air inlet, the bottom of the trapezoidal hot air suction duct (3) is an air outlet, and the high-strength fan (7) is fixedly connected at the position of the air inlet.

7. An internal trapezoidal hot air suction duct of a liquid-cooled chassis of an electronic device according to claim 1, characterized in that: A circuit board (11) is fixedly connected inside the chassis (12), and the high-power device collector (9) is in contact with the CPU on the circuit board (11).

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