Display substrate and display module

Abstract

The invention discloses a display substrate and a display module, and belongs to the technical field of display. The display substrate comprises a first substrate and a second substrate which are stacked, and a plurality of light-emitting units located on the side, away from the first substrate, of the second substrate. Through the first conductive block and the second conductive block which are connected with each other, the first substrate and the second substrate can form the driving backboard with a large number of conductive layers. Therefore, after the driving backboard with a large number of conductive layers is split into the first substrate and the second substrate, it can be ensured that the number of conductive layers contained in the first substrate and the second substrate is small and the order is low, the structural design of the first substrate and the second substrate is effectively simplified, and the preparation difficulty of the first substrate and the second substrate is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display substrate and a display module. Background Art

[0002] With the development of display technology, LED display substrates have become the most advantageous new generation display media and have been widely used due to their advantages such as pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, large viewing angle and stable and reliable operation.

[0003] However, the structure of current LED display substrates is usually relatively complex, which makes the processing of the LED display substrates more difficult, and further leads to higher preparation costs of the LED display substrates. Summary of the Invention

[0004] The embodiments of the present application provide a display substrate and a display module. This can solve the problem of high manufacturing costs of LED display substrates in the prior art. The technical solution is as follows:

[0005] In one aspect, a display substrate is provided, comprising:

[0006] A first substrate and a second substrate are stacked;

[0007] a plurality of light-emitting units, located on a side of the second substrate away from the first substrate;

[0008] The first substrate includes a first conductive block, which is located on a side of the first substrate close to the second substrate; the second substrate includes a second conductive block, which is located on a side of the second substrate close to the first substrate; and the first conductive block and the second conductive block are electrically connected.

[0009] Optionally, the display substrate includes a plurality of second substrates, the plurality of second substrates are all located on the same side of the first substrate, and the plurality of second substrates are spliced and arranged.

[0010] Optionally, the display substrate includes a plurality of pixels, each pixel is composed of at least one light-emitting unit, and the plurality of pixels are arrayed on the plurality of second substrates;

[0011] The plurality of second substrates include a first target substrate and a second target substrate arranged adjacent to each other, and in a first direction, a distance between adjacent pixels on the first target substrate is equal to a distance between a pixel on the first target substrate closest to the second target substrate and a pixel on the second target substrate closest to the first target substrate;

[0012] The first direction is a direction intersecting a seam between the first target substrate and the second target substrate.

[0013] Optionally, the plurality of pixels are arranged along the first direction and the second direction;

[0014] The first direction is perpendicular to the extending direction of the seam, and the second direction is parallel to the extending direction of the seam; the first direction and the second direction are perpendicular to each other.

[0015] Optionally, the first conductive block and the second conductive block are connected by welding;

[0016] Alternatively, the display substrate further includes an anisotropic conductive adhesive layer located between the first substrate and the second substrate, wherein a portion of the anisotropic conductive adhesive layer located between the first conductive block and the second conductive block is in a conductive state, and a portion of the anisotropic conductive adhesive layer surrounding the first conductive block and the second conductive block is in an insulating state.

[0017] Optionally, both the first substrate and the second substrate are printed circuit boards.

[0018] Optionally, for all the light-emitting units located on a side of the second substrate facing away from the first substrate, the light-emitting units are arranged in a plurality of columns along the third direction and in a plurality of rows along the fourth direction.

[0019] Optionally, the second substrate further includes: a plurality of first signal lines extending along the third direction, and a plurality of second signal lines extending along the fourth direction, wherein the plurality of first signal lines and the plurality of second signal lines are arranged in different layers;

[0020] The second substrate includes a plurality of second conductive blocks; among the plurality of second conductive blocks, a portion of the second conductive blocks are electrically connected to a plurality of first signal lines in a one-to-one correspondence, and another portion of the second conductive blocks are electrically connected to a plurality of second signal lines in a one-to-one correspondence.

[0021] Optionally, the second substrate further includes a third conductive block and a fourth conductive block, and the third conductive block and the fourth conductive block are both located on the side of the second substrate away from the first substrate, the third conductive block is electrically connected to the first signal line, the fourth conductive block is electrically connected to the second signal line, and the third conductive block and the fourth conductive block are respectively electrically connected to the first pole welding foot and the second pole welding foot in the same light-emitting unit.

[0022] Optionally, the second conductive block and the second signal line are provided in the same layer and are made of the same material; and / or the third conductive block and the fourth conductive block are provided in the same layer and are made of the same material as the first signal line.

[0023] Optionally, the first substrate and the second substrate each include: at least two conductive layers;

[0024] The conductive layer closest to the second substrate in the first substrate includes the first conductive block, and the conductive layer farthest from the second substrate in the first substrate is used for electrical connection with the driving component;

[0025] The conductive layer of the second substrate closest to the first substrate includes the second conductive block, and the conductive layer of the second substrate farthest from the first substrate is used for electrical connection with the light emitting unit.

[0026] Optionally, when the distance between two adjacent light-emitting units is greater than or equal to 1.2 mm, the first substrate and the second substrate each include two conductive layers.

[0027] Optionally, when the distance between two adjacent light-emitting units is less than 1.2 mm, the total number of conductive layers in the first substrate and the second substrate is six.

[0028] Optionally, the first substrate includes four conductive layers, and the second substrate includes two conductive layers; or, the first substrate includes two conductive layers, and the second substrate includes four conductive layers.

[0029] On the other hand, a display module is provided, comprising: the above-mentioned display substrate, and a driving component electrically connected to the display substrate, wherein the driving component is located on a side of the first substrate facing away from the second substrate.

[0030] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0031] A display substrate includes: a first substrate and a second substrate that are stacked, and a plurality of light-emitting units located on a side of the second substrate away from the first substrate. The first substrate and the second substrate can be combined into a driving backplane with a large number of conductive layers by connecting a first conductive block and a second conductive block. For this reason, after the driving backplane with a large number of conductive layers is split into a first substrate and a second substrate, it can be ensured that the first substrate and the second substrate contain fewer layers of conductive layers and a lower order, which effectively simplifies the structural design of the first substrate and the second substrate, and reduces the difficulty of preparing the first substrate and the second substrate. The assembly process of the first substrate and the second substrate is also generally simpler, thereby ensuring that the preparation cost of the driving backplane assembled from the first substrate and the second substrate is low, so that the preparation cost of the display substrate integrated with such a driving backplane is also low. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 This is a schematic diagram of the membrane structure of a circuit board design with a four-layer first-order board as the driving backplane;

[0034] Figure 2 This is a schematic diagram of the membrane structure of a circuit board design with a six-layer first-order board as the driving backplane;

[0035] Figure 3 This is a schematic diagram of the membrane structure of a circuit board design using a six-layer second-order board as the driving backplane;

[0036] Figure 4 Schematic diagram of a film structure of a display substrate provided in an embodiment of the present application;

[0037] Figure 5 A top view of a display substrate provided in an embodiment of the present application;

[0038] Figure 6 yes Figure 5 The schematic diagram of the film structure of the display substrate at AA' is shown;

[0039] Figure 7 is a top view of two adjacently arranged second substrates in a display substrate provided by an embodiment of the present application;

[0040] Figure 8 is a top view of a second substrate provided in an embodiment of the present application;

[0041] Figure 9 is a top view of a conductive layer of a second substrate that is farthest away from the first substrate provided in an embodiment of the present application;

[0042] Figure 10 is a top view of a conductive layer closest to the first substrate in a second substrate provided in an embodiment of the present application;

[0043] Figure 11 Schematic diagram of a film structure of a second substrate provided in an embodiment of the present application;

[0044] Figure 12 This is a schematic diagram of the film layer structure of a first substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0046] Current LED display substrates typically include a driver backplane and multiple LED light-emitting chips located on one side of the driver backplane. The driver backplane can be a printed circuit board (PCB) and typically contains multiple conductive layers, typically four or more.

[0047] For example, when the resolution of the LED display substrate is low, the driver backplane can adopt a four-layer first-order board circuit board design; when the resolution of the LED display substrate is high, the driver backplane needs to adopt a six-layer first-order board circuit board design or a six-layer second-order board structure design.

[0048] Here, please refer to Figure 1 , Figure 1 This is a schematic diagram of the film structure of a circuit board design using a four-layer, first-order board for the driver backplane. This circuit board includes four conductive layers 01 and three insulating layers 02. An insulating layer 02 is included between every two adjacent conductive layers 01.

[0049] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the film structure of a circuit board design using a six-layer, first-order board for the driver backplane. This circuit board includes six conductive layers 01 and five insulating layers 02. An insulating layer 02 is included between every two adjacent conductive layers 01.

[0050] In four-layer and six-layer single-step boards, both the topmost and bottommost insulating layers 02 have laser holes V01 that penetrate only a single layer, while the central insulating layer 02 has a through-hole V02 that penetrates at least one layer. For example, in a four-layer single-step board, through-hole V02 penetrates the middle insulating layer 02; in a six-layer single-step board, through-hole V02 penetrates the middle three insulating layers 02.

[0051] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the membrane layer structure of a circuit board design using a six-layer, second-order board as the driver backplane. This circuit board includes six conductive layers 01 and five insulating layers 02. An insulating layer 02 is included between every two adjacent conductive layers 01. In this circuit board, the top two insulating layers 02 each have two laser holes V01 that are disconnected and only penetrate a single layer. The bottom two insulating layers 02 also each have two laser holes V01 that are disconnected and only penetrate a single layer. The central insulating layer 02 has a through hole V02 that penetrates at least one layer. For this reason, the six-layer second-order board is equivalent to an insulating layer with laser holes V01 superimposed on the top and bottom sides of the four-layer first-order board.

[0052] However, the more conductive layers there are in a single circuit board and the higher the order, the more complex the circuit board design becomes and the more difficult it is to manufacture. Therefore, the current manufacturing cost of LED display substrates is relatively high.

[0053] Please refer to Figure 4 , Figure 4 Schematic diagram of a film structure of a display substrate provided by an embodiment of the present application. The display substrate 000 may include: a first substrate 100 and a second substrate 200 stacked together, and a plurality of light-emitting units 300 located on a side of the second substrate 100 away from the first substrate 100.

[0054] The first substrate 100 may include a first conductive block S1, which may be located on a side of the first substrate 100 close to the second substrate 200. The second substrate 200 may include a second conductive block S2, which may be located on a side of the second substrate 200 close to the first substrate 100. The first conductive block S1 in the first substrate 100 may be electrically connected to the second conductive block S2 in the second substrate 200.

[0055] For example, the first substrate 100 may include a plurality of first conductive blocks S1, and the second substrate 200 may include a plurality of second conductive blocks S2. The plurality of first conductive blocks S1 in the first substrate 100 may be electrically connected to the plurality of second conductive blocks S2 in the second substrate 200 in a one-to-one correspondence. In this way, the first substrate 100 may be electrically connected to the second substrate 200 via the connected first conductive blocks S1 and second conductive blocks S2.

[0056] In the embodiment of the present application, the first substrate 100 and the second substrate 200 are both printed circuit boards. The first and second conductive blocks 100 and 200 are connected to form a driving backplane with a large number of conductive layers. This driving backplane can control the light emission of multiple light-emitting units 300. Therefore, after the driving backplane with a large number of conductive layers is split into the first substrate 100 and the second substrate 200, the number of conductive layers contained in the first substrate 100 and the second substrate 200 can be ensured to be small and of a low order, which effectively simplifies the structural design of the first substrate 100 and the second substrate 200 and reduces the difficulty of manufacturing the first substrate 100 and the second substrate 200. The assembly process of the first substrate 100 and the second substrate 200 is generally simple, thereby ensuring that the manufacturing cost of the driving backplane assembled from the first substrate 100 and the second substrate 200 is low, and the manufacturing cost of the display substrate integrated with such a driving backplane is also low.

[0057] For example, when the driving backplane needs to adopt a circuit board structure design of a four-layer first-order board, the driving backplane can be split into: a first substrate 100 comprising two conductive layers and a second substrate 200 comprising two conductive layers, and the first substrate 100 and the second substrate 200 are both through-hole boards comprising only two conductive layers.

[0058] For another example, when a driver backplane requires a six-layer, first-order board structure, the driver backplane can be split into a first substrate 100 comprising four conductive layers and a second substrate 200 comprising two conductive layers. The second substrate 200 is a through-hole board comprising only two conductive layers, while the first substrate 100 is a through-hole board comprising four conductive layers, or the first substrate 100 is a four-layer, first-order board comprising four conductive layers.

[0059] For another example, when a driver backplane requires a six-layer, two-step board structure, the driver backplane can be split into a first substrate 100 comprising two conductive layers and a second substrate 200 comprising four conductive layers. The first substrate 100 is a through-hole board comprising only two conductive layers, while the second substrate 200 is a four-layer, one-step board comprising four conductive layers.

[0060] It should be noted that the term "through-hole board" here refers to a circuit board with only one type of through-hole, which is equivalent to a multi-layer zero-order circuit board. Therefore, the four-layer first-order board is equivalent to a through-hole board with only two conductive layers, with an insulating layer with laser holes superimposed on the top and bottom.

[0061] In summary, the display substrate provided by the embodiment of the present application includes: a first substrate and a second substrate that are stacked, and a plurality of light-emitting units located on the side of the second substrate away from the first substrate. The first substrate and the second substrate can be combined into a driving backplane with a large number of conductive layers through the connected first conductive block and the second conductive block. For this reason, after the driving backplane with a large number of conductive layers is split into the first substrate and the second substrate, it can be ensured that the first substrate and the second substrate contain fewer layers of conductive layers and a lower order, which effectively simplifies the structural design of the first substrate and the second substrate, and reduces the difficulty of preparing the first substrate and the second substrate. The assembly process of the first substrate and the second substrate is generally simpler, thereby ensuring that the preparation cost of the driving backplane assembled by the first substrate and the second substrate is low, so that the preparation cost of the display substrate integrated with such a driving backplane is also low.

[0062] In the embodiment of the present application, there are multiple optional implementations of the electrical connection between the first conductive block S1 in the first substrate 100 and the second conductive block S2 in the second substrate 200. The embodiment of the present application will be described using the following two optional implementations as examples:

[0063] In a first optional implementation, the first conductive block S1 and the second conductive block S2 may be connected by welding.

[0064] For example, the second conductive block S2 in the second substrate 200 can be welded to the first conductive block S1 in the first substrate 100 using surface mount technology (SMT), so that the second substrate 200 can not only be fixed on the second substrate 100, but also be electrically connected to the second substrate 200 through the first conductive block S1 and the second conductive block S2.

[0065] In a second optional implementation, the first conductive block S1 and the second conductive block S2 may be connected by bonding with an anisotropic conductive adhesive layer.

[0066] For example, the display substrate 000 further includes an anisotropic conductive adhesive layer positioned between the first substrate 100 and the second substrate 200. The portion of the anisotropic conductive adhesive layer positioned between the first conductive block 100 and the second conductive block 200 is conductive, while the portion surrounding the first conductive block 100 and the second conductive block 200 is insulating. Thus, the second substrate 200 can be bonded and fixed to the first substrate 100 via the anisotropic conductive adhesive layer, and the second conductive blocks S2 in the second substrate 200 can be electrically connected to the first conductive blocks S1 in the first substrate 100 via the conductive portion of the anisotropic conductive adhesive layer, thereby electrically connecting the second substrate 200 to the first substrate 100. Two adjacent second conductive blocks S2 in the second substrate 200 can be insulated by the insulating portion of the anisotropic conductive adhesive layer, preventing conduction between the two adjacent second conductive blocks S2 via the anisotropic conductive adhesive layer, thereby preventing a short circuit between the two second conductive blocks S2. Similarly, two adjacent first conductive blocks S1 in the first substrate 100 can be insulated by the insulating portion of the anisotropic conductive adhesive layer, so that the two adjacent first conductive blocks S1 will not be connected by the anisotropic conductive adhesive layer, thereby ensuring that the two first conductive blocks S1 will not be short-circuited.

[0067] In the embodiment of the present application, when the board surface of the first substrate 100 and the board surface of the second substrate 200 are both large, the first substrate 100 and the second substrate 200 are very likely to be offset during the alignment assembly process, resulting in a low yield rate of the driver backplane assembled from the first substrate 100 and the second substrate 200. In order to improve the yield rate of the driver backplane, it is necessary to improve the alignment accuracy of the first substrate 100 and the second substrate 200. Here, the second substrate 200 used to connect the light-emitting unit 300 can be set as a circuit board with a smaller board surface. In this way, after multiple second substrates 200 are fixed to the same side of the first substrate 100 at the same time, it can be ensured that the board surface of these second substrates 200 with smaller board surfaces after splicing is basically consistent with the board surface of the first substrate 100. Since the board surface of a single second substrate 200 is smaller, its alignment accuracy with the first substrate 100 is higher, and therefore, the alignment connection accuracy of the second substrate 200 and the first substrate 100 is higher.

[0068] For example, Figure 5 and Figure 6 As shown, Figure 5 1 is a top view of a display substrate provided in an embodiment of the present application. Figure 6 yes Figure 5 The display substrate 000 may include multiple second substrates 200 , which may all be located on the same side of the first substrate 100 , and the multiple second substrates 200 may be spliced and arranged on the same side of the first substrate 100 .

[0069] Here, the board surface of each second substrate 200 is smaller, while the board surface of the first substrate 100 is larger. After the multiple second substrates 200 are spliced and arranged on the same side of the first substrate 100, it can be ensured that the board surface of the multiple second substrates 200 after splicing and arrangement is approximately equal to the board surface of the first substrate 100.

[0070] In this case, since the surface area of a single second substrate 200 is relatively small, during the alignment process between the second substrate 200 and the first substrate 100, the multiple second conductive blocks S2 in the second substrate 200 and the corresponding first conductive blocks S1 in the first substrate 100 can be precisely aligned together, thereby ensuring that the second substrate 200 can be accurately assembled onto the first substrate 100. Therefore, each second substrate 200 can be precisely assembled onto the first substrate 100, resulting in a high yield rate for the driver backplane obtained by assembling the multiple second substrates 200 and the first substrate 100.

[0071] Optionally, each second substrate 200 in the display substrate 000 has the same shape and the same surface area. In this case, each second substrate 200 can be connected to multiple light-emitting units 300 on the side facing away from the first substrate 100, and each second substrate 200 is connected to an equal number of light-emitting units 300. Therefore, the shape and structure of the second substrates 200 in the display substrate 000 are completely consistent, and these second substrates 200 can be mass-produced with only a single structural design, further reducing the difficulty of manufacturing such a display substrate 000.

[0072] In the embodiments of this application, Figure 7 As shown, Figure 7 FIG2 is a top view of two adjacent second substrates in a display substrate provided in an embodiment of the present application. The display substrate 000 may include a plurality of pixels P, and each pixel P may be composed of at least one light emitting unit 300.

[0073] Here, the pixel P in the display substrate 000 may include three LED chips, and these three LED chips are distributed to emit red light, green light, and blue light. To this end, the light-emitting unit 300 in the display substrate 000 may include at least one LED chip. For example, the light-emitting unit 300 may include only one LED chip, or may include three LED chips at the same time. It should be noted that the LED chip may be an LED chip of ordinary size, or a mini light-emitting diode (English: miniLight-Emitting Diode, abbreviated as: mini-LED) chip, or a micro LED (English: MicroLight-Emitting Diode, abbreviated as: Micro-LED) chip. The embodiments of the present application are not limited to this.

[0074] For example, when the light emitting unit 300 includes only one LED chip, each pixel P in the display substrate 000 may be composed of three adjacent light emitting units 300 , and the three adjacent light emitting units are used to emit red light, green light and blue light, respectively.

[0075] For another example, when the light emitting unit 300 includes three LED chips, each pixel P in the display substrate 000 can be composed of one light emitting unit 300 , and the three LEDs in the light emitting unit 300 are distributed to emit red light, green light and blue light.

[0076] In this application, if Figure 7 As shown, the plurality of pixels P in the display substrate 000 can be arrayed on the second substrate 200. For example, a plurality of pixels P can be arrayed on each second substrate 200, and the number of pixels P in the display substrate 000 is the sum of the number of pixels P arrayed on each second substrate 200.

[0077] The plurality of second substrates 200 in the display substrate 000 may include adjacent first template substrates 200a and second target substrates 200b. In a first direction X, the distance between adjacent pixels P on the first target substrate 200a may be equal to the distance between the pixel on the first target substrate 200a closest to the second target substrate 200b and the pixel on the second target substrate 200b closest to the first target substrate 200a. The first direction X may be a direction intersecting the seam between the first target substrate 200a and the second target substrate 200b.

[0078] For example, Figure 7 As shown, assuming that the pixel closest to the second target substrate 200b on the first target substrate 200a is pixel P1, and the pixel closest to the first target substrate 200a on the second target substrate 200b is pixel P2, the distance between pixel P1 and pixel P2 can be equal to the distance between pixel P3 and pixel P4 arranged adjacent to each other in the first target substrate 200a in the first direction X. Similarly, the distance between pixel P1 and pixel P2 can also be equal to the distance between pixel P5 and pixel P6 arranged adjacent to each other in the first direction X in the second target substrate 200b.

[0079] In this case, even if a plurality of second substrates 200 are arranged on the first substrate 100 in a spliced arrangement, it is possible to ensure that the pixels P in the display substrate 000 are evenly arranged, thereby ensuring a better display effect of the display substrate 000.

[0080] Optional, such as Figure 7As shown, a plurality of pixels P in the display substrate 000 are arranged along a first direction X and a second direction Y. The first direction X may be perpendicular to the extending direction of the seam between the first target substrate 200a and the second target substrate 200b, and the second direction Y may be parallel to the extending direction of the seam between the first target substrate 200a and the second target substrate 200b. Here, the first direction X and the second direction Y may be perpendicular to each other.

[0081] In the present application, for all the light emitting units 300 located on the side of the second substrate 200 away from the first substrate 100 , these light emitting units 300 may be arrayed into multiple columns along the third direction and arrayed into multiple rows along the fourth direction.

[0082] It should be noted that the first direction X and the second direction Y described above are related to the arrangement direction of the first target substrate 200a and the second target substrate 200b. The third and fourth directions herein are only related to the arrangement of the light-emitting units 300 distributed on the second substrate 200. To this end, the third direction can be parallel to the first direction X, and the fourth direction can be parallel to the second direction Y. Alternatively, the third direction can be parallel to the second direction Y, and the fourth direction can be parallel to the second direction Y. This embodiment of the present application is not limited to this.

[0083] Optional, such as Figure 8 As shown, Figure 8 This is a top view of a second substrate provided in an embodiment of the present application. The second substrate 200 in the display substrate 000 may further include: a plurality of first signal lines L1 extending along a third direction, and a plurality of second signal lines extending along a fourth direction. Here, the plurality of first signal lines L1 may be arranged in a different layer from the plurality of second signal lines L2. This ensures that even if the extension direction of the first signal lines L1 intersects the extension direction of the second signal lines L2, a short circuit will not occur at the intersection between the first signal lines L1 and the second signal lines L2.

[0084] There may be multiple second conductive blocks S2 in the second substrate 200. Among the multiple second conductive blocks S2, some of the second conductive blocks S2 may be electrically connected to the multiple first signal lines L1 in a one-to-one correspondence, and another portion of the second conductive blocks S2 may be electrically connected to the multiple second signal lines L2 in a one-to-one correspondence.

[0085] In this way, the multiple first signal lines L1 and the multiple second signal lines L2 in the second substrate 200 can be connected to the first substrate 100 through the corresponding second conductive blocks S2 and the first conductive blocks S1 electrically connected to these second conductive blocks S2, so that after the first substrate 100 receives the signals for driving the light-emitting units 300, the first substrate 100 can transmit these signals to the corresponding first signal lines L1 and second signal lines L2 respectively, so that the corresponding light-emitting units 300 can emit light.

[0086] Optional, such as Figure 8 As shown, the second base 200 in the display substrate 000 may further include a third conductive block S3 and a fourth conductive block S4.

[0087] The third conductive block S3 and the fourth conductive block S4 can both be located on a side of the second substrate 200 facing away from the first substrate 100. The third conductive block S3 can be electrically connected to the first signal line L1, and the fourth conductive block S4 can be electrically connected to the second signal line L2. The third conductive block S3 and the fourth conductive block S4 can also be electrically connected to the first electrode solder pin and the second electrode solder pin of the same light-emitting unit 300, respectively.

[0088] It should be noted that the first and second solder legs in the light-emitting unit 300 refer to the first and second solder legs of the LED chip in the light-emitting unit 300. The second substrate 200 may include multiple third conductive blocks S3 and multiple fourth conductive blocks S4, each of which corresponds one-to-one to each of the LEDs in the display substrate 000. The first and second solder legs of each LED chip can be electrically connected to the corresponding third and fourth conductive blocks S3 and S4, respectively, via soldering. Soldering also allows the light-emitting unit 300, which includes at least one LED chip, to be secured to the second substrate 200.

[0089] Here, assuming that the third conductive pad S3 is used to electrically connect to the first pin of the LED chip, the fourth conductive pad S4 is used to electrically connect to the second pin of the LED chip, and the first pins of the three LED chips in the same pixel P need to be connected to the same signal, while the second pins of the three LED chips in the same pixel P need to be connected to three different signals. Therefore, the first pins of the LED chips in the same row of pixels P need to be connected to a first signal line L1; the second pins of the LED chips emitting the same color of light in the same column of pixels P can be connected to a second signal line L2, while the second pins of the LED chips emitting different colors of light in the same column of pixels P need to be connected to different second signal lines L2.

[0090] To this end, the three third conductive pads S3 electrically connected to the first pins of the three LED chips in the same pixel P can be connected to the corresponding first signal line L1 through the first transfer electrode Z1. The fourth conductive pad S4 electrically connected to the second pin of each LED chip can be connected to the corresponding second signal line L2 through the second transfer electrode Z2.

[0091] In the embodiment of the present application, all the second conductive blocks S2 disposed on the side of the second substrate 200 facing the first substrate 100 can be disposed in the same layer and made of the same material as the plurality of second signal lines L2. That is, all the second conductive blocks S2 and the plurality of second signal lines L2 are located in the same conductive layer. And / or, all the third conductive blocks S3 and fourth conductive blocks S4 disposed on the side of the second substrate 200 facing away from the first substrate 100 can be disposed in the same layer and made of the same material as the plurality of first signal lines L1. That is, all the third conductive blocks S3 and fourth conductive blocks S4 and the plurality of first signal lines L1 are located in the same conductive layer.

[0092] To this end, the second substrate 200 may include at least two conductive layers. Here, the conductive layer closest to the first substrate 100 in the second substrate 200 includes the second conductive block S2, and the conductive layer furthest from the first substrate 100 in the second substrate 200 is used to electrically connect to the light-emitting unit 300. In other words, the conductive layer furthest from the first substrate 100 in the second substrate 200 includes the third conductive block S3 and the fourth conductive block S4.

[0093] In one possible case, if the second substrate 200 only includes two conductive layers, then, Figure 9 As shown, Figure 9 This is a top view of a conductive layer in a second substrate that is farthest away from the first substrate provided by an embodiment of the present application. This conductive layer may include: a plurality of third conductive blocks S3, a plurality of fourth conductive blocks S4, and a plurality of first signal lines L1. Figure 10 As shown, Figure 10 This is a top view of a conductive layer closest to the first substrate in a second substrate provided by an embodiment of the present application. This conductive layer may include: a plurality of second conductive blocks S2 and a plurality of second signal lines L2. It should be noted that, if Figure 9 As shown, the conductive layer in the second substrate 200 that is most away from the first substrate 100 may further include: the first switching electrode Z1 and the second switching electrode Z2 in the above embodiment.

[0094] In this case, if Figure 9 、 Figure 10 and Figure 11 As shown, Figure 11Schematic diagram of the film layer structure of a second substrate provided in an embodiment of the present application. The second substrate 200 may further include: an insulating layer located between the two conductive layers, and the insulating layer has a plurality of first through holes V1 and a plurality of second through holes V2. The plurality of second signal lines L2 in the second substrate 200 can be directly electrically connected to a portion of the second conductive blocks S2 in a one-to-one correspondence, and the plurality of first signal lines L1 in the second substrate 200 can be electrically connected to another portion of the second conductive blocks S2 in a one-to-one correspondence through the first through holes V1. The first signal lines L2 in the second substrate 200 need to be electrically connected to the corresponding fourth conductive blocks S4 through the second through holes V2 and the second transfer electrodes Z2.

[0095] It should be noted that Figure 8 The second substrate 200 shown is schematically illustrated by taking the example of the second substrate 200 including two conductive layers. In the case where the second substrate 200 includes four or more conductive layers, the internal wiring distribution of the second substrate 200 can also refer to FIG. Figure 8 The wiring distribution is shown in FIG. This embodiment of the present application will not be described in detail.

[0096] In the embodiments of this application, Figure 12 As shown, Figure 12 This is a schematic diagram of the film layer structure of a first substrate provided in an embodiment of the present application. The first substrate 100 in the display substrate 000 also includes at least two conductive layers. Here, the conductive layer closest to the second substrate 200 in the first substrate 100 comprises the first conductive block S1, while the conductive layer furthest from the second substrate 200 in the first substrate 100 is used for electrical connection to the driver assembly.

[0097] The driving assembly can be bound to the side of the first substrate 100 away from the second substrate 200 by binding. Of course, the driving assembly can also be fixed to the side of the first substrate 100 away from the second substrate 200 by welding. This embodiment of the application is not limited to this.

[0098] It should be noted that when the driver assembly is fixed to the side of the first substrate 100 facing away from the second substrate 200 by welding, the conductive layer of the first substrate 100 that is farthest away from the second substrate 200 may include: multiple fifth conductive blocks S5, and the driver assembly may include multiple driver components. The solder legs of each driver component may be electrically connected to the corresponding fifth conductive block S5 by welding. Here, the multiple driver components may include: a first driver component for providing a signal to the first signal line L1, and a second driver component for providing a signal to the second signal line L2.

[0099] In the present application, the number of the second substrates 200 in the display module 000 may be determined according to the performance of the first driving components and the second driving components used.

[0100] For example, assuming that pixels P in the same row of the entire display substrate 000 need to be driven by M first driving devices, the second substrate 200 can be divided into M partitions in the third direction. Furthermore, assuming that the LED chips emitting the same color of light in the same column of pixels P in the entire display substrate 000 need to be driven by N second driving devices, the second substrate 200 can be divided into N partitions in the fourth direction. Here, M and N are both integers greater than or equal to 1. To this end, the number of second substrates 200 in the display substrate 000 can be M×N.

[0101] In an embodiment of the present application, when the resolution of the display substrate 000 is low, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is relatively large. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 can be greater than or equal to 1.2 mm. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is within a range of 1.2 mm to 3.0 mm. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is within a range of 1.2 mm to 2.0 mm. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is 1.2 mm, 1.5 mm, or 1.8 mm, etc. In this case, the total number of conductive layers in the first substrate 100 and the number of conductive layers in the second substrate 200 in the display substrate 000 is four. For example, the first substrate 100 and the second substrate 200 can each include two conductive layers, and both the first substrate 100 and the second substrate 200 are through-hole boards containing only two conductive layers. After the first substrate 100 and the second substrate 200 are electrically connected via the first conductive block S1 and the second conductive block S2 , the first substrate 100 and the second substrate 200 can be combined into a four-layer first-stage board.

[0102] When the display substrate 000 has a high resolution, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is smaller. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 can be less than 1.2 mm. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is within a range of 0.2 mm to 1.2 mm. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is within a range of 0.3 mm to 1.0 mm. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is within a range of 0.7 mm to 1.0 mm. For example, the spacing between two adjacent light-emitting units 300 in the display substrate 000 is 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm, etc. In this case, the total number of conductive layers in the first base 100 and the number of conductive layers in the second base 200 in the display substrate 000 is six. For example, when the wiring of the second substrate 200 for electrical connection to the light-emitting unit is relatively complex, the number of conductive layers in the second substrate 200 can be greater than the number of conductive layers in the first substrate 100. For example, the number of conductive layers in the second substrate 200 can be four, while the number of conductive layers in the first substrate 100 can be two. When the wiring of the second substrate 200 for electrical connection to the driving component is relatively complex, the number of conductive layers in the first substrate 100 can be greater than the number of conductive layers in the second substrate 200. For example, the number of conductive layers in the first substrate 100 can be four, while the number of conductive layers in the second substrate 100 can be two.

[0103] Here, if the number of conductive layers within the second substrate 200 is four and the number of conductive layers within the first substrate 100 is two, the first substrate 100 is a through-hole board comprising two conductive layers. If the second substrate 200 is a through-hole board comprising four conductive layers, then after the first substrate 100 and the second substrate 200 are electrically connected via the first conductive block S1 and the second conductive block S2, the first substrate 100 and the second substrate 200 can be combined into a six-layer, first-stage board. If the second substrate 200 is a four-layer, first-stage board comprising four conductive layers, then after the first substrate 100 and the second substrate 200 are electrically connected via the first conductive block S1 and the second conductive block S2, the first substrate 100 and the second substrate 200 can be combined into a six-layer, second-stage board.

[0104] If the first substrate 100 has four conductive layers and the second substrate 200 has two conductive layers, the second substrate 200 is a through-hole board comprising two conductive layers. If the first substrate 100 is a through-hole board comprising four conductive layers, then after the first substrate 100 and the second substrate 200 are electrically connected via the first conductive block S1 and the second conductive block S2, the first substrate 100 and the second substrate 200 can be combined into a six-layer, first-stage board. If the first substrate 100 is a four-layer, first-stage board comprising four conductive layers, then after the first substrate 100 and the second substrate 200 are electrically connected via the first conductive block S1 and the second conductive block S2, the first substrate 100 and the second substrate 200 can be combined into a six-layer, second-stage board.

[0105] In summary, the display substrate provided by the embodiment of the present application includes: a first substrate and a second substrate that are stacked, and a plurality of light-emitting units located on the side of the second substrate away from the first substrate. The first substrate and the second substrate can be combined into a driving backplane with a large number of conductive layers through the connected first conductive block and the second conductive block. For this reason, after the driving backplane with a large number of conductive layers is split into the first substrate and the second substrate, it can be ensured that the first substrate and the second substrate contain fewer layers of conductive layers and a lower order, which effectively simplifies the structural design of the first substrate and the second substrate, and reduces the difficulty of preparing the first substrate and the second substrate. The assembly process of the first substrate and the second substrate is generally simpler, thereby ensuring that the preparation cost of the driving backplane assembled by the first substrate and the second substrate is low, so that the preparation cost of the display substrate integrated with such a driving backplane is also low.

[0106] The present application also provides a display module, which may include a display substrate and a drive assembly electrically connected to the display substrate. The display substrate may be the display substrate described in the above embodiment. The drive assembly may be located on a side of the first substrate of the display substrate facing away from the second substrate. The drive assembly is configured to provide a drive signal to a light-emitting unit via the first and second substrates, causing the light-emitting unit to emit light, thereby enabling the side of the display module where the light-emitting unit is located to present a display image.

[0107] The present application also provides a display device. This display device can be any product or component with a display function, such as an advertising screen, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, or a navigation system. This display device can include the display module described in the above embodiments.

[0108] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0109] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0110] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display substrate, characterized in that: include: A first substrate and a second substrate are stacked; a plurality of light-emitting units, located on a side of the second substrate away from the first substrate; The first substrate includes a first conductive block, which is located on a side of the first substrate close to the second substrate; the second substrate includes a second conductive block, which is located on a side of the second substrate close to the first substrate; and the first conductive block and the second conductive block are electrically connected.

2. The display substrate according to claim 1, wherein: The display substrate includes a plurality of second substrates, the plurality of second substrates are all located on the same side of the first substrate, and the plurality of second substrates are spliced and arranged.

3. The display substrate according to claim 2, wherein: The display substrate includes a plurality of pixels, each pixel is composed of at least one light-emitting unit, and the plurality of pixels are arrayed on the plurality of second substrates; The plurality of second substrates include a first target substrate and a second target substrate arranged adjacent to each other, and in a first direction, a distance between adjacent pixels on the first target substrate is equal to a distance between a pixel on the first target substrate closest to the second target substrate and a pixel on the second target substrate closest to the first target substrate; The first direction is a direction intersecting a seam between the first target substrate and the second target substrate.

4. The display substrate according to claim 3, wherein: The plurality of pixels are arranged along the first direction and the second direction; The first direction is perpendicular to the extending direction of the seam, and the second direction is parallel to the extending direction of the seam; the first direction and the second direction are perpendicular to each other.

5. The display substrate according to claim 1, wherein The first conductive block and the second conductive block are welded and connected; Alternatively, the display substrate further includes an anisotropic conductive adhesive layer located between the first substrate and the second substrate, wherein a portion of the anisotropic conductive adhesive layer located between the first conductive block and the second conductive block is in a conductive state, and a portion of the anisotropic conductive adhesive layer surrounding the first conductive block and the second conductive block is in an insulating state.

6. The display substrate according to claim 1, wherein: The first substrate and the second substrate are both printed circuit boards.

7. The display substrate according to any one of claims 1 to 6, characterized in that: For all the light emitting units located on a side of the second substrate facing away from the first substrate, the light emitting units are arranged in a plurality of columns along the third direction and in a plurality of rows along the fourth direction.

8. The display substrate according to claim 7, wherein: The second substrate further includes: a plurality of first signal lines extending along the third direction, and a plurality of second signal lines extending along the fourth direction, wherein the plurality of first signal lines and the plurality of second signal lines are arranged in different layers; The second substrate includes a plurality of second conductive blocks; among the plurality of second conductive blocks, a portion of the second conductive blocks are electrically connected to a plurality of first signal lines in a one-to-one correspondence, and another portion of the second conductive blocks are electrically connected to a plurality of second signal lines in a one-to-one correspondence.

9. The display substrate according to claim 8, wherein: The second substrate also includes a third conductive block and a fourth conductive block. The third conductive block and the fourth conductive block are both located on the side of the second substrate facing away from the first substrate. The third conductive block is electrically connected to the first signal line, and the fourth conductive block is electrically connected to the second signal line. The third conductive block and the fourth conductive block are respectively electrically connected to the first electrode welding foot and the second electrode welding foot in the same light-emitting unit.

10. The display substrate according to claim 9, wherein: The second conductive block and the second signal line are provided in the same layer and made of the same material; and / or the third conductive block and the fourth conductive block are provided in the same layer and made of the same material as the first signal line.

11. The display substrate according to any one of claims 1 to 6 and 7 to 9, characterized in that: The first substrate and the second substrate each include: at least two conductive layers; The conductive layer closest to the second substrate in the first substrate includes the first conductive block, and the conductive layer farthest from the second substrate in the first substrate is used for electrical connection with the driving component; The conductive layer of the second substrate closest to the first substrate includes the second conductive block, and the conductive layer of the second substrate farthest from the first substrate is used for electrical connection with the light emitting unit.

12. The display substrate according to claim 11, wherein: When the distance between two adjacent light-emitting units is greater than or equal to 1.2 mm, the first substrate and the second substrate each include two conductive layers.

13. The display substrate according to claim 11, wherein: When the distance between two adjacent light-emitting units is less than 1.2 mm, the total number of conductive layers in the first substrate and the second substrate is six. 14 . The display substrate according to claim 13 , wherein the first substrate comprises four conductive layers, and the second substrate comprises two conductive layers; or the first substrate comprises two conductive layers, and the second substrate comprises four conductive layers.

15. A display module, characterized in that: include: The display substrate according to any one of claims 1 to 14, and a driving component electrically connected to the display substrate, wherein the driving component is located on a side of the first substrate facing away from the second substrate.

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