Heat dissipation module and laser

Abstract

The present invention provides a heat dissipation module and a laser, and relates to the technical field of heat dissipation modules and lasers. The heat dissipation module includes a main body, which includes a bottom surface and a top surface spaced apart from each other. The main body has a first end and a second end arranged along a first direction, and a third end and a fourth end arranged along a second direction. From the first end to the second end, the top surface includes a first surface and a second surface arranged obliquely relative to the bottom surface, and the distance between the first surface and the bottom surface gradually decreases, while the distance between the second surface and the bottom surface gradually increases. The first surface and the second surface respectively define a first part and a second part with the bottom surface. The first part is provided with a first liquid inlet branch and a first liquid outlet branch, and the second part is provided with a total liquid outlet pipeline, and the first liquid outlet branch is connected to the total liquid outlet pipeline via the first part and the second part. The first liquid outlet branch includes a first transverse flow channel section extending along the first direction. The length of the first transverse flow channel section in the second direction gradually increases from the first end toward the second end.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation modules and lasers, and in particular to a heat dissipation module and a laser. Background Art

[0002] The laser has a heat dissipation module, the chip is fixed on the heat dissipation module, a coolant flow channel is set inside the heat dissipation module, and a mounting structure is provided on the top surface of the heat dissipation module. Each mounting structure has a liquid outlet and a liquid inlet. A chip is mounted on the mounting structure and covers the liquid outlet and the liquid inlet.

[0003] The coolant flow path consists of an inlet branch and an outlet branch. All inlet holes are connected to the inlet branch, and all outlet holes are connected to the outlet branch. There are multiple mounting structures and chips, and they correspond one to one. As a result, the closer to the main outlet of the coolant flow path, the greater the liquid flow rate. However, the channel walls of the outlet branch will create resistance to the liquid, affecting the liquid outflow efficiency. Summary of the Invention

[0004] The object of the present invention is to provide a heat dissipation module and a laser, so as to alleviate the technical problem of low liquid discharge efficiency of the heat dissipation module in the existing laser.

[0005] In a first aspect, the present invention provides a heat dissipation module, comprising: a main body, the main body comprising a bottom surface and a top surface spaced apart from each other; the main body having a first end and a second end arranged along a first direction, and a third end and a fourth end arranged along a second direction;

[0006] Along the direction from the first end to the second end, the top surface includes a first surface and a second surface that are inclined relative to the bottom surface, and the distance between the first surface and the bottom surface gradually decreases, while the distance between the second surface and the bottom surface gradually increases;

[0007] The first surface and the second surface define a first portion and a second portion with the bottom surface respectively;

[0008] A first chip mounting area is provided on the first surface; a first liquid inlet branch and a first liquid outlet branch are provided on the first portion, and the first liquid inlet branch and the first liquid outlet branch are used to implement liquid cooling circulation for the first chip mounting area;

[0009] The second part is provided with a total liquid outlet pipeline, and the first liquid outlet branch is connected to the total liquid outlet pipeline through the first part and the second part;

[0010] The first liquid outlet branch includes a first transverse flow channel section extending along a first direction; a length of the first transverse flow channel section in the second direction gradually increases from the first end toward the second end.

[0011] A second chip mounting area is provided on the second surface; a second liquid inlet branch and a second liquid outlet branch are provided inside the second portion, and the second liquid inlet branch and the second liquid outlet branch are used for liquid cooling circulation of the second chip mounting area;

[0012] The second liquid outlet branch is communicated with the main liquid outlet pipeline, and the length of the second liquid outlet branch in the second direction gradually increases from the first end toward the second end.

[0013] Furthermore, a main liquid inlet pipeline is provided inside the first part; the first liquid inlet branch and the second liquid inlet branch are respectively connected to the main liquid inlet pipeline.

[0014] Furthermore, the first liquid outlet branch includes a third transverse flow channel section extending along the first direction, and the liquid flows from the second end toward the first end. The length of the third transverse flow channel section in the up and down directions gradually increases so that the cross-sectional area of ​​the third transverse flow channel section gradually increases.

[0015] Furthermore, the number of the first chip mounting area, the first liquid inlet branch and the first liquid outlet branch is at least two, and the first liquid inlet branch and the first liquid outlet branch correspond to each other one by one to form a liquid supply branch; there are at least two first liquid outlet branches that converge and are connected to the total liquid outlet pipeline at the boundary between the first part and the second part; or, each first liquid outlet branch is separately connected to the total liquid outlet pipeline at the boundary between the first part and the second part.

[0016] Furthermore, the second part is provided with an optical fiber connecting tube; a heat dissipation channel is provided inside the second part, one end of the heat dissipation channel is connected to the total liquid inlet pipeline, and the other end is connected to the total liquid outlet pipeline.

[0017] Furthermore, the second liquid inlet branch of the liquid supply branch closest to the heat dissipation channel is located between the heat dissipation channel and the second liquid outlet branch; the second liquid inlet branch and the heat dissipation channel constitute a common channel; the liquid inlet of the second liquid inlet branch is the same as the liquid inlet of the heat dissipation channel.

[0018] Furthermore, the second part is provided with an optical fiber connecting tube; a connecting pipe is provided in the second part, one end of the connecting pipe is connected to the outlet of the first liquid outlet branch at the boundary between the first part and the second part, and the other end of the connecting pipe is connected to the total liquid outlet pipe; the connecting pipe is located directly below the optical fiber connecting tube.

[0019] Furthermore, the second liquid outlet branch includes a second transverse flow channel section extending along the first direction, and the liquid flows from the first end toward the second end; from the first end toward the second end, the length of the second transverse flow channel section in the up and down directions gradually increases, so that the cross-sectional area of ​​the second transverse flow channel section gradually increases, and / or, a middle part is provided between the first part and the second part, and a liquid inlet branch channel is provided in the middle part, the total liquid inlet pipeline, the first liquid inlet branch and the second liquid inlet branch are all connected to the liquid inlet branch channel, and / or, the outlet of any first liquid outlet branch is connected to any second liquid outlet branch at the boundary between the first part and the second part.

[0020] In a second aspect, the present invention provides a laser comprising the above-mentioned heat dissipation module.

[0021] The present invention has at least the following advantages or beneficial effects:

[0022] The heat dissipation module provided by the present invention includes: a main body, the main body includes a bottom surface and a top surface arranged at an interval up and down; the main body has a first end and a second end arranged along the first direction, and a third end and a fourth end arranged along the second direction; along the first end to the second end, the top surface includes a first surface and a second surface arranged obliquely relative to the bottom surface, and the distance between the first surface and the bottom surface gradually decreases, and the distance between the second surface and the bottom surface gradually increases; the first surface and the second surface respectively define a first part and a second part with the bottom surface; a first chip mounting area is provided on the first surface; the first part is provided with a first liquid inlet branch and a first liquid outlet branch, the first liquid inlet branch and the first liquid outlet branch are used to realize liquid cooling circulation for the first chip mounting area; the second part is provided with a total liquid outlet pipeline, the first liquid outlet branch is connected to the total liquid outlet pipeline through the first part and the second part; the first liquid outlet branch includes a first transverse flow channel section extending along the first direction; the length of the first transverse flow channel section in the second direction gradually increases from the first end toward the second end.

[0023] In this solution, the main body is divided into a first portion and a second portion in the first direction. The first liquid inlet branch and the first liquid outlet branch for dissipating heat from the chip on the first surface are located within the first portion, while the main liquid outlet pipe for returning coolant to the outside world is located in the second portion. Because the first and second surfaces are both inclined, the thickness (in the vertical direction) of the central portion of the main body is relatively thin. The number of chips in the first chip mounting area is multiple. Coolant is diverted from the first liquid inlet branch and flows below the chip. After exchanging heat with the chip, it converges back to the first liquid outlet branch. The length of the first transverse flow channel section in the second direction gradually increases. Due to the limitations of the main body structure (narrow in the middle and tall at both ends), when the height of the middle position cannot be increased, the cross-sectional area of ​​the first transverse flow channel section is gradually increased by increasing the width. The increased cross-sectional area can reduce the resistance to the coolant from the side walls of the pipe as more and more coolant converges, thereby facilitating smoother fluid flow.

[0024] The laser provided by the present invention includes the above-mentioned heat dissipation module. Since the laser provided by the present invention uses the above-mentioned heat dissipation module, the laser provided by the present invention also has the advantages of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of a laser provided in an embodiment of the present invention;

[0027] Figure 2 A bottom view of a laser provided by an embodiment of the present invention;

[0028] Figure 3 A top view of the heat dissipation module provided in Example 1 of the present invention;

[0029] Figure 4 for Figure 3 Cross-sectional view in the AA direction;

[0030] Figure 5 for Figure 3 Cross-sectional view in the middle BB direction;

[0031] Figure 6 A side view of the laser provided in Example 1 of the present invention;

[0032] Figure 7 for Figure 6Cross-sectional view of the heat dissipation module in the center CC direction;

[0033] Figure 8 for Figure 6 Cross-sectional view of the heat dissipation module in the middle DD direction;

[0034] Figure 9 A schematic diagram of an internal flow channel of a heat dissipation module provided in Example 2 of the present invention;

[0035] Figure 10 A schematic diagram of another internal flow channel of the heat dissipation module provided in Example 2 of the present invention;

[0036] Figure 11 Schematic diagram of the internal flow channel of the heat dissipation module provided in Example 3 of the present invention.

[0037] Icon: 1-main body; 11-bottom surface; 12-first surface; 121-first chip mounting area; 13-second surface; 131-second chip mounting area;

[0038] 21-first liquid inlet branch; 22-first liquid outlet branch; 221-first transverse flow channel section; 222-third transverse flow channel section;

[0039] 31 - second liquid inlet branch; 32 - second liquid outlet branch; 321 - second transverse flow channel section; 33 - universal flow channel;

[0040] 41-total liquid inlet pipeline; 42-total liquid outlet pipeline;

[0041] 5-Connecting pipeline;

[0042] 6- heat dissipation channel;

[0043] 7-Liquid inlet branch channel;

[0044] 8-Fiber optic connecting tube. DETAILED DESCRIPTION

[0045] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0048] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like indicate positions or locations based on the positions shown in the accompanying drawings, or the positions or locations in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0049] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0050] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0051] like Figures 1-9 As shown, the heat dissipation module provided by the present invention is arranged inside the shell of the laser, and includes: a main body 1, and the shape of the main body 1 is roughly a rectangular parallelepiped.

[0052] like Figure 1 、 Figure 4 and Figure 5 As shown, the main body 1 includes a bottom surface 11 and a top surface spaced apart from each other. The bottom surface 11 is substantially flat, while the top surface is substantially V-shaped.

[0053] like Figure 3As shown, the main body 1 has a first end and a second end sequentially arranged along a first direction, and a third end and a fourth end sequentially arranged along a second direction. In this embodiment, the first direction, the second direction, and the up-down direction are perpendicular to each other. In other feasible solutions, the first direction, the second direction, and the up-down direction may not be completely perpendicular.

[0054] like Figure 3-Figure 5 As shown, along the direction from the first end to the second end, the top surface includes a first surface 12 and a second surface 13 arranged in sequence. A first chip mounting area is provided on the first surface 12, and a second chip mounting area is provided on the second surface 13. There are two of each. The first surface 12 and the second surface 13 are both inclined relative to the bottom surface 11, and the distance between the first surface 12 and the bottom surface 11 gradually decreases, while the distance between the second surface 13 and the bottom surface 11 gradually increases. The top surface is roughly "V"-shaped. The chip mounted on the first chip mounting area and the chip mounted on the second chip mounting area can both emit light toward the middle position, thereby achieving coupling of lasers on both sides ( Figure 3 The converging light path is not shown).

[0055] In the first direction, a portion between the first surface 12 and the bottom surface 11 forms a first portion, and a portion between the second surface 13 and the bottom surface 11 forms a second portion.

[0056] like Figure 3 and Figure 7 As shown, in order to cool the chip installed in the first chip mounting area 121, the first part is provided with a first liquid inlet branch 21, a first liquid outlet branch 22 and a total liquid inlet pipeline 41; wherein, the first chip mounting area 121, the first liquid inlet branch 21, and the first liquid outlet branch 22 correspond one to one.

[0057] The first chip mounting area 121 includes a plurality of mounting slots arranged in a row, each of which is equipped with a chip. The mounting slots are provided with an inlet hole and an outlet hole respectively connected to the first liquid inlet branch 21 and the first liquid outlet branch 22. The coolant in the first liquid inlet branch 21 flows upward from the inlet hole into the mounting slot, then contacts the bottom surface 11 of the chip, and after heat exchange, flows downward from the outlet hole and enters the first liquid outlet branch 22.

[0058] In order to reduce the volume of the main body 1, the total liquid inlet pipeline 41 and the total liquid outlet pipeline 42 are respectively arranged in the first part and the second part, separated from each other to achieve uniform distribution.

[0059] like Figure 3 and Figure 7As shown, a second chip mounting area 131 is provided on the second surface 13 for mounting a chip; a second liquid inlet branch 31, a second liquid outlet branch 32 and a total liquid outlet pipeline 42 are provided inside the second part, the second liquid inlet branch 31 is used to supply liquid to the second chip mounting area 131, and the second liquid outlet branch 32 is used to return liquid to the second chip mounting area 131, and the coolant flow form is roughly the same as that of the first part.

[0060] like Figure 4 and Figure 7 As shown, a middle part 16 is provided between the first part and the second part, and the middle part 16 is provided with a liquid inlet branch channel 7. The total liquid inlet pipeline, the first liquid inlet branch 21 and the second liquid inlet branch 31 are all connected to the liquid inlet branch channel 7. The liquid inlet branch channel 7 is located in the middle position and outputs coolant to both sides of the first end and the second end.

[0061] The first and second branch outlets 22 and 32 are each connected to the main outlet pipeline 42. As they approach the main outlet pipeline 42, the cross-sectional area of ​​the first branch outlet 22 and the cross-sectional area of ​​the second branch outlet 32 ​​gradually increase, thereby reducing the resistance of the converging fluids to the channel walls. The closer the channel approaches the main outlet pipeline 42, the more coolant flows into the first and second branch outlets 22 and 32, requiring a larger channel cross-sectional area.

[0062] Specifically, since the first liquid outlet branch 22 is located in the first part and the total liquid outlet pipeline 42 is located in the second part, the first liquid outlet branch 22 is connected to the total liquid outlet pipeline 42 through the first part and the second part; the first liquid outlet branch 22 includes a first transverse flow channel section 221 extending along the first direction, and the liquid flows from the first end toward the second end. From the first end to the second end, the first transverse flow channel section 221 is affected by the height (the height cannot be increased), and the length of the first transverse flow channel section 221 in the second direction gradually increases, so that the cross-sectional area of ​​the first transverse flow channel section 221 gradually increases, which can reduce the resistance of the side wall of the pipeline to the coolant after more and more coolant converges, so that the fluid flows smoother.

[0063] In this embodiment, in the first direction, the top surface of the main body 1 is in a "V" shape, thereby realizing chip coupling between the first part and the second part, but causing the middle position thereof to be relatively narrow, affecting the flow of the coolant in the first transverse flow channel section 221. Therefore, under the premise that the vertical height cannot be increased, the length of the first transverse flow channel section 221 is increased in the second direction, thereby increasing the cross-sectional area of ​​the first transverse flow channel section 221, thereby reducing the fluid resistance.

[0064] like Figure 4 and Figure 7 As shown, the first liquid outlet branch 22 also includes a third transverse flow channel section 222 extending along the first direction, and the liquid flows from the second end toward the first end. Since the fluid direction in the third transverse flow channel section 222 is from the second end toward the first end, the height change of the first part of the main body 1 can be used to set the length of the third transverse flow channel section 222 in the up and down directions to gradually increase, so that the cross-sectional area of ​​the third transverse flow channel section 222 gradually increases, thereby reducing fluid resistance.

[0065] like Figure 3 and Figure 7 As shown, the number of the first chip mounting area 121, the first liquid inlet branch 21 and the first liquid outlet branch 22 are at least two and correspond to each other. In this embodiment, the number of the first chip mounting area 121 is two and they are spaced apart along the second direction.

[0066] like Figure 7 As shown, in this embodiment, after the two first liquid outlet branches 22 merge, they are connected to the main liquid outlet pipeline 42 at the boundary between the first and second parts. Alternatively, in other possible implementations, each first liquid outlet branch 22 is independently connected to the main liquid outlet pipeline 42 at the boundary between the first and second parts. Whether to flow back or independently connect to the main liquid outlet pipeline 42 can be selected based on the specific shape of the main body 1. If a converging method is used, the cross-sectional area of ​​the first liquid outlet branch 22 after converging is larger than that before converging to avoid increased resistance.

[0067] like Figure 7 and Figure 8 As shown, the second portion is provided with an optical fiber connection tube 8, which is used to achieve a stable connection between the optical fiber and the laser; this fiber connection tube 8 is used to output the laser light. A heat dissipation channel 6 is provided within the second portion, located near the top surface. One end of this heat dissipation channel 6 is connected to the main liquid inlet pipe 41, and the other end is connected to the main liquid outlet pipe 42. The coolant flowing through this heat dissipation channel 6 dissipates heat from the optical fiber connection tube 8.

[0068] like Figure 7 As shown, the second liquid outlet branch 32 includes a second transverse flow channel section 321 extending along the first direction, and the liquid flows from the first end toward the second end. With the help of the original height gradient shape of the second part of the main body 1, the length of the second transverse flow channel section 321 in the up and down directions is gradually increased from the first end toward the second end, so that the cross-sectional area of ​​the second transverse flow channel section 321 gradually increases.

[0069] like Figure 7 and Figure 8 As shown, the outlet of one of the first liquid outlet branches 22 connects to one of the second liquid outlet branches 32 at the boundary between the first and second sections. This eliminates the need for an additional flow channel in the second section connecting the first liquid outlet branch 22 to the main liquid outlet pipeline 42, simplifying the product's internal structure. In this embodiment, the first transverse flow channel section 221 in the lower left corner directly connects to the second transverse flow channel section 321 in the lower right corner, allowing the coolant to flow through the second transverse flow channel section 321 and into the main liquid outlet pipeline 42.

[0070] Example 2

[0071] like Figure 9 As shown, the difference from Example 1 is that, in this embodiment, a heat dissipation channel is not provided separately, and the second part is provided with an optical fiber connecting tube 8; a connecting pipe 5 is provided inside the second part), one end of the connecting pipe 5 is connected to the outlet of the first liquid outlet branch 22 at the boundary between the first part and the second part, and the other end of the connecting pipe 5 is connected to the total liquid outlet pipe 42; and the connecting pipe 5 is located directly below the optical fiber connecting tube 8.

[0072] The cooling liquid flowing out from the first liquid outlet branch 22 flows through the connecting pipe 5 and then enters the main liquid outlet pipe 42. That is to say, the optical fiber connecting tube 8 is cooled by the above-mentioned cooling liquid. When the cooling requirements of the optical fiber connecting tube 8 are not high, the product structure can be simplified and the volume can be reduced.

[0073] like Figure 9 and Figure 10 As shown, in this embodiment, the two first transverse flow channel sections 221 extend to the second portion separately, and the two do not merge. Figure 9 As shown in the figure, a third transverse flow channel section 222 and the first transverse flow channel section 221 are connected through a bending flow channel section; and as shown in the figure Figure 10 As shown, the first transverse flow channel section 221 at the lower left of the figure directly extends to the second portion without a bending section. Therefore, the first transverse flow channel section 221 can be set wider in the second direction.

[0074] Example 3

[0075] like Figure 11 As shown, based on Example 1, two groups of second chip mounting areas 131 are also provided on the second part, wherein, in a group of second liquid inlet branches and second liquid outlet branches 32 closest to the heat dissipation channel, the second liquid inlet branch is located between the heat dissipation channel and the second liquid outlet branch 32, and the second liquid inlet branch and the heat dissipation channel are merged into the same common channel 33, and the liquid inlet of the second liquid inlet branch and the liquid inlet of the heat dissipation channel are the same port.

[0076] Part of the cooling liquid entering from the same port mentioned above enters the installation groove corresponding to the second chip area from the entrance to exchange heat with the chip; the other part flows through the heat dissipation channel under the optical fiber connecting tube 8 to dissipate heat for the optical fiber connecting tube 8. By merging the second liquid inlet branch and the heat dissipation channel into the same common channel 33, the cross-sectional area of ​​the common channel 33 can be made larger, and the heat dissipation effect can be better.

[0077] The laser provided by the present invention includes the above-mentioned heat dissipation module. Since the laser provided by the present invention uses the above-mentioned heat dissipation module, the laser provided by the present invention also has the advantages of the heat dissipation module.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation module, characterized in that: include: A main body (1), the main body (1) comprising a bottom surface (11) and a top surface spaced apart from each other; The main body (1) has a first end and a second end arranged along a first direction, and a third end and a fourth end arranged along a second direction; Along the direction from the first end to the second end, the top surface includes a first surface (12) and a second surface (13) arranged obliquely relative to the bottom surface (11), and the distance between the first surface (12) and the bottom surface (11) gradually decreases, and the distance between the second surface (13) and the bottom surface (11) gradually increases; The first surface (12) and the second surface (13) define a first portion and a second portion with the bottom surface (11), respectively; A first chip mounting area (121) is provided on the first surface (12); a first liquid inlet branch (21) and a first liquid outlet branch (22) are provided on the first portion, and the first liquid inlet branch (21) and the first liquid outlet branch (22) are used to realize liquid cooling circulation for the first chip mounting area (121); The second part is provided with a total liquid outlet pipeline (42), and the first liquid outlet branch (22) is connected to the total liquid outlet pipeline (42) through the first part and the second part; The first liquid outlet branch (22) comprises a first transverse flow channel section (221) extending along a first direction; the length of the first transverse flow channel section (221) in the second direction gradually increases from the first end toward the second end; The first liquid outlet branch (22) comprises a third transverse flow channel section (222) extending in a first direction, and the liquid flows from the second end toward the first end. The length of the third transverse flow channel section (222) in the vertical direction gradually increases, so that the cross-sectional area of ​​the third transverse flow channel section (222) gradually increases.

2. The heat dissipation module according to claim 1, characterized in that: A second chip mounting area (131) is provided on the second surface (13); a second liquid inlet branch (31) and a second liquid outlet branch (32) are provided inside the second portion, and the second liquid inlet branch (31) and the second liquid outlet branch (32) are used for liquid cooling circulation of the second chip mounting area (131); The second liquid outlet branch (32) is in communication with the main liquid outlet pipeline (42), and the length of the second liquid outlet branch (32) in the second direction gradually increases from the first end toward the second end.

3. The heat dissipation module according to claim 2, characterized in that: A main liquid inlet pipeline (41) is provided inside the first part; the first liquid inlet branch (21) and the second liquid inlet branch (31) are respectively connected to the main liquid inlet pipeline (41).

4. The heat dissipation module according to claim 1, characterized in that: The number of the first chip mounting area (121), the first liquid inlet branch (21), and the first liquid outlet branch (22) is at least two, and the first liquid inlet branch (21) and the first liquid outlet branch (22) form a liquid supply branch in a one-to-one correspondence; There are at least two first liquid outlet branches (22) that converge and communicate with the main liquid outlet pipeline (42) at the boundary between the first part and the second part; or Each of the first liquid outlet branches (22) is independently connected to the total liquid outlet pipeline (42) at the boundary between the first part and the second part.

5. The heat dissipation module according to claim 3, characterized in that: The second part is provided with an optical fiber connection tube (8); A heat dissipation channel (6) is provided inside the second part, one end of the heat dissipation channel (6) is in communication with the total liquid inlet pipeline (41), and the other end is in communication with the total liquid outlet pipeline (42).

6. The heat dissipation module according to claim 5, characterized in that: The second liquid inlet branch (31) of the liquid supply branch closest to the heat dissipation channel (6) is located between the heat dissipation channel (6) and the second liquid outlet branch (32); The second liquid inlet branch (31) and the heat dissipation channel (6) form a common channel (33); The liquid inlet of the second liquid inlet branch (31) is the same as the liquid inlet of the heat dissipation channel (6).

7. The heat dissipation module according to claim 1, characterized in that: The second part is provided with an optical fiber connection tube (8); A connecting pipe (5) is provided in the second part, one end of the connecting pipe (5) is connected to the outlet of the first liquid outlet branch (22) at the boundary between the first part and the second part, and the other end of the connecting pipe (5) is connected to the total liquid outlet pipe (42); The connecting pipe (5) is located directly below the optical fiber connecting pipe (8).

8. The heat dissipation module according to claim 3, characterized in that: The second liquid outlet branch (32) comprises a second transverse flow channel section (321) extending in a first direction, with the liquid flowing from the first end toward the second end; From the first end toward the second end, the length of the second transverse flow channel section (321) in the vertical direction gradually increases, so that the cross-sectional area of ​​the second transverse flow channel section (321) gradually increases, and / or, a middle portion (16) is provided between the first portion and the second portion, and the middle portion (16) is provided with a liquid inlet branch flow channel (7), and the total liquid inlet pipeline, the first liquid inlet branch (21) and the second liquid inlet branch (31) are all connected to the liquid inlet branch flow channel (7), and / or, the outlet of any first liquid outlet branch (22) is connected to any second liquid outlet branch (32) at the boundary between the first portion and the second portion.

9. A laser, characterized in that: The heat dissipation module comprises the heat dissipation module according to any one of claims 1 to 8.

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