Copper wire tinning device

Abstract

The invention relates to the technical field of copper wire tinning, and discloses a copper wire tinning device which comprises a frame body, a copper wire winding and unwinding assembly, a tin liquid spraying assembly and a preheating assembly. The preheating assembly enables the copper wire to be preheated before hot dipping, on one hand, the wettability and adhesive force of tin liquid can be increased, meanwhile, impurities and water on the surface of the copper wire can be removed, and therefore the quality of a tin plating layer is guaranteed; the tin plating layer which is uniform in thickness, smooth in surface and not prone to being oxidized can be formed on the surface of the copper wire, flowing tin liquid is used for hot dipping, impurities of the tin plating layer can be reduced, and the quality of the tin plating layer can be improved. The copper wire tinning device can effectively improve the quality of a tin plating layer, reduce energy consumption and improve production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of copper wire tinning, and in particular to a copper wire tinning device. Background Art

[0002] With the continuous advancement of technology, the variety and number of electronic products are constantly increasing. Copper wire is widely used as an important conductive material. To improve the solderability, oxidation resistance and service life of copper wire, we generally coat the copper wire with a layer of metallic tin. The tin layer can isolate the outside air and harmful substances, thereby protecting the copper wire.

[0003] Existing copper wire tinning technologies involve electroplating, which involves first subjecting the copper wire to pre-plating treatments such as degreasing, rust removal, and activation. The wire is then placed as the cathode in an electroplating solution containing tin salts and other ingredients. A tin plate or other suitable material serves as the anode, and a DC power source is connected, causing the tin ions in the electroplating solution to reduce and deposit on the copper wire surface, forming a tin layer. However, during the tin plating process, factors such as the equipment's electrode design and the copper wire's positioning can lead to uneven current density distribution, resulting in inconsistent tin layer thicknesses across different areas of the copper wire surface. Hot-dip tinning, by contrast, effectively addresses this issue. The hot-dip process involves immersing the treated copper wire in molten tin, ensuring full contact with the surface and forming a uniform, continuous, and firmly bonded tin layer. However, during this process, the tin solution is prone to oxidation, resulting in an impure, impure tin layer after hot-dip tinning. Furthermore, during the hot-dip process, the copper wire absorbs a significant amount of heat upon entering the plating solution, causing the solution temperature to drop. This requires additional energy to maintain the solution temperature, increasing energy consumption and production costs. At the same time, fluctuations in the plating solution temperature will affect the reaction speed and stability of tin plating, resulting in extended tin plating time and reduced production efficiency. Summary of the Invention

[0004] In view of this, the present invention provides a copper wire tinning device to solve the problems in the prior art of using a hot-dip process to tin copper wire, which easily produces impurities in the tin plating layer, consumes a lot of energy, takes a long time to tin, has poor stability and low production efficiency.

[0005] In order to solve the above technical problems, the technical solutions of the present invention are as follows:

[0006] The present invention provides a copper wire tinning device, comprising: a frame, a copper wire retracting and unreeling assembly, a tin liquid spraying assembly and a preheating assembly; the copper wire retracting and unreeling assembly comprises a wire-releasing structure and a wire-taking structure, the wire-taking structure and the wire-releasing structure are respectively arranged on both sides of the frame, the wire-releasing structure conveys the copper wire, and the wire-taking structure is used to take up the copper wire; the tin liquid spraying assembly is arranged on the frame and located between the wire-taking structure and the wire-releasing structure, the tin liquid spraying assembly is used to spray flowing tin liquid, the tin liquid spraying assembly is arranged below the copper wire, the copper wire slides relative to the flowing tin liquid so that the tin liquid adheres to the surface of the copper wire; the preheating assembly is arranged between the wire-releasing structure and the tin liquid spraying assembly, and the preheating assembly is used to preheat the copper wire.

[0007] The invention has the following advantages: the copper wire retracting and unreeling assembly realizes the transportation and storage of the copper wire; the tin liquid spraying assembly is arranged between the retracting structure and the unreeling structure; the copper wire slides above the tin liquid spraying assembly; the tin liquid spraying assembly is used to spray the flowing tin liquid upward so that the copper wire passes through the flowing tin liquid and the tin liquid adheres to the surface of the copper wire to form a film; the preheating assembly is arranged between the unreeling structure and the tin liquid spraying assembly to preheat the copper wire before tin plating. The preheating assembly preheats the copper wire before hot-dip plating, which can increase the wettability and adhesion of the tin liquid and remove impurities and moisture on the surface of the copper wire to ensure the quality of the tin plating layer; the tin liquid spraying assembly keeps the hot-dip tin liquid in a flowing state; when the copper wire passes through the sprayed flowing tin liquid, a tin plating layer with uniform thickness, smooth surface and not easily oxidized can be formed on the surface of the copper wire; using flowing tin liquid for hot-dip plating can reduce impurities in the tin plating layer and improve the quality of the tin plating layer. The copper wire tin plating device can effectively improve the quality of the tin plating layer, reduce energy consumption, and improve production efficiency.

[0008] According to some embodiments of the present invention, the preheating assembly includes a support column and a preheating part, the lower end of the support column is fixedly connected to the frame, the preheating part is fixedly connected to the upper end of the support column, one end of the copper wire is connected to the wire-paying structure, and the other end is passed through the preheating part, passes through the tin liquid spraying assembly, and is connected to the wire-taking structure.

[0009] According to some embodiments of the present invention, the preheating part includes a heat conductor and a heating element, the heat conductor and the support column are hollow structures, the heating element is arranged in the heat conductor, a connecting wire is provided in the support column, the frame is provided with a power supply, one end of the connecting wire is connected to the power supply, and the other end is connected to the heating element.

[0010] According to some embodiments of the present invention, the heat conducting member is a graphite ring, the heating element is an induction coil, and the inner diameter of the graphite ring is greater than the outer diameter of the copper wire.

[0011] According to some embodiments of the present invention, the tin liquid spraying assembly includes a furnace body and a driving structure both of which are arranged on the frame, and a tin spraying tube connected to the furnace body, the furnace body is provided with an opening, one end of the tin spraying tube is connected to the driving structure, and the other end passes through the opening and extends upward, the spraying direction of the flowing tin liquid is vertically upward, and the copper wire is located above the tin spraying tube so that the tin liquid adheres to the copper wire.

[0012] According to some embodiments of the present invention, the driving structure includes a first driving member provided on the frame and a driving pump provided in the furnace body, one end of the tin spray tube is connected to the output end of the driving pump, the first driving member is provided with a first transmission end, the driving pump is provided with a second transmission end, and the second transmission end is located outside the furnace body, the first transmission end and the second transmission end are connected by a transmission member, so that the first driving member drives the driving pump to operate, so as to make the flowing tin liquid flow through the tin spray tube and spray upward.

[0013] According to some embodiments of the present invention, the extension direction of the tin spraying tube is perpendicular to the axis of the heat conducting member, and the center height of the heat conducting member is higher than the height of the tin spraying tube.

[0014] According to some embodiments of the present invention, the furnace body is further provided with a slow flow groove, which is provided on the opening. The slow flow groove includes a splash guard and a slow flow part. The splash guard extends upward from the upper end surface of the furnace body to enclose the outer periphery of the opening. The slow flow part extends radially from the inner periphery of the opening and forms a through hole in the middle. The tin spraying tube is passed through the through hole and extends upward. The height of the tin spraying tube is higher than the splash guard. The inner diameter of the through hole is larger than the outer diameter of the tin spraying tube, so that there is a flow gap between the through hole and the outer wall of the tin spraying tube.

[0015] According to some embodiments of the present invention, the slow flow portion is radially inclined from outside to inside to form a funnel-shaped structure.

[0016] According to some embodiments of the present invention, the copper wire retracting assembly further includes a second driving member, which is disposed at one end of the wire-releasing structure or the wire-retracting structure to drive the wire-releasing structure or the wire-retracting structure to rotate, so that the copper wire is transported from the wire-releasing structure to the wire-retracting structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 is a front view of a copper wire tinning device in some embodiments of the present invention;

[0019] Figure 2 is an axial view of a copper wire tinning apparatus according to some embodiments of the present invention;

[0020] Figure 3 FIG1 is a top view of a copper wire tinning device in some embodiments of the present invention.

[0021] Description of reference numerals:

[0022] 1. Frame; 2. Copper wire retracting and releasing assembly; 21. Wire-releasing structure; 22. Wire-retracting structure; 23. Second driving component; 3. Preheating component; 31. Support column; 32. Preheating component; 4. Tin liquid spraying assembly; 41. Furnace body; 42. Driving structure; 43. Tin spraying tube; 44. Slow flow trough. DETAILED DESCRIPTION

[0023] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0026] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0027] Reference Figure 1 、 Figure 2 and Figure 3 As shown, in some embodiments of the present invention, the present invention provides a copper wire tinning device, comprising: a frame 1, a copper wire retracting and unreeling assembly 2, a tin liquid spraying assembly 4 and a preheating assembly 3; the copper wire retracting and unreeling assembly 2 comprises a wire-releasing structure 21 and a wire-taking structure 22, the wire-taking structure 22 and the wire-releasing structure 21 are respectively arranged on both sides of the frame 1, the wire-releasing structure 21 conveys the copper wire, and the wire-taking structure 22 is used to take in the copper wire; the tin liquid spraying assembly 4 is arranged on the frame 1 and is located between the wire-taking structure 22 and the wire-releasing structure 21, the tin liquid spraying assembly 4 is used to spray flowing tin liquid, the tin liquid spraying assembly 4 is arranged below the copper wire, and the copper wire slides relative to the flowing tin liquid so that the tin liquid adheres to the surface of the copper wire; the preheating assembly 3 is arranged between the wire-releasing structure 21 and the tin liquid spraying assembly 4, and the preheating assembly 3 is used to preheat the copper wire.

[0028] Specifically, the copper wire retracting assembly 2 realizes the transportation and storage of the copper wire, the tin liquid spraying assembly 4 is arranged between the retracting structure 22 and the pay-off structure 21, and the copper wire slides above the tin liquid spraying assembly 4. The tin liquid spraying assembly 4 is used to spray the flowing tin liquid upward so that the copper wire passes through the flowing tin liquid and the tin liquid adheres to the surface of the copper wire to form a film. The preheating assembly 3 is arranged between the pay-off structure 21 and the tin liquid spraying assembly 4 to preheat the copper wire before tin plating. The preheating assembly 3 preheats the copper wire before hot-dip plating. On the one hand, it can increase the wettability and adhesion of the tin liquid, and at the same time, it can remove impurities and moisture on the surface of the copper wire to ensure the quality of the tin plating. The tin liquid spraying assembly 4 keeps the hot-dip tin liquid in a flowing state. When the copper wire passes through the sprayed flowing tin liquid, a tin plating with uniform thickness, smooth surface and not easily oxidized can be formed on the surface of the copper wire. Using flowing tin liquid for hot-dip plating can reduce impurities in the tin plating and improve the quality of the tin plating. The copper wire tinning device can effectively improve the quality of the tin plating layer, reduce energy consumption, and improve production efficiency.

[0029] In some embodiments of the present invention, the preheating component 3 includes a support column 31 and a preheating part 32. The lower end of the support column 31 is fixedly connected to the frame 1, and the preheating part 32 is fixedly connected to the upper end of the support column 31. One end of the copper wire is connected to the wire-releasing structure 21, and the other end is passed through the preheating part 32, passes through the tin liquid spraying component 4, and is connected to the wire-receiving structure 22.

[0030] In some embodiments of the present invention, the preheating member 32 includes a heat conductor and a heating element. The heat conductor and the support column 31 are hollow structures. The heating element is arranged in the heat conductor. A connecting wire is provided in the support column 31. The frame 1 is provided with a power supply. One end of the connecting wire is connected to the power supply, and the other end is connected to the heating element.

[0031] In some embodiments of the present invention, the heat conductor is a graphite ring, the heating element is an induction coil, and the inner diameter of the graphite ring is larger than the outer diameter of the copper wire.

[0032] Specifically, the heat conductor is configured as a hollow ring structure, with the heating element located within it. The copper wire is threaded through the heat conductor. This ring structure uniformly heats the copper wire, removing impurities and excess material from the surface and ensuring the quality of the tin coating. The heating element is an induction coil. When connected to a power source, the induction coil converts electrical energy into heat, rapidly raising the temperature of the heat conductor. The heat conductor is a graphite ring that radiates heat to the copper wire.

[0033] In some embodiments of the present invention, the tin liquid spraying assembly 4 includes a furnace body 41 and a driving structure 42 both of which are arranged on the frame 1, and a tin spraying tube 43 connected to the furnace body 41. The furnace body 41 is provided with an opening, one end of the tin spraying tube 43 is connected to the driving structure 42, and the other end is provided with an opening and extends upward. The spraying direction of the flowing tin liquid is vertically upward, and the copper wire is located above the tin spraying tube 43 so that the tin liquid adheres to the copper wire.

[0034] Specifically, the opening of the tin spraying tube 43 extends upward, so that the flowing tin liquid sprays upward, overcoming the effect of gravity. The gushing flowing tin liquid will fall back into the furnace body 41 for reheating, avoiding waste of tin liquid. The copper wire is located above the tin spraying tube 43. Under the action of the wire-releasing structure 21 and the wire-retrieving structure 22, the copper wire slides relative to the flowing tin liquid, so that the tin liquid is evenly attached to the copper wire to form a tin plating layer.

[0035] In some embodiments of the present invention, the driving structure 42 includes a first driving member provided on the frame 1 and a driving pump provided in the furnace body 41. One end of the tin spray tube 43 is connected to the output end of the driving pump. The first driving member is provided with a first transmission end, and the driving pump is provided with a second transmission end, and the second transmission end is located outside the furnace body 41. The first transmission end and the second transmission end are connected through a transmission member, so that the first driving member drives the driving pump to operate, so as to make the flowing tin liquid flow through the tin spray tube 43 and spray upward.

[0036] Specifically, the transmission member is a belt or a gear member, which drives the driving pump through the first driving member to make the tin liquid flow continuously through the tin spraying tube 43 and spray upward to ensure that the tin plating layer can be evenly formed on the surface of the copper wire.

[0037] In some embodiments of the present invention, the extension direction of the tin spraying tube 43 is perpendicular to the axis of the heat conducting member, and the center height of the heat conducting member is higher than the height of the tin spraying tube 43 .

[0038] Specifically, to ensure that the copper wire is in a heated state when passing through the flowing tin liquid, the extension direction of the tin spray tube 43 is set perpendicular to the axis of the heat conductor, so that the straight-line distance between the two in the horizontal direction is shortened. In addition, to ensure that the copper wire is located above the tin spray tube 43, the center height of the heat conductor is higher than the height of the tin spray tube 43.

[0039] In some embodiments of the present invention, the furnace body 41 is further provided with a slow flow groove 44, which is provided on the opening. The slow flow groove 44 includes a splash guard and a slow flow part. The splash guard extends upward from the upper end surface of the furnace body 41 to enclose the outer periphery of the opening. The slow flow part extends radially from the inner periphery of the opening and forms a through hole in the middle. The tin spraying tube 43 is passed through the through hole and extends upward. The height of the tin spraying tube 43 is higher than the splash guard, and the inner diameter of the through hole is larger than the outer diameter of the tin spraying tube 43, so that there is a flow gap between the through hole and the outer wall of the tin spraying tube 43.

[0040] Specifically, after the flowing tin liquid is sprayed upward through the tin spray tube 43, there is a height difference with the liquid level in the furnace body 41, which easily causes splashing, resulting in serious pollution of the processing site and a large amount of loss and waste of tin liquid. By setting a slow flow groove 44 at the opening of the furnace body 41, the slow flow groove 44 includes a splash-proof part and a slow flow part. The splash-proof part extends upward from the upper end surface of the furnace body 41 to enclose the outer periphery of the opening, and the circulation part extends radially from the inner periphery of the opening to form a through hole in the middle. The setting of the slow flow part is to raise the liquid level and reduce the height difference, thereby reducing the potential energy of the flowing tin liquid. The splash-proof part realizes enclosure and effectively avoids the splashing of the flowing tin liquid. The tin spray tube 43 is provided in the through hole and extends upward. The inner diameter of the through hole is larger than the outer shape of the tin spray tube 43, so that a flow gap is formed between the through hole and the outer wall of the tin spray tube 43. The flowing tin liquid falling after spraying flows back to the inside of the furnace body 41 from the flow gap to realize the heating cycle.

[0041] In some embodiments of the present invention, the slow-flow portion is radially inclined from outside to inside to form a funnel-shaped structure.

[0042] Specifically, to ensure that the flowing tin liquid can smoothly flow back into the furnace body 41, the slow flow portion is inclined radially from outside to inside to form a funnel-shaped structure. Under the action of gravitational potential energy, the flowing tin liquid flows back into the furnace body 41 from the circulation gap.

[0043] In some embodiments of the present invention, the copper wire retracting assembly 2 also includes a second driving member 23, which is arranged at one end of the wire-releasing structure 21 or the wire-retracting structure 22 to drive the wire-releasing structure 21 or the wire-retracting structure 22 to rotate, so that the copper wire is transported from the wire-releasing structure 21 to the wire-retracting structure 22.

[0044] In order to achieve automation and ensure that a uniform tin plating layer is formed on the surface of the copper wire, a second driving member 23 is provided. The second driving member 23 is provided on the wire-paying structure 21 or the wire-taking structure 22 to drive the wire-paying structure 21 or the wire-taking structure 22 to rotate so that the copper wire is transported at a uniform speed; it can be understood that in order to improve reliability, a rotating handle is provided at one end of the wire-paying structure 21 or the wire-taking structure 22 to achieve manual drive.

[0045] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention. Such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A copper wire tinning device, characterized in that: include: Frame (1); A copper wire retracting assembly (2) comprises a wire-releasing structure (21) and a wire-taking structure (22), wherein the wire-taking structure (22) and the wire-releasing structure (21) are respectively arranged on both sides of the frame (1), the wire-releasing structure (21) conveys the copper wire, and the wire-taking structure (22) is used to take in the copper wire; A tin liquid spraying assembly (4) is provided on the frame (1) and is located between the wire-receiving structure (22) and the wire-releasing structure (21). The tin liquid spraying assembly (4) is used to spray flowing tin liquid. The tin liquid spraying assembly (4) is provided below the copper wire. The copper wire slides relative to the flowing tin liquid so that the tin liquid adheres to the surface of the copper wire. A preheating component (3) is provided between the wire-releasing structure (21) and the tin liquid spraying component (4), and the preheating component (3) is used for preheating the copper wire.

2. The copper wire tinning device according to claim 1, characterized in that The preheating assembly (3) comprises a support column (31) and a preheating part (32), wherein the lower end of the support column (31) is fixedly connected to the frame (1), and the preheating part (32) is fixedly connected to the upper end of the support column (31); one end of the copper wire is connected to the wire-releasing structure (21), and the other end is passed through the preheating part (32), passes through the tin liquid spraying assembly (4), and is connected to the wire-receiving structure (22).

3. The copper wire tinning device according to claim 2, characterized in that: The preheating member (32) includes a heat conducting member and a heating element. The heat conducting member and the support column (31) are hollow structures. The heating element is arranged in the heat conducting member. A connecting wire is arranged in the support column (31). The frame (1) is provided with a power supply. One end of the connecting wire is connected to the power supply, and the other end is connected to the heating element.

4. The copper wire tinning device according to claim 3, characterized in that: The heat conducting member is a graphite ring, the heating element is an induction coil, and the inner diameter of the graphite ring is greater than the outer diameter of the copper wire.

5. The copper wire tinning device according to claim 3, characterized in that: The tin liquid spraying assembly (4) comprises a furnace body (41) and a driving structure (42) both of which are arranged on the frame (1), and a tin spraying tube (43) connected to the furnace body (41), wherein the furnace body (41) is provided with an opening, one end of the tin spraying tube (43) is connected to the driving structure (42), and the other end passes through the opening and extends upward, the spraying direction of the flowing tin liquid is vertically upward, and the copper wire is located above the tin spraying tube (43) so that the tin liquid adheres to the copper wire.

6. The copper wire tinning device according to claim 5, characterized in that: The driving structure (42) includes a first driving member arranged on the frame (1) and a driving pump arranged in the furnace body (41); one end of the tin spraying tube (43) is connected to the output end of the driving pump; the first driving member is provided with a first transmission end; the driving pump is provided with a second transmission end, and the second transmission end is located outside the furnace body (41); the first transmission end and the second transmission end are connected by a transmission member, so that the first driving member drives the driving pump to operate, so as to make the flowing tin liquid flow through the tin spraying tube (43) and spray upward.

7. The copper wire tinning device according to claim 6, characterized in that: The extension direction of the tin spraying tube (43) is perpendicular to the axis of the heat conducting member, and the center height of the heat conducting member is higher than the height of the tin spraying tube (43).

8. The copper wire tinning device according to claim 5, characterized in that: The furnace body (41) is also provided with a slow flow groove (44), which is provided on the opening. The slow flow groove (44) includes a splash guard and a slow flow part. The splash guard extends upward from the upper end surface of the furnace body (41) to enclose the outer periphery of the opening. The slow flow part extends radially from the inner periphery of the opening and forms a through hole in the middle. The tin spraying tube (43) is passed through the through hole and extends upward. The height of the tin spraying tube (43) is higher than the splash guard. The inner diameter of the through hole is larger than the outer diameter of the tin spraying tube (43), so that there is a flow gap between the through hole and the outer wall of the tin spraying tube (43).

9. The copper wire tinning device according to claim 8, characterized in that: The slow flow portion is inclined from outside to inside along the radial direction to form a funnel-shaped structure.

10. The copper wire tinning device according to claim 1, characterized in that: The copper wire retracting assembly (2) further includes a second driving member (23), which is arranged at one end of the wire-releasing structure (21) or the wire-retracting structure (22) to drive the wire-releasing structure (21) or the wire-retracting structure (22) to rotate, so that the copper wire is transported from the wire-releasing structure (21) to the wire-retracting structure (22).

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