Semiconductor chip ink jet device

Abstract

The invention discloses a semiconductor chip ink-jet device, and relates to the technical field of ink-jet processing, the semiconductor chip ink-jet device comprises an ink-jet assembly, a rack, a displacement clamping plate located on the rack, a clamping block fixed on the displacement clamping plate, a fixed clamping plate arranged on one side of the displacement clamping plate, and a clamping block fixed on the other side of the displacement clamping plate, an ink jet mechanism is arranged at the top of the rack; and the feeding assembly is arranged on one side of the rack and comprises a displacement plate located on the rack. The device has the beneficial effects that through the arrangement of the feeding assembly, a hollow plate and a bearing part can be matched to pre-clamp a template, and a limiting part is matched to position and prevent falling, so that the placement stability of the template is ensured, the template can be conveniently fed and conveyed in cooperation with a conveying part, and the purpose of shielding and covering is achieved; the probability that the semiconductor chip on the template is polluted is reduced, and meanwhile, when the template is positioned, the purpose of blowing cleaning can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of inkjet processing, in particular to an inkjet device for a semiconductor chip. Background Art

[0002] Semiconductor chips are microelectronic devices made of semiconductor materials. During actual processing, the inkjet device (based on inkjet printing technology) accurately sprays liquid material flux in the form of micron-sized droplets onto the surface of the substrate, reducing the risk of damage caused by frequent contact with the product.

[0003] The inkjet device in the existing technology is integrated into one device, but it still requires manual operation to put the workpiece carrying multiple semiconductors into the machine, and cooperate with its own transmission mechanism to clamp the workpiece and then transport it. The actual feeding is affected by manual operation and the stability is generally poor. It is not convenient to calibrate with the subsequent transmission mechanism, and it is impossible to simultaneously spray and clean the workpiece, which affects the quality of subsequent inkjet processing. Summary of the Invention

[0004] The present invention is proposed in view of the above-mentioned problems existing in the existing semiconductor chip inkjet device.

[0005] Therefore, the problem to be solved by the present invention is that the inkjet device in the prior art has a generally low stability in feeding due to human influence and is unable to simultaneously perform spray cleaning on the workpiece, thus affecting the quality of subsequent inkjet processing.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a semiconductor chip inkjet device, comprising:

[0007] The inkjet assembly includes a frame, a conveying member is installed on the frame, and includes a displacement clamp located on the frame, a clamping block is fixed on the displacement clamp, a fixed clamp is provided on one side of the displacement clamp, and an inkjet mechanism is provided on the top of the frame; and

[0008] The feeding assembly is arranged on one side of the frame and includes a displacement plate located on the frame. A hollow plate is provided on one side of the displacement plate. A screw is embedded in the displacement plate. A receiving piece is provided on the top of the screw. A bearing piece is installed on the screw. The bearing piece includes a fixed shell fixed to the frame. A displacement shell is threadedly connected to the screw. A template is placed in the fixed shell. A limiting piece is provided on the top of the hollow plate. The limiting piece includes an insertion rod slidably connected to the hollow plate.

[0009] As a preferred solution of the semiconductor chip inkjet device of the present invention, an electromagnetic air nozzle is embedded on the displacement plate, the air outlet of the electromagnetic air nozzle is connected to the air inlet of the hollow plate, and an arc groove is opened on the block.

[0010] As a preferred solution of the semiconductor chip inkjet device described in the present invention, wherein: an annular inclined groove is opened at the bottom of the insertion rod, a spring is sleeved on the insertion rod, a convex ring is fixed on the insertion rod, one end of the spring is fixed to the top of the hollow plate, and the other end of the spring is fixed to the insertion rod.

[0011] As a preferred solution of the semiconductor chip inkjet device of the present invention, a limiting hole is provided on the top of the template and slides with the insertion rod, and a displacement groove is provided on the top of the template and communicates with the limiting hole.

[0012] As a preferred solution of the semiconductor chip inkjet device described in the present invention, the receiving part includes a fixing seat located at the top of the screw, a receiving sleeve is rotatably connected to the fixing seat, and a locking bolt is threadedly connected to the top of the receiving sleeve.

[0013] As a preferred solution of the semiconductor chip inkjet device described in the present invention, one end of the screw rod passes through the fixed shell and is rotatably connected to the fixed shell, one side of the fixed shell is fixed to the frame, one end of the screw rod passes through the displacement shell and is threadedly connected to the displacement shell, the displacement shell is slidably connected to the frame, and one end of the fixed shell and the displacement shell are fixed with a bracket.

[0014] As a preferred solution of the semiconductor chip inkjet device of the present invention, the bottoms of the two fixing seats are respectively fixed to the tops of the fixing shell and the displacement shell, and the hollow plate is slidably connected in the receiving sleeve.

[0015] As a preferred solution of the semiconductor chip inkjet device described in the present invention, wherein: an air jet hole is opened at the bottom of the hollow plate, a mold groove is opened at the top of the template, the air jet hole is located at the top of the mold groove, a first electrode seat is fixed on one side of the hollow plate, a second electrode seat is fixed on the frame and cooperates with the first electrode seat, and a rebounder is embedded in the frame and cooperates with the displacement plate.

[0016] As a preferred solution of the semiconductor chip inkjet device described in the present invention, the conveying member also includes a linear motor fixed on the frame, a carrier frame is fixed on the moving end of the linear motor and the frame, a belt transmission mechanism is provided in the carrier frame, an electric push rod is fixed on the frame, and a suction nozzle is fixed on the output end of the electric push rod.

[0017] As a preferred solution of the semiconductor chip inkjet device described in the present invention, a three-dimensional operating mechanism is provided on the top of the frame, a weighing mechanism is provided on the frame and at the bottom of the inkjet mechanism, a positioning groove is provided on the weighing mechanism, and a controller is provided at the bottom of the frame.

[0018] The beneficial effects of the present invention are: through the setting of the feeding component, the template can be pre-clamped in conjunction with the hollow plate and the carrier, and positioned and prevented from falling off in conjunction with the limiter, thereby ensuring the stability of the template placement, facilitating the feeding of the template into cooperation with the conveyor for transmission, and achieving the purpose of shielding and covering, reducing the probability of contamination of the semiconductor chip on the template, and at the same time, when completing the template positioning operation, the purpose of spray cleaning can also be achieved, which is more in line with actual use needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 This is a structural diagram of a semiconductor chip inkjet device.

[0021] Figure 2 This is a structural diagram of the inkjet component of the semiconductor chip inkjet device.

[0022] Figure 3 Another perspective view of the local structure of the semiconductor chip inkjet device.

[0023] Figure 4 This is a structural diagram of the displacement clamp and displacement plate of the semiconductor chip inkjet device.

[0024] Figure 5 A cross-sectional view of the displacement plate of a semiconductor chip inkjet device.

[0025] Figure 6 Inkjet device for semiconductor chips Figure 5 Enlarged view of point A in the middle.

[0026] Figure 7 This is a diagram of the separation of the hollow plate, template and carrier of the semiconductor chip inkjet device.

[0027] Figure 8 This is a rear view of the hollow plate and displacement clamp of the semiconductor chip inkjet device.

[0028] Figure 9 A side cross-sectional view of the displacement clamp, hollow plate, and template of a semiconductor chip inkjet device.

[0029] Figure 10 Inkjet device for semiconductor chips Figure 9 Enlarged view of point B in the middle.

[0030] Figure 11 This is a template structure diagram of the semiconductor chip inkjet device.

[0031] In the figure: 1. Inkjet assembly; 11. Frame; 12. Conveyor; 12-1. Displacement splint; 12-11. Clamping block; 12-12. Arc groove; 12-2. Fixed splint; 12-3. Carrying frame; 12-4. Belt transmission mechanism; 12-5. Electric push rod; 12-6. Suction nozzle; 12-7. Linear motor; 13. Inkjet mechanism; 14. Three-dimensional operation mechanism; 15. Positioning slot; 16. Weighing mechanism; 17. Controller; 2. Feeding assembly; 21. Displacement plate; 21-1. Electromagnetic nozzle; 22. Hollow plate; 2 2-1. First electrode holder; 22-2. Jet hole; 23. Rebounder; 24. Screw; 25. Storage member; 25-1. Fixed seat; 25-2. Storage sleeve; 25-3. Locking bolt; 26. Second electrode holder; 27. Carrying member; 27-1. Fixed shell; 27-2. Displacement shell; 27-3. Bracket; 28. Template; 28-1. Die groove; 28-2. Limiting hole; 28-3. Displacement groove; 29. Limiting member; 29-1. Insert rod; 29-11. Annular bevel groove; 29-2. Spring; 29-3. Convex ring. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0033] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0034] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0035] Example 1

[0036] Reference Figure 1 and Figure 2 , which is the first embodiment of the present invention, provides a semiconductor chip inkjet device, which includes an inkjet component 1 and a feeding component 2. Through the setting of the feeding component 2, pre-clamping processing can be performed to ensure the stability of workpiece placement, which is conducive to cooperation with the subsequent transmission mechanism and achieves the purpose of shielding and covering, reducing the probability of contamination of the semiconductor chip. At the same time, when completing the positioning operation, the purpose of blowing cleaning can also be achieved.

[0037] Specifically, the inkjet assembly 1 includes a frame 11, on which a conveying member 12 is installed, including a displacement splint 12-1 located on the frame 11, a clamping block 12-11 is fixed on the displacement splint 12-1, a fixed splint 12-2 is provided on one side of the displacement splint 12-1, and an inkjet mechanism 13 is provided on the top of the frame 11.

[0038] The inkjet mechanism 13 includes an ink cartridge, a precision inkjet valve and a nozzle, wherein the ink cartridge is used to store inkjet raw materials, and when the precision inkjet valve is opened, the nozzle sprays the ink to process the semiconductor chip. The working principle of this part is all existing technology, which can be clearly understood by those skilled in the art and will not be elaborated here.

[0039] Specifically, the feeding assembly 2 is arranged on one side of the frame 11, including a displacement plate 21 located on the frame 11, a hollow plate 22 is provided on one side of the displacement plate 21, a screw 24 is embedded in the displacement plate 21, a storage part 25 is provided on the top of the screw 24, a supporting part 27 is installed on the screw 24, the supporting part 27 includes a fixed shell 27-1 fixed on the frame 11, a displacement shell 27-2 is threadedly connected to the screw 24, a template 28 is placed in the fixed shell 27-1, a limiting part 29 is provided on the top of the hollow plate 22, and the limiting part 29 includes an insertion rod 29-1 slidably connected to the hollow plate 22.

[0040] By providing the receiving member 25 , the hollow panel 22 can be positioned and received, thereby ensuring the installation stability of the hollow panel 22 .

[0041] By setting the supporting member 27, it can be flexibly adjusted according to the specifications of the template 28 to meet the placement requirements of various templates 28, and has a simple structure, uses less materials and reduces costs.

[0042] Example 2

[0043] Reference Figures 2 to 11 , which is the second embodiment of the present invention, and this embodiment is based on the previous embodiment.

[0044] Specifically, an electromagnetic air nozzle 21 - 1 is embedded on the displacement plate 21 , an air outlet end of the electromagnetic air nozzle 21 - 1 is communicated with an air inlet end on the hollow plate 22 , and an arc groove 12 - 12 is opened on the clamping block 12 - 11 .

[0045] The other end of the electromagnetic air nozzle 21 - 1 is connected to the air outlet of the external ion air gun. When the electromagnetic air nozzle 21 - 1 is opened and the external ion air gun is working, the gas will enter the hollow plate 22 through the electromagnetic air nozzle 21 - 1.

[0046] An annular inclined groove 29-11 is provided at the bottom of the insertion rod 29-1, a spring 29-2 is sleeved on the insertion rod 29-1, a convex ring 29-3 is fixed on the insertion rod 29-1, one end of the spring 29-2 is fixed to the top of the hollow plate 22, and the other end of the spring 29-2 is fixed to the insertion rod 29-1.

[0047] A limit hole 28 - 2 is provided on the top of the template 28 and is slidably engaged with the insertion rod 29 - 1 . A displacement groove 28 - 3 is provided on the top of the template 28 and is communicated with the limit hole 28 - 2 .

[0048] The setting of the displacement groove 28 - 3 can meet the sliding space requirement of the bottom end of the insertion rod 29 - 1, which is conducive to the stable separation of the template 28 and the limiting member 29.

[0049] The insert rod 29-1 is in a T-shaped configuration and is locked when inserted into the template 28. Figure 10 As shown, the smooth outer ring of the insertion rod 29-1 is in sliding contact with the limiting hole 28-2, while part of the annular inclined groove 29-11 is located in the limiting hole 28-2 and does not contact the limiting hole 28-2.

[0050] As the displacement splint 12-1 moves closer to the template 28, the arc groove 12-12 on the block 12-11 will contact the annular bevel groove 29-11 to squeeze the insertion rod 29-1 upward, so that the smooth outer ring of the insertion rod 29-1 no longer contacts the limiting hole 28-2, and the annular bevel groove 29-11 contacts the inner wall of the limiting hole 28-2, and the insertion rod 29-1 is pushed out of the limiting hole 28-2, and the spring 29-2 is stretched.

[0051] Since the hollow plate 22 rotates around the fixing seat 25-1, when the inserting rod 29-1 moves, the hollow plate 22 will also rotate and open to a certain angle under the connecting action of the spring 29-2.

[0052] The storage member 25 includes a fixing seat 25 - 1 located at the top of the screw rod 24 , a storage sleeve 25 - 2 is rotatably connected to the fixing seat 25 - 1 , and a locking bolt 25 - 3 is threadedly connected to the top of the storage sleeve 25 - 2 .

[0053] The bottom end of the locking bolt 25 - 3 is in close contact with the top of the hollow plate 22 , and is used to lock the hollow plate 22 when screwed in, thereby ensuring the installation stability of the hollow plate 22 .

[0054] One end of the screw rod 24 passes through the fixed shell 27-1 and is rotatably connected to the fixed shell 27-1. One side of the fixed shell 27-1 is fixed to the frame 11. One end of the screw rod 24 passes through the displacement shell 27-2 and is threadedly connected to the displacement shell 27-2. The displacement shell 27-2 is slidably connected to the frame 11. One end of each of the fixed shell 27-1 and the displacement shell 27-2 is fixed with a bracket 27-3.

[0055] The bottoms of the two fixing seats 25 - 1 are fixed to the tops of the fixing shell 27 - 1 and the displacement shell 27 - 2 respectively, and the hollow plate 22 is slidably connected to the storage sleeve 25 - 2 .

[0056] By setting the screw 24, when the screw 24 is driven to rotate, the displacement shell 27-2 can slide and displace, and the position of the fixing seat 25-1 on one side can be adjusted synchronously to adapt to hollow panels 22 and templates 28 of different specifications.

[0057] An air injection hole 22-2 is provided at the bottom of the hollow plate 22, a mold groove 28-1 is provided at the top of the template 28, and the air injection hole 22-2 is located at the top of the mold groove 28-1. A first electrode seat 22-1 is fixed on one side of the hollow plate 22, and a second electrode seat 26 is fixed on the frame 11 and cooperates with the first electrode seat 22-1. A rebounder 23 is embedded in the frame 11 and cooperates with the displacement plate 21.

[0058] The mold groove 28-1 meets the space requirements for placing semiconductor chips. Through the cooperation of the air jet hole 22-2 and the mold groove 28-1, the air jet hole 22-2 can blow gas onto the semiconductor chip on the mold groove 28-1. Then, when the ion air gun is working, the gas with positive and negative ions is evenly blown onto the semiconductor chip to achieve the purpose of static neutralization.

[0059] After neutralization, the electrostatic voltage on the surface of the semiconductor chip is greatly reduced (approaching zero), the adsorption force (electrostatic force) between the dust and the surface disappears, and the dust and impurities are discharged along with the air flow, ensuring the cleanliness of the semiconductor chip surface, which is beneficial to subsequent inkjet processing.

[0060] The conveying member 12 also includes a linear motor 12-7 fixed on the frame 11. A carrier frame 12-3 is fixed on the moving end of the linear motor 12-7 and the frame 11. A belt transmission mechanism 12-4 is provided in the carrier frame 12-3. An electric push rod 12-5 is fixed on the frame 11, and a suction nozzle 12-6 is fixed on the output end of the electric push rod 12-5.

[0061] By setting the linear motor 12 - 7 , the corresponding carrier 12 - 3 can be driven to move during operation, and then the displacement clamping plate 12 - 1 and the fixed clamping plate 12 - 2 cooperate to complete the clamping of the template 28 .

[0062] The carrier frame 12-3 meets the installation space requirements for the belt transmission mechanism 12-4, wherein the belt transmission mechanism 12-4 includes a transmission motor, a pulley and a transmission belt. The transmission motor is fixed on the carrier frame 12-3, the pulley is rotatably connected to the carrier frame 12-3, and the transmission belt is arranged between multiple pulleys to enable multiple pulleys to be connected in transmission, and the displacement splint 12-1 and the fixed splint 12-2 are fixed on the transmission belt.

[0063] Under this design, when the transmission motor is working, the transmission belt will drive the displacement clamping plate 12-1 to move.

[0064] By setting the electric push rod 12-5 and the suction nozzle 12-6, the position of the suction nozzle 12-6 can be adjusted by the lifting and lowering operation of the electric push rod 12-5, and when the suction nozzle 12-6 adsorbs the semiconductor chip, multiple semiconductor chips can be transferred to the next process.

[0065] The adsorption platform where the suction nozzle 12-6 is located is equipped with an electric heater for heating the semiconductor chip raw material in the working state, which is conducive to the smooth progress of the subsequent inkjet process.

[0066] A three-dimensional operating mechanism 14 is provided on the top of the frame 11 , a weighing mechanism 16 is provided on the frame 11 and at the bottom of the inkjet mechanism 13 , a positioning slot 15 is provided on the weighing mechanism 16 , and a controller 17 is provided at the bottom of the frame 11 .

[0067] The three-dimensional operating mechanism 14 includes an X-axis linear motor, a Y-axis linear motor and a Z-axis linear motor, which are used to flexibly adjust the position of the inkjet mechanism 13; the weighing mechanism 16 includes a horizontal calibration rod and a precision weighing device, which can weigh the product and the amount of ink sprayed during the inkjet process, and then control the opening and closing of the precise inkjet valve in the inkjet mechanism 13, which is conducive to controlling the total amount of ink sprayed and ensuring the quality of inkjet processing; the working status of various electrical equipment can be controlled by the controller 17. The working principles of this part are all existing technologies, which can be clearly understood by those skilled in the art and will not be elaborated here.

[0068] The weighing mechanism 16 monitors the chip weight in real time, and the controller 17 dynamically adjusts the opening of the precision inkjet valve according to a preset threshold (such as ±0.1 mg) to achieve closed-loop control of the inkjet volume.

[0069] When in use, the semiconductor chip raw material is placed in the mold groove 28-1, and then the template 28 is positioned by the hollow plate 22 and the carrier 27, and then moved into the frame 11. The template 28 is clamped and transferred by the displacement clamp 12-1 and the fixed clamp 12-2, and then after the suction nozzle 12-6 is adsorbed, the electric push rod 12-5 is controlled to work to adjust the position of the template 28. Finally, with the assistance of the positioning groove 15, the inkjet mechanism 13 sprays the semiconductor raw material.

[0070] In the above process, first, according to the specifications of the template 28, the screw 24 is driven to rotate, and the positions of the displacement shell 27-2 and the corresponding fixed seat 25-1 are adjusted so that the fixed shell 27-1 and the displacement shell 27-2 cooperate to complete the preliminary positioning and storage of the template 28. At the same time, the cooperation of the two storage sleeves 25-2 also meets the storage space requirements of the hollow plate 22.

[0071] The hollow plate 22 is moved and inserted into the receiving sleeve 25 - 2 , and the locking bolt 25 - 3 is screwed in to lock the hollow plate 22 to prevent it from falling off.

[0072] Rotating the hollow plate 22 will cause the storage sleeve 25-2 to rotate around the fixed seat 25-1, and pull up the insertion rod 29-1, adjust the bottom position of the insertion rod 29-1, and the spring 29-2 will be stretched until the hollow plate 22 rotates to a horizontal state, and the insertion rod 29-1 is aligned with the template 28. Loosen the insertion rod 29-1 and the spring 29-2 cooperates, and the insertion rod 29-1 will be inserted into the limit hole 28-2, as shown in the accompanying drawings of the specification. Figure 10 As shown, the bottom of the raised ring 29 - 3 contacts the top of the template 28 to reposition the template 28.

[0073] After the hollow plate 22 is rotated and closed, the first electrode seat 22-1 thereof will also contact the second electrode seat 26 and make the circuit conductive, and the ion gas will be sprayed onto the semiconductor raw material to achieve synchronous cleaning without the operator having to perform additional actions.

[0074] The operator can place the displacement plate 21 smoothly into the frame 11, and then control the corresponding belt transmission mechanism 12-4 to work, adjust the positions of the displacement splint 12-1 and the fixed splint 12-2, and the fixed splint 12-2 first contacts one side of the template 28, and then control the linear motor 12-7 to work, so that the displacement splint 12-1 gradually approaches the template 28.

[0075] As the displacement splint 12-1 moves, the block 12-11 will gradually approach the insertion rod 29-1 until the arc groove 12-12 slides into contact with the annular bevel groove 29-11, squeezing the insertion rod 29-1 upward, and the spring 29-2 is stretched. Under the positioning of the fixed seat 25-1, the hollow plate 22 will rotate, and the annular bevel groove 29-11 will contact the inner wall of the limiting hole 28-2, eventually making the insertion rod 29-1 completely disengage from the limiting hole 28-2 and placed in the displacement groove 28-3. The displacement splint 12-1 and the fixed splint 12-2 cooperate to complete the clamping of the template 28.

[0076] When the hollow plate 22 rotates to a certain angle, the first electrode holder 22 - 1 is separated from the second electrode holder 26 , and the electromagnetic gas nozzle 21 - 1 is automatically closed, and the gas is no longer circulated.

[0077] The operation of the belt transmission mechanism 12-4 causes the displacement clamping plate 12-1 and the fixed clamping plate 12-2 to be displaced synchronously, so that the template 28 can be separated from the fixed shell 27-1 and the displacement shell 27-2, thereby completing stable and convenient material feeding.

[0078] Example 3

[0079] Reference Figures 3 to 11 , which is the third embodiment of the present invention, is based on the first two embodiments.

[0080] Specifically, a slide groove is provided on the frame 11, which slides with the displacement shell 27-2, and the screw rod 24 is rotatably connected in the slide groove. A hand wheel is fixed at one end of the screw rod 24, which can facilitate the operator to drive the screw rod 24 to rotate with less effort.

[0081] In actual application, in order to facilitate the accurate long-distance movement of the displacement plate 21 into the frame 11 , guide rails can be fixed on both sides of the displacement plate 21 , and corresponding guide wheels are provided on the frame 11 to improve operational convenience.

[0082] The first electrode seat 22-1 and the second electrode seat 26 are both composed of an insulating seat and a conductor, and the conductor is embedded in the insulating seat. When the hollow plate 22 rotates to a horizontal state, the first electrode seat 22-1 will contact the second electrode seat 26, so that the corresponding circuit is connected, while preventing the hollow plate 22 from rotating excessively.

[0083] A short tube is fixed to the air inlet end of the hollow plate 22, which is connected to the electromagnetic air nozzle 21-1 in a socket-type manner when installed.

[0084] The electromagnetic air nozzle 21-1 includes a solenoid valve, a hose and a fixed tube. The solenoid valve is normally closed and opens in the working state. It is fixed on the displacement plate 21 and is connected in series with the circuit of the first electrode seat 22-1 and the second electrode seat 26. When the first electrode seat 22-1 and the second electrode seat 26 are in contact and conductive, the solenoid valve opens. The fixed tube is embedded in the storage sleeve 25-2 and is connected with the short tube on the hollow plate 22. One end of the hose is connected to the solenoid valve and the other end is connected to the fixed tube. When the angle of the storage member 25 changes, the solenoid valve and the fixed tube can still be ensured to be in a connected state.

[0085] A damping ring is provided between the fixing seat 25 - 1 and the storage sleeve 25 - 2 to prevent the storage sleeve 25 - 2 from rotating freely in the absence of external force.

[0086] In actual application, in order to ensure that the gas of the ion air gun can be evenly sprayed from multiple mold grooves 28-1, a gas distributor is installed in the template 28 to redistribute the flowing gas to ensure the uniformity of subsequent spraying of semiconductor raw materials.

[0087] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A semiconductor chip inkjet device, characterized in that: include, An inkjet assembly (1) comprises a frame (11), a conveying member (12) is mounted on the frame (11), and comprises a displacement clamp (12-1) located on the frame (11), a clamping block (12-11) is fixed on the displacement clamp (12-1), a fixed clamp (12-2) is provided on one side of the displacement clamp (12-1), and an inkjet mechanism (13) is provided on the top of the frame (11); and A feeding assembly (2) is arranged on one side of a frame (11), comprising a displacement plate (21) located on the frame (11), a hollow plate (22) being arranged on one side of the displacement plate (21), a screw rod (24) being embedded in the displacement plate (21), a receiving member (25) being arranged on the top of the screw rod (24), a bearing member (27) being mounted on the screw rod (24), the bearing member (27) comprising a fixed shell (27-1) fixed on the frame (11), a displacement shell (27-2) being threadedly connected to the screw rod (24), a template (28) being placed in the fixed shell (27-1), a limiting member (29) being arranged on the top of the hollow plate (22), the limiting member (29) comprising an inserting rod (29-1) being slidably connected to the hollow plate (22).

2. The semiconductor chip inkjet device according to claim 1, wherein: An electromagnetic air nozzle (21-1) is embedded on the displacement plate (21), an air outlet end of the electromagnetic air nozzle (21-1) is connected to an air inlet end on the hollow plate (22), and an arc groove (12-12) is provided on the clamping block (12-11).

3. The semiconductor chip inkjet device according to claim 1, wherein: An annular inclined groove (29-11) is provided at the bottom of the insertion rod (29-1), a spring (29-2) is sleeved on the insertion rod (29-1), a convex ring (29-3) is fixed on the insertion rod (29-1), one end of the spring (29-2) is fixed to the top of the hollow plate (22), and the other end of the spring (29-2) is fixed to the insertion rod (29-1).

4. The semiconductor chip inkjet device according to claim 3, wherein: A limiting hole (28-2) is provided on the top of the template (28) and is slidably matched with the insertion rod (29-1). A displacement groove (28-3) is provided on the top of the template (28) and is communicated with the limiting hole (28-2).

5. The semiconductor chip inkjet device according to claim 1, wherein: The storage member (25) comprises a fixing seat (25-1) located at the top of the screw rod (24); a storage sleeve (25-2) is rotatably connected to the fixing seat (25-1); and a locking bolt (25-3) is threadedly connected to the top of the storage sleeve (25-2).

6. The semiconductor chip inkjet device according to claim 5, wherein: One end of the screw rod (24) passes through the fixed shell (27-1) and is rotatably connected to the fixed shell (27-1); one side of the fixed shell (27-1) is fixed to the frame (11); one end of the screw rod (24) passes through the displacement shell (27-2) and is threadedly connected to the displacement shell (27-2); the displacement shell (27-2) is slidably connected to the frame (11); and one end of each of the fixed shell (27-1) and the displacement shell (27-2) is fixed with a bracket (27-3).

7. The semiconductor chip inkjet device according to claim 6, wherein: The bottoms of the two fixing seats (25-1) are respectively fixed to the tops of the fixing shell (27-1) and the displacement shell (27-2), and the hollow plate (22) is slidably connected in the storage sleeve (25-2).

8. The semiconductor chip inkjet device according to claim 1, wherein: The bottom of the hollow plate (22) is provided with an air injection hole (22-2), the top of the template (28) is provided with a mold groove (28-1), and the air injection hole (22-2) is located at the top of the mold groove (28-1). A first electrode seat (22-1) is fixed to one side of the hollow plate (22), a second electrode seat (26) is fixed on the frame (11) and cooperates with the first electrode seat (22-1), and a rebounder (23) is embedded in the frame (11) and cooperates with the displacement plate (21).

9. The semiconductor chip inkjet device according to claim 1, wherein: The conveying member (12) further comprises a linear motor (12-7) fixed on the frame (11); a carrier frame (12-3) is fixed on both the moving end of the linear motor (12-7) and the frame (11); a belt transmission mechanism (12-4) is provided in the carrier frame (12-3); an electric push rod (12-5) is fixed on the frame (11); and a suction nozzle (12-6) is fixed on the output end of the electric push rod (12-5).

10. The semiconductor chip inkjet device according to claim 1, wherein: A three-dimensional operating mechanism (14) is provided on the top of the frame (11), a weighing mechanism (16) is provided on the frame (11) and located at the bottom of the inkjet mechanism (13), a positioning groove (15) is provided on the weighing mechanism (16), and a controller (17) is provided at the bottom of the frame (11).

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