LTCC (Low Temperature Co-Fired Ceramic) filter electronic component with rivet structure and preparation method

Abstract

The invention discloses an LTCC (Low Temperature Co-Fired Ceramic) filter electronic component with a rivet structure and a preparation method, and belongs to the technical field of filters. The LTCC filter electronic component comprises a rivet structure layer, a plurality of through hole electrode layers and a capping ceramic layer which are sequentially connected from bottom to top. The preparation method is simple, and is suitable for large-scale production, and the LTCC filter electronic component is processed and prepared by using common preparation processes of punching, hole filling, printing, laminating and the like; according to the LTCC filter, the rivet structure design is carried out on the electrode bottom bonding pad, the excellent electrical performance of the LTCC filter is guaranteed, meanwhile, the binding force between the LTCC filter electronic element and the electrode bottom bonding pad is remarkably improved, the tolerance strength of the LTCC filter electronic element to transverse thrust and longitudinal drawing force is improved, the damage resistance and durability of a product are effectively enhanced, and the service life of the LTCC filter is prolonged. Wide application prospects are realized.

Description

Technical Field

[0001] The present invention relates to the technical field of filters, and in particular to an LTCC filter electronic component with a rivet structure and a preparation method thereof. Background Art

[0002] LTCC design is a 3D design structure that utilizes a combination of capacitors and inductors, circuit designs on each layer, and through-hole electrode conduction requirements, and is prepared using traditional multi-layer ceramic technology for post-processing. In the existing technology, a sheet-cutting process is first performed using a cast-film roll of raw porcelain tape to form a sheet of raw porcelain tape, and then laser drilling, micro-pore grouting with metal paste to make through-hole electrodes, and precision printing are used to prepare circuit graphics to form internal circuit electrodes. The circuit graphics are heated and dried to obtain a raw porcelain tape covered with metal electrodes. Multiple pieces of raw porcelain tape with metal electrodes are heated and dried, then stacked, cut into granules, and then subjected to debinding and sintering processes. Finally, a post-process is used through rolling corners, silver termination, sintering, electroplating, external inspection, and packaging to produce a plurality of layers of ceramic dielectric layers and a plurality of internal circuit electrodes. LTCC filter products, such as Figure 1 shown.

[0003] In the design of the product's lead-out electrode, in order to achieve a small design and reduce the customer's installation space, the lead-out electrode is designed as the electrode bottom pad. However, since the bottom pad is made by screen-printing the pad electrode on the ceramic dielectric layer and sintering the ceramic dielectric layer and the pad electrode, the bonding strength between the silver or silver palladium electrode as the pad electrode and the ceramic dielectric layer is limited. After the product is electroplated, nickel tin will only be on the surface of the electrode bottom pad. When subjected to thrust (such as Figure 2 as shown) or pull-out test (as Figure 3 As shown in the figure, crack defects will occur on the bonding surface between the ceramic dielectric layer and the bottom pad of the electrode, and the push and pull forces will not meet the product specifications, resulting in poor product durability. Summary of the Invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide an LTCC filter electronic component with a rivet structure and a preparation method to solve the problems of low bonding strength between the dielectric layer and the bottom pad of the electrode of the existing LTCC filter component, easy cracking under stress, and poor product durability.

[0005] The technical solution of the present invention to solve the above technical problems is as follows:

[0006] A LTCC filter electronic component with a rivet structure comprises a rivet structure layer (2), a plurality of through-hole electrode layers (3) and a capping ceramic layer (4) which are sequentially connected from bottom to top.

[0007] The beneficial effects of the present invention are as follows: by arranging a ceramic-metal structure layer having a rivet metal structure above the electrode bottom pad of the LTCC filter electronic component, or using the rivet metal structure as the electrode bottom pad, and placing the electrode bottom pad on the ceramic dielectric layer or the component body, the present invention effectively enhances the product's tolerance to lateral thrust and longitudinal pull-out force, and improves the product's anti-destruction ability after welding.

[0008] Furthermore, the through-hole electrode layer includes a ceramic plate, through-hole electrodes connecting the ceramic plate in series, and internal circuit electrodes located on the upper surface of the ceramic plate; the through-hole electrodes and the internal circuit electrodes in each through-hole electrode layer are connected.

[0009] Furthermore, the internal circuit electrodes are printed electrode patterns.

[0010] The LTCC filter electronic component with a rivet structure and a rivet structure layer as an electrode bottom pad specifically includes the following structure:

[0011] Furthermore, the rivet structure layer includes a shank structure layer and a rivet head electrode, and the rivet head electrode is located above the shank structure layer and below the bottom through-hole electrode layer.

[0012] Furthermore, the nail rod structure layer includes a ceramic plate having a plurality of through holes and metal nail rods filled in the through holes;

[0013] The nail head electrodes are a plurality of circuit electrodes, which are the same in number as the metal nail rods and correspond one to one.

[0014] Furthermore, the ratio of the through hole area in the nail rod structure layer to the bottom area in the nail head electrode is 1:1.25-5.

[0015] The LTCC filter electronic component with a rivet structure and an electrode bottom pad is provided, specifically comprising the following structure:

[0016] Furthermore, the LTCC filter electronic component further includes an electrode bottom pad located on the rivet structure layer;

[0017] The rivet structure layer includes a rivet head structure layer and a rivet rod structure layer; the rivet head structure layer is located above the rivet rod structure layer and below the bottom through-hole electrode layer.

[0018] Furthermore, the nail head structure layer includes a ceramic plate having a plurality of through holes and metal nail heads filled in the through holes;

[0019] The nail rod structure layer includes a ceramic plate with a plurality of through holes and metal nail rods filled in the through holes;

[0020] The ceramic plate of the nail head structure layer is located above the ceramic plate of the nail rod structure layer, and the number of metal nail heads and metal nail rods is the same and they are connected in a one-to-one correspondence.

[0021] Furthermore, the aperture ratio of the through holes in the nail rod structure layer to the through holes in the nail head structure layer is 1:1.25-5.

[0022] Furthermore, the diameter of the through holes in the nail head structure layer is 30-200 μm.

[0023] The method for preparing the LTCC filter electronic component having a rivet structure and using the rivet structure layer as the electrode bottom pad comprises the following steps:

[0024] Step 1: First, fill the through holes of a green porcelain tape having a plurality of through holes with metal paste and dry it to obtain a nail rod structure layer, with the nail rod structure layer serving as the bottom layer;

[0025] Step 2: Printing a circuit electrode on the rivet rod structure layer obtained in step 1 and drying the printed circuit electrode to obtain a rivet structure layer having a rivet head electrode;

[0026] Step 3: First, fill the through holes of the green ceramic tape with through holes with metal paste and dry it to prepare through-hole electrodes, then print internal circuit electrodes on the upper surface of the through-hole electrodes and dry it again to prepare a through-hole electrode layer;

[0027] Step 4: Repeat step 3 to prepare several through-hole electrode layers until the target number of layers is reached;

[0028] Step 5: Using the green ceramic tape without through-holes as the top ceramic layer, the rivet structure layer obtained in step 2, the through-hole electrode layer obtained in step 4, and the top ceramic layer are laminated and pressed together from the bottom to the top to obtain a green body;

[0029] Step 6: Debinding the green body obtained in step 5, then sintering it, and finally post-processing it to obtain the product.

[0030] Furthermore, the drying temperature in steps 1 to 4 is 40-100° C. and the drying time is 5-30 minutes.

[0031] Furthermore, in step six, the temperature of the debinding treatment is 250-450° C., and the time is 18-24 hours; the temperature of the sintering treatment is 850-950° C., and the time is 5-20 hours.

[0032] Furthermore, the post-processing process in step six includes edge rolling, silver termination, sintering and electroplating.

[0033] The method for preparing the LTCC filter electronic component having a rivet structure and provided with an electrode bottom pad comprises the following steps:

[0034] S1: First, fill the through holes of a green porcelain tape having a plurality of through holes with metal paste and dry it to produce a nail rod structure layer, and then print the electrode bottom pad at the bottom of the nail rod structure layer;

[0035] S2: filling metal paste into the through holes of another green porcelain tape having a plurality of through holes and drying the metal paste to obtain a nail head structure layer;

[0036] S3: first, filling a metal paste into a through hole of a green ceramic tape having a single through hole and drying the metal paste to prepare a through hole electrode, then printing an internal circuit electrode on the upper surface of the through hole electrode and drying the internal circuit electrode again to prepare a through hole electrode layer;

[0037] S4: Repeat S3 to prepare a number of through-hole electrode layers until the target number of layers is reached;

[0038] S5: Then, the green ceramic tape without through-holes is used as the top ceramic layer, and the electrode bottom pad obtained in S1, the nail rod structure layer obtained in S1, the nail head structure layer obtained in S2, the through-hole electrode layer obtained in S4 and the top ceramic layer are stacked and pressed from the bottom to the top to obtain a green body;

[0039] S6: First, the green body obtained in S5 is subjected to a binder removal treatment, then sintered, and finally subjected to post-processing to obtain the product.

[0040] Furthermore, the drying temperature in S1-S4 is 40-100° C., and the drying time is 5-30 minutes.

[0041] Furthermore, the number of through holes in the raw porcelain tape S1 and the through holes in the raw porcelain tape S2 are the same and correspond one to one when laminated and pressed, and the aperture ratio of the through holes in the raw porcelain tape S1 and the through holes in the raw porcelain tape S2 is 1:1.25-5.

[0042] Furthermore, the diameter of the through holes of the green porcelain tape in S2 is 30-200 μm.

[0043] Furthermore, the temperature of the debinding treatment in S6 is 250-450° C., and the time is 18-24 hours; the temperature of the sintering treatment is 850-950° C., and the time is 5-20 hours.

[0044] Furthermore, the post-processing process in S6 includes corner rolling, silver end treatment, sintering and electroplating.

[0045] The present invention has the following beneficial effects:

[0046] The preparation method of the present invention is simple and is processed and prepared using commonly used preparation processes for LTCC filter electronic components, such as punching, filling, printing and lamination, and is suitable for large-scale production. The present invention designs a rivet structure on the electrode bottom pad or uses the rivet metal structure as the electrode bottom pad. While ensuring the excellent electrical performance of the LTCC filter, the present invention significantly improves the bonding strength between the LTCC filter electronic component and the electrode bottom pad, improves its tolerance to lateral thrust and longitudinal pull-out force, effectively enhances the product's anti-destructive ability and durability, and has broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 This is a schematic diagram of the structure of the LTCC filter electronic component prepared in Comparative Example 1;

[0048] Figure 2 This is a schematic diagram of the lateral thrust applied to the LTCC filter electronic components when assembled on a PCB circuit board;

[0049] Figure 3 This is a schematic diagram of the longitudinal pull-out force on the LTCC filter electronic components when assembled on a PCB circuit board;

[0050] Figure 4 This is a schematic structural diagram of the LTCC filter electronic component with a rivet structure obtained in Example 1-5;

[0051] Figure 5 A schematic diagram of the stacking process for preparing LTCC filter electronic components with rivet structures according to Examples 1-5;

[0052] Figure 6 This is a schematic structural diagram of an LTCC filter electronic component having a rivet structure as an electrode bottom pad, prepared in Example 6;

[0053] Figure 7 This is a schematic diagram of the stacking process for preparing an LTCC filter electronic component having a rivet structure as an electrode bottom pad in Example 6;

[0054] Figure 8 This is a schematic diagram of the structure of the LTCC filter electronic component prepared in Comparative Example 2;

[0055] In the figure, 1-electrode bottom pad, 2-rivet structure layer, 3-through-hole electrode layer, 4-capping electrode layer, 5-PCB circuit board, 6-electrode bottom pad LTCC filter electronic component, 21-nail head structure layer, 22-nail rod structure layer, 23-nail head electrode, 211-metal nail head, 221-metal nail rod, 31-through-hole electrode, 32-internal circuit electrode. DETAILED DESCRIPTION

[0056] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples are only used to explain the present invention and are not intended to limit the scope of the invention. In the embodiments, if specific conditions are not specified, they are carried out according to conventional conditions or conditions recommended by the manufacturer. If the manufacturer of the reagents or instruments is not specified, they are all conventional products that can be purchased commercially.

[0057] Example 1:

[0058] An LTCC filter electronic component with a rivet structure (schematic diagram as shown in FIG. Figure 4As shown), comprising an electrode bottom pad 1 and a ceramic dielectric layer;

[0059] The ceramic dielectric layer is located above the electrode bottom pad 1;

[0060] The ceramic dielectric layer includes a rivet structure layer 2, fourteen through-hole electrode layers 3 and a capping ceramic layer 4 which are connected in sequence.

[0061] The rivet structure layer 2 includes a rivet head structure layer 21 and a rivet rod structure layer 22 ; the rivet head structure layer 21 is located above the rivet rod structure layer 22 and below the bottom through-hole electrode layer 3 .

[0062] The nail head structure layer 21 includes a ceramic plate with 10 through holes and metal nail heads 211 filled in the through holes. The material of the nail heads is solidified silver paste.

[0063] The nail rod structure layer 22 includes a ceramic plate with 10 through holes and metal nail rods 221 filled in the through holes. The material of the nail rods is solidified silver paste.

[0064] The ceramic plate of the nail head structure layer 21 is located above the ceramic plate of the nail rod structure layer 22 , and the number of metal nail heads 211 and metal nail rods 221 is the same and they are connected in a one-to-one correspondence.

[0065] The diameter of the through hole in the nail head structure layer is 75 μm, and the diameter of the through hole in the nail rod structure layer 22 is 60 μm.

[0066] The through-hole electrode layer 3 includes a ceramic plate, through-hole electrodes 31 connecting the ceramic plate and internal circuit electrodes 32 located on the upper surface of the ceramic plate; the through-hole electrodes 31 and the internal circuit electrodes 32 in each through-hole electrode layer are connected.

[0067] The internal circuit electrode 32 is a printed electrode pattern. The ceramic part of the LTCC filter electronic component is made by debinding and sintering the green ceramic tape.

[0068] The preparation method of the above-mentioned LTCC filter electronic component with rivet structure (the schematic diagram of the laminated preparation is as follows Figure 5 ), comprising the following steps:

[0069] S1: First, 10 through holes with a hole diameter of 60 μm are punched on the green porcelain tape using a punching device. The green porcelain tape with the through holes is filled with silver paste. The filled green porcelain tape is then placed in an oven and dried at 60°C for 10 minutes to produce a nail rod structure layer 22. Finally, a bottom pad pattern is printed on the bottom of the completed nail rod structure layer 22. After printing, the pattern is placed in an oven and dried at 60°C for 10 minutes to produce a printed electrode bottom pad 1.

[0070] S2: First, ten through holes with a diameter of 75 μm are punched on the green porcelain tape at positions corresponding to the centers of the ten metal nail rods 221 of the nail rod structure layer 22 using a punching device. The through holes are then filled with silver paste and dried in an oven at 60° C. for 10 minutes to obtain the nail head structure layer 21 having the metal nail heads 211.

[0071] S3: A through-hole electrode 31 with a pore size of 60 μm is designed on the green porcelain tape using a punching device. The hole is then filled with silver paste and then dried in an oven at 60° C. for 10 minutes to form the through-hole electrode 31. An internal circuit electrode 32 pattern is then printed on top of the through-hole electrode 31. Finally, the through-hole electrode layer 3 is formed by drying in an oven at 60° C. for 10 minutes.

[0072] S4: Repeat S3 to prepare fourteen through-hole electrode layers 3;

[0073] S5: Then, the green ceramic tape without through-holes is used as the capping ceramic layer 4, and the electrode bottom pad 1 obtained in S1, the nail rod structure layer 22 obtained in S1, the nail head structure layer 21 obtained in S2, the through-hole electrode layer 3 obtained in S4 and the capping ceramic layer 4 are stacked and pressed from the bottom to the top to obtain a sheet-like green body;

[0074] S6: The sheet-like green body is cut into granules, and then subjected to a binder removal treatment at 320°C for 24 hours; then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and packaging to obtain an LTCC filter electronic component with a rivet structure.

[0075] Example 2:

[0076] An LTCC filter electronic component with a rivet structure (schematic diagram as shown in FIG. Figure 4 As shown), comprising an electrode bottom pad 1 and a ceramic dielectric layer;

[0077] The ceramic dielectric layer is located above the electrode bottom pad 1;

[0078] The ceramic dielectric layer includes a rivet structure layer 2, fourteen through-hole electrode layers 3 and a capping ceramic layer 4 which are connected in sequence.

[0079] The rivet structure layer 2 includes a rivet head structure layer 21 and a rivet rod structure layer 22 ; the rivet head structure layer 21 is located above the rivet rod structure layer 22 and below the bottom through-hole electrode layer 3 .

[0080] The nail head structure layer 21 includes a ceramic plate with 10 through holes and metal nail heads 211 filled in the through holes. The material of the nail heads is solidified silver paste.

[0081] The nail rod structure layer 22 includes a ceramic plate with 10 through holes and metal nail rods 221 filled in the through holes. The material of the nail rods is solidified silver paste.

[0082] The ceramic plate of the nail head structure layer 21 is located above the ceramic plate of the nail rod structure layer 22 , and the number of metal nail heads 211 and metal nail rods 221 is the same and they are connected in a one-to-one correspondence.

[0083] The diameter of the through hole in the nail head structure layer is 90 μm, and the diameter of the through hole in the nail rod structure layer 22 is 60 μm.

[0084] The through-hole electrode layer 3 includes a ceramic plate, through-hole electrodes 31 connecting the ceramic plate and internal circuit electrodes 32 located on the upper surface of the ceramic plate; the through-hole electrodes 31 and the internal circuit electrodes 32 in each through-hole electrode layer are connected.

[0085] The internal circuit electrode 32 is a printed electrode pattern. The ceramic part of the LTCC filter electronic component is made by debinding and sintering the green ceramic tape.

[0086] The preparation method of the above-mentioned LTCC filter electronic component with rivet structure (the schematic diagram of the laminated preparation is as follows Figure 5 ), comprising the following steps:

[0087] S1: First, 10 through holes with a hole diameter of 60 μm are punched on the green porcelain tape using a punching device. The green porcelain tape with the through holes is filled with silver paste. The filled green porcelain tape is then placed in an oven and dried at 60°C for 10 minutes to produce a nail rod structure layer 22. Finally, a bottom pad pattern is printed on the bottom of the completed nail rod structure layer 22. After printing, the pattern is placed in an oven and dried at 60°C for 10 minutes to produce a printed electrode bottom pad 1.

[0088] S2: First, ten through holes with a diameter of 90 μm are punched on the green porcelain tape at positions corresponding to the centers of the ten metal nail rods 221 of the nail rod structure layer 22 using a punching device. The through holes are then filled with silver paste and finally dried in an oven at 60° C. for 10 minutes to obtain a nail head structure layer 21 having metal nail heads 211.

[0089] S3: A through-hole electrode 31 with a pore size of 60 μm is designed on the green porcelain tape using a punching device. The hole is then filled with silver paste and then dried in an oven at 60° C. for 10 minutes to form the through-hole electrode 31. An internal circuit electrode 32 pattern is then printed on top of the through-hole electrode 31. Finally, the through-hole electrode layer 3 is formed by drying in an oven at 60° C. for 10 minutes.

[0090] S4: Repeat S3 to prepare fourteen through-hole electrode layers 3;

[0091] S5: Then, the green ceramic tape without through-holes is used as the capping ceramic layer 4, and the electrode bottom pad 1 obtained in S1, the nail rod structure layer 22 obtained in S1, the nail head structure layer 21 obtained in S2, the through-hole electrode layer 3 obtained in S4 and the capping ceramic layer 4 are stacked and pressed from the bottom to the top to obtain a sheet-like green body;

[0092] S6: The sheet-like green body is cut into granules, and then subjected to a binder removal treatment at 320°C for 24 hours; then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and packaging to obtain an LTCC filter electronic component with a rivet structure.

[0093] Example 3:

[0094] An LTCC filter electronic component with a rivet structure (schematic diagram as shown in FIG. Figure 4 As shown), comprising an electrode bottom pad 1 and a ceramic dielectric layer;

[0095] The ceramic dielectric layer is located above the electrode bottom pad 1;

[0096] The ceramic dielectric layer includes a rivet structure layer 2, fourteen through-hole electrode layers 3 and a capping ceramic layer 4 which are connected in sequence.

[0097] The rivet structure layer 2 includes a rivet head structure layer 21 and a rivet rod structure layer 22 ; the rivet head structure layer 21 is located above the rivet rod structure layer 22 and below the bottom through-hole electrode layer 3 .

[0098] The nail head structure layer 21 includes a ceramic plate with 10 through holes and metal nail heads 211 filled in the through holes. The material of the nail heads is solidified silver paste.

[0099] The nail rod structure layer 22 includes a ceramic plate with 10 through holes and metal nail rods 221 filled in the through holes. The material of the nail rods is solidified silver paste.

[0100] The ceramic plate of the nail head structure layer 21 is located above the ceramic plate of the nail rod structure layer 22 , and the number of metal nail heads 211 and metal nail rods 221 is the same and they are connected in a one-to-one correspondence.

[0101] The diameter of the through hole in the nail head structure layer is 180 μm, and the diameter of the through hole in the nail rod structure layer 22 is 60 μm.

[0102] The through-hole electrode layer 3 includes a ceramic plate, through-hole electrodes 31 connecting the ceramic plate and internal circuit electrodes 32 located on the upper surface of the ceramic plate; the through-hole electrodes 31 and the internal circuit electrodes 32 in each through-hole electrode layer are connected.

[0103] The internal circuit electrode 32 is a printed electrode pattern. The ceramic part of the LTCC filter electronic component is made by debinding and sintering the green ceramic tape.

[0104] The preparation method of the above-mentioned LTCC filter electronic component with rivet structure (the schematic diagram of the laminated preparation is as follows Figure 5 ), comprising the following steps:

[0105] S1: First, 10 through holes with a hole diameter of 60 μm are punched on the green porcelain tape using a punching device. The green porcelain tape with the through holes is filled with silver paste. The filled green porcelain tape is then placed in an oven and dried at 60°C for 10 minutes to produce a nail rod structure layer 22. Finally, a bottom pad pattern is printed on the bottom of the completed nail rod structure layer 22. After printing, the pattern is placed in an oven and dried at 60°C for 10 minutes to produce a printed electrode bottom pad 1.

[0106] S2: First, ten through holes with a diameter of 180 μm are punched on the green porcelain tape at positions corresponding to the centers of the ten metal nail rods 221 of the nail rod structure layer 22 using a punching device. The through holes are then filled with silver paste and dried in an oven at 60° C. for 10 minutes to obtain the nail head structure layer 21 having the metal nail heads 211.

[0107] S3: A through-hole electrode 31 with a pore size of 60 μm is designed on the green porcelain tape using a punching device. The hole is then filled with silver paste and then dried in an oven at 60° C. for 10 minutes to form the through-hole electrode 31. An internal circuit electrode 32 pattern is then printed on top of the through-hole electrode 31. Finally, the through-hole electrode layer 3 is formed by drying in an oven at 60° C. for 10 minutes.

[0108] S4: Repeat S3 to prepare fourteen through-hole electrode layers 3;

[0109] S5: Then, the green ceramic tape without through-holes is used as the capping ceramic layer 4, and the electrode bottom pad 1 obtained in S1, the nail rod structure layer 22 obtained in S1, the nail head structure layer 21 obtained in S2, the through-hole electrode layer 3 obtained in S4 and the capping ceramic layer 4 are stacked and pressed together from the bottom to the top to obtain a sheet-like green body;

[0110] S6: The sheet-like green body is cut into granules, and then subjected to a binder removal treatment at 320°C for 24 hours; then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and packaging to obtain an LTCC filter electronic component with a rivet structure.

[0111] Example 4:

[0112] An LTCC filter electronic component with a rivet structure (schematic diagram as shown in FIG. Figure 4 As shown), comprising an electrode bottom pad 1 and a ceramic dielectric layer;

[0113] The ceramic dielectric layer is located above the electrode bottom pad 1;

[0114] The ceramic dielectric layer includes a rivet structure layer 2, fourteen through-hole electrode layers 3 and a capping ceramic layer 4 which are connected in sequence.

[0115] The rivet structure layer 2 includes a rivet head structure layer 21 and a rivet rod structure layer 22 ; the rivet head structure layer 21 is located above the rivet rod structure layer 22 and below the bottom through-hole electrode layer 3 .

[0116] The nail head structure layer 21 includes a ceramic plate with 20 through holes and metal nail heads 211 filled in the through holes. The material of the nail heads is solidified silver paste.

[0117] The nail rod structure layer 22 includes a ceramic plate with 20 through holes and metal nail rods 221 filled in the through holes. The material of the nail rods is solidified silver paste.

[0118] The ceramic plate of the nail head structure layer 21 is located above the ceramic plate of the nail rod structure layer 22 , and the number of metal nail heads 211 and metal nail rods 221 is the same and they are connected in a one-to-one correspondence.

[0119] The diameter of the through hole in the nail head structure layer is 180 μm, and the diameter of the through hole in the nail rod structure layer 22 is 60 μm.

[0120] The through-hole electrode layer 3 includes a ceramic plate, through-hole electrodes 31 connecting the ceramic plate and internal circuit electrodes 32 located on the upper surface of the ceramic plate; the through-hole electrodes 31 and the internal circuit electrodes 32 in each through-hole electrode layer are connected.

[0121] The internal circuit electrode 32 is a printed electrode pattern. The ceramic part of the LTCC filter electronic component is made by debinding and sintering the green ceramic tape.

[0122] The preparation method of the above-mentioned LTCC filter electronic component with rivet structure (the schematic diagram of the laminated preparation is as follows Figure 5 ), comprising the following steps:

[0123] S1: First, 20 through holes with a hole diameter of 60 μm are punched on the green porcelain tape using a punching device. The green porcelain tape with the through holes is filled with silver paste. The filled green porcelain tape is then placed in an oven and dried at 60°C for 10 minutes to produce a nail rod structure layer 22. Finally, a bottom pad pattern is printed on the bottom of the completed nail rod structure layer 22. After printing, the pattern is placed in an oven and dried at 60°C for 10 minutes to produce a printed electrode bottom pad 1.

[0124] S2: First, 20 through holes with a diameter of 180 μm are punched on the green porcelain tape at positions corresponding to the centers of the 20 metal nail rods 221 of the nail rod structure layer 22 using a punching device. The through holes are then filled with silver paste and finally dried in an oven at 60° C. for 10 minutes to obtain the nail head structure layer 21 having the metal nail heads 211.

[0125] S3: A through-hole electrode 31 with a pore size of 60 μm is designed on the green porcelain tape using a punching device. The hole is then filled with silver paste and then dried in an oven at 60° C. for 10 minutes to form the through-hole electrode 31. An internal circuit electrode 32 pattern is then printed on top of the through-hole electrode 31. Finally, the through-hole electrode layer 3 is formed by drying in an oven at 60° C. for 10 minutes.

[0126] S4: Repeat S3 to prepare fourteen through-hole electrode layers 3;

[0127] S5: Then, the green ceramic tape without through-holes is used as the capping ceramic layer 4, and the electrode bottom pad (1) obtained in S1, the nail rod structure layer 22 obtained in S1, the nail head structure layer 21 obtained in S2, the through-hole electrode layer 3 obtained in S4 and the capping ceramic layer 4 are stacked and pressed together from the bottom to the top to obtain a sheet-like green body;

[0128] S6: The sheet-like green body is cut into granules, and then subjected to binder removal treatment at 320°C for 24 hours; then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and packaging to obtain an LTCC filter electronic component with a rivet structure.

[0129] Example 5:

[0130] An LTCC filter electronic component with a rivet structure (schematic diagram as shown in FIG. Figure 4 As shown), comprising an electrode bottom pad 1 and a ceramic dielectric layer;

[0131] The ceramic dielectric layer is located above the electrode bottom pad 1;

[0132] The ceramic dielectric layer includes a rivet structure layer 2, fourteen through-hole electrode layers 3 and a capping ceramic layer 4 which are connected in sequence.

[0133] The rivet structure layer 2 includes a rivet head structure layer 21 and a rivet rod structure layer 22 ; the rivet head structure layer 21 is located above the rivet rod structure layer 22 and below the bottom through-hole electrode layer 3 .

[0134] The nail head structure layer 21 includes a ceramic plate with 30 through holes and metal nail heads 211 filled in the through holes. The material of the nail heads is solidified silver paste.

[0135] The nail rod structure layer 22 includes a ceramic plate with 30 through holes and metal nail rods 221 filled in the through holes. The material of the nail rods is solidified silver paste.

[0136] The ceramic plate of the nail head structure layer 21 is located above the ceramic plate of the nail rod structure layer 22 , and the number of metal nail heads 211 and metal nail rods 221 is the same and they are connected in a one-to-one correspondence.

[0137] The diameter of the through hole in the nail head structure layer is 180 μm, and the diameter of the through hole in the nail rod structure layer 22 is 60 μm.

[0138] The through-hole electrode layer 3 includes a ceramic plate, through-hole electrodes 31 connecting the ceramic plate and internal circuit electrodes 32 located on the upper surface of the ceramic plate; the through-hole electrodes 31 and the internal circuit electrodes 32 in each through-hole electrode layer are connected.

[0139] The internal circuit electrode 32 is a printed electrode pattern. The ceramic part of the LTCC filter electronic component is made by debinding and sintering the green ceramic tape.

[0140] The preparation method of the above-mentioned LTCC filter electronic component with rivet structure (the schematic diagram of the laminated preparation is as follows Figure 5 ), comprising the following steps:

[0141] S1: First, 30 through holes with a hole diameter of 60 μm are punched on the green porcelain tape using a punching device. The green porcelain tape with the through holes is filled with silver paste. The filled green porcelain tape is then placed in an oven and dried at 60°C for 10 minutes to produce a nail rod structure layer 22. Finally, a bottom pad pattern is printed on the bottom of the completed nail rod structure layer 22. After printing, the pattern is placed in an oven and dried at 60°C for 10 minutes to produce a printed electrode bottom pad 1.

[0142] S2: First, 30 through holes with a diameter of 180 μm are punched on the green porcelain tape at positions corresponding to the centers of the 30 metal nail rods 221 of the nail rod structure layer 22 using a punching device. The through holes are then filled with silver paste and finally dried in an oven at 60° C. for 10 minutes to obtain the nail head structure layer 21 having the metal nail heads 211.

[0143] S3: A through-hole electrode 31 with a pore size of 60 μm is designed on the green porcelain tape using a punching device. The hole is then filled with silver paste and then dried in an oven at 60° C. for 10 minutes to form the through-hole electrode 31. An internal circuit electrode 32 pattern is then printed on top of the through-hole electrode 31. Finally, the through-hole electrode layer 3 is formed by drying in an oven at 60° C. for 10 minutes.

[0144] S4: Repeat S3 to prepare fourteen through-hole electrode layers 3;

[0145] S5: Then, the green ceramic tape without through-holes is used as the capping ceramic layer 4, and the electrode bottom pad 1 obtained in S1, the nail rod structure layer 22 obtained in S1, the nail head structure layer 21 obtained in S2, the through-hole electrode layer 3 obtained in S4 and the capping ceramic layer 4 are stacked and pressed from the bottom to the top to obtain a sheet-like green body;

[0146] S6: The sheet-like green body is cut into granules, and then subjected to a binder removal treatment at 320°C for 24 hours; then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and packaging to obtain an LTCC filter electronic component with a rivet structure.

[0147] Example 6:

[0148] An LTCC filter electronic component with a rivet structure (schematic diagram as shown in FIG. Figure 6 As shown), it includes a rivet structure layer 2, fourteen through-hole electrode layers 3 and a capping ceramic layer 4 connected in sequence.

[0149] The rivet structure layer 2 includes a rivet head electrode 23 and a rivet rod structure layer 22 ; the rivet head electrode 23 is located above the rivet rod structure layer 22 and below the bottom through-hole electrode layer 3 .

[0150] The nail rod structure layer 22 includes a ceramic plate with 6 through holes and metal nail rods 221 filled in the through holes. The material of the nail rods is solidified silver paste.

[0151] The nail head electrodes 23 are six circuit electrode patterns corresponding to the metal nail rods one by one, and the material is solidified silver paste;

[0152] The rivet structure layer 22 and the rivet head electrode 23 together constitute the rivet structure layer 2 .

[0153] The through-hole electrode layer 3 includes a ceramic plate, through-hole electrodes 31 connecting the ceramic plate and internal circuit electrodes 32 located on the upper surface of the ceramic plate; the through-hole electrodes 31 and the internal circuit electrodes 32 in each through-hole electrode layer are connected.

[0154] The internal circuit electrode 32 is a printed electrode pattern. The ceramic part of the LTCC filter electronic component is made by debinding and sintering the green ceramic tape.

[0155] The preparation method of the above-mentioned LTCC filter electronic component with rivet structure (the schematic diagram of the laminated preparation is as follows Figure 7 ), comprising the following steps:

[0156] S1: First, six through holes with a diameter of 0.52 mm × 0.68 mm are punched in the green porcelain tape using a punching device. The holes are then filled with silver paste. The filled green porcelain tape is then placed in an oven at 60°C for 10 minutes to produce a nail rod structure layer 22, which is used to replace the electrode bottom pad 1.

[0157] S2: Six 0.80 mm × 1.00 mm via electrode patterns are printed using silver paste at positions corresponding to the metal nail rods prepared in the nail rod structure layer 22 obtained in S1. After printing, the patterns are placed in an oven at 60° C. and dried for 10 minutes to obtain nail head electrodes 23, thereby obtaining a rivet structure layer 2 having nail head electrodes 23 and a nail rod structure layer 22.

[0158] S3: A through-hole electrode 31 with a pore size of 60 μm is designed on the green porcelain tape using a punching device. The hole is then filled with silver paste and then dried in an oven at 60° C. for 10 minutes to form the through-hole electrode 31. An internal circuit electrode 32 pattern is then printed on top of the through-hole electrode 31. Finally, the through-hole electrode layer 3 is formed by drying in an oven at 60° C. for 10 minutes.

[0159] S4: Repeat S3 to prepare fourteen through-hole electrode layers 3;

[0160] S5: Then, the green ceramic tape without through-holes is used as the capping ceramic layer 4, and the electrode bottom pad 1 obtained in S1, the nail rod structure layer 22 obtained in S1, the nail head structure layer 21 obtained in S2, the through-hole electrode layer 3 obtained in S4 and the capping ceramic layer 4 are stacked and pressed together from the bottom to the top to obtain a sheet-like green body;

[0161] S6: The sheet-like green body is cut into granules, and then subjected to a binder removal treatment at 320°C for 24 hours; then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and packaging, to obtain an LTCC filter electronic component with a rivet structure as the electrode bottom pad.

[0162] Comparative Example 1:

[0163] An LTCC filter electronic component (structural diagram as shown Figure 1 As shown), the difference from Example 1 is that this comparative example does not include the nail head structure layer 21, the nail rod structure layer 22 and the nail head electrode 23 in Example 1, and the rest of the structure remains unchanged. The through-hole electrode layer 3 in the ceramic dielectric layer is directly connected to the electrode bottom pad 1.

[0164] The method for preparing the LTCC filter electronic component comprises the following steps:

[0165] S1: Designing a through hole of a through-hole electrode 31 with a pore size of 60 μm on a green porcelain tape using a punching device, then filling the hole with silver paste, and then drying it in an oven at 60°C for 10 minutes to form the through-hole electrode 31. After drying, printing a pattern of the electrode bottom pad 1, and then drying it in an oven at 60°C for 10 minutes to form the electrode bottom pad 1. Then, printing a pattern of the internal circuit electrode 32 on top of the through-hole electrode 31, and finally drying it in an oven at 60°C for 10 minutes to form a through-hole electrode layer 3.

[0166] S2: First, a through hole of a through-hole electrode 31 with a hole diameter of 60 μm is designed on a green porcelain tape using a punching device, and then the hole is filled with silver paste, followed by drying in an oven at 60° C. for 10 minutes to obtain a through-hole electrode 31, and then an internal circuit electrode 32 pattern is printed on top of the through-hole electrode 31, and finally dried in an oven at 60° C. for 10 minutes to obtain a second through-hole electrode layer 3; the process is continued until fourteen through-hole electrode layers 3 are formed; then, a green porcelain tape without through holes is used as a capping ceramic layer 4, and the electrode bottom pad 1 obtained in S1, all the through-hole electrode layers 3 obtained, and the capping ceramic layer 4 are stacked and pressed together from the bottom layer to the top layer to obtain a sheet-like green body;

[0167] S3: The sheet-like green body is cut into granules, and then subjected to a binder removal treatment at 320°C for 24 hours; then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and packaging to produce the LTCC filter electronic component.

[0168] Comparative Example 2:

[0169] An LTCC filter electronic component (structural diagram as shown Figure 8 As shown), the difference from Example 1 is that this comparative example does not include the nail head structure layer 21 in Example 1, the rest of the structure remains unchanged, and the through-hole electrode layer 3 in the ceramic dielectric layer is directly connected to the nail rod structure layer 22.

[0170] The method for preparing the LTCC filter electronic component comprises the following steps:

[0171] S1: First, 10 through holes with a hole diameter of 60 μm are punched on the green porcelain tape using a punching device. The green porcelain tape with the through holes is filled with silver paste. The filled green porcelain tape is then placed in an oven and dried at 60°C for 10 minutes to produce a nail rod structure layer 22. Finally, a bottom pad pattern is printed on the bottom of the completed nail rod structure layer 22. After printing, the pattern is placed in an oven and dried at 60°C for 10 minutes to produce a printed electrode bottom pad 1.

[0172] S2: A through-hole electrode 31 with a pore size of 60 μm is designed on the green porcelain tape using a punching device. The hole is then filled with silver paste and dried in an oven at 60° C. for 10 minutes to form the through-hole electrode 31. An internal circuit electrode 32 pattern is then printed on top of the through-hole electrode 31. The hole is then dried in an oven at 60° C. for 10 minutes to form a through-hole electrode layer 3.

[0173] S3: Repeat S2 to prepare fourteen layers of through-hole electrode layers 3, then use a green ceramic tape without through-holes as a capping ceramic layer, and stack and press the electrode bottom pad 1 obtained in S1, the nail rod structure layer 22 obtained in S1, the through-hole electrode layer 3 obtained in S3, and the capping ceramic layer 4 from the bottom to the top to obtain a sheet-like green body;

[0174] S4: The sheet-like green body is cut into granules, and then subjected to a binder removal treatment at 320°C for 24 hours; and then sintered at 895°C for 9 hours; and finally subjected to corner rolling, silver termination, sintering, electroplating, external inspection and package testing to produce the LTCC filter electronic component.

[0175] Test Example 1:

[0176] The LTCC filter electronic components prepared in Examples 1-6 and Comparative Examples 1-2 were characterized. The LTCC filter electronic components were assembled on a PCB circuit board and subjected to lateral thrust and longitudinal pull-out force tests using a push-pull test machine (the force diagram is shown in FIG. Figure 2 and Figure 3 shown).

[0177] The experimental results are shown in Table 1:

[0178] Table 1 Transverse thrust and longitudinal pull-out force test results

[0179]

[0180] As shown in Table 1, the LTCC filter electronic components with rivet structures prepared in the embodiments of the present invention can effectively increase the product's thrust and pull-out forces, thereby improving its durability. However, since Comparative Example 1 lacks a rivet structure and relies solely on the ceramic-silver interface, its thrust and pull-out forces are significantly inferior to those of the LTCC filter electronic components with rivet structures prepared in the embodiments of the present application. Comparative Example 2, which only incorporates a rivet structure layer, effectively increases lateral thrust but does not significantly improve pull-out force.

[0181] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An LTCC filter electronic component with a rivet structure, characterized in that: The LTCC filter electronic component comprises a rivet structure layer (2), a plurality of through-hole electrode layers (3) and a capping ceramic layer (4) which are sequentially connected from bottom to top.

2. The LTCC filter electronic component with a rivet structure according to claim 1, characterized in that: The through-hole electrode layer (3) comprises a ceramic plate, a through-hole electrode (31) connected in series with the ceramic plate, and an internal circuit electrode (32) located on the upper surface of the ceramic plate; the through-hole electrode (31) and the internal circuit electrode (32) in each through-hole electrode layer are connected.

3. The LTCC filter electronic component with a rivet structure according to claim 2, characterized in that: The internal circuit electrode (32) is a printed electrode pattern.

4. The LTCC filter electronic component with a rivet structure according to claim 1, characterized in that: The rivet structure layer (2) comprises a rivet rod structure layer (22) and a rivet head electrode (23), wherein the rivet head electrode (23) is located above the rivet rod structure layer (22) and below the bottom through-hole electrode layer (3).

5. The LTCC filter electronic component with a rivet structure according to claim 4, characterized in that: The nail rod structure layer (22) comprises a ceramic plate having a plurality of through holes and metal nail rods (221) filled in the through holes; The nail head electrodes (23) are a plurality of circuit electrodes, which are the same in number and correspond one to one with the metal nail rods (221); The ratio of the through hole area in the nail rod structure layer (22) to the bottom area in the nail head electrode (23) is 1:1.25-5.

6. The LTCC filter electronic component with a rivet structure according to claim 1, characterized in that: The LTCC filter electronic component further includes an electrode bottom pad (1) located on the rivet structure layer (2); The rivet structure layer (2) comprises a nail head structure layer (21) and a nail rod structure layer (22); the nail head structure layer (21) is located above the nail rod structure layer (22) and below the bottom through-hole electrode layer (3).

7. The LTCC filter electronic component with a rivet structure according to claim 6, characterized in that: The nail head structure layer (21) comprises a ceramic plate with a plurality of through holes and metal nail heads (211) filled in the through holes; The nail rod structure layer (22) comprises a ceramic plate having a plurality of through holes and metal nail rods (221) filled in the through holes; The ceramic plate of the nail head structure layer (21) is located above the ceramic plate of the nail rod structure layer (22), and the metal nail heads (211) and the metal nail rods (221) are the same in number and are connected in a one-to-one correspondence.

8. The LTCC filter electronic component with a rivet structure according to claim 7, characterized in that: The aperture ratio of the through holes in the nail rod structure layer (22) to the through holes in the nail head structure layer (21) is 1:1.25-5.

9. The method for preparing the LTCC filter electronic component with a rivet structure according to any one of claims 1 to 5, characterized in that: The following steps are involved: Step 1: first, fill the through holes of a green porcelain tape having a plurality of through holes with metal paste and dry it to obtain a nail rod structure layer (22), with the nail rod structure layer serving as the bottom layer; Step 2: Printing a circuit electrode on the nail rod structure layer (22) obtained in step 1 and drying it to obtain a rivet structure layer (2) having a nail head electrode (23); Step 3: first, fill the through-holes of the green ceramic tape with through-holes with metal paste and dry it to prepare a through-hole electrode (31), then print the internal circuit electrode (32) on the upper surface of the through-hole electrode (31) and dry it again to prepare a through-hole electrode layer (3); Step 4: Repeat step 3 to prepare a plurality of through-hole electrode layers (3) until the target number of layers is reached; Step 5: Using a green ceramic tape without through holes as a capping ceramic layer (4), the rivet structure layer (2) obtained in step 2, the through-hole electrode layer (3) obtained in step 4, and the capping ceramic layer (4) are stacked and pressed together from the bottom layer to the top layer to obtain a green body; Step 6: Debinding the green body obtained in step 5, then sintering it, and finally post-processing it to obtain the product.

10. The method for preparing the LTCC filter electronic component with a rivet structure according to any one of claims 1 to 3 and 6 to 8, characterized in that: The following steps are involved: S1: first, filling metal paste into the through holes of a green porcelain tape having a plurality of through holes and drying the metal paste to obtain a nail rod structure layer (22), and then printing an electrode bottom pad (1) at the bottom of the nail rod structure layer (22); S2: filling metal paste into the through holes of another green porcelain tape having a plurality of through holes and drying the metal paste to obtain a nail head structure layer (21); S3: first, filling the through-holes of the green ceramic tape with through-holes with a metal paste and drying it to prepare a through-hole electrode (31), then printing an internal circuit electrode (32) on the upper surface of the through-hole electrode (31) and drying it again to prepare a through-hole electrode layer (3); S4: Repeat S3 to prepare a plurality of through-hole electrode layers (3) until the target number of layers is reached; S5: using a green ceramic tape without through-holes as a capping ceramic layer (4), sequentially laminating and pressing the electrode bottom pad (1) obtained in S1, the nail rod structure layer (22) obtained in S1, the nail head structure layer (21) obtained in S2, the through-hole electrode layer (3) obtained in S4, and the capping ceramic layer (4) from the bottom layer to the top layer to obtain a green body; S6: First, the green body obtained in S5 is subjected to a binder removal treatment, then sintered, and finally subjected to post-processing to obtain the product.

Images